Abstract: Solder balls are placed onto multiple I/O pads of an integrated circuit package by the steps of a) providing a template with a channel which has multiple openings on a surface of the template that match the pattern of the I/O pads; b) pouring a plurality of the solder balls onto the surface of the template; c) vibrating the template and thereby seating a respective solder ball in each of the template openings; d) turning the template over, after the vibrating step and while a vacuum is applied to the channel, to remove excess solder balls from the template; and e) removing the vacuum from the channel when the solder balls on the turned over template are aligned to the I/O pads of the integrated circuit package. Due to the vibrating step, the solder balls settle in the template openings in a position where vacuum leaks past the solder balls become minimized; and that stops the solder balls from dropping out of the template openings when the template is turned over.

Abstract: A solder ball placement and alignment apparatus for placing and aligning a plurality of solder balls onto solder pads on a multi-chip substrate includes a placement tray and a base seat. The placement tray includes a solder ball gate, means for controlling movement of the gate, a plurality of placement through holes that correspond to the solder pads on the substrate, and a plurality of alignment cavities disposed on the underside of the placement tray. The solder ball gate is slidably mounted to the placement tray and, when the gate is at a first position, an opening in the placement tray is uncovered thereby permitting solder balls to be removed when the placement and alignment apparatus is tilted toward the direction of the opening. When the gate is at a second position, the opening of the placement tray is covered. The movement of the gate is controlled by an electromagnet and associated control circuit means or a mechanical device.

Abstract: The invention provides an apparatus and a method for producing an electronic component provided with bumps, in which the operation of placing a solder ball serving as a material of a bump onto an electrode of a work is monitored, and if a solder ball placing failure is detected, a recovering operation is automatically performed. In the apparatus and method of the invention, a head is moved to a location above a solder ball supplying unit so as to pick up solder balls by means of suction. The head is then moved to a location above a flux reservoir so that the solder balls are coated with flux. The head is further moved to a location above a substrate and the solder balls are placed on electrodes of the substrate. The substrate is then observed using a camera to decide whether solder balls are correctly placed on the electrodes. If yes, the substrate is transferred into a heating furnace.

Abstract: Method and apparatus for forming solder balls on electronic components and for forming solder joints between electronic components is described. A preform is fabricated having relatively large cross-section solder masses connected to one another by relatively small cross-section solder bridges. Upon reheating (reflow heating), the solder bridges melt first, and become subsumed into the solder masses. In instances where the preform is placed on a surface of an electronic component and reflowed, the solder masses become solder balls on pads of the electronic component. In instances where the preform is placed between two electronic components and reflowed, the solder masses become solder joints connecting the two electronic components. The preform may be prefabricated with a carrier, for later application to or between electronic components, and may be used to form solder balls on one or more unsingulated semiconductor dies on a semiconductor wafer.

Abstract: The present invention involves the use of a braze preform (28) for sealing and maintaining a vacuum in an insulation vessel (10). The braze preform (28) comprises particles of a braze material that are at least partially sintered together and at least substantially free of a binder. An assembly is provided for use in a method of manufacturing a vacuum insulation vessel (10). The assembly comprises a metal jacket (12) defining an interior space (20) to be evacuated and one or more evacuation ports (24) formed through a wall of the jacket (12). The evacuation ports (24) provide an opening to the interior space (20). The sintered braze preform (28) is located adjacent to the evacuation ports (24) so as to seal the evacuation ports (24) upon the melting of the brazing material. After the interior space (20) of the jacket (12) is evacuated, the preform (28) can be melted and allowed to solidify and seal the evacuation ports (24). In this way a vacuum can be maintained in the interior space (20).

Abstract: A process for joining two parts of which at least one is made of an intermetallic material comprises:mixing elemental powders to form an intermetallic compound of the same type as that of the intermetallic part or parts;compacting and forming an intermediate part from the said compound at a temperature below that of the reaction sintering temperature of the compound;placing the intermediate part in position between the two parts to be joined;subjecting the assembly of parts to a first thermal cycle so as to effect a reaction sintering of the intermediate part and a consolidation of the assembly; and,subjecting the assembly to a second thermal cycle at a temperature above 0.8 of the fusion temperature of said intermetallic compound so as to effect a diffusion treatment and mechanical consolidation of the assembly.The process may also be adapted to form a coating or a repair of a part using an intermetallic material.

Abstract: A mounting head is composed of a box-shaped main body, a case contained inside the main body, and a suction tool in the lower part of the case. The main body and case are coupled by a spring member, and the weight of the suction tool is canceled by the force of the spring. A cylinder is provided in the main body, and a rod is coupled to the case and cylinder. Solder balls sucked in by a vacuum into suction holes of the suction tool are pressed onto the electrodes of a workpiece by the cylinder. The mounting head is moved up and down by elevating means comprising a ball screw, a nut, and a motor. The pressing force of the suction tool by the cylinder is set to a proper magnitude so that the solder balls are not squeezed or crushed into the electrodes or sink into the suction holes of the suction tool.

Abstract: An apparatus for placing electrically-conductive balls on electrodes of workpieces so as to form projected electrodes includes a ball-placing head which picks up the conductive balls from a reservoir. Suction holes for respectively suction-holding the conductive balls are formed in a lower surface of a box member of the ball-placing head. Recesses are formed respectively in portions of this lower surface where the suction holes are not formed. The box member of the ball-placing head is caused to rest on an upper surface of layers of conductive balls stored in a container of the reservoir. In this condition gas is blown or injected into the container so as to fluidize the conductive balls. At this time the gas flows upward into the recesses in the lower surface of the box member, thereby sufficiently fluidizing the whole of the upper layer of conductive balls, so that all of the suction holes can effectively and securely pick up and hold the conductive balls.

Abstract: An absorber head picks up a plurality of soldering balls from a container, and is shifted horizontally toward a substrate. In the midway of this shift movement, the absorber head is stopped just above a flux storage and then lowered to soak the soldering ball in the flux stored in the flux storage, thereby applying each soldering ball with an adequate amount of flux. Thereafter, the absorber head is again shifted horizontally until it reaches the substrate. Then, the absorber head lowers the soldering ball applied with flux, so that each soldering ball is mounted on a corresponding electrode provided on the substrate. If any soldering balls are left in the flux storage due to failure of the pickup operation by the absorber head, such soldering balls are surely collected in a groove by wiping movement of a squeegee which is associated with the flux storage.

Abstract: A sucking failure detecting device built into an apparatus which transfers an object by sucking the object onto a sucking hole of a sucking head of the apparatus, the detecting device comprises: a light-emitting device emitting light and disposed on a movement path of the sucking head; and a light-receiving device disposed inside the sucking head which is made of light-shielding material, the light-receiving device receiving the light emitted by the light-emitting device and passing through the sucking hole.

Abstract: An automatic ball placing device can automatically attach the solder ball to the pad of BGA's (Ball Grid Array) substrate. It comprises mainly a BGA substrate fixing device, a stencil fixing seat at least, a horizontal driving device, a vertical driving device and a swinging device. The BGA substrate possesses multiple stencil. The horizontal driving device and the vertical driving device can drive the said BGA substrate fixing device to perform horizontal and vertical movement respectively so as to move the BGA substrate to the position below the stencil fixing seat and thereby, make the solder balls drop into the mesh of the stencil which facilitates the solder balls to attach to the pad of BGA's substrate.

Abstract: A process of forming ball bumps for electrical connection to an integrated circuit, the process comprising the steps of: applying a vibration at a small amplitude to a vessel containing small balls of an electroconductive material to cause the small balls to jump up above the vessel; holding and arranging the small balls on an arrangement baseplate by attracting the jumping up small balls to attraction openings provided in the arrangement baseplate in positions corresponding to positions of at least one set of the electrode pads of one semiconductor chip; removing excess small balls adhered either to the arrangement baseplate or to the small balls attracted to the openings; and simultaneously bonding the small balls held and arranged on the arrangement baseplate to bonding spots arranged in positions corresponding to said positions of said at least one set of the electrode pads.

Abstract: Methods for soldering a ball grid array (BGA) integrated circuit package to a printed circuit board. One method includes the steps of applying a solder flux to the conductive surface pads of a printed circuit board and capturing a plurality of solder balls with a separate fixture. The fixture is then placed onto the printed circuit board and the solder balls are released onto the conductive surface pads. The fixture is removed and an integrated circuit package is placed onto the solder balls. Solder flux may be applied to the bottom of the package to adhere the package to the balls. The solder balls are then reflowed to attach the package to the board. The flux provides a bonding agent which maintains the position of the solder balls and package while the solder is being reflowed. Another method includes the step of placing a fixture adjacent to the integrated circuit package so that a plurality of openings in the fixture are aligned with surface pads located on the bottom surface of the package.

Abstract: This invention relates to a method of combining a plurality of surface mount technology components and at least one plated through-hole component on a printed wiring board. The method includes applying to a secondary side of the printed wiring board a first layer of a preselected quantity of electrically conductive adhesive and then attaching a first portion of the plurality of the surface mount technology components to the adhesive. The first layer of the adhesive is then reflowed, thereby adhering the first portion of the plurality of surface mount technology components to the secondary side of the printed wiring board. The method then continues by applying to a primary side of the printed wiring board a second layer of the first preselected quantity of electrically conductive adhesive and applying to the primary side of the printed wiring board a second preselected quantity of electrically conductive adhesive.

Abstract: An absorber head 10 picks up a plurality of soldering balls 1 from a container 2, and is shifted horizontally toward a substrate 31. In the midway of this shift movement, the absorber head 10 is stopped just above a flux storage 32 and then lowered to soak the soldering ball 1 in the flux 34 stored in the flux storage 32, thereby applying each soldering ball 1 with an adequate amount of flux. Thereafter, the absorber head 10 is again shifted horizontally until it reaches the substrate 31. Then, the absorber head 10 lowers the soldering ball 1 applied with flux, so that each soldering ball 1 is mounted on a corresponding electrode 31a provided on the substrate 31. If any soldering balls 1 are left in the flux storage 32 due to failure of the pickup operation by the absorber head 10, such soldering balls 1 are surely collected in a groove 36 by a wiping movement of a squeegee 37 which is associated with the flux storage 32.

Abstract: Disclosed is a spectroscopic probe apparatus useful for Raman, near infrared, luminescence, ultraviolet or visible spectroscopies that is formed with a robust method of construction using a molten metal soldering technique. The disclosed method and apparatus provides an optical probe that is easy to manufacture yet able to withstand drastic environmental conditions without damage and produce useful spectroscopic results under such conditions.

Abstract: A soldering ball mounting apparatus comprises a workpiece positioning mechanism "A" for positioning a workpiece 2 at a predetermined position. The workpiece 2 has an upper face formed with a plurality of electrodes 2a on which soldering balls 3 are mounted. A template 4, provided with a plurality of through holes 4a corresponding to the electrodes 2a in a one-to-one relationship, is supportable in such a manner that their through holes 4a are positioned just above the corresponding electrodes 2a of the workpiece 2. A soldering ball container 12 is provided on the template 4 for accommodating soldering balls 3 therein. The soldering ball container 12 has an open bottom allowing the soldering balls 3 to fall below the template 4 via the through holes 4a. A pair of X and Y motors shifts the soldering ball container 12 along the upper surface of the template 4 disposed in a horizontal direction.

Abstract: A solder-ball mounting apparatus is provided with a ball feed jig having a ball tank that may receive a predetermined number of solder-balls for feeding the solder-balls to a ball suction jig through a guide mask mounted on an opening portion of the ball tank, and blowout holes formed in a bottom of the ball tank for a blow gas as a blow unit for agitating the solder-balls received in the ball tank in the ball feed jig. The solder-balls may be positively sucked to ball suction holes one by one without turning over the ball suction jig.

Abstract: A solder delivery and array device for soldering electronic components and/or IC chips to printed circuit boards (PCB) or substrates comprises solder performs with predetermined weight, size, shape, and a flexible retaining means with spaced openings according to the layout of pins or leads of the components and/or IC chips. The solder performs are positioned and fixed in the openings through mechanical locking. The devices are located between components and PCB or substrate during the soldering processing. By using these devices, through hole type components and surface mount type parts can be attached onto the PCB through heat reflow soldering at same time without the wave soldering process, and overheating can be avoided during the soldering process especially for the pin grid array component. Another bonus for the application of the device is shorting the required lead time for research and development in new electronic products.

Abstract: A method and preform for forming and attaching an array of conductive balls, preferably solder balls, to ball receiving areas on a substrate is disclosed. The preform is a connected array of sub-preforms comprised of the conductive material from which the balls will be formed. The connections between adjacent sub-preforms are designed to assure division of the preform into individual masses, each sufficient to form one conductive ball. Each sub-preform is provided with a bottom protrusion which assures physical and thermal contact between preform and substrate. The method involves placing the preform on the substrate such that each sub-preform is positioned above the conductive ball receiving areas. The preform and substrate are than heated to above the melting point of the conductive material to melt the conductive material and form metallurgical bonds between the conductive material and the receiving areas.

Abstract: A shaped soldering strip for promoting improved soldering joints to or between a tube array comprising: a thin coupon of solder having margins defining openings aligned with the axes of the tubes to be joined; a collar surrounding each margin to define a cup shape integral with the associated margin, such margin forming the bottom of said cup shape and being positioned by the collar for placement in annular contact or at least in micro-close proximity to the external circumference of an aligned tube to limit downward weepage of flux deposited in said cup shape: and bridges connecting said collars to create said coupon that extends over said frontal area and gangs the collars for positioning on the tubes of said array.

Abstract: In a soldering ball mounting apparatus, a pickup head is movable between a soldering ball feeder and a workpiece to be mounted with soldering balls. The pickup head has a bottom formed with a large number of absorber holes for vacuum-absorbing the soldering balls from the soldering ball feeder. On the way to the workpiece, light is irradiated onto the bottom of the pickup head from the exterior. When the light leaks into the pickup head, the leakage light is detected by a light detector provided in the pickup head so that presence of a soldering-ball pickup error is determined. On the other hand, on the way to the soldering ball feeder after mounting the soldering balls onto the workpiece, light is irradiated along the bottom of the pickup head from one side. Accordingly, when the light is not received at the opposite side, at least one soldering ball remains attached to the bottom of the pickup head so that presence of a soldering-ball mounting error is determined.

Abstract: Rectangular preforms are vacuum picked and placed in each cavity of a first holder, and a measured amount of no-clean flux liquid is dispensed onto each preform, then a second holder is placed in an inverted position on top of the first holder and the holders are flipped so that the dry side of the preform is exposed and then a measured amount of no-clean solder is dispensed on the dry side of the preform. A robot arm with a rubber tipped vacuum probe picks up the preforms without damage or contamination and places them on a circuit board, grippers of the robot arm pick up and position a component on an induction coil to heat it up sufficient for reflow soldering, and then move the component onto the preform on the circuit board for reflow soldering. The circuit board can be used without cleaning with solvents or CFC's, thus reducing process steps and reducing environmental hazards.

Abstract: Rectangular preforms are vacuum picked and placed in each cavity of a first holder, and a measured amount of no-clean flux liquid is dispensed onto each preform, then a second holder is placed in an inverted position (upside-down) on top of the first holder and the holders are flipped so that the dry side of the preform is exposed and then a measured amount of no-clean solder is dispensed on the dry side of the preform. The holders are unstacked and positioned on different sized posts extending upward from a pick-and-place machine. A robot arm with a rubber tipped vacuum probe picks up the preforms without damage or contamination and places them on a circuit board, grippers of the robot arm pick up and position a component on an induction coil to heat it up sufficient for reflow soldering, and then move the component onto the preform on the circuit board for reflow soldering.

Abstract: In accordance with the invention, an electronic device having one or more contact pads is adhered to an array of transferable solder particles on a removable carrier sheet. The carrier is removed, as by dissolving, leaving solder selectively adhered to the contact pads. In a preferred embodiment the solder-carrying medium is water soluble, and the solder particles comprise solder-coated magnetic particles. Application of a magnetic material while the medium is drying or curing, produces a regular array of solder-coated particles. Using this method, devices having smaller than conventional contact structures can be readily interconnected.

Abstract: The invention relates to a method for forming bump electrodes on an electronic part such as a chip or a substrate. Conventional methods for forming bump electrode had a factor causing high cost, but with the invention, instead of solder balls, low cost solder wires are used, that is, solder wires are cut in a predetermined length, the cut solder wires are vacuum-attracted to the lower face of a pick up head and transferred onto a chip, then the solder pieces transferred are heated to melt, then cooled to solidify and results in forming bump electrodes of hemisphere shape.

Abstract: A method of producing a microchip having at least a portion of an electrical circuit element contained within a hermetically sealed enclosure comprises the steps of: forming a cavity in a first substrate assembly which has a cavity opening at a first surface portion of the first substrate assembly; forming an electrical circuit element and sealing ring from a film applied to a first surface portion of a second substrate assembly with the sealing ring arranged in circumscribing relationship with at least a portion of the circuit element; positioning the first surface portion of the first substrate assembly opposite the first surface portion of the second substrate assembly with the sealing ring located in circumscribing relationship with the cavity opening; sealingly bonding the sealing ring to the first surface portion of the first substrate assembly.

Abstract: A solder ball supply device comprising flux supply means 200 which supplies flux at the same time to input and output terminals on substrate 1 prior to supply of solder balls, and solder ball supply means 300 which takes out a number of solder balls from discharger 350 in which solder balls are held matrixwise at the same time in the same pattern as the pattern of said input and output terminals and supplies solder balls to said input and output terminals to which flux has been supplied.

Abstract: A station (10) in a manufacturing line (12) for the accurate placement of solder balls (30) on a ball grid array package and for the removal of excess solder balls comprises a substrate (4) having an array of solder pads (7), and an adhesion layer (8) on the solder pads.

Abstract: A device automatically places marks, such as notches, on solder as that solder is being dispensed to a soldering operation. The device is entirely mechanical, and places the proper amount of tension on the solder without stretching it, and guides the solder from a storage reel to a marking system. The solder is marked by elements located on a marking wheel that rotates next to a grooved wheel. The tensioning is effected by a plurality of grooved wheels around which the solder is trained and which can be adjusted to control the amount of tension applied to the solder.

Abstract: A composite transversely plastic interconnect for a microcarrier produces a carrier-to-substrate bond having low electrical resistance and high mechanical strength, significant bond height to mediate TCE mismatch between dissimilar carrier and substrate materials, and sufficient gap between the carrier and the substrate to permit effective post solder cleaning of the interconnect. A contact array consisting of solder balls is placed directly onto either of a carrier or a substrate interconnect surface with a stencil positioned to the chosen interconnect surface. The solder balls may have a selected melting temperature. Additionally, the solder balls may have a metallic coating, such as nickel or copper, or molten solder. The carrier and substrate are joined by mating an interconnect surface of each and applying heat. Solder paste may be applied to one of the interconnect surfaces to add additional height to the joint and compensate for lack of coplanarity between the carrier and the substrate.

Abstract: There is a method for increasing the life of the mechanical bonding between the PCB and the surface mount IC. Specifically, the invention elevates the atmospheric pressure during the heating and cooling phases of Ball Grid Array (BGA) soldering of an IC device to a PCB. This accomplishes a decreasing of the curvature of the solder ball wall inherent in the typical BGA technique. Uniquely, by increasing the atmospheric pressure around the solder ball during the cooling phases, specifically, the outer pressure will decrease the outer curvature of the walls. This allows the PCB and IC to increase the stand off distance, and increase the strength of the mechanical properties of the weld. With stronger bonding, the ICs will stay bonded longer to the PCB before deteriorating and thereby needing replacement.

Abstract: A component made of superalloy is provided with a localized coating formed from three layers by a brazing heat treatment, the layers comprising an outer layer having a composition adapted to the specific surface properties sought, an inner layer having a composition which includes flux elements, and an intermediate layer obtained by the deposition of a mixture of the materials used for the other two layers.

Abstract: The present invention provides a method for providing an array of metal microbeads on a substrate, preferably in a regular pattern of very fine, uniform size microspheres or microbeads at precise spacing or scale previously unachievable. The method of the present invention comprises the steps of providing a metal layer on a substrate that is partitioned into metal regions; heating the metal layer to a temperature sufficient to melt the metal and to permit beading of the layer into discrete microbeads.

Abstract: Composite solder articles contain a first portion of a first solder having a first melting point, T.sub.1, and a second portion of a second solder having a second melting point, T.sub.2, which is at least (T.sub.1 +10).degree. C. Such articles are useful as the sole solder-producing inserts in heat-recoverable solder connection devices. When the device is heated, the second solder will not melt until the first solder has melted and flowed. Thus the second solder portion can indicate when the first solder has flowed, and/or can control flow of the first solder.

Abstract: The present invention is embodied in a technique for precise and accurate height control in fabricating solder bumps or joints formed from a solder bump or bumps. A solder bump is formed by reflow of a conical solder body having base diameter D, height H and cone angle .theta., and has truncated sphere shape, with height h and truncation diameter d. We have found that D, H, and d can be selected such that .differential.h/.differential.H is small (typically .ltoreq.0.5), indicative of relative insensitivity of the bump height to variation in the height of the conical solder body. The inventive process is also applicable to a component (e.g., a laser) solder-bonded to a substrate, and can provide previously unattainable control of the spacing between component and substrate.

Abstract: A method for applying solder on a substrate (12) comprises the steps of providing a substrate (12) having predefined solder pads (15) and then providing solder spheres (16) for suitable placement on the solder pads. Then applying flux (14) and tacking media (18) between the solder pads (15) and the solder spheres (16) and then placing the solder spheres on the solder pads. Subsequently the solder spheres are heated onto the solder pads of the substrate providing reflowed solder (26) on the solder pads. Then a layer of flux tacking media (28) is applied on the reflowed solder. Next, a component (30 or 40) is placed on the reflowed solder and flux tacking media providing a substrate assembly (10). Finally, the circuit assembly is heated allowing the component to be soldered to the solder pad.

Abstract: A solder preform containing a series of islands that are joined together in a matrix by bridging bands. Each band has a reduced cross-sectional area in its midregion. In one form of this invention, at least some of the islands contain pin receiving holes formed therein and solder tabs that are arranged to frictionally engage a pin that is passed into the hole to prevent the preform from being misaligned or dislodged from the pins and which at the time of bonding, prewets the pins to promote flowing of solder to the pins from the islands to form a superior solder joint.

Abstract: Solder balls are transferred onto a semiconductor device (50), for example a flip chip semiconductor device, without using solder evaporation techniques. In one form, pre-formed solder balls (36) are placed in recesses (32) formed in a transfer substrate (30). A semiconductor die (12) having a plurality of bond pads (14) is positioned with respect to the transfer substrate so that the solder balls are aligned to, and in contact with, the bond pads. The solder balls are then reflowed to form a metallurgical bond to the bond pads. One embodiment of the invention utilizes a transfer substrate made of silicon so that the coefficient of thermal expansion of the transfer substrate will closely match that of the semiconductor die, thereby minimizing solder ball alignment variances. Use of silicon as a transfer substrate material also allows the recesses to easily be made non-wettable by conventional silicon oxidation techniques.

Abstract: Discrete solder preforms (28, 14a, 14b, 14c) are quickly and accurately placed on substrates (10) to be soldered by means of a foil sheet (24) apertured (26) with the pattern of preform placement. The foil sheet has a vacuum drawn through its apertures, and a number of discrete solder preforms are randomly projected from a vibratory membrane (38) up against the foil to be attached to the foil at each of its apertures. Then the foil sheet with its vacuum attached solder preforms (28, 14a, 14b, 14c) is moved into registration with the flux pattern (12a, 12b, 12c) pre-printed on the substrate (10), and all of the vacuum attached preforms are simultaneously positioned down upon the flux areas of the substrate where they remain when the vacuum is released. Planarity of the thin foil is maintained by a flat somewhat rigid but porous backing member (32) secured to the foil.

Abstract: The present invention discloses a method for repairing metal edges using wire and a braze alloy. Using this method, it is possible to restore a damaged metal edge to blueprint dimensions. In the preferred embodiment, the disclosed method relates to the restoration of damaged or worn turbine vanes. The method comprises a preparation step of cleaning and milling the edge of the base metal to be repaired. A repair wire is then placed along the edge, and a braze compound is applied to the junction of the base metal and the repair wire. A brazing step follows which integrates the base metal, the wire and the brazing compound. After standard finishing steps, the repaired vane meets blueprint specifications and is ready for use in a turbine.

Abstract: A method for making a gas chamber for photometric measuring equipment comprises providing a metal frame with recesses on opposite sides establishing a web and at least one opening in the web and having solder surface areas; providing at least two calcium fluoide panes, said panes each having a rim portion; is improved by providing rim surface portions of the panes about to face the recess-web portion of said metal frame with a plurality of layers, by (i) physical vapor depositing a thin chromium nickel layer, (ii) physical vapor depositing thereon a nickel layer, and (iii) by physical vapor depositing thereon a gold layer; vapor depositing on the web portion around the opening of said recesses a gold layer; providing at least two solder elements of basically ring-shaped configuration respectively to be interposed between the web and the panes, the soldering elements being configured so that between their respective outer contour and walls of the recesses a solder flow space obtains when the solder elements ar

Abstract: A soldering process uses a plurality of individual heating elements (204) to solder a plurality of solder locations. The process consists of the steps of substantially simultaneously picking up a plurality of solder preforms (202); placing the plurality of solder preforms substantially simultaneously on different interconnection locations (214) found on a circuit board (212); and substantially simultaneously soldering the plurality of solder preforms (202) with a heating element fixture (200) which has a plurality of individual heating elements (204) which match the different interconnection locations (214) found on the circuit board (212).

Abstract: A device for froming a solder connection between a plurality of elongate bodies comprises a dimensionally recoverable article, e.g. a heat-shrinkable sleeve, into which the bodies can be inserted, and a solder insert. The solder insert comprises two portions, one formed from a relatively low melting point solder for forming a solder joint between the bodies, and the other portion being formed from a relatively high melting point solder. When the device is heated the relatively high melting point solder will not melt until the low melting point solder has melted and flowed, and therefore provides a means for indicating that the correct temperature has been reached.

Abstract: Disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of the substrate; at least one second solder portion connected to each of the at least one first solder portions; and an epoxy layer disposed about the at least one first and second solder portions in such a manner as to cover the first solder portion and contact, but not cover, the second solder portion.Also disclosed is a connector structure on a substrate which includes at least one first solder portion on the surface of said substrate; at least one second solder ball portion connected to the at least one first solder portions; wherein the melting point of the second solder ball portion is relatively higher than that of the first solder portion.Finally, disclosed is a method of testing the solderability of the above structures.

Abstract: A standard tinned nickel-iron alloy lead frame has a plurality of pairs of extending tab portion positioned in a straight row. A long straight piece of an exothermically alloyable fuse wire, with a core of aluminum coaxially clad with palladium in approximately equal volumes, is held in contact with the plurality of pairs of lead frame tabs. Heat is applied to the fuse strand at two points; namely, on one and the other sides of each pair of tabs initiating progressive alloying in two directions from each heated point. When the progressive alloying and melting of the fuse strand reaches a tab, the tab is heated and heat sinks the fuse strand to stop the progressive alloying and melting. There is simultaneously formed a metallurgical bond between the ends of each remaining elemental fuse strand, respectively, and each of the pair of tabs that are bridged by that remaining elemental strand.

Abstract: A number of rare earth-cobalt permanent magnet segments are temporarily secured together by means of a tool. Before securement the segment surfaces at each interface are pre-tinned. A solder pre-form in the shape of a "wagon wheel" rests on one transverse end of the magnet so that the spokes of the pre-form overlie the interface joints. The magnet is then lowered into a gradually heated glycerine bath until the solder melts and directly flows over each interface. Upon slow cooling of the cylinder, metallurgical bonding is effected between the various segments of the magnet.

Abstract: A process for treating the surface of solid fusible solder supported on a substrate, comprises a heated tool having a treatment surface with a selected shape. The heated tool is brought into contact with the solder for fusing the solder to reshape the surface of the solder. The tool is allowed to cool to permit the solder to resolidify, and when withdrawn from the solder, leaving the imprinted shape. The treatment surface is made of material which is not wettable by the solder. Stops may be utilized for limiting movement between the tool and the substrate to a specified gap for the treatment surface.

Abstract: A thin metal foil or an array of fine wires or a graphite web, mat or the ke, having electrical conductivity was interposed between clean polished surfaces of ceramic parts which are to be joined, with application of pressure. A high current electrical discharge with very short duration puts so much energy into the conducting material that it explosively vaporizes and penetrates interacts with the ceramic before the ceramic can absorb an appreciable amount of heat and before the hot material can undesirably react with the surrounding atmosphere, so that an inert atmosphere is not necessary for the process. Metals that form silicides and/or carbides are for e.g. desirable for connecting SiC parts and conducting forms of carbon such as graphite are also suitable. Precoating the surfaces to be joined, with reactive or reaction-promoting material as well as a thermal treatment of the joint may be favorable.

Abstract: A foil (15) has cutouts (17) which are bridged over by strips of solder (18, 19). The cutouts (17) are so dimensioned that the strips of solder (18, 19) can be placed transversely over the ends of conductive paths (9-14). The terminals (3-8) of the corresponding electronic component (2) are then placed on the strips of solder (18, 19). Pressure is exerted by means of a ram and heat applied, which leads to the melting of the strips of solder (18, 19) and thus to the soldering of the terminals (3-8) to the conductive paths (9-14).