Abstract: There is disclosed a method and apparatus for ensuring release of objects such as solder balls from a pick head in a transfer and placement apparatus, comprising causing said pick head to vibrate by applying a vibration signal to said pick head over a range of frequencies. The range of frequencies is chosen such that it bounds the resonant frequencies of the pick head which may be calculated by computer simulation.

Abstract: A method is provided for manufacturing a piezoelectric actuator having a piezoelectric element and a lead wire for supplying a drive signal to the piezoelectric element. A melt material is immersed into a fusing agent. A quantity of the material and the fusing agent is supplied to a transfer plate and then adjusted. A preselected quantity of the melt material and the fusing agent is then transferred preselected quantity of the melt material and the fusing agent is supplied from the transfer tool to the lead wire. The melt material is then welded on the lead wire and on the piezoelectric element to thereby connect the lead wire to the piezoelectric element.

Abstract: There are disclosed a solder bump forming method and an apparatus therefor, which achieve a high reliability, and an electronic part, produced by this method and this apparatus, is also disclosed. For each of the step of arraying solder balls, the step of supplying a flux, and the step of mounting the solder balls on a board, it is checked whether or not any solder ball is omitted, and the process is conducted while confirming the condition of the operation, thereby enhancing the reliability and also preventing defective products from being produced.

Abstract: A tool for applying solder paste to leadless chips has recesses adapted to receive the leadless chips. Apertures in each recess are arranged according to pads on the leadless chip. With the chips held in the recesses, solder paste is applied in the apertures.

Abstract: Disclosed is a solder alloy in use for bonding electric or electronic parts, containing: 3 to 12% by weight of a zin component; and a tin component. The oxygen content of the solder alloy is reduced to 100 ppm or less. Using the solder alloy, a bonding portion is formed on the substrate and the electronic part is mounted thereon to obtain a substrate for mounting the electronic part and a substrate on which the electronic part is mounted. The bonding portion made of the above solder alloy can prevent migration.

Abstract: A connector for use with a circuit substrate having a plurality of elongated conductors. A solder ball is fused to the end of the conductors for connection of the connector to a circuit substrate. Method for attaching the solder ball to the end of the conductors using a solder paste with or without a preformed solder ball. The conductors are fitted into passages of an interface member. A tail end of each conductor terminates in a well in a surface of the interface member that facilitates the attachment of solder ball to the end of the conductors. The passages in the interface member hold the conductor tail ends in place while providing a clearance around the conductor to accommodate the effects of thermal expansion and contraction.

Abstract: There is provided a process that includes providing an extruded fitting having a bore formed therein. The bore is machined from one or both sides of the extruded fitting to provide a ledge on one side for interacting with a corresponding fitting and a stop on the other. A pipe and braze sleeve are placed in combination into the bore and engage the stop. The pipe and bore include anti-rotation and location irregularities formed thereon to maintain a desired orientation of the parts. A mandrel is used to deform the pipe and sleeve to the shape of the bore. The parts are then brazed in a furnace.

Abstract: Interconnection elements for electronic components, exhibiting desirable mechanical characteristics (such as resiliency, for making pressure contacts) are formed by using a shaping tool (512) to shape an elongate core element (502) of a soft material (such as gold or soft copper wire) to have a springable shape (including cantilever beam, S-shape, U-shape), and overcoating the shaped core element with a hard material (such as nickel and its alloys), to impart a desired spring (resilient) characteristic to the resulting composite interconnection element. A final overcoat of a material having superior electrical qualities (e.g., electrical conductivity and/or solderability) may be applied to the composite interconnection element.

Abstract: A BGA (Ball Grid Array) package fabrication method is proposed for the purpose of achieving solder ball coplanarity on a warped BGA package, such as a concavely-warped BGA package or a convexly-warped BGA package. The proposed method is characterized in the provision of a plurality of variably-sized solder-ball pads over the bottom surface of the substrate, each solder-ball pad having a specified size predetermined in accordance with pre-measured package warpage and predetermined relation of solder ball height against pad size. This provision allows the use of a solder mask having fixed-size openings, as contrary to the prior art that uses a solder mask having variably-sized openings, to allow the implanted solder balls to achieve coplanarity and have strengthened shear for robust solder joint.

Abstract: An apparatus joins bonding pads of a slider and lead pads of lead wires in a head gimbals assembly to improve efficiency, downsizing, and maintenance of solder-ball disposing devices, and solder-ball reflow devices for reflowing solder balls. The solder-ball disposing apparatus discharges solder balls from solder-ball discharging holes of a solder-ball feeder unit which are evacuated by a suction pad. An environmental space and an inert-gas supply portion for forming inactive atmosphere are formed on a table to eliminate an inert-gas supply unit from an optical unit, so that converged laser beams are directly radiated onto the solder balls.

Abstract: A semiconductor chip package includes a semiconductor chip mounted on a top surface of a substrate. A bottom surface of the substrate has ball pads. Bonding pads of the chip are electrically connected to the substrate. Enhanced pads, each having one or more dummy patterns coupled to one or more dummy pads, are preferably formed near edges of the substrate. The semiconductor chip package is mounted on the board by attaching external connection terminals such as solder balls, formed on the ball pads and the dummy pads, to a solder paste coated on ball lands and enhanced lands of the board.

Abstract: An apparatus for placing an array of solder balls on a substrate includes a carrier plate having an array of holes therethrough. Each hole is capable of holding a solder ball. A ball placement head having an array of pins is aligned with a desired pattern of solder balls held by the carrier plate. The array of pins push the pattern of solder balls through the holes in the carrier plate onto the substrate.

Abstract: An apparatus for lining up micro-balls in accordance with the present invention includes: ball carrying pallets having a plurality of pits for holding the micro-balls, respectively, on its surface, a pallet holder for holding the ball carrying pallets, a lining-up container defining a sealed chamber in association with the pallet holder hermetically fitted thereto, a storing tank for storing liquid carrier in which micro-balls are dispersed, and applying/collecting device for communicating the storing tank with the lining-up container via a passage to supply the micro-balls together with the liquid carrier from the storing tank to the sealed chamber and return the surplus micro-balls together with the liquid carrier from the sealed chamber to the storing tank.

Abstract: A one-step bumping/bonding process for forming a semiconductor package is disclosed. In the method, a first electronic substrate which has either a plurality of conductive pads or a plurality of recessed openings formed on top of a plurality of apertures through the substrate is first provided and aligned with a second electronic substrate that has a plurality of conductive pads with each aperture aligned to a conductive pad on the second substrate. A plurality of solder balls is then planted on top of the plurality of conductive pads or the plurality of recessed openings on the surface of the first electronic substrate by a pick-and-place technique. Alternatively, a plurality of solder paste may be printed by a thick film stencil printing process similarly in place of the plurality of solder balls.

Abstract: There is disclosed a solder ball pitcher supplying a large number of solder balls stored in a solder ball housing chamber in a row into a solder ball supply passage unit through a taper portion, and then delivers the solder balls in sequence through a solder ball supply opening at the tip end of the solder ball supply passage unit by a swing motion of the release link in case of allowing a release lever reciprocated by a pusher and a compressive coil spring to translate by a parallel link composed of the release link and a follower link.

Abstract: A kind of composite metal coil/plate includes one parent metal coil/plate and at least one clad metal coil/plate as well as an interlayer composed of atoms of a brazing filler, the parent metal and the clad metal. The interlayer is about 2-10 &mgr;m in thickness. The present invention also relates to a method of manufacturing composite metal coil/plate. The method comprises pre-cladding the parent and clad metal coils/plates as well as the brazing filler foil in an inert or reductive atmosphere at 850-1000° C., and hot rolling cladding the same under inert or reductive atmosphere at 900-1050° C. A composite metal plate is obtained after cooling.

Abstract: A method and apparatus are disclosed for releasing solder spheres during the locating and/or placing of a pattern of conductive preforms 32 on a respective pattern of electronic pads 14 on a receiving substrate 12 for such uses as a Ball Grid Array component 24. The release mechanisms are of either compliant mechanical 11, vibratory 90, air pressure 100 or 120, or sound pressure waves 140. Additionally, a method and apparatus is disclosed for the electrical inspection for presence or absence of the complete pattern of conductive preforms.

Abstract: An annular turbine shroud separates a hot gas path from a cooling plenum containing a cooling medium. Bumps are cast in the surface on the cooling side of the shroud. A surface coating overlies the cooling side surface of the shroud, including the bumps, and contains cooling enhancement material. The surface area ratio of the cooling side of the shroud with the bumps and coating is in excess of a surface area ratio of the cooling side surface with bumps without the coating to afford increased heat transfer across the element relative to the heat transfer across the element without the coating.

Abstract: In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to form, there are various limitations to the material of which the bumps are made, to enough cubic volume of bumps and to small scattering of the bump height. According to the invention, solder balls and a tool having a large number of through-holes are used, and under the condition that the through-holes of the tool are aligned with the pads of the semiconductor device, the solder balls are charged into the through-holes, pressed to be fixed on the pads, and then reflowed to form bumps.

Abstract: A conductive ball transferring apparatus including: an arranging member having in its top face a plurality of recesses in a predetermined arrangement pattern each capable of receiving one conductive ball therein; a tilting mechanism for tilting the arranging member with respect to a horizontal plane; a speed controller for controlling the moving speeds of the conductive balls that move along the top face of the tilted arranging member in a direction the arranging member has been tilted; and a transferring head for picking up the conductive balls arranged by the arranging member and transferring them onto predetermined positions. With this structure, the moving speeds of the conductive balls are stabilized and the conductive balls are arranged into the recesses quickly without fail, and thereby the transferring head can pick up these conductive balls onto predetermined positions promptly.

Abstract: A wire bonding technique applied to wafer bump and wafer level chip size package structure and the method of manufacturing thereof comprising under no repassivation layer and without an under bump metallurgy layer, direct forming metal bump on a metal pad of a wafer surface, ball bump, method being employed to form metal bump, and wire bonding of ultrasonic vibration being used to join a suitable metal wire on the metal pad, next pulling off the metal wire and leaving the metal bump, the height of the metal bump is controlled by the parameters of the type, diameter and wire bonding of the metal wire; planarizing the metal bump of all wire bonding to an appropriate height using metallurgical tools; implanting solder bump by means of implant ball or solder printing technology on the metal bump, and an under bump metallurgy layer being formed on the top face of the metal block by means of metal deposition method in case an unfavorable intermetallic compound is formed between the metal (used for the metal bump) a

Abstract: An apparatus and method for high speed, reliable and repeatable delivery and reflow of solder material onto a substrate are disclosed. The apparatus has a repositionable capillary to direct individual solder material to a specific location on the substrate. An energy source is directed through the capillary onto the solder to reflow the solder to the substrate. The apparatus provides for individual introduction of the solder material into the capillary and urging of the solder material from a reservoir to the capillary while preventing unintended jams and blockage of the solder material.

Abstract: The present invention is drawn to a method of making solder bump interconnections or BGAs ranging from chip-level connections to either single chip or multichip modules, flip-chip packages and printed circuit board connections. According to the method of the present invention, a die wafer or a substrate with a conductive contact location is positioned in close proximity and aligned with a mold wafer having a pocket corresponding to the contact location of the die wafer. A source of a molten solder is also provided which interconnects with the mold wafer. The molten solder from the source is introduced into the pocket of the mold wafer such that the molten solder wets the contact location aligned with the pocket. Before the molten solder inside the pocket is allowed to solidify, the die wafer and the mold wafer are separated from each other.

Abstract: Disclosed is a solder material and a manufacturing method thereof. The solder material has a first layer composed of a first metallic material and a second layer composed of a second metallic material which is different from the first metallic material, the first layer being formed in an elongated shape having axiality, and the second layer covering the first layer to surround the axis of the first layer. The solder material is in a form of a wire, a granule, a sheet, a tape or a planar fragment. The manufacturing method includes: covering a first metallic material with a second metallic material which is different from the first metallic material to prepare a covered body; and rolling the covered body to prepare a solder material comprising a first layer formed of the first metallic material in an elongated shape having axiality and a second layer covering the first layer to surround an axis of the first layer.

Abstract: A process for joining or welding components made from case-hardened steel to one another or to components made from cast iron uses a nickel-containing filler. The components are not prepared for the welding operation, i.e., the components do not undergo at least partial abrasion of surfaces to be joined.

Abstract: A solder interconnection uses preferably lead-rich solder balls for making a low temperature chip attachment directly to any of the higher levels of packaging substrate. After a solder ball has been formed using standard processes, a thin cap layer of preferably pure tin is deposited on a surface of the solder balls. An interconnecting eutectic alloy is formed upon reflow. Subsequent annealing causes tin to diffuse into the lead, or vice versa, and intermix, thereby raising the melting point temperature of the cap layer of the resulting assembly. This structure and process avoids secondary reflow problems during subsequent processing.

Abstract: A flip chip interconnect system comprises an elongated pillar comprising two elongated portions, a first portion including solder with or without lead and a second portion including copper or gold or other material having a higher reflow temperature than the first portion. The second portion is to be connected to the semiconductor chip and has a length preferably of more than 55 microns to reduce the effect of &agr; particles from the solder from affecting electronic devices on the chip. The total length of the pillar is preferably in the range of 80 to 120 microns.

Abstract: An apparatus and a method are disclosed for placing at least two elements on a surface. The apparatus comprises means for supplying a surface, means for transferring the two elements to the surface, means for adjusting the position of the surface in a first direction, and means for adjusting the position of the transferring means in a second direction and about a rotation axis parallel to a third direction, the first, second and third directions being mutually orthogonal. Recognizing means are provided on at least one of the transferring means for recognizing position alignment marks provided on the surface.

Abstract: In a ball suction head, a main body thereof has a large number of ball suction holes and its inside space is to be decompressed. A mask is provided in the inside space of the main body to thereby close a predetermined number of the ball suction holes. A changeover member changes opening and closing of the suction holes by the mask.

Abstract: The inventive embedded processing subsystem module is adapted for backside circuit board assembly directly opposite of a specific microprocessor or Digital Signal Processor so that circuit groups such as memory banks and communications peripherals may utilize otherwise unused backside printed circuit board space underneath the processor device, and further so that high-speed signals interconnecting the processor and subsystem circuit devices traverse a minimized printed circuit track length.

Abstract: A structure of solder bumps with improved coplanarility, comprising a substrate, a passivation layer, a plurality of Under Ball Metallurgy (UBM) layers and a plurality of solder bumps. The substrate has at least an active surface, and a plurality of bonding pads are provided thereon. The UBM layers with various areas are electrically connected to the bonding pads. Finally, the solder bumps are formed with uniform-height on the UBM layers. A method of forming solder bumps with improved coplanarity. A UBM structure with various sizes of openings is provided to control the volume of the solder, wherein the various sizes of openings are corresponding to the current distribution across the wafer. The purpose of the various openings is to control the volume of the solder in order to form uniform-heights of solder bumps, the coplanarity of the solder bumps can thus be improved.

Abstract: This invention provides an improved method of projection welding which enables the sound welding of high-carbon, and high-tension low-alloy steels.

Abstract: A method for assembling a magnetic head assembly with a slider and a magnetic head including forming, on a slider supporting member, a terminal connected to a magnetic head terminal. In addition, the method includes fixing a head slider on the slider supporting member so that the head terminal faces the terminal of the slider supporting member and contacting a conductive ball member to both of the head terminal and the terminal of the slider supporting member. Furthermore, the method includes pressing the ball member to bond the head terminal with the terminal of the slider supporting member so that the ball member connects the terminals electrically and mechanically.

Abstract: A solder interconnection between a module and printed circuit board or card is provided by a plurality of solder connections arranged in a micro grid array joining solder wettable pads on a major surface of the module to a corresponding set of solder wettable pads of the printed circuit board or card. The solder connections are column shaped with the height of each connection being at least about 1.4 times the diameter of the connection.

Abstract: A capillary tube for a solder ball connection device connects a first connection surface of a pad to a second connection surface of a pad with a solder ball. The first connection surface is formed at a slider held by a slider holder in a disk unit. The second connection surface is formed at an end of a lead wired to the slider holder. The capillary tube has a ball regulator with a substantially conic, hollow portion. The solder ball regulator has an opening at its top that opens to the tip of the hollow portion. The center axes of the hollow portion and the opening are common. The solder ball regulator also has a pair of projections along the center axis around the opening, where the projections face each other with the center axis therebetween. The projections regulate the movement of the solder ball. The tip of the hollow portion is tapered when viewed from a line connecting the pair of projections and the extreme tips of the tapered tip portions.

Abstract: A precise volume, precisely registerable carrier is provided for use with injection molding for producing integrated circuit bump contacts in the “flip chip” technology. A hemispherical cavity is produced by etching through and undercutting a registered opening into a transparent carrier. The hemispherical cavity has related specific volume and visible peripheral shape that permits simple optical quality control when the injection molding operation has filled the cavity and simple optical registration for fusing to the pads on the integrated circuit.

Abstract: A solder interconnection uses preferably lead-rich solder balls for making a low temperature chip attachment directly to any of the higher levels of packaging substrate. After a solder ball has been formed using standard processes, a thin cap layer of preferably pure tin is deposited on a surface of the solder balls. An interconnecting eutectic alloy is formed upon reflow. Subsequent annealing causes tin to diffuse into the lead, or vice versa, and intermix, thereby raising the melting point temperature of the cap layer of the resulting assembly. This structure and process avoids secondary reflow problems during subsequent processing.

Abstract: A method of providing such an intercoupling component includes positioning terminals within holes of an insulative support member and attaching a solder ball to each of the terminals. Attaching the solder ball to the terminals is accomplished using a fixture having a number of recesses located in a pattern corresponding to a pattern of the holes in the insulative support member; filling each of the recesses with a solder ball; positioning the insulative support member over the fixture so that an end of each of the terminals contacts a corresponding solder ball; soldering the solder ball to the end of the terminal while maintaining the generally spherical shape of the solder ball; and removing the insulative support member from the fixture. The solder balls are generally soldered by passing the insulative support member with terminals and fixture with solder balls through a reflow apparatus.

Abstract: A diffusion-soldered joint and a method for making diffusion-soldered joints includes a particularly actively diffusing, low-melting-point intermediate layer, applied in the molten state, introduced in the form of a solder carrier between at least two joint components. The solder carrier includes a metal foil that is equipped on both sides with solder layers, wherein the solder layers may include multiple layers.

Abstract: An apparatus for placing solder balls in a pattern on a substrate, e.g., to form a ball grid array, the apparatus comprising a template having a first plane, a second plane, and a plurality of holes passing substantially orthogonally through the first and second planes parallel to an axis and corresponding in location to the pattern. Each of the holes is slightly larger than a solder ball diameter. The apparatus also including a porous base having first and second planes, wherein the first plane of the base contacts the second plane of the template. The base is permeable to a fluid in a first direction from the first plane of the template toward the second plane of the base. The apparatus further includes a fluid controller in fluid communication with the base for selectively causing the fluid to pass through the holes and through the base in the first direction to force the solder balls into the holes.

Abstract: An apparatus for placing solder balls in a pattern on a substrate is provided for, for example, to create a ball grid array. The apparatus comprises a template having a first plane, a second plane, and a plurality of holes. The holes pass substantially orthogonally through the first and second planes so that the template is permeable to a fluid between the first and second planes. The holes correspond in location to the pattern and each of the holes passes through the template along an axis. Each of the holes has a first end adjacent to the first plane with a first cross section substantially parallel to the first plane. The first cross section has a first characteristic dimension, for example, a diameter if the first cross section is circular. In addition each of the holes has a second end adjacent to the second plane with a second cross section substantially parallel to the second plane. The second cross section has a second characteristic dimension.

Abstract: A solder balltape comprised of an elongated tail with a ball of solder formed at one end. A plurality of the balltape structures are positioned on a carrier strip of solder. The balltape is positioned in contact with a transducer pad on a magnetic read/write slider and an electrical lead pad. A pulse of focused laser radiation is directed at the ball part of the balltape and a right angle fillet joint is formed. A subsequent laser pulse or a sharpened blade is used to remove the tail from the newly formed fillet joint.

Abstract: A process for joining or welding components made from case-hardened steel to one another or to components made from cast iron uses a nickel-containing filler. The components are not prepared for the welding operation, i.e., the components do not undergo at least partial abrasion of surfaces to be joined.

Abstract: Solder balls are mounted on electrodes with an active resin therebetween. The solder is heated and melts to be connected to pads of an LSI chip, thereby forming solder bumps on the chip. In a method of forming bumps, a method of mounting flip chips, and a mounting structure, by the use of the active resin, a flux washing process can be eliminated and at the same time, an assembly cost can be minimized.

Abstract: The present invention relates to a method for making an array of metal balls. The method includes the step of generating a first pattern on a metal foil which includes a plurality of foil projections. The method also includes the step of generating a second pattern on a carrier substrate. The second pattern includes a plurality of carrier recesses that are arranged and configured to correspond with the foil projections of the first pattern. The method further includes the steps of placing the metal foil and the carrier substrate together such that the foil projections of the metal foil fit within the carrier recesses of the carrier substrate, and melting the metal foil such that the foil projections form metal balls positioned within the carrier recesses of the carrier substrate. The invention also relates to metal ball arrays constructed via the above method.

Abstract: An apparatus and a process for mounting solder balls or other conductor balls on terminal pads of semiconductor devices or other electronic devices collectively formed on a semiconductor wafer or other substrate by using a single adsorbing plate. The apparatus includes an adsorbing unit which comprises an adsorbing head; an adsorbing plate attached to the head and having adsorbing holes for adsorbing the conductor balls, the adsorbing holes being arranged corresponding in number and position to the terminal pads present in one of the divisions that includes a largest number of the devices; and a mask plate attached to one side of the adsorbing plate and having an opening conformed in shape and size to an area of the substrate occupied by a group of the devices included in a selected one of the divisions so that the conductor balls are only adsorbed by the adsorbing holes corresponding in position to the terminal pads of the devices of the group in the selected one division.

Abstract: An apparatus for transferring micro-balls in accordance with the present invention, includes a suction head in which a plurality of suction pits are open for holding the respective micro-balls, a head holder to which the suction head is detachably coupled, a suction device communicating with a suction chamber in the head holder, for allowing the suction pits to hold the micro-balls by decompressing the interior of the suction chamber, and a holder transporting device to which the head holder is mounted, wherein the holder transporting device are movable between a sucking position at which is placed a pallet on which the micro-balls to be held by the suction pits, a transferring position at which is placed a working object to which the micro-balls held by the suction pits, and a head exchanging position at which the replacement of the suction head is carried out relative to the head holder.

Abstract: A connector for use with a circuit substrate having a plurality of elongated conductors. A solder ball is fused to the end of the conductors for connection of the connector to a circuit substrate. Method for attaching the solder ball to the end of the conductors using a solder paste with or without a preformed solder ball. The conductors are fitted into passages of an interface member. A tail end of each conductor terminates in a well in a surface of the interface member that facilitates the attachment of solder ball to the end of the conductors. The passages in the interface member hold the conductor tail ends in place while providing a clearance around the conductor to accommodate the effects of thermal expansion and contraction.

Abstract: A solder preform is provided for forming interconnections between multilayer ceramic substrates comprising an upper layer and lower layer of solder separated by an intermediate layer of a material which is wettable by solder and which does not melt at the temperatures used to reflow the solder and form the connections. The solder preform is used to join the substrates and is particularly useful to simultaneously electrically interconnect the substrates and to form a hermetic seal between the substrates being joined.

Abstract: A semiconductor device in chip format having a chip which has at least one first insulating layer and electrical connection pads free of the insulating layer is described. On the first insulating layer, interconnects run from the electrical connection pads to base regions of external connection elements. A further applied insulating layer is provided with openings leading from the outside to the base regions of the external connection elements. In the openings there is a conductive adhesive, onto which small balls which are metallic at least on the outside are placed. The semiconductor element can also contain a solder paste instead of a conductive adhesive in the openings, and metallized small plastic balls are placed onto the solder paste. The invention furthermore relates to methods for producing the semiconductor device described.