Abstract: Minute copper balls having a high sphericity which are suitable for use as the cores of copper core solder balls are manufactured by heating small pieces comprising an alloy of 0.5-40 wt % of Zn and a remainder of Cu to at least the melting point of Cu without the pieces contacting each other to give them a spherical shape and cooling the resulting spheres to form solid balls. The minute copper balls which are obtained comprises 0.01-0.5 wt % of Zn and a remainder of Cu and have a spherical shape with a diameter in the range of 50-1000 &mgr;m.

Abstract: Improved fluxless soldering processes are disclosed. In accordance with one technique, a solder preform having a plurality of voids formed on its primary surfaces is disposed between metallized surfaces of a pair of members to be joined. Upon reaching the reflow temperature, fresh solder flows into the voids and wets portions of the metallized surfaces, thus overcoming the solder surface oxidation problem common to fluxless soldering processes. In accordance with another technique, a solder preform having primary surfaces coated with a thin layer of a noble metal is employed. The noble metal substantially prevents oxidation of the solder performs surfaces while the preform is heated to reach reflow temperature. As the solder temperature increases, portions of the noble metal are dissolved into the bulk solder material. Thus, during reflow, non-oxidized bulk solder material is enabled to wet the metallized surfaces of the pair of members.

Abstract: A solder ball attachment system for manufacturing an integrated circuit or the like is disclosed. The solder ball attachment system includes a flux station to apply flux onto a substrate and a solder ball placement station to place solder balls onto the flux on the substrate. The solder ball attachment system further includes a conveyor assembly to move the substrate between the flux station and the solder ball placement station.

Abstract: A connecting method of a wheel rim of a bicycle includes the following steps: forming a wheel rim, inserting an inner connecting member between two abutment ends of the wheel rim, connecting the two abutment ends, heating, packing, permeating, and returning. Thus, the structural strength of the wheel rim is enhanced, thereby increasing the lifetime of the wheel rim. In addition, the connecting seam of the two abutment ends will not form a protruding rough bur, so that it is unnecessary to perform a secondary working process to grind the surface of the connecting seam of the two abutment ends, thereby simplifying the working process of the wheel rim, and thereby decreasing costs of fabrication.

Abstract: Method for controlling the deposition of solder on a base metal or substrate is disclosed. The method comprises applying an attaching flux and finishing flux to a substrate, placing a preform thereon and subjecting the same to reflow conditions. The finishing flux is applied to solubilize the normally insoluble corrosive residues that would occur when the attaching flux is subjected to reflow conditions with the preform and substrate. Alternatively, the attaching flux may be applied to the preform and substrate before undergoing reverse reflow conditions and then the finishing flux is applied to the solder deposit and substrate and the same subjected to second reflow conditions. After each method, the residues left from the attaching flux which are solubilized by the finishing flux, are cleaned by washing with a typical solvent.

Abstract: A method of manufacturing a fiber reinforced metal disc comprises forming an annular groove in an axial face of a first metallic ring. A plurality of metal coated fibers are arranged in spiral preforms and a plurality of metallic wires are arranged in spiral preforms. The metal coated fiber preforms and the metallic wire preforms are arranged in the groove. An annular projection is formed on an axial face of a second metallic ring. The annular projection on the second metallic ring is aligned with the annular groove in the first metallic ring. Heat and pressure is applied to axially consolidate the metal coated fiber preforms and metallic wire preforms and to bond the first metal ring, the second metal ring, and the preforms to form a unitary composite disc. The use of metal coated fibers and metallic wires allows the mechanical properties to be tailored.

Abstract: Method of tying two or more components together using a fastener. Each component is provided with a hole and the components are placed so that the holes overlap one another in order to receive the fastener in the holes. The fastener is placed in the holes and mechanically pressure-loaded and heated in order to deform the fastener to tie the components together. The fastener is heated essentially only during the fastener deformation phase in order to minimize the heat transfer from the fastener to the components being tied.

Abstract: The invention relates to a flow sensor comprising a substrate with integrated heat source and temperature sensors. Solder bumps are arranged on the heat source and the temperature sensors and the substrate is attached to the outside of a tube using flip chip technology. Preferably, the outside of the tube is structured for being wetted at appropriate positions by the solder. This allows to assemble the sensor easily and accurately.

Abstract: A vacuum brazing method is disclosed for joining aluminum stock materials to each other. The typical cladding material utilized includes aluminum and a melting point lowering agent such as silicon. In addition, the cladding material typically includes magnesium to provide for enhanced wetting of the cladding material into the joint area. It has been found that adjusting the ratio of magnesium to calcium to a level of equal to or greater than 625 to 1 provides greatly enhanced brazed joint formation and reliability of the vacuum brazing method.

Abstract: A method for creating an electroconductive joint in connection with conductor rails made of copper or copper alloy, in which method in between the conductor rail elements to be joined, there is applied soldering/brazing agent, whereafter at least the junction area is heated, so that a joint is created. According to the method, the employed soldering/brazing agent is a layered soldering/brazing agent foil (3) comprising surface layers (4, 6) and an intermediate layer (5) therebetween, and the junction area is thermally treated, so that a diffusion joint is created.

Abstract: A method of fabricating a FCBGA (Flip-Chip Ball-Grid-Array) package without causing mold flash is proposed, which is characterized by the forming of a dummy pad over the back surface of the substrate to allow the portion of the solder mask formed over a vent hole in the substrate to be substantially raised to an elevated flat surface where a groove is then formed to surround the exit of the vent hole. During a molding process, when the encapsulation material infiltrates to the exit of the vent hole, it can be confined within the groove in the elevated flat surface over the dummy pad, thereby preventing it from flashing to nearby solder-ball pads.

Abstract: Reactive foils and their uses are provided as localized heat sources useful, for example, in ignition, joining and propulsion. An improved reactive foil is preferably a freestanding multilayered foil structure made up of alternating layers selected from materials that will react with one another in an exothermic and self-propagating reaction. Upon reacting, this foil supplies highly localized heat energy that may be applied, for example, to joining layers, or directly to bulk materials that are to be joined. This foil heat-source allows rapid bonding to occur at room temperature in virtually any environment (e.g., air, vacuum, water, etc.). If a joining material is used, the foil reaction will supply enough heat to melt the joining materials, which upon cooling will form a strong bond, joining two or more bulk materials.

Abstract: A solder ball dispenser (100) has feeder unit and head unit chambers (200, 300) and a pneumatic singulator (370). Solder balls (101) are put into motion in the chambers by moving air. The pneumatic singulator and a channel for solder balls are formed, machined or molded in a head plate (142) of a dispenser and enclosed by a front plate (141) and a back plate (143) secured adjacent to the head plate. The solder ball dispenser receives a continuous supply of unorganized solder balls and arranges them in a single stack (340). The pneumatic singulator ejects the balls one at a time to a target device such as a Ball Grid Array (BGA). The dispenser has a plurality of conduits (331-338) for applying one of air pressure and vacuum to various points of the chambers and the channel. Solder balls are transported through the dispenser and ejected from the dispenser by the programmed application of air pressure and vacuum.

Abstract: A method and apparatus for reworking a Ball Grid Array (BGA) package is provided. The apparatus includes a housing with a solder ball compartment that includes solder balls; a sliding base plate positioned to slide under the solder ball compartment; and a BGA nest for supporting the BGA package and a stencil with a hole. The sliding base plate has a BGA nest holder adapted to receive the BGA nest with the BGA package and the stencil. The sliding base plate with the BGA nest, BGA package and the stencil moves underneath the solder ball compartment such that solder balls are placed on the BGA package through the stencil hole pattern. After the solder balls are placed on the BGA package, the sliding plate with the BGA package and the solder balls move in a second direction away from the solder ball compartment.

Abstract: Systems and methods for forming a seal between members of an assembly are disclosed. In one embodiment, a seal is formed between a first member and a second member by establishing within the members a bounded volume and creating within the bounded volume a pressure differential with respect to the ambient pressure outside the bounded volume. The pressure differential results in a uniformly applied clamping force to the members thereby creating a reliable seal. A sealing member (such as solder, epoxy, or other sealant) is positioned between the first and second members and the resulting assembly is mechanically positioned such that heat can then be applied to melt the solder. Concurrently, the pressure differential is created which allows the externally applied mechanical positioning to be relaxed while the members are being sealed together. This system and method can be used to create hermetic seals.

Abstract: The invention provides an apparatus and method for positioning solder balls in a desired array on a substrate. A positioning means is provided for positioning the solder balls in positions corresponding to the array of positions the solder balls are to take up on the substrate. A container for receiving a plurality of solder balls and which is movable between a first position remote from the positioning means and a second position directly thereover supplies solder balls to the positioning means. Means are provided to bias the solder balls in the direction of movement of the container from the first to the second position whereby to reduce or obviate damage to the solder balls during such movement.

Abstract: A hermetic package useful in optical communications, for example to house a MEMS switch, a semiconductor laser or a dynamic gain equalizer, has at least one vent opening that is sealed, following the assembly of the package, by inserting a solder plug into the vent opening and cold-pressing the solder by into the opening, preferably by screwing-in a bolt into a threaded part of the vent opening, until the solder is deformed to seal the vent opening. Preferably, the indium-tin or bismuth-tin solder is pushed down until it partially exits from a narrower portion of the vent opening into the package cavity. Following the plug deformation, the bolt may be withdrawn or left in place. The approach is simple and eliminates the conventional step of melting the solder.

Abstract: An optically baffled heating station for joining wire connections by using a solder sleeve includes: an outer housing; a reflection block where said reflection block includes a reflection chamber where the reflection chamber forms the shape of two overlapping ellipses where the ellipses intersect at one respective focal point of each ellipsis and the opposing non-intersecting focal points are separated by about a 90° angle; two heating elements within a heating element block where the two heating elements extend beyond the heating element block and protrude into the reflection pockets of the reflection chamber. A slot extends between the two heating elements through the reflection block and the heating element block. The closed end of the slot includes a target area where the shrinking of the sleeve occurs. The target area receives the reflected light and minimizes the reflection of light toward the open end of the slot.

Abstract: A furnace brazing process for metal parts of which at least one part is tubular, includes positioning of the filler metal, preferably as a pre-formed member inside said tubular part, and successive reheating inside the furnace to induce the melting of the filler metal and the accomplishment of the joint.

Abstract: A method and apparatus for loading solder balls into a mold. Solder balls are loaded into a reservoir having multiple exit ports. A removable mold is fitted into the apparatus and the reservoir is passed across the top of the mold while solder balls are fed into cavities in the mold. After the reservoir has advanced across the mold and the mold cavities are filled with solder balls, the reservoir is reset as a roller is simultaneously guided across the mold to seat the solder balls firmly within the mold. Alternatively, the roller may be applied to the solder balls while the reservoir advances across the mold, or both as the the reservoir is advanced and when it is returned to its original position.

Abstract: A method and apparatus provides increased operative life for flip-chip devices that are produced from an integrated circuit formed with electrically conductive bumps bonded to a printed circuit board substrate. The bumps and the substrate are formed from similar materials that allow control of the degree of latency for each element and produce a covalently bonded laminate structure when the bumps and substrate are brought together. The covalently bonded structure decreases bump fatigue to lengthen the operative life of the flip-chip device.

Abstract: A method for manufacturing a cooling element comprising a housing part and ceramic lining elements arranged on the housing part surface. The ceramic lining elements (2) are connected to the element housing part (1) by using in the joint between the lining elements and the housing part a soldering/brazing agent, wherein at least the junction area is heated at least up to the melting temperature of the soldering/brazing agent, so that there is created a joint with a good thermal contact with the element housing part (1) and a ceramic lining element (2). The invention also relates to a cooling element.

Abstract: The present invention relates to a method for repairing components such as blades used in turbine engines. The method comprises the steps of placing a piece of refractory metal material over an area of the component to be repaired and depositing a repair filler metal material over the piece of refractory material in an amount sufficient to repair the component and welding the repair filler metal material in place. The refractory metal material may be selected from the group consisting of niobium, tantalum, molybdenum, tungsten, a metal having a melting point higher than the melting point of nickel, and alloys thereof and may be uncoated or coated.

Abstract: A device (61) is provided herein which comprises a semiconductor substrate (63) having a solder pad (65) disposed thereon. The solder pad (65) has a convex surface (67) upon which is disposed a solder (75). The solder joints formed with this type of solder pad are found to exhibit reduced stress and improved reliability.

Abstract: Systems and methods for forming a seal between members of an assembly are disclosed. In one embodiment, a seal is formed between a first member and a second member by creating a near vacuum with respect to the members to be sealed. The vacuum results in a uniformly applied clamping force to the members thereby creating a reliable seal. A sealing member (such as solder) is positioned between first and second members and the resulting assembly is mechanically positioned such that heat can then be applied to melt the solder. Concurrently, a vacuum is created within the assembly, thereby allowing the externally applied mechanical pressure to be relaxed. The created vacuum allows the members to seal together without externally applied forces.

Abstract: A solder ball attachment system for manufacturing an integrated circuit or the like is disclosed. The solder ball attachment system includes a flux station adapted to apply flux onto a substrate and a solder ball placement station adapted to place solder balls onto the flux. A conveyor assembly is included to move the substrate between the flux station and the solder ball placement station.

Abstract: An apparatus for applying solder balls to a substrate (7, 9) and for remelting the solder balls on soldering points (6) of the substrate (7, 9) has a capillary (3) for supplying a solder ball (5) to the soldering points (6) and for placing the solder ball (5) at the free end (4) of the capillary (3) opposite the soldering point, a means for supplying heat to the solder ball (5) to remelt it, and a pressing apparatus (10) for holding down the substrate (7, 9) to prevent the substrate (7, 9) from being resilient when placing and remelting the solder ball (5).

Abstract: A semiconductor chip package includes a semiconductor chip mounted on a top surface of a substrate. A bottom surface of the substrate has ball pads. Bonding pads of the chip are electrically connected to the substrate. Enhanced pads, each having one or more dummy patterns coupled to one or more dummy pads, are preferably formed near edges of the substrate. The semiconductor chip package is mounted on the board by attaching external connection terminals such as solder balls, formed on the ball pads and the dummy pads, to a solder paste coated on ball lands and enhanced lands of the board.

Abstract: The bump ball crimping apparatus of the present invention is characterized in comprising an alignment plate 31 for aligning bump balls; a crimping table 32 on which the wafer to which bump balls are to be crimped is mounted; a crimping plate 42 that crimps the bump balls onto the bonding pads of the wafer; a Y-axis moving mechanism 35 that can move the alignment plate 31 in the Y direction and can fasten it at a predetermined position; an X-axis moving mechanism that can move the alignment plate 31 in the X direction and can fasten it at a predetermined position; and a second Y-axis moving mechanism 37 that can move the crimping table 32 in the Y direction and can fasten it at a predetermined position.

Abstract: A solder ball holding terminal has a first plate, a second plate and a third plate integrally formed with and sandwiched between the first plate and the second plate. The first plate has a first distal end, the second plate has a second distal end and the third plate has a third distal end and a fourth distal end. A distance between the third distal end and the fourth distal end is much smaller than that between the first distal end and the second distal end such that when a solder ball is inserted into a space defined among the first distal end, the second distal end, the third distal end and the fourth distal end, a substantially three-point support is provided to the solder ball so that the solder ball is securely clamped.

Abstract: A solder ball attaching process for attaching solder balls to a wafer is provided. First, an under-ball-metallurgy layer is formed on the active surface of the wafer. Patterned masking layers are sequentially formed over the active surface of the wafer. The masking layers together form a step opening structure that exposes the under-ball-metallic layer. A solder ball is placed on the uppermost masking layer and allowed to roll so that the solder ball drops into the step opening structure by gravity. A reflow process is conducted to join the solder ball and the under-ball-metallurgy layer together. Finally, various masking layers are removed to expose the solder ball on the bonding pad of the wafer.

Abstract: A method for fabricating a chip scale package is described. The method utilizes wafer level processes to obtain a chip level package. The method particularly avoids the use of mechanical grinding by the novel use of molding, extruding, and etching technology.

Abstract: A method for plugging a hole, particularly a hole provided in a cooling element, in which method a hole formed in a piece essentially made of mainly copper, for instance in the housing element of a cooling element, there is arranged a plug mainly made of copper. Between the side surface of the plug and the inner surface of the hole, there is arranged brazing agent with a melting temperature lower than that of the pieces to be joined together, and the junction area between the plug and the piece, such as the housing element of the cooling element, is heated at least up to the melting temperature of the brazing agent or to the vicinity thereof, whereafter the junction area is cooled. The invention also relates to a cooling element manufactured according to said method.

Abstract: High melt balls dispersed on the surface of a ball grid array package in such a manner that the collapse of eutectic solder balls is controlled during reflow heating in order to ensure appropriate solder ball standoff, pitch and coplanarity of the ball grid array package from the substrate or printed circuit board surface to which it is being attached.

Abstract: A wire bonding method, a bump forming method and a bump which are capable of preventing contact of a wire with a substrate or a conductive lead after the wire is bonded to a bump, and which are capable of preventing generation of bending in the wire during bonding of the wire to the bump are disclosed. When a first conductor and a second conductor are wire bonded, a bump is previously formed on the second conductor by ball bonding. An inclined surface is formed on an upper end of the bump by moving a capillary along a predetermined path to operate the capillary. First bonding of a wire to the first conductor is carried out, then the wire is looped from the first conductor to the bump, and second bonding of the wire onto the inclined surface of the bump is carried out.

Abstract: A method of forming solder connections on a circuitized substrate having connection pads is provided. A laser ablatable solder mask material, preferably an epoxy, is degassed and then dispensed as a liquid onto the substrate over the circuitization. The surface of the solder mask material as applied is leveled, and the solder mask material is then cured to form a solder mask. Openings are laser ablated in the solder mask material to reveal those connection pads which are to receive solder to form the solder connections. Liquid solder is dispensed under pressure in a confined space into the openings as blades move laterally on top of the solder mask to fill the openings in the solder mask. The solder material is then solidified to form domed solder bumps in the openings.

Abstract: A weld wire for storage on a spool of weld wire. The weld wire has a substantially linear cast in the form of an undulating curve that generally lies in a single plane. The undulating curve is a succession of generally semi-circular sections having a generally fixed radius of curvature. The linear cast is formed on the weld wire prior to the weld wire being wound on the spool of weld wire. The linear cast is at least partially retained on the weld wire after the weld wire is unwound from the spool and during the feeding of the weld wire through a welding machine.

Abstract: A solder-fill used for mounting a semiconductor chip consists of under-fill material to fill the gap between the semiconductor chip and the PCB, and the solder bump material formed by a plurality of dot or disc shapes and disposed interior of the under-fill material with same thickness to match with the connection pattern of semiconductor chip pad and the PCB. A process of manufacturing the solder-fill is that of: arranging a plurality of wire or rod shaped solder bump material to match with the connection pattern of semiconductor chip and PCB in a container, filling a liquid state of under-fill material into the container, solidifying the under-fill material in the container, and slicing the solidified under-fill material and solder bump material with a uniform thickness.

Abstract: In one embodiment, portions of a plurality of solder balls are placed within a frame and in registered alignment with individual bond pads over a substrate. While the ball portions are within the frame, the balls are bonded to their associated bond pads. In another embodiment, a frame is provided having a plurality of holes sized to receive individual balls. Individual balls are delivered into the holes from over the frame. The balls are placed into registered alignment with a plurality of individual bond pads over a substrate while the balls are in the holes. The balls are further bonded. In another embodiment, a frame is provided having a hole. A solder ball is provided having an outer surface. The ball is retained within the hole in an ambient processing environment which is generally uniform over the entirety of the ball's outer surface. While the ball is within the hole, the ball is bonded.

Abstract: The aim of the present invention is a process for manufacturing a plated product (1) comprising a support part in steel (2) and an anticorrosion metallic coating (3), characterized in that the anticorrosion coating (3) is fixed on the support part (2) by controlled-atmosphere brazing, in particular by vacuum brazing. The process according to the invention makes it possible to fix solidly an anticorrosion coating with a thickness smaller than 1 mm on a steel plate.

Abstract: Stenciling machines and methods for forming solder balls on microelectronic-workpieces are disclosed herein. In one embodiment, a method for depositing and reflowing solder paste on a microelectronic workpiece having a plurality of dies includes positioning a stencil having a plurality of apertures at least proximate to the workpiece. The method further includes placing discrete masses of solder paste into the apertures and reflowing the discrete masses of solder paste while the stencil is positioned at least proximate to the workpiece and while the discrete masses are in the apertures. In another embodiment of the invention, a stenciling machine for depositing and reflowing solder paste on the microelectronic workpiece includes a heater for reflowing the solder paste, a stencil having a plurality of apertures, and a controller operatively coupled to the heater and the stencil. The controller has a computer-readable medium containing instructions to perform the above-mentioned method.

Abstract: A system and method of joining together first and second electric terminals includes providing the second terminal with an aperture extending therethrough and a notch therein. The first and second terminals are positioned in overlapping relationship with one another so the aperture overlaps the first terminal to provide access to the first terminal through the second terminal, and so the notch overlaps the first terminal. Heat is applied to the first terminal through the aperture in the second terminal to heat the first and second terminals. The end of a solder wire is positioned in engagement with the notch of the heated second terminal to locate the solder wire with respect to the terminals and to melt the solder wire to form a solder pool that contacts the first and second terminals.

Abstract: A first member 10 containing at least ceramics and a second member 12 containing at least a metal or a metal composite was joined with each other. An adhesive 2 composed of a metal containing at least indium and materials 1A, 1B containing at least a component capable of reducing the melting point of indium between the first and second members to provide a laminate 13. The laminate 13 is heated at a temperature in solid-liquid coexisting range of an alloy comprising indium and said component to join the first member 10 and second member 12.

Abstract: A method is proposed for fastening at least one electrical component to a substrate using solder, in which elevations are produced in the solder substrate, the elevations being at least as high as the thickness of a solder layer to be produced, in a further step the solder, especially a solder foil, is laid upon the elevations, and in a further step, the elevations are pressed down until they have reached approximately the height of the solder, so that a soldering procedure may follow. The method is used for producing exactly specified thicknesses of solder layers having tolerances less than 10 micrometer.

Abstract: A system for joining a pair of structural members having widely differing coefficients of thermal expansion is disclosed. A mechanically “thick” foil is made by dispersing a refractory metal powder, such as molybdenum, niobium, tantalum, or tungsten into a quantity of a liquid, high expansion metal such as copper, silver, or gold, casting an ingot of the mixture, and then cutting sections of the ingot about 1 mm thick to provide the foil member. These foil members are shaped, and assembled between surfaces of structural members for joining, together with a layer of a braze alloy on either side of the foil member capable of wetting both the surfaces of the structural members and the foil. The assembled body is then heated to melt the braze alloy and join the assembled structure. The foil member subsequently absorbs the mechanical strain generated by the differential contraction of the cooling members that results from the difference in the coefficients of thermal expansion of the members.

Abstract: A semiconductor device can be formed with fewer voids in the solder bonding a laminate of a silicon chip, an insulator substrate, and a metal base, with a solder layer positioned between the layers. After placing the laminate in a furnace, it is evacuated and then pressurized with hydrogen gas, and then heated to melt the solder. While maintaining the heat, the furnace is again evacuated to remove voids in the solder, and then the furnace is positively pressurized again with hydrogen gas to prevent holes produced by the voids traveling in the solder, and to obtain a uniform solder fillet shape. Thereafter the laminate is rapidly cooled to obtain a finer grain solder to increase the rate of creep to quickly remove the warping of the laminate to the original state.

Abstract: The method forms a sputter target assembly by attaching a sputter target to an insert and applying a bond metal layer between the insert and a backing plate. Then pressing the insert and backing plate together forms a solid state bond with the bond metal layer, attaches the insert to the backing plate and forms at least one cooling channel between the insert and the backing plate. A filler metal secures the outer perimeter of the insert to the backing plate in order to eliminate leakage from the cooling channel during sputtering of the sputter target.

Abstract: Disclosed is a solder alloy in use for bonding electric or electronic parts, containing: 3 to 12% by weight of a zin component; and a tin component. The oxygen content of the solder alloy is reduced to 100 ppm or less. Using the solder alloy, a bonding portion is formed on the substrate and the electronic part is mounted thereon to obtain a substrate for mounting the electronic part and a substrate on which the electronic part is mounted. The bonding portion made of the above solder alloy can prevent migration.

Abstract: A method of manufacturing a joint between metal and a ceramic substrate for a high temperature sensor. First, a predetermined hole is formed in the ceramic substrate to serve as a joint portion. A bonding layer is preferably disposed on the ceramic substrate to form on the inner surface and the surrounding portion of the hole. Next, the hole is filled with a supporting metal. Then, a conductive layer is formed on the supporting metal and the bonding layer. A metal signal conductive frame is then formed on the conductive layer. Next, a welding spot is formed through the metal signal conductive frame, the conductive layer and the supporting metal at the joint portion by a welding process.

Abstract: A pin standing resin substrate including a resin substrate having a substantially plate-shaped main surface and composed of one of a resin and a composite material containing a resin, and having a pin-pad exposed from the main surface; and a pin soldered to the pin-pad, wherein the pin has been thermally treated by heating so as to soften the pin. The pin has a rod-like portion composed of a copper base metal and an enlarged diameter portion made of the same material as the rod-like portion. The enlarged diameter portion has a larger diameter than the rod-like portion and is formed at one end of the rod-like portion. At least the enlarged diameter portion is soldered to the pin-pad. Also disclosed is a method of making the pin standing resin substrate, a pin for bonding with the resin substrate, and a method of making the pin.