Abstract: The present invention relates to a method and an apparatus for arranging fine balls serving as a ball bump particularly on electrodes on a semiconductor chip, electrodes on a semiconductor-mounting substrate, or electrodes on a semiconductor device. It is made possible to remove small-diameter balls by, firstly, using a pre-arrangement plate for arranging the balls and using two diameters for the ball trap holes of the pre-arrangement plate. Secondly, occurrence of a ball suction abnormality and the time required for sucking the balls is reduced by using the pre-arrangement plate and a ball feeder. Thirdly, a ball suction abnormality to the ball arrangement device is determined by detecting the air flow velocity in an evacuation route of the ball arrangement device.

Abstract: An apparatus for lining up micro-balls in accordance with the present invention includes: ball carrying pallets having a plurality of pits for holding the micro-balls, respectively, on its surface, a pallet holder for holding the ball carrying pallets, a lining-up container defining a sealed chamber in association with the pallet holder hermetically fitted thereto, a storing tank for storing liquid carrier in which micro-balls are dispersed, and applying/collecting device for communicating the storing tank with the lining-up container via a passage to supply the micro-balls together with the liquid carrier from the storing tank to the sealed chamber and return the surplus micro-balls together with the liquid carrier from the sealed chamber to the storing tank.

Abstract: This invention provides screen printing for forming a higher solder ball (bump). In first printing step, a first solder layer is printed. After drying in drying step, a second solder layer is printed on the first solder layer in second printing step. Then, in re-flow processing step, re-flow processing is performed, and the first solder layer and the second solder layer are melted. Finally, the melted layer is solidified in a ball shape to form the solder ball (bump). Since solder paste is printed in layers, an amount of the solder paste can be increased. Hence, a higher solder ball (bump) can be formed.

Abstract: A method and apparatus are disclosed for releasing solder spheres during the locating and/or placing of a pattern of conductive preforms 32 on a respective pattern of electronic pads 14 on a receiving substrate 12 for such uses as a Ball Grid Array component 24. The release mechanisms are of either compliant mechanical 11, vibratory 90, air pressure 100 or 120, or sound pressure waves 140. Additionally, a method and apparatus is disclosed for the electrical inspection for presence or absence of the complete pattern of conductive preforms.

Abstract: A solder preform is provided for forming interconnections between multilayer ceramic substrates comprising an upper layer and lower layer of solder separated by an intermediate layer of a material which is wettable by solder and which does not melt at the temperatures used to reflow the solder and form the connections. The solder preform is used to join the substrates and is particularly useful to simultaneously electrically interconnect the substrates and to form a hermetic seal between the substrates being joined.

Abstract: Bonding material balls such as solder balls are applied onto contacts of a semiconductor chip or other microelectronic unit using an escapement mechanism which feeds one solder ball per cycle into each aperture of a stencil. The apparatus reliably places one solder ball on each contact of the microelectronic unit.

Abstract: A connector for use with a circuit substrate having a plurality of elongated conductors. A solder ball is fused to the end of the conductors for connection of the connector to a circuit substrate. Method for attaching the solder ball to the end of the conductors using a solder paste with or without a preformed solder ball. The conductors are fitted into passages of an interface member. A tail end of each conductor terminates in a well in a surface of the interface member that facilitates the attachment of solder ball to the end of the conductors. The passages in the interface member hold the conductor tail ends in place while providing a clearance around the conductor to accommodate the effects of thermal expansion and contraction.

Abstract: A method for repairing and joining aluminum alloy articles and structures, such as heat exchangers for use in automotive applications. The method utilizes a flux-coated soldering rod (10) that is used to deliver a solder alloy (12) and a flux compound to a region to be repaired. The flux compound has a higher melting temperature than the solder alloy (12), and is present as a coating (14) that sufficiently thermally insulates the alloy (12) to cause the flux compound and the solder alloy (12) to melt nearly simultaneously during the soldering operation. The solder alloy (12) is preferably a zinc-aluminum alloy, while the flux coating (14) preferably contains a cesium-aluminum flux compound such as potassium cesium tetrafluoroaluminate, dispersed in an adhesive binder that will readily volatilize or cleanly burn off during the soldering operation.

Abstract: A method and apparatus are disclosed for placing solder balls on electronic pads on a component or substrate, such as for a ball grid array (BGA) applicator. The BGA applicator utilizes a foil(s) that is treated to provide color to the surface; the color is used to assist in inspection of the solder spheres. The solder balls can transferred to the electronic pads by holding them to openings in the foil by applying a holding force such as a vacuum applied to the solder balls through the openings in a foil. Optionally, a second material can be placed against the foil where the secondary material holds solder spheres to the apertures. After locating the solder balls to the electronic pads of a component or substrate, the solder balls are released and placed on the electronic pads by removing the holding force such as by deactivating the vacuum.

Abstract: A printed circuit board has a conductor path applied to a substrate having an electrically insulating surface, the conductor path preferably being constructed in the shape of a meander and containing connection areas with holes to which small contact plates are applied for the purpose of later bonding with connection leads. The small contact plates are applied in a hard soldering process with the aid of solder paste to the connection areas of the conductor paths and to the surface area of the substrate surface which is made of ceramic and exposed by the holes. It is consequently possible, dispensing with so-called bonding wires, to directly connect connection leads or bonding lugs electrically with the conductor path and mechanically with the printed circuit board. The printed circuit board is preferably designed as a measuring resistor, wherein the conductor path is applied as a resistance layer of platinum or platinum group metal in a thin film process to a small ceramic plate of aluminum oxide.

Abstract: The present disclosure pertains to a method for making a hermetically sealed package which includes a housing, a lid and a feedthrough for at least one stripped fiber. The method includes the following steps: 1) placing at least one optical fiber and at least one solder preform between the sealing surface of the lid and the sealing surface of the housing; and 2) sealing the assembly by applying pressure and heat so as to press the fiber (or fibers) into the solder.

Abstract: In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to form, there are various limitations to the material of which the bumps are made, to enough cubic volume of bumps and to small scattering of the bump height. According to the invention, solder balls and a tool having a large number of through-holes are used, and under the condition that the through-holes of the tool are aligned with the pads of the semiconductor device, the solder balls are charged into the through-holes, pressed to be fixed on the pads, and then reflowed to form bumps.

Abstract: A method and apparatus are disclosed for placing solder balls 201 on electronic pads 1204 on a substrate 1202, such as for a ball grid array (BGA) applicator 10. The solder balls 201 are held to openings 102 in a foil 22 such as by vacuum force 1607 applied to the solder balls 201 through the openings 102 in a foil 22. After locating the solder balls 201 at electronic pads 1204 on a substrate 1202, by deactivating the vacuum force 1607 and optionally applying a release force 1703 the solder balls 201 are released and placed on the electronic pads 1204. Optionally, a release mechanism 2400 applies placing force 2600 to the solder balls 201 through the openings 2404 in the foil 2403.

Abstract: An apparatus and a process for mounting solder balls or other conductor balls on terminal pads of semiconductor devices or other electronic devices collectively formed on a semiconductor wafer or other substrate by using a single adsorbing plate. The apparatus includes an adsorbing unit which comprises an adsorbing head; an adsorbing plate attached to the head and having adsorbing holes for adsorbing the conductor balls, the adsorbing holes being arranged corresponding in number and position to the terminal pads present in one of the divisions that includes a largest number of the devices; and a mask plate attached to one side of the adsorbing plate and having an opening conformed in shape and size to an area of the substrate occupied by a group of the devices included in a selected one of the divisions so that the conductor balls are only adsorbed by the adsorbing holes corresponding in position to the terminal pads of the devices of the group in the selected one division.

Abstract: An electrical contact that is mounted on a printed circuit board to provide an electrical connection to the printed circuit board. The contact has the structural integrity of a through-hole component with the capability of being soldered to the circuit board using a surface mount reflow process. The contact includes a pair of elongated, conductive pins with a base disposed therebetween, and a solder preform supported on one of the conductive pins adjacent the base. The pin supporting the solder preform is insertable into a plated-through hole on the circuit board so that the solder preform can be reflowed into the hole along the pin to form a solder joint between the contact and the hole. The contact may include a retainer to secure the solder preform to the pin and the end of the base adjacent the pin may be beveled to facilitate gas ventilation from the hole during the soldering process. The base may be configured so that it can be grasped with a test instrument or support a wire connection to the contact.

Abstract: An apparatus for placing an array of solder balls on a substrate includes a carrier plate having an array of holes therethrough. Each hole is capable of holding a solder ball. A ball placement head having an array of pins is aligned with a desired pattern of solder balls held by the carrier plate. The array of pins push the pattern of solder balls through the holes in the carrier plate onto the substrate.

Abstract: By providing a mechanism for removing static electricity, even slight electric charge caused by natural electrification is removed before holding solder balls. A necessary number of solder balls are held securely. The solder balls attracted by vacuum suction are brought close to pads until the solder balls come in contact with flux surfaces of pads. While continuously holding the solder balls using vacuum suction, the solder balls are pressed against the pads. The solder balls are embedded in the flux having adherence power and held. In a solder ball mounting apparatus, therefore, solder balls can be mounted on pads of a substrate securely without using electrostatic force which is difficult to control.

Abstract: The method (400, 500) and device (200) for reworkable direct chip attachment include a thermal-mechanical and mechanical stable solder joint for arranging connection pads on a top surface of the circuit board to facilitate connection for electronic elements, and affixing a reinforcement having apertures to accommodate solder joints to the top surface of the circuit board to facilitate solder attachment of the connection pads to the electronic elements wherein the reinforcement constrains deformation of the circuit board to provide reliable solder joints and facilitates attachment and removal of electronic elements from the circuit board.

Abstract: A connecting board is provided for disposition between a base plate such a LGA base plate and a mounting board such as a printed circuit board. The connecting board has a substrate having a plurality of through holes. Each through hole extends between opposite first and second surfaces of the substrate. An easily deformable soft metal body is mounted in each through hole in such a way as to have protruded portions protruding from the first and second surfaces of the substrate. The protruded portions of the soft metal body are different in protruding height. The connecting board are connected at the protruded portions to the base plate and the mounting board. The heights of the protruded portions are set depending upon the materials and the coefficients of thermal expansion of the LGA base plate, printed circuit board and connecting board.

Abstract: A sheet metal layer of a layer-like configuration with rolled-on brazing material and a process for producing a honeycomb body by stacking and/or winding sheet metal layers made of a layered material. At least a part of sheet metal layers for honeycomb bodies have a structure forming channels through which a fluid can flow. At least part of the sheet metal layers is formed initially of a layered material with at least one layer of chromium-containing steel and at least one mainly aluminum-containing layer, that are homogenized to a large extent during a subsequent heat treatment. The layered material is provided with at least one additional layer made of brazing material when it is produced by rolling, so that during a subsequent heat treatment at least parts of contact locations between the sheet metal layers are joined by brazing.

Abstract: In a metal material bonding method, an insertion material, which has a lower melting point than that of metal materials to be bonded, is interposed between bonding end surfaces of the metal materials to be bonded. The metal materials to be bonded is heated and held to a temperature not lower than the melting point of the insertion material and not higher than the melting point of the metal materials to be bonded while applying pressure to bonding surfaces of the metal materials to be bonded. The insertion material is formed to have a size which is smaller than each of the bonding surfaces of the metal materials to be bonded.

Abstract: A method of applying a surface coating to a stator vane (1) of a gas turbine, the stator vane (1) comprising a platform (3) with an outer surface (4) connected to the stator of the gas turbine and an airfoil (2) connected to the platform (3), the method comprising the steps of each stator vane (1) is provided as a singlet, a base layer coating (7) affording resistance to oxidation is applied to surfaces of said stator vane (1) and said outer surface (4) of the platform (3) to be exposed to hot gases of the gas turbine, and a top layer coating (8) affording thermal resistance is applied to all coated surfaces of said stator vane (1) and the outer surface (4) of the platform (3), and welding the stator vanes (1) together, wherein a welding filler material (10) is placed between said walls of two adjacent platforms (3) of said stator vane (1), welding said singlets to one another at the margins of walls of said platform (3) to said welding filler material (10).

Abstract: Apparatus and method for assembling solder balls in a selected one of several different patterns for delivery to connector pads on an integrated circuit package, or other receiver, includes a universal template containing holes at locations in an aggregate pattern of all hole locations for the several different patterns, and includes a subtemplate for each individual different pattern that contains posts at locations for insertion from the rear of the template into holes therein at locations where no surface recess is desired. The universal template may remain aligned with an assembly jig or holder of packages while only the subtemplate is changed to change the surface pattern of holes into which solder balls may then be distributed.

Abstract: A method and apparatus for placing and attaching solder balls to a substrate having conductive pads in a predetermined pattern is disclosed. The substrate is placed on a carrier plate. An alignment plate having holes corresponding to the predetermined pattern is mated to the carrier plate with its holes aligned with the predetermine pattern on the substrate. Solder balls are loaded into each hole of the alignment plate. The solder balls may be loaded with a vacuum plate which uses vacuum to pick up solder balls in the predetermined pattern and place them over the holes on the alignment plate. The vacuum is released for dropping the balls in the holes of the alignment plate. Alternatively a shutter plate having holes corresponding to the holes on the alignment plate is fitted on the alignment plate and afforded slidable movement between an offset position and an aligned position. A ball is loaded in each hole in the shutter plate when it is in its offset position.

Abstract: The invention provides for a functionally-graded metal substrate that is made of at least two metal compositions, a functional insert and a surrounding body that surrounds the functional insert. In a preferred embodiment of the invention a functional insert powder composition of loose powder metal is placed in a compact of a surrounding body powder composition and both metal compositions are sintered in a sintering furnace to form a sintered part. The sintered part is infiltrated in part or in whole with a molten metal compound to produce a functionally graded metal substrate having a density of at least 90% of theoretical. A heat-generating component such as a chip can be attached to the metal substrate for use in microelectronic packaging. When the functionally-graded metal substrate has two discrete compositions of copper/tungsten the surrounding body which has a CTE that ranges from about 5.6ppm/.degree. C. to about 7 ppm/.degree. C.

Abstract: A suction head sucks up conductive balls to its suction holes, and mounts them on pads of said workpiece. That is, the suction head is lowered so as to land the conductive balls onto the pads, and then is raised, and a positive pressure is applied in a space defined in the suction head and communicated with the suction holes and thereafter, the positive pressure is released so as to effect the atmospheric pressure in the space. As a result, the conductive balls are smoothly and surely separated from the suction holes and mounted onto the pads of the workpiece. Thereby it is possible to rapidly mount the conductive balls sucked at the lower surface of the suction head onto the pads of the workpiece.

Abstract: An apparatus for use in manufacturing a semiconductor device having input-output (IO) lands arranged in an IO array on an IO face includes a body having a plurality of cavities extending from an operating face into the body; the cavities are arranged in a cavity loci array which is in registeration with the IO lands when the apparatus is in a manufacturing position with the operating face generally adjacent the IO face. Each cavity has a depth and a lateral expanse which cooperate to establish a volume defined by a cavity bottom and at least one cavity wall. The volume accommodates an appropriate amount of solder material to establish a measure of the solder material on a facing IO land when the apparatus is in the manufacturing position.

Abstract: A solder ball arrangement device has a thin arrangement plate having a plurality of through-holes of a truncated pyramid shape, a porous member bonded to the arrangement plate, and a housing member for receiving the arrangement plate and the porous member for defining an air space inside the housing member. A suction pump is provided to evacuate the air space and to receive an array of solder balls in the through-holes by suction. The through-holes are formed by etching, and the porous member reinforces the thin arrangement plate.

Abstract: There is disclosed herein a solder preform for use on printed circuit boards to provide reinforced solder joints thereon. The preform 70 comprises a solder body 72 made of solder, and a thin metallic member 30 attached to the solder body 72. The member 30 may be a metallic screen or foil having holes or perforations 32 therethrough, or may be a non-perforated metallic foil. A method for producing such reinforced solder joints is also disclosed.

Abstract: An apparatus and a method for attaching conductive balls by which the tact time necessary for the positional recognition of a substrate before the conductive balls are attached onto a substrate can be greatly reduced. A first camera and a second camera are moved together a suction head. After the suction head picks up the conductive balls in a conductive ball supply section, the suction head is moved to a position above a flux supply section so that flux can be attached to the conductive balls 10, and concurrently the first camera recognizes a positional recognition mark on a substrate. Then, during when the suction head is moved to a position above the substrate, the second camera recognizes another positional recognition mark on the substrate. In accordance with the positional recognition conducted above, the suction head is positioned accurately with respect to the substrate, and then the conductive balls are attached onto the electrodes on the substrate.

Abstract: A pipe coupling joins together adjacent metal pipe segments. The pipe coupling includes a hollow metal body having first and second open ends adapted for receiving respective proximal ends of the adjacent pipe segments. At least one solder groove is formed along an inside surface of the body. A solder alloy is embedded in the solder groove, and is adapted to flow between the body and the adjacent pipe segments when heated. Upon subsequent cooling, the solder alloy joins the adjacent pipe segments and coupling together.

Abstract: An apparatus for placing an array of solder balls on a substrate includes a carrier plate having an array of holes therethrough. Each hole is capable of holding a solder ball. A ball placement head having an array of pins is aligned with a desired pattern of solder balls held by the carrier plate. The array of pins push the pattern of solder balls through the holes in the carrier plate onto the substrate. The invention is also directed to a solder ball dispenser for dispensing solder balls to a plate having an upper surface with an array of holes formed therein. The solder ball dispenser includes a plate support to support the plate such that the upper surface is tilted at an angle from horizontal, a ball feed device to provide solder balls to the plate, and a solder ball retainer. The solder ball retainer is movable across the upper surface of the plate for controlling a speed at which the solder balls move across the plate.

Abstract: A solder bump forming method includes a step of causing one end surface of a punch inserted into a through hole provided in a die to be retracted by a desired distance from an end surface of the die to thereby provide a recess of a desired volume in the end surface of the die, a step of embedding solder in the recess of the die, a step of moving the punch toward the end surface of the die to thereby extrude the solder, and a step of fusing the solder extruded by the movement of the punch.

Abstract: Disclosed is a solder injection mold apparatus and method for providing solder balls to a printed circuit board substrate using the solder injection mold apparatus in the plastic ball grid array (PBGA). The solder mold through holes are chamfered at entry and at exit ends to assist in receipt of molten solder and the formation and transfer of solder balls to lands on the substrate. A blind recess is provided in the second major surface of the mold, i.e. the side facing the substrate, in order to accommodate electronic components mounted thereon. Solder balls are delivered and metallurgically affixed to the lands in a process that requires only one reflow, leaving the through holes clean of solder and the mold ready for reuse. The material of which the substrate, mold and base plate are comprised is selected to be non-wettable by solder and mutually compatible with respect to CTE when exposed to temperatures of molten solder.

Abstract: An armature for an electric rotating machine has a plurality of outer coil elements and a plurality of inner coil elements. Each of the coil elements has end protrusions extending axially outwardly from an axial side of an armature. The end protrusions facing each other in a radial direction is joined by an arc welding. In one method, the end protrusion of the outer coil element is formed a projection at an axially inside of an axial end of the protrusion. The end protrusions are held spaced apart from each other in the radial direction while contacting only through the projection. The axial ends of the protrusions are welded by swinging the welding arc. In another method, a ring-shaped brazing material is interposed between the end protrusions. The brazing material is melted by the welding arc to weld the end protrusions, while cutting out the brazing material existing between two adjacent pairs of the end protrusions.

Abstract: The invention is to a method for forming solder contact balls (12) for a ball grid array semiconductor device. A solder sheet (15) is formed having solder elements (18) extending out at least one side of the solder sheet (15). The solder sheet is placed over and aligned on a semiconductor package (50) on which solder balls (12) are to be electrically connected to contact areas (51). The solder sheet (15) is aligned with one solder element (18) over each contact area (51). The package (50) and solder sheet (15) is heated to cause the solder elements (18) on the solder sheet (15) to separate and reflow such that the surface tension of the reflowed solder of each solder element (18) forms a solder ball (12) over a contact area (51).

Abstract: An apparatus and a method for transferring solder bumps from a solder mold to a solder-receiving substrate are disclosed. The apparatus includes a transfer fixture constructed by a base member, a lid member and a compressible member for holding a mold/substrate assembly therein. A plurality of compression pins are mounted through the lid member for supplying a uniform pressure on the mold/substrate assembly and for allowing lateral motion of the mold/substrate assembly relative to the transfer fixture due to a mismatch in the coefficients of thermal expansion. The compressible member is a cellulosic foam sheet which applies a uniform joining force across the entire surface of a wafer and assures abutting contact between the entire wafer and the mold surface. The foam sheet further assists in the lateral movement of the mold/substrate assembly relative to the base member of the transfer fixture.

Abstract: In a ball grid array (BGA) station (50) having a robotic arm (60) with a vacuum head (70) containing a predetermined quantity of vacuum apertures (90), a method and apparatus of loading an array of solder balls (14) for solder bumping a carrier (20). Solder balls (14) are supplied into a tub (500) having a head opening (510) for accommodating a vacuum head (70). After the vacuum head (70) is positioned by the robotic arm (60) towards the head opening (510) of the tub (500), suitable fluid pressure (570) is applied to the solder balls (14) within the tub (500) to force the solder balls (14) to float on the gas pressure towards the vacuum apertures (90). The vacuum apertures (90), which are appropriately sized and annularly shaped has at least a partial vacuum (34) applied through the apertures (90) to suck-up a desired quantity of solder balls for eventual placement on the BGA carrier (20).

Abstract: The present invention relates to a method for making an array of metal balls. The method includes the step of generating a first pattern on a metal foil which includes a plurality of foil projections. The method also includes the step of generating a second pattern on a carrier substrate. The second pattern includes a plurality of carrier recesses that are arranged and configured to correspond with the foil projections of the first pattern. The method further includes the steps of placing the metal foil and the carrier substrate together such that the foil projections of the metal foil fit within the carrier recesses of the carrier substrate, and melting the metal foil such that the foil projections form metal balls positioned within the carrier recesses of the carrier substrate. The invention also relates to metal ball arrays constructed via the above method.

Abstract: A method and apparatus are disclosed for placing solder balls 201 on electronic pads 1204 on a substrate 1202, such as for a ball grid array (BGA) applicator 10. The solder balls 201 are held to openings 102 in a foil 22 such as by vacuum force 1607 applied to the solder balls 201 through the openings 102 in a foil 22. After locating the solder balls 201 at electronic pads 1204 on a substrate 1202, by deactivating the vacuum force 1607 and optionally applying a release force 1703 the solder balls 201 are released and placed on the electronic pads 1204. Optionally, a release mechanism 2400 applies placing force 2600 to the solder balls 201 through the openings 2404 in the foil 2403.

Abstract: A method for arranging metallic balls to form an array of bump electrodes comprises the steps of immersing a silicon template in ethanol dropping metallic balls through the ethanol onto the template to receive the metallic balls in the holes of the template. The metallic balls are free from cohesion caused by electrostatic charge or moisture. The template may be inclined in the ethanol. The holes are formed by anisotropic etching a silicon plate.

Abstract: Apertures in a tape formed on a substrate allow straight plating of solder bumps to heights above 4 mils. The solder bumps are combined with a lower density material to form an hourglass-shaped structure which allows interconnections to bonding pads of electronic components with pitches less than 9 mils.

Abstract: A method and apparatus is disclosed for applying solder to a substrate which has a predetermined pattern of receiving pads thereon and forming solder balls from the applied solder. A conveyor is provided having a support member and a continuous metering member. The metering member has openings thereon arranged in the same preselected pattern as the solder receiving pads on the substrate. The substrate is moved into contact with the support member and the metering member, the openings in the metering member being in alignment with the solder receiving pads of the substrate. A container of solder is provided which supplies solder to the openings. The solder may be in liquid form, or in paste form, or in the form of solid solder balls. The applied solder, if in the form of paste or solid balls is melted. Thereafter, the solder is solidified on the pads to form solder balls, and the substrate is discharged from the conveyor with the solidified solder balls thereon.

Abstract: A method and apparatus allow securing of balls to ball grid array electronic components. A component having a surface with rows and columns of electrical contact solder pads is removed from a printed circuit board for rework. Excess solder is removed from the solder pads and the surface is pressed against a stencil having a pattern of holes corresponding to the component contact pad pattern. Each of the holes is filled with a solder ball. The assembly is heated to melt the at least the solder pads. Where lower melting solder balls are used, the pads and balls both melt. Where high melting temperature solder balls are used, only the solder pads melt. The assembly is cooled to solidify melted solder, the stencil is removed, the component is cleaned and is ready for reuse.

Abstract: A method for joining a component to a substrate applies a base solder portion to the substrate and provides a standoff solder portion in the base solder portion. The standoff solder portion has a higher melting temperature than the base solder portion and a height which substantially corresponds to a desired standoff height between the component and the substrate. The component is positioned on the standoff solder portion and the base solder portion is melted under reflow conditions to form a solder joint between the component and the substrate. This joint substantially encapsulates the standoff solder portion, wherein the reflow conditions create a dendritic structure between the base solder portion and the standoff solder portion.

Abstract: A method and device for attaching a module having a ball grid array or column grid array of solder material thereon arranged in a given pattern or footprint to a substrate having an array of connector pads arranged in the same pattern is provided. A preformed alignment device has an array of through holes therein aligned in the same pattern or footprint as the ball grid array or column pattern on the module and the pattern of contact pads on the substrate. The through holes in the preform are filled with a solder material which can be either a solder paste or a solid solder or with a curable conductive adhesive. The solder preferably is a lead-tin eutectic, but in any event has a melting point of less than about 240.degree. C. and in the case of the conduction adhesive, will cure below about 240.degree. C. In the case of solid solder, thin films of flux material can be applied to opposite faces of the preform to prevent the solder from dislodging therefrom and to act as a flux when the solder is reflowed.

Abstract: The invention herein relates to a kind of integrated circuit solder ball implant machine that is mainly comprised of a machine base, a solder ball implant device, a solder ball loading device, an integrated circuit component positioning device and an integrated circuit mold ejection device, the innovations of which includes the utilization of the aforesaid integrated circuit component positioning device that reciprocates leftward and rightward at the lower extent of the solder ball implant device as well as the aforesaid solder ball loading device that is vibrated forward and backward to directly transport the solder balls through the feed holes of the solder ball implant device such that each of the solder balls are reliably, accurately, soundly and expeditiously carried and positioned onto integrated circuit component in the integrated circuit component positioning device.

Abstract: The invention relates to a solder bump for flip-chip assembly and consist of a core containing a high proportion of a soft and electrically well conducting metal, particularly gold, and a diffusion barrier layer deposited on the solder bump core. As is known, the diffusion barrier layer functions to prevent intermetallic compounds between the gold of the solder bump core and the solder material, especially tin-lead solder material, which would otherwise reduce the mechanical stability of the solder connection. A pre-treatment with a cleaning solvent or in a nucleation bath has hitherto been necessary. to provide a good bond between the diffusion barrier layer, usually nickel, and the solder bump core. With the invention, this pretreatment process step is no longer necessary, since small amounts of a material are added to the solder bump core which acts as a nucleation material for the diffusion barrier layer.

Abstract: A conductive ball mounting apparatus and a mounting method for mounting a conductive ball for forming a bump without erroneously mounting an additional conductive ball in a workpiece, comprising a workpiece positioning section, a conductive ball feeding section, a mounting head provided with a plurality of suction holes each of which has a recess capable of storing one conductive ball on the bottom surface of the head, a moving device for moving the mounting head between the workpiece positioning section and the conductive ball feeding section, and a detecting device for detecting conductive balls erroneously additionally attached to the bottom surface of the mounting head without being stored in recesses arranged on the moving route of the mounting head.

Abstract: A process of forming ball bumps for electrical connection to an integrated circuit, the process comprising the steps of: applying a vibration at a small amplitude to a vessel containing small balls of an electroconductive material to cause the small balls to jump up above the vessel; holding and arranging the small balls on an arrangement baseplate by attracting the jumping up small balls to attraction openings provided in the arrangement baseplate in positions corresponding to positions of at least one set of the electrode pads of one semiconductor chip; removing excess small balls adhered either to the arrangement baseplate or to the small balls attracted to the openings; and simultaneously bonding the small balls held and arranged on the arrangement baseplate to bonding spots arranged in positions corresponding to said positions of said at least one set of the electrode pads.