Abstract: Provided is a method and system for auto focusing a workpiece in the Z-axis using a position sensitive focus detector. A focus detection beam is measured using a focus detector, the focus detector having an array of sensors, each sensor of the array of sensors having a sensor identification, the focus detector measuring the focus detection beam projected on a plurality of sensors in the array of sensors, generating a corresponding focus signal for each sensor in the array of sensors. The plurality of focus signals and associated sensor data is used to generate a best focus instruction which is used to move the workpiece to the best focus position on the Z-axis.

Abstract: An aerial image of a measurement mark arranged on a measurement mask is conformed to a center in an X-axis direction of a slit arranged on a Z tilt stage. While illuminating the measurement mark with an illumination light, a slit plate on which the slit is formed is continuously moved in a Z-axis direction, and based on position information of the slit obtained during the movement and a photoelectric conversion signal outputted from an optical sensor that receives the illumination light from the measurement mark via a projection optical system and the slit, a best focus position is detected. Thus, the best focus position of the projection optical system can be measured in a short period of time.

Abstract: A map of the surface of a substrate is generated at a measurement station. The substrate is then moved to where a space between a projection lens and the substrate is filled with a liquid. The substrate is then aligned using, for example, a transmission image sensor and, using the previous mapping, the substrate can be accurately exposed. Thus the mapping does not take place in a liquid environment.

Abstract: An alignment method is provided in which a substrate including first and second layers is aligned in forming a second pattern in the second layer. The method includes storing first alignment measurement data to be used in alignment performed in forming a first pattern and a second alignment mark in the second layer, the first alignment measurement data obtained by measuring a first alignment mark provided in the first layer; obtaining second alignment measurement data by measuring the second alignment mark through a resist applied over the second layer; obtaining third alignment measurement data by measuring the first alignment mark through the resist; and performing alignment of the substrate in accordance with a first difference between the first and second alignment measurement data, or in accordance with the first difference and a second difference between the first and third alignment measurement data.

Abstract: An imprint apparatus, comprising a first holder for holding a mold having an imprint pattern; a second holder for holding a workpiece to which the imprint pattern is transferred; a first illumination system for irradiating a mark for determining a position of the mold and a mark for determining a position of the workpiece with light; a first and second optical systems for imaging the marks for the mold and workpiece at a first and second observation points respectively; an imaging optical system; a first and second image pick-up devices for observing the marks for the mold and workpiece respectively; and at least one of a first drive mechanism for moving the first image pick-up device while following movement of the first observation point and a second drive mechanism for moving the second image pick-up device while following movement of the second observation point.

Abstract: A level detection apparatus includes an illumination slit in which a rectangular first opening which causes illumination light to pass is formed, an optical system configured to illuminate a target object surface by illumination light passing through the illumination slit and focuses reflected light from the target object surface, first and second detection slits which are arranged in front of and in back of a focal point and in each of which a second opening is formed such that a short side of a rectangle is shorter than a short side of a illumination slit image formed by the illumination slit and a long side of the rectangle is larger than a long side of the illumination slit image, first and second light amount sensors configured to detect amounts of light of the reflected lights passing through the first and second detection slits, and a calculating unit configured to calculate a level of the target object surface based on outputs from the first and second light amount sensors.

Abstract: An inspection system includes: a facility that uses wide-band illumination light having different wavelengths and single-wavelength light to perform dark-field illumination on an object of inspection, which has the surface thereof coated with a transparent film, in a plurality of illuminating directions at a plurality of illuminating angles; a facility that detects light reflected or scattered from repetitive patterns and light reflected or scattered from non-repetitive patterns with the wavelengths thereof separated from each other; a facility that efficiently detects light reflected or scattered from a foreign matter or defect in the repetitive patterns or non-repetitive patterns or a foreign matter or defect on the surface of the transparent film; and a facility that removes light, which is diffracted by the repetitive patterns, from a diffracted light image of actual patterns or design data representing patterns. Consequently, a more microscopic defect can be detected stably.

Abstract: A map of the surface of a substrate is generated at a measurement station. The substrate is then moved to where a space between a projection lens and the substrate is filled with a liquid. The substrate is then aligned using, for example, a transmission image sensor and, using the previous mapping, the substrate can be accurately exposed. Thus the mapping does not take place in a liquid environment.

Abstract: A position detection method of detecting a position of a detection mark. The method includes a matching step of calculating a value of a correlation using a template for an image including the detection mark, a change step of changing the template to be used for the correlation, a repeat step of, when a value of a correlation in the matching step is not more than a predetermined value, changing the matching processing while changing the template in the change step, and a step of performing position detection on the basis of a result of correlation in the matching step or the repeat step.

Abstract: Methods and systems for evaluating and controlling a lithography process are provided. For example, a method for reducing within wafer variation of a critical metric of a lithography process may include measuring at least one property of a resist disposed upon a wafer during the lithography process. A critical metric of a lithography process may include, but may not be limited to, a critical dimension of a feature formed during the lithography process. The method may also include altering at least one parameter of a process module configured to perform a step of the lithography process to reduce within wafer variation of the critical metric. The parameter of the process module may be altered in response to at least the one measured property of the resist.

Abstract: An optical image is formed in a radiation-sensitive layer (5), by a number of sub-illuminations, in each of which an array of light valves (21-25) and a corresponding array (40) of converging elements (43) are used to form a pattern of spots in the resist layer (5) in accordance with a sub-image pattern. Between the sub-illuminations, the resist layer (5) is displaced relative to the arrays (21-25, 40). The lens array (40) may be tilted with respect to the scan area, such that each resist layer area is scanned by a number of spots. In addition, some spot overlap also occurs in a direction perpendicular to the scan direction. This spot redundancy is utilised by selectively reducing the intensity, or switching off, one or more of the redundant spots so as to alter the position of an edge of a device feature, i.e. “fine tune” it.

Abstract: To calibrate a lithographic apparatus having a programmable patterning means, a sensor, such as a CCD, CMOS sensor or photo-diode array, having detector elements larger than the size of a spot corresponding to a single pixel of the programmable patterning means is used. Pixels are selectively activated singly or in groups.

Abstract: A sensor for use at substrate level in a high numerical aperature lithographic apparatus, the sensor having a transparent plate that covers a sensing element and includes elements that improve coupling of radiation into the sensing element. The elements include Fresnel lenses, holographic optical elements, inverted Winston Cones, spherical lenses and surface roughening.

Abstract: A wafer may be aligned with an imaging plate including an alignment grating with a pitch P. A pupil filter in the pupil plane of the optical system may be used so that the periodicity of the intensity of light from the alignment grating is less than P at the wafer plane. Thus, an alignment pattern on the wafer having a pitch smaller than the pitch of the alignment grating may be used. For example, the intensity periodicity at the wafer plane may be P/2. In an implementation, a pupil filter may be sized and positioned to block a zero-th order maximum of light transmitted through the alignment grating at the pupil plane. The pupil filter may be sized and positioned to allow first order maxima of the light to pass. The alignment system may be used with transmission or reflection optics.

Abstract: An alignment system for a lithographic apparatus has a source of alignment radiation; a detection system that has a first detector channel and a second detector channel; and a position determining unit in communication with the detection system. The position determining unit is constructed to process information from said first and second detector channels in a combination to determine a position of an alignment mark on a work piece, the combination taking into account a manufacturing process of the work piece. A lithographic apparatus has the above mentioned alignment system. Methods of alignment and manufacturing devices with a lithographic apparatus use the above alignment system and lithographic apparatus, respectively.

Abstract: An imaging optical system for imaging a pattern of an object plane onto an image plane includes a first imaging optical system for imaging at a first imaging position, the first imaging optical system having a magnification ? in a vacuum atmosphere, and a second imaging optical system for imaging at a second imaging position, the second imaging optical system having a magnification ? in the vacuum atmosphere, wherein when an environment in which the imaging optical system is placed changes from the vacuum atmosphere to an air atmosphere or vise versa, a direction of the first imaging position that moves along an optical axis is opposite to a direction of the second imaging position that moves along the optical axis.

Abstract: A method of helping to prevent liquid reaching under a substrate is disclosed that includes introducing a gas at a bottom edge of the substrate so that a buffer is created at the edge of the substrate, helping to keep immersion liquid that is present at the top and edge of the substrate away from the bottom surface of the substrate.

Abstract: Spectral, densitometric, or color measured values are detected on sheet printing materials during the printing process in a sheet-fed printing press. The measured values are determined on sheets as they are moving through the printing press and the measured values are used in real-time by a computer to control parameters for controlling the printing process in the sheet-fed printing press.

Abstract: An exposure apparatus generates an interlock signal to stop an exposure process when defocus is detected in real time. Leveling data for at least one wafer, and a predetermined threshold value are stored in a memory of the exposure apparatus. A value indicative of the defocus is calculated from the leveling data. An interlock signal is generated if the result of comparing the defocus value and the threshold value reveals that the focus of a lens of the exposure apparatus is outside an acceptable range.

Abstract: Disclosed is a method of measuring aberration of a projection optical system, that includes an illuminating step for illuminating a reticle by use of light from a light source and through an illumination optical system, a projecting step for projecting an image of a test pattern formed on the reticle, upon a substrate through the projection optical system, a measuring step for measuring a positional deviation amount of the image of the test pattern, and a determining step for determining the aberration of the projection optical system on the basis of the positional deviation amount measured at the measuring step, wherein the projecting step includes a shaping step for shaping the light by use of shaping means disposed in one of the illumination optical system and the projection optical system and a light blocking pattern formed on a surface of the reticle, remote from a surface of the reticle where the test pattern is formed, so that the light passes only through a predetermined region of a pupil of the proje

Abstract: A lithographic apparatus and method, in an embodiment for immersion lithography, are disclosed with a single stage in which levelling and exposure are performed simultaneously.

Abstract: A system and method include an object supported on a moveable support, an optical system that transmits radiation onto the object, a support having an aperture therethrough, a sensor system coupled to the support, and a control system coupled to the sensor system and the moveable support. The sensor system is arranged with respect to the aperture to measure a surface of the object and send measurement signals to the control system, such that the control system generates control signals received and used by the moveable support to ensure that the surface of the object receiving light transmitted by the optical system through the aperture is in a focus plane of the optical system.

Abstract: Disclosed herein is a beam processing machine comprising laser beam application device for applying a laser beam to a workpiece, which device includes a laser beam oscillator and a condenser for converging a laser beam to apply the converged laser beam. The condenser includes a first prism for splitting the laser beam oscillated from the laser beam oscillator into a first laser beam and a second laser beam both having a semicircular section and interchanging the first laser beam with the second laser beam, a second prism for correcting the optical paths of the first laser beam and the second laser beam split by the first prism to become parallel to each other, and an image forming lens for focusing the first laser beam and the second laser beam whose optical paths have been corrected by the second prism to become parallel to each other into spots having linear portions on the outer side and arcuate portions on the inner side.

Abstract: An immersion lithographic projection apparatus is disclosed in which a liquid removal system surrounds a liquid supply system which provides liquid to a space between a projection system and a substrate. The liquid removal system is moveable relative to the liquid supply system and is controlled to have substantially zero velocity relative to the moving substrate table. The gap between the liquid supply system and the liquid removal system may be covered and the atmosphere between the liquid supply system and the liquid removal system above the substrate table may be maintained such that the vapor pressure of liquid is relatively high.

Abstract: An alignment system for a lithographic apparatus has a source of alignment radiation; a detection system that has a first detector channel and a second detector channel; and a position determining unit in communication with the detection system. The position determining unit is constructed to process information from said first and second detector channels in a combination to determine a position of an alignment mark on a work piece, the combination taking into account a manufacturing process of the work piece. A lithographic apparatus has the above mentioned alignment system. Methods of alignment and manufacturing devices with a lithographic apparatus use the above alignment system and lithographic apparatus, respectively.

Abstract: Focal plane errors across the field of an array of focusing elements are reduced by using a non-planar correction surface, shaped such that focal points of the focusing elements lie closer to a single plane than they would if the correction surface were planar. For example, this can be used when an array of focusing elements is used in a projection system of a lithography system.

Abstract: An alignment system for a lithographic apparatus has a source of alignment radiation; a detection system that has a first detector channel and a second detector channel; and a position determining unit in communication with the detection system. The position determining unit is constructed to process information from said first and second detector channels in a combination to determine a position of an alignment mark on a work piece, the combination taking into account a manufacturing process of the work piece. A lithographic apparatus has the above mentioned alignment system. Methods of alignment and manufacturing devices with a lithographic apparatus use the above alignment system and lithographic apparatus, respectively.

Abstract: A dose transfer standard detector measures radiation intensity and dose in a lithography tool. The lithography tool may be an Extreme Ultraviolet lithography (EUVL) tool. The dose transfer standard detector may transmit intensity and dose data to a computer, which analyzes the data. Based on the analyzed data, the lithography tool may be calibrated.

Abstract: A tightly adhering state between an elastically deformable first substrate deformed and made to tightly adhere to an elastically undeformable second substrate is detected by way of displacement of the light receiving position of a light receiving section adapted to receive light emitted from a light source for the first substrate and reflected by the first substrate.

Abstract: A method and system position a laser beam spot relative to a semiconductor substrate having structures on or within the semiconductor substrate to be selectively processed by delivering a processing laser beam to a processing laser beam spot. The method generates a metrology laser beam and propagates the metrology laser beam along a propagation path to a metrology laser beam spot on or near a structure to be selectively processed. The method detects a reflection of the metrology laser beam from the structure, thereby generating a reflection signal, and determining, based on the reflection signal, a position of the metrology laser beam spot relative to the structure.

Abstract: An exposure apparatus includes an illumination optical system to illuminate an original with exposure light of plural wavelengths, a projection optical system to project an image of a pattern of the original onto a substrate, an original-side reference pattern provided at an original side of the projection optical system, a substrate-side reference pattern provided at a substrate side of the projection optical system, and an image plane detecting system configured so that the original-side reference pattern is illuminated with the exposure light or light equivalent to the exposure light with respect to a wavelength component rate.

Abstract: A lithographic apparatus includes a projection system including a movable optical element. The movable optical element is capable, by a displacement thereof to influence a position quantity of a radiation beam projected by the projection system. A control device is provided to drive the optical element actuator to influence a position quantity of the movable optical element, thereby influencing a position quantity of the radiation beam as projected by the projection system. The control device is adapted to move the movable optical element to position the radiation beam as projected by the projection system with respect to the substrate, or to correct a position quantity of the radiation beam as projected by the projection system caused by any type of disturbance on the projection system.

Abstract: An object pattern is imaged by an imaging system onto the image plane of the imaging system at a location where a reference pattern suited to the object pattern is situated in order to measure the imaging fidelity of an optical imaging system, for example, an eyeglass lens, a photographic lens, or a projection lens, for use in the visible spectral range. The resultant, two-dimensional, superposition pattern is detected in a spatially resolved manner in order to determine imaging parameters therefrom. The object pattern is generated with the aid of at least one electronically controllable pattern generator that serves as a self-luminous, electronically configurable, incoherent light source and may, for example, have a color monitor. The measuring system allows rapidly, flexibly, checking optical imaging systems with minimal time and effort spent on the mechanical setup required.

Abstract: An apparatus includes a chamber, an electro-mechanical driver, a window, and a mechanical cantilever. The chamber has an interior in which the mechanical cantilever is located. The mechanical cantilever has a first end that is attached to the electro-mechanical driver and has second end that is free. The driver is configured to drive the mechanical cantilever to perform an oscillatory motion. The window is located along a wall of the chamber to enable external light to enter the chamber and illuminate a portion of the mechanical cantilever. The mechanical cantilever is configured to mechanically respond to being illuminated by the external light entering the chamber via the window.

Abstract: Alignment of layers during manufacture of a multi-layer sample is controlled by applying optical measurements to a measurement site in the sample. The measurement site includes two diffractive structures located one above the other in two different layers, respectively. The optical measurements include at least two measurements with different polarization states of incident light, each measurement including illuminating the measurement site so as to illuminate one of the diffractive structures through the other. The diffraction properties of the measurement site are indicative of a lateral shift between the diffractive structures. The diffraction properties detected are analyzed for the different polarization states of the incident light to determine an existing lateral shift between the layers.

Abstract: Various methods and systems measure, determine, or align a position of a laser beam spot relative to a semiconductor substrate having structures on or within the semiconductor substrate to be selectively processed by delivering a processing laser beam to a processing laser beam spot. A metrology laser beam spot is directed to one or more of those structures to be selectively processed (e.g., laser-severable conductive links), and reflections of the metrology laser beam off of those structures to be selectively processed are detected to perform the measurement, determination, or alignment. The processing laser beam can then be accurately directed onto those structures to process them on a selective basis. The various methods and systems thus utilize those structures themselves—rather than relying exclusively on dedicated alignment markers—to perform the measurement, determination, or alignment.

Abstract: A lithographic apparatus includes an illumination system configured to condition a radiation beam. The illumination system includes a pulsed source of radiation and a controller to control an output of the pulsed source of radiation. The controller includes a dose sensor to measure a dose of a pulse of the source of radiation. The dose sensor includes a dose sensor output to provide a dose signal representative of the measured dose. An integrator unit is connected to the dose sensor output. The integrator unit integrates the dose signal at least twice, an output of the integrator unit provides an integrator output signal including the at least twice integrated dose signal. The output of the integrator unit drives a driving input of the source of radiation with the integrator output signal.

Abstract: A method and apparatus for use with a web of material having a web length dimension and a web surface, the method for placing mark sequences on the web surface every X distance along the web length dimension identifying location along the web length dimension, the method comprising the steps of monitoring web location, every X distance, placing a sequence of N marks on the web surface along the web length wherein each two adjacent marks define a space length dimension and wherein the pattern of space length dimensions formed by the N marks in the sequence together specify a specific web length location. The invention also includes a marking and defect locating system including a high speed printer and a high resolution, high speed camera to facilitate the methods.

Abstract: An exposure apparatus for aligning a substrate and performing exposure using the aligned substrate. The apparatus includes a first alignment system, having a first stage and a first image sensing unit, to detect a position of a first mark on the substrate on the first stage using the first image sensing unit, a transfer system to transfer the substrate, on which the position of the first mark has been detected by the first alignment system, from the first stage onto a second stage, and a second alignment system, having the second stage and a second image sensing unit of which magnification is higher than that of the first image sensing unit, to detect a position of a second mark on the substrate on the second stage using the second image sensing unit, and to align the substrate based on the detection obtained by using the second image sensing unit.

Abstract: A method for optimizing an alignment condition of a lithographic projection apparatus. This method comprises projecting a beam of radiation on a target portion of a substrate and measuring a plurality of diffracted signals emitted by the target portion. This method further comprises calculating a variance for each of the plurality of diffracted signals, such that a plurality of variances of the diffracted signals is determined, and adjusting the alignment condition of the lithographic projection apparatus based on analysis of the plurality of variances.

Abstract: A measuring apparatus for measuring optical performance of a target optical system to be measured includes an optical unit for splitting light from a light source into measuring light and reference light so that the measuring light can be introduced into the target optical system, a reflection unit for reflecting the measuring light from the target optical system toward the target optical system via a fluid, and a detector for detecting an interference fringe generated between interference between the measuring light that has emitted from the target optical system after being reflected by the reflection unit and the reference light that does not pass the target optical system.

Abstract: A projection system comprises an array of lenses MLA, each lens transmitting a unique part of a patterned beam. Measuring devices measure a distance between the array of lenses MLA and a substrate W. A controller controls an actuator to adjust a position (e.g., height and/or tilt) of the microlens array MLA.

Abstract: Techniques for determining wafer stage grid and yaw in a projection imaging tool are described. The techniques include exposing an overlay reticle onto a substrate having a recording media, thereby creating a plurality of printed fields on the substrate. The overlay reticle is then positioned such that when the reticle is exposed again completed alignment attributes are created in at least two sites in a first and a second printed field. The substrate is then rotated relative to the reticle by a desired amount. The overlay reticle is then positioned such that when the reticle is again exposed, completed alignment attributes are created in at least two sites in the first and a third printed field. Measurements of the complementary alignment attribute and a dynamic intra-field lens distortion are then used to reconstruct wafer stage grid and yaw error of the projection imaging system.

Abstract: Apparatus for sensing information regarding a surface including a first plurality of optical elements arranged to acquire two dimensional information about a surface, a second plurality of optical elements arranged to acquire topographical information about the surface, wherein the first plurality and the second plurality of optical elements are arranged to simultaneously provide the two dimensional information and the topographical information to at least partially non-overlapping portions of a single sensor array.

Abstract: An apparatus and method measures the gap between one substantially planar object, such as a mask, and a second planar object, such as a substrate. A gapping mark is used for measuring a gap between the first and second plates. The gapping mark includes a first grating on a first surface of a first plate, the first grating having a first uniform period in a first direction. A second grating is located on the first surface of the first plate, the second grating being adjacent to the first grating in the first direction, the second grating having a second uniform period in the first direction. The gapping mark also includes a third grating on the first surface of the first plate, the third grating being adjacent to the first grating in a second direction, the second direction being substantially orthogonal to the first direction, the third grating having the second uniform period in the first direction.

Abstract: A position detection apparatus for detecting a position of an object to be observed, including a position detection system, and an evaluation unit for measuring by the position detection system each of mark spacings between a plurality of alignment marks arranged on the object to be observed and evaluating measurement performance of the position detection system on the basis of mark spacing information obtained as the measurement result.

Abstract: The invention relates to a lithographic apparatus, a device manufacturing method and a device thus manufactured. The lithographic apparatus is of the scanning type, in which a target portion of a substrate is scanned through a patterned radiation beam. Inhomogeneities in the radiation beam may become visible in the form of stripes on the substrate. By imparting an additional movement to the substrate table and optionally to the patterning device of the apparatus, during scanning, in a direction at an angle with the scanning movement, such inhomogeneities are smeared out, and the overall homogeneity of the illumination may be improved.

Abstract: A method of generating masks for printing a pattern including a plurality of features having varying critical dimensions. The method includes the steps of: (1) obtaining data representing the pattern; (2) defining a plurality of distinct zones based on the critical dimensions of the plurality of features; (3) categorizing each of the features into one of the plurality of distinct zones; and (4) modifying the mask pattern for each feature categorized into a predefined distinct zone of the plurality of distinct zones.

Abstract: When irradiating a sample with light from a light source through an object lens, discretely changing a relative position between a beam condensing position of the object lens and the sample in an optical axis direction of the converging beam, obtaining light intensity information from the sample at each relative position, extracting plural pieces of light intensity information from a light intensity information group, estimating a maximum value on a change curve adaptive to the plural pieces of extracted light intensity information and the relative position for the maximum value, and obtaining the estimated maximum value of the light intensity information and relative position as brightness information and height information, these information about the sample can be continuously obtained by discretely performing an iterative operation on the relative position between a beam condensing position of the object lens and the sample in an optical axis direction of the converging beam.

Abstract: A map of the surface of a substrate is generated at a measurement station. The substrate is then moved to where a space between a projection lens and the substrate is filled with a liquid. The substrate is then aligned using, for example, a transmission image sensor and, using the previous mapping, the substrate can be accurately exposed. Thus the mapping does not take place in a liquid environment.