Abstract: An optical element is placed in the alignment beam during alignment. The optical element serves to focus the alignment beam onto the substrate alignment mark when it is at a different focal length from the front surface of the substrate.

Abstract: An apparatus for determining positions of a plurality of regions formed on a substrate based on positions of a plurality of sample regions sampled from the plurality of regions. The apparatus includes a processor configured to control operation of a stage and an alignment optical system so as to obtain positions of the plurality of the sample regions sampled from the plurality of regions, to calculate a first conversion parameter and a second conversion parameter for converting designed positions of the plurality of regions into first and second determined positions of the plurality of regions based on at least designed positions of the plurality of the sample regions and positions of the plurality of the sample regions measured by the alignment optical system, and to determine whether to finish the position determinations based on a difference between the first conversion parameter and the second conversion parameter.

Abstract: A scanning module capable of finely tuning the optical length comprises a lamp tube, a base, a photosensitive substrate, and an adjustment unit. The lamp tube provides a required light source for a document to be scanned. The base has a reflective mirror set and a camera lens. The reflective mirror set is used to receive light from the document, and transmits the light to the camera lens for focusing. The photosensitive substrate is used to convert light outputted by the camera lens into electronic signals. The adjustment unit is used to adjust the optical length between the base and the photosensitive substrate. The total optical length can thus be adjusted to correct the inaccuracy of magnification. Or the distance between the camera lens and the photosensitive substrate can be adjusted to align the focal length within the allowable inaccuracy of magnification to achieve an output image of better quality.

Abstract: To calibrate a lithographic apparatus having a programmable patterning means, a sensor, such as a CCD, CMOS sensor or photo-diode array, having detector elements larger than the size of a spot corresponding to a single pixel of the programmable patterning means is used. Pixels are selectively activated singly or in groups.

Abstract: An alignment apparatus for aligning a reflective reticle includes a light source for emitting alignment light, an optical alignment mark provided on the reticle, and a reference mark provided on a reticle stage that holds the reticle. A detecting unit detects the alignment light reflected from the alignment mark and the reference mark, and the reticle is aligned on the basis of the result of detection by the detection unit.

Abstract: In a purge gas system for a lithographic apparatus, a rate of flow of purge gas to the system is reduced substantially once a contamination level has fallen below a threshold level. The control may be on the basis of a detected level of contamination or on the basis of a timetable.

Abstract: A method of determining relative position between a reflective reticle and a substrate includes a detection step of detecting relative position between a transmissive reference mark on a reticle stage and a substrate alignment mark on a substrate stage through a reflective optical system which projects a pattern of the reflective reticle onto the substrate with extreme ultraviolet light, and a determination step of determining relative position between the reflective reticle and the substrate based on the detection result in the detection step.

Abstract: An exposure apparatus for exposing a substrate moving in a scan direction to light directed via an original. The apparatus includes a projection optical system configured to image a pattern of the original on the substrate, a substrate stage configured to hold the substrate and to move, and a detector configured to detect a surface position of the substrate, held and moved in the scan direction at a scan speed by the substrate stage, in a direction parallel to an optical axis of the projection optical system over a detection region preset on the substrate.

Abstract: A substrate alignment apparatus which aligns and fixes a substrate on a substrate stage includes a chucking pad fixed on the substrate stage to chuck and fix the substrate, a moving unit which moves the substrate with respect to the substrate stage such that a mark on the substrate stage and a mark on the substrate coincide with each other, and a determination unit which evaluates and controls a relative position between the chucking pad and the substrate after movement by the moving unit and determines whether the chucking pad can normally chuck the substrate.

Abstract: A catoptric projection optical system for projecting a reduced size of a pattern on an object surface onto an image surface includes eight mirrors and forms an intermediate image between the sixth mirror and the seventh mirror on an optical path, wherein a position in a height direction of a principal ray from an optical axis at each mirror displaces, and a displacement direction from the first mirror to the fourth mirror is reverse to that from the fifth mirror to the eight mirror, wherein the second mirror to the fifth mirror are a concave mirror, a convex mirror, a concave mirror and a concave mirror, and the seventh mirror to the eighth are a convex mirror and a concave mirror, and wherein the second mirror of the eight mirrors is located closest to the object surface side.

Abstract: A method of manufacturing an electronic device includes providing a mask substrate, a first substrate on which an object to be transferred is formed, and a second substrate to which the object is to be transferred, adjusting positions of the mask substrate, the first substrate and the second substrate so that an alignment mark formed on one of the substrates (a reference substrate) and alignment marks formed on other two of the substrates are aligned with each other, and transferring the object to be transferred from the first substrate to the second substrate, the transferring step including irradiating the object to be transferred from the first substrate with light transmitted through the mask substrate.

Abstract: A lithographic projection apparatus includes a passive magnetic bearing configured to provide support between a first and second part of the lithographic apparatus and allow both parts to be displaced relative to each other in a direction perpendicular to the support direction. The passive magnetic bearing includes first and second magnetic assemblies. Each magnetic assembly includes at least one permanent magnet.

Abstract: Alignment of layers during manufacture of a multi-layer sample is controlled by applying optical measurements to a measurement site in the sample. The measurement site includes two diffractive structures located one above the other in two different layers, respectively. The optical measurements comprise at least two measurements with different polarization states of incident light, each measurement including illuminating eh measurement site so as to illuminate one of the diffractive structures through the other. The diffraction properties of the measurement site are indicative of a lateral shift between eth diffractive structures. The diffraction properties detected are analyzed for the different polarization states of the incident light to determine an existing lateral shift between the layers.

Abstract: A lithographic apparatus includes an illumination system configured to provide a beam of radiation, a first support structure configured to support a patterning device, a second support that includes a substrate holder for holding a substrate, a projection system configured to project the patterned beam of radiation onto the substrate, and a servo unit configured to position the substrate holder. The apparatus further includes a sensor unit configured to determine a distance of at least one location point on the surface of the substrate relative to a reference plane, a memory unit configured to store surface information of the substrate based on respective distances of corresponding location points on the substrate surface, and a calculating unit configured to determine a feed-forward set-point signal based on the stored surface information, such that the feed-forward set-point signal is forwardly fed to the servo unit in order to position the substrate holder.

Abstract: A method of device inspection, the method comprising providing an asymmetric marker on a device to be inspected, the form of asymmetry of the marker being dependent upon the parameter to be inspected, directing light at the marker, obtaining a first measurement of the position of the marker via detection of diffracted light of a particular wavelength or diffraction angle, obtaining a second measurement of the position of the marker via detection of diffracted light of a different wavelength or diffraction angle, and comparing the first and second measured positions to determine a shift indicative of the degree of asymmetry of the marker.

Abstract: An assembly according to an embodiment of the invention includes a sensor for determining at least one of tilt and height of a surface of a substrate in a lithographic apparatus. The substrate is moveable along at least one path substantially parallel to the surface of the substrate with respect to the sensor. The lithographic apparatus has an exposure scanning direction and the assembly is arranged to move the substrate relative to the sensor along the at least one path and to provide measurement data about the at least one of tilt and height along the at least one path. The assembly includes a memory configured to store the measurement data for use during a later exposure of the substrate by the lithographic apparatus. The at least one path of the substrate is at least partly at an angle to the exposure scanning direction.

Abstract: Attempting to provide an illumination optical system and an exposure apparatus using the same, which provide a more uniform angular distribution of light for illuminating a mask than the prior art, an illumination optical system for illuminating an object surface includes an optical unit that converts light from a light source section into approximately parallel light, and includes first and second mirrors, wherein the first mirror has an opening, through which light reflected by the second mirror passes.

Abstract: An exposure apparatus and method in which a mark on an object is illuminated, and plural pairs of two diffractive beams of same order are generated and directed to different reference gratings to detect positional information of the mark. Beams received from the different reference gratings have different order.

Abstract: A light beam emitted from a light source passes through a spatial light modulation device, at which a plurality of unit elements for respectively modulating incident light beam are two-dimensionally arrayed, and a microlens array, at which a plurality of microlenses corresponding to the unit elements are arrayed, and is focused on an exposure surface. A four-part detector, which is structured by four diodes, is disposed on the exposure surface so as to correspond to four pixels which are present at one corner of the exposure area. Relative mispositioning between the spatial light modulation device and the microlens array generates a difference in respective detection signals of the four diodes. Thus, an offset between the spatial light modulation device and the microlenses can be detected. Positional adjustment of the microlens array is performed on the basis of a detected offset amount.

Abstract: A cooling apparatus arranged in a vacuum or reduced pressure atmosphere for use with an optical element having an illuminated area onto which light is irradiated concave part includes a temperature variation mechanism that changes a temperature of part of the cooling apparatus in a non-contact manner.

Abstract: A reticle includes a first mask portion including a first opaque portion, first and second exposure monitor patterns provided within first and second window portions in the first opaque portion, increasing transmittances in a first direction and a direction reverse to the first direction, respectively; and a second mask potion including a second opaque portion, third and fourth exposure monitor patterns provided within third and fourth window portions in the second opaque portion in positions corresponding to the first opaque portion upon alignment with the first mask portion, increasing transmittances in the first direction and the reverse direction, respectively.

Abstract: A system and method is used to pattern a substrate. A projection beam received from a radiation system is patterned using an array of individually controllable elements. A portion of the projection beam is directed directly onto one of the individually controllable elements and collecting radiation reflected therefrom using each one of a first array of focusing elements. An image of the first array of focusing elements is projected onto a second array of focusing elements using a projection system, such that radiation reflected from one of the individually controllable elements is projected via one of the focusing elements in the first array of focusing elements and the projection system to one of the focusing elements in the second array which focuses the radiation onto a spot on the substrate.

Abstract: An exposure apparatus which exposes substrates to a pattern on a master. The apparatus includes first, second and third chucks which hold the substrates, a first fine adjustment stage which holds the first chuck to perform fine driving, a second fine adjustment stage which holds the second chuck to perform fine driving, a coarse adjustment stage on which the first and second fine adjustment stages are mounted and which can move in an X-Y plane substantially perpendicular to an optical axis, an exposure unit which performs exposure operation for the substrate held by the first chuck, a measurement unit which performs measurement operation for the substrate held by the second chuck, and a controller which drives the coarse adjustment stage and causes the measurement and exposure units to perform the measurement and exposure operations, respectively.

Abstract: When actual measurement data of a wavefront aberration of a projection optical system is input, a main controller calculates a targeted image forming characteristic of the projection optical system based on the data and a Zernike sensitivity table of the image forming characteristic that is made prior to the input. By using the Zernike sensitivity table, the targeted image forming characteristic can be calculated with only one measurement of wavefront aberration. Moreover, parameters that denote a relation between an adjustment of an adjustable specific optical element and a change in the image forming characteristics of the projection optical system is obtained in advance, and are stored in advance in a storage unit.

Abstract: A lithographic projection apparatus for successively projecting a pattern on wafers by preliminarily determining locations of surface points of each wafer before it is illuminated in a projection station has a pair of measuring stations arranged oppositely with respect to the projection station at the center. Each measuring station has a wafer surface sensor for determining the locations of surface points of the wafer carried on a stage and a stage height sensor for measuring the height of a reference plane on the stage. A wafer on a stage is placed in one of the measuring stations to have measurements taken and ideal height data are collected while another wafer is being illuminated in the projection station. After these measurement and illumination processes are completed, the illuminated wafer is removed from the projection station and replaced with a new wafer to be measured and illuminated.

Abstract: A management system including an acquisition device for acquiring actual processing results obtained by operating an industrial device with a set parameter value and another parameter value, and an estimated processing result, an inspection device for inspecting the processing result obtained with the set parameter value, and acquiring and accumulating an inspection result value, a change device for changing the set parameter value on the basis of the processing results acquired by the acquisition device and the inspection result value obtained by the inspection device, an evaluation device for evaluating a variation state of the processing results on the basis of an inspection result value accumulated by the inspection device, and a decision device for deciding, on the basis of an evaluation result by the evaluation device, a frequency at which the acquisition device is executed.

Abstract: The present invention provides for a method for adjusting an alignment microscope. In the method of the present invention an alignment mask is used in which the one side comprises at least one alignment mark and the other side is reflective. For the adjustment, the microscope is first focused to the alignment mark and then refocused to the mirror image of the alignment mark generated by the reflective side. The microscope is then adjusted by comparing the positions of the alignment mark and the generated mirror image of the alignment mark until the alignment mark overlaps its mirror image. Moreover, a device for adjusting an alignment microscope in accordance with the method of the present invention.

Abstract: In an exposure apparatus and method, an object is exposed through a projection optical system with an exposure beam irradiated on a mask. An illumination system illuminates a mark on the object and a detecting system detects the illuminated mark. Various illumination and exposure wavelengths are used. The mark is moved relative to illumination beams to enable determining positional information of the mark.

Abstract: An exposure apparatus able to maintain reflectances of mirrors and transmittances of lenses and to maintain initial performance over a long period by using exposure light of a wavelength of the vacuum ultraviolet region to illuminate a mask and transfer images of patterns on the mask to a substrate, provided with a gas feed unit for supplying a light path space through which the exposure light passes with a gas mainly comprised of an inert gas or rare gas and introducing a predetermined concentration of hydrogen into the gas fed to at least part of the light path space.

Abstract: In an exposure device 100 having a vertically movable stage device 120, and which performs exposure by projecting a pattern recorded on a hologram mask 130 onto a substrate to be exposed 110 on which is formed a photosensitive material film 112 and which is placed on the above stage device, a film thickness measurement mechanism 160, 162 measures the thickness of the photosensitive material film 112, and based on the measured film thickness a light amount control mechanism 162 controls the amount of exposure light from the exposure light source 140. An appopriate amount of light is set according to the film thickness, so that an accurate pattern can be formed in a single exposure pass.

Abstract: A test cell for use in a semiconductor manufacturing operation allowing alignment of semiconductor devices to be tested to a test station. The test cell is well suited for testing semiconductor devices on carrier strips. To aid in alignment, the test cell includes a down-ward looking camera and a simple upward looking sensor. Fiducials are acurately positioned relative to the test site, which are easily detected by the simple sensor. A controller within the test cell uses the output of the camera and the sensor, in conjunction with position sensors on a robotic assembly, to determine relative positions of the devices to be tested and the test station and issue the appropriate commands to align the devices to the test station.

Abstract: A virtual gauging method for use in a lithographic process includes gauging a region at a surface of a wafer when the region is located away from an axis of illumination producing wafer surface data, while other portions of the wafer are being illuminated. The method also includes acquiring time-domain measurements representing the wafer surface data and converting the time-domain measurements into space-domain measurements. This conversion can be done using a finite-impulse-response (FIR) filter. The FIR filter can be triggered with a spatial interrupt, and a width of the FIR filter is modified in response to a velocity of travel of the wafer. The method further includes converting space-domain measurements into wafer correction data.

Abstract: A system and method are used for pulse to pulse dose control in an illumination system, used, for example, in a lithography or a maskless lithography machine. The system and method can be used to decrease effective laser pulse-to-pulse variability in lithographic lasers, allowing adequate dose control using a minimum number of pulses (e.g. as little as one pulse).

Abstract: While the alignment beam is focused on a mark on the substrate table, the substrate table is moved substantially perpendicularly to the alignment beam. If the image of the mark moves relative to a reference mark, then the substrate and the alignment beam are not perpendicular. The mark on the substrate table is aligned to a plurality of reference marks. At least two substrate marks are then aligned with a single reference mark. Errors due to the inclination of the alignment beam are eliminated from the expansion and rotation values calculated for the substrate.

Abstract: In an inspection system for planar objects having periodic structures, programmable optical Fourier filtering in the focal plane of a telecentric lens system is used to directly identify physical phenomena indicative of non-periodic defects. Lens assemblies and a coherent optical source are used to generate and observe a spatial Fourier transform of a periodic structure in the Fourier plane. Optical Fourier filtering (OFF) is performed in the focal plane using an electrically programmable and electrically alignable spatial light modulator. The spatial light modulator with high signal to noise ratio is electrically reconfigurable according to a feedback-driven, filter construction and alignment algorithm. The OFF enhances any non-periodic components present in the Fourier plane and final image plane of the object. A system having a plurality of inspection channels provides high-throughput inspection of objects with small non-periodic defects while maintaining high detection sensitivity.

Abstract: A substrate is exposed through immersion liquid supplied by a liquid supply system. Prior to being exposed, a map of the surface of the substrate is generated at a measurement station. A liquid supply system fills the space between a measurement system and the substrate so the measurement takes place through liquid.

Abstract: An exposure apparatus for exposing a substrate to a pattern due to an original includes a substrate stage which holds and moves the substrate, and a first measurement unit which is arranged on the substrate stage, and measures a position of a mark formed on the original by projecting and receiving light.

Abstract: A device for measuring the output of an LED with a detector under different distance conditions without requiring the movement of either the LED or the detector. An exemplary embodiment of the present invention implements the testing conditions specified in CIE 127 allowing the determination of Averaged LED Intensity at the specified distances of 100 mm and 316 mm while keeping the physical distance between the LED and the detector fixed at the shorter distance of 100 mm. The exemplary embodiment comprises an optical element that can be selectively inserted into the optical path between the LED and the detector to make the separation appear to be the longer of the two distances. The optical element comprises a lens assembly and a detector aperture that creates a virtual image of the detector aperture at the longer of the two distances. The detector aperture is dimensioned so that the virtual image of the detector aperture has the area required by the standard.

Abstract: Exposure systems are disclosed having a configuration in which a field stop is positioned in proximity to a reflection-type mask, but that satisfactorily minimize adverse effects on the image-forming performance of the projection-optical system. The systems transfer a mask pattern accurately and with high throughput onto a photosensitive substrate. The system comprises an illumination-optical system (1, 2) that illuminates a reflection-type mask (M) on which is formed a prescribed pattern. A projection-optical system forms an image of the mask pattern on the photosensitive substrate (W). The mask and substrate are moved in a prescribed direction relative to the projection-optical system to project the mask pattern onto and expose the photosensitive substrate. The illumination-optical system has a field stop (19), positioned in proximity to the mask, that defines the illumination area on the mask. The interval between the mask and the field stop satisfies a prescribed conditional relation.

Abstract: A position detection method of illuminating an object to be observed with an illumination system having a variable illumination condition to detect a position of the object to be observed by a position detection system, including the steps of measuring each of mark spacings between a plurality of alignment marks arranged on the object to be observed, and selecting the illumination condition on the basis of mark spacing information obtained as the measurement result.

Abstract: A lithographic projection system has an illumination system. A plurality of directing elements direct different sub-beams of an incident beam into predetermined directions. By using re-directing optics any desired angular intensity distribution of the beam can be produced. The illumination system includes a setting device that includes a reflector plate that supports reflectors. The reflectors are resiliently supported on the reflector plate. At least one aperture in the reflector plate is associated with each reflector. A setting plate includes at least one pin associated with each reflector. The pins of the setting plate are insertable into the apertures of the reflector plate. Each pin or pins engages its associated reflector to control the orientation of the associated reflector by rotation about two axes substantially perpendicular to the optical axis of the associated reflector.

Abstract: A polarization state detecting system includes a first dividing device for dividing incident light into two light beams having the same polarization state as the incident light, a detector for detecting one of the two light beams from the first dividing device, through a polarizer, and an acquisition device for acquiring information regarding the polarization state of the incident light on the basis of an output of the detector. The first dividing device includes a first element, a second element and a third element. The second element is disposed so that a p-polarization component reflected by the first element is reflected by the second element as an s-polarization component.

Abstract: The invention relates to a device for photolithography of integrated circuits, at least comprising base plate, precision working table, optical head array; the optical head array adopts a line-array photosource scan-imaging device to realize the optical probe technique, and the line-array photosource scan-imaging device comprises a line-array photosource consisting of a plurality of adjacent linearly-arranged micro-photosources and the micro-imaging system performing micro-imaging for the photosource; the line-array photosource can realized not only with a plurality of micro-lasers but also with a line-array photosource device; a novel method is disclosed that can perform encoding based upon the line-array photosource scan width; an integrated circuit photolithographic method which can align the silicon wafer not only at the beginning of photolithography but also can repeatedly align it if needed during the photolithographic process.

Abstract: An alignment method includes a step of measuring the positions of a plurality of sample shot areas, a step of calculating conversion parameters between the measured positions of the sample shot areas and designed positions thereof so as to minimize the overall error of all of the measured positions, a step of selecting one or more sample shot areas, a step of memorizing the conversion parameters calculated in correspondence with the combinations of the sample shot areas; and a step of determining whether or not to finish the alignment measurement on the basis of the conversion parameters memorized in correspondence with the combinations of the sample shot areas.

Abstract: An aspect of the present invention provides simulation that includes dividing a surface of a substrate onto which light that is focused at an aperture angle by a projection lens is shone into a first region onto which all of the light strikes and a second region onto which a portion of the light strikes, calculating an intensity of the light shone onto the first region, and calculating an intensity of the light shone onto the second region.

Abstract: A reticle position detection system which detects an abnormal position of a reticle in order to prevent damage to the reticle by a reticle fork or pre-alignment unit used to orient the reticle for subsequent internalization into a process tool or other equipment. The reticle position detection system includes a laser beam generator provided on one side of the reticle and a laser beam sensor provided on the opposite side of the reticle. The laser beam generator emits a laser beam which is received by the laser beam sensor in the event that the reticle is correctly positioned for engagement by a reticle fork or pre-alignment unit.

Abstract: A method of detecting a position of a mark within image data. The method includes a first step of obtaining a first position of the mark based on a first degree of correlation between a first template and the image data, the first template having a first feature point to obtain the first degree of correlation, a second step of obtaining a second position of the mark based on a second degree of correlation between a second template and the image data, the second template having a second feature point, of which a position is different from that of the first feature point, to obtain the second degree of correlation, and a third step of detecting the position of the mark through the first and second steps.

Abstract: A method of detecting relative position of a reflecting-type reticle and a substrate with the reticle having an alignment mark thereon. The method includes a holding step of holding the reticle on a reticle stage which has a reference mark, and a detection step of detecting position of the alignment mark on the reticle based on alignment light reflected from the alignment mark and detecting relative position between the reference mark on the reticle stage and the alignment mark.

Abstract: A system and method are used for pulse to pulse dose control in an illumination system, used, for example, in a lithography or a maskless lithography machine. The system and method can be used to decrease effective laser pulse-to-pulse variability in lithographic lasers, allowing adequate dose control using a minimum number of pulses (e.g. as little as one pulse).

Abstract: To use a beam splitting optical system smaller than the conventional beam splitters and to set a longer optical path between a concave, reflective mirror and an image plant. A light beam from an object surface travels through a first converging group to enter a beam splitter, and a light beam reflected by the beam splitter is reflected by a concave, reflective mirror to form an image of patterns on the object surface inside the concave, reflective mirror. A light beam from the image of the patterns passes through the beam splitter and thereafter forms an image of the patterns through a third converging group on an image plane.