Abstract: A method is provided for automatically focusing a light signal on a surface of a substrate. The method is independent of the substrate material and is effective for both opaque and transparent substrates. A method is also provided for calibrating a system to allow for automatic focusing of a light signal.

Abstract: A method and apparatus for inspecting a surface of a semiconductor wafer having repetitive patterns for contaminant particles using scattered light which involves directing two beams of light at different approach angles onto the surface in a manner so as to illuminate two intersecting stripe shaped regions on the surface. An imaging lens collects scattered light from the surface as the semiconductor wafer is moving and then images the scattered light collected onto a CCD camera having a square array sensor and arranged to operate in a time delayed integration (TDI) mode. The field of view of the CCD camera is centered at the intersection of the two striped regions. Each light beam striking the surface produces a Fourier diffraction pattern of scattered light in the back focal plane of the imaging lens. In setting up the apparatus, the angle of incidence of one of the light beams is adjusted to shift one of the diffraction patterns, if necessary, so that it overlaps the other diffraction pattern.

Abstract: An imaging system for detecting defects on a substrate. Sensor module ports are disposed on an imaging platform. Sensor modules are removably connected to the sensor module ports, and are adapted to sense swaths on the surface of the substrate. Each of the sensor modules includes a time domain integration sensor, optics, an analog controller, and a digital controller. The time domain integration sensor optically senses the swath. The optics focus light from the swath on the time domain integration sensor. The analog controller receives signals from the time domain integration sensor and provides data signals. The digital controller receives the data signals, integrates the data signals into an image of the swath, and provides the image as digital signals to the sensor module port. A master controller receives the digital signals, composites them into a single image of a desired portion of the surface of the substrate, and detects defects within the image.

Abstract: Disclosed is a pattern forming method, in which a mask blank for preparation of a photomask is exposed in a desired pattern to form a mask pattern on the mask blank. Position measuring marks are formed on the diagonally facing corners of a main surface of the mask blank to detect a defect on the main surface of the mask blank. The relative positions of the detected defect and the mask pattern that is to be formed on the mask blank are compared, and the pattern position is selected such that the defect overlaps with the pattern. Then, the position measuring marks are measured to calculate the exposure position, and exposure treatment is applied to the selected position.

Abstract: In one aspect, the present invention is a technique of, and a system and sensor for measuring, inspecting, characterizing and/or evaluating optical lithographic equipment, methods, and/or materials used therewith, for example, photomasks. In one embodiment, the system, sensor and technique measures, collects and/or detects an aerial image produced or generated by the interaction between the photomask and lithographic equipment. An image sensor unit may measure, collect, sense and/or detect the aerial image in situ—that is, the aerial image at the wafer plane produced, in part, by a product-type photomask (i.e., a wafer having integrated circuits formed during the integrated circuit fabrication process) and/or by associated lithographic equipment used, or to be used, to manufacture of integrated circuits.

Abstract: According to the present invention, there is disclosed a defect detection apparatus comprising an illuminating unit which irradiates an inspection object with illuminating light, and an image pickup unit which picks up an image of diffracted light from the inspection object to perform defect inspection of the inspection object from image data picked up by the image pickup unit, the apparatus further comprising a diffraction angle calculation unit to obtain the diffraction angle of the illuminating light with respect to the inspection object, which is optimum for picking up the image of the diffracted light, based on design information of the inspection object, and an illuminating setting unit which sets the angle of incidence of the illuminating unit to the diffraction angle calculated by the diffraction angle calculation unit.

Abstract: An adaptive median filter (40) provides dynamic detection and correction of digital image defects which are caused by defective or malfunctioning elements of a radiation detector array (20). The adaptive median filter receives (100) lines of pixel values of a digital image that may have defects and a user-defined defect threshold. The lines of pixel values are scanned on a pixel-by-pixel basis using a kernel of n×n pixels, where the kernel contains the candidate pixel being examined (120). Each kernel is numerically reordered (130) and a median value is calculated (140). A defect threshold value is calculated by multiplying the user-defined defect threshold criteria and the candidate pixel value (150). A reference value is calculated by subtracting the candidate pixel value and the median value (160). The reference value is compared to the defect threshold value (170).

Abstract: An appearance inspection method, includes (a), (b), (c), (d), (e), (f), (g), and (h). The (a) includes providing an image data in which an inspected sample is photographed. The (b) includes detecting a brightness of each of a plurality of image units included in the image data based on the image data. The (c) includes detecting the number of the image units being identical with each other in the brightness for each of the brightness. The (d) includes detecting, as a measured maximum number, the number that is maximum of the detected numbers as a result of the (c). The (e) includes computing the measured maximum number to determine a set maximum number. The (f) includes determining a threshold level of the brightness based on the set maximum number. The (g) includes converting the image data into a binary pattern based on the threshold level. The (h) includes detecting a defect of the inspected sample based on the binary pattern.

Abstract: In a pattern inspection apparatus inspecting a pattern formed on a device and the like with a plurality of inspection lights, a sensitivity adjustment method in which respective optical systems associated with the inspection lights are efficiently and precisely checked to adjust the sensitivity thereof is attained. The sensitivity adjusting method for adjusting sensitivity of the pattern inspection apparatus performing inspection with a plurality of inspection lights includes the steps of preparing a sensitivity adjusting substrate divided into a plurality of regions to which identical reference patterns are provided, and scanning the reference patterns with the plurality of inspection lights making one of the plurality of inspection lights respectively correspond to one of the reference patterns, after attaching the sensitivity adjusting substrate to the pattern inspection apparatus.

Abstract: Provided are apparatus and methods for detecting phase defects. The invention relies generally on the distortion of light as it passes through defects in phase shift masks to detect these defects. Light traveling through a defect, such as a bump in an etched area will travel at a different angle than light traveling through air. In order to enhance the signals generated from the defects, the invention in several embodiments provides a multiple element detector having at least four elements, arranged in a radially symmetric configuration. Individual elements of the detector are selected to form a differential signal based on the configuration of pattern lines in the area proximate to the defect. The resulting differential signal is used to generate an image signal and to identify phase defects.

Abstract: A system for inspecting a specimen, such as a semiconductor wafer that uses a laser light source for providing a beam of light. The beam is applied to a traveling lens acousto-optic device having an active region and responsive to an RF input signal to selectively generate plural traveling lenses in the active region. The traveling lens acousto-optic device is operative to receive the light beam and generate plural flying spot beams, at the respective focus of each of the generated traveling lenses. A light detector unit, having a plurality of detector sections, each detector section having a plurality of light detectors and at least one multi-stage storage device operative to receive in parallel an input from the plurality of light detectors, is used to generate useable scan data. Information stored in each of the storage devices is serially read out concurrently from the multiple stages.

Abstract: When performing a defect inspection of a wafer W, defect observation equipment 3 first inputs defect position data from defect detection equipment 2. After a plurality of measurement points are set, the amount of position shift between the detection coordinate system and the observation coordinate system is measured for each measurement point. Then, the defect observation equipment 3 creates a first-order defect position correction formula in order to make reasonable the defect position in the detection coordinate system, based on the position shift amounts of the measurement points. This first-order defect position correction formula has three terms, for the offset component, the magnification component, and the rotation component of the observation coordinate system with respect to the detection coordinate system. Next, using the defect position correction formula, a defect position detected by the defect detection equipment 2 is corrected.

Abstract: A method and system are presented for inspecting a structure containing a pattern in the form of a surface relief fabricated by a pattern-creating tool applied to the structure. Reference data is provided being indicative of photometric intensities of light components of different wavelengths returned from a structure having a pattern similar to the pattern of the structure under inspection. Spectrophotometric measurements are continuously applied to successive locations within the surface relief on the structure so as to form a measurement slice thereon. Measured data in the form of a spectrum indicative of photometric intensities of light components of different wavelengths returned from the successive locations within the slice is detected and analyzed to determine whether it correlates with the reference data in accordance with predetermined criteria results.

Abstract: The object of the invention is to provide high-sensitivity detection of fine patterns on a transparent inter-layer insulative film and defects on the same layer. Detection is performed with lower-layer patterns and defects on the same layer defocused, thus allowing detection of just the defects from the process that is intended for inspection. An inspection apparatus for a specimen on which a plurality of patterns intended to have identical shapes are arranged in a uniform manner includes: an imaging optical system with a relationship between illumination wavelength and objective lens numerical aperture that provides a resolution of no more than 0.18 microns, or preferably no more than 0.

Abstract: The present invention generally provides an apparatus and a method for inspecting a substrate in a processing system. More specifically, optical signal routing methods and apparatus provide multiple inspection collection points on a semiconductor processing system. In one aspect, an optical inspection system comprises a light source and an optical receiving device, such as a CCD camera, to illuminate and inspect a substrate for various optical signatures. A plurality of optical inspection systems are connected to a signal switching device, such as a multiplexer, which operates to route a particular signal to a detector.

Abstract: A system for detecting defects in a layer of dielectric material is disclosed. The disclosed system comprises a first electrode, on which the layer is placed, at least one second electrode oppositely spaced apart from the first electrode and oppositely spaced apart from, but not in contact with, the top surface of the layer. A voltage, that is at least equal to the breakdown voltage corresponding to the spacing between the first and second electrodes in the absence of the material layer, is applied across the first and second electrodes. The presence and characteristics, such as the location and the cross sectional area, of defects are detected as a function of the flow of electrical current from the first electrode to the at least one second electrode.

Abstract: A method for focusing on disk-shaped objects with patterned and unpatterned surfaces includes imaging of the patterned and unpatterned surfaces on a disk-shaped object for defect detection and defect classification by using various preset values of a focus regulation system to acquire the image sequence. At least one preset value is learned on the basis of an image sequence at least at one position in a substantially flat reference region of the surface of the disk-shaped object. A regulated adjustment is provided of a measurable distance from a carrier plane to a reference plane, wherein the carrier plane serves as a support for the disk-shaped objects. The distance is adjusted by applying the at least one preset value, which is overlaid on the regulation system, a focus state is evaluated by an image processor according to at least one rule, and the at least one preset value is ascertained therefrom.

Abstract: Device for checking the neck of a container for the presence of an incline.

Abstract: A laser inspection apparatus has a light source 13 for outputting laser beam, application means 5, 33, 34 for irradiating the laser beam 7 output from the light source 13 to any desired position of a detected body 21, first detection means 2 for detecting fluorescence 8 generated from the detected body 21 to which the laser beam 7 is applied, and second detection means 3 for detecting reflected light 8 scattered on a surface of the detected body 21 to which the laser beam 7 is applied.

Abstract: Apparatus for spatial filtering includes a Fourier lens, adapted to collect radiation emitted from a point and to separate the collected radiation into spatial components in a Fourier plane of the lens, and a programmable spatial filter, positioned at the Fourier plane. An image sensor is optically coupled to capture an image of the spatial components of the collected radiation in the Fourier plane, while the components are incident on the filter. A filter controller is coupled to receive and analyze the image captured by the image sensor and, responsive thereto, to control the spatial filter so as to block one or more of the spatial components.

Abstract: Provided are apparatus and methods for detecting phase defects. The invention relies generally on the distortion of light as it passes through defects in phase shift masks to detect these defects. Light traveling through a defect, such as a bump in an etched area will travel at a different angle than light traveling through air. In order to enhance the signals generated from the defects, the invention in several embodiments provides a multiple element detector having at least four elements, arranged in a radially symmetric configuration. Individual elements of the detector are selected to form a differential signal based on the configuration of pattern lines in the area proximate to the defect. The resulting differential signal is used to generate an image signal and to identify phase defects.

Abstract: An optical system for detecting defects on a wafer that includes a device for producing a beam and directing the beam onto the wafer surface, producing an illuminated spot on the wafer's surface. The system further includes a detector detecting light, and a mirrored assembly having together with the detector an axis of symmetry about a line perpendicular to the wafer surface. The assembly is configured to receive scattered light from the surface, where the scattered light including a first scattered light part being scattered from the pattern. The assembly is further configured to reflect and focus rotationally symmetrically about the axis of symmetry the scattered light to the detector. The system further includes a device operating with the detector for facilitating detection of a scattered light other than the specified scattered light due to pattern.

Abstract: A web defect inspection system includes line scan cameras positioned across the width of a web and a dual-level out-of-focus light source for illuminating the web. An illumination surface of the dual-level light source has a bright portion adjacent a dark portion. One such dual-level light source is provided by covering a portion of a diffused light surface with an opaque material having a sharp edge. The pixels of each line scan camera are aligned with the dark to light transition of the light source so that each pixel has a no-defect brightness level equal to half of a relative brightness level of the bright portion of the dual-level light source. An image of a defect-free portion of the web consists of pixels having relative brightness levels within a pre-determined range of the no-defect brightness level. Images of defects on the web surface appear three-dimensional as bright and dark areas.

Abstract: The present invention includes a servo-shutter mechanism comprising a servo-motor and a first gear rotatably attached to the servo-motor. The gear has teeth. The invention also includes a second gear having a first end and a second end. The first end has teeth in meshing contact with the teeth of the first gear and the second end is adapted to be joined to a cam ring. The cam ring has an aperture and a plurality of pivot pins where one of the pivot pins is joined to the second end of the second gear. Additionally, the invention includes at least one shutter blade having a first end and a second end where the first end is adapted to be pivotably joined to the cam ring and the second end is adapted to block the aperture.

Abstract: An inspection apparatus for inspecting a resist boundary on a substrate having an outer surrounding portion, includes: an illumination unit which illuminates the outer surrounding portion of the substrate; a detector which detects light reflected from the outer surrounding portion; and a judgment unit which judges, based on light intensity of the detected reflected light, whether a resist removal width is proper.

Abstract: A laser beam L from a laser 2 is introduced from an introducing surface into a transparent substrate 1 by using mirrors 31 and 32. The laser beam introduced through the transparent substrate 1 repeats a total reflection on the surfaces (main surfaces and end surfaces) of the transparent substrate 1 and enters a state in which the laser beam is almost confined in the substrate 1. When an ununiform portion such as a scratch exists on the surface of the transparent substrate 1, however, total reflecting conditions are not satisfied and the light leaks out of the ununiform portion. The leaked light is formed as an image on a CCD 6 by a lens system 7 and an image process is executed by an image processing apparatus 12. In is a detected image, the ununiform portion in which the scratch or the like exists is brightly seen in a linear or a dot form in a black background, so that the ununiform portion such as a very fine scratch can be detected.

Abstract: A method and apparatus for inspecting a specimen which includes emitting a deep ultraviolet light from a light source illuminating a sample with the deep ultraviolet light through an objective lens, detecting an optical image of the sample by receiving light from the sample by the illumination with a time delay integration sensor through the objective lens, and outputting an image signal, processing the outputted image signal to extract a defect candidate, and determining a defect among the extracted defect candidate using information of a characteristic quality of the extracted defect candidate. In the detection, the time delay integration sensor receives the light from the sample by the illumination through a rear side of the time delay integration sensor.

Abstract: The surface inspection apparatus according to the present invention obtains images of a test piece by capturing images of the test piece with an image-capturing device while varying at least one apparatus condition (e.g., the wafer tilt angle) through apparatus condition adjustment and determines an optimal setting at which a surface inspection is to be conducted on the test piece based upon the images thus obtained. As a result, the optimal setting for the inspection can be accurately ascertained with ease even when the pitch of a pattern formed at the surface of the test piece is not known, thereby making it possible to perform a surface inspection while sustaining high levels of accuracy and efficiency at all times.

Abstract: Provided are apparatus and methods for detecting phase defects. The invention relies generally on the distortion of light as it passes through defects in phase shift masks to detect these defects. Light traveling through a defect, such as a bump in an etched area will travel at a different rate than light traveling through air. In order to enhance the signals generated from the defects, the invention in several embodiments provides a defocused light inspection beam by setting the focus of the beam to a level above or below the photomask subject to inspection. The light from the photomask is collected by a detector split into at least two portions, each generating a signal. A resulting differential signal produced from the signals generated at each of the two detector portions is used to determine whether a defect in the photomask is present, in one embodiment, by generating an image from the resulting signal.

Abstract: In a pattern inspection apparatus inspecting a pattern formed on a device and the like with a plurality of inspection lights, a sensitivity adjustment method in which respective optical systems associated with the inspection lights are efficiently and precisely checked to adjust the sensitivity thereof is attained. The sensitivity adjusting method for adjusting sensitivity of the pattern inspection apparatus performing inspection with a plurality of inspection lights includes the steps of preparing a sensitivity adjusting substrate divided into a plurality of regions to which identical reference patterns are provided, and scanning the reference patterns with the plurality of inspection lights making one of the plurality of inspection lights respectively correspond to one of the reference patterns, after attaching the sensitivity adjusting substrate to the pattern inspection apparatus.

Abstract: A high data-rate spot-grid array imaging system is provided that compensates for stage vibrations and overcomes the severe linearity requirements of prior art systems. Embodiments include an imaging system with a two-dimensional and periodic array of lenses, each lens imaging a spot in an object plane, such as a semiconductor substrate to be inspected, upon an image plane to image a two-dimensional and periodic array of spots. A sensor is provided in a conjugate image plane with a two-dimensional and periodic array of readout elements, each collecting the signal from one of the spots. A mechanical system moves the substrate in a direction which is nearly parallel to an axis of the array of spots such that as the substrate is moved across the spot array in the scan direction (the y-direction) the spots trace a path which leaves no gaps in the mechanical cross-scan direction (the x-direction).

Abstract: According to the present invention, there is disclosed a defect detection apparatus comprising an illuminating unit which irradiates an inspection object with illuminating light, and an image pickup unit which picks up an image of diffracted light from the inspection object to perform defect inspection of the inspection object from image data picked up by the image pickup unit, the apparatus further comprising a diffraction angle calculation unit to obtain the diffraction angle of the illuminating light with respect to the inspection object, which is optimum for picking up the image of the diffracted light, based on design information of the inspection object, and an illuminating setting unit which sets the angle of incidence of the illuminating unit to the diffraction angle calculated by the diffraction angle calculation unit.

Abstract: A defect inspecting apparatus for inspecting a defect of an object having a periodic pattern includes: a dark field illumination optical system that illuminates the object with substantially parallel illumination light in a direction having a predetermined first inclined angle relative to an inspection surface of the object; an imaging optical system having an imaging element for imaging the object illuminated with the illumination light, the imaging element having an imaging lens; and a defect detecting system for detecting the defect based on image data of the object thus imaged. A mutual positional relation ship between the direction of illumination by the illumination optical system and a direction of imaging by the imaging optical system is determined based on a diffraction angle defined by a period of the pattern and a wavelength of the illumination light.

Abstract: A scanning electron microscope equipped with a laser defect detection function has an automatic focusing function that performs the steps of: obtaining a deviation (offset) amount between focal positions of an optical microscope and a scanning electron microscope; detecting a defect by a laser dark-field image of the optical microscope; analyzing the dark-field image to readjust a focus of the optical microscope to adjust a height of the optical microscope; and automatically adjusting a focus of the scanning electron microscope by adding a readjusted amount of the focus of the optical microscope to the offset amount before an observation is conducted by the scanning electron microscope.

Abstract: A method and apparatus for inspecting a surface of a semiconductor wafer having repetitive patterns for contaminant particles using scattered light by illuminating an area on the surface with two beams of light at different approach angles which are independent from each other and then imaging the area illuminated onto a camera positioned above the surface using an imaging lens. Each light beam striking the surface of the semiconductor wafer produces a Fourier diffraction pattern of light scattered from the surface in the back focal plane of the imaging lens. The two diffraction patterns are offset from each other if the two approach angles are not symmetrically disposed relative to an axis of the wafer. In setting up the apparatus, the angle of incidence of one of the beams is adjusted to shift one of the diffraction patterns, if necessary, so that it overlaps the other diffraction pattern.

Abstract: An image of a scanning position on a faceplate on a light receiving region defined by an arrangement of n light receiving elements such that an amount of light received by the light receiving region becomes a peak at a center of the light receiving region in an arranging direction of the light receiving elements and is gradually reduced substantially symmetrically toward both ends thereof in the same direction. Therefore, if there is no defect in the surface of the faceplate, levels of light receiving signals of the light receiving elements arranged substantially symmetrically in position on both sides of the light receiving region with respect to the center thereof as a reference are substantially equal and there is no substantial difference therebetween.

Abstract: A method for determining the wood/bark ratio from a flow of wood material, in which the flow is illuminated in a non-flashing manner, scanned along a transverse line with a video camera with at least three channels, the line image corresponding to the line is digitalized into pixels each of which comprise intensity information, the intensity classes corresponding to the wood and the bark are determined in each channel and the pixels belonging to each class are calculated with the help of their intensity-information, and the wood/bark ratio is determined by the number of pixels situated in the different intensity classes. The dynamics of each channel are at least 10, most preferably 12 bit.

Abstract: A workpiece inspecting device suitable for inspection of tiny workpieces is provided which move workpieces such as screws, nails, screws and rivets while hanging them in the air and to carry out overall length inspection and projecting inspection of the workpieces while they are moving. A hanging portion is provided on the outer periphery of the turntable to lower the position of the bottom surface of the turntable at the outer peripheral portion where the workpieces are supported, so that the heads of workpieces supported in a hanged state from the turntable are within an inspection area through windows provided in the hanging portion.

Abstract: A laser beam L from a laser 2 is introduced from an introducing surface into a transparent substrate 1 by using mirrors 31 and 32. The laser beam introduced through the transparent substrate 1 repeats a total reflection on the surfaces (main surfaces and end surfaces) of the transparent substrate 1 and enters a state in which the laser beam is almost confined in the substrate 1. When an ununiform portion such as a scratch exists on the surface of the transparent substrate 1, however, total reflecting conditions are not satisfied and the light leaks out of the ununiform portion. The leaked light is formed as an image on a CCD 6 by a lens system 7 and an image process is executed by an image processing apparatus 12. In a detected image, the ununiform portion in which the scratch or the like exists is brightly seen in a linear or a dot form in a black background, so that the ununiform portion such as a very fine scratch can be detected.

Abstract: An inspection tool or inspection system can be utilized to determine whether the appropriate pattern is on a reticle. The reticle can be associated with EUV lithographic tools. The system utilizes at least two wavelengths of light. The light is directed to the reticle at the at least two wavelengths of light and detected by a detector. The image associated with the first wavelength is subtracted from or otherwise processed with respect to the image associated with the second wavelength to improve contrast ratio.

Abstract: A surface inspection apparatus inputs image data obtained by scanning an inspection object by a camera which includes a line image sensor into calculation means. The surface inspection apparatus comprises a line memory and adder to add image data of two adjacent main scanning lines to generate an image data string, adds the image data in a block including a plurality of pixels continuous in a main scanning direction by the calculation processor to generate added data in the block, calculates a correlated value of the added data in the blocks adjacent to each other in the main scanning direction, and judges the correlated value with a threshold value by judgment means to obtain a surface state of the inspection object.

Abstract: The invention pertains to a method for examining a series of objects that are symmetrical in reference to a rotational axis, e.g., circular disks, during or after the manufacturing process of the disks. In particular, the invention pertains to the optical examination of circular data carriers, e.g., CD, DVDs, CD-Rs or the like. The invention proposes that each object contains at least one marking or is provided with at least one marking. The marking makes it possible to unequivocally determine the angular position of each object about the rotational axis in reference to the marking for objects manufactured in the same manufacturing process. At least one section of the objects is scanned by at least one scanning element, and the marking is detected during the examination process.

Abstract: Method and device to detect defects (11a, 11b, 11c) in the section shape of a product (10), wherein the following steps are provided:

Abstract: A holographic scatterometer with continuous readout can rapidly identify the presence of deposits (particles or other defects) on an unpatterned wafer surface and determine the volume density (size) and location. The scatterometer can also determine chemical composition of the detected deposits. The range of the deposit (particle) size to be measured is below 80 nm, which currently existing scatterometer type instruments cannot readily detect. The inspection can be achieved as an in-line stage during the processing of wafers or in situ in combination with another processing tool or as a separate off-line analysis device.

Abstract: Apparatus for spatial filtering includes a Fourier lens, adapted to collect radiation emitted from a point and to separate the collected radiation into spatial components in a Fourier plane of the lens, and a programmable spatial filter, positioned at the Fourier plane. An image sensor is optically coupled to capture an image of the spatial components of the collected radiation in the Fourier plane, while the components are incident on the filter. A filter controller is coupled to receive and analyze the image captured by the image sensor and, responsive thereto, to control the spatial filter so as to block one or more of the spatial components.

Abstract: An inspection apparatus in which the environment for inspecting a semiconductor wafer or the like at a high degree of cleanness to enable a fine pattern to be inspected properly. A main body portion 10 for inspecting the semiconductor wafer or the like is housed in the inside of a clean box 3 and clean air is supplied from the clean air unit 4 into the inside of the clean box 3 in which the main body portion 10 is accommodated. There are provided opening areas 80 in lateral sides of the clean box 3 lying laterally of the inspection stage 14 for the main body portion 10 and the vessel mounting space 8. The clean air supplied from the clean air unit 4 into the inside of the clean box is passed over the inspection stage carrying the semiconductor wafer and through the cassette 7b mounted in the vessel mounting space 8 so as to be discharged from the opening areas 80 to outside of the clean box 3.

Abstract: A method of determining the correctness of a DRAM redundancy repair. The method is capable of detecting whether a redundancy repair has been properly conducted. The method includes illuminating a die on a wafer with a convergent light beam and observing the physical bit map produced after illumination on a screen. When the convergent light beam aims at a defective array, two semicircular shaped images appear on the screen. When the convergent light beam aims at a redundancy element used in a redundancy repair, a bright line appears on the screen. Through gauging the relative positions between the bright line and the pair of semicircular images, proper replacement by a redundancy element can be ascertained.

Abstract: An improved infrared (IR) imaging arrangement for a turbine component inspection system includes a platform having a turbine component base feature to receive a turbine component for inspection. Disposed on the platform are a number of mirrors around the turbine component feature. The number of mirrors simultaneously reflects a number of sides/edges for detection by an IR imager. As a result, the IR imager simultaneously view more than one sides/edges of a turbine component.

Abstract: An electronic media edge defect detector in one form has plural light sources and detectors arranged to direct and receive deflected light from the side edge margins and outer edge margins of the electronic media. The detected light is analyzed to detect the presence of defects. Individual wafers may be raised while in a cassette and turned during the inspection without removing the wafers from the cassette.

Abstract: Substrate inspection apparatus in accordance with the invention comprises optics for reflecting a laser beam off of a substrate and a detector for detecting the reflected laser beam. If a defect is present at the point where the laser reflects off the substrate, the laser will be deflected at an angle. Circuitry coupled to the detector generates a first signal that provides a measure of the extent to which the laser beam is deflected. (This signal is a measure of the slope of the defect walls.) An integrator receives that signal, and generates a second signal that is the integral of the first signal. The second signal is a measure of the height of the defect. The first and second signals provide a measure of the types of defects present on the substrate, and are used to determine whether the substrate is acceptable or should be rejected. In accordance with a second embodiment of the invention, laser beams are reflected off both the top and bottom surfaces of the substrate and detected by detectors.