Abstract: An optoelectronic semiconductor device using stimulated emission and absorption to achieve the functions of detection, modulation, generation and/or amplification of light. In one embodiment, the device includes a waveguide heterojunction bipolar transistor (HBT) biased in the active mode where the minority carrier concentration in the base is designed with bandgap engineering to optimize optical gain in this region. This HBT configuration allows optical modulation at considerably higher frequencies and/or with improved efficiency compared to the prior art, and is particularly suited to the fabrication of direct or external modulated wideband fiber optic links.

Abstract: A solid state array has a plurality of radiation detector unit cells, wherein each unit cell includes a bias-selectable two color photodetector in combination with either a second bias-selectable two color detector (10, 11) or a single photodetector (10', 11'). Each unit cell is thus capable of simultaneously outputting charge carriers resulting from the absorption of electromagnetic radiation within two spectral bands that are selected from one of four spectral bands and three spectral bands.

Abstract: This invention describes a nanometer scale interband lateral resonant tunneling transistor, and the method for producing the same, with lateral geometry, good fanout properties and suitable for incorporation into large-scale integrated circuits. The transistor is of a single gate design and operation is based on resonant tunneling processes in narrow-gap nanostructures which are highly responsive to quantum phenomena. Such quantum-effect devices can have very high density, operate at much higher temperatures and are capable of driving other devices.

Abstract: A photoresponsive device (10) includes a body comprised of semiconductor material comprised of elements selected from Group IIB-VIA; and at least one electrically conductive contact pad (20) formed over a surface of the semiconductor material. The at least one electrically conductive contact pad is comprised of metal nitride, such as MoN, and serves as a diffusion barrier between an Indium bump (22a, 22b) and the underlying semiconductor material. A passivation layer (18), such as a layer of wider bandgap CdTe, can be formed to overlie the surface of said semiconductor material. A p-n junction is contained within a mesa structure (10a) that comprises a portion of an n-type base layer (14) and a p-type cap layer (16). A first contact pad is disposed over the cap layer and a second contact pad is disposed over the base layer.

Abstract: The present invention provides an Si base semiconductor monocrystal substrate which includes an Si(11n) substrate where n=1.5-2.5. An intermediate layer is formed on the Si(11n) substrate. The intermediate layer is made of a material selected from the group consisting of ZnTe and Zn-rich CdZnTe, The intermediate layer has a thickness in the range of 50-200 angstroms. The intermediate layer is oriented in a (11n')B plane. An upper layer is formed on the intermediate layer. The upper layer is made of a material selected from the group consisting of CdTe and Cd-rich CdZnTe. The upper layer is oriented in a (11n")B plane. The indexes n' and n" satisfy the following equations. ##EQU1## where y is the lattice mismatch between the Si substrate and the intermediate layer. ##EQU2## where y' is the lattice mismatch between the Si substrate and the upper layer.

Abstract: A radiation detector (1) unit cell (10) includes an n-p+ LWIR photodiode that is vertically integrated with a p+-n MWIR photodiode in a n-p+-n structure. Electrical contact is made separately to each of these layers in order to simultaneously detect both the LWIR and MWIR bands. The electrical contact is made via indium bump interconnections (23, 25, 27) enabling the unit cell to be subsequently hybridized with a topside mounted electronic readout integrated circuit (30). The n-p+-n structure in a given pixel of an array of radiation detector pixels is electrically isolated from all neighboring pixels by a trench (28) that is etched into an underlying substrate (12). To compensate for a reduction in the optically sensitive area due to the placement of the electrical contacts and the presence of the pixel isolation trench, a microlens (34) may be provided within, upon, or adjacent to the backside, radiation receiving surface of the substrate in registration with the unit cell.

Abstract: Group II-VI thin film transistors, a method of making same and a monolithic device containing a detector array as well as transistors coupled thereto wherein, according to a first embodiment, there is provided a group II-VI insulating substrate, a doped layer of a group II-VI semiconductor material disposed over the substrate, an insulating gate region disposed over the doped layer, a pair of spaced contacts on the doped layer providing source and drain contacts, a gate contact disposed over the insulating gate region, an insulating layer disposed over exposed regions of the substrate, doped layer, insulating gate region and contacts and metallization disposed on the insulating layer and extending through the insulating layer to the contacts. The thickness of the doped layer is less than the maximum depletion region thickness thereof.

Abstract: Chalcopyrite compound semiconductor thin films represented by I-III-VI.sub.2-x V.sub.x or I-III-VI.sub.2-x VII.sub.x, and semiconductor devices having a I-III-VI.sub.2 /I-III-VI.sub.2-x V.sub.x or I-III-VI.sub.2 /I-III-VI.sub.2-x VII.sub.x chalcopyrite homojunction are provided. Such chalcopyrite compound semiconductor thin films are produced by radiating molecular beams or ion beams of the I, III, VI, and V or VII group elements simultaneously, or by doping I-III-VI.sub.2 chalcopyrite thin films with VII-group atoms after the formation thereof. Pollution-free solar cells are also provided, which are formed by the steps of forming a structure of a lower electrode, a chalcopyrite semiconductor thin film, and an upper electrode and radiating accelerated ion beams of a V, VII, or VIII group element thereto.

Abstract: A compositionally graded HgCdTe radiation detector (10) is constructed to have a high purity "denuded zone" (Region 2) that is formed adjacent to a radiation absorbing region (Region 1). The compositional grading results in an internally generated electric field that is orthogonally disposed with respect to an externally generated electric field applied between contacts (16, 18). The internally generated electric field has the effect of injecting photogenerated minority charge carriers into the denuded zone, thereby reducing recombination with photogenerated majority charge carriers and increasing carrier lifetime. The detector further includes a wider bandgap surface passivation region (Region 3) that functions to trap, or "getter", impurities from the denuded zone and also to reduce surface recombination effects.

Abstract: An adhesive ohmic contact made to a p-type semiconductor metal substrate or layer (10) comprises tin. The contact preferably includes a tin film (24) approximately 2000 .ANG. in thickness. The p-type semiconductor compound contains mercury and, while described in conjunction with Hg.sub.1-x Cd.sub.x Te, other elements exhibiting group II and group VI chemical behavior and properties may be used. A cap layer (30) is deposited over film (24), followed by insulating layer 32. Via (34) is then formed and, to complete contact (50), a metal (36) is deposited inside via (34).

Abstract: A dual-band HgCdTe radiation detector (10) includes a four layer n-p.sup.+ -p-n.sup.+ structure, grown by LPE, upon a substrate (12). The four layers are, from a bottom layer next to the substrate to the surface: (a) a MWIR radiation responsive n-type absorbing layer (14); (b) a p.sup.+ cap layer (16); (c) a LWIR radiation responsive p-type layer (18); and (d) an n+ top layer (20). The n.sup.+ top layer has a compositional profile that is similar to the p-type cap layer. Operation of this structure involves biasing the top layer positive with respect to the bottom layer, which results in the collection of LWIR-generated electrons in the p-type layer. Biasing the top layer negative with respect to the bottom layer results in MWIR-generated holes being collected by the bottom n-p+ junction.

Abstract: A layer (32) of a HgCdTe compound epitaxially contacts a buffer structure, which in turn epitaxially contacts a silicon substrate (22). The buffer structure is formed of II-VI compounds, and preferably includes at least one layer (24) of a ZnSeTe compound epitaxially contacting the silicon substrate (22) and a layer (30) of a CdZnTe compound overlying the ZnSeTe compound layer (24). The ZnSeTe compound layer (24) may be provided as a single graded layer having a composition of ZnSe adjacent to the silicon and a composition of ZnTe remote from the silicon, or as two distinct sublayers with a ZnSe sublayer (26) adjacent to the silicon substrate (22) and a ZnTe sublayer (28) remote from the silicon substrate (22).

Abstract: An infrared imaging device includes a first conductivity type first semiconductor layer having a small energy band gap, a first conductivity type second semiconductor layer have a larger energy band gap and disposed on the first semiconductor layer, a light receiving region of the second conductivity type in the second semiconductor layer and extending into the first semiconductor layer, a second conductivity type region in the second semiconductor layer spaced from the light receiving region, an insulating layer on the second semiconductor layer, and an MIS electrode on the insulating layer between the light receiving region and the second conductivity type region. Recombination of signal charges produced by incident light in the light receiving region and leakage current at the surface of the second semiconductor layer at the light receiving region are reduced. In addition, the numerical aperture of the light receiving region is increased.

Abstract: A photoresponsive device wherein the device includes semiconductor material, such as a cap region (14a), comprised of elements selected from Group IIB-VIA. A molybdenum contact pad (16) is formed upon a surface of the cap region, and a molybdenum ground contact pad is formed on a surface of a base region (12). A wide bandgap semiconductor passivation layer (20) overlies the surface of the cap region and also partially overlies the molybdenum contact pad. A dielectric layer (22) overlies the passivation layer, and an indium bump (24) is formed upon the molybdenum contact pad. The dielectric layer is in intimate contact with side surfaces of the indium bump such that no portion of the molybdenum contact pad can be physically contacted from a top surface of the dielectric layer. This method eliminates the possibility of unwanted chemical reactions occurring between the In and the underlying contact pad metal.

Abstract: A HgCdTe S-I-S (semiconductor-insulator-semiconductor) two color infrared detector wherein the semiconductor regions are HgCdTe with different compositions for the desired spectral regions. The device is operated as a simple integrating MIS device with respect to one semiconductor. The structure can be grown by current MBE techniques and does not require any significant additional steps with regard to fabrication.

Abstract: A IV--IV semiconductor device having a narrowed bandgap characteristic compared to silicon and method is provided. By incorporating carbon into silicon at a substitutional concentration of between 0.5% and 1.1%, a semiconductor device having a narrowed bandgap compared to silicon and good crystalline quality is achieved. The semiconductor device is suitable for semiconductor heterojunction devices that use narrowed bandgap regions.

Abstract: Spectral shift between different wavelength spectra by restricted narrow bandgap absorption of incident radiation at one location on a semiconductor body, under electrical bias causing release of radiation at another emission location as a result of radiative electron-hole recombination. The semiconductor body is a graded bandgap establishing composition of two selected compounds alloyed to a variable, position-dependent degree between the respective radiation and emission locations at which the respective narrow and wide bandgap properties of the compounds prevail.

Abstract: An intersub-valence band quantum well detector (52), comprising alternating quantum wells (30') and barriers (32'), provided with differential strain permits obtaining hole mean free paths similar to the electron. Consequently, the gain and responsivity should dramatically increase. In addition, the absorption coefficient should increase, while the noise current should decrease; thus, the quantum efficiency and the detectivity (D*) should increase, compared to a detector without the added differential strain.

Abstract: A group II-VI epitaxial layer grown on a (111) silicon substrate has a lattice mismatch which is minimized, as between the group II-VI epitaxial layer and the silicon substrate. The grown group II-VI epitaxial layer also has a (111) plane at the interface with the substrate, and a 30.degree. in-plane rotation slip is formed at the interface between the (111) silicon substrate and the group II-VI epitaxial layer. The above structure is produced by a metal organic chemical vapor deposition method (MOCVD), in which a mol ratio of a group VI gas source supply to a group II gas source supply is kept greater than 15 during the growth. The (111) silicon substrate is preferably mis-oriented toward the <110> direction of the silicon substrate. When a HgCdTe layer is grown on the epitaxial layer, the product thus formed has utility as a monolithic infrared detector in which a plurality of detector elements are formed in the HgCdTe layer and a signal processing circuit is formed in the silicon substrate.

Abstract: A two color infrared detector (10) is described comprising a heterojunction diode and a metal insulator semiconductor ("MIS") device. The diode comprises first (12) and second (14) semiconductor regions which are operable to generate electron-hole pairs when struck by infrared radiation having first and second wavelengths respectively. The gate (24) of the MIS device is operable to generate a potential well in the first semiconductor region conjunction with an insulator layer (22).

Abstract: A photodiode (10) fabricated in accordance with the method of the invention includes a substrate (11) and a semiconductor base region (12) overlying the substrate. The base region is comprised of Group IIB-VIA material and has a first type of electrical conductivity. A passivation layer (16) overlies the base region and is also comprised of Group IIB-VIA material. A dielectric layer (18) at least partially overlies the passivation layer. During fabrication the dielectric layer functions as an etch stop during a removal of excess cap material, the remaining cap material forming a cap region (14) within an opening that is etched through the dielectric layer and the passivation layer. The cap region is also comprised of Group IIB-VIA material, has a second type of electrical conductivity, and forms a heterojunction (14a) with the base region. An electrically conductive contact pad (20) and an electrically conductive interconnect, preferably an indium bump (22), are formed upon the cap region.

Abstract: A mercury-cadmium-telluride (HgCdTe) photoresponsive layer (14) having the composition Hg.sub.1-x Cd.sub.x Te is formed on a substrate (12) such that x increases from the surface (14a) of the photoresponsive layer (14) toward the substrate (12). This causes the bandgap in the photoresponsive layer (14) to increase from the surface (14a) toward the substrate (12), thereby urging minority carriers which are photogenerated in the photoresponsive layer (14) to move toward and be trapped at the surface (14a). Laterally spaced first and second ohmic contacts (16,18) are electrically connected to the photoresponsive layer (14) at a predetermined distance (z.sub.c) below the surface (14a) such that the photogenerated minority carriers trapped at the surface (14a) are urged away from the contacts (16,18) by the increasing bandgap.

Abstract: A field effect type photo-detector comprises a semiconductor buffer layer arranged on a substrate. A semiconductor activation layer is arranged on that buffer layer, and a source electrode, a drain electrode and a gate electrode are arranged on the activation layer. A depletion layer for controlling a current flow between the source electrode and the drain electrode is created in the activation layer by applying a voltage to the gate electrode. When light irradiates the activation layer, the depletion layer changes. The buffer layer has a wider band gap than that of the activation layer and has an energy gap which serves as a barrier to carriers. The buffer layer has a sufficiently wide band gap to prevent the absorption of light having an equal wavelength to that of the light irradiated to the activation layer.

Abstract: A photodetector includes a compound semiconductor substrate including first and second elements and having a first energy band gap, a first conductivity type compound semiconductor light absorbing layer including at least one of the first and second elements and having a second energy band gap narrower than the first energy band gap, a transition layer having an energy band gap at least as wide as the second energy band gap and no wider than the first energy band gap disposed between and contacting the substrate and the light absorbing layer, at least a first recess extending through the substrate and the transition layer to the light absorbing layer, a second conductivity type region disposed in the light absorbing layer at the first recess, a first electrode disposed in the first recess in contact with the second conductivity type region, and a second electrode disposed in contact with the first conductivity type light absorbing layer.

Abstract: A method for fabricating a plurality of semiconductor photodetectors and an array of same produced by the method. The method includes a first step of selectively removing semiconductor material to form a channel within a semiconductor material for physically isolating a first photodetector from a second photodetector, the semiconductor material having a characteristic energy bandgap. The method includes a second step of selectively increasing the carrier concentration of the semiconductor material within a bottom region of the channel for preventing minority charge carriers from diffusing under the channel from a region associated with the first photodetector to a region associated with the second photodetector. The step of selectively removing is accomplished by the steps of providing a patterned mask upon the semiconductor material and selectively removing the underlying semiconductor material through an opening within the mask.

Abstract: A Hall generator includes a substrate body of single crystalline semi-insulating gallium arsenide having a surface. A thin layer, no greater than about 5 micrometers in thickness, of single crystalline indium arsenide is on the surface of the body and is in the form of four arms joined at a common point to form a cross. A separate metal contact is on each of the arms at the free end thereof. An accumulation layer is adjacent the outer surface of the indium arsenide layer and extends along the entire surface of the indium arsenide layer between the contacts. The accumulation layer is effective to provide a magnetic sensitivity and range of operating temperatures as if the indium arsenide layer was much thinner and had a much higher electron density and electron mobility. Electrical devices, such as field effect transistors, may be formed in the body and the surface and electrically connected to the contacts of the Hall generator in a desired circuit.