Abstract: An inverter-type basic cell, with a hexagonal contour, comprises one CMOS device pair arrangement including an n-channel transistor and a p-channel transistor. The inverter-type basic cell has a gate region annularly formed and connected in parallel with the n-channel and p-channel transistors, a sectoral drain diffusion region having a vertex at the center of the annularly-formed gate region, and a source diffusion region that is formed outside of the gate region in such a way as to define a shape having two opposing sides that lie on the prolongation of the two radii of the sectoral drain diffusion region.

Abstract: Several inventions are disclosed. A cell architecture using hexagonal shaped cells is disclosed. The architecture is not limited to hexagonal shaped cells. Cells may be defined by clusters of two or more hexagons, by triangles, by parallelograms, and by other polygons enabling a variety of cell shapes to be accommodated. Polydirectional non-orthogonal three layer metal routing is disclosed. The architecture may be combined with the tri-directional routing for a particularly advantageous design. In the tri-directional routing arraingement, electrical conductors for interconnecting terminals of microelectronic cells of an integrated circuit preferrably extend in three directions that are angularly displaced from each other by 60.degree.. The conductors that extend in the three directions are preferrably formed in three different layers. A method of minimizing wire length in a semiconductor device is disclosed. A method of minimizing intermetal capacitance in a semiconductor device is disclosed.

Abstract: On transistors P1, P2, N1 and N2 constituting an NAND gate, interconnection pattern W of metal having high melting point and aluminum interconnection patterns Al1 and Al2 are stacked. A local line LL for connecting transistors P1, P2, N1 and N2 to each other is formed by the interconnection pattern W of metal having high melting point, signal lines SL and SL' for signal input/output between the NAND gate and the outside are formed by aluminum interconnection pattern Al1, and power supply lines VL and VL' for applying power supply potentials Vcc and Vss to the NAND gate are formed by the aluminum interconnection pattern Al2. As compared with the prior art in which the local line LL is formed by the aluminum interconnection pattern Al1, the degree of freedom in layout can be improved and the layout area can be reduced.

Abstract: The invention pertains to a solid-state chemical sensor with a substrate support. On one side of the support is mounted a heating element with branch circuit connections. On the other side interdigital electrodes are arranged and thereon a carbon dioxide-sensitive material, which comprises CuO and TiO.sub.3, as well as additional metal oxides, in the form of a thick film of approximately 20-200 .mu.m.

Abstract: An IC comprises a tub of a first conductivity type, at least one transistor embedded in the tub, and a first pair of isolating regions defining therebetween a tub-tie region coupled to the tub. The tub-tie region comprises a cap portion of the first conductivity type and an underlying buried pedestal portion of a second conductivity type. At least a top section of the pedestal portion is surrounded by the cap portion so that a conducting path is formed between the cap portion and the tub. In a CMOS IC tub-ties of this design are provided for both NMOS and PMOS transistors. In a preferred embodiment, the cap portion of each tub-tie comprises a relatively heavily doped central section and more lightly doped peripheral sections, both of the same conductivity type.

Abstract: A gate array base cell which can easily be configured as high conductivity transistor device or a low conductivity transistor device comprises a moat region of first conductivity type, typically heavily doped n-type silicon or heavily doped p-type silicon, for example. A channel region of a different conductivity type separates the moat region into at least three portions. An insulating layer, such as silicon dioxide, for example, and a gate are formed above the channel region. The gate may be formed of polysilicon, for example. Modifications, variations, circuit configurations and an illustrative fabrication method are also disclosed.

Abstract: The invention provides an improvement in a cell structure for gate arrays. By using the cell in gate arrays, the design flexibility and the symmetry feature of the gate array can be retained. By providing transistors of different sizes, the design can possess more flexibility and more efficiency. Moreover, a denser chip layout can be completed. Thus, average wire lengths used for interconnections in the chip design may be shorter than previously possible. Also, better utilization of available chip area can be made. Thus, it becomes possible to flexibly and optimally use every area of the chip.

Abstract: A CMOS cell architecture and routing technique is optimized for three or more interconnect layer cell based integrated circuits such as gate arrays. First and second layer interconnect lines are disposed in parallel and are used as both global interconnect lines and interconnect lines internal to the cells. Third layer interconnect lines extend transverse to the first two layer interconnects and can freely cross over the cells. Non-rectangular diffusion regions, shared gate electrodes, judicious placement of substrate contact regions, and the provision for an additional small transistor for specific applications are among numerous novel layout techniques that yield various embodiments for a highly compact and flexible cell architecture. The overall result is significant reduction in the size of the basic cell, lower power dissipation, reduced wire trace impedances, and reduced noise.

Abstract: There is disclosed a multi-power supply integrated circuit including a first pMOS transistor which is formed in a first n-well and operated at a first supply voltage and a second pMOS transistor which is formed in a second n-well and operated at a second supply voltage being lower than the first supply voltage, wherein the first n-well and the second n-well are placed adjacently to put a boundary line therebetween and also the first supply voltage is supplied to both the first and second n-wells. Because a space between the first and second n-wells is made small, a gate array LSI with a reduced chip area is provided. A common n-well may be formed in place of the first and second n-wells.

Abstract: A BiMOS integrated circuit includes a bipolar transistor for output pull-up; a BiMOS hybrid gate buffer section which comprises a MOS transistor for output pull-down which is longitudinally connected to the bipolar transistor, and a MOS transistor for base drive which comprises an output which is connected a base of the bipolar transistor to drive the base and a gate which is connected to an input; and a logical section which comprises at least a CMOS gate, the logical section having an output which is connected to the input; wherein the base drive MOS transistor has an input capacitance less than that of the output pull-down MOS transistor.

Abstract: A CMOS cell architecture and routing technique is optimized for three or more interconnect layer cell based integrated circuits such as gate arrays. First and second layer interconnect lines are disposed in parallel and are used as both global interconnect lines and interconnect lines internal to the cells. Third layer interconnect lines extend transverse to the first two layer interconnects and can freely cross over the cells. Non-rectangular diffusion regions, shared gate electrodes, judicious placement of substrate contact regions, and the provision for an additional small transistor for specific applications are among numerous novel layout techniques that yield various embodiments for a highly compact and flexible cell architecture. The overall result is significant reduction in the size of the basic cell, lower power dissipation, reduced wire trace impedances, and reduced noise.

Abstract: A display device having high definition and high reliability, and technology for manufacturing the same. In an active matrix type display device of integrated peripheral driving circuit type, pixel TFTs of an active matrix circuit 100 are not provided with LDD regions. Also, among circuits constituting peripheral driving circuits 101, 102, buffer circuits, of which a high withstand voltage and high-speed operation are required, are made with thin film transistors having floating island regions and base regions between source and drain regions of their active layers.

Abstract: A semiconductor integrated circuit having a plurality of fundamental cells respectively composed of a pair of p-channel field effect transistors and a pair of n-channel field effect transistors is disclosed. Elements of each fundamental cell are connected by lines, the fundamental cells are connected by lines, and a circuit is formed. The p-channel field effect transistors are formed in symmetry to each other, the n-channel field effect transistors are formed in symmetry to each other, one p-channel field effect transistor and one n-channel field effect transistor are formed in symmetry to each other, and the other p-channel field effect transistor and the other n-channel field effect transistor are formed in symmetry to each other.

Abstract: Several inventions are disclosed. A cell architecture using hexagonal shaped cells is disclosed. The architecture is not limited to hexagonal shaped cells. Cells may be defined by clusters of two or more hexagons, by triangles, by parallelograms, and by other polygons enabling a variety of cell shapes to be accommodated. Polydirectional non-orthogonal three layer metal routing is disclosed. The architecture may be combined with the tri-directional routing for a particularly advantageous design. In the tri-directional routing arrangement, electrical conductors for interconnecting terminals of microelectronic cells of an integrated circuit preferrably extend in three directions that are angularly displaced from each other by 60.degree.. The conductors that extend in the three directions are preferrably formed in three different layers. A method of minimizing wire length in a semiconductor device is disclosed. A method of minimizing intermetal capacitance in a semiconductor device is disclosed.

Abstract: A customizable logic array device including an array of identical multiple input, function selectable logic cells comprising a first conductive layer, application configurable interconnection apparatus selectably interconnecting the multiple input, function selectable logic cells, the application configurable interconnection apparatus comprising at least two conductive layers.

Abstract: A semiconductor integrated circuit device includes a high density cell in which a more densely integrated layout is provided by combining cells having the same circuit configuration and sharing a basic gate portion among each of the cells.

Abstract: Several inventions are disclosed. A cell architecture using hexagonal shaped cells is disclosed. The architecture is not limited to hexagonal shaped cells. Cells may be defined by clusters of two or more hexagons, by triangles, by parallelograms, and by other polygons enabling a variety of cell shapes to be accommodated. Polydirectional non-orthogonal three layer metal routing is disclosed. The architecture may be combined with the tri-directional routing for a particularly advantageous design. In the tri-directional routing arrangement, electrical conductors for interconnecting terminals of microelectronic cells of an integrated circuit preferrably extend in three directions that are angularly displaced from each other by 60.degree.. The conductors that extend in the three directions are preferrably formed in three different layers. A method of minimizing wire length in a semiconductor device is disclosed. A method of minimizing intermetal capacitance in a semiconductor device is disclosed.

Abstract: A semiconductor integrated circuit has a semiconductor substrate on which macrocells are formed. At least one of the macrocells is surrounded by a first diffused region, which may be surrounded by a second diffused region. The first and second diffused regions are connected to power source terminals, respectively. Semiconductor elements included in each macrocell are connected to power source terminals that are independent of the terminals connected to the diffused regions. Alternatively, a voltage is supplied to the diffused regions through power lines that are different from power lines for the semiconductor elements. This arrangement absorbs short-circuit current in CMOS circuitry and/or substrate current produced by the semiconductor elements.

Abstract: A basic cell structure of a gate array that allows wiring in a macro cell is implemented solely by using first layer metallic wires and entails neither performance deterioration nor an increase in sell size. The basic cell of the gate array comprises a pMOS transistor having two FETs connected in series to each other and an nMOS transistor also having two FETs also connected in series to each other. The pMOS transistor and the nMOS transistor are formed on a substrate and arranged in parallel to each other, and gate electrodes corresponding to the FETs are commonly provided for the pMOS transistor and the nMOS transistor. In this structure, a first auxiliary wire is provided between the gate electrodes on the same layer as the gate electrodes. A second auxiliary wire is provided between adjacent basic cells also on the same layer as the gate electrodes. Wiring in a macro cell can be completed by using the first and second auxiliary wires of different types to form a two-dimensional structure.

Abstract: Several inventions are disclosed. A cell architecture using hexagonal shaped cells is disclosed. The architecture is not limited to hexagonal shaped cells. Cells may be defined by clusters of two or more hexagons, by triangles, by parallelograms, and by other polygons enabling a variety of cell shapes to be accommodated. Polydirectional non-orthogonal three layer metal routing is disclosed. The architecture may be combined with the tri-directional routing for a particularly advantageous design. In the tri-directional routing arraingement, electrical conductors for interconnecting terminals of microelectronic cells of an integrated circuit preferrably extend in three directions that are angularly displaced from each other by 60.degree.. The conductors that extend in the three directions are preferrably formed in three different layers. A method of minimizing wire length in a semiconductor device is disclosed. A method of minimizing intermetal capacitance in a semiconductor device is disclosed.

Abstract: A cell architecture using hexagonal shaped cells is disclosed. The architecture is not limited to hexagonal shaped cells. Cells may be defined by clusters of two or more hexagons, by triangles, by parallelograms, and by other polygons enabling a variety of cell shapes to be accommodated. Polydirectional non-orthogonal three layer metal routing is disclosed. The architecture may be combined with the tri-directional routing for a particularly advantageous design. In the tri-directional routing arraingement, electrical conductors for interconnecting terminals of microelectronic cells of an integrated circuit preferrably extend in three directions that are angularly displaced from each other by 60.degree.. The conductors that extend in the three directions are preferrably formed in three different layers. A method of minimizing wire length in a semiconductor device is disclosed. A method of minimizing intermetal capacitance in a semiconductor device is disclosed. A novel device called a "tri-ister" is disclosed.

Abstract: Several inventions are disclosed. A cell architecture using hexagonal shaped cells is disclosed. The architecture is not limited to hexagonal shaped cells. Cells may be defined by clusters of two or more hexagons, by triangles, by parallelograms, and by other polygons enabling a variety of cell shapes to be accommodated. Polydirectional non-orthogonal three layer metal routing is disclosed. The architecture may be combined with the tri-directional routing for a particularly advantageous design. In the tri-directional routing arraingement, electrical conductors for interconnecting terminals of microelectronic cells of an integrated circuit preferrably extend in three directions that are angularly displaced from each other by 60.degree.. The conductors that extend in the three directions are preferrably formed in three different layers. A method of minimizing wire length in a semiconductor device is disclosed. A method of minimizing intermetal capacitance in a semiconductor device is disclosed.

Abstract: A gate array architecture adapted for serial multiplexer-based circuits. In one embodiment, the gate array contains base cells having functional but isolated serial multiplexer circuits therein. In another embodiment, a base cell contains a single serial multiplexer circuit divisible into varying-sized (size corresponding to the number of inputs) derivative serial multiplexer circuits. In either embodiment, the serial multiplexer circuits within the base cell may be formed from P- and N-channel transistors of varying size. The transistor sizes are chosen to optimize the efficiency of serial multiplexer-based circuits.

Abstract: A master slice type gate array has a plurality of block areas. Each block area includes a plurality of basic cells arranged in a matrix. Different block areas have transistors with different channel widths. Within each of the block areas, a plurality of basic cells are connected to one another through a wiring layer to form function cells. First layer wirings for the function cells are completed within an area between rows of power source wirings Vdd and Vss of the first layer in the transverse direction. Contacts for connecting the sources and drains of P- and N-channel type MOS transistors to the first layer wirings are arranged in rows. Even if the channel widths are changed, the position of the contacts for forming the function cells and the wiring pattern remain unchanged for every block. Therefore, the master slice type gate array can be optimized for various performance parameters such as speed, integration, power consumption and other factors.

Abstract: The gate array (10) has a first doped region (14) in a semiconductor substrate (12) and a plurality of contacts (20-20"', 21-21") arranged in rows and columns to the first doped region (14) organized with contacts of each row offset in a column (25) that is spaced with respect to a columns (28) of adjacent rows at which a contact exists. A plurality of gate conductors (35-42) are arranged to circumnavigate successive contacts (20,21) of adjacent rows on opposite sides in a serpentine patterns, preferably that follow partially circular paths. The contacts (20,21) are substantially circular in cross section, and may be provided with cap (32) on each that may also have a substantially circular cross section. The contacts (20-21) are spaced with a predetermined pitch and the gate conductors (35-42) have a width that defines transistor channels between adjacent contacts. The width of the conductors (35-42) allows the conductors to pass in proximity to the contacts (20-21) with a predetermined spacing.

Abstract: In a gate array having a plurality of free transistors and target transistors, a method and apparatus for protecting a gate electrode of a target transistor from gate charge by employing a free transistor as a gate electrode protection device. A target transistor is a transistor that has been determined to need gate charging protection. A free transistor is a transistor in the gate array which is not used to implement the logic design as embodied in the gate array. Initially, a base array is formed without any metal layers. Then, a determination is made as to which transistors require gate charging protection. The gate electrode of each target transistor determined to require gate charging is coupled to an associated drain or source electrode of a free transistor of the gate array. The gate electrode of the free transistor is connected to an appropriate voltage reference to turn the free transistor off.

Abstract: The gate resistance of a high-frequency multi-finger MOS transistor is reduced by shorting together the ends of each of the gates by utilizing gate contacts, metal regions, vias, and a metal layer. Alternately, the gate resistance is reduced by utilizing a metal line that shorts all of the gate contacts together, and overlies each of the gates. By reducing the gate resistance, the maximum frequency f.sub.MAX of the multi-finger transistor can be increased.

Abstract: Several inventions are disclosed. A cell architecture using hexagonal shaped cells is disclosed. The architecture is not limited to hexagonal shaped cells. Cells may be defined by clusters of two or more hexagons, by triangles, by parallelograms, and by other polygons enabling a variety of cell shapes to be accommodated. Polydirectional non-orthogonal three layer metal routing is disclosed. The architecture may be combined with the tri-directional routing for a particularly advantageous design. In the tri-directional routing arraingement, electrical conductors for interconnecting terminals of microelectronic cells of an integrated circuit preferrably extend in three directions that are angularly displaced from each other by 60.degree.. The conductors that extend in the three directions are preferrably formed in three different layers. A method of minimizing wire length in a semiconductor device is disclosed. A method of minimizing intermetal capacitance in a semiconductor device is disclosed.

Abstract: An integrated digital circuit is protected from reverse engineering by fabricating all transistors of like conductivity with a common size and geometric layout, providing a common layout for different logic cells, connecting doped circuit elements of like conductivity with electrically conductive doped implants in the substrate rather than metalized interconnections, and providing non-functional apparent interconnections that are interrupted by non-discernable channel stops so that all cells falsely appear to have a common interconnection scheme. The camouflage is enhanced by providing a uniform pattern of metal leads over the transistor array, with a uniform pattern of heavily doped implant taps from the transistors for connection to the leads; undesired tap-lead connections are blocked by channel stops.

Abstract: A gate array architecture adapted for circuits containing transmission gates. In one embodiment, the gate array architecture contains a base row having at least four alternating P- and N-channel transistor rows. The transistor rows are positioned between a first voltage and a second voltage rail. In another embodiment, the rows adjacent the first and second voltage rails have larger transistors to facilitate connection of the transistors as inverters or buffers. The rows more remotely positioned from the first and second voltage rails have smaller transistor sizes to facilitate connection of the transistors as transmission gates. The gate array architecture is particularly efficient when used to create serial multiplexer-based circuits.

Abstract: Integrated circuits having single and multiple device modes are described. In a preferred random access memory (RAM) embodiment, a first static RAM (SRAM) 10a having a "by n" input/output (I/O) configuration is fabricated adjacent to a second SRAM 10b having the same I/O configuration. An interconnect scheme 14 spans a single device scribe line 18 that separates SRAM 10a from SRAM 10b, and carries address, timing, and control signals between the adjacent SRAMs (10a and 10b). In the event single SRAMs of a ".times.n" configuration are desired, the wafer is sawed along the single device scribe line 18 severing the interconnect scheme 14. In the event multiple device SRAMs of a ".times.2n" configuration are desired, the wafer is sawed into multiple device dies, and the interconnect scheme kept intact.

Abstract: An apparatus for generating a cell layout representative of a CMOS logic cell. The apparatus includes a pMOS transistor layout generator for generating a first set of layout data representative of a plurality of substantially similar pMOS relatively low strength transistor groups that are oriented along a first direction. The apparatus further includes an nMOS transistor layout generator for generating a second set of layout data representative of a plurality of substantially similar nMOS relatively low strength transistor groups that are also oriented along the first direction.

Abstract: An object of the present invention is to micronize (i.e., reduce the size of) a MOS semiconductor device without reducing the operating speed of the device. An active region for the formation of a transistor has edges defined as the boundaries between the active region and a device separation region. The distance from one edge of the active region, which extends in the direction parallel to a gate width of the transistor, to the other edge decreases as the distance from a gate electrode along the direction of a gate length, which intersects the direction of the gate width increases. Thus, the size of the MOS semiconductor device can be decreased without impairing its speedup.

Abstract: A gate array masterslice having a minimal input/output slot and variable pad pitch architecture is disclosed. In the masterslice, many identical input/output slots ring the periphery of a semiconductor substrate and contain only the special devices necessary for input/output circuits. Each of the input/output slots include (i) a first region containing a plurality of tuning transistors of different sizes, (ii) a second region having one or more PMOS transistors, each of a size greater than any one of the plurality of tuning transistors, (iii) a third region having one or more NMOS transistors, each of a size greater than any one of the plurality of tuning transistors, and (iv) a fourth region containing one or more devices for providing electrostatic discharge protection. One to four PMOS transistors are provided in the second slot region and one to four NMOS transistors are provided in the third slot region.

Abstract: Integrated circuit SRAM cells include a semiconductor substrate having a field region and first, second, third and fourth active regions therein. The first and second active regions each include a horizontal leg and a vertical leg and are mirror images of each other about a vertical axis. The third and fourth active regions each also include a horizontal leg and a vertical leg and are mirror images of each other about a vertical axis. The integrated circuit SRAM cells also include first and second vertically extending gate conductive layers on the semiconductor substrate. The first vertically extending conductive layer extends vertically over the first active region horizontal leg and extends vertically over the third active region horizontal leg. The second vertically extending conductive layer extends vertically over the second active region horizontal leg and extends vertically over the fourth active region horizontal leg.

Abstract: A monolithic integrated circuit utilizing areas associated with unused devices for wiring signal lines, thereby implementing effective wiring and improving high frequency characteristics. A common substrate consisting of a semiconductor substrate, and active devices, capacitor electrodes and resistors formed on the semiconductor substrate, is followed by a dielectric film, a ground metal, a dielectric film whose thickness is equal to or greater than 1 .mu.m, and signal lines. A desired circuit is formed by connecting the signal lines with electrodes of the active devices and other elements via, holes in the dielectric films, and windows of the ground metal. The windows of the ground metal are formed over portions of active devices which are used as components of the circuit.

Abstract: Techniques are provided for protecting the cells of an array against deleterious effects of, for example, photolithography, etching and charge contamination. The cell array is designed to have edge cells modified at layout, or inactive edge cells, or guardrings surrounding the active array to contain the above effects, leaving the active cells highly reliable and with identical behavior.

Abstract: An improved transistor design and methods of construction and testing for same. The novel transistor design method includes the steps of providing a transistor with multiple common gate areas; connecting each gate area to a pad; and adjusting the ratio of the area of the pad to the total of the gate areas to provide a predetermined ratio. The ratio may be adjusted by adjusting the size of the gate, in a single gate implementation, or adjusting the number of gates in a multiple gate configuration. The novel transistor includes a substrate, at least one source disposed on the substrate; at least one drain disposed on the substrate; and at least one gate disposed on the substrate between the source and the drain. The gate has a first layer of at least partially conductive material of area A.sub.g connected to a pad of area A.sub.p. In accordance with the present teachings, the antenna ratio R of the area of the pad A.sub.p to the area of the gate A.sub.g is a predetermined number.

Abstract: A CMOS cell architecture and routing method optimized for three or more interconnect layer cell based integrated circuits such as gate arrays is disclosed. Improved provisioning of routing resources and cell layout optimize routability and significantly reduce cell size. First and second layer interconnect lines are disposed in parallel and are used as both global interconnect lines and interconnect lines internal to the cells. Third layer interconnect lines extend orthogonally to the first two layer interconnects and can freely cross over the cells. Non-rectangular diffusion regions, shared gate electrodes, judicious placement of substrate contact regions, and the provision for an additional small transistor for specific applications are among numerous novel layout techniques that yield various embodiments for a highly compact and flexible cell architecture. The overall result is significant reduction in the size of the basic cell, lower power dissipation, reduced wire impedances, and reduced noise.

Abstract: A semiconductor integrated circuit has a chip check circuit for detecting cracks and other defects in the chip during operation. The chip check circuit extends in the chip from an input terminal to an output terminal so as to scan a predetermined wide area. The chip check circuit has at least one signal line extending near or within a circuit block in the chip so that the signal line can be broken together with the circuit block. The chip check circuit may further comprise one or more inverters, and/or one or more two-wire logic circuits.

Abstract: A MOS transistor structure for an electro-static discharge (ESD) protection circuit of an integrated circuit device. The ESD protection transistor has a structure that comprises a drain diffusion region formed in the silicon substrate of the integrated circuit device, a source diffusion region formed in the silicon substrate, a gate formed in the silicon substrate, and a number of isolated islands evenly distributed throughout the drain diffusion region. The isolated islands provide substantially uniform diffusion resistance between the drain contacts and the gate while increasing the diffusion resistance of the drain region to a level suitable for ESD current protection. The disclosed MOS transistor structure may be fabricated by a salicide technology-based fabrication procedure that is completely compatible with the salicide technology used for the making of the circuitry for the IC device.

Abstract: A base cell design is disclosed, which base cell design includes ten transistor base cell design that includes (1) a first group of four n-type transistors; (2) a second group of four p-type transistors; and (3) a third group of two n-type transistors. The transistors in the first and second groups have substantially the same gate widths, while the transistors of the third group have a substantially smaller gate width. Further, the transistors of the first and second groups all have gates that are aligned in parallel with a first axis, and the transistors of the third group all have gates that are aligned in parallel with a second axis that is substantially perpendicular to the first axis. The first and second groups of transistors each contain at least one set of two transistors which are connected in series and share a source/drain region.

Abstract: A semiconductor device of a memory-macro type can be designed within a short time to have a desired storage capacity, which does not occupy a large area, so as to reduce the chip cost. The semiconductor device includes a memory macro having sub-memory macros, each sub-memory macro having a DRAM memory-cell array, and a row decoder and a column decoder for selecting any desired memory-cell from the memory cell of the array. The memory macro also includes a control-section macro having a DC potential generating circuit for generating various DC potentials required to drive the sub-memory macros. At least one of the sub-memory macros is combined with the control-section macro to form the memory macro as a one-chip memory capable of storing an integral multiple of N bits.

Abstract: Wafer level testing of a wafer (500) is accomplished by dividing the integrated circuits of the wafer into a plurality of segmented bus regions (514, 516, and 518 for example). Each bus region is formed having its own set of test conductors (520-530) wherein each set of test conductors are isolated from all other sets of test conductors on the wafer. Each test conductor has at least one contact pad (531-546) where each contact pad lies within a periphery of the integrated circuits' active areas. By forming pads over ICs and by sub-dividing the bus structure of test conductive lines, more high powered ICs can be tested in a wafer-level manner with fewer problems associated with speed, power, throughput, and routing problems.

Abstract: A semiconductor 110 device includes an array of like base cells wherein each base cell includes at least one source 132 and at least one drain 130 region formed in a semiconductor substrate. At least one gate 126 is formed over and insulated from a channel region 118 which separates the source 132 and drain 130 regions. An insulating layer 190 overlies the structure. A plurality of contacts are formed in the insulating layer in a plurality of substantially parallel; evenly spaced grid lines G1-G5. In addition, at least one additional contact 150 formed between two adjacent ones G2 and G3 of the substantially parallel grid lines is formed. A plurality of interconnect lines 142 and 144 are formed over the insulating layer such that each contact is connected to at least one of the interconnect lines. Modifications, variations, circuit configurations and an illustrative fabrication method are also disclosed.

Abstract: A gate array architecture is disclosed that utilizes significantly less silicon area than the prior art. The core cell includes a four transistor arrangement in which a substrate tap is located adjacent to the transistor pair. This provides for a more "symmetric" cell array than those in the prior art. Through the placement of the taps outside of the transistors the power line connections can be routed in a simple and efficient manner. The architecture includes an extension portion in the contact region of the cell to further reduce wiring complexity. In addition the gate array architecture mirrors pairs of transistor columns to allow for the sharing of substrate taps between pairs of columns. This mirroring feature further reduces routing complexity. The architecture further includes a plurality of probe lines that are located within the architecture to facilitate testability of the outputs of the architecture.

Abstract: In order to improve a withstand voltage and implement a gate array SOI semiconductor integrated circuit device having a large gate width, a region consisting of end cells (49) is provided on each end of a region formed by repeatedly arranging basic cells (BC) consisting of both transistor regions (32, 33) in a first direction and while symmetrically arranging the same to be folded in a second direction. Both ends of a channel region of a PMOS transistor (42) are drawn out in the second direction to provide a P-type semiconductor layer just under a field shielding gate electrode (FG), and this semiconductor layer is drawn also in the first direction to be connected with a P-type semiconductor layer of the end cell (49). A first source potential is applied to a region (PBD) which is bonded with one of the P-type semiconductor layers.

Abstract: Customizable semiconductor devices, integrated circuit gate arrays and techniques to produce same are disclosed. The devices comprise integrated circuit blanks having a collection of semiconductor elements and at least one metal layer including fusible links interconnecting said collection of semiconductor elements into an inoperably connected integrated circuit blank. At least one metal layer is first etched thereby to define a pattern of conductors. A passivation layer is provided over at least one metal layer, afterwhich at least one metal layer is etched a second time for selectably removing the fusible links, thereby converting the inoperable integrated circuit blank into a selected operable electronic function.

Abstract: The absolute value of the threshold voltage of a P-channel TFT is reduced by making its channel length shorter than that of an N-channel TFT by at least 20%, to thereby approximately equalize the threshold voltage absolute values of those TFTs.

Abstract: The invention provides a semiconductor integrated circuit including a substrate, and a plurality of block cells arranged on the substrate and including a plurality of basic cells. Each of the basic cells includes a plurality of CMOS transistors. At least one of the CMOS transistors is an asymmetrical one in which one of a source diffusion layer or a drain diffusion layer has a lightly doped drain (LDD) structure or a deep doped drain (DDD) structure.