Abstract: A semiconductor device and a method of fabricating a semiconductor device, the device including a fin-type pattern extending in a first direction; a gate electrode extending in a second direction over the fin-type pattern, the second direction being different from the first direction; spacers on sidewalls of the gate electrode; a capping structure on the gate electrode and the spacers, the capping structure including a first capping pattern and a second capping pattern, the second capping pattern being on the first capping pattern; and an interlayer insulating film surrounding sidewalls of each of the spacers and sidewalls of the capping structure, the interlayer insulating film being in contact with the first capping pattern.

Abstract: A device includes gates and a first conductive segment. A first distance is present between a first gate of the gates and the first conductive segment. A second distance is present between a second gate of the gates and the first conductive segment. The first distance is greater than the second distance.

Abstract: An integrated circuit has a P-type substrate and an N-type LDMOS transistor. The LDMOS transistor includes a boron-doped diffused well (DWELL-B) and an arsenic-doped diffused well (DWELL-As) located within the DWELL-B. A first polysilicon gate having first sidewall spacers and a second polysilicon gate having second sidewall spacers are located over opposite edges of the DWELL-B. A source/IBG region includes a first source region adjacent the first polysilicon gate, a second source region adjacent the second polysilicon gate, and an integrated back-gate (IBG) region located between the first and second source regions. The first source region and the second source region each include a lighter-doped source sub-region, the IBG region including an IBG sub-region having P-type dopants, and the source/IBG region includes a heavier-doped source sub-region.

Abstract: The present disclosure provides a semiconductor device structure in accordance with some embodiments. In some embodiments, the semiconductor device structure includes a semiconductor substrate of a first semiconductor material and having first recesses. The semiconductor device structure further includes a first gate stack formed on the semiconductor substrate and being adjacent the first recesses. In some examples, a passivation material layer of a second semiconductor material is formed in the first recesses. In some embodiments, first source and drain (S/D) features of a third semiconductor material are formed in the first recesses and are separated from the semiconductor substrate by the passivation material layer. In some cases, the passivation material layer is free of chlorine.

Abstract: A method of fabricating a semiconductor device includes: forming a first transistor including: forming a plurality of lightly doped regions in a substrate; forming a first gate structure on the substrate, the first gate structure covering portions of the plurality of lightly doped regions and a portion of the substrate; forming first spacers on sidewalls of the first gate structure; forming doped region in the lightly doped regions; forming an etching stop layer on the substrate; patterning the etching stop layer and the first gate structure to form a second gate structure, and to form a plurality of trenches between the second gate structure and the first spacers; and forming a first dielectric layer on the substrate to cover the etching stop layer and fill the plurality of trenches. The first dielectric layer filled in the trenches is used as virtual spacers.

Abstract: A thin film transistor, a manufacturing method thereof, an array substrate and an electronic device are disclosed. The manufacturing method of the thin film transistor includes: forming an active layer pattern on a base substrate; forming a gate insulating layer on the active layer pattern; the gate insulating layer includes a first portion, a second portion and a third portion, the third portion is on both sides of the first portion, the second portion is between the first portion and the third portion on at least one side, and the thickness of the second portion is larger than that of the third portion.

Abstract: An integrated circuit comprising an n-type drift region, a gate structure directly on a first portion of the n-type drift region, a drain structure formed in a second portion of the n-type drift region, the gate structure and the drain structure being separated by a drift region length, a resist protective oxide (RPO) formed over a portion of the n-type drift region between the gate structure and the drain structure, a field plate contact providing a direct electrical connection to the resist protective oxide.

Abstract: A transistor is produced by forming a first part of a first region of the transistor in a semiconductor substrate by implanting dopants through an opening in an isolating trench formed at an upper surface of the semiconductor substrate. A second region of the transistor in the opening by epitaxy.

Abstract: A semiconductor structure and a method for forming same are provided.

Abstract: Disclosed is an LDMOS device comprising a drift region formed by a selected area of a doped layer of a first conductivity type on a semiconductor substrate, a gate structure comprising a gate dielectric layer and a gate conductive layer which are sequentially formed on a surface of the doped layer of the first conductivity type, a doped self-aligned channel region of a second conductivity type, and a doped layer formed by tilted ion implantation with a first side face of the gate structure as a self-alignment condition. A method for manufacturing an LDMOS device is further disclosed. The channel length is not affected by lithography and thus can be minimized to fulfill an ultralow specific-on-resistance, and the distribution uniformity of the channel length can be improved, so that the performance uniformity of the device is improved.

Abstract: A high-voltage semiconductor device includes a semiconductor substrate having a first conductivity type. A first well region is disposed on the semiconductor substrate and has the first conductivity type. A second well region is adjacent to the first well region and has a second conductivity type opposite to the first conductivity type. A first source region and a first drain region is respectively disposed in the first well region and the second well region, wherein the first source region and the first drain region has the second conductivity type. A first gate structure is disposed on the first well region and the second well region, and a buried layer is disposed in the semiconductor substrate and has the first conductivity type, wherein the buried layer is overlapped with the first well region and the second well region, and the buried layer is directly below the first source region.

Abstract: A light emitting device package includes a cell array having a first surface and a second surface located opposite to the first surface and including, on a portion of a horizontal extension line of the first surface, semiconductor light emitting units each including a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer sequentially located on a layer surface including a sidewall of the first conductivity type semiconductor layer; wavelength converting units corresponding respectively to the semiconductor light emitting units and each arranged corresponding to the first conductivity type semiconductor layer; a barrier structure arranged between the wavelength converting units corresponding to the cell array; and switching units arranged in the barrier structure and electrically connected to the semiconductor light emitting units.

Abstract: A lateral DMOS having a well region, a source region, a drain region, a first gate region and a second gate region. The first gate region may be positioned atop a portion of the well region near the source region side. The second gate region may be formed in a portion of the well region near the drain region side. The second gate region includes a shallow trench isolation structure formed in a shallow trench opened from a top surface of the well region and extended vertically into the well region, and having a first sidewall contacting with the drain region or abut the drain region, and further having a second sidewall opposite to the first sidewall and laterally extended below the first gate region.

Abstract: A semiconductor device includes a substrate including an active region extending in a first direction; a gate structure intersecting the active region and extending in a second direction on the substrate, the gate structure including a gate electrode, a gate capping layer on the gate electrode, and a plurality of spacers on side surfaces of the gate electrode; source/drain regions on the active region on at least one side of the gate structure; a first insulating layer and a second insulating layer on the source/drain regions on at least one side of the gate structure; and contact plugs on the source/drain regions and penetrating the first and second insulating layers.

Abstract: A semiconductor device may include a substrate and a hyper-abrupt junction region carried by the substrate. The hyper-abrupt region may include a first semiconductor layer having a first conductivity type, a first superlattice layer on the first semiconductor layer, a second semiconductor layer on the first superlattice layer and having a second conductivity type different than the first conductivity type, and a second superlattice layer on the second semiconductor layer. The semiconductor device may further include a gate dielectric layer on the second superlattice layer of the hyper-abrupt junction region, a gate electrode on the gate dielectric layer, and spaced apart source and drain regions adjacent the hyper-abrupt junction region.

Abstract: In some embodiments, a sensor is provided. The sensor includes a microelectromechanical systems (MEMS) substrate disposed over an integrated chip (IC), where the IC defines a lower portion of a first cavity and a lower portion of a second cavity, and where the first cavity has a first operating pressure different than an operating pressure of the second cavity. A cap substrate is disposed over the MEMS substrate, where a first pair of sidewalls of the cap substrate partially define an upper portion of the first cavity, and a second pair of sidewalls of the cap substrate partially define an upper portion of the second cavity. A sensor area comprising a movable portion of the MEMS substrate and a dummy area comprising a fixed portion of the MEMS substrate are both disposed in the first cavity. A pressure enhancement structure is disposed in the dummy area.

Abstract: Implementations of the present disclosure generally relate to methods and apparatuses for epitaxial deposition on substrate surfaces. More particularly, implementations of the present disclosure generally relate to an integrated system for processing N-type metal-oxide semiconductor (NMOS) devices. In one implementation, a cluster tool for processing a substrate is provided. The cluster tool includes a pre-clean chamber, an etch chamber, one or more pass through chambers, one or more outgassing chambers, a first transfer chamber, a second transfer chamber, and one or more process chambers. The pre-clean chamber and the etch chamber are coupled to a first transfer chamber. The one or more pass through chambers are coupled to and disposed between the first transfer chamber and the second transfer chamber. The one or more outgassing chambers are coupled to the second transfer chamber. The one or more process chambers are coupled to the second transfer chamber.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a first well region, a second well region, an isolation structure, and a gate structure. The first well region is disposed in the substrate. The second well region is disposed in the substrate. The second well region is adjoining the first well region. The isolation structure is disposed in the first well region. The gate structure is disposed on the substrate. The gate structure includes a first gate portion and a second gate portion. The first gate portion overlaps the first well region and the second well region. There is an opening between the first gate portion and the second gate portion exposing a portion of the isolation structure.

Abstract: A semiconductor device includes: a first gate structure on a substrate; a first drain region having a first conductive type adjacent to one side of the first gate structure; a source region having the first conductive type adjacent to another side of the first gate structure; and a first body implant region having a second conductive type under part of the first gate structure.

Abstract: A semiconductor device includes: a substrate including a first region and a second region; a first gate stack on the first region of the substrate; a first source/drain contact at a first side of the first gate stack, wherein the first source/drain contact is connected to the substrate; a second gate stack on the second region of the substrate; and a second source/drain contact at a first side of the second gate stack, wherein the second source/drain contact is connected to the substrate, wherein a height of the second source/drain contact is greater than a height of the first source/drain contact, and wherein a width of the second source/drain contact is greater than a width of the first source/drain contact.

Abstract: A method for making a semiconductor device may include forming spaced apart first and second doped regions in a substrate. The first doped region may be larger than the second doped region to define an asymmetric channel therebetween. The method may further include forming a superlattice extending between the first and second doped regions to constrain dopant therein. The superlattice may include a plurality of stacked groups of layers, with each group of layers comprising a plurality of stacked base semiconductor monolayers defining a base semiconductor portion, and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions. The method may also include forming a gate overlying the asymmetric channel.

Abstract: A device includes gates and a first conductive segment. A first distance is present between a first gate of the gates and the first conductive segment. A second distance is present between a second gate of the gates and the first conductive segment. The first distance is greater than the second distance.

Abstract: The disclosure provides for a transistor which may include: a gate stack on a substrate, the gate stack including a gate dielectric and a gate electrode over the gate dielectric; a channel within the substrate and under the gate stack; a doped source and a doped drain on opposing sides of the channel, the doped source and the doped drain each including a dopant, wherein the dopant and the channel together have a first coefficient of diffusion and the doped source and the doped drain each have a second coefficient of diffusion; and a doped extension layer separating each of the doped source and the doped drain from the channel, the doped extension layer having a third coefficient of diffusion, wherein the third coefficient of diffusion is greater than the first coefficient of diffusion and the second coefficient of diffusion is less than the third coefficient of diffusion.

Abstract: A method is provided for producing a microelectronic component on a substrate including in an exposed manner on a first face thereof, an active zone and an electrical isolation zone adjacent thereto, the method including forming a gate on the active zone, forming spacers each configured to cover a surface of a different edge of the gate, and forming source and drain zones by doping portions of the active zone adjacent to the gate, the method successively including forming a first layer of spacer material above the active zone and the electrical isolation zone; an ion implantation to produce doping of the portions through the first layer; removing a modified portion of the first layer disposed overlooking the portions, the modified portion coming from the ion implantation, the removing being configured to preserve at least part of the first layer at a level of edges of the gate.

Abstract: A manufacturing process of a DMOS device in a drift region in a semiconductor substrate, having: forming a polysilicon layer above the drift region; forming a block layer above the polysilicon layer; etching both the block layer and the polysilicon layer, through a window of a first masking layer to expose a window to the drift region; implanting dopants through the window to the drift region to form a body region; forming blocking spacers to wrap side walls of the polysilicon layer; implanting dopants into the body region under a window shaped by the blocking spacers to form a body pickup region; etching away the blocking spacers; performing a masking step to form gates; forming ONO spacers to wrap side walls of the gates; and performing a masking step to form source regions and drain pickup regions.

Abstract: Various embodiments of the present disclosure are directed towards a varactor comprising a reduced surface field (RESURF) region. In some embodiments, the varactor includes a drift region, a gate structure, a pair of contact regions, and a RESURF region. The drift region is within a substrate and has a first doping type. The gate structure overlies the drift region. The contact regions are within the substrate and overlie the drift region. Further, the contact regions have the first doping type. The gate structure is laterally sandwiched between the contact regions. The RESURF region is in the substrate, below the drift region, and has a second doping type. The second doping type is opposite the first doping type. The RESURF region aids in depleting the drift region under the gate structure, which decreases the minimum capacitance of the varactor and increases the tuning range of the varactor.

Abstract: A bit line driver device includes a semiconductor substrate and at least one isolation structure disposed in the semiconductor substrate. Active regions are defined in the semiconductor substrate by the at least one isolation structure. Each of the active regions is elongated in a first direction, and two of the active regions are disposed adjacent to each other in a second direction. Each of the active regions includes a first portion, a second portion, and a third portion. The third portion is disposed between the first portion and the second portion in the first direction. A width of the third portion is smaller than a width of the first portion and a width of the second portion. The distance between the two adjacent active regions may be increased by the third portions accordingly.

Abstract: Techniques are disclosed for forming a transistor with one or more additional spacers, or inner-gate spacers, as referred to herein. The additional spacers may be formed between the gate and original spacers to reduce the parasitic coupling between the gate and the source/drain, for example. In some cases, the additional spacers may include air gaps and/or dielectric material (e.g., low-k dielectric material). In some cases, the gate may include a lower portion, a middle portion, and an upper portion. In some such cases, the lower and upper portions of the gate may be wider between the original spacers than the middle portion of the gate, which may be as a result of the additional spacers being located between the middle portion of the gate and the original spacers. In some such cases, the gate may approximate an I-shape, C-shape, -shape, ?-shape, L-shape, or ?-shape, for example.

Abstract: Transistors may be manufactured with a shared drain to reduce die area consumed by circuitry. In one example, two transistors can be manufactured that include two body regions that abut a shared drain region. The two transistors can be independently operated by coupling terminals to a source and a gate for each transistor and the shared drain. Characteristics of the two transistors can be controlled by adjusting feature sizes, such as overlap between the gate and the shared drain for a transistor. In particular, two transistors with different voltage requirements can be manufactured using a shared drain structure, which can be useful in amplifier circuitry and in particular Class-D amplifiers.

Abstract: A semiconductor device includes a substrate and a conducting structure. The substrate has a first conductivity type and includes a first isolation region, a first implant region, and a second implant region. The first isolation region is disposed along the circumference of the substrate. The first implant region has the first conductivity type, and the second implant region has a second conductivity type that is the opposite of the first conductivity type. The conducting structure is disposed on the substrate, and at least a portion of the conducting structure is located on the first isolation region.

Abstract: A method for making a semiconductor device may include forming a trench in a semiconductor substrate, and forming a superlattice liner covering bottom and sidewall portions of the trench. The superlattice liner may include a plurality of stacked groups of layers, with each group of layers including a plurality of stacked base semiconductor monolayers defining a base semiconductor portion, and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions. The method may further include forming a semiconductor cap layer on the superlattice liner and having a dopant constrained therein by the superlattice liner, and forming a conductive body within the trench.

Abstract: A semiconductor device includes a substrate, a core device disposed above the substrate, and an input/output (I/O) device disposed above the substrate. The core device includes a first gate electrode having a bottom surface and a sidewall that define a first interior angle therebetween. The first interior angle is an obtuse angle. The I/O device includes a second gate electrode having a bottom surface and a sidewall that define a second interior angle therebetween. The second interior angle is greater than the first interior angle.

Abstract: In some examples, a transistor includes a first well doped with a first-type dopant having a first concentration. The transistor also includes a gate oxide layer on a portion of the first well and a gate layer on the gate oxide layer. The transistor further includes a first segment of a second well doped with the first-type dopant having a second concentration, the first segment underlapping a first portion of the gate layer. The transistor also includes a source region doped with a second-type dopant having a third concentration, the source region in the first segment. The transistor further includes a drain region doped with the second-type dopant having a concentration that is substantially the same as the third concentration.

Abstract: A method of fabricating a semiconductor device. A cell area and a core area is defined in a substrate. A bit line structure disposed in the cell area is provided. A gate structure disposed in the core area is provided, and a core capping film disposed on the gate structure is provided. A height of the core capping film is greater than a height of the bit line structure. A first contact film is formed on the bit line structure. A second contact film is formed on the core capping film. A mask is formed on the first contact film. An upper surface of the core capping film is exposed using the mask. The first contact film is etched until a height of the first contact film becomes less than a height of the bit line structure using an etching process. In the etching process, an etching rate for the first contact film is greater than etching rates for the bit line structure and the core capping film.

Abstract: A semiconductor device may include a semiconductor substrate having a trench therein, and a superlattice liner at least partially covering bottom and sidewall portions of the trench. The superlattice liner may include a plurality of stacked groups of layers, with each group of layers including a plurality of stacked base semiconductor monolayers defining a base semiconductor portion, and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions. The semiconductor device may further include a semiconductor cap layer on the superlattice liner and having a dopant constrained therein by the superlattice liner, and a conductive body within the trench.

Abstract: A vertical transistor structure is provided that includes a bottom source/drain structure that includes a doped semiconductor buffer layer that contains a first dopant species having a first diffusion rate, and an epitaxial doped semiconductor layer that contains a second dopant species that has a second diffusion rate that is less than the first diffusion rate. During a junction anneal, the first dopant species readily diffuses from the doped semiconductor buffer layer into a pillar portion of a base semiconductor substrate to provide the bottom source/drain extension and bottom source/drain junction. No diffusion overrun is observed. During the junction anneal, the second dopant species remains in the epitaxial doped semiconductor layer providing a low resistance contact. The second dopant species does not interfere with the bottom source/drain extension and bottom source/drain junction due to limited diffusion of the second dopant species.

Abstract: A latch circuit including: a first inverter having a first pull-up transistor connected between a first power supply node and a first output node, and a first pull-down transistor connected between a second power supply node and the first output node; a second inverter having a second pull-up transistor connected between the first power supply node and a second output node, and a second pull-down transistor connected between the second power supply node and the second output node; a first current control transistor connected between the first pull-up transistor and the first output node; a second current control transistor connected between the second pull-up transistor and the second output node; a third current control transistor connected between the first pull-down transistor and the first output node; and a fourth current control transistor connected between the second pull-down transistor and the second output node.

Abstract: A gate driver integrated circuit is provided. The gate driver integrated circuit includes a substrate having a drift region of a first doping type therein, and a field effect transistor including a drain region of the first doping type, a source region of the first doping type, and a gate structure. The gate driver integrated circuit also includes a first well region of a second doping type and a first contact region of the second doping type. Each of the first well region and the drain region is formed in the drift region, the source region is formed in the first well region, and an end portion of the gate structure near the source region covers a portion of the first well region. Further, the gate driver integrated circuit includes a field plate structure formed on the substrate and disposed between the source region and the drain region.

Abstract: A device includes gates and a first conductive segment. A first distance is present between a first gate of the gates and the first conductive segment. A second distance is present between a second gate of the gates and the first conductive segment. The first distance is greater than the second distance.

Abstract: In-situ low pressure chamber cleans and gas nozzle apparatus for plasma processing systems employing in-situ deposited chamber coatings. Certain chamber clean embodiments for conductor etch applications include an NF3-based plasma clean performed at pressures below 30 mT to remove in-situ deposited SiOx coatings from interior surfaces of a gas nozzle hole. Embodiments include a gas nozzle with bottom holes dimensioned sufficiently small to reduce or prevent the in-situ deposited chamber coatings from building up a SiOx deposits on interior surfaces of a nozzle hole.

Abstract: A semiconductor device is provided. The semiconductor device includes a substrate, an oxide layer disposed over the substrate, and a first epitaxial layer disposed over the oxide layer. The first epitaxial layer has the first conductivity type. The semiconductor device also includes a second epitaxial layer disposed over the first epitaxial layer and a third epitaxial layer disposed over the second epitaxial layer. The second epitaxial layer has a second conductivity type that is opposite to the first conductivity type. The third epitaxial layer has the first conductivity type.

Abstract: A semiconductor device according to one embodiment comprises a first transistor, a second transistor, a switch, and a first control circuit. The first transistor including, one end of a current path connected to a first node, another end of the current path connected to a second node, and a gate connected to a third node. The second transistor including, one end of a current path connected to the second node, another end of the current path connected to a fourth node, and a gate connected to the third node. The switch configured to connect the second node and the third node. The first control circuit configured to control the switch.

Abstract: The present disclosure generally relates to semiconductor structures and, more particularly, to middle of line structures and methods of manufacture. The structure includes: a plurality of gate structures comprising source and/or drain metallization features; spacers on sidewalls of the gate structures and composed of a first material and a second material; and contacts in electrical contact with the source and/or drain metallization features, and separated from the gate structures by the spacers.

Abstract: A power semiconductor device includes a drain region and a source region disposed on a substrate, a gate insulating layer and a gate electrode disposed on the substrate and disposed between the drain region and the source region, a protection layer in contact with a top surface of the substrate and a top surface of the gate electrode, a source contact plug connected to the source region, a drain contact plug connected to the drain region, and a field plate plug in contact with the protection layer, wherein a width of the field plate plug is greater than a width of the source contact plug or a width of the drain contact plug.

Abstract: A p-type metal oxide semiconductor field effect transistor (PFET) includes a p-type silicon substrate and an n-type well formed in the p-type silicon substrate. The PFET also comprises a p-type source formed in the n-type well, a p-type drain formed in the n-type well, and dual pockets implanted in the n-type well and coupled to the source and drain. The dual pockets comprise a first pocket with first arsenic n-type dopants and a second pocket with second arsenic n-type dopants.

Abstract: A semiconductor package includes a leadframe having an electrically conductive paddle, electrically conductive perimeter package leads, a first electrically conductive clip electrically connected to a first set of the package leads, and a second electrically conductive clip electrically connected to a second set of the package leads. The semiconductor package includes a single semiconductor die. The die includes a front-side active layer having an integrated power structure of two or more transistors. The die includes a backside portion having a backside contact electrically coupled to at least one of the two or more transistors and to the paddle. One or more first front-side contacts of the die are electrically coupled to at least one of the transistors and to the first clip, and one or more second front-side contacts of the die are electrically coupled to at least one of the transistors and to the second clip.

Abstract: In a method for manufacturing a semiconductor device, a gate structure is formed over a channel layer and an isolation insulating layer. A first sidewall spacer layer is formed on a side surface of the gate structure. A sacrificial layer is formed so that an upper portion of the gate structure with the first sidewall spacer layer is exposed from the sacrificial layer and a bottom portion of the gate structure with the first sidewall spacer layer is embedded in the first sacrificial layer. A space is formed between the bottom portion of the gate structure and the sacrificial layer by removing at least part of the first sidewall spacer layer. After the first sidewall spacer layer is removed, an air gap is formed between the bottom portion of the gate structure and the sacrificial layer by forming a second sidewall spacer layer over the gate structure.

Abstract: A vertical transistor is described that uses a through silicon via as a gate. In one example, the structure includes a substrate, a via in the substrate, the via being filled with a conductive material and having a dielectric liner, a deep well coupled to the via, a drain area coupled to the deep well having a drain contact, a source area between the drain area and the via having a source contact, and a gate contact over the via.

Abstract: An integrated circuit which includes a field-plated FET is formed by forming a first opening in a layer of oxide mask, exposing an area for a drift region. Dopants are implanted into the substrate under the first opening. Subsequently, dielectric sidewalls are formed along a lateral boundary of the first opening. A field relief oxide is formed by thermal oxidation in the area of the first opening exposed by the dielectric sidewalls. The implanted dopants are diffused into the substrate to form the drift region, extending laterally past the layer of field relief oxide. The dielectric sidewalls and layer of oxide mask are removed after the layer of field relief oxide is formed. A gate is formed over a body of the field-plated FET and over the adjacent drift region. A field plate is formed immediately over the field relief oxide adjacent to the gate.

Abstract: A semiconductor device includes a substrate having an active pattern thereon, a gate electrode intersecting the active pattern, and a spacer on a sidewall of the gate electrode. The gate electrode includes a first metal pattern adjacent to the active pattern. The first metal pattern has a first portion parallel to the sidewall and a second portion parallel to the substrate. A top surface of the first portion has a descent in a direction from the spacer towards the second portion.