Abstract: In one example, an electronic device includes a semiconductor sensor device having a cavity extending partially inward from one surface to provide a diaphragm adjacent an opposite surface. A barrier is disposed adjacent to the one surface and extends across the cavity, the barrier has membrane with a barrier body and first barrier strands bounded by the barrier body to define first through-holes. The electronic device further comprises one or more of a protrusion pattern disposed adjacent to the barrier structure, which can include a plurality of protrusion portions separated by a plurality of recess portions; one or more conformal membrane layers disposed over the first barrier strands; or second barrier strands disposed on and at least partially overlapping the first barrier strands. The second barrier strands define second through-holes laterally offset from the first through-holes. Other examples and related methods are also disclosed herein.

Abstract: A MEMS device and a method of manufacturing the same are provided. A semiconductor device includes a substrate; and a membrane over the substrate and configured to generate charges in response to an acoustic wave, the membrane being in a polygonal shape including vertices. The membrane includes a via pattern includes: first lines that partition the membrane into slices and extend to the vertices of the membrane such that the slices are separated from each other near an anchored region of the membrane and connected to each other around a central region; and second lines extending from the anchored region of the membrane toward the central region of the membrane, each of the first lines or each of the second lines including non-straight lines.

Abstract: A surface acoustic wave resonator device and method for manufacturing the same, and filter, the surface acoustic wave resonator device includes an interdigital electrode body region, and including: a piezoelectric substrate; a first interdigital electrode, a first interdigital electrode connection part and a first interdigital electrode lead-out part electrically connected to each other; a second interdigital electrode, a second interdigital electrode connection part and a second interdigital electrode lead-out part electrically connected to each other; and a spanning structure; wherein the first and second interdigital electrode connection parts are respectively located on opposite sides of the interdigital electrode body region; the first interdigital electrode connection part contacts the first interdigital electrode and is electrically isolated from the second interdigital electrode through the spanning structure; the second interdigital electrode connection part contacts the second interdigital electrode

Abstract: The present disclosure may provide a microphone. The microphone may include: a shell structure and a vibration pickup portion, wherein the vibration pickup portion may generate vibration in response to vibration of the shell structure; the vibration transmission portion may be configured to transmit the vibration generated by the vibration pickup portion; and an acoustic-electric conversion component configured to receive the vibration transmitted by the vibration transmission portion to generate an electrical signal, wherein the vibration transmission portion and at least a portion of vibration pickup portion may form a vacuum cavity, and the acoustic-electric conversion component may be located in the vacuum cavity.

Abstract: A microelectromechanical apparatus includes a base and a thin film including a stationary part disposed on the base, a peripheral part, a central part surrounded by the peripheral part, and a first and second elastic part. The first elastic part is connected to the stationary part and the peripheral part. The second elastic part is connected to the peripheral part and the central part. When low frequency signal is input to a first electrode of the first elastic part, the peripheral part and the and the central part respectively vibrate with a first and second low-frequency amplitudes. When high-frequency signal is input to a second electrode of the second elastic part, the peripheral part and the central part respectively vibrate with a first and second high-frequency amplitudes. A difference between the first and second low-frequency amplitudes is smaller than a difference between the first and second high-frequency amplitudes.

Abstract: A design process is used for designing a device comprising a plurality of micro-machined elements, each comprising a flexible membrane, the elements being arranged in a plane in a determined topology. The design process comprises a step of defining the determined topology so that it has a character compatible with a generic substrate having cavities, the characteristics of which are pre-established. Each flexible membrane of the micro-machined elements is associated with one cavity of the generic substrate. The present disclosure also relates to a fabrication process for fabricating a device comprising a plurality of micro-machined elements, and to this device itself, wherein only some of the pairs of cavities and flexible membranes are configured to form a set of functional micro-machined elements.

Abstract: In examples, a device comprises a semiconductor die, a thin-film layer, and an air cavity positioned between the semiconductor die and the thin-film layer. The air cavity comprises a resonator positioned on the semiconductor die. A rib couples to a surface of the thin-film layer opposite the air cavity.

Abstract: A semiconductor package including a core structure, in which a first and second semiconductor chips and passive components are embedded, a connection structure disposed on a first side of the core structure, and including a redistribution layer electrically connected to the first and second semiconductor chips and the passive components, and a metal pattern layer and a backside wiring layer disposed on a second side of the core structure opposing the first side, and spaced apart from each other. The core structure includes a first metal layer surrounding the first semiconductor chip, a second metal layer surrounding the first semiconductor chip, and the first metal layer, a third metal layer surrounding the second semiconductor chip, and a fourth metal layer surrounding the second semiconductor chip, the passive components, and the third metal layer, and each of the first to fourth metal layers is electrically connected to the metal pattern layer.

Abstract: A backplate assembly for a condenser microphone. The backplate may be coated with a parylene configured to help reduce the flatness deviation of the backplate across the diameter of the backplate. A plurality of openings may extend from the top portion of the backplate to the bottom portion of the backplate.

Abstract: A semiconductor die package and a method of forming the same are provided. The semiconductor die package includes a package substrate and a semiconductor device disposed over the package substrate. A ring structure is disposed over the package substrate and laterally surrounds the semiconductor device. The ring structure includes a lower ring portion arranged around the periphery of the package substrate. Multiple notches are formed along the outer periphery of the lower ring portion. The ring structure also includes an upper ring portion integrally formed on the lower ring portion. The upper ring portion laterally extends toward the semiconductor device, so that the inner periphery of the upper ring portion is closer to the semiconductor device than the inner periphery of the lower ring portion. An adhesive layer is interposed between the lower ring portion and the package substrate.

Abstract: Micromachined ultrasonic transducers having pressure ports are described. The micromachined ultrasonic transducers may comprise flexible membranes configured to vibrate over a cavity. The cavity may be sealed, in some instances by the membrane itself. A pressure port may provide access to the cavity, and thus control of the cavity pressure. In some embodiments, an ultrasound device including an array of micromachined ultrasonic transducers is provided, with pressure ports for at least some of the ultrasonic transducers. The pressure ports may be used to control pressure across the array.

Abstract: Various embodiments of the present disclosure are directed towards an electronic device that comprises a semiconductor substrate having a first surface opposite a second surface. The semiconductor substrate at least partially defines a cavity. A first microelectromechanical systems (MEMS) device is disposed along the first surface of the semiconductor substrate. The first MEMS device comprises a first backplate and a diaphragm vertically separated from the first backplate. A second MEMS device is disposed along the first surface of the semiconductor substrate. The second MEMS device comprises spring structures and a moveable element. The spring structures are configured to suspend the moveable element in the cavity. A segment of the semiconductor substrate continuously laterally extends from under a sidewall of the first MEMS device to under a sidewall of the second MEMS device.

Abstract: A method of forming a monolithic integrated PMUT and CMOS with a coplanar elastic, sealing, and passivation layer in a single step without bonding and the resulting device are provided. Embodiments include providing a CMOS wafer with a metal layer; forming a dielectric over the CMOS; forming a sacrificial structure in a portion of the dielectric; forming a bottom electrode; forming a piezoelectric layer over the CMOS; forming a top electrode over portions of the bottom electrode and piezoelectric layer; forming a via through the top electrode down to the bottom electrode and a second via down to the metal layer through the top electrode; forming a second metal layer over and along sidewalls of the first and second via; removing the sacrificial structure, an open cavity formed; and forming a dielectric layer over a portion of the CMOS, the open cavity sealed and an elastic layer and passivation formed.

Abstract: Provided is a MEMS device. The MEMS device includes: substrate having back cavity passing through; diaphragm connected to the substrate and covers the back cavity, the diaphragm comprises first and second membranes, and accommodating space is formed between the first and second membranes; supports arranged in the accommodating space, and opposite ends of the support are connected to the first and second membranes; counter electrode arranged in the accommodating space, the first and second membranes each include conductive and second regions, ventilation slots are annularly spaced on the diaphragm along circumferential direction and penetrate through the first and second membranes, the electrode region extends from center of the first and second membranes toward but does not reach the ventilation slots. Through design of the first and second membranes and the electrode region, sensitivity of the microphone is increased.

Abstract: Provided is an MEMS device, including: a base, a rear cavity; a vibrating diaphragm, the vibrating diaphragm including an upper diaphragm and a lower diaphragm, and an accommodation space being formed between the upper and lower diaphragms; a counter electrode arranged in the accommodation space; and supporting members concentrically arranged and spaced apart. The supporting members are arranged between the upper and lower diaphragms and are spaced apart from the counter electrode, two opposite ends of each supporting member are connected to the upper and lower diaphragms, and at least one of the supporting members is provided with first cavities. An upper ventilation hole and a lower ventilation hole are respectively formed at a position of the upper diaphragm and a position of the lower diaphragm corresponding to one of the first cavities; and the upper ventilation hole, the first cavity and the lower ventilation hole communicate with each other.

Abstract: A MEMS device is provided. The MEMS device includes a substrate having at least one contact, a first dielectric layer disposed on the substrate, at least one metal layer disposed on the first dielectric layer, a second dielectric layer disposed on the first dielectric layer and the metal layer and having a recess structure, and a structure layer disposed on the second dielectric layer and having an opening. The opening is disposed on and corresponds to the recess structure, and the cross-sectional area at the bottom of the opening is smaller than the cross-sectional area at the top of the recess structure. The MEMS device also includes a sealing layer, and at least a portion of the sealing layer is disposed in the opening and the recess structure. The second dielectric layer, the structure layer, and the sealing layer define a chamber.

Abstract: The present disclosure discloses a MEMS speaker including a housing with a receiving space; a MEMS speaker chip with an inner cavity, accommodated in the receiving space and connected with the housing, the MEMS speaker chip dividing the receiving space into a first cavity and a second cavity communicating with the inner cavity; a sound hole communicating with the first cavity or the second cavity; and a damping mesh connected to the housing and covering the sound hole; wherein sounds emitted by the MEMS speaker chip transmit outward through the sound hole and the damping mesh. Compared with the related art, MEMS speaker disclosed by the present disclosure has a better reliability.

Abstract: In one example, an electronic device includes a semiconductor sensor device having a cavity extending partially inward from one surface to provide a diaphragm adjacent an opposite surface. A barrier is disposed adjacent to the one surface and extends across the cavity, the barrier has membrane with a barrier body and first barrier strands bounded by the barrier body to define first through-holes. The electronic device further comprises one or more of a protrusion pattern disposed adjacent to the barrier structure, which can include a plurality of protrusion portions separated by a plurality of recess portions; one or more conformal membrane layers disposed over the first barrier strands; or second barrier strands disposed on and at least partially overlapping the first barrier strands. The second barrier strands define second through-holes laterally offset from the first through-holes. Other examples and related methods are also disclosed herein.

Abstract: The present invention provides a MEMS microphone, including: a base with a back cavity; and an electric capacitance system arranged on the base. The electric capacitance system includes a back plate, a first diaphragm and a second diaphragm opposite to the back plate and arranged on an upper and lower sides of the back plate. The MEMS microphone further includes an insulation layer isolating the base, the back plate, the first diaphragm and the second diaphragm, and a sealing space formed between the first diaphragm and the second diaphragm. The pressure in the sealing space is equal to an external pressure.

Abstract: The provides a method for fabricating a semiconductor device including performing a bonding process to bond a second die onto a first die including a pad layer, forming a through-substrate opening along the second die and extending to the pad layer in the first die, conformally forming an isolation layer in the through-substrate opening, performing a punch etch process to remove a portion of the isolation layer and expose a portion of a top surface of the pad layer, performing an isotropic etch process to form a recessed space extending from the through substrate opening and in the pad layer, conformally forming a barrier layer in the through-substrate opening and the recessed space, and forming a filler layer in the through-substrate opening and the recessed space.

Abstract: The application relates to structures, e.g. substrates for supporting semiconductor die. The substrate defines a frame which lateral surrounds one or more die and is provided in contact with at least one side surface of the die, wherein the frame defines upper and lower surfaces of the substrate.

Abstract: Provided is a sensor interface including a first cantilever beam bundle including at least one resonator and a first output terminal, a second cantilever beam bundle including at least one resonator and a second output terminal, and a differential amplifier including a first input terminal electrically connected to the first output terminal of the first cantilever beam bundle and a second input terminal electrically connected to the second output terminal of the second cantilever beam bundle.

Abstract: A MEMS device and a method of manufacturing the same are provided. A semiconductor device includes a substrate; and a membrane over the substrate and configured to generate charges in response to an acoustic wave, the membrane being in a polygonal shape including vertices. The membrane includes a via pattern having first lines that partition the membrane into slices and extend to the vertices of the membrane such that the slices are separated from each other near an anchored region of the membrane and connected to each other around a central region. The via pattern further includes second lines extending from the anchored region of the membrane toward the central region of the membrane. Each of the second lines includes a length less than a length of each of the first lines.

Abstract: A Micro-Electro-Mechanical System (MEMS) device includes a substrate, and a first sacrificial layer, a first conductive film, a second sacrificial layer, and a second conductive film successively laminated on the substrate, the second sacrificial layer being provided with a cavity; and further includes an amplitude-limiting layer provided with a first through hole and an isolation layer provided with a second through hole. The amplitude-limiting layer is located between the first conductive film and the first sacrificial layer and the isolation layer is located between the amplitude-limiting layer and the first conductive film, and/or the amplitude-limiting layer is located on the second conductive film and the isolation layer is located between the amplitude-limiting layer and the second conductive film. The amplitude-limiting layer extends to a projection region of an opening of the cavity and is in a suspended state.

Abstract: The present disclosure relates to semiconductor structures, and more particularly, to crackstop structures and methods of manufacture. The structure includes: a die matrix comprising a plurality of dies separated by at least one scribe lane; and a crackstop structure comprising at least one line within the at least one scribe lane between adjacent dies of the plurality of dies.

Abstract: An integrated circuit includes a lead frame, a first die, and a second die. The first die is bonded to and electrically connected to the lead frame. The second die is electrically connected to and spaced apart from the first die.

Abstract: A MEMS microphone includes a substrate having an opening, a first diaphragm, a first backplate, a second diaphragm, and a backplate. The first diaphragm faces the opening in the substrate. The first backplate includes multiple accommodating-openings and it is spaced apart from the first diaphragm. The second diaphragm joints the first diaphragm together at multiple locations by pillars passing through the accommodating-openings in the first backplate. The first backplate is located between the first diaphragm and the second diaphragm. The second backplate includes at least one vent hole and it is spaced apart from the second diaphragm. The second diaphragm is located between the first backplate and the second backplate.

Abstract: A capacitive microphone includes a substrate, a plurality of stationary electrodes, a diaphragm, and a backplate. The substrate includes a cavity and a step disposed in the cavity, and the plurality of stationary electrodes is equally spaced on the step. A diaphragm is received in the step and includes a vibration portion and a connecting portion connected to the vibration portion. A plurality of movable electrodes protrudes from a periphery of the vibration portion, and one end of the connecting portion away from the vibration portion is connected to the substrate. The backplate is provided with a plurality of sound transmission holes, and a gap is formed between the backplate and the diaphragm to form electrode plates of a variable capacitor. The capacitive microphone can get a higher signal-to-noise ratio, improve the capability of suppressing linear distortion, and improve the anti-interference capability of the microphone.

Abstract: A backing member includes: a resin body including a lower surface and an upper surface opposite to each other; a plurality of leads each of which extends in a first direction from the lower surface toward the upper surface, and that are embedded at pitches in the resin body; and a plurality of insulating spacers each of which is provided between adjacent ones of the leads and extends in a second direction intersecting with the first direction, and that contact the leads.

Abstract: A sensor includes a membrane electrode, a counter-electrode, and at least one spring. The sensor can include a structure; a membrane electrode, which is deformable as a consequence of pressure and which is in contact with the structure; a counter-electrode mechanically connected to the structure and separated from the membrane electrode by a gap; and at least one spring mechanically connected to the membrane electrode and the counter-electrode, so as to exert an elastic force between the membrane electrode and the counter-electrode.

Abstract: A front-end module includes: a substrate including a first connection member in which at least one first insulating layer and at least one first wiring layer are alternately stacked, a second connection member in which at least one second insulating layer and at least one second wiring layer are alternately stacked, and a core member disposed between the first and second connection members; a radio-frequency component mounted on a surface of the substrate and configured to amplify a main band of an input RF signal or filter bands outside the main band; an inductor disposed on a surface of the core member and electrically connected to the radio-frequency component; and a ground plane disposed on another surface of the core member. The core member includes a core insulating layer thicker than an insulating layer among at least one first insulating layer and the at least one second insulating layer.

Abstract: A micro-electro-mechanical system, MEMS, microphone assembly comprises an enclosure defining a first cavity, and a MEMS microphone arranged inside the first cavity. The microphone comprises a first die with bonding structures and a MEMS diaphragm, and a second die having an application specific integrated circuit, ASIC. The second die is bonded to the bonding structures such that a gap is formed between a first side of the diaphragm and the second die, with the gap defining a second cavity. The first side of the diaphragm is interfacing with the second cavity and a second side of the diaphragm is interfacing with the environment via an acoustic inlet port of the enclosure. The bonding structures are arranged such that pressure ventilation openings are formed that connect the first cavity and the second cavity.

Abstract: A touch surface device, comprising at least: an element comprising a first face forming the touch surface and a second face opposite to the first face; an acoustic wave sensor including at least one portion of piezoelectric material disposed between two electrodes, the portion of piezoelectric material and both electrodes being structured by forming surface wavinesses as wrinkles, the sensor being secured to the second face of the element such that apexes or valleys of the wrinkles are in contact with the second face of the element; an electronic circuit coupled to the electrodes of the sensor and configured to identify, from an electric signal intended to be outputted from the electrodes of the sensor, at least one touch gesture made on the touch surface.

Abstract: A MEMS device and a method of manufacturing the same are provided. A semiconductor device includes a substrate and a membrane over the substrate. The membrane includes a piezoelectric material configured to generate charges in response to an acoustic wave. The membrane includes a via pattern having first lines that partition the membrane into slices such that the slices are separated from each other at a first region near an edge of the membrane and connected to each other at a second region.

Abstract: An acoustic microphone assembly for surveillance into a protected space includes a microphone including a transducer and a diagram adapted for picking up acoustic sound waves, electronic circuitry for processing input, a power source, and an audio output wire or trace for delivering processed digital sound to a sound system, a cover plate having at least two bolt openings for mounting to a base plate on a wall or structure the cover plate covering an opening there through into the protected space, the cover plate accepting an orthogonal mounting of the microphone, and a sound diffraction pattern of different sized openings placed through the cover plate, the sound diffraction pattern located in alignment to the mounted microphone head and having a foot print roughly equal to the circumference of the head of the microphone.

Abstract: The waterproof sound-transmitting member of the present disclosure includes: a waterproof sound-transmitting membrane configured to prevent entry of water while permitting sound to pass therethrough, and a support layer joined to a main surface of the waterproof sound-transmitting membrane. The waterproof sound-transmitting membrane has an air permeability of 10,000 seconds/100 mL or more as expressed by Gurley number, the support layer includes a resin foam material and has a through hole extending in a thickness direction thereof and serving as a path for sound transmitted through the waterproof sound-transmitting membrane, and a side air permeability of the support layer between the through hole and an outer peripheral side surface of the support layer when the support layer is compressed in the thickness direction thereof at a compression ratio of 20% is 0.1 mL/(min·mm3) or more as a value per unit volume of the support layer.

Abstract: In one example, an electronic device can comprise (a) a first substrate comprising a first encapsulant extending from the first substrate bottom side to the first substrate top side, and a first substrate interconnect extending from the substrate bottom side to the substrate top side and coated by the first encapsulant, (b) a first electronic component embedded in the first substrate and comprising a first component sidewall coated by the first encapsulant, (c) a second electronic component coupled to the first substrate top side, (d) a first internal interconnect coupling the second electronic component to the first substrate interconnect, and (e) a cover structure on the first substrate and covering the second component sidewall and the first internal interconnect. Other examples and related methods are also disclosed herein.

Abstract: A MEMS transducer includes a first and a second differential MEMS sensor device. The first differential MEMS sensor device includes a first and a second electrode structure for providing a first differential output signal, and a third electrode structure between the first and second electrode structure. The second differential MEMS sensor device includes a first and second electrode structure for providing a second differential output signal, and a third electrode structure between the first and second electrode structure. A biasing circuit provides the third electrode structure of the first differential MEMS sensor device with a first biasing voltage and provides the third electrode structure of the second differential MEMS sensor device with a second biasing voltage. A read-out circuitry combines the first and second differential output signal in an anti-parallel manner.

Abstract: A piezoelectric microelectromechanical acoustic transducer, having a semiconductor substrate with a frame portion and a through cavity defined internally by the frame portion; an active membrane, suspended above the through cavity and anchored, at a peripheral portion thereof, to the frame portion of the substrate by an anchorage structure, a plurality of piezoelectric sensing elements carried by a front surface of the active membrane so as to detect mechanical stresses of the active membrane; a passive membrane, suspended above the through cavity, underneath the active membrane, interposed between the through cavity and a rear surface of the active membrane; and a pillar element, which fixedly couples, and is centrally interposed between, the active membrane and the passive membrane. A ventilation hole passes through the entire active membrane, the passive membrane and the pillar element to set the through cavity in fluidic communication with the front surface of the active membrane.

Abstract: A MEMS package has a MEMS chip, a package substrate which the MEMS chip is adhered, a chip cover which wraps the MEMS chip, and a pressure regulation film which is adhered to the front surface of the chip cover. The chip cover has a vent which is formed in a chip outside area, arranged outside than the MEMS chip, the pressure regulation film has a slit. The slit is arranged in the neighborhood of the vent and the vent is covered with the pressure regulation film.

Abstract: A piezoelectric MEMS microphone is disclosed. The microphone includes a base having a cavity; a piezoelectric diaphragm; a fixation beam connecting with the piezoelectric diaphragm; and a support beam connecting with the base and the fixation beam. The piezoelectric diaphragm has a number of diaphragm sheets fixed by the fixation beam, each diaphragm sheet having a fixed end and a free end. The fixed end is connected with the fixation beam, and the free end extends from the fixed end to two sides and is suspended above the cavity. Compared with the related art, mechanical strength of the diaphragm sheet is improved, and the output intensity of the signal is improved.

Abstract: Acoustic resonator devices and filters are disclosed. An acoustic resonator includes a substrate having a trap-rich region adjacent to a surface and a single-crystal piezoelectric plate having parallel front and back surfaces, the back surface attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm that spans a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the single-crystal piezoelectric plate such that interleaved fingers of the IDT are disposed on the diaphragm. The single-crystal piezoelectric plate and the IDT are configured such that a radio frequency signal applied to the IDT excites a shear primary acoustic mode within the diaphragm.

Abstract: A structure of micro-electro-mechanical-system (MEMS) microphone includes a substrate, having a first opening. A dielectric layer is disposed on the substrate, wherein the dielectric layer has a second opening aligned to the first opening. A membrane is disposed within the second opening of the dielectric layer. A peripheral region of the membrane is embedded into the dielectric layer at sidewall of the second opening. A backplate layer is disposed on the dielectric layer. The backplate layer includes a protection layer, having a peripheral region disposed on the dielectric layer and a central region with venting holes over the second opening. The central region of the protection layer further has anti-sticky structures at a side of the protection layer toward the membrane. An electrode layer is disposed on the side of the protection layer, surrounding the anti-sticky structures.

Abstract: An electronic device has an acoustic transducer with an acoustic diaphragm. The diaphragm has opposed first and second major surfaces. A front volume is positioned adjacent the first major surface. A back volume is positioned adjacent the second major surface. An elongated channel defines a barometric vent and extends from a first end fluidly coupled with the front volume to a second end fluidly coupled with the back volume, fluidly coupling the front volume with the back volume. The elongated channel may have a high aspect ratio (L/D), providing the vent with a substantial air mass. The elongated channel may be segmented to define a higher-order filter. For example, a segmented channel can have a cascade of repeating acoustic-mass and acoustic-compliance units, providing the barometric vent with additional degrees-of-freedom for tuning.

Abstract: An acoustic transducer for generating electrical signals in response to acoustic signals includes a transducer substrate, a back plate, and a diaphragm assembly. The diaphragm assembly includes a first diaphragm and a second diaphragm coupled thereto. The second diaphragm is positioned closer to the back plate than the first diaphragm. The second diaphragm includes a plurality of diaphragm apertures configured to allow air to pass through the second diaphragm. Each of the back plate and the first diaphragm are coupled to the transducer substrate at their periphery. In an embodiment, the transducer includes a post coupled to the first diaphragm and the second diaphragm, the post configured to prevent movement of the second diaphragm relative to the first diaphragm in a direction substantially perpendicular to the second diaphragm.

Abstract: An exemplary microelectromechanical system (MEMS) device comprises a plurality of stacked layers, including at least one layer that includes micromechanical components that respond to a force to be measured. Two of the layers may include respective first and second external electrical connection points. A plurality of conductive paths may be disposed in a continuous manner over an external surface of each of the plurality of layers between the first and second external electrical connection points.

Abstract: The present disclosure discloses a microphone, comprising: a first substrate, the first substrate having an inner cavity open at one end, wherein the microphone further comprises a vibration diaphragm and at least one cantilever which are provided to the first substrate and suspended above the inner cavity. The cantilever is separated from the vibration diaphragm by a spacing portion, and the vibration diaphragm and the inner cavity of the first substrate define an acoustically sealed cavity; and a detection structure is provided to the vibration diaphragm and the cantilever. The structural design of the cantilever is adopted, so that the space between the vibration diaphragm and the cantilever is open, the airflow can smoothly pass by the cantilever, and further the signal-to-noise ratio of the microphone can be greatly improved.

Abstract: Systems and methods for digital wallet transit payments are disclosed. According to one embodiment, a method for managing transit payments using a digital wallet may include (1) receiving, at a receiver associated with a vehicle and at a first vehicle location, a first communication from a mobile electronic device associated with a traveler comprising an identification of a payment instrument from a traveler's digital wallet, the first communication received before the traveler begins a trip in the vehicle; (2) receiving, at the receiver and at second vehicle location, a second communication from a mobile device at a conclusion of the trip; (3) a computer processor calculating a fare based on a travelled distance between the first vehicle location and the second vehicle location; and (4) the computer processor automatically submitting a transaction request for the fare to an issuer of the payment instrument.

Abstract: A dual membrane microphone is disclosed. In an embodiment, a MEMS microphone includes a first membrane, a backplate with a separated central area including a first backplate electrode on a lower portion of the backplate, a second backplate electrode on a upper portion of the backplate and a backplate insulation layer galvanically isolating the first and the second backplate electrodes, a second membrane and a coupling central portion, wherein the first membrane couples mechanically to the separated central area of the backplate in an electrically isolating manner and the separated central area of the backplate couples to the second membrane in an electrically isolating manner.

Abstract: The invention provides a piezoelectric micro-electromechanical system (MEMS) microphone includes a base with a cavity and a piezoelectric diaphragm arranged on the base. The base has a ring base and a support column. The piezoelectric diaphragm includes a plurality of diaphragm sheets. Each diaphragm sheet has a fixing end connected with the support column and a free end suspended above the cavity. The widths of the diaphragm sheets are gradually increased from the fixing ends to the free ends. According to the piezoelectric MEMS microphone provided by the invention, under sound pressure, the free ends vibrate, wide free ends drive short fixing ends, and the diaphragm sheets close the fixing ends generate greater deformation to generate more charge. Therefore, the sensitivity can be further improved.