Acoustic Wave Patents (Class 257/416)
  • Patent number: 11395057
    Abstract: The waterproof sound-transmitting member of the present disclosure includes: a waterproof sound-transmitting membrane configured to prevent entry of water while permitting sound to pass therethrough, and a support layer joined to a main surface of the waterproof sound-transmitting membrane. The waterproof sound-transmitting membrane has an air permeability of 10,000 seconds/100 mL or more as expressed by Gurley number, the support layer includes a resin foam material and has a through hole extending in a thickness direction thereof and serving as a path for sound transmitted through the waterproof sound-transmitting membrane, and a side air permeability of the support layer between the through hole and an outer peripheral side surface of the support layer when the support layer is compressed in the thickness direction thereof at a compression ratio of 20% is 0.1 mL/(min·mm3) or more as a value per unit volume of the support layer.
    Type: Grant
    Filed: November 7, 2018
    Date of Patent: July 19, 2022
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yosuke Sugaya, Bunta Hirai, Takeo Inoue
  • Patent number: 11383970
    Abstract: In one example, an electronic device can comprise (a) a first substrate comprising a first encapsulant extending from the first substrate bottom side to the first substrate top side, and a first substrate interconnect extending from the substrate bottom side to the substrate top side and coated by the first encapsulant, (b) a first electronic component embedded in the first substrate and comprising a first component sidewall coated by the first encapsulant, (c) a second electronic component coupled to the first substrate top side, (d) a first internal interconnect coupling the second electronic component to the first substrate interconnect, and (e) a cover structure on the first substrate and covering the second component sidewall and the first internal interconnect. Other examples and related methods are also disclosed herein.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: July 12, 2022
    Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
    Inventor: Sung Jae Oh
  • Patent number: 11381923
    Abstract: A MEMS transducer includes a first and a second differential MEMS sensor device. The first differential MEMS sensor device includes a first and a second electrode structure for providing a first differential output signal, and a third electrode structure between the first and second electrode structure. The second differential MEMS sensor device includes a first and second electrode structure for providing a second differential output signal, and a third electrode structure between the first and second electrode structure. A biasing circuit provides the third electrode structure of the first differential MEMS sensor device with a first biasing voltage and provides the third electrode structure of the second differential MEMS sensor device with a second biasing voltage. A read-out circuitry combines the first and second differential output signal in an anti-parallel manner.
    Type: Grant
    Filed: May 27, 2020
    Date of Patent: July 5, 2022
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Andreas Wiesbauer, Pedro Augusto Borrego Lambin Torres Amaral, Alessandro Caspani, Niccoló De Milleri, Marc Fueldner
  • Patent number: 11350220
    Abstract: A MEMS package has a MEMS chip, a package substrate which the MEMS chip is adhered, a chip cover which wraps the MEMS chip, and a pressure regulation film which is adhered to the front surface of the chip cover. The chip cover has a vent which is formed in a chip outside area, arranged outside than the MEMS chip, the pressure regulation film has a slit. The slit is arranged in the neighborhood of the vent and the vent is covered with the pressure regulation film.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: May 31, 2022
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Masashi Shiraishi, Hironobu Hayashi, Toyotaka Kobayashi
  • Patent number: 11350218
    Abstract: A piezoelectric microelectromechanical acoustic transducer, having a semiconductor substrate with a frame portion and a through cavity defined internally by the frame portion; an active membrane, suspended above the through cavity and anchored, at a peripheral portion thereof, to the frame portion of the substrate by an anchorage structure, a plurality of piezoelectric sensing elements carried by a front surface of the active membrane so as to detect mechanical stresses of the active membrane; a passive membrane, suspended above the through cavity, underneath the active membrane, interposed between the through cavity and a rear surface of the active membrane; and a pillar element, which fixedly couples, and is centrally interposed between, the active membrane and the passive membrane. A ventilation hole passes through the entire active membrane, the passive membrane and the pillar element to set the through cavity in fluidic communication with the front surface of the active membrane.
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: May 31, 2022
    Assignee: STMicroelectronics S.r.l.
    Inventors: Fabrizio Cerini, Silvia Adorno
  • Patent number: 11337009
    Abstract: A piezoelectric MEMS microphone is disclosed. The microphone includes a base having a cavity; a piezoelectric diaphragm; a fixation beam connecting with the piezoelectric diaphragm; and a support beam connecting with the base and the fixation beam. The piezoelectric diaphragm has a number of diaphragm sheets fixed by the fixation beam, each diaphragm sheet having a fixed end and a free end. The fixed end is connected with the fixation beam, and the free end extends from the fixed end to two sides and is suspended above the cavity. Compared with the related art, mechanical strength of the diaphragm sheet is improved, and the output intensity of the signal is improved.
    Type: Grant
    Filed: December 30, 2020
    Date of Patent: May 17, 2022
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventors: Lian Duan, Rui Zhang
  • Patent number: 11323089
    Abstract: Acoustic resonator devices and filters are disclosed. An acoustic resonator includes a substrate having a trap-rich region adjacent to a surface and a single-crystal piezoelectric plate having parallel front and back surfaces, the back surface attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm that spans a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the single-crystal piezoelectric plate such that interleaved fingers of the IDT are disposed on the diaphragm. The single-crystal piezoelectric plate and the IDT are configured such that a radio frequency signal applied to the IDT excites a shear primary acoustic mode within the diaphragm.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: May 3, 2022
    Assignee: Resonant Inc.
    Inventor: Patrick Turner
  • Patent number: 11312616
    Abstract: A structure of micro-electro-mechanical-system (MEMS) microphone includes a substrate, having a first opening. A dielectric layer is disposed on the substrate, wherein the dielectric layer has a second opening aligned to the first opening. A membrane is disposed within the second opening of the dielectric layer. A peripheral region of the membrane is embedded into the dielectric layer at sidewall of the second opening. A backplate layer is disposed on the dielectric layer. The backplate layer includes a protection layer, having a peripheral region disposed on the dielectric layer and a central region with venting holes over the second opening. The central region of the protection layer further has anti-sticky structures at a side of the protection layer toward the membrane. An electrode layer is disposed on the side of the protection layer, surrounding the anti-sticky structures.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: April 26, 2022
    Assignee: Solid State System Co., Ltd.
    Inventors: Tsung-Min Hsieh, Chien-Hsing Lee, Cheng-Wei Tsai
  • Patent number: 11310600
    Abstract: An acoustic transducer for generating electrical signals in response to acoustic signals includes a transducer substrate, a back plate, and a diaphragm assembly. The diaphragm assembly includes a first diaphragm and a second diaphragm coupled thereto. The second diaphragm is positioned closer to the back plate than the first diaphragm. The second diaphragm includes a plurality of diaphragm apertures configured to allow air to pass through the second diaphragm. Each of the back plate and the first diaphragm are coupled to the transducer substrate at their periphery. In an embodiment, the transducer includes a post coupled to the first diaphragm and the second diaphragm, the post configured to prevent movement of the second diaphragm relative to the first diaphragm in a direction substantially perpendicular to the second diaphragm.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: April 19, 2022
    Assignee: KNOWLES ELECTRONICS, LLC
    Inventors: Vahid Naderyan, Sung Bok Lee, Michael Kuntzman
  • Patent number: 11310591
    Abstract: An electronic device has an acoustic transducer with an acoustic diaphragm. The diaphragm has opposed first and second major surfaces. A front volume is positioned adjacent the first major surface. A back volume is positioned adjacent the second major surface. An elongated channel defines a barometric vent and extends from a first end fluidly coupled with the front volume to a second end fluidly coupled with the back volume, fluidly coupling the front volume with the back volume. The elongated channel may have a high aspect ratio (L/D), providing the vent with a substantial air mass. The elongated channel may be segmented to define a higher-order filter. For example, a segmented channel can have a cascade of repeating acoustic-mass and acoustic-compliance units, providing the barometric vent with additional degrees-of-freedom for tuning.
    Type: Grant
    Filed: May 21, 2020
    Date of Patent: April 19, 2022
    Assignee: Apple Inc.
    Inventors: Peter C. Hrudey, Justin D. Crosby, Gokhan Hatipoglu
  • Patent number: 11299393
    Abstract: An exemplary microelectromechanical system (MEMS) device comprises a plurality of stacked layers, including at least one layer that includes micromechanical components that respond to a force to be measured. Two of the layers may include respective first and second external electrical connection points. A plurality of conductive paths may be disposed in a continuous manner over an external surface of each of the plurality of layers between the first and second external electrical connection points.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: April 12, 2022
    Assignee: INVENSENSE, INC.
    Inventor: Peter George Hartwell
  • Patent number: 11297441
    Abstract: The present disclosure discloses a microphone, comprising: a first substrate, the first substrate having an inner cavity open at one end, wherein the microphone further comprises a vibration diaphragm and at least one cantilever which are provided to the first substrate and suspended above the inner cavity. The cantilever is separated from the vibration diaphragm by a spacing portion, and the vibration diaphragm and the inner cavity of the first substrate define an acoustically sealed cavity; and a detection structure is provided to the vibration diaphragm and the cantilever. The structural design of the cantilever is adopted, so that the space between the vibration diaphragm and the cantilever is open, the airflow can smoothly pass by the cantilever, and further the signal-to-noise ratio of the microphone can be greatly improved.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: April 5, 2022
    Assignees: Goertek, Inc., Qingdao Research Institute of Beihang Univerity
    Inventors: Quanbo Zou, Qunwen Leng, Zhe Wang
  • Patent number: 11288716
    Abstract: Systems and methods for digital wallet transit payments are disclosed. According to one embodiment, a method for managing transit payments using a digital wallet may include (1) receiving, at a receiver associated with a vehicle and at a first vehicle location, a first communication from a mobile electronic device associated with a traveler comprising an identification of a payment instrument from a traveler's digital wallet, the first communication received before the traveler begins a trip in the vehicle; (2) receiving, at the receiver and at second vehicle location, a second communication from a mobile device at a conclusion of the trip; (3) a computer processor calculating a fare based on a travelled distance between the first vehicle location and the second vehicle location; and (4) the computer processor automatically submitting a transaction request for the fare to an issuer of the payment instrument.
    Type: Grant
    Filed: November 4, 2016
    Date of Patent: March 29, 2022
    Assignee: JPMORGAN CHASE BANK, N.A.
    Inventors: James David Porterfield, Ryan Andrew Schlosser
  • Patent number: 11272296
    Abstract: A dual membrane microphone is disclosed. In an embodiment, a MEMS microphone includes a first membrane, a backplate with a separated central area including a first backplate electrode on a lower portion of the backplate, a second backplate electrode on a upper portion of the backplate and a backplate insulation layer galvanically isolating the first and the second backplate electrodes, a second membrane and a coupling central portion, wherein the first membrane couples mechanically to the separated central area of the backplate in an electrically isolating manner and the separated central area of the backplate couples to the second membrane in an electrically isolating manner.
    Type: Grant
    Filed: August 17, 2020
    Date of Patent: March 8, 2022
    Inventor: Pirmin Hermann Otto Rombach
  • Patent number: 11265657
    Abstract: The invention provides a piezoelectric micro-electromechanical system (MEMS) microphone includes a base with a cavity and a piezoelectric diaphragm arranged on the base. The base has a ring base and a support column. The piezoelectric diaphragm includes a plurality of diaphragm sheets. Each diaphragm sheet has a fixing end connected with the support column and a free end suspended above the cavity. The widths of the diaphragm sheets are gradually increased from the fixing ends to the free ends. According to the piezoelectric MEMS microphone provided by the invention, under sound pressure, the free ends vibrate, wide free ends drive short fixing ends, and the diaphragm sheets close the fixing ends generate greater deformation to generate more charge. Therefore, the sensitivity can be further improved.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: March 1, 2022
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventors: Lian Duan, Rui Zhang, Zhiyuan Chen
  • Patent number: 11254565
    Abstract: Implementations of absolute pressure sensor devices may include a microelectromechanical system (MEMS) absolute pressure sensor coupled over a controller die. The MEMS absolute pressure sensor may be mechanically coupled to the controller die and may also be configured to electrically couple with the controller die. A perimeter of the controller die may be one of the same size and larger than a perimeter of the MEMS absolute pressure sensor. The controller die may be configured to electrically couple with a module through an electrical connector.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: February 22, 2022
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventor: Michael J. Seddon
  • Patent number: 11245379
    Abstract: In an elastic wave device, an IDT electrode is disposed on a piezoelectric substrate and includes a close contact layer, which includes first and second main surfaces and side surfaces. The first main surface is in contact with the piezoelectric substrate, and at least two electrode layers are disposed on the close contact layer. The at least two electrode layers include a first electrode layer and a second electrode layer. The first electrode layer is made of a material that has a higher density than that of Al. The second electrode layer has a lower density than the first electrode layer. One of the at least two electrode layers has higher weather resistance than the close contact layer and covers the side surfaces of the close contact layer.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: February 8, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Chihiro Konoma
  • Patent number: 11212623
    Abstract: The invention provides a piezoelectric micro-electromechanical systems (MEMS) microphone having a base with a cavity, a piezoelectric diaphragm, and a limit element. The base has a ring base, and a support column. The piezoelectric diaphragm includes diaphragm sheets. Each diaphragm sheet have a fixing end connected with the support column and a free end suspended above the cavity. The limit element includes a limit part arranged apart from the piezoelectric diaphragm to limit the free ends in vibration directions of the diaphragm sheets, and an edge fixing plate connected with the outer edge of the limit part and arranged on the ring base. When the diaphragm sheets greatly deform upwards under impact force, deformation of the diaphragm sheets can be controlled, and the diaphragm sheets are protected to prevent the diaphragm sheets from breaking, thereby improving the stability of the piezoelectric MEMS microphone.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: December 28, 2021
    Assignee: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
    Inventors: Lian Duan, Rui Zhang, Zhiyuan Chen
  • Patent number: 11212617
    Abstract: The present invention provides a piezoelectric MEMS microphone having a base with a cavity, a piezoelectric diaphragm, and a restraining element. The base has a ring base circumferentially forming a cavity, a support column. The piezoelectric diaphragm includes diaphragm sheets each having a fixing end connected to a support column and a free end suspended over the cavity. The restraining element has one end fixedly connected to the free end, the other end connected to the part on the base that is not connected to the fixing end. The piezoelectric MEMS microphone of the invention can constrain the deformation of the diaphragm sheet, thereby improving the resonant frequency of the piezoelectric diaphragm, reducing the noise of the whole piezoelectric MEMS microphone.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: December 28, 2021
    Assignee: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
    Inventors: Lian Duan, Rui Zhang, Zhiyuan Chen
  • Patent number: 11206493
    Abstract: A micro electro mechanical system (MEMS) microphone includes a first membrane, a second membrane, a third membrane disposed between the first membrane and the second membrane, a first cavity disposed between the first membrane and the third membrane and surrounded by a first wall, a second cavity disposed between the second membrane and the third membrane and surrounded by a second wall, and one or more first supports disposed in the first cavity and connecting the first membrane and the third membrane.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: December 21, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chen Hsiung Yang, Chun-Wen Cheng, Chia-Hua Chu, En-Chan Chen
  • Patent number: 11197088
    Abstract: A MEMS transducer includes a transducer substrate, a back plate, a diaphragm, and an intermediate layer. The transducer substrate includes an aperture. The back plate is coupled to a first surface of the transducer substrate and covers the aperture. The diaphragm is oriented substantially parallel to the back plate and is spaced apart from the back plate to form a gap. The intermediate layer is coupled to the diaphragm and the back plate and includes an acoustic relief channel, which fluidly couples the gap to an environment surrounding the MEMS transducer.
    Type: Grant
    Filed: May 10, 2020
    Date of Patent: December 7, 2021
    Assignee: Knowles Electronics, LLC
    Inventors: Vahid Naderyan, Mohammad Mohammadi, Evan Llamas-Young
  • Patent number: 11172306
    Abstract: Disclosed are a vibration system, a panel speaker and an active noise reduction wearable electronic device. The vibration system includes a diaphragm body. The diaphragm body includes at least one vocalization film having a vocalization area, a reinforcement structure and a solid member. The vocalization film realizes vibration vocalization function. The reinforcement structure is provided at the vocalization area of the vocalization film to make the vocalization film remain flat at the vocalization area. The solid member is provided at other positions of the vocalization film except the vocalization area to increase strength of the diaphragm body.
    Type: Grant
    Filed: October 22, 2020
    Date of Patent: November 9, 2021
    Assignee: Shenzhen Ausounds Intelligent Co., Ltd.
    Inventor: Rui Qiu
  • Patent number: 11172313
    Abstract: A MEMS microphone integrates a temperature-sensing element in or on the ASIC die of a MEMS microphone to enable an audio mode and a temperature-sensing mode in parallel. The system also permits for a method for easily switching between these two modes and for outputting both digital output signals at the same common output pad, which allows for the use of the footprint of a conventional microphone.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: November 9, 2021
    Assignee: TDK Corporation
    Inventors: Lei Zou, Pirmin Hermann Otto Rombach, Henning Petersen
  • Patent number: 11159892
    Abstract: The invention relates to a sounding device having a first housing body with a first accommodation space, and a speaker box accommodated into the first housing body. The speaker box includes a second housing body with a second accommodation space, and a speaker unit accommodated in the second housing body. The speaker unit divides the second accommodation space into a front acoustic cavity. The sounding device further comprises a one-way intake valve. The speaker box, serving as a fan in a mobile terminal, pushes air circulation inside and outside the mobile terminal, thereby achieving a heat dissipation effect and facilitating internal cooling of the mobile terminal.
    Type: Grant
    Filed: August 18, 2020
    Date of Patent: October 26, 2021
    Assignee: AAC Technologies Pte. Ltd.
    Inventors: Xingzhi Huang, Lin Liu, Dijiang Tong, Zhe Zhang, Jun Wu, Zhichen Chen, Zhaoyu Yin
  • Patent number: 11158784
    Abstract: The present invention makes clear and defines a congruent composition of a langasite-based oxide, and establishes a method of manufacturing a crystal by any desired composition of AE3ME1+a(Ga1?xAlx)3+bSi2+cO14 (AE is an alkaline-earth metal, ME is Nb or Ta, 0?x?1, ?0.5<a?0 or 0<a<0.5, ?0.5<b?0 or 0<b?0.5, and ?0.5<c?0 or 0<c<0.5, excluding a=b=c=0). This makes it possible to suppress the formation of an impurity, and improve the yield and crystal manufacturing rate. The raw material is a raw material mixture prepared by mixing an alkaline-earth metal or its carbonate or oxide, Nb or Ta or its oxide, Ga or its oxide, Al or its oxide, and Si or its oxide.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: October 26, 2021
    Assignees: PIEZO STUDIO INC., TOHOKU UNIVERSITY
    Inventors: Akira Yoshikawa, Yuui Yokota, Yuji Ohashi, Kei Kamada, Tetsuo Kudo, Kenji Inoue, Yasuhiro Shoji, Yu Igarashi, Mototaka Arakawa, Shunsuke Kurosawa, Akihiro Yamaji
  • Patent number: 11134325
    Abstract: A microphone assembly has an interconnect substrate and a microphone transducer coupled with the substrate. A lid overlies the microphone transducer. At least a portion of the lid is spaced from the substrate, defining an acoustic chamber for the microphone transducer. The lid can have a layer of discretized metal or other patterned conductor. The discretized layer of metal or other patterned conductor is configured to inhibit formation of eddy currents, as when exposed to electromagnetic radiation. The lid can be grounded. Microphone modules and electronic devices also are described.
    Type: Grant
    Filed: June 24, 2019
    Date of Patent: September 28, 2021
    Assignee: Apple Inc.
    Inventors: Peter C. Hrudey, Anthony D. Minervini, Joseph R. Maurer
  • Patent number: 11128942
    Abstract: A sound transducer arrangement for generating and/or detecting sound waves in the audible wavelength spectrum includes an acoustic unit, which includes a vibratable diaphragm and a MEMS unit coupled to the diaphragm for generating and/or detecting a deflection of the diaphragm. The sound transducer arrangement includes a MEMS structure, which includes a support unit on which the MEMS unit and the acoustic unit are arranged. The support unit includes a metallic lead frame and a plastic body, with which the lead frame is partially circumferentially fused.
    Type: Grant
    Filed: June 8, 2018
    Date of Patent: September 21, 2021
    Assignee: USOUND GMBH
    Inventors: Ferruccio Bottoni, Andrea Rusconi Clerici Beltrami
  • Patent number: 11107858
    Abstract: An electronic device comprises a CMOS substrate having a first surface and a second surface opposite the first surface. A plurality of ultrasonic transducers is provided having a transmit/receive surface. A contact surface is piezoelectrically associated with the plurality of ultrasonic transducers and is formed on the first surface of the CMOS substrate. The plurality of ultrasonic transducers is disposed on the second surface of the CMOS substrate, with the transmit/receive side attached to the second surface thereof such that the CMOS substrate is between the plurality of ultrasonic transducers and the platen. An image sensing system is also provided, together with a method for ultrasonic sensing in the electronic device.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: August 31, 2021
    Assignee: InvenSense, Inc.
    Inventors: Renata Melamud Berger, Julius Ming-Lin Tsai, Stephen Lloyd
  • Patent number: 11101174
    Abstract: Methods for forming an interconnections structure on a substrate in a cluster processing system and thermal processing such interconnections structure are provided. In one embodiment, a method for a device structure for semiconductor devices includes forming a barrier layer in an opening formed in a material layer disposed on a substrate, forming an interface layer on the barrier layer, forming a gap filling layer on the interface layer, and performing an annealing process on the substrate, wherein the annealing process is performed at a pressure range greater than 5 bar.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: August 24, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Hao Jiang, Nikolaos Bekiaris, Erica Chen, Mehul B. Naik
  • Patent number: 11078074
    Abstract: Processes for integrating complementary metal-oxide-semiconductor (CMOS) devices with microelectromechanical systems (MEMS) devices are provided. In some embodiments, the MEMS devices are formed on a sacrificial substrate or wafer, the sacrificial substrate or wafer is bonded to a CMOS die or wafer, and the sacrificial substrate or wafer is removed. In other embodiments, the MEMS devices are formed over a sacrificial region of a CMOS die or wafer and the sacrificial region is subsequently removed. Integrated circuit (ICs) resulting from the processes are also provided.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: August 3, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Wen Cheng, Chia-Hua Chu
  • Patent number: 11063558
    Abstract: A system includes a tunable bulk acoustic wave (BAW) resonator device and a direct-current (DC) tuning controller coupled to the tunable BAW resonator device. The system also includes an oscillator circuit coupled to the tunable BAW resonator device. The DC tuning controller selectively adjusts a DC tuning signal applied to the tunable BAW resonator device to adjust a signal frequency generated by the oscillator circuit.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: July 13, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Bichoy Bahr, Baher Haroun, Ting-Ta Yen, Ali Kiaei
  • Patent number: 11059717
    Abstract: A micromechanical pressure sensor, having a sensor core formed in a silicon substrate in a pressure-sensitive region, having a sensor membrane, a first cavity being formed in the silicon substrate on the sensor membrane; a second cavity formed between a rear-side surface of the silicon substrate and the sensor core, access holes that go out from the rear-side surface of the silicon substrate being connected to the second cavity; and at least one anchoring recess going out from the rear-side surface being formed in an anchoring region of the silicon substrate surrounding the pressure-sensitive region, the anchoring recess being formed such that a molding compound can flow into the anchoring recess.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: July 13, 2021
    Assignee: Robert Bosch GmbH
    Inventors: Arne Dannenberg, Tobias Henn
  • Patent number: 11051109
    Abstract: A MEMS microphone includes a substrate having an opening, a first diaphragm, a first backplate, a second diaphragm, and a second backplate. The first diaphragm faces the opening in the substrate. The first backplate includes multiple accommodating-openings and it is spaced apart from the first diaphragm. The second diaphragm joints the first diaphragm together at multiple locations by pillars passing through the accommodating-openings in the first backplate. The first backplate is located between the first diaphragm and the second diaphragm. The second backplate includes at least one vent hole and it is spaced apart from the second diaphragm. The second diaphragm is located between the first backplate and the second backplate.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: June 29, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Wen Cheng, Chia-Hua Chu, Wen-Tuan Lo
  • Patent number: 11021363
    Abstract: In some embodiments a method of manufacturing a sensor system can comprise forming a first structure having a substrate layer and a first sensor that is positioned on a first side of the substrate layer, bonding a cap structure over the first sensor on the first side of the substrate layer, and depositing a first dielectric layer over the cap structure. After bonding the cap structure and depositing the first dielectric layer, a second sensor is fabricated on the first dielectric layer. The second sensor includes material that would be adversely affected at a temperature that is used to bond the cap structure to the first side of the substrate layer.
    Type: Grant
    Filed: June 13, 2019
    Date of Patent: June 1, 2021
    Assignee: NXP USA, Inc.
    Inventors: Lianjun Liu, David J. Monk
  • Patent number: 10998279
    Abstract: A semiconductor chip may include high frequency electrical circuitry. The semiconductor chip may include a cavity resonator integrated with the high frequency electrical circuitry in a semiconductor substrate of the semiconductor chip. The cavity resonator may include a resonator body in a cavity in the semiconductor substrate of the semiconductor chip. The resonator body may comprise a metal layer. The cavity resonator may include a feeding structure electrically connected to the high frequency electrical circuitry.
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: May 4, 2021
    Assignee: Infineon Technologies AG
    Inventors: Dmitri Alex Tschumakow, Claus Dahl
  • Patent number: 10993043
    Abstract: Provided is a MEMS acoustic sensor including a substrate and a cavity, a back plate supported on the substrate and including a plurality of through-holes, at least one anchor projecting from the back plate toward the substrate, and a diaphragm supported by the at least one anchor and deformed by a sound wave introducing from the outside through the cavity, wherein no part of the deformed diaphragm comes into contact with the substrate.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: April 27, 2021
    Assignee: SHIN SUNG C&T CO., LTD.
    Inventors: Sang woo Lee, Ci Moo Song, Keun Jung Youn, Yong Kook Kim, Kyu dong Jung, Muhammad Ali Shah
  • Patent number: 10957688
    Abstract: A method of manufacture and structure for a monolithic single chip single crystal device. The method can include forming a first single crystal epitaxial layer overlying the substrate and forming one or more second single crystal epitaxial layers overlying the first single crystal epitaxial layer. The first single crystal epitaxial layer and the one or more second single crystal epitaxial layers can be processed to form one or more active or passive device components. Through this process, the resulting device includes a monolithic epitaxial stack integrating multiple circuit functions.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: March 23, 2021
    Assignee: Akoustis, Inc.
    Inventors: Shawn R. Gibb, David M. Aichele, Ramakrishna Vetury, Mark D. Boomgarden, Jeffrey B. Shealy
  • Patent number: 10952324
    Abstract: A spacer is provided to allow a surface mount device (SMD) to be surface mounted onto a PCB with greater degrees of freedom. The spacer is designed to be surface mountable to the PCB and includes an electrically non-conducting body that has a first surface facing the SMD, a second surface facing the PCB, and through holes and/or indents in the electrically non-conducting body to accommodate electrical conductors that provide electrical connections between the SMD and the PCB. The spacer may provide one or more of: an elevated height (so that the SMD is elevated above the PCB), an offset along the surface of the PCB relative to a designated position for the SMD on the PCB, or a tilt in one or more directions relative to a surface of the PCB.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: March 16, 2021
    Assignee: Facebook Technologies, LLC
    Inventor: Raymond Lee
  • Patent number: 10856844
    Abstract: Vertical packaging configurations for ultrasound chips are described. Vertical packaging may involve use of integrated interconnects other than wires for wire bonding. Examples of such integrated interconnects include edge-contact vias, through silicon vias and conductive pillars. Edge-contact vias are vias defined in a trench formed in the ultrasound chip. Multiple vias may be provided for each trench, thus increasing the density of vias. Such vias enable electric access to the ultrasound transducers. Through silicon vias are formed through the silicon handle and provide access from the bottom surface of the ultrasound chip. Conductive pillars, including copper pillars, are disposed around the perimeter of an ultrasound chip and provide access to the ultrasound transducers from the top surface of the chip. Use of these types of packaging techniques can enable a substantial reduction in the dimensions of an ultrasound device.
    Type: Grant
    Filed: May 2, 2019
    Date of Patent: December 8, 2020
    Assignee: Butterfly Network, Inc.
    Inventors: Keith G. Fife, Jianwei Liu
  • Patent number: 10834490
    Abstract: The present disclosure provides a microphone module, an electronic device, and relates to the field of electronic device technology. The microphone module includes a housing, a circuit board, a signal converter, and an adhesive member. The housing is formed with a cavity and an acoustic receiving hole which are connected with each other; the circuit board is connected to the housing to seal a bottom of the cavity; the adhesive member is provided in the cavity; the signal converter for converting an acoustic signal into an electrical signal is electrically connected to the circuit board and provided in the cavity.
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: November 10, 2020
    Assignee: Beijing Xiaomi Mobile Software Co., Ltd.
    Inventors: Chiafu Yen, Hui Du
  • Patent number: 10798493
    Abstract: A Micro-Electro-Mechanical Systems (MEMS) device includes a substrate, a dielectric supporting layer, a diaphragm, a backplate. The substrate has a substrate opening corresponding to a diaphragm region. The dielectric supporting layer is disposed on the substrate, having a dielectric opening corresponding to the substrate opening to form the diaphragm region. The diaphragm within the dielectric opening is held by the dielectric supporting layer at a periphery. The backplate is disposed on the dielectric supporting layer, having a plurality of venting holes, connecting to the dielectric opening. The backplate includes a conductive layer and a passivation layer covering over the conductive layer at a first side opposite to the diaphragm, wherein a second side of the conductive layer is facing to the diaphragm and not covered by the passivation layer.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: October 6, 2020
    Assignee: Solid State System Co., Ltd.
    Inventors: Tsung-Min Hsieh, Chien-Hsing Lee, Cheng-Wei Tsai
  • Patent number: 10790798
    Abstract: An acoustic resonator includes a substrate having via holes provided therein and having a membrane structure formed on a first surface of the substrate, and a cap accommodating the membrane structure and bonded to the substrate. The cap includes a support block in contact with the membrane structure.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: September 29, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jeong Suong Yang, Sang Hyun Yi, Ho Joon Park, Yeong Gyu Lee
  • Patent number: 10737932
    Abstract: A MEMS structure includes a substrate, a dielectric layer, a membrane, a backplate, and a blocking layer. The substrate has a through-hole. The dielectric layer is disposed on the substrate and has a cavity in communication with the through-hole. The membrane has at least one vent hole, is embedded in the dielectric layer and together with the dielectric layer defines a first chamber that communicates with the through-hole. The backplate is disposed on the dielectric layer. One end of the blocking layer is embedded in the dielectric layer, and the other end of the blocking layer extends into the cavity; the blocking layer is spatially isolated from the membrane and at least partially overlaps with the at least one vent hole.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: August 11, 2020
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Yuan-Sheng Lin, Jung-Hao Chang, Chang-Sheng Hsu, Weng-Yi Chen
  • Patent number: 10726230
    Abstract: There is disclosed a display panel and its driving method and a display device in the technical field of display. The display panel according to the disclosure includes a base substrate, a driving structure provided on the base substrate, a receiving structure provided above the driving structure, and a fingerprint detection module provided on the base substrate, wherein the driving structure is configured to create an ultrasonic signal, the receiving structure is configured to receive the ultrasonic signal reflected from a finger and transform the reflected ultrasonic signal into an electric signal which is input to the fingerprint detection module, and the fingerprint detection module is configured to determine fingerprint information from the electric signal output by the receiving structure.
    Type: Grant
    Filed: September 30, 2017
    Date of Patent: July 28, 2020
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yingming Liu, Xue Dong, Haisheng Wang, Xiaoliang Ding, Rui Xu, Lijun Zhao
  • Patent number: 10710868
    Abstract: A MEMS sensor including an electrode plate, a diaphragm structure, a support structure, and a pressure relief film. The electrode plate has a conductive portion. The diaphragm structure is disposed at a side of the electrode plate with an interval, and has a sensing film. The support structure is disposed between the diaphragm structure and the electrode plate, and surrounds an electrical coupling zone and a gas flow zone. The support structure includes an inner wall and an outer wall. An outer edge of the gas flow zone is surrounded by the inner wall. An outer edge of the electrical coupling zone is surrounded by the outer wall. The pressure relief film covers the gas flow zone.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: July 14, 2020
    Assignee: Merry Electronics (Shenzhen) Co., Ltd.
    Inventors: Kai-Yu Jiang, Jen-Yi Chen, Chao-Sen Chang
  • Patent number: 10715923
    Abstract: Disclosed are a condenser MEMS microphone and an electronic apparatus. The condenser MEMS microphone comprises: a substrate; a bottom plate placed on the substrate; and a top plate placed above the bottom plate and spaced from the bottom plate, wherein the top plate is torsional with respect to a first torsional axis and is divided into a first part and a second part by the first torsional axis, the first part and the second part form two condensers with the bottom plate, and a first group of acoustic holes are provided in the first part of the top plate.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: July 14, 2020
    Assignee: GOERTEK INC.
    Inventor: Quanbo Zou
  • Patent number: 10710873
    Abstract: Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in connection with the transducers. The CUTs may be used in ultrasound devices such as ultrasound imaging devices and/or high intensity focused ultrasound (HIFU) devices.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: July 14, 2020
    Assignee: Butterfly Network, Inc.
    Inventors: Jonathan M. Rothberg, Keith G. Fife, Tyler S. Ralston, Gregory L. Charvat, Nevada J. Sanchez
  • Patent number: 10687147
    Abstract: Disclosed are a MEMS microphone and an electronic apparatus. The MEMS microphone comprises: a pressure sensing element, for sensing pressure applied thereon; a diaphragm attached to the pressure sensing element and applying pressure to the pressure sensing element; and a backbone attached to the pressure sensing element and supporting the pressure sensing element.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: June 16, 2020
    Assignee: GOERTEK INC.
    Inventor: Quanbo Zou
  • Patent number: 10665765
    Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.
    Type: Grant
    Filed: January 2, 2018
    Date of Patent: May 26, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Mei-Yi Wu, Lu-Ming Lai, Yu-Ying Lee, Yung-Yi Chang
  • Patent number: 10627654
    Abstract: An acousto-optic waveguide device comprises a substrate comprising a first material having a first refractive index and a first acoustic velocity; a cladding layer over the substrate, the cladding layer comprising a second material having a second refractive index that is distinct from the first refractive index, the second material having a second acoustic velocity that is distinct from the first acoustic velocity; and an optical core surrounded by the cladding layer, the optical core comprising a third material having a third refractive index that is higher that the first refractive index and the second refractive index, the third material having a third acoustic velocity that is distinct from the first acoustic velocity and the second acoustic velocity. The cladding layer that surrounds the optical core has a thickness configured to substantially confine acoustic waves to the cladding layer when an optical signal propagates through the optical core.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: April 21, 2020
    Assignee: Honeywell International Inc.
    Inventors: Matthew Wade Puckett, Jianfeng Wu, Mary Salit, Tiequn Qiu