Responsive To Non-electrical Signal (e.g., Chemical, Stress, Light, Or Magnetic Field Sensors) Patents (Class 257/414)
  • Patent number: 10352848
    Abstract: A gas detection system, comprising a sample gas inlet, a reference gas inlet and a gas modulation valve alternatingly connecting one of the sample gas inlet and the reference gas inlet to a gas sensor, is characterized in that a selective transfer filter is located in the gas flow path connecting the gas modulation valve and the gas sensor.
    Type: Grant
    Filed: October 24, 2016
    Date of Patent: July 16, 2019
    Assignee: INFICON GmbH
    Inventors: Fredrik Enquist, Niclas Edvardsson, Johan Hellgren, Henrik Vennerberg
  • Patent number: 10350593
    Abstract: A device for monitoring fluid media, and methods of manufacture thereof are disclosed. The monitoring device may be implemented as a single monolithic unit made from a certain type of material without a separate packaging, and having a base element comprising at least one fluid port and at least one cavity or fluid flow path fluidly coupled to the at least one fluid port for enabling fluid exchange of fluid media therewith. The device comprises at least one sensing element associated with the cavity or fluid flow path and configured and operable for measuring at least one property or condition of fluid media introduced thereinto, and generate measurement data or signals indicative thereof. Electrical contacts disposed on the base element of the device, and electrically coupled to the at least one sensing element are used for establishing electrical connection with the at least one sensing element.
    Type: Grant
    Filed: August 3, 2016
    Date of Patent: July 16, 2019
    Assignee: EZMEMS LTD.
    Inventors: Tsvi Shmilovich, Nicola Molinazzi
  • Patent number: 10347692
    Abstract: An organic light emitting display device in an embodiment of the present invention comprises a display panel equipped with a plurality of pixels each including an OLED and a driving TFT for driving the OLED and a sensing circuit connected to pixels through a sensing line and detecting driving characteristics of a corresponding pixel. The sensing circuit may comprise a plural sensing units including an integrator for integrating currents respectively flowing two adjacent sensing lines connected to inverting and non-inverting input terminals of a fully differential amplifier, a sampling unit for respectively sampling two integral outputs of the integrator and a scaler for regulating an operating range of outputs of the sampling unit, a differential amplifier for differentially amplifying one or more outputs of the scaler, and an ADC for converting an output of the differential amplifier into a digital sensing value.
    Type: Grant
    Filed: October 24, 2017
    Date of Patent: July 9, 2019
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Taeyoung Lee, Changwoo Lee, Osung Do
  • Patent number: 10343895
    Abstract: A method for forming a micro-electro-mechanical system (MEMS) device structure is provided. The MEMS device structure includes a micro-electro-mechanical system (MEMS) substrate, and a substrate formed over the MEMS substrate. The substrate includes a semiconductor via through the substrate. The MEMS device structure includes a dielectric layer formed over the substrate and a polymer layer formed on the dielectric layer. The MEMS device structure also includes a conductive layer formed in the dielectric layer and the polymer layer. The conductive layer is electrically connected to the semiconductor via, and the polymer layer is between the conductive layer and the dielectric layer.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: July 9, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Kai-Fung Chang, Lien-Yao Tsai, Len-Yi Leu
  • Patent number: 10322481
    Abstract: A structure for fixing a membrane to a carrier including a carrier; a suspended structure; and a holding structure with a rounded concave shape which is configured to fix the suspended structure to the carrier and where a tapered side of the holding structure physically connects to the suspended structure is disclosed. A method of forming the holding structure on a carrier to support a suspended structure is further disclosed. The method may include: forming a holding structure on a carrier; forming a suspended structure on the holding structure; shaping the holding structure such that it has a concave shape; and arranging the holding structure such that a tapered side of the holding structure physically connects to the suspended structure.
    Type: Grant
    Filed: March 6, 2014
    Date of Patent: June 18, 2019
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Alfons Dehe, Reinhard Gabl, Ulrich Krumbein
  • Patent number: 10325131
    Abstract: Embodiments described herein include an input device including an array of sensing pixels configured to sense an input object in a sensing region, each of the sensing pixels including a sense element. Each of the sensing pixels also includes a first transistor, wherein the first transistor includes a gate terminal connected to a row select line and a second terminal connected to the sense element. Each of the sensing pixels also includes a non-linear circuit element, wherein the non-linear circuit element includes a first terminal connected to the sense element and the second terminal of the first transistor, and wherein the non-linear circuit element further includes a second terminal connected to a column output line.
    Type: Grant
    Filed: June 30, 2015
    Date of Patent: June 18, 2019
    Assignee: SYNAPTICS INCORPORATED
    Inventors: Arash Akhavan Fomani, Patrick Smith
  • Patent number: 10315917
    Abstract: A micromechanical sensor device and a corresponding manufacturing method. The micromechanical sensor device is equipped with a substrate which includes a diaphragm area, multiple sensor layer areas being formed on the diaphragm area, which have a particular structured sensor layer; and a particular electrode device, via which the sensor layer areas are electrically connectable outside of the diaphragm area, the sensor layer areas being structured in such a way that they have length and width dimensions of a magnitude between 1 and 10 micrometers.
    Type: Grant
    Filed: January 8, 2018
    Date of Patent: June 11, 2019
    Assignee: ROBERT BOSCH GMBH
    Inventors: Andreas Krauss, Elisabeth Preiss
  • Patent number: 10308507
    Abstract: Provided herein is a method including forming a cavity in a first side of a first silicon wafer. An oxide layer is formed on the first side and in the cavity. The first side of the first silicon wafer is bonded to a first side of a second silicon wafer, and a gap control structure is deposited on a second side of the second silicon wafer. A MEMS structure is formed in the second silicon wafer. The second side of the second silicon wafer is eutecticly bonded to the third silicon wafer, and the eutectic bonding includes pressing the second silicon wafer to the third silicon wafer.
    Type: Grant
    Filed: October 20, 2016
    Date of Patent: June 4, 2019
    Assignee: InvenSense, Inc.
    Inventors: Jong Ii Shin, Peter Smeys, Bongsang Kim
  • Patent number: 10297515
    Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.
    Type: Grant
    Filed: April 18, 2016
    Date of Patent: May 21, 2019
    Assignee: Amkor Technology, Inc.
    Inventors: Sung Sun Park, Ji Young Chung, Christopher Berry
  • Patent number: 10297300
    Abstract: A method for measuring a temperature of magnetic junction switchable using spin transfer. The magnetic junction includes at least one magnetic layer. The method includes measuring a temperature variation of at least one magnetic characteristic for the magnetic layer(s) versus temperature. The method also includes measuring a bias variation in the magnetic characteristic versus an electrical bias for the magnetic junction. This measurement is performed such that spin transfer torque-induced variation(s) in the magnetic characteristic(s) are accounted for. The temperature versus the electrical bias for the magnetic junction is determined based on the temperature variation and the bias variation.
    Type: Grant
    Filed: September 15, 2015
    Date of Patent: May 21, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sebastian Schafer, Dmytro Apalkov, Alexey Vasilyevitch Khvalkovskiy, Vladimir Nikitin, Robert Beach, Zheng Duan
  • Patent number: 10291200
    Abstract: MEMS based sensors, particularly capacitive sensors, potentially can address critical considerations for users including accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, and cost effectiveness. Accordingly, it would be beneficial to exploit MEMS processes that allow for manufacturability and integration of resonator elements into cavities within the MEMS sensor that are at low pressure allowing high quality factor resonators and absolute pressure sensors to be implemented. Embodiments of the invention provide capacitive sensors and MEMS elements that can be implemented directly above silicon CMOS electronics.
    Type: Grant
    Filed: July 2, 2015
    Date of Patent: May 14, 2019
    Assignee: The Royal Institution for the Advancement of Learning / McGill University
    Inventors: Vamsy Chodavarapu, George Xereas
  • Patent number: 10282581
    Abstract: A finger print and pressure dual sensor includes first electrodes disposed on a substrate and extending in a first direction, and source electrodes and drain electrodes disposed to face each other in the first direction; channel regions disposed on the substrate and electrically connected to the source electrode and drain electrode; a first dielectric layer disposed on the substrate, covering the first electrodes, the source electrodes, and the drain electrodes and having first openings for exposing the channel region; second electrodes disposed on the first dielectric layer and extending in a second direction; a second dielectric layer disposed on the first dielectric layer, covering the second electrodes and having second openings for exposing the channel region; gate electrodes disposed on the second dielectric layer, extending in the second direction and disposed on the channel region; and a cover layer disposed on the second dielectric layer and covering the gate electrodes.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: May 7, 2019
    Assignee: UNIST(ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)
    Inventors: Jang Ung Park, Byeong Wan An
  • Patent number: 10268868
    Abstract: A fingerprint sensor package and method are provided. The fingerprint sensor package comprises a fingerprint sensor along with a fingerprint sensor surface material and electrical connections from a first side of the fingerprint sensor to a second side of the fingerprint sensor. A high voltage chip is connected to the fingerprint sensor and then the fingerprint sensor package with the high voltage chip are connected to a substrate, wherein the substrate has an opening to accommodate the presence of the high voltage chip.
    Type: Grant
    Filed: January 23, 2018
    Date of Patent: April 23, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Yu-Feng Chen, Chih-Hua Chen, Hao-Yi Tsai, Chung-Shi Liu
  • Patent number: 10260905
    Abstract: A magnetic field sensor can sense a movement of an object along a path. A movement line is tangent to the path. The magnetic field sensor can include a semiconductor substrate. The semiconductor substrate can have first and second orthogonal axes orthogonal to each other on the first surface of the substrate. A projection of the movement line onto a surface of the semiconductor substrate is only substantially parallel to the first orthogonal axis. The magnetic field sensor can also include first, second, third, and fourth magnetic field sensing elements disposed on the substrate. The first and second magnetic field sensing elements have maximum response axes parallel to the first orthogonal axis and the second and fourth magnetic field sensing elements have maximum response axes parallel to the second orthogonal axis. Signals generated by the second and fourth magnetic field sensing elements can be used as reference signals.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: April 16, 2019
    Assignee: Allegro MicroSystems, LLC
    Inventors: Paul A. David, Eric G. Shoemaker, Jeffrey Eagen
  • Patent number: 10254261
    Abstract: A microelectronic device capable of detecting multiple gas constituents in ambient air can be used to monitor air quality. The microelectronic air quality monitor includes a plurality of temperature-sensitive gas sensors tuned to detect different gas species. Each gas sensor is tuned by programming an adjacent heater. An insulating air pocket formed below the sensor helps to maintain the sensor at a desired temperature. A temperature sensor may also be integrated with each gas sensor to provide additional feedback control. The heater, temperature sensor, and gas sensors are in the form of patternable thin films integrated on a single microchip. The device can be incorporated into computer workstations, smart phones, clothing, or other wearable accessories to function as a personal air quality monitor that is smaller, more accurate, and less expensive than existing air quality sensors.
    Type: Grant
    Filed: July 18, 2016
    Date of Patent: April 9, 2019
    Assignee: STMicroelectronics PTE Ltd
    Inventors: Olivier Le Neel, Tien Choy Loh, Shian Yeu Kam, Ravi Shankar
  • Patent number: 10247788
    Abstract: A resistive element includes a resistive region in a semiconductor substrate, a first contact structure and a second contact structure. The semiconductor substrate includes a first main surface area. The resistive region extends in a lateral direction parallel to the main surface area and in a vertical direction perpendicular to the main surface area, and includes a first piezo-resistive coefficient for a current flow in the lateral direction and a second piezo-resistive coefficient for a current flow in the vertical direction. The first contact structure contacts a portion of a first face of the resistive region and the second contact structure contacts a portion of a second face of the resistive region. The resistive element generates a current flow distribution within the resistive region having a lateral component and a vertical component that results in a piezo-resistive coefficient of the resistive element.
    Type: Grant
    Filed: March 23, 2016
    Date of Patent: April 2, 2019
    Assignee: Infineon Technologies AG
    Inventor: Udo Ausserlechner
  • Patent number: 10228353
    Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: March 12, 2019
    Assignee: Butterfly Networks, Inc.
    Inventors: Jonathan M. Rothberg, Susan A. Alie, Keith G. Fife, Nevada J. Sanchez, Tyler S. Ralston
  • Patent number: 10217739
    Abstract: A bipolar junction transistor having a relatively reduced size and an improved current gain and a method of manufacturing the same are disclosed. The bipolar junction transistor includes a plurality of emitter regions disposed in a substrate, a plurality of base regions disposed in the substrate and configured to surround the emitter regions, respectively, and a collector region disposed in the substrate and configured to surround the base regions. The plurality of emitter and base regions may be arranged in a matrix.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: February 26, 2019
    Assignee: DB Hitek Co., Ltd
    Inventor: Joo Hyung Kim
  • Patent number: 10215590
    Abstract: A back-biased magnetic field sensor can have one or more vertical Hall effect elements arranged within a substrate region of a substrate, wherein magnetic fields are oriented substantially vertical to the substrate within the substrate region when a ferromagnetic object is not proximate. When the ferromagnetic object becomes proximate, the magnetic field sensor can sense at least the proximity, and, in some embodiments, can also localize a position of the ferromagnetic object relative to the magnetic field sensor.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: February 26, 2019
    Assignee: Allegro MicroSystems, LLC
    Inventors: Paul A. David, Ravi Vig
  • Patent number: 10192092
    Abstract: A high-efficiency fingerprint identification device includes an electrode substrate, plural 1-to-N switch circuits formed on the electrode substrate, plural sensing electrodes and plural wires. Each 1-to-N switch circuit has one first end, N second ends and m control ends. The m control ends control connection between the N second ends and the first end. Each sensing electrode corresponds to a nearby 1-to-N switch circuit. The wires are divided into sensing and driving lines and control lines. The sensing electrodes in each column correspond to a sensing and driving line. The sensing and driving line is connected to one of the N second ends of the 1-to-N switch circuits in the column. The sensing electrodes in each row correspond to m control lines. Each control line is connected to ones of the m control ends of the 1-to-N switch circuits in the row.
    Type: Grant
    Filed: January 23, 2017
    Date of Patent: January 29, 2019
    Assignee: SUPERC-TOUCH CORPORATION
    Inventors: Hsiang-Yu Lee, Shang Chin, Ping-Tsun Lin
  • Patent number: 10190865
    Abstract: Methods, kits, systems, and apparatuses, for measuring and/or verifying end effector flatness using electrical continuity are provided.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: January 29, 2019
    Assignee: Lam Research Corporation
    Inventors: Silvia Rocio Aguilar Amaya, Derek John Witkowicki, Damon Tyrone Genetti
  • Patent number: 10192492
    Abstract: An organic light emitting diode display including: a substrate including a pixel part for displaying an image and a peripheral part enclosing the pixel part; a plurality of scan lines formed on the substrate, each for transferring a scan signal; a plurality of data lines for transferring a data voltage, and a plurality of driving voltage lines intersecting the plurality of scan lines for transferring a driving voltage, respectively; a plurality of pixels connected to the plurality of scan lines and the plurality of data lines, respectively and formed in the pixel part; and at least one dummy pixel connected to the plurality of scan lines and the plurality of data lines and formed in the peripheral part.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: January 29, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jin Sung An, Min Ho Ko
  • Patent number: 10189021
    Abstract: According to embodiments of the present invention, a microfluidic chip, a manufacturing method therefor and an analysis device using the same are provided. The microfluidic chip comprises: a substrate comprising an inflow part through which a fluid flows in, a fluid channel through which the fluid moves and an outflow part through which the fluid flows out; and a film attached to the substrate to protect at least one of the inflow part, the outflow part and the fluid channel from the outside, wherein the inflow part and the outflow part are implemented by penetrating through the surface of the substrate, and the fluid channel can be implemented by being sunk from the surface of the substrate.
    Type: Grant
    Filed: June 22, 2015
    Date of Patent: January 29, 2019
    Assignee: NANOBIOSYS INC.
    Inventors: Sung Woo Kim, Jae Young Byun
  • Patent number: 10173893
    Abstract: Methods and structures that may be implemented in one example to co-integrate processes for thin-film encapsulation and formation of microelectronic devices and microelectromechanical systems (MEMS) such as sensors and actuators. For example, structures having varying characteristics may be fabricated using the same basic process flow by selecting among different process options or modules for use with the basic process flow in order to create the desired structure/s. Various process flow sequences as well as a variety of device design structures may be advantageously enabled by the various disclosed process flow sequences.
    Type: Grant
    Filed: August 24, 2016
    Date of Patent: January 8, 2019
    Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
    Inventors: Emmanuel P. Quevy, Jeremy R. Hui, Carrie Wing-Zin Low, Mehrnaz Motiee
  • Patent number: 10177769
    Abstract: Embodiments of the present invention relate generally to logic devices, and more particularly, to magnetoelectric magnetic tunneling junction computational devices. Aspects of the disclosed technology include a stand-alone voltage-controlled magnetoelectric device that satisfies essential requirements for general logic applications, including nonlinearity, gain, concatenability, feedback prevention, and a complete set of Boolean operations based on the majority gate and inverter. Aspects of the present disclosed technology can eliminate the need for any auxiliary FETs to preset or complicated clocking schemes and prevents the racing condition.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: January 8, 2019
    Assignee: Georgia Tech Research Corporation
    Inventors: Chenyun Pan, Sourav Dutta, Azad Naeemi
  • Patent number: 10160640
    Abstract: A method for forming a micro-electro mechanical system (MEMS) device is provided. The method includes bonding a semiconductor substrate with a carrier substrate through a dielectric layer and patterning the semiconductor substrate into multiple elements. The method also includes partially removing the dielectric layer to release some of the elements such that the released elements become one (or more) first movable element and one (or more) second movable element. The method further includes bonding a cap substrate with the semiconductor substrate to form a first closed chamber containing the first movable element and a second closed chamber containing the second movable element. In addition, the method includes opening the second closed chamber and sealing the second closed chamber after vacuumizing the second closed chamber such that the second closed chamber has a reduced pressure smaller than that of the first closed chamber.
    Type: Grant
    Filed: October 20, 2016
    Date of Patent: December 25, 2018
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Wen Cheng, Chia-Hua Chu
  • Patent number: 10164641
    Abstract: Embodiments of the present invention relate generally to logic devices, and more particularly, to magnetoelectric magnetic tunneling junction computational devices. Aspects of the disclosed technology include a stand-alone voltage-controlled magnetoelectric device that satisfies essential requirements for general logic applications, including nonlinearity, gain, concatenability, feedback prevention, and a complete set of Boolean operations based on the majority gate and inverter. Aspects of the present disclosed technology can eliminate the need for any auxiliary FETs to preset or complicated clocking schemes and prevents the racing condition.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: December 25, 2018
    Assignee: Georgia Tech Research Corporation
    Inventors: Chenyun Pan, Sourav Dutta, Azad Naeemi
  • Patent number: 10148896
    Abstract: According to an embodiment, a facial recognition system includes an image sensor, a facial recognition processing unit, a heart rate detection unit, and an authentication unit. The image sensor detects incident light by an infrared pixel, and outputs detected infrared information. The facial recognition processing unit recognizes the face of a person based on image information signal captured by the image sensor. The heart rate detection unit reads the heart rate of the person from pulses in a blood vessel in the face based on the infrared information. The authentication unit receives facial recognition signal outputted from the facial recognition processing unit. The authentication unit authenticates the person as an identical person when the heart rate is inputted, and authenticates the person as a photograph when the heart rate is not inputted.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: December 4, 2018
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Eiichirou Kosugou
  • Patent number: 10135211
    Abstract: A connector for use in a free-standing connector port for mating with an external pluggable module is disclosed. The connector has terminals that extend lengthwise of the connector so that cables may be terminated to the terminals and the terminals and cable generally are horizontally aligned together. The connector includes a housing and a pair of connecting elements that flank a card-receiving slot of the connector. The cables exit from the rear of the connector elements and from the connector port. The connector elements engage the connector port to fix the connector in place within the connector port.
    Type: Grant
    Filed: January 11, 2016
    Date of Patent: November 20, 2018
    Assignee: Molex, LLC
    Inventors: Brian Keith Lloyd, Gregory B. Walz, Bruce Reed, Gregory Fitzgerald, Ayman Isaac, Kent E. Regnier, Brandon Janowiak, Darian R. Schulz, Munawar Ahmad, Eran J. Jones, Javier Resendez, Michael Rost
  • Patent number: 10109787
    Abstract: A vertical Hall element and method of fabricating are disclosed. The method includes forming a buried region having a first conductivity type in a substrate having a second conductivity type and implanting a dopant of the first conductivity type into a well region between the top surface of the substrate and the buried region. The buried region has a doping concentration increasing with an increasing depth from a top surface of the substrate and the well region has a doping concentration decreasing from the top surface of the substrate to the buried region. The method includes forming first through fifth contacts on the well region. First and second contacts define a conductive path and second and third contacts define another conductive path through the well region. The fourth contact is formed between first and second contacts and the fifth contact is formed between second and third contacts.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: October 23, 2018
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Keith Ryan Green, Iouri Mirgorodski
  • Patent number: 10103320
    Abstract: A component with a magnetic field sensor. The electronic component is located in a semiconductor substrate or on the surface of the semiconductor substrate and is surrounded at least partially, preferably largely, by a trench in the semiconductor substrate. The trench is filled with a filling material.
    Type: Grant
    Filed: May 4, 2016
    Date of Patent: October 16, 2018
    Assignee: TDK-Micronas GmbH
    Inventors: Marc Baumann, Thilo Rubehn, Christian Joos, Jochen Stephan
  • Patent number: 10088670
    Abstract: A spatial light modulator is provided that uses light modulation structures at each pixel to employ electromagnetic interference to modulate the intensity and/or phase of the transmitted and/or reflected light from the pixel. The use of the modulation structures enables the independent and dynamic changing of the intensity and/or phase of the reflected and/or transmitted light at each pixel. The modulation structure can incorporate a plate with a semi-reflective surface that is separated from a substrate having either a reflective or semi-reflective surface. The modulation structure can have actuators positioned between the substrate and the plate to control the separation distance between the plate and the substrate. By controlling the separation distance, the amount of light reflected by and/or transmitted through the surfaces of the plate and substrate can be controlled. The separation distance can be related to the resulting interference applied to particular wavelengths of the light.
    Type: Grant
    Filed: March 21, 2016
    Date of Patent: October 2, 2018
    Inventors: C. Anthony Hester, Charles F. Hester
  • Patent number: 10084944
    Abstract: The disclosure extends to devices, systems and methods for connecting one or more sensors to one or more printed circuit boards (PCB) in the distal end or tip of a scope. The disclosure also extends to a connector assembly for an image sensor for protecting the sensor and conveying information from the sensor to the PCB.
    Type: Grant
    Filed: March 23, 2015
    Date of Patent: September 25, 2018
    Assignee: DePuy Synthes Products, Inc.
    Inventors: Jeremiah D. Henley, Laurent Blanquart, Brian Dean
  • Patent number: 10064280
    Abstract: A printed circuit board includes an insulating layer and an element embedded in the insulating layer and exposed through a surface of the insulating layer.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: August 28, 2018
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jae Hyun Ahn, Min Wook Yu
  • Patent number: 10052066
    Abstract: Disclosed are appendage mountable electronic systems and related methods for covering and conforming to an appendage surface. A flexible or stretchable substrate has an inner surface for receiving an appendage, including an appendage having a curved surface, and an opposed outer surface that is accessible to external surfaces. A stretchable or flexible electronic device is supported by the substrate inner and/or outer surface, depending on the application of interest. The electronic device in combination with the substrate provides a net bending stiffness to facilitate conformal contact between the inner surface and a surface of the appendage provided within the enclosure. In an aspect, the system is capable of surface flipping without adversely impacting electronic device functionality, such as electronic devices comprising arrays of sensors, actuators, or both sensors and actuators.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: August 21, 2018
    Assignee: The Board of Trustees of the University of Illinois
    Inventors: John A. Rogers, Ming Ying, Andrew Bonifas, Nanshu Lu
  • Patent number: 10048787
    Abstract: A fingerprint sensor which includes a conductive layer which is incorporatable within an electronic display is disclosed. The fingerprint sensor also includes a controller coupled to the conductive layer to capture a fingerprint image and can further be adapted to control the display.
    Type: Grant
    Filed: February 29, 2016
    Date of Patent: August 14, 2018
    Assignee: Synaptics Incorporated
    Inventors: Richard Alexander Erhart, Richard Brian Nelson, Paul Wickboldt
  • Patent number: 10043704
    Abstract: A system and method for manipulating the structural characteristics of a MEMS device include etching a plurality of holes into the surface of a MEMS device, wherein the plurality of holes comprise one or more geometric shapes determined to provide specific structural characteristics desired in the MEMS device.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: August 7, 2018
    Assignee: MEMS Drive, Inc.
    Inventors: Roman Gutierrez, Tony Tang, Xiaolei Liu, Guiqin Wang, Matthew Ng
  • Patent number: 10043776
    Abstract: A micro pick up array mount includes a pivot platform to allow a micro pick up array to automatically align with a carrier substrate. Deflection of the pivot platform may be detected to control further movement of the micro pick up array.
    Type: Grant
    Filed: June 14, 2016
    Date of Patent: August 7, 2018
    Assignee: APPLE INC.
    Inventors: Dariusz Golda, John A. Higginson, Andreas Bibl
  • Patent number: 10032635
    Abstract: The disclosed subject matter provides thin films including a metal silicide and methods for forming such films. The disclosed subject matter can provide techniques for tailoring the electronic structure of metal thin films to produce desirable properties. In example embodiments, the metal silicide can comprise a platinum silicide, such as for example, PtSi, Pt2Si, or Pt3Si. For example, the disclosed subject matter provides methods which include identifying a desired phase of a metal silicide, providing a substrate, depositing at least two film layers on the substrate which include a first layer including amorphous silicon and a second layer including metal contacting the first layer, and annealing the two film layers to form a metal silicide. Methods can be at least one of a source-limited method and a kinetically-limited method. The film layers can be deposited on the substrate using techniques known in the art including, for example, sputter depositing.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: July 24, 2018
    Assignee: THE TRUSTEES OF THE UNIVERSITY OF PENNSYLVANIA
    Inventors: Robert W. Carpick, Frank Streller, Rahul Agarwal, Filippo Mangolini
  • Patent number: 10020405
    Abstract: The present disclosure relates to a microelectronics package with optical sensors and/or thermal sensors. The disclosed microelectronics package includes a module substrate, a thinned flip-chip die with an upper surface that includes a first surface portion and a second surface portion surrounding the first surface portion, and a first mold compound component. The thinned flip-chip die is attached to the module substrate and includes a device layer with sensor structure integrated at a top portion of the device layer. Herein, the sensor structure is below the first surface portion and not below the second surface portion. The first mold compound component is formed over the second surface portion to define a first cavity over the upper surface of the thinned flip-chip die. The first mold compound component is not over the first surface portion, and the first surface portion is exposed at the bottom of the first cavity.
    Type: Grant
    Filed: January 18, 2017
    Date of Patent: July 10, 2018
    Assignee: Qorvo US, Inc.
    Inventors: Dirk Robert Walter Leipold, George Maxim, Julio C. Costa, Baker Scott
  • Patent number: 10009523
    Abstract: An electronic module includes a mounting surface, a cover disposed above the mounting surface, wherein the cover includes a protruding portion extending from a lower surface of the cover to a predetermined distance, and an adhesion part adhering the protruding portion to the mounting surface.
    Type: Grant
    Filed: April 18, 2016
    Date of Patent: June 26, 2018
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Heung Woo Park, Jung Gon Choi
  • Patent number: 10006888
    Abstract: A plurality of micro-electro-mechanical system (MEMS) transducers in a phased array are coupled to a flexible substrate using carbon nanotubes (CNTs) for conformal ultrasound scanning. Each transducer comprises a cantilever, magnetic material deposited on the cantilever, and a solenoid positioned relative to the magnetic material. The carbon nanotubes are grown on the cantilever and mechanically couple the transducer to one side of the flexible substrate. The other side of the flexible substrate is applied to a surface of a part under inspection, and the transducers are electrically connected to a processer to cause movement of the cantilevers when the solenoids are energized by the processor. The movement of the cantilevers results in movement of the carbon nanotubes, which imparts a force to the flexible substrate that results in ultrasound waves, which permeate the part. Returns from the ultrasound waves are interpreted by the processor to generate images of the part.
    Type: Grant
    Filed: April 21, 2016
    Date of Patent: June 26, 2018
    Assignee: THE BOEING COMPANY
    Inventors: Keith D. Humfeld, Morteza Safai
  • Patent number: 10007830
    Abstract: A finger biometric sensor may include a lower conductive layer, an upper conductive layer, and a spacer between the lower and upper conductive layers to define an air gap therebetween. The finger biometric sensor may also include a finger biometric sensing integrated circuit (IC) above the upper conductive layer and capable of deflecting the upper conductive layer toward the lower conductive layer to change a capacitance thereof based upon pressure applied to the finger biometric sensing IC. A pressure sensing circuit may be coupled to the lower and upper conductive layers to sense the change in capacitance.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: June 26, 2018
    Assignee: APPLE INC.
    Inventor: Dale R. Setlak
  • Patent number: 10008373
    Abstract: An impedance spectrometer comprised of a thermal micro-platform supported with phononic structured nanowires disposed within a micromachined structure is provided to identify, monitor and characterize a gas, vapor, solid or liquid analyte. The impedance sensor and analyte sensing element in embodiments are formed from a semiconductor SOI starting wafer.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: June 26, 2018
    Inventor: William N Carr
  • Patent number: 10003011
    Abstract: A magnetic memory device may include a free magnetic pattern and a capping pattern on a surface of the free magnetic pattern. The capping pattern may include first and second metal elements. The capping pattern may include a first portion adjacent to an interface between the free magnetic pattern and the capping pattern, and a second portion spaced apart from the interface. The first metal element may have a concentration greater in the first portion than in the second portion. The first metal element may have an atomic weight smaller than that of the second metal element. The concentration of the first metal element along the thickness direction of the capping pattern may be proportional to a proximity to the interface.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: June 19, 2018
    Assignee: Samsung Electronics, Co., Ltd.
    Inventors: Sang Hwan Park, Keewon Kim, Youngman Jang, Kwangseok Kim
  • Patent number: 10002844
    Abstract: A bonded structure can include a first element having a first conductive interface feature and a second element having a second conductive interface feature. An integrated device can be coupled to or formed with the first element or the second element. The first conductive interface feature can be directly bonded to the second conductive interface feature to define an interface structure. The interface structure can be disposed about the integrated device in an at least partially annular profile to connect the first and second elements.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: June 19, 2018
    Assignee: INVENSAS BONDING TECHNOLOGIES, INC.
    Inventors: Liang Wang, Rajesh Katkar, Javier A. DeLaCruz, Arkalgud R. Sitaram
  • Patent number: 9988264
    Abstract: A method of fabricating an integrated structure for MEMS device and semiconductor device comprises steps of: providing a substrate having a transistor thereon in a semiconductor device region and a first MEMS component thereon in a MEMS region; performing a interconnect process on the substrate in the semiconductor device region to form a plurality of first dielectric layers, at least a conductive plug and at least a conductive layer in the first dielectric layers; forming a plurality of second dielectric layers and an etch stopping device in the second dielectric layers on the substrate in a etch stopping device region; forming a plurality of third dielectric layers and at least a second MEMS component in the third dielectric layers on the substrate in the MEMS region; and performing an etching process to remove the third dielectric layers in the MEMS region.
    Type: Grant
    Filed: September 18, 2014
    Date of Patent: June 5, 2018
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Bang-Chiang Lan, Li-Hsun Ho, Wei-Cheng Wu, Hui-Min Wu, Min Chen, Tzung-I Su, Chien-Hsin Huang
  • Patent number: 9988265
    Abstract: Trapped sacrificial structures and thin-film encapsulation methods that may be implemented to manufacture trapped sacrificial structures such as relative humidity sensor structures, and spacer structures that protect adjacent semiconductor structures extending above a semiconductor die substrate from being contacted by a molding tool or other semiconductor processing tool in an area of a die substrate adjacent the spacer structures.
    Type: Grant
    Filed: August 22, 2016
    Date of Patent: June 5, 2018
    Assignee: Semiconductor Manufacturing International (Shanghai) Corporation
    Inventors: Emmanuel P. Quevy, Louis Nervegna, Jeremy R. Hui
  • Patent number: 9978886
    Abstract: The present disclosure relates to a microelectronics package with optical sensors and/or thermal sensors. The disclosed microelectronics package includes a module substrate, a thinned flip-chip die with an upper surface that includes a first surface portion and a second surface portion surrounding the first surface portion, and a first mold compound component. The thinned flip-chip die is attached to the module substrate and includes a device layer with sensor structure integrated at a top portion of the device layer. Herein, the sensor structure is below the first surface portion and not below the second surface portion. The first mold compound component is formed over the second surface portion to define a first cavity over the upper surface of the thinned flip-chip die. The first mold compound component is not over the first surface portion, and the first surface portion is exposed at the bottom of the first cavity.
    Type: Grant
    Filed: January 18, 2017
    Date of Patent: May 22, 2018
    Assignee: Qorvo US, Inc.
    Inventors: Dirk Robert Walter Leipold, George Maxim, Julio C. Costa, Baker Scott
  • Patent number: 9979401
    Abstract: Embodiments of the present invention relate generally to logic devices, and more particularly, to magnetoelectric magnetic tunneling junction computational devices. Aspects of the disclosed technology include a stand-alone voltage-controlled magnetoelectric device that satisfies essential requirements for general logic applications, including nonlinearity, gain, concatenability, feedback prevention, and a complete set of Boolean operations based on the majority gate and inverter. Aspects of the present disclosed technology can eliminate the need for any auxiliary FETs to preset or complicated clocking schemes, and prevents the racing condition.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: May 22, 2018
    Assignee: Georgia Tech Research Corporation
    Inventors: Chenyun Pan, Sourav Dutta, Azad Naeemi