Physical Deformation Patents (Class 257/415)
  • Patent number: 11125812
    Abstract: The invention discloses a circuit aging detection sensor based on voltage comparison. A control circuit generates an aging voltage signal, a standard voltage signal and a reference voltage signal. The aging voltage signal passes through a first voltage-controlled oscillator to generate an aging frequency signal. The standard voltage signal passes through a second voltage-controlled oscillator to generate a standard frequency signal. The standard frequency signal and the aging frequency signal pass through an aging detection circuit to generate a frequency difference signal. A level signal generated by a serial data detector passes through a beat-frequency oscillator to generate a reset signal. A counter quantizes aging information, which is converted by a digital-analog converter into a quantized voltage signal. The quantized voltage signal is compared with the reference voltage signal by a voltage comparator, to generate a hopping signal at a voltage superposition node, and an aging signal is output.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: September 21, 2021
    Assignee: Ningbo University
    Inventors: Pengjun Wang, Haiming Zhang, Yuejun Zhang, Huihong Zhang, Xiaotian Zhang, Haizhen Yu
  • Patent number: 11127783
    Abstract: A Magnetic Random Access Memory (MRAM), a method of manufacturing the same, and an electronic device including the same are provided. The MRAM includes a substrate, an array of memory cells arranged in rows and columns, bit lines, and word lines. The memory cells each include a vertical switch device and a magnetic tunnel junction on the switch device and electrically connected to a first terminal of the switch device. An active region of the switch device at least partially includes a single-crystalline semiconductor material. Each of the memory cell columns is disposed on a corresponding bit line, and a second terminal of each of the respective switch devices in the memory cell column is electrically connected to the corresponding bit line. Each of the word lines is electrically connected to a control terminal of the respective switch devices of the respective memory cells in a corresponding memory cell row.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: September 21, 2021
    Assignee: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
    Inventors: Huilong Zhu, Junjie Li, Chao Zhao
  • Patent number: 11117135
    Abstract: Disclosed is a liquid-sealed cartridge in which a liquid is transferred by a centrifugal force generated when the liquid-sealed cartridge is rotated around a rotation shaft, including: a liquid storage portion configured to store the liquid therein; a seal having an outer peripheral portion connected to the liquid storage portion, the seal being configured to seal the liquid storage portion; a flow path connected to the liquid storage portion via the seal, through which the liquid in the liquid storage portion is transferred by the centrifugal force in a direction away from the rotation shaft, wherein, when the seal receives a pressing force, the seal is inclined in a pressing direction, with one portion of the outer peripheral portion thereof remaining connected with the liquid storage portion, and the other portion of the outer peripheral portion being separated from the liquid storage portion.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: September 14, 2021
    Assignees: Sysmex Corporation, ASTI Corporation
    Inventors: Kazuyoshi Horii, Takao Fujiwara, Tomoyuki Nose, Yasunori Maekawa, Noriyuki Ogai, Yasuhiro Toda
  • Patent number: 11086468
    Abstract: A touch device includes a base; a first peripheral wire, a second peripheral wire, a third peripheral wire, a first shield wire and a second shield wire are disposed on the base; there is a first potential difference between the first peripheral wire and the second peripheral wire, and there is a second potential difference between the second peripheral wire and the third peripheral wire. The second peripheral wire is disposed between and spaced from the first peripheral wire and the third peripheral wire. The first shield wire is discontinuously disposed between the first peripheral wire and the second peripheral wire. The second shield wire is discontinuously disposed between the second peripheral wire and the third peripheral wire.
    Type: Grant
    Filed: March 20, 2020
    Date of Patent: August 10, 2021
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Lixiang Yi, Hongqiang Luo, Kwanggyun Jang, Feng Xiao
  • Patent number: 11082028
    Abstract: In one aspect of the disclosure, a semiconductor package is disclosed. The semiconductor package includes a lead frame. A semiconductor die is attached to a first side of the lead frame. A protective shell covers at least a first portion of the first surface of the semiconductor die. The protective shell comprises of ink residue. A layer of molding compound covers an outer surface of the protective shell and exposed portion of the first surface of the semiconductor die. A cavity space is within an inner space of the protective shell and the first portion of the top surface of the semiconductor die.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: August 3, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: James Cooper Wainerdi, Luu Nguyen, Alexander Harvey Scheuermann, Matthew David Romig
  • Patent number: 11061519
    Abstract: A pseudo-piezoelectric d33 vibration device includes transistors and receivers electrically connected to the transistors. Each transistor controls a corresponding one of the receivers to receive a second vibration wave, generated after an object reflects a first vibration wave, and to generate a sensing signal. Each receiver has a first electrode, a second electrode and a nano-gap, which is created between the first and second electrodes after a semiconductor-metal compound is formed. A display integrating the pseudo-piezoelectric d33 vibration device is also provided.
    Type: Grant
    Filed: April 27, 2020
    Date of Patent: July 13, 2021
    Assignee: MAY SUN TECHNOLOGY CO., LTD.
    Inventor: Bruce C. S. Chou
  • Patent number: 11063241
    Abstract: A display apparatus includes a flexible substrate and a first insulation layer disposed on the flexible substrate. The flexible substrate includes a bending area. The first insulation layer includes a first unevenness disposed over the bending area. The first unevenness includes two or more steps in at least a portion of the first unevenness.
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: July 13, 2021
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventor: Hyekyung Park
  • Patent number: 11054327
    Abstract: A microelectromechanical pressure sensor includes a monolithic body of semiconductor material having a front surface. A sensing structure is integrated in the monolithic body and has a buried cavity completely contained within the monolithic body at the front surface. A sensing membrane is suspended above the buried cavity and is formed by a surface portion of the monolithic body. Sensing elements of a piezoresistive type are arranged in the sensing membrane to detect a deformation of the sensing membrane as a result of a pressure. The pressure sensor is further provided with a self-test structure integrated within the monolithic body to cause application of a testing deformation of the sensing membrane in order to verify proper operation of the sensing structure.
    Type: Grant
    Filed: January 15, 2019
    Date of Patent: July 6, 2021
    Assignee: STMicroelectronics S.r.l.
    Inventors: Enri Duqi, Lorenzo Baldo
  • Patent number: 11054633
    Abstract: A mirror assembly, a control method thereof and a light adjusting board are provided. The mirror assembly includes a mirror, a first rotation electrode, a second rotation electrode, a first electrode, a second electrode, a third electrode and a fourth electrode. The mirror includes a rotation axis; the first rotation electrode and the second rotation electrode are respectively at two sides of the rotation axis; the first electrode and the second electrode are opposite to form a first electric field; the first rotation electrode is between the first electrode and the second electrode; the third electrode and the fourth electrode are opposite to form a second electric field; the second rotation electrode is between the third electrode and the fourth electrode; the first rotation electrode and the second rotation electrode rotate under the two electric fields to drive the mirror to rotate around the rotation axis.
    Type: Grant
    Filed: September 18, 2019
    Date of Patent: July 6, 2021
    Assignees: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Jinyu Ren, Bo Zhou, Yongzhi Song
  • Patent number: 11041774
    Abstract: A pressure sensor package includes a package lead frame including a molding plastic layer with a top surface and a plurality of lead frame units mounted in the molding plastic layer, a sidewall disposed on the top surface of the molding plastic layer and surrounding a receiving chamber, a pressure sensor module mounted on the top surface of the molding plastic layer and disposed in the receiving chamber, and a packaging silicone mounted in the receiving chamber to encapsulate the pressure sensor module.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: June 22, 2021
    Assignee: LINGSEN PRECISION INDUSTRIES, LTD.
    Inventors: Ming-Te Tu, Chiung-Yueh Tien, Cheng-Yao Chang, Mei-Yen Su
  • Patent number: 11035747
    Abstract: A pressure detection apparatus includes a base plate including a first surface, a second surface, and an opening, a pressure sensor disposed on the first surface so as to cover the opening of the base plate and outputting an electric signal according to a pressure of measured fluid inside the opening, a lead terminal electrically connected to the pressure sensor, a housing holding the base plate and the lead terminal and including an exposed portion in which a portion of the lead terminal is exposed, and a capacitor protecting the pressure sensor. The housing includes a capacitor housing portion, the capacitor being electrically connected to the lead terminal inside the exposed portion, and a positioning portion that positions, inside the capacitor housing portion, the capacitor that has been mounted in the capacitor housing portion.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: June 15, 2021
    Assignee: Nidec Tosok Corporation
    Inventors: Yoshiyuki Kobayashi, Shigehiro Kataoka, Yoshihiro Kamimura
  • Patent number: 11031074
    Abstract: A semiconductor device includes a semiconductor substrate including a fin of semiconductor material having a fin width and a fin length. The fin length is greater than the fin width and extends between a first fin end and a second fin end. A gate electrode extends over the fin at a first fin location between the first fin end and the second fin end. A dummy gate electrode extends over the first fin end and is floating.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: June 8, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Jhon Jhy Liaw
  • Patent number: 11022590
    Abstract: An electronic component comprises a carrier (3), a sensor device (2) mounted on the carrier (3), which sensor device (2) comprises a sensor chip (21), and an electrostatic discharge protection element (1) for protecting the sensor chip (21) from an electrostatic discharge, which protection element (1) is mounted on the carrier (3).
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: June 1, 2021
    Assignee: SENSIRION AG
    Inventors: Markus Wiget, Stephan Braun, Lukas Winkler, Markus Graf, Lukas Hoppenau, Tobias Schmid
  • Patent number: 11023702
    Abstract: There is provided a fingerprint sensing module comprising a fingerprint sensor device having a sensing array arranged on a first side of the device, the sensing array comprising an array of fingerprint sensing elements. The fingerprint sensor device also comprises connection pads for connecting the fingerprint sensor device to external circuitry. The fingerprint sensing module further comprises a fingerprint sensor device cover structure arranged to cover the fingerprint sensor device, the cover structure having a first side configured to be touched by a finger, thereby forming a sensing surface of the sensing module, and a second side facing the sensing array, wherein the cover structure comprises conductive traces for electrically connecting the fingerprint sensor module to external circuitry, and wherein a surface area of the cover structure is larger than a surface area of the sensor device.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: June 1, 2021
    Assignee: Fingerprint Cards AB
    Inventors: Nils Lundberg, Zhimin Mo, Mats Slottner
  • Patent number: 11010002
    Abstract: An electronic pen includes a tubular casing, and a first coupling member and a second coupling member that are coupled to each other in a hollow portion of the casing in an axial direction of the casing. In the axial direction, the first coupling member and the second coupling member are coupled to each other while partially overlapping each other, and in a coupling portion between the first coupling member and the second coupling member, a welded portion that attaches the first coupling member and the second coupling member to each other is formed.
    Type: Grant
    Filed: March 4, 2020
    Date of Patent: May 18, 2021
    Assignee: Wacom Co., Ltd.
    Inventors: Kohei Tanaka, Hiroyuki Fujitsuka, Kenichi Ninomiya, Takenori Kaneda, Gunji Ishihara, Takashi Yamaguchi, Taketoshi Ito, Shuanglei Li
  • Patent number: 10988372
    Abstract: A method includes forming a first mask on a first portion of a first surface of a substrate, forming a second mask on the first mask and further forming the second mask on a second portion of the first surface of the substrate, and etching an exposed portion of the first surface of the substrate and removing the second mask. According to some embodiments, an exposed portion of the first surface of the substrate is etched and the first mask is removed. An oxide layer is formed on the first surface of the substrate. A third mask is formed on the oxide layer except for a portion of the oxide layer corresponding to bumpstop features. The portion of the oxide layer corresponding to the bumpstop features is removed. An exposed portion of the first surface of the substrate is etched and the third mask is removed.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: April 27, 2021
    Assignee: InvenSense, Inc.
    Inventor: Dongyang Kang
  • Patent number: 10989918
    Abstract: An optical scanner includes a movable portion having a movable plate on which a light reflecting portion is provided, a frame body portion provided surrounding the movable portion when viewed in a planar manner, a first axis portion that oscillatably supports the movable portion around a first oscillation axis, a second axis portion that oscillatably supports the frame body portion around a second oscillation axis, which intersects the first oscillation axis, and a permanent magnet provided in the frame body portion, in which the movable portion has a projection portion, which is disposed overlapping the first oscillation axis within a region that does not overlap with the permanent magnet when viewed in a planar manner, and which projects, from the movable plate, further to the permanent magnet side than the first axis portion.
    Type: Grant
    Filed: September 7, 2017
    Date of Patent: April 27, 2021
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Hisako Kojima
  • Patent number: 10991322
    Abstract: Provided is a bistable driving method for an electrowetting display, comprising: setting a non-selected voltage for one or more writing rows; switching a row voltage of the one or more writing rows from the non-selected voltage to a selected voltage; applying the digital voltage on at least one column of digital electrodes to be written; switching the row voltage of the one or more writing rows from the selected voltage to the non-selected voltage, and decreasing the digital voltage applied to the at least one column to a voltage less than the opening voltage minus the selected voltage; and applying the steps above to next one or more writing rows until an entire display screen is written.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: April 27, 2021
    Assignees: Academy of Shenzhen Guohua Optoelectronics, Shenzhen Guohua Optoelectronics Co., Ltd.
    Inventors: Guofu Zhou, Weijie Lin, Alexander Victor Henzen
  • Patent number: 10981779
    Abstract: A MEMS device and methods of forming are provided. A dielectric layer of a first substrate is patterned to expose conductive features and a bottom layer through the dielectric layer. A first surface of a second substrate is bonded to the dielectric layer and the second substrate is patterned to form a membrane and a movable element. A cap wafer is bonded to the second substrate, where bonding the cap wafer to the second substrate forms a first sealed cavity comprising the movable element and a second sealed cavity that is partially bounded by the membrane. Portions of the cap wafer are removed to expose the second sealed cavity to ambient pressure.
    Type: Grant
    Filed: March 2, 2018
    Date of Patent: April 20, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Fung Chang, Len-Yi Leu, Lien-Yao Tsai
  • Patent number: 10985226
    Abstract: Provided are an ink jet printing organic light emitting diode display panel and a manufacturing method thereof. The method includes: sequentially forming a passivation layer and a planarization layer on a carrier substrate prepared with one pair of thin film transistors, wherein the passivation layer covers the one pair of thin film transistors; forming one pair of vias in the passivation layer and the planarization layer; forming one pair of anodes on the planarization layer, wherein the one pair of anodes are electrically connected to the one pair of thin film transistors through the one pair of vias in the passivation layer and the planarization layer; preparing an electrode separation layer between the one pair of anodes with Al2O3 or an organic photoresist material; forming a light emitting layer over the one pair of anodes by ink jet printing, wherein the light emitting layer covers the electrode separation layer.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: April 20, 2021
    Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventors: Zhaosong Liu, Yuanjun Hsu
  • Patent number: 10978457
    Abstract: The present invention provides a semiconductor device, the semiconductor device includes a substrate, at least one bit line is disposed on the substrate, a rounding hard mask is disposed on the bit line, and the rounding hard mask defines a top portion and a bottom portion, and at least one storage node contact plug, located adjacent to the bit line, the storage node contact structure plug includes at least one conductive layer, from a cross-sectional view, the storage node contact plug defines a width X1 and a width X2. The width X1 is aligned with the top portion of the rounding hard mask in a horizontal direction, and the width X2 is aligned with the bottom portion of the rounding hard mask in the horizontal direction, X1 is greater than or equal to X2.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: April 13, 2021
    Assignees: UNITED MICROELECTRONICS CORP., Fujian Jinhua Integrated Circuit Co., Ltd.
    Inventors: Li-Wei Feng, Yu-Hsiang Hung, Ming-Te Wei
  • Patent number: 10969576
    Abstract: Disclosed herein are maskless imaging tools and display systems that include piezoelectrically actuated mirrors and methods of forming such devices. The maskless imaging tool may include a light source. Additionally, the tool may include one or more piezoelectrically actuated mirrors for receiving light from the light source. The piezoelectrically actuated mirrors are actuatable about one or more axes to reflect the light from the light source to a workpiece positioned to receive light from the piezoelectrically actuated mirror. Disclosed herein is a maskless imaging tool that is a laser direct imaging lithography (LDIL) tool. The maskless imaging tool may also be a via-drill tool. Disclosed herein is also a piezoelectrically actuated mirror used in a projection system. For example, the projection system may be integrated into a pair of glasses.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: April 6, 2021
    Assignee: Intel Corporation
    Inventors: Aleksandar Aleksov, Feras Eid, Sasha N. Oster, Shawna M. Liff, Johanna M. Swan, Thomas L. Sounart, Baris Bicen, Valluri R. Rao
  • Patent number: 10961118
    Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. In some embodiments, a ventilation trench and an isolation trench are concurrently within a capping substrate. The isolation trench isolates a silicon region and has a height substantially equal to a height of the ventilation trench. A sealing structure is formed within the ventilation trench and the isolation trench, the sealing structure filing the isolation trench and defining a vent within the ventilation trench. A device substrate is provided and bonded to the capping substrate at a first gas pressure and hermetically sealing a first cavity associated with a first MEMS device and a second cavity associated with a second MEMS device. The capping substrate is thinned to open the vent to adjust a gas pressure of the second cavity.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: March 30, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Wen-Chuan Tai, Ching-Kai Shen, Hua-Shu Ivan Wu, Fan Hu
  • Patent number: 10961116
    Abstract: A micro-electro-mechanical sensor comprises a first substrate comprising an element movable with respect to the first substrate and a second substrate comprising a first contact pad and a second contact pad. The first substrate is bonded to the second substrate such that a movement of the element changes a coupling between the first contact pad and the second contact pad.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: March 30, 2021
    Assignee: Infineon Technologies Dresden GmbH & Co. KG
    Inventors: Dirk Meinhold, Steffen Bieselt, Erhard Landgraf
  • Patent number: 10961115
    Abstract: A semiconductor structure includes a first substrate; a heater surrounded by the first substrate; a pressure adjusting material disposed over the first substrate and adjacent to the heater; a second substrate disposed over the first substrate; and a cavity enclosed by the first substrate and the second substrate, wherein the pressure adjusting material is disposed within the cavity.
    Type: Grant
    Filed: January 16, 2019
    Date of Patent: March 30, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventor: Kuei-Sung Chang
  • Patent number: 10943851
    Abstract: An integrated circuit device assembly may be formed comprising a reconstituted wafer attached to a base substrate, wherein the base substrate provides thermal management and optical signal routes. In one embodiment, the base substrate may include a plurality of electrical interconnects for electrically coupling integrated circuit devices in the reconstituted wafer. In another embodiment, a plurality of electrical interconnects for electrically coupling integrated circuit devices in the reconstituted wafer may be formed in the reconstituted wafer itself.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: March 9, 2021
    Assignee: Intel Corporation
    Inventors: Adel Elsherbini, Shawna Liff, Henning Braunisch, Johanna Swan
  • Patent number: 10935567
    Abstract: In a physical quantity sensor, wirings provided on a projection and a bonding pad form a silicide layer and are electrically connected. The wirings are multilayered films. A noble metal layer covers the projection and contacts the bonding pad to form the silicide layer. A metal layer extends between the noble metal layer and a base substrate. The metal layer, the noble metal layer, an adhesion layer, and an insulating layer are stacked in this order from the base substrate in all areas except for atop the projection.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: March 2, 2021
    Inventor: Shuichi Kawano
  • Patent number: 10937718
    Abstract: Package structures and methods of forming package structures are described. A method includes placing a first package within a recess of a first substrate. The first package includes a first die. The method further includes attaching a first sensor to the first package and the first substrate. The first sensor is electrically coupled to the first package and the first substrate.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: March 2, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Chih-Hua Chen, Hao-Yi Tsai, Yu-Feng Chen
  • Patent number: 10927000
    Abstract: A MEMS structure includes a substrate, an inter-dielectric layer on a front side of the substrate, a MEMS component on the inter-dielectric layer, and a chamber disposed within the inter-dielectric layer and through the substrate. The chamber has an opening at a backside of the substrate. An etch stop layer is disposed within the inter-dielectric layer. The chamber has a ceiling opposite to the opening and a sidewall joining the ceiling. The sidewall includes a portion of the etch stop layer.
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: February 23, 2021
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Li-Che Chen, Te-Yuan Wu, Chia-Huei Lin, Hui-Min Wu, Kun-Che Hsieh, Kuan-Yu Wang, Chung-Yi Chiu
  • Patent number: 10927002
    Abstract: A membrane component comprises a membrane structure comprising an electrically conductive membrane layer. The electrically conductive membrane layer has a suspension region and a membrane region. In addition, the suspension region of the electrically conductive membrane layer is arranged on an insulation layer. Furthermore, the insulation layer is arranged on a carrier substrate. Moreover, the membrane component comprises a counterelectrode structure. A cavity is arranged vertically between the counterelectrode structure and the membrane region of the electrically conductive membrane layer. In addition, an edge of the electrically conductive membrane layer projects laterally beyond an edge of the insulation layer by more than half of a vertical distance between the electrically conductive membrane layer and the counterelectrode structure.
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: February 23, 2021
    Assignee: INFINEON TECHNOLOGIES AG
    Inventor: Alfons Dehe
  • Patent number: 10923407
    Abstract: Provided is a semiconductor device including an interconnection structure provided on a cell region of a substrate to include a first line and a second line sequentially stacked on the substrate, and a defect detection structure provided on a peripheral region of the substrate to include first and second defect detection lines provided at the same levels as those of the first and second lines, respectively.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: February 16, 2021
    Inventors: Sundae Kim, Yun-Rae Cho, Namgyu Baek, Seokhyun Lee
  • Patent number: 10924867
    Abstract: A microphone includes a housing including a substrate and a cover disposed over the substrate, the housing including a sound port between the interior of the housing and the exterior of the housing. The microphone also includes a microelectromechanical systems (MEMS) transducer and an integrated circuit (IC) positioned within the housing and mounted on a common surface of the housing, where the MEMS transducer is electrically connected to the IC, and the IC is electrically connected to a conductor on the substrate. The microphone further includes an encapsulating material covering the IC, and an encapsulating material confinement structure disposed between the MEMS transducer and the IC, where the encapsulating material confinement structure at least partially confines the encapsulating material around the IC.
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: February 16, 2021
    Assignee: Knowles Electroics, LLC
    Inventors: Tony K. Lim, John Szczech, Joshua Watson
  • Patent number: 10917026
    Abstract: A microelectromechanical structure with electrothermal actuation including a fixed part, a moveable part, a first electrothermal actuating beam enabling an electric current to flow from the fixed part to the moveable part and a second electrothermal actuating beam enabling an electric current to flow from the fixed part to the moveable part, the beams being mechanically connected to the moveable part enabling a displacement of the moveable part by electrothermal actuation, an electrically conductive connecting element connecting the moveable part to the fixed part, a first connector for connecting the first actuating beam to a first polarisation source and a second connector for connecting the second actuating beam to a second polarisation source, such that the first and the second can be polarised differently and separately.
    Type: Grant
    Filed: October 19, 2016
    Date of Patent: February 9, 2021
    Assignees: Commissariat A L'Energie Atomique et aux Energies Alternatives, SAFRAN ELECTRONICS & DEFENSE
    Inventors: Guillaume Jourdan, Guillaume Lehee
  • Patent number: 10910341
    Abstract: First and second contacts are formed on first and second wafers from disparate first and second conductive materials, at least one of which is subject to surface oxidation when exposed to air. A layer of oxide-inhibiting material is disposed over a bonding surface of the first contact and the first and second wafers are positioned relative to one another such that a bonding surface of the second contact is in physical contact with the layer of oxide-inhibiting material. Thereafter, the first and second contacts and the layer of oxide-inhibiting material are heated to a temperature that renders the first and second contacts and the layer of oxide-inhibiting material to liquid phases such that at least the first and second contacts alloy into a eutectic bond.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: February 2, 2021
    Assignee: SiTime Corporation
    Inventors: Paul M. Hagelin, Charles I. Grosjean
  • Patent number: 10901021
    Abstract: Embodiments include systems and methods for determining a processing parameter of a processing operation. Some embodiments include a diagnostic substrate that comprises a substrate, a circuit layer over the substrate, a capping layer over the circuit layer, and a sensing region across the capping layer. In an embodiment, the sensing region comprises, an array of first micro resonators and a second micro resonator. In an embodiment, the array of first micro resonators surround the second micro resonator.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: January 26, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Chuang-Chia Lin, Upendra Ummethala
  • Patent number: 10899608
    Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. A device substrate comprising first and second MEMS devices is bonded to a capping substrate comprising first and second recessed regions. A ventilation trench is laterally spaced apart from the recessed regions and within the second cavity. A sealing structure is arranged within the ventilation trench and defines a vent in fluid communication with the second cavity. A cap is arranged within the vent to seal the second cavity at a second gas pressure that is different than a first gas pressure of the first cavity.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: January 26, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Wen-Chuan Tai, Ching-Kai Shen, Hua-Shu Ivan Wu, Fan Hu
  • Patent number: 10896787
    Abstract: The present invention generally relates to a mechanism for making a MEMS switch that has a robust RF-contact by avoiding currents to run through a thin sidewall in a via from the RF-contact to the underlying RF-electrode.
    Type: Grant
    Filed: November 14, 2016
    Date of Patent: January 19, 2021
    Assignee: Cavendish Kinetics, Inc.
    Inventors: Robertus Petrus Van Kampen, James Douglas Huffman, Mickael Renault, Shibajyoti Ghosh Dastider, Jacques Marcel Muyango
  • Patent number: 10889491
    Abstract: A method for producing a micromechanical element includes producing a micromechanical structure, the micromechanical structure having: a functional layer for a micromechanical element, a sacrifical layer at least partly surrounding the functional layer, and a closure cap on the sacrifical layer. The method further includes applying a cover layer on the micromechanical structure. The method further includes producing a grid structure in the cover layer. The method further includes producing a cavity below the grid structure, as access to the sacrifical layer. The method further includes at least partly removing the sacrifical layer. The method further includes applying a closure layer at least on the grid structure of the cover layer for the purpose of closing the access to the cavity.
    Type: Grant
    Filed: September 18, 2018
    Date of Patent: January 12, 2021
    Assignee: Robert Bosch GmbH
    Inventors: Markus Kuhnke, Heiko Stahl, Stefan Majoni
  • Patent number: 10882738
    Abstract: A MEMS device package comprising a first die of semiconductor material including a contact pad and a second die of semiconductor material stacked on the first die. The second die is smaller than the first die. The second die includes a contact pad, and a conductive wire is coupled between the contact pad of the first die and a contact pad of the second die. A mold compound is on the second die and the first die. A vertical connection structure is on the contact pad of the second die. The vertical connection structure extends through the mold compound.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: January 5, 2021
    Assignee: STMICROELECTRONICS (MALTA) LTD
    Inventors: Conrad Cachia, David Oscar Vella, Damian Agius, Maria Spiteri
  • Patent number: 10882735
    Abstract: Capped microelectromechanical systems (MEMS) devices are described. In at least some situations, the MEMS device includes one or more masses which move. The cap may include a stopper which damps motion of the one or more movable masses. In at least some situations, the stopper damps motion of one of the masses but not another mass.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: January 5, 2021
    Assignee: Analog Devices, Inc.
    Inventors: Jinbo Kuang, Gaurav Vohra
  • Patent number: 10885422
    Abstract: A device has a latching mechanism including a catch element having at least two catches, and a pawl configured to engage in a catch interstice between two catches. The catch element is movable in relation to the pawl in a freewheeling direction, and a movement of the catch element in relation to the pawl in a blocking direction may be blocked by means of the pawl. The device further includes a deflectable actuator configured to move the catch element and the pawl relative to each other on a catch-by-catch basis in the freewheeling direction by means of deflection. According to the invention, the device also includes an electric component configured to change its electric property as a function of the catch-wise movement of the catch element in relation to the pawl.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: January 5, 2021
    Assignee: Hahn-Schickard-Gesellschaft fur angewandte Forschung e.V.
    Inventor: Sven Spieth
  • Patent number: 10877110
    Abstract: A high-sensitivity and ultra-low power consumption magnetic sensor using a magnetoelectric (ME) composite comprising of magnetostrictive and piezoelectric layers. This sensor exploits the magnetically driven resonance shift of a free-standing magnetoelectric micro-beam resonator. Also disclosed is the related method for making the magnetic sensor.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: December 29, 2020
    Assignee: The Government of the United States of America, as represented by the Secretary of the Navy
    Inventors: Peter Finkel, Steven P. Bennett, Margo Staruch, Konrad Bussmann, Jeffrey W. Baldwin, Bernard R. Matis, Ronald Lacomb, William Zappone, Julie Lacomb, Meredith Metzler, Norman Gottron
  • Patent number: 10869519
    Abstract: A micro-electro-mechanical (MEMS) exhaust valve-based impact attenuating fluid filled cell for use in cushioning impact and decelerating of a wearer's body portion (e.g. head, shoulder, torso, etc.) after an impact. In combination with the use of accelerometers, pressure sensors, location and other electronics supply signals to a microcontroller, the controlled opening/closing of said exhaust valve (resulting in the expelling of said fluids with an optional combination with cell refill means) when certain parameters exceed a threshold.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: December 22, 2020
    Inventor: Raymond Louis Barrett, Jr.
  • Patent number: 10867757
    Abstract: A microelectromechanical resonant switch (“resoswitch”) converts received radio frequency (RF) energy into a clock output. The resoswitch first accepts incoming amplitude- or frequency-shift keyed clock-modulated RF energy at a carrier frequency, filters it, provides power gain via resonant impact switching, and finally envelop detects impact impulses to demodulate and recover the carrier clock waveform. The resulting output derives from the clock signal that originally modulated the RF carrier, resulting in a local clock that shares its originator's accuracy. A bare push-pull 1-kHz RF-powered mechanical clock generator driving an on-chip inverter gate capacitance of 5 fF can potentially operate with only 5 pW of battery power, 200,000 times lower than a typical real-time clock. Using an off-chip inverter with 17.5 pF of effective capacitance, a 1-kHz push-pull resonator would consume 17.5 nW.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: December 15, 2020
    Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Clark T.-C. Nguyen, Ruonan Liu, Jalal Naghsh Nilchi
  • Patent number: 10867756
    Abstract: The present invention generally relates to a mechanism for making a MEMS switch that has a robust RF-contact by avoiding currents to run through a thin sidewall in a via from the RF-contact to the underlying RF-electrode.
    Type: Grant
    Filed: November 14, 2016
    Date of Patent: December 15, 2020
    Assignee: Cavendish Kinetics, Inc.
    Inventors: Robertus Petrus Van Kampen, James Douglas Huffman, Mickael Renault, Shibajyoti Ghosh Dastider, Jacques Marcel Muyango
  • Patent number: 10866214
    Abstract: An element of a photoacoustic sensor combines an optomechanical resonator and a photoacoustic cavity. The photoacoustic cavity is formed by a measurement chamber, traversed by a pulsed excitation beam. The optomechanical resonator is formed by an optical resonator, a mechanical element for being set in rapid oscillations, by an optical signal confined in the optomechanical resonator, and in slow oscillations, by an acoustic wave generated in the photoacoustic cavity. A measurement beam is sent into the optical resonator, where it carries out several passages via the mechanical element. The optical properties thereof at the output of the optical resonator are therefore dependent on the oscillations of the mechanical element. A low-frequency-amplitude-modulated high-frequency signal can be obtained, with the amplitude modulation representing the acoustic wave in the measurement chamber. An accurate, low-noise, and highly compact method is enabled for making measurements with a photoacoustic effect.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: December 15, 2020
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Laurent Duraffourg, Pierre Labeye, Boris Taurel
  • Patent number: 10861715
    Abstract: In described examples, a method for encapsulating a semiconductor device includes the steps of immersing a layer of the semiconductor device in a liquid encapsulation material, irradiating portions of the liquid encapsulation material to polymerize the liquid encapsulation material, and moving the semiconductor device further from a surface of the liquid encapsulation material proximate to the layer. Immersing the semiconductor device is performed to cover a layer of the device in the liquid encapsulation material. Targeted locations of the liquid encapsulation material covering the layer are irradiated to form solid encapsulation material. The semiconductor device is moved from a surface of the liquid encapsulation material so that a new layer of the semiconductor device and/or of the solid encapsulation material can be covered by the liquid encapsulation material.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: December 8, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Benjamin Stassen Cook, Daniel Lee Revier
  • Patent number: 10858245
    Abstract: A semiconductor device and a method of manufacturing the same are provided such that a microelectromechanical systems (MEMS) element is protected at an early manufacturing stage. A method for protecting a MEMS element includes: providing at least one MEMS element, having a sensitive area, on a substrate; and depositing, prior to a package assembly process, a protective material over the sensitive area of the at least one MEMS element such that the sensitive area of at least one MEMS element is sealed from an external environment, where the protective material permits a sensor functionality of the at least one MEMS element.
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: December 8, 2020
    Assignee: Infineon Technologies AG
    Inventors: Florian Brandl, Manfred Fries, Franz-Peter Kalz
  • Patent number: 10849240
    Abstract: A contact pad includes a solder-wettable porous network (310) which wicks the molten solder (130) and thus restricts the lateral spread of the solder, thus preventing solder bridging between adjacent contact pads.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: November 24, 2020
    Assignee: Invensas Corporation
    Inventors: Liang Wang, Rajesh Katkar, Hong Shen, Cyprian Emeka Uzoh
  • Patent number: 10840231
    Abstract: A semiconductor device includes a first chip, a dielectric layer over the first chip, and a second chip over the dielectric layer. A conductive layer is embedded in the dielectric layer and is electrically coupled to the first chip and the second chip. The second chip includes an optical component. The first chip and the second chip are arranged on opposite sides of the dielectric layer in a thickness direction of the dielectric layer.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: November 17, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jui Hsieh Lai, Ying-Hao Kuo, Kuo-Chung Yee