Physical Deformation Patents (Class 257/415)
  • Patent number: 10766763
    Abstract: The present disclosure relates to a microphone. In some embodiments, the microphone may comprise a substrate, a diaphragm, a backplate, and a sidewall stopper. The substrate has an opening disposed through the substrate. The diaphragm is disposed over the substrate and facing the opening of the substrate. The diaphragm has a venting hole overlying the opening of the substrate. A backplate is disposed over and spaced apart from the diaphragm. A sidewall stopper is disposed along a sidewall of the venting hole of the diaphragm and thus is not limited by a distance between the movable part and the stable part. Also, the sidewall stopper does not alternate the shape of movable part, and thus will less likely introduce crack to the movable part. In some embodiments, the sidewall stopper may be formed like a sidewall stopper by a self-alignment process, such that no extra mask is needed.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: September 8, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shih-Wei Lin, Chang-Ming Wu, Ting-Jung Chen
  • Patent number: 10763215
    Abstract: A hybrid microelectronic substrate may be formed by the incorporation of a high density microelectronic patch substrate within a lower density microelectronic substrate. The hybrid microelectronic substrate may allow for direct flip chip attachment of a microelectronic device having high density interconnections to the high density microelectronic patch substrate portion of the hybrid microelectronic substrate, while allowing for lower density interconnection and electrical routes in areas where high density interconnections are not required.
    Type: Grant
    Filed: December 9, 2015
    Date of Patent: September 1, 2020
    Assignee: Intel Corporation
    Inventors: Robert Starkston, Robert L. Sankman, Scott M. Mokler, Richard C. Stamey
  • Patent number: 10753877
    Abstract: A detection device can include a cavity structure forming a Fabry-Perot optical microcavity, an electrostatic trap, and a Brownian motor. The Fabry-Perot optical microcavity has two mirrors extending on each side of a reference plane in a spacer region between the two mirrors. The mirrors are configured to vertically confine radiation in the spacer region, e.g., with respect to a first direction perpendicular to the reference plane. The electrostatic trap is arranged in the spacer region. The trap includes a pit and the cavity structure is generally configured to confine radiation in the pit, laterally (e.g., with respect to a second direction parallel to the reference plane). The Brownian motor structure extends in the spacer region along said reference plane. This structure is adapted to laterally load particles in the pit of the electrostatic trap by moving such particles along the structure, in operation.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: August 25, 2020
    Assignee: International Business Machines Corporation
    Inventors: Christian Michael Schwemmer, Darius Urbonas, Francesca Ruggeri, Thilo Hermann Curt Stoeferle, Armin Knoll
  • Patent number: 10742217
    Abstract: Multi-chip systems and structures for modular scaling are described. In some embodiments an interfacing bar is utilized to couple adjacent chips. For example, a communication bar may utilized to coupled logic chips, and memory bar may be utilized to couple multiple memory chips to a logic chip.
    Type: Grant
    Filed: February 4, 2019
    Date of Patent: August 11, 2020
    Assignee: Apple Inc.
    Inventors: Sanjay Dabral, Bahattin Kilic, Jie-Hua Zhao, Kunzhong Hu, Suk-Kyu Ryu
  • Patent number: 10733916
    Abstract: An electronic tag including an electronic paper display, a driving circuit, and an energy harvesting device is provided. The electronic paper display is configured to display tag information. The driving circuit is coupled to the electronic paper display and includes a voltage detecting circuit. The energy harvesting device is coupled to the driving circuit and configured to generate a first power signal. The voltage detecting circuit is configured to receive the first power signal. When a voltage value of the first power signal is higher than a threshold voltage value, the voltage detecting circuit outputs the first output power signal so that the driving circuit enables the electronic paper display by the first output power signal. In addition, a driving method of the above electronic tag is also provided.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: August 4, 2020
    Assignee: E Ink Holdings Inc.
    Inventors: Yu-Ming Lee, Chuen-Jen Liu
  • Patent number: 10725067
    Abstract: The invention relates to an accelerometer comprising a plurality of proof-masses (M1-M4) moveable along a measurement axis (AB); a respective spring (K1-K4) rigidly attached to each proof-mass, configured to exert an elastic recall on the proof-mass in the measurement axis; a fixed stop (S1-S4) associated with each proof-mass, arranged to intercept the proof-mass when the acceleration in the measurement axis increases by a step; and an electrical contact associated with each stop, configured to be closed when the associated proof-mass reaches the stop. The proof-masses are suspended in series with respect to one another by springs in the measurement axis, the stops being arranged to successively intercept the respective proof-masses for increasing thresholds of acceleration.
    Type: Grant
    Filed: April 5, 2017
    Date of Patent: July 28, 2020
    Inventors: Nicolas Pierre Delorme, Daniel Saias
  • Patent number: 10726231
    Abstract: Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: July 28, 2020
    Assignee: INVENSENSE, INC.
    Inventors: Julius Ming-Lin Tsai, Mike Daneman, Sanjiv Kapoor
  • Patent number: 10710871
    Abstract: An embodiment is MEMS device including a first MEMS die having a first cavity at a first pressure, a second MEMS die having a second cavity at a second pressure, the second pressure being different from the first pressure, and a molding material surrounding the first MEMS die and the second MEMS die, the molding material having a first surface over the first and the second MEMS dies. The device further includes a first set of electrical connectors in the molding material, each of the first set of electrical connectors coupling at least one of the first and the second MEMS dies to the first surface of the molding material, and a second set of electrical connectors over the first surface of the molding material, each of the second set of electrical connectors being coupled to at least one of the first set of electrical connectors.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: July 14, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Wen Cheng, Jung-Huei Peng, Shang-Ying Tsai, Hung-Chia Tsai, Yi-Chuan Teng
  • Patent number: 10696544
    Abstract: A synthetic resin molded article includes an electric element part extending in a distal direction and a primary molded part. The primary molded part has an element covering portion and a body portion. The element covering portion has a distal end surface exposed in the distal direction and a first side surface extending in a proximal direction opposite to the distal direction. The element covering portion covers a proximal portion of the electric element portion, and a distal end portion of the electric element portion projects from the distal end surface in the distal direction. The body portion has an intermediate surface exposed in the distal direction and a second side surface extending in the proximal direction. The body portion is disposed on a side of the element covering portion in the distal direction and is integrally connected to the element covering portion.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: June 30, 2020
    Assignee: DENSO CORPORATION
    Inventors: Motomi Ishikawa, Norihito Yoshida, Ryosuke Izumi, Hiroyuki Yamakawa, Hodaka Mori
  • Patent number: 10665398
    Abstract: A switch assembly includes a case and a direct current (DC) electronic solid-state switch coupled to the case. The case covers the DC electronic solid-state switch, and the DC electronic solid-state switch has an on-state and off-state. The DC electronic solid-state switch blocks between 650 volts and 1200 volts in a single direction in an off-state. The DC electronic solid-state switch continuously carries at least 400 amperes direct current with a voltage drop of less than one volt. The DC electronic solid-state switch also includes a plurality of semiconductor dies each forming a MOSFET. The DC electronic solid-state switch also includes a plurality of signal conductors.
    Type: Grant
    Filed: September 23, 2019
    Date of Patent: May 26, 2020
    Assignee: GM Global Technology Operations LLC
    Inventors: Chandra S. Namuduri, Rashmi Prasad
  • Patent number: 10662055
    Abstract: A MEMS element includes a surface silicon layer on which an element is formed and on which a first electrode and a second electrode as element electrodes and an electrode pad connected to the first electrode and the second electrode are disposed, and in which a first wiring through-hole is disposed at a position overlapping with the electrode pad of the surface silicon layer and a wiring electrode electrically connected to the electrode pad is disposed in the first wiring through-hole, in plan view.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: May 26, 2020
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Takashi Yamazaki, Akihiko Ebina, Osamu Kawauchi, Yoshihiko Yokoyama
  • Patent number: 10665414
    Abstract: A vacuum transistor includes a substrate and a first terminal formed on the substrate. A piezoelectric element has a second terminal formed on the piezoelectric element, wherein the piezoelectric element is provided over the first terminal to provide a gap between the first terminal and the second terminal. The gap is adjusted in accordance with an electrical field on the piezoelectric element.
    Type: Grant
    Filed: November 2, 2017
    Date of Patent: May 26, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Qing Cao, Kangguo Cheng, Zhengwen Li, Fei Liu
  • Patent number: 10660208
    Abstract: A system and method for providing a packaged electronics module having a dry film battery incorporated therein is disclosed. The packaged electronics module includes a first dielectric layer, at least one electronic component attached to or embedded in the first dielectric layer, a dry film battery formed on the first dielectric layer, and metal interconnects mechanically and electrically coupled to the at least one electronic component and the dry film battery to form electrical interconnections thereto. Electronic components in the form of a MEMS type sensor, semiconductor device and communications device may be included in the module along with the battery to provide a self-powered module capable of communicating with other like packaged electronics modules.
    Type: Grant
    Filed: July 13, 2016
    Date of Patent: May 19, 2020
    Assignee: General Electric Company
    Inventors: Christopher James Kapusta, Kaustubh Ravindra Nadarkar
  • Patent number: 10656174
    Abstract: A physical quantity sensor has a first movable electrode section which has a portion facing a first fixed electrode section and a second movable electrode section which has a portion facing a second fixed electrode section, and is provided with a movable mass section which is formed in a shape which encloses a first fixed electrode side fixed section, a second fixed electrode side fixed section, a first movable electrode side fixed section, and a second movable electrode side fixed section in planar view.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: May 19, 2020
    Assignee: Seiko Epson Corporation
    Inventors: Shota Kigure, Satoru Tanaka
  • Patent number: 10648879
    Abstract: Aspects of the disclosure provide a capacitive pressure sensor. The capacitive pressure sensor can include a first substrate having a first surface and a second surface, a movable plate at a bottom of a first cavity recessed into the substrate from the first surface, and a second substrate bonded to the first substrate over the first surface. A second cavity is formed between the movable plate and the second surface. The second substrate includes a fixed plate disposed over the movable plate to form a capacitor. The second substrate further includes a third cavity between a surface of the fixed plate opposite to the movable plate and a surface of the second substrate opposite to the first substrate.
    Type: Grant
    Filed: February 22, 2017
    Date of Patent: May 12, 2020
    Inventors: Kathirgamasundaram Sooriakumar, Anu Austin, Ian Rose Bihag, Dieter Naegele-Preissmann
  • Patent number: 10631099
    Abstract: A microphone includes a substrate defining an embedded cavity between a first surface of the substrate and an opposing second surface of the substrate, the first surface defining a first opening into the embedded cavity, a distance between the first surface and the second surface defining a substrate thickness. A cover is disposed over the first surface of the substrate and forms a housing, the cover including a port, the substrate thickness being greater than a height of the cover from the first surface of the substrate. A microelectromechanical systems (MEMS) transducer is disposed in the housing and mounted on the first surface of the substrate over the first opening, and an integrated circuit (IC) is disposed in the housing and electrically coupled to the MEMS transducer. The MEMS transducer and the IC are disposed in a front volume of the housing defined by the cover and the substrate.
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: April 21, 2020
    Assignee: Knowles Electronics, LLC
    Inventors: Tony K. Lim, John Szczech, Joshua Watson
  • Patent number: 10584029
    Abstract: A method for producing thin MEMS chips on SOI substrate including: providing an SOI substrate having a silicon layer on a front side and having an oxide intermediate layer, producing a layer structure on the front side of the SOI substrate and producing a MEMS structure from this layer structure, capping the MEMS structure and producing a cavity, and etching a back side of the SOI substrate down to the oxide intermediate layer. Also described is a micromechanical component having a substrate, a MEMS layer structure having a MEMS structure in a cavity and a cap element, the MEMS structure and its cavity being enclosed by the substrate underneath and the cap element above, the substrate being made of polycrystalline silicon.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: March 10, 2020
    Assignee: Robert Bosch GmbH
    Inventors: Jochen Reinmuth, Burkhard Kuhlmann, Holger Hoefer
  • Patent number: 10566279
    Abstract: A package device includes a circuit layer, at least one conductive segment, an encapsulant and a redistribution layer. The conductive segment is disposed on the circuit layer and has a first surface and a second surface. The encapsulant encapsulates at least a portion of the conductive segment and has a first upper surface. A first portion of the first surface and at least a portion of the second surface of the conductive segment are disposed above the first upper surface of the encapsulant. The redistribution layer is disposed on the encapsulant, the first portion of the first surface of the conductive segment, and the second surface of the conductive segment.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: February 18, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Wen-Long Lu, Jen-Kuang Fang, Min Lung Huang, Chan Wen Liu, Ching Kuo Hsu
  • Patent number: 10559524
    Abstract: A packaged semiconductor device includes a leadframe (LF) having a plurality of laminate-supporting pedestals. A cured first die attach (DA) material is on an outer edge of the pedestals being an ultraviolet (UV)-curing DA material having a photoinitiator or a cured B-stage DA material. A cured thermally-curing DA material is on an area of the pedestals not occupied by the UV-curing DA material. A laminate component having bond pads on a top side is mounted top side up on the plurality of pedestals.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: February 11, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Sadia Naseem, Vikas Gupta, Rongwei Zhang
  • Patent number: 10547955
    Abstract: A microphone device includes a housing including a substrate having a first surface and a cover disposed over the substrate, the housing including a sound port between the interior of the housing and the exterior of the housing. The device also includes a microelectromechanical systems (MEMS) transducer mounted on the substrate and an integrated circuit (IC) mounted on the substrate. The MEMS transducer of the device is electrically connected to the IC, and the IC of the device is electrically connected to a conductor on the substrate. An encapsulating material covers the IC. And an encapsulating material confinement structure is disposed between the MEMS transducer and the IC, wherein the encapsulating material confinement structure at least partially confines the encapsulating material around the IC.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: January 28, 2020
    Assignee: Knowles Electronics, LLC
    Inventors: Tony K. Lim, John Szczech, Joshua Watson
  • Patent number: 10544038
    Abstract: A MEMS microphone includes a substrate having a cavity, a back plate provided over the substrate and having a plurality of acoustic holes, a diaphragm disposed between the substrate and the back plate, and spaced apart from the substrate and the back plate, a strut located at outer side of the diaphragm, having a lower surface in contact with an upper surface of the substrate and being integrally formed with the upper insulation layer to support the upper insulation layer to space the upper insulation layer from the diaphragm, and a bending prevention member provided on an upper surface of the back plate for preventing the back plate from being bent.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: January 28, 2020
    Assignee: DB HITEK CO., LTD.
    Inventors: Dong Chun Park, Jong Won Sun
  • Patent number: 10532926
    Abstract: A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric layer disposed between the handle and device wafers. The MEMS wafer also includes a moveable portion of the device wafer suspended over a cavity in the handle wafer. Four methods are described to create two or more enclosures having multiple gas pressure or compositions on a single substrate including, each enclosure containing a moveable portion. The methods include: A. Forming a secondary sealed enclosure, B. Creating multiple ambient enclosures during wafer bonding, C. Creating and breaching an internal gas reservoir, and D. Forming and subsequently sealing a controlled leak/breach into the enclosure.
    Type: Grant
    Filed: November 22, 2016
    Date of Patent: January 14, 2020
    Assignee: INVENSENSE, INC.
    Inventors: Michael Daneman, Martin Lim, Kegang Huang, Igor Tchertkov
  • Patent number: 10532925
    Abstract: The present disclosure relates to a micro-electromechanical system (MEMs) package. In some embodiments, the MEMs package has a plurality of conductive interconnect layers disposed within a dielectric structure over an upper surface of a first substrate. A heating element is electrically coupled to a semiconductor device within the first substrate by one or more of the plurality of conductive interconnect layers. The heating element is vertically separated from the first substrate by the dielectric structure. A MEMs substrate is coupled to the first substrate and has a MEMs device. A hermetically sealed chamber surrounding the MEMs device is disposed between the first substrate and the MEMs substrate. An out-gassing material is disposed laterally between the hermetically sealed chamber and the heating element.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: January 14, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shyh-Wei Cheng, Chih-Yu Wang, Hsi-Cheng Hsu, Hsin-Yu Chen, Ji-Hong Chiang, Jui-Chun Weng, Wei-Ding Wu
  • Patent number: 10524060
    Abstract: The present invention provides a MEMS device such as a capacitive MEMS microphone that comprises a new design of air flow restrictor. An air channel includes a first internal wall and a second internal wall for air to flow between. A trench is recessed from the first internal wall, and an insert is extended from the second internal wall and inserted into the trench. The spatial relationship between the insert and the trench can vary or oscillate. Air resistance of the channel may be controlled by the trench depth. The air resistance is higher with a deeper trench. The invention has a significant effect on, for example, keeping the sound frequency response plot more flat on the low frequency part ranging from 20 Hz to 1000 Hz.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: December 31, 2019
    Assignee: GMEMS Technologies International Limited
    Inventors: Guanghua Wu, Xingshuo Lan
  • Patent number: 10515926
    Abstract: Systems and methods for providing 3D wafer assembly with known-good-dies are provided. An example method compiles an index of dies on a semiconductor wafer and removes the defective dies to provide a wafer with dies that are all operational. Defective dies on multiple wafers may be removed in parallel, and resulting wafers with all good dies stacked in 3D wafer assembly. In an implementation, the spaces left by removed defective dies may be filled at least in part with operational dies or with a fill material. Defective dies may be replaced either before or after wafer-to-wafer assembly to eliminate production of defective stacked devices, or the spaces may be left empty. A bottom device wafer may also have its defective dies removed or replaced, resulting in wafer-to-wafer assembly that provides 3D stacks with no defective dies.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: December 24, 2019
    Assignee: Invensas Corporation
    Inventors: Hong Shen, Liang Wang, Guilian Gao
  • Patent number: 10509937
    Abstract: A curved-surface OLED display device with fingerprint identification includes a substrate, a thin film transistor layer, a pixel electrode layer, an OLED display material layer, a common electrode layer, an encapsulation layer, a curved touch detection and fingerprint detection layer and a curved protective layer. The thin film transistor layer includes plural thin film transistors, plural scan lines, and plural data lines. The pixel electrode layer includes plural pixel electrodes. The curved touch detection and fingerprint detection layer includes plural sense electrodes and plural traces for performing the touch detection operation and fingerprint identification operation. A partial area of the curved touch detection and fingerprint detection layer and the curved protective layer exhibits a curved-surface shape.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: December 17, 2019
    Assignee: SUPERC-TOUCH CORPORATION
    Inventors: Hsiang-Yu Lee, Shang Chin, Ping-Tsun Lin, Chia-Hsun Tu
  • Patent number: 10508026
    Abstract: A monolithically integrated multi-sensor (MIMS) is disclosed. A MIMs integrated circuit comprises a plurality of sensors. For example, the integrated circuit can comprise three or more sensors where each sensor measures a different parameter. The three or more sensors can share one or more layers to form each sensor structure. In one embodiment, the three or more sensors can comprise MEMs sensor structures. Examples of the sensors that can be formed on a MIMs integrated circuit are an inertial sensor, a pressure sensor, a tactile sensor, a humidity sensor, a temperature sensor, a microphone, a force sensor, a load sensor, a magnetic sensor, a flow sensor, a light sensor, an electric field sensor, an electrical impedance sensor, a galvanic skin response sensor, a chemical sensor, a gas sensor, a liquid sensor, a solids sensor, and a biological sensor.
    Type: Grant
    Filed: February 11, 2018
    Date of Patent: December 17, 2019
    Assignee: Versana Micro Inc.
    Inventor: Bishnu Prasanna Gogoi
  • Patent number: 10486963
    Abstract: The present disclosure relates to a wafer-level package that includes a first thinned die, a multilayer redistribution structure, a first mold compound, and a second mold compound. The first thinned die resides over a top surface of the multilayer redistribution structure. The multilayer redistribution structure includes at least one support pad that is on a bottom surface of the multilayer redistribution structure and vertically aligned with the first thinned die. The first mold compound resides over the multilayer redistribution structure and around the first thinned die, and extends beyond a top surface of the first thinned die to define an opening within the first mold compound and over the first thinned die. The second mold compound fills the opening and is in contact with the top surface of the first thinned die.
    Type: Grant
    Filed: August 14, 2017
    Date of Patent: November 26, 2019
    Assignee: Qorvo US, Inc.
    Inventors: Merrill Albert Hatcher, Jr., Jonathan Hale Hammond, Jon Chadwick, Julio C. Costa, Jan Edward Vandemeer
  • Patent number: 10475640
    Abstract: Provided herein is a method for manufacturing a semiconductor device. A substrate including a MEMS region and a connection region thereon is provided; a dielectric layer disposed on the substrate in the connection region is provided; a poly-silicon layer disposed on the dielectric layer is provided, wherein the poly-silicon layer serves as an etch-stop layer; a connection pad disposed on the poly-silicon layer is provided; and a passivation layer covering the dielectric layer is provided, wherein the passivation layer includes an opening that exposes the connection pad and a transition region between the connection pad and the passivation layer, and a conductive layer conformally covering the connection pad and the poly-silicon layer in the transition region is provided.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: November 12, 2019
    Assignee: UNITED MICROELECTRONICS CORPORATION
    Inventors: Yan-Da Chen, Weng Yi Chen, Chang-Sheng Hsu, Kuan-Yu Wang, Yuan Sheng Lin
  • Patent number: 10457550
    Abstract: A microelectromechanical system (MEMS) device may include a MEMS structure over a first substrate. The MEMS structure comprises a movable element. Depositing a first conductive material over the first substrate and etching trenches in a second substrate. Filling the trenches with a second conductive material and depositing a third conductive material over the second conductive material and the second substrate. Bonding the first substrate and the second substrate and thinning a backside of the second substrate which exposes the second conductive material in the trenches.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: October 29, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Chih Liang, Chia-Hua Chu, Te-Hao Lee, Jiou-Kang Lee, Chung-Hsien Lin
  • Patent number: 10455748
    Abstract: A high-frequency module includes a wiring board, a component that is mounted on an upper surface of the wiring board, a sealing resin layer that is laminated on the upper surface of the wiring board and that seals the component, a first shield layer that is laminated on the sealing resin layer so as to cover an opposite surface of the sealing resin layer and a peripheral side surface of the sealing resin layer, the opposite surface being opposite to the upper surface of the wiring board, and a second shield layer that is laminated on a portion of the first shield layer that covers the peripheral side surface of the sealing resin layer. In this case, even if the first shield layer cannot be made thick enough for obtaining desired shield characteristics, the second shield layer can provide a thickness corresponding to the insufficient thickness.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: October 22, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Issei Yamamoto
  • Patent number: 10453766
    Abstract: This disclosure provides devices and methods for 3-D device packaging with backside interconnections. One or more device elements can be hermetically sealed from an ambient environment, such as by vacuum lamination and bonding. One or more via connections provide electrical interconnection from a device element to a back side of a device substrate, and provide electrical interconnection from the device substrate to external circuitry on the back side of the device. The external circuitry can include a printed circuit board or flex circuit. In some implementations, an electrically conductive pad is provided on the back side, which is electrically connected to at least one of the via connections. In some implementations, the one or more via connections are electrically connected to one or more electrical components or interconnections, such as a TFT or a routing line.
    Type: Grant
    Filed: November 14, 2016
    Date of Patent: October 22, 2019
    Assignee: OBSIDIAN SENSORS, INC.
    Inventors: Yaoling Pan, Tallis Young Chang, John Hyunchul Hong
  • Patent number: 10448168
    Abstract: A microphone includes a substrate, an opening extending through the substrate, a first electrode plate layer on the opening, a second electrode plate layer spaced apart from the first electrode plate layer, a support structure layer on the substrate including an electrode attachment portion operable to attach the second electrode plate layer and a stopper operable to block contact between the first electrode plate layer and the second electrode plate layer, a cavity delineated by the support structure layer, the first electrode plate layer, and the substrate, and a conductive material layer on the support structure layer and spaced apart from the second electrode plate layer. The microphone has a significantly lower leakage current than conventional semiconductor microphones.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: October 15, 2019
    Assignees: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION, SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
    Inventor: Qiang Wang
  • Patent number: 10442684
    Abstract: The present disclosure relates to a wafer-level package that includes a first thinned die, a multilayer redistribution structure, a first mold compound, and a second mold compound. The first thinned die resides over a top surface of the multilayer redistribution structure. The multilayer redistribution structure includes at least one support pad that is on a bottom surface of the multilayer redistribution structure and vertically aligned with the first thinned die. The first mold compound resides over the multilayer redistribution structure and around the first thinned die, and extends beyond a top surface of the first thinned die to define an opening within the first mold compound and over the first thinned die. The second mold compound fills the opening and is in contact with the top surface of the first thinned die.
    Type: Grant
    Filed: August 14, 2017
    Date of Patent: October 15, 2019
    Assignee: Qorvo US, Inc.
    Inventors: Merrill Albert Hatcher, Jr., Jonathan Hale Hammond, Jon Chadwick, Julio C. Costa, Jan Edward Vandemeer
  • Patent number: 10395164
    Abstract: There is provided a fingerprint sensing module comprising a fingerprint sensor device having a sensing array arranged on a first side of the device. The fingerprint sensor device also comprises connection pads for connecting the fingerprint sensor device to external circuitry and a fingerprint sensor device cover structure, the cover structure having a first side configured to be touched by a finger, and a second side facing the sensing array, wherein the cover structure comprises conductive traces, arranged on the second side, for electrically connecting the fingerprint sensor module to external circuitry, and wherein a surface area of the cover structure is larger than a surface area of the sensor device. Moreover, the fingerprint sensor device comprises wire-bonds electrically connecting the connection pads of the fingerprint sensing device to the conductive traces of the cover structure.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: August 27, 2019
    Assignee: Fingerprint Cards AB
    Inventors: Nils Lundberg, Zhimin Mo, Mats Slottner
  • Patent number: 10377627
    Abstract: The present disclosure relates to a wafer-level package that includes a first thinned die, a multilayer redistribution structure, a first mold compound, and a second mold compound. The first thinned die resides over a top surface of the multilayer redistribution structure. The multilayer redistribution structure includes at least one support pad that is on a bottom surface of the multilayer redistribution structure and vertically aligned with the first thinned die. The first mold compound resides over the multilayer redistribution structure and around the first thinned die, and extends beyond a top surface of the first thinned die to define an opening within the first mold compound and over the first thinned die. The second mold compound fills the opening and is in contact with the top surface of the first thinned die.
    Type: Grant
    Filed: August 14, 2017
    Date of Patent: August 13, 2019
    Assignee: Qorvo US, Inc.
    Inventors: Merrill Albert Hatcher, Jr., Jonathan Hale Hammond, Jon Chadwick, Julio C. Costa, Jan Edward Vandemeer
  • Patent number: 10370241
    Abstract: A physical quantity detection device includes a semiconductor element and a physical quantity detection vibrator element a portion of which overlaps the semiconductor element in a plan view of the semiconductor element. The physical quantity detection vibrator element includes a drive portion including a drive electrode, and a detection portion. At least a partial region of the drive electrode does not overlap the semiconductor element in the plan view of the semiconductor element.
    Type: Grant
    Filed: September 15, 2015
    Date of Patent: August 6, 2019
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Shinya Aoki
  • Patent number: 10373884
    Abstract: The fan-out semiconductor package includes: a semiconductor chip having an active surface having a connection pad disposed thereon and an inactive surface disposed to oppose the active surface; a first capacitor disposed adjacently to the semiconductor chip; an encapsulant at least partially encapsulating the first connection member and the semiconductor chip; a first connection member disposed on the encapsulant, the first capacitor, and the semiconductor chip, and a second capacitor disposed on the other surface of the first connection member opposing one surface of the first connection member on which the semiconductor chip is disposed, wherein the first connection member includes a redistribution layer electrically connected to the connection pad of the semiconductor chip, the first capacitor, and the second capacitor, and the first capacitor and the second capacitor are electrically connected to the connection pad through a common power wiring of the redistribution layer.
    Type: Grant
    Filed: September 28, 2016
    Date of Patent: August 6, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Han Kim, Mi Ja Han, Kang Heon Hur, Young Gwan Ko
  • Patent number: 10358340
    Abstract: Integrated circuits having shielded micro-electromechanical system (MEMS) devices and method for fabricating shielded MEMS devices are provided. In an example, an integrated circuit having a shielded MEMS device includes a substrate, a ground plane including conductive material over the substrate, and a dielectric layer over the ground plane. The integrated circuit further includes a MEMS device over the ground plane. Also, the integrated circuit includes a conductive pillar through the dielectric layer and in contact with the ground plane. The integrated circuit includes a metallic thin film over the MEMS device and in contact with the conductive pillar, wherein the metallic thin film, the conductive pillar and the ground plane form an electromagnetic shielding structure surrounding the MEMS device. Further, the integrated circuit includes an acoustic shielding structure over the substrate and adjacent the electromagnetic shielding structure.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: July 23, 2019
    Assignee: Globalfoundries Singapore Pte. Ltd.
    Inventors: Humberto Campanella-Pineda, Rakesh Kumar, Zouhair Sbiaa, Nagarajan Ranganathan, Ramachandramurthy Pradeep Yelehanka
  • Patent number: 10356531
    Abstract: A MEMS sensor, in particular a microphone, of a piezoelectric type, formed in a membrane of semiconductor material accommodating a compliant portion, which extends from a first surface to a second surface of the membrane. The compliant portion has a Young's modulus lower than the rest of the membrane. A sensitive region having piezoelectric material extends on the first surface, over the compliant portion and is fixed at its ends to the membrane on opposite sides of the compliant portion. A third area of the membrane, arranged between the compliant portion and the second surface, forms a hinge element.
    Type: Grant
    Filed: June 21, 2017
    Date of Patent: July 16, 2019
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Domenico Giusti, Sebastiano Conti
  • Patent number: 10351420
    Abstract: A capacitive micro electrical mechanical system (MEMS) pressure sensor in one embodiment includes a base layer, a lower oxide layer supported by the base layer, a contact layer extending within the lower oxide layer, a membrane layer positioned generally above the lower oxide layer, the membrane layer including at least one protrusion extending downwardly through a portion of the lower oxide layer and contacting the contact layer, a nitride layer extending partially over the membrane layer, an upper oxide layer above the nitride layer, a backplate layer directly supported by the membrane layer and positioned above the upper oxide layer, a front-side etched portion exposing a first portion of the membrane layer through the upper oxide layer and the nitride layer, and a backside etched portion extending through the base layer, the backside etched portion at least partially aligned with the front-side etched portion.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: July 16, 2019
    Assignee: Robert Bosch GmbH
    Inventors: Ando Feyh, Gary O'Brien
  • Patent number: 10343897
    Abstract: An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to an air flow and the acoustic sensor to sound waves. An example of the acoustic sensor is a microphone and an example of the environmental sensor is a humidity sensor.
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: July 9, 2019
    Assignee: INVENSENSE, INC.
    Inventors: Julius Ming-Lin Tsai, Baris Cagdaser, Martin Lim, Aleksey S. Khenkin
  • Patent number: 10322928
    Abstract: A multi-layer sealing film for high seal yield is provided. In some embodiments, a substrate comprises a vent opening extending through the substrate, from an upper side of the substrate to a lower side of the substrate. The upper side of the substrate has a first pressure, and the lower side of the substrate has a second pressure different than the first pressure. The multi-layer sealing film covers and seals the vent opening to prevent the first pressure from equalizing with the second pressure through the vent opening. Further, the multi-layer sealing film comprises a pair of metal layers and a barrier layer sandwiched between metal layers. Also provided is a microelectromechanical systems (MEMS) package comprising the multilayer sealing film, and a method for manufacturing the multi-layer sealing film.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: June 18, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Chien Yang, Ming-Lun Shih, Ren-Dou Lee, Jen-Hao Liu
  • Patent number: 10315916
    Abstract: Microelectromechanical and/or nanoelectromechanical device comprising a support and at least one moveable element so as to be able to be displaced translationally with respect to the support, a means (G1) for translationally guiding said element, said guiding means (G1) comprising two rigid arms (6), a rotating articulation (12, 10) between each arm (6, 8) and the moveable element (4) and a rotating articulation (10, 14) between each arm (6, 8) and the support, the guiding means (G1) also comprising a coupling articulation (18) between the two arms having at least rotating articulation, said rotating articulations having axes of rotation at least parallel with each other such that during a translational displacement of the moveable element (4) the arms (6, 8) pivot with respect to each other in opposite directions, the rotating articulations being made by torsionally deformable beams.
    Type: Grant
    Filed: June 14, 2018
    Date of Patent: June 11, 2019
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Federico Maspero, Loic Joet
  • Patent number: 10317357
    Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed.
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: June 11, 2019
    Assignee: STMicroelectronics Pte Ltd.
    Inventors: Olivier Le Neel, Ravi Shankar, Suman Cherian, Calvin Leung, Tien-Choy Loh, Shian-Yeu Kam
  • Patent number: 10308503
    Abstract: An apparatus includes a cavity within a substrate. A MEMS structure is within the cavity, wherein the cavity includes the MEMS structure. A trench is connected to the cavity, wherein the trench is not directly opposite the MEMS structure. An oxide layer lines the trench and the cavity. A seal layer seals the trench and traps a predetermined pressure within the cavity and the trench.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: June 4, 2019
    Assignee: InvenSense, Inc.
    Inventors: Jong Il Shin, Peter Smeys, Daesung Lee
  • Patent number: 10310294
    Abstract: Methods to form a device whereon flexible component elements are attached upon three-dimensional surfaces are described. In some aspects, the present invention includes incorporating flexible semiconductor devices onto three-dimensional surfaces with electrical contacts. In some aspects, the formed device may be incorporated in an ophthalmic device.
    Type: Grant
    Filed: July 19, 2013
    Date of Patent: June 4, 2019
    Assignee: Johnson & Johnson Vision Care, Inc.
    Inventors: Randall B. Pugh, James Daniel Riall, Daniel B. Otts, Adam Toner, Frederick A. Flitsch
  • Patent number: 10302670
    Abstract: An acceleration sensor includes: a sensor section having a cap section; a sensing section including movable and fixed electrodes and movable and fixed electrode connecting sections; a peripheral section. The cap section includes a movable electrode through-hole electrode in a movable electrode through hole and a fixed electrode through-hole electrode in a fixed electrode through hole. The cap section further includes a movable electrode pad connected to the movable electrode through-hole electrode and a circuit device and a fixed electrode pad connected to the fixed electrode through-hole electrode and the circuit device. The movable electrode pad and the fixed electrode pad are adjacent to each other in a region of the cap section overlapped with the peripheral section in the stacking direction.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: May 28, 2019
    Assignee: DENSO CORPORATION
    Inventors: Naoki Yoshida, Kiyomasa Sugimoto
  • Patent number: 10294096
    Abstract: In order to manufacture a packaged device, a die having a sensitive region is bonded to a support, and a packaging mass of moldable material is molded on the support so as to surround the die. During molding of the packaging mass, a chamber is formed, which faces the sensitive region and is connected to the outside environment. To this end, a sacrificial mass of material that may evaporate/sublimate is dispensed on the sensitive region; the packaging mass is molded on the sacrificial mass; a through hole is formed in the packaging mass to extend as far as the sacrificial mass; the sacrificial mass is evaporated/sublimated through the hole.
    Type: Grant
    Filed: June 13, 2017
    Date of Patent: May 21, 2019
    Assignee: STMicroelectronics S.r.l.
    Inventor: Federico Giovanni Ziglioli
  • Patent number: 10282585
    Abstract: A fingerprint sensor-compatible overlay material which uses anisotropic conductive material to enable accurate imaging of a fingerprint through an overlay is disclosed. The anisotropic conductive material has increased conductivity in a direction orthogonal to the fingerprint sensor, increasing the capacitive coupling of the fingerprint to the sensor surface, allowing the fingerprint sensor to accurately image the fingerprint through the overlay. Methods for forming a fingerprint sensor-compatible overlay are also disclosed.
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: May 7, 2019
    Assignee: Cypress Semiconductor Corporation
    Inventors: Roman Ogirko, Hans Klein, David G. Wright, Igor Kolych, Andriy Maharyta, Hassane El-Khoury, Oleksandr Karpin, Oleksandr Hoshtanar, Igor Kravets