Physical Deformation Patents (Class 257/415)
  • Patent number: 11459228
    Abstract: A physical quantity sensor includes a substrate, a movable body that is provided displaceably in a state of being opposed to the substrate and is provided with a first through-hole and a second through-hole as through-holes, and a protrusion configured integrally with the substrate at a side of the movable body of the substrate, and in which the protrusion is provided at a position where the protrusion overlaps the through-hole and the movable body in plan view.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: October 4, 2022
    Assignee: Seiko Epson Corporation
    Inventor: Satoru Tanaka
  • Patent number: 11442294
    Abstract: A transmissive polarization control device includes: a semiconductor layer having a first surface and a second surface opposite to the first surface, the semiconductor layer including: a first conductivity type region having a conductivity type, a second conductivity type region having a conductivity type, and a pn junction located between the first and second conductivity type regions; a loop electrode disposed on the first surface and configured such that an electric current flowing through the loop produces a magnetic field in a direction penetrating the pn junction; and a near-field light formation region in which an impurity of the first conductivity type introduced as a dopant into the first conductivity type region for formation of near-field light is distributed. A polarization direction of linearly polarized light traveling through a region surrounded by the loop electrode and the near-field light formation region is rotated according to the electric current.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: September 13, 2022
    Assignee: NICHIA CORPORATION
    Inventors: Takuya Kadowaki, Motoichi Ohtsu, Tadashi Kawazoe
  • Patent number: 11444048
    Abstract: In one instance, a semiconductor package includes a lead frame and a semiconductor die mounted to the lead frame via a plurality of bumps that are shaped or tapered. Each of the plurality of bumps includes a first end connected to the semiconductor die and an opposing, second end connected to the lead frame. The first end has an end surface area A1. The second end has an end surface area A2. The end surface area A1 of the first end is less than the end surface area A2 of the second end. Other aspects are disclosed.
    Type: Grant
    Filed: August 14, 2018
    Date of Patent: September 13, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Sreenivasan K. Koduri
  • Patent number: 11422075
    Abstract: The invention relates to a device (10) for determining the mechanical properties of nanomaterials comprising a substrate (30) onto which a nanomaterial specimen (40) can be anchored, wherein said substrate (30) is mechanically connected to an actuator (20) on one side and to a sensor (50) on the opposite side, and wherein the substrate (30) is configured to generate a fracture line (32?) in a predetermined position which divides the substrate (30) into two parts (31,31?), wherein a first part (31) is connected to the actuator (20) and a second part (31?) is connected to a sensor (50), in order to allow a relative movement between the actuator (20) and the sensor (50).
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: August 23, 2022
    Assignee: UNIVERSITA' DEGLI STUDI DI TRENTO
    Inventors: Maria Pantano, Nicola Pugno, Giorgio Speranza
  • Patent number: 11408912
    Abstract: An optomechanical device for producing and detecting optical signals comprising a proof mass assembly, one or more laser devices, and a circuit. The one or more laser devices are configured to generate a first optical signal and a second optical signal. The circuit is configured to modulate, with an electro-optic modulator (EOM), the second optical signal, output the first optical signal and the second optical signal to the proof mass assembly, generate a filtered optical signal corresponding to a response by the proof mass assembly to the first optical signal without the second optical signal, and generate an electrical signal based on the filtered optical signal, wherein the EOM modulates the second optical signal based on the electrical signal.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: August 9, 2022
    Assignee: Honeywell International Inc.
    Inventors: Joshua Dorr, Chad Fertig, Arthur Savchenko, Steven Tin, Neil Krueger
  • Patent number: 11342266
    Abstract: An integrated circuit (IC) with an integrated microelectromechanical systems (MEMS) structure is provided. In some embodiments, the IC comprises a semiconductor substrate, a back-end-of-line (BEOL) interconnect structure, the integrated MEMS structure, and a cavity. The BEOL interconnect structure is over the semiconductor substrate, and comprises wiring layers stacked in a dielectric region. Further, an upper surface of the BEOL interconnect structure is planar or substantially planar. The integrated MEMS structure overlies and directly contacts the upper surface of the BEOL interconnect structure, and comprises an electrode layer. The cavity is under the upper surface of the BEOL interconnect structure, between the MEMS structure and the BEOL interconnect structure.
    Type: Grant
    Filed: July 21, 2020
    Date of Patent: May 24, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Wen Cheng, Chia-Hua Chu
  • Patent number: 11343904
    Abstract: The present invention relates to a multi-functional platform, including: a printed circuit board (PCB) having a single chip integrated thereon; wherein the single chip includes a substrate having an environmental system disposed thereon, the environmental system including a plurality of three-dimensional (3D) printed, patterned and multi-layered nanostructures disposed on the substrate. The nanostructures include an on-chip heater, a power source, a wireless communication module, and a plurality of sensors, the sensors including at least one of a gas sensor, a pressure sensor, or a temperature sensor, each of which is directly deposited on the substrate and printed with a plurality of nanomaterials. The 3D patterned nanostructures use functionalized nanomaterials, which are patterned by a template using one of directed assembly or nano-offset printing, to deposit the nanostructures directly on the substrate of the single chip.
    Type: Grant
    Filed: February 22, 2021
    Date of Patent: May 24, 2022
    Assignee: United States of America as represented by the Administrator of NASA
    Inventor: Mahmooda Sultana
  • Patent number: 11339050
    Abstract: An actuator device includes a support portion, a movable portion, a connection portion which connects the movable portion to the support portion on a second axis, a first wiring which is provided on the connection portion, a second wiring which is provided on the support portion, and an insulation layer which includes a first opening exposing a surface opposite to the support portion in a first connection part located on the support portion in one of the first wiring and the second wiring and covers a corner of the first connection part. The rigidity of a first metal material forming the first wiring is higher than the rigidity of a second metal material forming the second wiring. The other wiring of the first wiring and the second wiring is connected to the surface of the first connection part in the first opening.
    Type: Grant
    Filed: February 13, 2020
    Date of Patent: May 24, 2022
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Sadaharu Takimoto, Yuki Morinaga, Daiki Suzuki, Yoshihisa Warashina
  • Patent number: 11335678
    Abstract: The present disclosure concerns an integrated circuit comprising a substrate, the substrate comprising a first region having a first thickness and a second region having a second thickness smaller than the first thickness, the circuit comprising a three-dimensional capacitor formed inside and on top of the first region, and at least first and second connection terminals formed on the second region, the first and second connection terminals being respectively connected to first and second electrodes of the three-dimensional capacitor.
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: May 17, 2022
    Assignee: STMICROELECTRONICS (TOURS) SAS
    Inventor: Mohamed Boufnichel
  • Patent number: 11312617
    Abstract: A MEMS device formed using the materials of the BEOL of a CMOS process where a post-processing of vHF and post backing was applied to form the MEMS device and where a total size of the MEMS device is between 50 um and 150 um. The MEMS device may be implemented as an inertial sensor among other applications.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: April 26, 2022
    Assignee: Nanusens SL
    Inventor: Josep Montanyà Silvestre
  • Patent number: 11312623
    Abstract: The present disclosure relates to a method of forming an integrated chip structure. The method includes forming a plurality of interconnect layers within a dielectric structure over a substrate. A dielectric layer arranged along a top of the dielectric structure is patterned to define a via hole exposing an uppermost one of the plurality of interconnect layers. An extension via is formed within the via hole and one or more conductive materials are formed over the dielectric layer and the extension via. The one or more conductive materials are patterned to define a sensing electrode over and electrically coupled to the extension via. A microelectromechanical systems (MEMS) substrate is bonded to the substrate. The MEMs substrate is vertically separated from the sensing electrode.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: April 26, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Chia Liu, Chia-Hua Chu, Chun-Wen Cheng, Jung-Huei Peng
  • Patent number: 11293821
    Abstract: In an embodiment, a pressure sensor module includes a base electrode surrounding at least a part of a bottom electrode, an anchor arrangement on top of the base electrode including at least two electrically conductive walls that both surround at least the part of the bottom electrode and an electrically conductive layer that covers at least the bottom electrode and the anchor arrangement such that a cavity is formed between the bottom electrode, the anchor arrangement and the electrically conductive layer, wherein, on at least one side of the cavity, a proportionate area of the electrically conductive walls in a cross section extending from a surface of an inner wall of the anchor arrangement facing the cavity to a surface of an outermost wall of the anchor arrangement facing away from the cavity in a plane parallel to a plane of the bottom electrode is equal to or less than 10%.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: April 5, 2022
    Assignee: SCIOSENSE B.V.
    Inventors: Roel Daamen, Kailash Vijayakumar, Hendrik Bouman, Remco Henricus Wilhelmus Pijnenburg, Twan Van Lippen
  • Patent number: 11269377
    Abstract: The present disclosure relates to the field of flexible display technology and provides a flexible display panel, a method for manufacturing the same, and a display device, which can reduce the stress in the direction perpendicular to the bending surface applied on a portion of the signal lead wire located in the bending area when the flexible display panel is bent. The flexible display panel includes a flexible basal substrate including a first surface, the first surface including a bending area provided with a plurality of protrusions, and a signal lead wire located on a side of the first surface facing away from the flexible basal substrate. The signal lead wire extends across the bending area and has a shape substantially matching the plurality of protrusions.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: March 8, 2022
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Peng Huang, Zhifeng Zhan, Hai Zheng, Fushi Jin
  • Patent number: 11269464
    Abstract: An electronic pen includes a tubular casing, and a first coupling member and a second coupling member that are coupled to each other in a hollow portion of the casing in an axial direction of the casing. In the axial direction, the first coupling member and the second coupling member are coupled to each other, and in a coupling portion between the first coupling member and the second coupling member, a welded portion that attaches the first coupling member and the second coupling member to each other is formed. The first coupling member is coupled to a core. The second coupling member holds a printed circuit board. The core of the core-side component is made of a conductive material. The second coupling member includes a conductor that supplies, to the core, a signal from a signal transmitting circuit on the printed circuit board with a battery.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: March 8, 2022
    Assignee: Wacom Co., Ltd.
    Inventors: Kohei Tanaka, Hiroyuki Fujitsuka, Kenichi Ninomiya, Takenori Kaneda, Gunji Ishihara, Takashi Yamaguchi, Taketoshi Ito, Shuanglei Li
  • Patent number: 11267692
    Abstract: A MEMS device formed using the materials of the BEOL of a CMOS process where a post-processing of vHF and post backing was applied to form the MEMS device and where a total size of the MEMS device is between 50 um and 150 um. The MEMS device may be implemented as an inertial sensor among other applications.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: March 8, 2022
    Assignee: Nanusens SL
    Inventor: Josep Montanyà Silvestre
  • Patent number: 11262294
    Abstract: An illumination unit is described that includes a first light source positioned on a first axis and a second light source on a second axis that intersects and is angularly offset with respect to the first axis. The illumination unit includes a reflector having an aperture through which the first axis extends and a reflective surface angled with respect to the first axis and second axis.
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: March 1, 2022
    Assignee: Siemens Healthcare Diagnostics Inc.
    Inventor: Jeffrey R. Jasperse
  • Patent number: 11251081
    Abstract: The method of manufacturing a plurality of semiconductor chips (100) comprises a step A) of providing a semiconductor substrate (1) having a plurality of integrated electronic circuits (2) on a top side (10) thereof. In a step B), a sacrificial layer (3) is applied on one side of the semiconductor substrate. In a step C), holes (30) are introduced in the sacrificial layer so that at least one hole is formed above each electronic circuit. In a step D), the semiconductor substrate is adhered to a carrier (5) with the sacrificial layer at the front, an adhesive layer (4) being used between the sacrificial layer and the carrier, and the adhesive layer filling the holes so that holding elements (40) from the adhesive layer are formed in the holes. In a step E) the semiconductor substrate is thinned.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: February 15, 2022
    Assignee: OSRAM OLED GMBH
    Inventors: Thomas Schwarz, Lutz Höppel, Thorsten Frank Baumheinrich, Jens Richter
  • Patent number: 11242243
    Abstract: Embodiments of the application provide a MEMS chip and an electrical packaging method for a MEMS chip. The MEMS chip includes a MEMS device layer, a first isolating layer located under the MEMS device layer, and a first conducting layer located under the first isolating layer. At the first isolating layer, there are a corresponding quantity of first conductive through holes in locations corresponding to conductive structures in a first region and in locations corresponding to electrodes in a second region. At the first conducting layer, there are M electrodes spaced apart from one another, and the M electrodes are respectively connected to M of the first conductive through holes. At the first conducting layer, electrodes in locations corresponding to at least some of the conductive structures in the first region are electrically connected in a one-to-one correspondence to electrodes in locations corresponding to at least some of the electrodes in the second region.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: February 8, 2022
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventor: Yuming Wei
  • Patent number: 11229090
    Abstract: A method for fabricating a multilayered metal nanowire array including providing a metal seed layer, stacking a plurality of porous templates on the seed layer so that a gap forms between each adjacent pair of templates, depositing by electroplating a metal in the pores so that the metal produces nanowires in the templates and lateral interposers in the gaps between the templates, and dissolving the templates so as to produce the multilayered nanowire array including the lateral interposers. The layers between the interposers can have the same or different thicknesses, the diameter and density of the pores in each layer can be the same or different and the metal deposited in the pores of the layers can be the same or different.
    Type: Grant
    Filed: May 10, 2019
    Date of Patent: January 18, 2022
    Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: Michael T. Barako, Jesse B. Tice, Max H. Kuciej
  • Patent number: 11195899
    Abstract: A display substrate and a method for manufacturing the same. The display substrate includes a stretchable substrate and a signal line on a first surface of the stretchable substrate. The first surface of the stretchable substrate is provided with a plurality of grooves spaced apart from each other, and the signal line includes a first portion within the grooves and a second portion outside the grooves.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: December 7, 2021
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Guoqiang Tang, Yingsong Xu
  • Patent number: 11192776
    Abstract: A device having both an electronic assembly having an electronic component assembled on a first substrate, and also a body defining a cavity having a first end in fluid flow communication with a fluid, the electronic component extending inside the cavity and the first substrate including a portion in contact with a wall of the cavity. The coefficient of thermal expansion of the material of the first substrate is less than that of the electronic component, and the electronic component is assembled on the first substrate by a brazing type assembly method involving the application of heat. A method of making an electronic assembly. An assembly obtained by the method.
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: December 7, 2021
    Assignee: SAFRAN ELECTRONICS & DEFENSE
    Inventors: Jean-Christophe Riou, Nawres Sridi-Convers, Eric Bailly
  • Patent number: 11181371
    Abstract: A vibrator device includes a base, a relay substrate supported by the base, and a vibrating element supported by the relay substrate, the relay substrate includes a base mount that is directly or indirectly fixed to the base, a vibrating element mount on which the vibrating element is mounted, and a beam that couples the base mount and the vibrating element mount, and parts of the vibrating element mount that are coupled to the vibrating element are positioned on both sides of the base mount while interposing the base mount therebetween in a plan view.
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: November 23, 2021
    Inventors: Ryuta Nishizawa, Shiro Murakami, Keiichi Yamaguchi
  • Patent number: 11180363
    Abstract: A MEMS support structure and a cap structure are provided. At least one vertically-extending trench is formed into the MEMS support structure or a portion of the cap structure. A vertically-extending outgassing material portion having a surface that is physically exposed to a respective vertically-extending cavity is formed in each of the at least one vertically-extending trench. A matrix material layer is attached to the MEMS support structure. A movable element laterally confined within a matrix layer is formed by patterning the matrix material layer. The matrix layer is bonded to the cap structure. A sealed chamber containing the movable element is formed. Each vertically-extending outgassing material portion has a surface that is physically exposed to the sealed chamber, and outgases a gas to increase the pressure in the sealed chamber.
    Type: Grant
    Filed: February 7, 2020
    Date of Patent: November 23, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Kuei-Sung Chang, Tai-Bang An, Chun-wen Cheng, Hung-Hua Lin
  • Patent number: 11164485
    Abstract: An energy harvesting device and a display device are provided. The energy harvesting device is configured to generate a power signal and the energy harvesting device includes a slot antenna. The slot antenna comprises a first section and a second section. The first section of the slot antenna is a linear shape and comprises an opening end, and the second section of the slot antenna is a bending shape and comprises a plurality of continuously bending corners.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: November 2, 2021
    Assignee: E Ink Holdings Inc.
    Inventors: Yu-Ming Lee, Chuen-Jen Liu
  • Patent number: 11148940
    Abstract: In a microelectromechanical component according to the invention, at least one microelectromechanical element (5), electrical contacting elements (3) and an insulation layer (2.2) and thereon a sacrificial layer (2.1) formed with silicon dioxide are formed on a surface of a CMOS circuit substrate (1) and the microelectromechanical element (5) is arranged freely movably in at least a degree of freedom. At the outer edge of the microelectromechanical component, extending radially around all the elements of the CMOS circuit, a gas- and/or fluid-tight closed layer (4) which is resistant to hydrofluoric acid and is formed with silicon, germanium or aluminum oxide is formed on the surface of the CMOS circuit substrate (1).
    Type: Grant
    Filed: October 8, 2018
    Date of Patent: October 19, 2021
    Assignee: FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.
    Inventors: Dirk Rudloff, Martin Friedrichs, Sebastian Doering, Arnd Huerrich
  • Patent number: 11148936
    Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a substrate, a metallization layer over the substrate, and a sensing structure over the metallization layer. The sensing structure includes an outgassing layer over the metallization layer, a patterned outgassing barrier in proximity to a top surface of the outgassing layer, the patterned outgassing barrier exposing a portion of the outgassing layer, and an electrode over the patterned outgassing barrier. The method for manufacturing the semiconductor device is also provided.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: October 19, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Jung-Huei Peng, Chia-Hua Chu, Fei-Lung Lai, Shiang-Chi Lin
  • Patent number: 11150092
    Abstract: A sensor includes a sensor substrate, and an upper lid substrate joined to an upper surface of the sensor substrate. The sensor substrate includes a fixed part, a deformable beam connected to the fixed part, and a weight connected to the beam. The weight is movable relative to the fixed part. The upper lid substrate includes a first part containing silicon and a second part joined to the first part and containing glass. The first part includes a projection protruding toward the sensor substrate relative to the second part. The sensor has high accuracy or high reliability.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: October 19, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takashi Imanaka, Shoichi Taji, Soichiro Hiraoka, Katsuya Morinaka
  • Patent number: 11143594
    Abstract: The present application discloses a sensor system that includes a sensor having a sensor surface, a sample cartridge including one or more flexible membranes and a membrane frame, the membrane frame including one or more openings covered by the one or more flexible membranes defining one or more wells for holding one or more samples, the flexible membrane having a sample side supporting the sample and an opposite sensor side, the sample cartridge being removably insertable in the sensor system such that the sensor side of the flexible membrane is positioned above and faces the sensor surface, a displacement mechanism that can be actuated to displace the flexible membrane toward the sensor surface such that the sample is moved to a position closer to the sensor surface, and an optical imaging system that detects light emitted from the sensor. Disclosed also are a cartridge cassette and a method of use.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: October 12, 2021
    Assignee: Quantum Diamond Technologies Inc.
    Inventors: Colin B. Connolly, Giles P. Blaney, Akim Lennhoff, Jeffrey D. Randall, Harald Quintus-Bosz, Stuart E. Schechter, Kenneth A. Ritsher, Hooman Hosseinkhannazer, Graham McKinnon
  • Patent number: 11139134
    Abstract: Unwanted or parasitic capacitances may occur in MEMS switches. To reduce or eliminate the impact of the unwanted or parasitic capacitance, an extra device, such as a second MEMS switch, may be coupled to a first MEMS switch to divert the unwanted or parasitic capacitance to ground.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: October 5, 2021
    Assignee: Qorvo US, Inc.
    Inventors: Cornelius Petrus Elisabeth Schepens, Roberto Gaddi
  • Patent number: 11137370
    Abstract: A sensor with a nanowire heater may be provided. The sensor may be patterned in a device layer of a Silicon on Insulation (SOI) wafer comprising a backside layer and a Buried Oxide (BOX) layer and the nanowire heater may be patterned in the device layer of the SOI wafer adjacent to the sensor. Next, metal routing may be created for the SOI wafer and a bond carrier wafer may be provided on a metal routing side of the SOI wafer. The backside layer may then be ground until the BOX layer is exposed. Then the device layer may be patterned through the BOX layer to expose the sensor and the nanowire heater. A dielectric may be deposited covering at least one of the following: the sensor; and the nanowire heater.
    Type: Grant
    Filed: July 29, 2019
    Date of Patent: October 5, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Allen Timothy Chang, Tung-Tsun Chen, Jui-Cheng Huang, Yu-Jie Huang, Yi-Hsing Hsiao
  • Patent number: 11125812
    Abstract: The invention discloses a circuit aging detection sensor based on voltage comparison. A control circuit generates an aging voltage signal, a standard voltage signal and a reference voltage signal. The aging voltage signal passes through a first voltage-controlled oscillator to generate an aging frequency signal. The standard voltage signal passes through a second voltage-controlled oscillator to generate a standard frequency signal. The standard frequency signal and the aging frequency signal pass through an aging detection circuit to generate a frequency difference signal. A level signal generated by a serial data detector passes through a beat-frequency oscillator to generate a reset signal. A counter quantizes aging information, which is converted by a digital-analog converter into a quantized voltage signal. The quantized voltage signal is compared with the reference voltage signal by a voltage comparator, to generate a hopping signal at a voltage superposition node, and an aging signal is output.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: September 21, 2021
    Assignee: Ningbo University
    Inventors: Pengjun Wang, Haiming Zhang, Yuejun Zhang, Huihong Zhang, Xiaotian Zhang, Haizhen Yu
  • Patent number: 11127783
    Abstract: A Magnetic Random Access Memory (MRAM), a method of manufacturing the same, and an electronic device including the same are provided. The MRAM includes a substrate, an array of memory cells arranged in rows and columns, bit lines, and word lines. The memory cells each include a vertical switch device and a magnetic tunnel junction on the switch device and electrically connected to a first terminal of the switch device. An active region of the switch device at least partially includes a single-crystalline semiconductor material. Each of the memory cell columns is disposed on a corresponding bit line, and a second terminal of each of the respective switch devices in the memory cell column is electrically connected to the corresponding bit line. Each of the word lines is electrically connected to a control terminal of the respective switch devices of the respective memory cells in a corresponding memory cell row.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: September 21, 2021
    Assignee: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
    Inventors: Huilong Zhu, Junjie Li, Chao Zhao
  • Patent number: 11117135
    Abstract: Disclosed is a liquid-sealed cartridge in which a liquid is transferred by a centrifugal force generated when the liquid-sealed cartridge is rotated around a rotation shaft, including: a liquid storage portion configured to store the liquid therein; a seal having an outer peripheral portion connected to the liquid storage portion, the seal being configured to seal the liquid storage portion; a flow path connected to the liquid storage portion via the seal, through which the liquid in the liquid storage portion is transferred by the centrifugal force in a direction away from the rotation shaft, wherein, when the seal receives a pressing force, the seal is inclined in a pressing direction, with one portion of the outer peripheral portion thereof remaining connected with the liquid storage portion, and the other portion of the outer peripheral portion being separated from the liquid storage portion.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: September 14, 2021
    Assignees: Sysmex Corporation, ASTI Corporation
    Inventors: Kazuyoshi Horii, Takao Fujiwara, Tomoyuki Nose, Yasunori Maekawa, Noriyuki Ogai, Yasuhiro Toda
  • Patent number: 11086468
    Abstract: A touch device includes a base; a first peripheral wire, a second peripheral wire, a third peripheral wire, a first shield wire and a second shield wire are disposed on the base; there is a first potential difference between the first peripheral wire and the second peripheral wire, and there is a second potential difference between the second peripheral wire and the third peripheral wire. The second peripheral wire is disposed between and spaced from the first peripheral wire and the third peripheral wire. The first shield wire is discontinuously disposed between the first peripheral wire and the second peripheral wire. The second shield wire is discontinuously disposed between the second peripheral wire and the third peripheral wire.
    Type: Grant
    Filed: March 20, 2020
    Date of Patent: August 10, 2021
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Lixiang Yi, Hongqiang Luo, Kwanggyun Jang, Feng Xiao
  • Patent number: 11082028
    Abstract: In one aspect of the disclosure, a semiconductor package is disclosed. The semiconductor package includes a lead frame. A semiconductor die is attached to a first side of the lead frame. A protective shell covers at least a first portion of the first surface of the semiconductor die. The protective shell comprises of ink residue. A layer of molding compound covers an outer surface of the protective shell and exposed portion of the first surface of the semiconductor die. A cavity space is within an inner space of the protective shell and the first portion of the top surface of the semiconductor die.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: August 3, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: James Cooper Wainerdi, Luu Nguyen, Alexander Harvey Scheuermann, Matthew David Romig
  • Patent number: 11061519
    Abstract: A pseudo-piezoelectric d33 vibration device includes transistors and receivers electrically connected to the transistors. Each transistor controls a corresponding one of the receivers to receive a second vibration wave, generated after an object reflects a first vibration wave, and to generate a sensing signal. Each receiver has a first electrode, a second electrode and a nano-gap, which is created between the first and second electrodes after a semiconductor-metal compound is formed. A display integrating the pseudo-piezoelectric d33 vibration device is also provided.
    Type: Grant
    Filed: April 27, 2020
    Date of Patent: July 13, 2021
    Assignee: MAY SUN TECHNOLOGY CO., LTD.
    Inventor: Bruce C. S. Chou
  • Patent number: 11063241
    Abstract: A display apparatus includes a flexible substrate and a first insulation layer disposed on the flexible substrate. The flexible substrate includes a bending area. The first insulation layer includes a first unevenness disposed over the bending area. The first unevenness includes two or more steps in at least a portion of the first unevenness.
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: July 13, 2021
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventor: Hyekyung Park
  • Patent number: 11054327
    Abstract: A microelectromechanical pressure sensor includes a monolithic body of semiconductor material having a front surface. A sensing structure is integrated in the monolithic body and has a buried cavity completely contained within the monolithic body at the front surface. A sensing membrane is suspended above the buried cavity and is formed by a surface portion of the monolithic body. Sensing elements of a piezoresistive type are arranged in the sensing membrane to detect a deformation of the sensing membrane as a result of a pressure. The pressure sensor is further provided with a self-test structure integrated within the monolithic body to cause application of a testing deformation of the sensing membrane in order to verify proper operation of the sensing structure.
    Type: Grant
    Filed: January 15, 2019
    Date of Patent: July 6, 2021
    Assignee: STMicroelectronics S.r.l.
    Inventors: Enri Duqi, Lorenzo Baldo
  • Patent number: 11054633
    Abstract: A mirror assembly, a control method thereof and a light adjusting board are provided. The mirror assembly includes a mirror, a first rotation electrode, a second rotation electrode, a first electrode, a second electrode, a third electrode and a fourth electrode. The mirror includes a rotation axis; the first rotation electrode and the second rotation electrode are respectively at two sides of the rotation axis; the first electrode and the second electrode are opposite to form a first electric field; the first rotation electrode is between the first electrode and the second electrode; the third electrode and the fourth electrode are opposite to form a second electric field; the second rotation electrode is between the third electrode and the fourth electrode; the first rotation electrode and the second rotation electrode rotate under the two electric fields to drive the mirror to rotate around the rotation axis.
    Type: Grant
    Filed: September 18, 2019
    Date of Patent: July 6, 2021
    Assignees: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Jinyu Ren, Bo Zhou, Yongzhi Song
  • Patent number: 11041774
    Abstract: A pressure sensor package includes a package lead frame including a molding plastic layer with a top surface and a plurality of lead frame units mounted in the molding plastic layer, a sidewall disposed on the top surface of the molding plastic layer and surrounding a receiving chamber, a pressure sensor module mounted on the top surface of the molding plastic layer and disposed in the receiving chamber, and a packaging silicone mounted in the receiving chamber to encapsulate the pressure sensor module.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: June 22, 2021
    Assignee: LINGSEN PRECISION INDUSTRIES, LTD.
    Inventors: Ming-Te Tu, Chiung-Yueh Tien, Cheng-Yao Chang, Mei-Yen Su
  • Patent number: 11035747
    Abstract: A pressure detection apparatus includes a base plate including a first surface, a second surface, and an opening, a pressure sensor disposed on the first surface so as to cover the opening of the base plate and outputting an electric signal according to a pressure of measured fluid inside the opening, a lead terminal electrically connected to the pressure sensor, a housing holding the base plate and the lead terminal and including an exposed portion in which a portion of the lead terminal is exposed, and a capacitor protecting the pressure sensor. The housing includes a capacitor housing portion, the capacitor being electrically connected to the lead terminal inside the exposed portion, and a positioning portion that positions, inside the capacitor housing portion, the capacitor that has been mounted in the capacitor housing portion.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: June 15, 2021
    Assignee: Nidec Tosok Corporation
    Inventors: Yoshiyuki Kobayashi, Shigehiro Kataoka, Yoshihiro Kamimura
  • Patent number: 11031074
    Abstract: A semiconductor device includes a semiconductor substrate including a fin of semiconductor material having a fin width and a fin length. The fin length is greater than the fin width and extends between a first fin end and a second fin end. A gate electrode extends over the fin at a first fin location between the first fin end and the second fin end. A dummy gate electrode extends over the first fin end and is floating.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: June 8, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Jhon Jhy Liaw
  • Patent number: 11023702
    Abstract: There is provided a fingerprint sensing module comprising a fingerprint sensor device having a sensing array arranged on a first side of the device, the sensing array comprising an array of fingerprint sensing elements. The fingerprint sensor device also comprises connection pads for connecting the fingerprint sensor device to external circuitry. The fingerprint sensing module further comprises a fingerprint sensor device cover structure arranged to cover the fingerprint sensor device, the cover structure having a first side configured to be touched by a finger, thereby forming a sensing surface of the sensing module, and a second side facing the sensing array, wherein the cover structure comprises conductive traces for electrically connecting the fingerprint sensor module to external circuitry, and wherein a surface area of the cover structure is larger than a surface area of the sensor device.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: June 1, 2021
    Assignee: Fingerprint Cards AB
    Inventors: Nils Lundberg, Zhimin Mo, Mats Slottner
  • Patent number: 11022590
    Abstract: An electronic component comprises a carrier (3), a sensor device (2) mounted on the carrier (3), which sensor device (2) comprises a sensor chip (21), and an electrostatic discharge protection element (1) for protecting the sensor chip (21) from an electrostatic discharge, which protection element (1) is mounted on the carrier (3).
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: June 1, 2021
    Assignee: SENSIRION AG
    Inventors: Markus Wiget, Stephan Braun, Lukas Winkler, Markus Graf, Lukas Hoppenau, Tobias Schmid
  • Patent number: 11010002
    Abstract: An electronic pen includes a tubular casing, and a first coupling member and a second coupling member that are coupled to each other in a hollow portion of the casing in an axial direction of the casing. In the axial direction, the first coupling member and the second coupling member are coupled to each other while partially overlapping each other, and in a coupling portion between the first coupling member and the second coupling member, a welded portion that attaches the first coupling member and the second coupling member to each other is formed.
    Type: Grant
    Filed: March 4, 2020
    Date of Patent: May 18, 2021
    Assignee: Wacom Co., Ltd.
    Inventors: Kohei Tanaka, Hiroyuki Fujitsuka, Kenichi Ninomiya, Takenori Kaneda, Gunji Ishihara, Takashi Yamaguchi, Taketoshi Ito, Shuanglei Li
  • Patent number: 10989918
    Abstract: An optical scanner includes a movable portion having a movable plate on which a light reflecting portion is provided, a frame body portion provided surrounding the movable portion when viewed in a planar manner, a first axis portion that oscillatably supports the movable portion around a first oscillation axis, a second axis portion that oscillatably supports the frame body portion around a second oscillation axis, which intersects the first oscillation axis, and a permanent magnet provided in the frame body portion, in which the movable portion has a projection portion, which is disposed overlapping the first oscillation axis within a region that does not overlap with the permanent magnet when viewed in a planar manner, and which projects, from the movable plate, further to the permanent magnet side than the first axis portion.
    Type: Grant
    Filed: September 7, 2017
    Date of Patent: April 27, 2021
    Assignee: SEIKO EPSON CORPORATION
    Inventor: Hisako Kojima
  • Patent number: 10988372
    Abstract: A method includes forming a first mask on a first portion of a first surface of a substrate, forming a second mask on the first mask and further forming the second mask on a second portion of the first surface of the substrate, and etching an exposed portion of the first surface of the substrate and removing the second mask. According to some embodiments, an exposed portion of the first surface of the substrate is etched and the first mask is removed. An oxide layer is formed on the first surface of the substrate. A third mask is formed on the oxide layer except for a portion of the oxide layer corresponding to bumpstop features. The portion of the oxide layer corresponding to the bumpstop features is removed. An exposed portion of the first surface of the substrate is etched and the third mask is removed.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: April 27, 2021
    Assignee: InvenSense, Inc.
    Inventor: Dongyang Kang
  • Patent number: 10991322
    Abstract: Provided is a bistable driving method for an electrowetting display, comprising: setting a non-selected voltage for one or more writing rows; switching a row voltage of the one or more writing rows from the non-selected voltage to a selected voltage; applying the digital voltage on at least one column of digital electrodes to be written; switching the row voltage of the one or more writing rows from the selected voltage to the non-selected voltage, and decreasing the digital voltage applied to the at least one column to a voltage less than the opening voltage minus the selected voltage; and applying the steps above to next one or more writing rows until an entire display screen is written.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: April 27, 2021
    Assignees: Academy of Shenzhen Guohua Optoelectronics, Shenzhen Guohua Optoelectronics Co., Ltd.
    Inventors: Guofu Zhou, Weijie Lin, Alexander Victor Henzen
  • Patent number: 10981779
    Abstract: A MEMS device and methods of forming are provided. A dielectric layer of a first substrate is patterned to expose conductive features and a bottom layer through the dielectric layer. A first surface of a second substrate is bonded to the dielectric layer and the second substrate is patterned to form a membrane and a movable element. A cap wafer is bonded to the second substrate, where bonding the cap wafer to the second substrate forms a first sealed cavity comprising the movable element and a second sealed cavity that is partially bounded by the membrane. Portions of the cap wafer are removed to expose the second sealed cavity to ambient pressure.
    Type: Grant
    Filed: March 2, 2018
    Date of Patent: April 20, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Fung Chang, Len-Yi Leu, Lien-Yao Tsai
  • Patent number: 10985226
    Abstract: Provided are an ink jet printing organic light emitting diode display panel and a manufacturing method thereof. The method includes: sequentially forming a passivation layer and a planarization layer on a carrier substrate prepared with one pair of thin film transistors, wherein the passivation layer covers the one pair of thin film transistors; forming one pair of vias in the passivation layer and the planarization layer; forming one pair of anodes on the planarization layer, wherein the one pair of anodes are electrically connected to the one pair of thin film transistors through the one pair of vias in the passivation layer and the planarization layer; preparing an electrode separation layer between the one pair of anodes with Al2O3 or an organic photoresist material; forming a light emitting layer over the one pair of anodes by ink jet printing, wherein the light emitting layer covers the electrode separation layer.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: April 20, 2021
    Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventors: Zhaosong Liu, Yuanjun Hsu