Abstract: An acoustic resonator is fabricated with a substrate having a substrate top surface and a piezoelectric plate having plate front and plate back surfaces. An acoustic Bragg reflector is sandwiched between the substrate top surface and the plate back surface. The reflector has a cavity with a top surface perimeter, and the acoustic Bragg reflector is configured to reflect shear acoustic waves at a resonance frequency of the acoustic resonator. The back surface is mounted on the cavity top surface perimeter except for a portion of the plate forming a diaphragm that spans the cavity. An interdigital transducer (IDT) is formed on the plate front surface such that interleaved fingers of the IDT are disposed on the diaphragm. Two or more layers of the acoustic Bragg reflector form pedestals that support the back surface of the plate opposite some or all interleaved fingers of the IDT.

Abstract: The present disclosure provides a structure and method of fabricating the structure. The structure comprises a cavity enclosed by a first substrate and a second substrate opposite to the first substrate. Further, the structure includes a feature in the cavity and the feature is protruded from a surface of the first substrate. In addition, the structure includes a dielectric layer over the feature, wherein the dielectric layer includes a first surface in contact with the feature and a second surface opposite to the first surface is positioned toward the cavity.

Abstract: A user-input system includes a force-measuring device, a cover member, and an elastic circuit board substrate interposed between the force-measuring device and the cover member and mechanically coupled to the cover member and to the force-measuring device. The force-measuring device includes a strain-sensing element. The force-measuring device is mounted to and electrically connected to the elastic circuit board substrate. The cover member undergoes a primary mechanical deformation in response to forces imparted at the cover member. The elastic circuit board substrate transmits a portion of the primary mechanical deformation to the force-measuring device resulting in a concurrent secondary mechanical deformation of the force-measuring device. The strain-sensing element is configured to output voltage signals in accordance with a time-varying strain at the strain-sensing element resulting from the secondary mechanical deformation.

Abstract: A semiconductor device includes: a substrate; a transduction microstructure integrated in the substrate; a cap joined to the substrate and having a first face adjacent to the substrate and a second, outer, face; and a channel extending through the cap from the second face to the first face and communicating with the transduction microstructure. A protective membrane made of porous polycrystalline silicon permeable to aeriform substances is set across the channel.

Abstract: A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate and having acoustic holes. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate and extending across the opening portion of the substrate. The diaphragm includes a ventilation hole, and an air gap is formed between the diaphragm and the backplate. The MEMS structure further includes a filler structure disposed on the diaphragm, and a portion of the filler structure is disposed in the ventilation hole.

Abstract: In an embodiment an electric circuitry includes at least one first ring oscillator and at least one second ring oscillator being arranged on a substrate in different orientations, a time-to-digital converter having a converter ring oscillator and a processing circuit, wherein a first time is determined by a period duration of at least one first ring oscillator, this period duration depending on the propagation delay time of first delay elements, wherein a second time is determined by a period duration of at least one second ring oscillator, this period duration depending on the propagation delay time of second delay elements, and wherein the processing circuit is configured to determine a magnitude of the strain applied on the substrate based on a first state of the converter ring oscillator at the first time and a second state of the converter ring oscillator the second time.

Abstract: A method of manufacturing is provided. The method can include determining a cross-sectional shape of an object to be inspected using a sensor configured with a sensor coil. The method can also include providing a substrate having a profile matching the cross-sectional shape of the object. The method can further include applying a dielectric material to the substrate in a patter matching a shape of the sensor coil. The method can also include forming a first layer of a first material on the dielectric material by sputtering particles of the first material on the dielectric material in the pattern and forming additional layers of the first material atop the first layer by iteratively depositing the additional layers in the pattern via an additive manufacturing technique. A sensor including a sensor coil formed via the method is also provided.

Abstract: A method for manufacturing an embedded package structure having an air resonant cavity according to an embodiment includes manufacturing a first substrate including a first insulating layer, a chip embedded in the insulating layer, and a wiring layer on a terminal face of the chip of the first substrate, wherein the wiring layer is provided thereon with an opening revealing the terminal face of the chip; manufacturing a second substrate which comprises a second insulating layer; locally applying a first adhesive layer on the wiring layer such that the opening revealing the terminal face of the chip is not covered; and applying a second adhesive layer on the second substrate; and attaching and curing the first adhesive layer of the first substrate and the second adhesive layer of the second substrate to obtain an embedded package structure having an air resonant cavity on the terminal face of the chip.

Abstract: A sensor apparatus includes at least one substrate layer of an elastically deformable material, the substrate layer extending longitudinally between spaced apart ends thereof. A conductive layer is attached to and extends longitudinally between the spaced apart ends of the at least one substrate layer. The conductive layer includes an electrically conductive material adapted to form a strain gauge having an electrical resistance that varies based on deformation of the conductive layer in at least one direction.

Abstract: A sample (4) is created by cutting out a device on a plane (10-10). The device has a gate electrode (3) formed along a direction [2-1-10] on a plane c (0001) of a compound semiconductor (1) having a wurtzite structure. Edge dislocations having Burgers vectors of 1/3[2-1-10] and 1/3[?2110] and mixed dislocations having Burgers vectors of 1/3[2-1-13] and 1/3[?2113] are observed by making an electron beam (5) incident on the sample (4) from a direction [?1010] using a transmission electron microscope.

Abstract: A preparation method for a micro-electromechanical systems (MEMS) microphone includes the steps of: providing a silicon substrate having a silicon surface; forming an enclosed cavity in the silicon substrate; forming a plurality of spaced apart acoustic holes in the silicon substrate, each acoustic hole having two openings, one of which communicating with the cavity and the other one located on the silicon surface; forming a sacrificial layer on the silicon substrate, which includes a first filling portion, a second filling portion and a shielding portion; forming a polysilicon layer on the shielding portion; forming a recess in the silicon substrate on the side away from the silicon surface; and removing the first filling portion, the second filling portion and part of the shielding portion so that the recess is brought into communication with the cavity to form a back chamber, and that the polysilicon layer, the remainder of the shielding portion and the silicon substrate together delimit a hollow chamber,

Abstract: A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.

Abstract: Disclosed herein is a stress sensor that includes a stress detection layer including a laminated body including a first ferromagnetic layer, a first non-magnetic layer, a second ferromagnetic layer, and an antiferromagnetic layer stacked one on another. The antiferromagnetic layer includes Mn, and the magnetization direction of the second ferromagnetic layer is fixed by the exchange bias caused by the exchange coupling with the antiferromagnetic layer. The stress sensor detects a stress by an electric resistance depending upon a relative angle between magnetization directions of the first ferromagnetic layer and the second ferromagnetic layer, the relative angle changing depending upon an externally applied stress.

Abstract: Disclosed herein are devices, systems, and methods that can improve the SNR of nanopore measurements by mitigating the effect of parasitic capacitance between the sense electrode and the counter electrode. In some embodiments, a feedback circuit is used to inject a charge into the sense electrode to at least partially cancel the parasitic capacitance between the sense electrode and the counter electrode. In some embodiments, bootstrapping of a signal from the amplifier output or from the sense electrode is used to inject a charge on the counter electrode to substantially cancel the parasitic capacitance.

Abstract: The pressure sensing device includes a substrate and a pressure sensor. The pressure sensor used is a thin-film piezoresistive sensor with a certain area, and a power wire, a ground wire, and two differential wires are led out from ends of the pressure sensor respectively, and the pressure sensor is arranged on the substrate. The substrate is simply attached to the object being tested that is to be subjected to pressure, the pressure sensor is connected to a pressure sensing detection circuit, the object being tested deforms under pressure, and the thin-film piezoresistive sensor deforms as the substrate deforms. The deformation of the substrate is detected through detecting the voltage drop between the two differential wires, which is converted to obtain the pressure on the object being tested, thereby realizing a pressure-sensitive touch function. A pressure sensing method and an electronic terminal with the pressure sensing device are also provided.

Abstract: Disclosed are a design and manufacturing method for a three-dimensional electromechanical adhesive surface structure capable of adhesive force manipulation and tactile sensing by using 3D printing. The three-dimensional electromechanical adhesive surface structure includes: a body; a plurality of three-dimensional micro pillar structures which are attached to the body at a certain angle; and a wire which supplies voltage to the plurality of three-dimensional micro pillar structures. The three-dimensional micro pillar structure includes: a pillar which is attached to the body at a certain angle and is formed integrally with the body; a conductive material which is applied to surround the pillar; and an insulating material coated to surround the conductive material in order to be insulated from an opposite surface. The voltage supplied through the wire is supplied to the conductive material. A passage for providing the wire is formed under the plurality of three-dimensional micro pillar structures of the body.

Abstract: Systems and methods for providing an electronics module including a raceway for mounting submodules and establishing electrical communication with said submodules. The raceway comprises a base structure and a conductive trace formed by a conductive plating process. Connection pads on the raceway are configured to receive connection nodes of the submodules for providing a continuous electrical connection between the raceway and the submodules for electrical communication and power transmission.

Abstract: Disclosed is a bulk acoustic wave resonator (BAWR). The BAWR includes a bulk acoustic wave resonance unit with a first electrode, a second electrode, and a piezoelectric layer. The piezoelectric layer is disposed between the first electrode and the second electrode. An air edge is formed at a distance from a center of the bulk acoustic wave resonance unit.

Abstract: A force torque sensor device includes a sensor chip that detects a displacement in a predetermined axis direction, a strain body that transmits an applied force to the sensor chip, and an adhesive that bonds the sensor chip to the strain body. The Young's modulus of the adhesive is greater than or equal to 130 MPa and less than or equal to 1.5 GPa.

Abstract: An injection molded article is provided with: a flat molded resin body that has a flat rectangular parallelepiped shape and is formed from an injection molded resin; and a base sheet affixed to the surface of the molded resin body. The base sheet has formed therein a first conductive layer on a first surface and a through hole passing through from the first surface to a second surface. The through hole is filled with a conductive material, and a second conductive layer is formed so as to be electrically connected with the first conductive layer via the conductive material with which the through hole is filled. In addition, a sealing material is formed on the first conductive layer so as to cover the through hole. The molded resin body is fixed together with the first surface side of the base sheet so as to cover the sealing material.

Abstract: A system for evaluating a bond includes a first electrode and a second electrode that are spaced apart from one another. The system also includes a sacrificial material layer positioned proximate to a surface of a bonded structure that includes the bond. The system also includes a power source configured to cause the first and second electrodes to generate an electrical arc that at least partially ablates the sacrificial material layer as part of a non-destructive inspection of the bond.

Abstract: According to at least one embodiment, a method of fabricating a micro electro-mechanical systems (MEMS) structure is disclosed. The method involves causing an etchant to remove a portion of a sacrificial layer of the MEMS structure, the sacrificial layer between a structural layer of the MEMS structure and a substrate of the MEMS structure. In this embodiment, causing the etchant to remove the portion of the sacrificial layer involves causing a target portion of the substrate to be released from the MEMS structure. According to another embodiment, another method of fabricating a MEMS structure is disclosed. The method involves causing an etchant including water to remove a portion of a sacrificial layer of the MEMS structure, the sacrificial layer between a structural layer of the MEMS structure and a substrate of the MEMS structure. In this embodiment, the sacrificial layer and the substrate are hydrophobic.

Abstract: The present disclosure provides a semiconductor package structure and a method of manufacturing the same. The semiconductor package structure includes a semiconductor structure, a conductive trace and a tenting structure. The semiconductor structure has a first surface, a second surface and a third surface extending between the first surface and the second surface, and the first surface, the second surface and the third surface define a through-silicon via recessed from the first surface. The conductive trace is disposed adjacent to the first surface, the second surface and the third surface of the semiconductor structure. The tenting structure covering the TSV of the semiconductor structure. A cavity is defined by the tenting structure and the TSV.

Abstract: Techniques, systems, and devices are described for implementing for implementing computation devices and artificial neurons based on nanoelectromechanical (NEMS) systems. In one aspect, a nanoelectromechanical system (NEMS) based computing element includes: a substrate; two electrodes configured as a first beam structure and a second beam structure positioned in close proximity with each other without contact, wherein the first beam structure is fixed to the substrate and the second beam structure is attached to the substrate while being free to bend under electrostatic force. The first beam structure is kept at a constant voltage while the other voltage varies based on an input signal applied to the NEMS based computing element.

Abstract: A user-input system includes a force-measuring device, a cover member, and an elastic circuit board substrate interposed between the force-measuring device and the cover member and mechanically coupled to the cover member and to the force-measuring device. The force-measuring device includes a strain-sensing element. The force-measuring device is mounted to and electrically connected to the elastic circuit board substrate. The cover member undergoes a primary mechanical deformation in response to forces imparted at the cover member. The elastic circuit board substrate transmits a portion of the primary mechanical deformation to the force-measuring device resulting in a concurrent secondary mechanical deformation of the force-measuring device. The strain-sensing element is configured to output voltage signals in accordance with a time-varying strain at the strain-sensing element resulting from the secondary mechanical deformation.

Abstract: A structure for fixing a membrane to a carrier including a carrier; a suspended structure; and a holding structure with a rounded concave shape which is configured to fix the suspended structure to the carrier and where a tapered side of the holding structure physically connects to the suspended structure is disclosed. A method of forming the holding structure on a carrier to support a suspended structure is further disclosed. The method may include: forming a holding structure on a carrier; forming a suspended structure on the holding structure; shaping the holding structure such that it has a concave shape; and arranging the holding structure such that a tapered side of the holding structure physically connects to the suspended structure.

Abstract: An ultrasonic sensor includes: an ultrasonic element provided to transmit or receive an ultrasonic wave propagating along a directional axis; and an element housing case that includes a case diaphragm having a thickness direction along the directional axis. A resonant space is defined between the case diaphragm and the ultrasonic element for the propagating wave, by housing the ultrasonic element while separating the ultrasonic element from the case diaphragm. A horn shape is defined in the element housing case in which a width of the resonant space in a direction orthogonal to the directional axis is reduced as the resonant space extends in an axial direction parallel to the directional axis.

Abstract: A semiconductor oxide plate is formed on a recessed surface in a semiconductor matrix material layer. Comb structures are formed in the semiconductor matrix material layer. The comb structures include a pair of inner comb structures spaced apart by a first semiconductor portion. A second semiconductor portion that laterally surrounds the first semiconductor portion is removed selective to the comb structures using an isotropic etch process. The first semiconductor portion is protected from an etchant of the isotropic etch process by the semiconductor oxide plate, the pair of inner comb structures, and a patterned etch mask layer that covers the comb structures. A movable structure for a MEMS device is formed, which includes a combination of the first portion of the semiconductor matrix material layer and the pair of inner comb structures.

Abstract: Embodiments relate to a monolithic arrangement comprising one or more electrochemically responsive electrodes that are configured to generate a signal relating to a characteristic of a fluid sample; and one or more electronic circuits for processing signals generated by the at least one electrode. Optionally, the monolithic arrangement comprises a plurality of electrodes configured to implement potentiostat and/or galvanostat measurement techniques. Optionally, at least two of the plurality of electrodes have different electrochemical material layers to obtain correspondingly different electrode functionalization.

Abstract: Methods and systems for modulation and mapping of brain tissue in a subject using an ultrasound assembly are provided. An exemplary method for modulation uses an ultrasound assembly including a housing and an ultrasound transducer joined to the housing. The method includes securing the housing to the head of the subject with the ultrasound transducer aligned with a region of the brain tissue to target the region of the brain tissue for modulating, and providing focused ultrasound at an acoustic pressure to the targeted region using the ultrasound transducer to induce cavitation proximate the targeted region. The method further includes detecting a cavitation signal magnitude from the induced cavitation corresponding to the acoustic pressure and modulating the targeted region.

Abstract: A diaphragm for use in a transducer, the diaphragm including a flexible layer configured to deflect in response to changes in a differential pressure. The flexible layer includes a lattice grid. The lattice grid includes a first plurality of substantially elongate openings oriented along an axis and a second plurality of substantially elongate openings extending generally parallel to the axis. The second plurality of openings is substantially offset from the first plurality of openings in a direction substantially parallel to the axis. The first plurality of openings and the second plurality of openings define a first plurality of spaced apart grid beams extending between and substantially parallel to the axis and a second plurality of spaced apart grid beams extending substantially perpendicular to the axis. The second plurality of grid beams is configured to connect adjacent ones of the first plurality of grid beams.

Abstract: In micromechanical pressure sensor device and a corresponding production method, the micromechanical pressure sensor device is provided with a first diaphragm; an adjacent first cavity; a first deformation detection device situated in and/or on the first diaphragm for detecting a deformation of the first diaphragm as a consequence of an applied external pressure change and as a consequence of an internal mechanical deformation of the pressure sensor device; a second diaphragm; an adjacent second cavity; and a second deformation detection device situated in and/or on the second diaphragm for detecting a deformation of the second diaphragm as a consequence of the internal mechanical deformation of the pressure sensor device, where the second diaphragm is developed in such a way that it is not deformable as a consequence of the external pressure change.

Abstract: A pressure sensor including: a structure which delimits a main cavity of a closed type, the structure being at least partially deformable as a function of a pressure external to the structure; and a MEMS device, which is arranged in the main cavity and generates an output signal, which is of an electrical type and is indicative of the pressure inside the main cavity.

Abstract: An acoustic transducer comprises a transducer substrate having an aperture defined therethrough. At least one diaphragm is disposed on the transducer substrate over the aperture. A back plate is disposed on the transducer substrate and axially spaced apart from the at least one diaphragm. A perimetral support structure is disposed circumferentially between the at least one diaphragm and the back plate at a radially outer perimeter of the back plate. A plurality of perimetral release holes are defined circumferentially through at least one of the at least one diaphragm or the back plate proximate to and radially inwards of the perimetral support structure, at least a portion of the plurality of perimetral release holes defining a non-circular shape.

Abstract: The present disclosure provides a display panel, a manufacturing method thereof, and a display device. The display panel includes a display area and a non-display area, and the non-display area has GOA regions. The display panel further includes a first substrate, an array substrate, and an anti-deformation layer. In the present disclosure, the anti-deformation layer is disposed on a lower surface of the first substrate at a position corresponding to the GOA regions. Metal material of the GOA regions is same as metal material of the anti-deformation layer, so that metal expansion coefficient of upper and lower surfaces of the first substrate are same, thereby effectively preventing warpage of the first substrate and the array substrate.

Abstract: Embodiments of a packaged electronic device and method of fabricating such a device are provided, where the packaged electronic device includes: a pressure sensor die having a diaphragm on a front side; an encapsulant material that encapsulates the pressure sensor die, wherein the front side of the pressure sensor die is exposed at a first major surface of the encapsulant material; an interconnect structure formed over the front side of the pressure sensor die and the first major surface of the encapsulant material, wherein an opening through the interconnect structure is generally aligned to the diaphragm; and a cap attached to an outer dielectric layer of the interconnect structure, the cap having a vent hole generally aligned with the opening through the interconnect structure.

Abstract: An exhaust gas aftertreatment system includes a first sensor configured to measure a parameter and a second sensor disposed proximate the first sensor and configured to measure the parameter. The system includes a controller configured to initially utilize the first sensor as a primary sensor. At target intervals, the controller is configured to receive a first sensor value from the first sensor and receive a second sensor value from the second sensor. The controller is configured to calculate a difference between the first sensor value and the second sensor value and determine if the difference between the first sensor value and the second sensor value is greater than a threshold value. If the difference between the first and second sensor values is greater than the threshold value, the controller is configured to stop utilizing the first sensor as the primary sensor and utilize the second sensor as the primary sensor.

Abstract: A micromechanical sensor includes a substrate having a cavity; a flexible diaphragm spanning the cavity; and a lever element that spans the diaphragm and has a first and second end section on opposite sides of a center section. A first joint element is between the first end section and the substrate and a second joint element is between the center section and the diaphragm. The lever element can be pivoted due to a deflection of the diaphragm. Two capacitive sensors are provided, each having two electrodes, one electrode of each sensor being mounted at one of the end sections of the lever element, and the other being mounted on the substrate. The electrodes are disposed so that distances between the electrodes of different sensors are influenced oppositely when the lever element is pivoted. Also, an actuator is provided for applying an actuating force between the lever element and the substrate.

Abstract: A control system controls a plurality of controllable units with a central control device and further has a plurality of control modules, each of which is assigned to one of the units to be controlled. The central control device is set up to exchange digital data with each control module. The control modules form a connection network, wherein each control module is connected to at least one other control module via a communication line so that data exchange between them is possible. One of the control modules is directly connected to the central control device as the master node of the connection network, and the control modules are set up to form a communication network within the connection network, so that the data exchange between the central control device and each control module can be respectively carried out via an assigned communication path within the communication network.

Abstract: In an embodiment, the invention provides a structure of MEMS microphone includes a substrate of semiconductor, having a first opening in the substrate. A dielectric layer is disposed on the substrate, having a dielectric opening. A diaphragm is within the dielectric opening and held by the dielectric layer at a peripheral region, wherein the diaphragm has a diaphragm opening. A back-plate is disposed on the dielectric layer, over the diaphragm. A protruding structure is disposed on the back-plate, protruding toward the diaphragm. At least one air valve plate is affixed on an end of the protruding structure within the diaphragm opening of the diaphragm. The air valve plate is activated when suffering an air flow with a pressure.

Abstract: A pressure sensor includes a lidless structure defining an internal chamber for a sealed environment and presenting an aperture; a chip including a membrane deformable on the basis of external pressure, the chip being mounted outside the lidless structure in correspondence to the aperture so that the membrane closes the sealed environment; and a circuitry configured to provide a pressure measurement information based on the deformation of the membrane.

Abstract: The disclosed technology generally relates to integrated circuit devices with wear out monitoring capability. An integrated circuit device includes a wear-out monitor device configured to record an indication of wear-out of a core circuit separated from the wear-out monitor device, wherein the indication is associated with localized diffusion of a diffusant within the wear-out monitor device in response to a wear-out stress that causes the wear-out of the core circuit.

Abstract: In a non-limiting embodiment, a MEMS device may include a substrate having a device stopper. The device stopper may be integral to the substrate and formed of the substrate material. A thermal dielectric isolation layer may be arranged over the device stopper and the substrate. A device cavity may extend through the substrate and the thermal dielectric isolation layer. The thermal dielectric isolation layer and the device stopper at least partially surround the device cavity. An active device layer may be arranged over the thermal dielectric isolation layer and the device cavity.

Abstract: Micro-electro-mechanical system (MEMS) devices are disclosed, including a MEMS device comprising a semiconductor die including integrated circuitry, a structure mounted on the semiconductor die and covering at least a portion of the circuitry, the structure defining a space between the structure and the at least a portion of the circuitry, and a transducer including a membrane, the transducer located outside of the space.

Abstract: Surgical instruments for performing wedge-shaped osteotomies are disclosed herein. One surgical instrument includes a body including a distal end, a proximal end, and a top surface. The top surface includes a slope extending upward and along a single plane from the distal end to the proximal end. Multiple columns of cutting blades positioned on the top surface and each of the cutting blades includes a respective uniform height that extends vertically along at least a portion of the slope. Another surgical instrument includes a top surface including a flat plane. Multiple columns of cutting blades are positioned on the top surface and the columns of cutting blades are spaced apart and positioned on at least a portion of the top surface. Each cutting blade extends horizontally along the top surface and includes an increasing slope extending upward and along a single plane from the distal end to the proximal end.

Abstract: A force sensor including: a first part including a detection coil; a second part positioned opposite the first part and including: a ferromagnetic plate translationally movable relative to the first part to move towards the first part when a force is transferred to the sensor and to reduce reluctance of a magnetic circuit formed by the first and second parts in series with a variable gap; and an electronic detection circuit configured to generate a signal dependent on the reluctance of the magnetic circuit. The ferromagnetic plate is formed by an amorphous metal alloy.

Abstract: A micromechanical pressure sensor for measuring a pressure differential includes a diaphragm having an inner region and two edge regions, one opposite the other with respect to the inner region. Two or more piezoresistive resistance devices are on the diaphragm, at least one in each of the inner and edge region, and are configured to be electrically connected in a bridge circuit. The micromechanical pressure sensor is configured so that an operating temperature of the one or more piezoresistive resistance devices in the inner region is substantially the same as an operating temperature of the one or more piezoresistive resistance devices in at least one of the edge regions throughout a full operating range such that an error of the micromechanical pressure sensor output resulting from self-heating is less than if the micromechanical pressure sensor were not configured to maintain the operating temperatures substantially the same.

Abstract: The present invention provides a low-pressure capacitive tactile sensor for measuring tactile pressures in a range of approximately 0.5 kPa to approximately 20 kPa, the sensor including a first flexible electrode layer; a second flexible electrode layer; a micro-patterned, discontinuous, flexible, UV-curable in approximately 60 seconds or less, elastic polymer nano-imprinted dielectric layer; and a ground shielding layer disposed above the first flexible electrode layer and below the second flexible electrode layer of the capacitive tactile sensor respectively to minimize electromagnetic and capacitive interference. The pressure sensing range of the capacitive tactile sensor is approximately 0.5-20 kPa, the sensitivity is approximately greater than 0.12 pF/kPa. A method for fabricating the capacitive tactile sensor is also provided.

Abstract: A semiconductor device includes a strain gauge on a substrate, the strain gauge configured to measure a stress of the substrate; and a temperature sensor disposed within the substrate, the temperature sensor being decoupled from the stress of the substrate.

Abstract: In various embodiments, a method of processing a monocrystalline substrate is provided. The method may include severing the substrate along a main processing side into at least two monocrystalline substrate segments, and forming a micromechanical structure comprising at least one monocrystalline substrate segment of the at least two substrate segments.