Abstract: A semiconductor device with EMI shield and a fabricating method thereof are provided. In one embodiment, the semiconductor device includes EMI shield on all six surfaces of the semiconductor device without the use of a discrete EMI lid.

Abstract: Disclosed herein is a stress sensor that includes a stress detection layer including a laminated body including a first ferromagnetic layer, a first non-magnetic layer, a second ferromagnetic layer, and an antiferromagnetic layer stacked one on another. The antiferromagnetic layer includes Mn, and the magnetization direction of the second ferromagnetic layer is fixed by the exchange bias caused by the exchange coupling with the antiferromagnetic layer. The stress sensor detects a stress by an electric resistance depending upon a relative angle between magnetization directions of the first ferromagnetic layer and the second ferromagnetic layer, the relative angle changing depending upon an externally applied stress.

Abstract: Disclosed herein are devices, systems, and methods that can improve the SNR of nanopore measurements by mitigating the effect of parasitic capacitance between the sense electrode and the counter electrode. In some embodiments, a feedback circuit is used to inject a charge into the sense electrode to at least partially cancel the parasitic capacitance between the sense electrode and the counter electrode. In some embodiments, bootstrapping of a signal from the amplifier output or from the sense electrode is used to inject a charge on the counter electrode to substantially cancel the parasitic capacitance.

Abstract: The pressure sensing device includes a substrate and a pressure sensor. The pressure sensor used is a thin-film piezoresistive sensor with a certain area, and a power wire, a ground wire, and two differential wires are led out from ends of the pressure sensor respectively, and the pressure sensor is arranged on the substrate. The substrate is simply attached to the object being tested that is to be subjected to pressure, the pressure sensor is connected to a pressure sensing detection circuit, the object being tested deforms under pressure, and the thin-film piezoresistive sensor deforms as the substrate deforms. The deformation of the substrate is detected through detecting the voltage drop between the two differential wires, which is converted to obtain the pressure on the object being tested, thereby realizing a pressure-sensitive touch function. A pressure sensing method and an electronic terminal with the pressure sensing device are also provided.

Abstract: Disclosed are a design and manufacturing method for a three-dimensional electromechanical adhesive surface structure capable of adhesive force manipulation and tactile sensing by using 3D printing. The three-dimensional electromechanical adhesive surface structure includes: a body; a plurality of three-dimensional micro pillar structures which are attached to the body at a certain angle; and a wire which supplies voltage to the plurality of three-dimensional micro pillar structures. The three-dimensional micro pillar structure includes: a pillar which is attached to the body at a certain angle and is formed integrally with the body; a conductive material which is applied to surround the pillar; and an insulating material coated to surround the conductive material in order to be insulated from an opposite surface. The voltage supplied through the wire is supplied to the conductive material. A passage for providing the wire is formed under the plurality of three-dimensional micro pillar structures of the body.

Abstract: Systems and methods for providing an electronics module including a raceway for mounting submodules and establishing electrical communication with said submodules. The raceway comprises a base structure and a conductive trace formed by a conductive plating process. Connection pads on the raceway are configured to receive connection nodes of the submodules for providing a continuous electrical connection between the raceway and the submodules for electrical communication and power transmission.

Abstract: Disclosed is a bulk acoustic wave resonator (BAWR). The BAWR includes a bulk acoustic wave resonance unit with a first electrode, a second electrode, and a piezoelectric layer. The piezoelectric layer is disposed between the first electrode and the second electrode. An air edge is formed at a distance from a center of the bulk acoustic wave resonance unit.

Abstract: A force torque sensor device includes a sensor chip that detects a displacement in a predetermined axis direction, a strain body that transmits an applied force to the sensor chip, and an adhesive that bonds the sensor chip to the strain body. The Young's modulus of the adhesive is greater than or equal to 130 MPa and less than or equal to 1.5 GPa.

Abstract: An injection molded article is provided with: a flat molded resin body that has a flat rectangular parallelepiped shape and is formed from an injection molded resin; and a base sheet affixed to the surface of the molded resin body. The base sheet has formed therein a first conductive layer on a first surface and a through hole passing through from the first surface to a second surface. The through hole is filled with a conductive material, and a second conductive layer is formed so as to be electrically connected with the first conductive layer via the conductive material with which the through hole is filled. In addition, a sealing material is formed on the first conductive layer so as to cover the through hole. The molded resin body is fixed together with the first surface side of the base sheet so as to cover the sealing material.

Abstract: A system for evaluating a bond includes a first electrode and a second electrode that are spaced apart from one another. The system also includes a sacrificial material layer positioned proximate to a surface of a bonded structure that includes the bond. The system also includes a power source configured to cause the first and second electrodes to generate an electrical arc that at least partially ablates the sacrificial material layer as part of a non-destructive inspection of the bond.

Abstract: According to at least one embodiment, a method of fabricating a micro electro-mechanical systems (MEMS) structure is disclosed. The method involves causing an etchant to remove a portion of a sacrificial layer of the MEMS structure, the sacrificial layer between a structural layer of the MEMS structure and a substrate of the MEMS structure. In this embodiment, causing the etchant to remove the portion of the sacrificial layer involves causing a target portion of the substrate to be released from the MEMS structure. According to another embodiment, another method of fabricating a MEMS structure is disclosed. The method involves causing an etchant including water to remove a portion of a sacrificial layer of the MEMS structure, the sacrificial layer between a structural layer of the MEMS structure and a substrate of the MEMS structure. In this embodiment, the sacrificial layer and the substrate are hydrophobic.

Abstract: The present disclosure provides a semiconductor package structure and a method of manufacturing the same. The semiconductor package structure includes a semiconductor structure, a conductive trace and a tenting structure. The semiconductor structure has a first surface, a second surface and a third surface extending between the first surface and the second surface, and the first surface, the second surface and the third surface define a through-silicon via recessed from the first surface. The conductive trace is disposed adjacent to the first surface, the second surface and the third surface of the semiconductor structure. The tenting structure covering the TSV of the semiconductor structure. A cavity is defined by the tenting structure and the TSV.

Abstract: A user-input system includes a force-measuring device, a cover member, and an elastic circuit board substrate interposed between the force-measuring device and the cover member and mechanically coupled to the cover member and to the force-measuring device. The force-measuring device includes a strain-sensing element. The force-measuring device is mounted to and electrically connected to the elastic circuit board substrate. The cover member undergoes a primary mechanical deformation in response to forces imparted at the cover member. The elastic circuit board substrate transmits a portion of the primary mechanical deformation to the force-measuring device resulting in a concurrent secondary mechanical deformation of the force-measuring device. The strain-sensing element is configured to output voltage signals in accordance with a time-varying strain at the strain-sensing element resulting from the secondary mechanical deformation.

Abstract: Techniques, systems, and devices are described for implementing for implementing computation devices and artificial neurons based on nanoelectromechanical (NEMS) systems. In one aspect, a nanoelectromechanical system (NEMS) based computing element includes: a substrate; two electrodes configured as a first beam structure and a second beam structure positioned in close proximity with each other without contact, wherein the first beam structure is fixed to the substrate and the second beam structure is attached to the substrate while being free to bend under electrostatic force. The first beam structure is kept at a constant voltage while the other voltage varies based on an input signal applied to the NEMS based computing element.

Abstract: A structure for fixing a membrane to a carrier including a carrier; a suspended structure; and a holding structure with a rounded concave shape which is configured to fix the suspended structure to the carrier and where a tapered side of the holding structure physically connects to the suspended structure is disclosed. A method of forming the holding structure on a carrier to support a suspended structure is further disclosed. The method may include: forming a holding structure on a carrier; forming a suspended structure on the holding structure; shaping the holding structure such that it has a concave shape; and arranging the holding structure such that a tapered side of the holding structure physically connects to the suspended structure.

Abstract: An ultrasonic sensor includes: an ultrasonic element provided to transmit or receive an ultrasonic wave propagating along a directional axis; and an element housing case that includes a case diaphragm having a thickness direction along the directional axis. A resonant space is defined between the case diaphragm and the ultrasonic element for the propagating wave, by housing the ultrasonic element while separating the ultrasonic element from the case diaphragm. A horn shape is defined in the element housing case in which a width of the resonant space in a direction orthogonal to the directional axis is reduced as the resonant space extends in an axial direction parallel to the directional axis.

Abstract: A semiconductor oxide plate is formed on a recessed surface in a semiconductor matrix material layer. Comb structures are formed in the semiconductor matrix material layer. The comb structures include a pair of inner comb structures spaced apart by a first semiconductor portion. A second semiconductor portion that laterally surrounds the first semiconductor portion is removed selective to the comb structures using an isotropic etch process. The first semiconductor portion is protected from an etchant of the isotropic etch process by the semiconductor oxide plate, the pair of inner comb structures, and a patterned etch mask layer that covers the comb structures. A movable structure for a MEMS device is formed, which includes a combination of the first portion of the semiconductor matrix material layer and the pair of inner comb structures.

Abstract: Methods and systems for modulation and mapping of brain tissue in a subject using an ultrasound assembly are provided. An exemplary method for modulation uses an ultrasound assembly including a housing and an ultrasound transducer joined to the housing. The method includes securing the housing to the head of the subject with the ultrasound transducer aligned with a region of the brain tissue to target the region of the brain tissue for modulating, and providing focused ultrasound at an acoustic pressure to the targeted region using the ultrasound transducer to induce cavitation proximate the targeted region. The method further includes detecting a cavitation signal magnitude from the induced cavitation corresponding to the acoustic pressure and modulating the targeted region.

Abstract: Embodiments relate to a monolithic arrangement comprising one or more electrochemically responsive electrodes that are configured to generate a signal relating to a characteristic of a fluid sample; and one or more electronic circuits for processing signals generated by the at least one electrode. Optionally, the monolithic arrangement comprises a plurality of electrodes configured to implement potentiostat and/or galvanostat measurement techniques. Optionally, at least two of the plurality of electrodes have different electrochemical material layers to obtain correspondingly different electrode functionalization.

Abstract: A diaphragm for use in a transducer, the diaphragm including a flexible layer configured to deflect in response to changes in a differential pressure. The flexible layer includes a lattice grid. The lattice grid includes a first plurality of substantially elongate openings oriented along an axis and a second plurality of substantially elongate openings extending generally parallel to the axis. The second plurality of openings is substantially offset from the first plurality of openings in a direction substantially parallel to the axis. The first plurality of openings and the second plurality of openings define a first plurality of spaced apart grid beams extending between and substantially parallel to the axis and a second plurality of spaced apart grid beams extending substantially perpendicular to the axis. The second plurality of grid beams is configured to connect adjacent ones of the first plurality of grid beams.

Abstract: In micromechanical pressure sensor device and a corresponding production method, the micromechanical pressure sensor device is provided with a first diaphragm; an adjacent first cavity; a first deformation detection device situated in and/or on the first diaphragm for detecting a deformation of the first diaphragm as a consequence of an applied external pressure change and as a consequence of an internal mechanical deformation of the pressure sensor device; a second diaphragm; an adjacent second cavity; and a second deformation detection device situated in and/or on the second diaphragm for detecting a deformation of the second diaphragm as a consequence of the internal mechanical deformation of the pressure sensor device, where the second diaphragm is developed in such a way that it is not deformable as a consequence of the external pressure change.

Abstract: A pressure sensor including: a structure which delimits a main cavity of a closed type, the structure being at least partially deformable as a function of a pressure external to the structure; and a MEMS device, which is arranged in the main cavity and generates an output signal, which is of an electrical type and is indicative of the pressure inside the main cavity.

Abstract: An acoustic transducer comprises a transducer substrate having an aperture defined therethrough. At least one diaphragm is disposed on the transducer substrate over the aperture. A back plate is disposed on the transducer substrate and axially spaced apart from the at least one diaphragm. A perimetral support structure is disposed circumferentially between the at least one diaphragm and the back plate at a radially outer perimeter of the back plate. A plurality of perimetral release holes are defined circumferentially through at least one of the at least one diaphragm or the back plate proximate to and radially inwards of the perimetral support structure, at least a portion of the plurality of perimetral release holes defining a non-circular shape.

Abstract: The present disclosure provides a display panel, a manufacturing method thereof, and a display device. The display panel includes a display area and a non-display area, and the non-display area has GOA regions. The display panel further includes a first substrate, an array substrate, and an anti-deformation layer. In the present disclosure, the anti-deformation layer is disposed on a lower surface of the first substrate at a position corresponding to the GOA regions. Metal material of the GOA regions is same as metal material of the anti-deformation layer, so that metal expansion coefficient of upper and lower surfaces of the first substrate are same, thereby effectively preventing warpage of the first substrate and the array substrate.

Abstract: Embodiments of a packaged electronic device and method of fabricating such a device are provided, where the packaged electronic device includes: a pressure sensor die having a diaphragm on a front side; an encapsulant material that encapsulates the pressure sensor die, wherein the front side of the pressure sensor die is exposed at a first major surface of the encapsulant material; an interconnect structure formed over the front side of the pressure sensor die and the first major surface of the encapsulant material, wherein an opening through the interconnect structure is generally aligned to the diaphragm; and a cap attached to an outer dielectric layer of the interconnect structure, the cap having a vent hole generally aligned with the opening through the interconnect structure.

Abstract: An exhaust gas aftertreatment system includes a first sensor configured to measure a parameter and a second sensor disposed proximate the first sensor and configured to measure the parameter. The system includes a controller configured to initially utilize the first sensor as a primary sensor. At target intervals, the controller is configured to receive a first sensor value from the first sensor and receive a second sensor value from the second sensor. The controller is configured to calculate a difference between the first sensor value and the second sensor value and determine if the difference between the first sensor value and the second sensor value is greater than a threshold value. If the difference between the first and second sensor values is greater than the threshold value, the controller is configured to stop utilizing the first sensor as the primary sensor and utilize the second sensor as the primary sensor.

Abstract: A micromechanical sensor includes a substrate having a cavity; a flexible diaphragm spanning the cavity; and a lever element that spans the diaphragm and has a first and second end section on opposite sides of a center section. A first joint element is between the first end section and the substrate and a second joint element is between the center section and the diaphragm. The lever element can be pivoted due to a deflection of the diaphragm. Two capacitive sensors are provided, each having two electrodes, one electrode of each sensor being mounted at one of the end sections of the lever element, and the other being mounted on the substrate. The electrodes are disposed so that distances between the electrodes of different sensors are influenced oppositely when the lever element is pivoted. Also, an actuator is provided for applying an actuating force between the lever element and the substrate.

Abstract: A control system controls a plurality of controllable units with a central control device and further has a plurality of control modules, each of which is assigned to one of the units to be controlled. The central control device is set up to exchange digital data with each control module. The control modules form a connection network, wherein each control module is connected to at least one other control module via a communication line so that data exchange between them is possible. One of the control modules is directly connected to the central control device as the master node of the connection network, and the control modules are set up to form a communication network within the connection network, so that the data exchange between the central control device and each control module can be respectively carried out via an assigned communication path within the communication network.

Abstract: In an embodiment, the invention provides a structure of MEMS microphone includes a substrate of semiconductor, having a first opening in the substrate. A dielectric layer is disposed on the substrate, having a dielectric opening. A diaphragm is within the dielectric opening and held by the dielectric layer at a peripheral region, wherein the diaphragm has a diaphragm opening. A back-plate is disposed on the dielectric layer, over the diaphragm. A protruding structure is disposed on the back-plate, protruding toward the diaphragm. At least one air valve plate is affixed on an end of the protruding structure within the diaphragm opening of the diaphragm. The air valve plate is activated when suffering an air flow with a pressure.

Abstract: A pressure sensor includes a lidless structure defining an internal chamber for a sealed environment and presenting an aperture; a chip including a membrane deformable on the basis of external pressure, the chip being mounted outside the lidless structure in correspondence to the aperture so that the membrane closes the sealed environment; and a circuitry configured to provide a pressure measurement information based on the deformation of the membrane.

Abstract: The disclosed technology generally relates to integrated circuit devices with wear out monitoring capability. An integrated circuit device includes a wear-out monitor device configured to record an indication of wear-out of a core circuit separated from the wear-out monitor device, wherein the indication is associated with localized diffusion of a diffusant within the wear-out monitor device in response to a wear-out stress that causes the wear-out of the core circuit.

Abstract: Micro-electro-mechanical system (MEMS) devices are disclosed, including a MEMS device comprising a semiconductor die including integrated circuitry, a structure mounted on the semiconductor die and covering at least a portion of the circuitry, the structure defining a space between the structure and the at least a portion of the circuitry, and a transducer including a membrane, the transducer located outside of the space.

Abstract: In a non-limiting embodiment, a MEMS device may include a substrate having a device stopper. The device stopper may be integral to the substrate and formed of the substrate material. A thermal dielectric isolation layer may be arranged over the device stopper and the substrate. A device cavity may extend through the substrate and the thermal dielectric isolation layer. The thermal dielectric isolation layer and the device stopper at least partially surround the device cavity. An active device layer may be arranged over the thermal dielectric isolation layer and the device cavity.

Abstract: Surgical instruments for performing wedge-shaped osteotomies are disclosed herein. One surgical instrument includes a body including a distal end, a proximal end, and a top surface. The top surface includes a slope extending upward and along a single plane from the distal end to the proximal end. Multiple columns of cutting blades positioned on the top surface and each of the cutting blades includes a respective uniform height that extends vertically along at least a portion of the slope. Another surgical instrument includes a top surface including a flat plane. Multiple columns of cutting blades are positioned on the top surface and the columns of cutting blades are spaced apart and positioned on at least a portion of the top surface. Each cutting blade extends horizontally along the top surface and includes an increasing slope extending upward and along a single plane from the distal end to the proximal end.

Abstract: A force sensor including: a first part including a detection coil; a second part positioned opposite the first part and including: a ferromagnetic plate translationally movable relative to the first part to move towards the first part when a force is transferred to the sensor and to reduce reluctance of a magnetic circuit formed by the first and second parts in series with a variable gap; and an electronic detection circuit configured to generate a signal dependent on the reluctance of the magnetic circuit. The ferromagnetic plate is formed by an amorphous metal alloy.

Abstract: A micromechanical pressure sensor for measuring a pressure differential includes a diaphragm having an inner region and two edge regions, one opposite the other with respect to the inner region. Two or more piezoresistive resistance devices are on the diaphragm, at least one in each of the inner and edge region, and are configured to be electrically connected in a bridge circuit. The micromechanical pressure sensor is configured so that an operating temperature of the one or more piezoresistive resistance devices in the inner region is substantially the same as an operating temperature of the one or more piezoresistive resistance devices in at least one of the edge regions throughout a full operating range such that an error of the micromechanical pressure sensor output resulting from self-heating is less than if the micromechanical pressure sensor were not configured to maintain the operating temperatures substantially the same.

Abstract: The present invention provides a low-pressure capacitive tactile sensor for measuring tactile pressures in a range of approximately 0.5 kPa to approximately 20 kPa, the sensor including a first flexible electrode layer; a second flexible electrode layer; a micro-patterned, discontinuous, flexible, UV-curable in approximately 60 seconds or less, elastic polymer nano-imprinted dielectric layer; and a ground shielding layer disposed above the first flexible electrode layer and below the second flexible electrode layer of the capacitive tactile sensor respectively to minimize electromagnetic and capacitive interference. The pressure sensing range of the capacitive tactile sensor is approximately 0.5-20 kPa, the sensitivity is approximately greater than 0.12 pF/kPa. A method for fabricating the capacitive tactile sensor is also provided.

Abstract: A semiconductor device includes a strain gauge on a substrate, the strain gauge configured to measure a stress of the substrate; and a temperature sensor disposed within the substrate, the temperature sensor being decoupled from the stress of the substrate.

Abstract: In various embodiments, a method of processing a monocrystalline substrate is provided. The method may include severing the substrate along a main processing side into at least two monocrystalline substrate segments, and forming a micromechanical structure comprising at least one monocrystalline substrate segment of the at least two substrate segments.

Abstract: A microelectromechanical force/pressure sensor has: a sensor die, of semiconductor material, having a front surface and a bottom surface, extending in a horizontal plane, and made of a compact bulk region having a thickness along a vertical direction, transverse to the horizontal plane; piezoresistive elements, integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die, coupled above the sensor die, covering the piezoresistive elements, having a respective front surface and bottom surface, opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die.

Abstract: A method for producing a micromechanical pressure sensor. The method includes: providing a MEMS wafer having a silicon substrate and a first cavity developed therein underneath a sensor diaphragm; providing a second wafer; bonding the MEMS wafer to the second wafer; and exposing a sensor core from the rear side; a second cavity being formed in the process between the sensor core and the surface of the silicon substrate, and the second cavity being developed with the aid of an etching process which is carried out using etching parameters that are modified in a defined manner.

Abstract: Semiconductor packages and methods of forming the same are provided. a semiconductor package includes a sub-package, a second die and a second molding layer. The sub-package includes a first die, a first molding layer aside the first die and a first redistribution layer structure disposed over the first die and the first molding layer and electrically connected to the first die. The second die is disposed over the sub-package, wherein the first die and the second die are disposed on opposite surfaces of the first redistribution layer structure. The second molding layer encapsulates the sub-package and the second die.

Abstract: A method comprising bonding a first substrate to a second substrate. The first substrate includes a layer of one or more pairs of reactive material. The method comprising triggering a reaction between the one or more pairs of reactive material and fragmenting the second substrate.

Abstract: In an embodiment of the present invention, a load sensor package includes a housing having a cap, a column, a peripheral structure, and a base. The base includes a major surface configured to mount a stress sensor, while the cap includes a cap major surface configured to receive a load to be measured. The column is configured to transfer a predetermined fraction of the load to be measured to the base through the stress sensor. The peripheral structure is configured to transfer the remaining fraction of the load to be measured to the base.

Abstract: A flexible sensor that includes a printed circuit board (PCB), a capacitive structure on the PCB, and mechanical coupling sites. The PCB includes a slot extending from an outer edge of the PCB to an inner portion of the PCB, and the slot defines a first edge and a second edge facing the first edge. The first and second edges are separated by a gap when the PCB is in an unflexed state. The slot is configured to permit the PCB to flex so as to vary a relative position of the first edge with respect to the second edge. The capacitive structure on the PCB includes a first edge electrode on a portion of the first edge of the PCB, and a second edge electrode on a portion of a second edge of PCB. The second edge electrode is aligned with the first edge electrode across the slot.

Abstract: The present disclosure provides a display substrate, a display panel and a display device. The display substrate includes a display region and a peripheral region surrounding the display region. Silicon-based force sensors are provided in the peripheral region. Each of the force sensors is rectangle-shaped and has a first side, a second side, a third side and a fourth side interconnected end-to-end. A first signal input part is electrically connected at a first corner formed between the first side and the second side, a first signal output part is electrically connected at a second corner formed between the second side and the third side, a second signal input part is electrically connected at a third corner formed between the third side and the fourth side, and a second signal output part is electrically connected at a fourth corner formed between the fourth side and the first side.

Abstract: A MEMS microphone includes a substrate defining a cavity, a diaphragm being spaced apart from the substrate, covering the cavity, and configured to generate a displacement of the diaphragm in response to an applied acoustic pressure, an anchor extending from an end portion of the diaphragm, and fixed to an upper surface of the substrate to support the diaphragm and a back plate disposed over the diaphragm, the back plate being spaced apart from the diaphragm such that an air gap is maintained between the back plate and the diaphragm, and defining a plurality of acoustic holes, wherein the anchor has a repetitive concave-convex shape in a direction toward a center of the diaphragm so that the anchor acts as a resistance to an acoustic wave.

Abstract: An electronic circuit comprises a primary amplifier circuit including a differential input and an output, an offset nulling amplifier circuit, and an impedance matching circuit. The offset nulling amplifier circuit includes a differential input and an output. The differential input of the primary amplifier circuit is operatively coupled to a differential input of the offset nulling amplifier circuit and the impedance matching circuit. The output of the offset nulling amplifier circuit is operatively coupled to the primary amplifier circuit and provides a voltage to reduce offset in an output signal of the primary amplifier circuit.

Abstract: Provided is an electronic device that suppresses an increase in internal pressure while suppressing entry of a foreign material. An electronic module according to the present embodiment has an electronic device, a substrate, a frame, and a cover, a hole portion having a first opening in a first main surface and a second opening in a second main surface and communicating the internal space and the external space, and a component is disposed to face the second opening.

Abstract: A sensor for use in a fluid flow application is provided. The sensor includes an inlet chamber configured to receive a fluid flow from a first conduit, an outlet chamber configured to provide the fluid flow to a second conduit, and a membrane separating the inlet chamber from the outlet chamber, the membrane including a fluid passage to allow the fluid flow from the inlet chamber to the outlet chamber. The sensor also includes a circuit component disposed on the membrane, having an electrical property configured to change according to a deformation of the membrane, and a conductor formed on a substrate and coupled with the circuit component, to provide an electrical signal based on a change in the electrical property of the circuit component. The membrane includes an epitaxial layer formed on the substrate. Methods for fabricating and using the above sensor are also presented.