Strain Sensors Patents (Class 257/417)
  • Patent number: 11504060
    Abstract: An oral insert includes at least one pH sensor in electronic communication with a power source and a data transceiver. The pH sensor is exposed to fluids in the patient's mouth and measures the pH of the fluids to determine fluid composition.
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: November 22, 2022
    Assignee: Martha Ann Keels
    Inventor: Martha Ann Keels
  • Patent number: 11506549
    Abstract: A force sensor includes a circuit board, a sensing element, and a first gel. The sensing element is disposed on the circuit board, wherein the sensing element has a top surface and a bottom surface opposite to each other and has a sensing portion. The bottom surface faces the circuit board. The sensing portion is located at the top surface. The first gel is disposed on the top surface and covers the sensing portion, wherein the sensing portion is adapted to generate a sensing signal through an external force transferred from the first gel to the top surface.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: November 22, 2022
    Assignee: Coretronic MEMS Corporation
    Inventors: Hsi-Wen Tung, Wen-Pin Tsai, Ming-Ching Wu
  • Patent number: 11498832
    Abstract: A stacked semiconductor structure includes a first substrate. A multilayer interconnect is disposed over the first substrate. Metal sections are disposed over the multilayer interconnect. First bonding features are over the metal sections. A second substrate has a front surface. A cavity extends from the front surface into a depth D in the second substrate. A movable structure is disposed over the front surface of the second substrate and suspending over the cavity. The movable structure includes a dielectric membrane, metal units over the dielectric membrane and a cap dielectric layer over the metal units. Second bonding features are over the cap dielectric layer and bonded to the first bonding features. The second bonding features extend through the cap dielectric layer and electrically coupled to the metal units.
    Type: Grant
    Filed: May 21, 2018
    Date of Patent: November 15, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chia-Hua Chu, Chun-Wen Cheng
  • Patent number: 11373963
    Abstract: A bonded structure is disclosed. The bonded structure can include a semiconductor element comprising active circuitry. The bonded structure can include a protective element directly bonded to the semiconductor element without an adhesive along a bonding interface. The protective element can include an obstructive material disposed over at least a portion of the active circuitry. The obstructive material can be configured to obstruct external access to the active circuitry. The bonded structure can include a disruption structure configured to disrupt functionality of the at least a portion of the active circuitry upon debonding of the protective element from the semiconductor element.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: June 28, 2022
    Assignee: Invensas Bonding Technologies, Inc.
    Inventors: Javier A. DeLaCruz, Belgacem Haba, Rajesh Katkar
  • Patent number: 11358862
    Abstract: A micro-electro-mechanical device, comprising a monolithic body of semiconductor material accommodating a first buried cavity; a sensitive region facing the first buried cavity; a second cavity facing the first buried cavity; a decoupling trench extending from the monolithic body and separating the sensitive region from a peripheral portion of the monolithic body; a cap die, forming an ASIC, bonded to and facing the first face of the monolithic body; and a first gap between the cap die and the monolithic body. The device also comprises at least one spacer element between the monolithic body and the cap die; at least one stopper element between the monolithic body and the cap die; and a second gap between the stopper element and one between the monolithic body and the cap die. The second gap is smaller than the first gap.
    Type: Grant
    Filed: May 7, 2020
    Date of Patent: June 14, 2022
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Enri Duqi, Lorenzo Baldo, Marco Del Sarto, Mikel Azpeitia Urquia
  • Patent number: 11320324
    Abstract: A sensor device includes a piezoresistive element that is formed in a semiconductor substrate and has a polarity opposite to a polarity of the semiconductor substrate, diffusion wirings that are formed in the semiconductor substrate and have a polarity opposite to the polarity of the semiconductor substrate, a first barrier layer formed between the adjacent diffusion wirings in the semiconductor substrate and has a same polarity as the polarity of the semiconductor substrate, and a second barrier layer that is formed on surface layers of the piezoresistive element and the diffusion wirings and have a same polarity as the polarity of the first barrier layer.
    Type: Grant
    Filed: January 10, 2020
    Date of Patent: May 3, 2022
    Assignee: MINEBEA MITSUMI Inc.
    Inventor: Yasuhiro Kudo
  • Patent number: 11316292
    Abstract: A semiconductor power module includes an electrically conductive carrier plate, a power semiconductor chip arranged on the carrier plate and electrically connected to the carrier plate, and a contact pin electrically connected to the carrier plate and forming an outer contact of the semiconductor power module. The contact pin is arranged above a soldering point. The soldering point is configured to mechanically directly or indirectly fix the contact pin on the carrier plate and to electrically connect the contact pin to the carrier plate. The contact pin is electrically connected to the carrier plate via a further connection. The further connection has a portion which is mechanically flexible in relation to the carrier plate.
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: April 26, 2022
    Assignee: Infineon Technologies AG
    Inventors: Tomas Manuel Reiter, Mark Nils Muenzer, Marco Stallmeister
  • Patent number: 11307269
    Abstract: A magnetic field sensor for measuring a variable magnetic field, in particular for a movement sensor or position sensor, has a magnetoresistive sensor chip and a flat sensor carrier carrying the sensor chip. The carrier has an upper side from which the sensor chip is electrically contactable, the upper side of the sensor carrier having a recess or depression in which the sensor chip is arranged. The sensor chip is electrically contactable from the upper side and that the sensor chip receives a magnetic field to be measured via an underside of the sensor carrier. A manufacturing method for manufacturing an above magnetic field sensor and a measuring method are proposed.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: April 19, 2022
    Assignee: Sensitec GmbH
    Inventor: Carola Gebhardt
  • Patent number: 11297711
    Abstract: A wiring circuit board sequentially includes a conductive layer, an insulating layer, and a shield layer toward one side in a thickness direction. The insulating layer covers the conductive layer and has an insulating opening portion exposing a part of a one-side surface in the thickness direction of the conductive layer, and the shield layer has a recessed portion disposed at the inside of the insulating opening portion and recessed toward the other side in the thickness direction so as to be in contact with the conductive layer. The shield layer sequentially includes an adhesive layer and a main body layer toward one side in the thickness direction. A ratio (Tb/Ta) of a thickness Tb of the main body layer to a thickness Ta of the adhesive layer is 4 or more.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: April 5, 2022
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yoshihiro Kawamura, Shusaku Shibata, Hayato Takakura, Masaki Ito
  • Patent number: 11280612
    Abstract: An inertial measurement apparatus has mechanically bendable beams that have an isosceles trapezoid cross-section. The apparatus has a resonant member having a perimeter at least partially defined by a sidewall slanted at a first angular value and at least one electrode disposed adjacent, and parallel, to the sidewall and separated therefrom by a capacitive gap.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: March 22, 2022
    Assignee: Georgia Tech Research Corporation
    Inventors: Farrokh Ayazi, Haoran Wen
  • Patent number: 11280613
    Abstract: An inertial measurement apparatus has mechanically bendable beams that have an isosceles trapezoid cross-section. The apparatus has a resonant member having a perimeter at least partially defined by a sidewall slanted at a first angular value and at least one electrode disposed adjacent, and parallel, to the sidewall and separated therefrom by a capacitive gap.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: March 22, 2022
    Assignee: Georgia Tech Research Corporation
    Inventors: Farrokh Ayazi, Haoran Wen
  • Patent number: 11262262
    Abstract: The present disclosure provides a pressure sensor, including a chamber and a film. The chamber includes a first wall with a first electrode and a second wall with a second electrode. The first wall faces the second wall, and the first electrode and the second electrode respectively include conductive or semiconductive material. The film lines a surface inside the chamber exclusive of the first electrode and the second electrode for blocking outgassing entering the chamber from the surface. A method of manufacturing the pressure sensor is also disclosed.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: March 1, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventor: Chi-Chao Hung
  • Patent number: 11263424
    Abstract: Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.
    Type: Grant
    Filed: February 28, 2020
    Date of Patent: March 1, 2022
    Assignee: INVENSENSE, INC.
    Inventors: Julius Ming-Lin Tsai, Mike Daneman, Sanjiv Kapoor
  • Patent number: 11257727
    Abstract: Representative implementations of techniques and devices provide seals for sealing the joints of bonded microelectronic devices as well as bonded and sealed microelectronic assemblies. Seals are disposed at joined surfaces of stacked dies and wafers to seal the joined surfaces. The seals may be disposed at an exterior periphery of the bonded microelectronic devices or disposed within the periphery using the various techniques.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: February 22, 2022
    Assignee: INVENSAS BONDING TECHNOLOGIES, INC.
    Inventors: Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao, Ilyas Mohammed
  • Patent number: 11254559
    Abstract: This invention describes the structure and function of an integrated multi-sensing system. Integrated systems described herein may be configured to form a microphone, pressure sensor, gas sensor, multi-axis gyroscope or accelerometer. The sensor uses a variety of different Field Effect Transistor technologies (horizontal, vertical, Si nanowire, CNT, SiC and III-V semiconductors) in conjunction with MEMS based structures such as cantilevers, membranes and proof masses integrated into silicon substrates. It also describes a configurable method for tuning the integrated system to specific resonance frequency using electronic design.
    Type: Grant
    Filed: March 4, 2018
    Date of Patent: February 22, 2022
    Inventors: Kris Vossough, Farhang Yazdani
  • Patent number: 11243226
    Abstract: The present disclosure provides a composite sensor and a manufacturing method thereof. The composite sensor includes: a first substrate and a second substrate configured to be laminated with the first substrate; a pressure sensor located on the first substrate and configured to sense a change in external pressure; and an acceleration sensor located on the second substrate and configured to sense a change in acceleration. A pressure film of the pressure sensor is configured to be spaced from the second substrate to form a pressure cavity, and a proof mass of the acceleration sensor is configured to be spaced from the first substrate to form a first anti-collision cavity. The present disclosure may reduce the chip area and reduce mutual interference.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: February 8, 2022
    Assignee: AUTOCHIPS WUHAN CO., LTD.
    Inventor: Senlin Li
  • Patent number: 11202156
    Abstract: An MEMS capacitor microphone is provided, comprising a first substrate and a vibration diaphragm supported above the first substrate by a spacing portion, the first substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, and a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the first substrate, wherein a lower electrode forming a capacitor structure with the vibration diaphragm is provided on a side of the first substrate that is adjacent to the vacuum chamber, and an electric field between the vibration diaphragm and the lower electrode is 100-300 V/?m.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: December 14, 2021
    Assignee: Goertek, Inc.
    Inventors: Quanbo Zou, Yongwei Dong
  • Patent number: 11198606
    Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a capping structure over a device substrate. The device substrate includes a first microelectromechanical systems (MEMS) device and a second MEMS device laterally offset from the first MEMS device. The capping structure includes a first cavity overlying the first MEMS device and a second cavity overlying the second MEMS device. The first cavity has a first gas pressure and the second cavity has a second gas pressure different from the first cavity. An outgas layer abutting the first cavity. The outgas layer includes an outgas material having an outgas species. The outgas material is amorphous.
    Type: Grant
    Filed: September 23, 2019
    Date of Patent: December 14, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Ren Wang, Shing-Chyang Pan, Yuan-Chih Hsieh
  • Patent number: 11181408
    Abstract: A thermoresistive gas sensor, e.g. for a flow sensor or a thermal conductivity detector, has a lattice with lattice webs, which consist of a semiconductor material arranged in the plane of the lattice in parallel next to one another, wherein the semiconductor material is formed on a plate-shaped semiconductor substrate that extends over a window-like cutout in the semiconductor substrate and forms the lattice, where the semiconductor layer is doped outside the cutout in areas of two ends of the lattice at least over the width of the lattice until it degenerates and/or bears metallizations, where the semiconductor layer further contains a separation structure insulating the two ends of the lattice from one another, in which the semiconductor material is removed or is not doped, and where the lattice webs extend in an S shape and are connected electrically in parallel to achieve a high measurement sensitivity and mechanical stability.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: November 23, 2021
    Assignee: Siemens Aktiengesellschaft
    Inventors: Sebastian Kisban, Stefan Klehr, Thomas Neuhauser, Piotr Strauch, Jörg Zapf, Jürgen Zettner, Stefan Von Dosky
  • Patent number: 11169039
    Abstract: A pressure sensor device comprises a device package (110) arranged to define a cavity (116) having an opening for fluid communication with an internal volume thereof. The cavity (116) comprises a side wall (114, 115). An elongate pressure sensor element (100) is provided and has a proximal end (120) and a distal end (122). The side wall (114, 115) is arranged to hold fixedly the proximal end (120) of the pressure sensor element (100) therein so that the pressure sensor element (100) is cantilever-suspended from the side wall (114, 115) within the cavity (116).
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: November 9, 2021
    Assignee: MELEXIS TECHNOLOGIES NV
    Inventors: Laurent Otte, Appolonius Jacobus Van Der Wiel, Jian Chen
  • Patent number: 11143975
    Abstract: A lithographic apparatus has an object, the object includes: a substrate and optionally a lower layer on the substrate; an upper layer; and an intermediate layer between the upper layer and the substrate, wherein a bond strength between the intermediate layer and the substrate or lower layer is greater than a bond strength between the intermediate layer and the upper layer and the intermediate layer has a Young's Modulus and/or a Poisson ratio within 20% of that of the upper layer.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: October 12, 2021
    Assignee: ASML Netherlands B.V.
    Inventors: Andrey Nikipelov, Vadim Yevgenyevich Banine, Joost André Klugkist, Maxim Aleksandrovich Nasalevich, Roland Johannes Wilhelmus Stas, Sando Wricke
  • Patent number: 11123156
    Abstract: The present disclosure describes devices, systems, and methods for monitoring use of an oral appliance in an oral cavity using extra-oral sensor(s). One method includes sensing one or more physical properties of an oral appliance using an extra-oral sensor, providing a compliance signal from the extra-oral sensor, the compliance signal including an electronic representation of the one or more physical properties of the oral appliance, identifying one or more patient compliance factors based on the compliance signal, the one or more patient compliance factors providing a basis to identify an extent of compliance of usage of the oral appliance with an orthodontic treatment plan, and providing one or more compliances indicators based on the one or more patient compliance factors, the one or more compliance indicators providing a basis to indicate the extent of compliance.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: September 21, 2021
    Assignee: Align Technology, Inc.
    Inventors: Bruce Cam, Yaser Shanjani, Edi Fridman, Sergey Vinnichenko, Jun Sato
  • Patent number: 11112424
    Abstract: A physical quantity sensor includes a sensor element (acceleration sensor element) and a substrate (package) to which the sensor element is attached using a bonding material (resin adhesive), in which, when an elastic modulus of the bonding material is e, 2.0 GPa<e<7.8 GPa is satisfied.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: September 7, 2021
    Inventor: Juichiro Matsuzawa
  • Patent number: 11105629
    Abstract: An acceleration sensor functioning as a physical quantity sensor includes an acceleration sensor element including a substrate, a lid joined to the substrate to form a housing space in the inside, and an acceleration sensor element piece housed in the housing space and capable of detecting a physical quantity, and a circuit element bonded to, by an adhesive material, an upper surface on the opposite side of the acceleration sensor element piece side of the lid. A recess is provided along the outer edge of the lid in an outer edge region of the upper surface of the lid.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: August 31, 2021
    Inventor: Tatsuro Torimoto
  • Patent number: 11081347
    Abstract: In this method for manufacturing a semiconductor element, a modified layer produced by subjecting a substrate (70) to mechanical polishing is removed by heating the substrate (70) under Si vapor pressure. An epitaxial layer formation step, an ion implantation step, an ion activation step, and a second removal step are then performed. In the second removal step, macro-step bunching and insufficient ion-implanted portions of the surface of the substrate (70) performed the ion activation step are removed by heating the substrate (70) under Si vapor pressure. After that, an electrode formation step in which electrodes are formed on the substrate (70) is performed.
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: August 3, 2021
    Assignee: KWANSEI GAKUIN EDUCATIONAL FOUNDATION
    Inventors: Tadaaki Kaneko, Noboru Ohtani, Kenta Hagiwara
  • Patent number: 11064945
    Abstract: Devices, methods, computer-readable media, and systems for determining an identity of a food are disclosed. For example, a method may receive at least one property of at least one component in a sample of a food from an intra-oral device including a spectrometer, the at least one property obtained via the spectrometer, compares the at least one property to a plurality of food signatures, and determines the identity of the food based upon the comparing. In another example, a system may include an intra-oral device and a wireless device. The intra-oral device may include a spectrometer for measuring at least one property of at least one component in a sample of a food. The wireless device may include a processor for receiving the at least one property, comparing the at least one property to a plurality of food signatures, and determining the identity of the food based upon the comparing.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: July 20, 2021
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Juliette Zerick, Eugene Rascle, William Cottrill
  • Patent number: 11054326
    Abstract: In a physical quantity sensor, a first substrate has a recess depressed from a second surface to provide a thin film section adjacent to a first surface, and a second substrate has a first surface bonded to the first surface of the first substrate, and has a hollow depressed from the first surface and facing the recess. The recess and the hollow have such sizes that a projected line defined by projecting an end of a bottom surface in the recess to the first surface of the first substrate surrounds an open end of the hollow. When the thin film section is displaced toward the hollow, a maximum tensile stress is generated at a position on a rear surface of the thin film section intersecting an extended line along a normal direction to the first surface of the first substrate and passing through the open end of the hollow.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: July 6, 2021
    Assignee: DENSO CORPORATION
    Inventors: Yutaka Hayakawa, Hisanori Yokura
  • Patent number: 11034578
    Abstract: A multi-layer sealing film for high seal yield is provided. In some embodiments, a substrate comprises a vent opening extending through the substrate, from an upper side of the substrate to a lower side of the substrate. The upper side of the substrate has a first pressure, and the lower side of the substrate has a second pressure different than the first pressure. The multi-layer sealing film covers and seals the vent opening to prevent the first pressure from equalizing with the second pressure through the vent opening. Further, the multi-layer sealing film comprises a pair of metal layers and a barrier layer sandwiched between metal layers. Also provided is a microelectromechanical systems (MEMS) package comprising the multilayer sealing film, and a method for manufacturing the multi-layer sealing film.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: June 15, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Chien Yang, Ming-Lun Shih, Ren-Dou Lee, Jen-Hao Liu
  • Patent number: 11029227
    Abstract: A pressure sensing element includes a supporting substrate including a cavity. A device layer is bonded to the supporting substrate, with a diaphragm of the device layer covering the cavity in a sealed manner. A plurality of piezoresistors is coupled to the diaphragm. A plurality of metal stress equalizers is disposed on the device layer such that each stress equalizer is generally adjacent to, but separated from, a corresponding piezoresistor. A plurality of metal bond pads is disposed on the device layer. The plurality of stress equalizers are constructed and arranged to reduce thermal hysteresis of the pressure sensing element caused by stress relaxation of the metal bond pads during a cooling and heating cycle of the pressure sensing element.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: June 8, 2021
    Assignee: Vitesco Technologies USA, LLC
    Inventors: Jen-Huang Albert Chiou, Shiuh-Hui Steven Chen
  • Patent number: 11015980
    Abstract: An infrared radiation sensor comprises a substrate, a membrane formed in or at the substrate, a first counter electrode, a second counter electrode, and a composite comprising at least two layers of materials having different coefficients of thermal expansion. At least a portion of the membrane forms a deflectable electrode and the deflectable electrode is electrically floating. A first capacitance is formed between the deflectable electrode and the first counter electrode, and a second capacitance is formed between the deflectable electrode and the second counter electrode. The membrane comprises the composite or is supported at the substrate by the composite. The membrane comprises an absorption region configured to cause deformation of the composite by absorbing infrared radiation, the deformation resulting in a deflection of the deflectable electrode, which causes a change of the first and second capacitances.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: May 25, 2021
    Assignee: Infineon Technologies AG
    Inventors: Vladislav Komenko, Heiko Froehlich, Thoralf Kautzsch, Andrey Kravchenko
  • Patent number: 10994989
    Abstract: A method for producing a microelectromechanical component as well as a wafer system includes steps of: providing a first wafer having a plurality of microelectromechanical base elements; forming a respective container structure on the microelectromechanical base elements at the wafer level; and disposing an oil or a gel within the container structures.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: May 4, 2021
    Assignee: Robert Bosch GmbH
    Inventors: Vijaye Rajaraman, Eckart Schellkes
  • Patent number: 10988373
    Abstract: A MEMS component including a first substrate having at least one first insulating layer and a first metallic coating on a first side; and including a second substrate having at least one second insulating layer and a second metallic coating on a second side, the second substrate including a micromechanical functional element, which is connected electroconductively to the second metallic layer. The first side and the second side are positioned on each other, the first insulating layer and the second insulating layer being interconnected, and the first metallic coating and the second metallic coating being interconnected. A method for manufacturing a MEMS component is also described.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: April 27, 2021
    Assignee: Robert Bosch GmbH
    Inventor: Christoph Schelling
  • Patent number: 10964591
    Abstract: A method includes forming a metal seed layer on a dielectric layer, and forming a patterned mask over the metal seed layer. An opening in the patterned mask is over a first portion of the dielectric layer, and the patterned mask overlaps a second portion of the dielectric layer. The method further includes plating a metal region in the opening, removing the patterned mask to expose portions of the metal seed layer, etching the exposed portions of the metal seed layer, performing a plasma treatment on a surface of the second portion of the dielectric layer, and performing an etching process on the surface of the second portion of the dielectric layer.
    Type: Grant
    Filed: June 24, 2019
    Date of Patent: March 30, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yun Chen Hsieh, Hui-Jung Tsai, Hung-Jui Kuo, Chen-Hua Yu
  • Patent number: 10964660
    Abstract: An electronic device assembly includes one or more discrete electronic components mounted onto a substrate having a 3D, 2.5D, or N×2D geometric classification. The substrate surface includes a specific mounting location to which an electronic component is to be electrically connected, where each specific mounting location includes one or more electrical connection points, such as contact pads. An anisotropic conductive film (ACF) is applied to the substrate surface covering the one or more electrical connection points of the specific mounting location, and the electronic component is placed on the ACF and properly aligned with the specific mounting location on the substrate surface. Pressure and heat are applied to compress the ACF to form an electrical interconnection between corresponding pairs of the electrical connection points on the electronic device and the specific mounting location on the substrate surface.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: March 30, 2021
    Assignee: Flex Ltd.
    Inventors: Yoav Alfandari, Yitzchak Shpitzer
  • Patent number: 10964623
    Abstract: An electronic module of a control device of a vehicle includes at least one interconnect device, with electronic structural elements as the control unit, and at least one electronic component electrically connected to the interconnect device via a connecting region, wherein the structural elements of the interconnect device and each connecting region between the interconnect device and each dedicated electronic component are coated with an encapsulating material. Furthermore, a method for encapsulating an electronic module is disclosed.
    Type: Grant
    Filed: March 22, 2016
    Date of Patent: March 30, 2021
    Assignee: ZF FRIEDRICHSHAFEN AG
    Inventor: Hermann Josef Robin
  • Patent number: 10960551
    Abstract: A sensor system according to the present disclosure includes a substrate, a force sensor, a calculation unit, and an output part. The substrate includes a reference plane and an inclined surface. The force sensor is provided on the inclined surface and outputs signals in three-axis directions that correspond to an orthogonal axis direction that is orthogonal to the inclined surface and two-axis directions that are parallel to the reference plane. The calculation unit calculates a pressing force in each coordinate axis direction of rectangular coordinates formed of an axis vertical to the reference plane and two axes parallel to the reference plane and moments around the respective coordinate axes of the rectangular coordinates. The output part outputs calculation results.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: March 30, 2021
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Takahiro Nakayama, Motohiro Fujiyoshi, Yoshiyuki Hata, Yoshiteru Omura
  • Patent number: 10934161
    Abstract: A MEMS device that includes a lower substrate having an element region on a surface thereof; an upper substrate opposed to the lower substrate; and a bonding section that bonds the lower substrate and the upper substrate to each other around the periphery of the element region. The bonding section has a first region, a second region, and a third region which are sequentially provided in this order from a side closer to the element region to a side farther from the element region. At least one of the first region and the third region contains a hyper-eutectic alloy of one of a first component and a second component, and the second region contains a eutectic alloy of the first component and the second component.
    Type: Grant
    Filed: January 9, 2018
    Date of Patent: March 2, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Masakazu Fukumitsu, Shuhei Yamada
  • Patent number: 10913654
    Abstract: An electronic device includes a package substrate, a circuit assembly, and a housing. The circuit assembly is mounted on the package substrate. The circuit assembly includes a first sealed cavity formed in a device substrate. The housing is mounted on the package substrate to form a second sealed cavity about the circuit assembly.
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: February 9, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Adam Joseph Fruehling, Juan Alejandro Herbsommer, Simon Joshua Jacobs, Benjamin Stassen Cook, James F. Hallas, Randy Long
  • Patent number: 10900995
    Abstract: A method for fabricating a tri-axial MEMS accelerometer that has a top cap silicon wafer and a bottom cap silicon wafer coupled with a measurement mass. The measurement mass has a two level structure, each level having an inner frame coupled to an outer frame by a plurality of first elastic beams, a mass coupled to the inner frame by a plurality of second elastic beams, and a comb coupling structure between the mass and the inner frame. The comb coupling structures are arranged in an orthogonal orientation. The top level and bottom level measurement masses measure acceleration in perpendicular directions. The top level and bottom level measurement masses and the inner frame form an integral unit which moves along a third direction. Acceleration in the third direction is measured from the change in capacitance between the integral unit and the top cap silicon wafer and bottom cap silicon wafer.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: January 26, 2021
    Assignee: CHINESE ACADEMY OF SCIENCES INSTITUTE OF GEOLOGY AND GEOPHYSICS
    Inventors: Chen Sun, Lian Zhong Yu
  • Patent number: 10875761
    Abstract: A micro-electrical-mechanical system (MEMS) device includes one or more slidable connection assemblies for releasably coupling the micro-electrical-mechanical system (MEMS) device to a wafer from which the micro-electrical-mechanical system (MEMS) device was made. The MEMS device may include a MEMS actuation core, and a MEMS electrical connector assembly electrically coupled to the MEMS actuation core configured to be electrically coupled to a printed circuit board.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: December 29, 2020
    Assignee: MEMS Drive, Inc.
    Inventors: Matthew Ng, Xiaolei Liu, Guiqin Wang
  • Patent number: 10869630
    Abstract: A device for measuring the pressure applied between a user's tongue and palate includes a body shaped to fit complimentarily against the user's palate and a pressure sensor affixed to the body such that the device has a total thickness less than 4 millimeters.
    Type: Grant
    Filed: January 26, 2016
    Date of Patent: December 22, 2020
    Assignee: University of Kansas
    Inventor: Jeff P. Searl
  • Patent number: 10850976
    Abstract: Various embodiments of the present disclosure are directed towards a method for forming an integrated chip including an epitaxial layer overlying a microelectromechanical systems (MEMS) substrate. The method includes bonding a MEMS substrate to a carrier substrate, the MEMS substrate includes monocrystalline silicon. An epitaxial layer is formed over the MEMS substrate, the epitaxial layer has a higher doping concentration than the MEMS substrate. A plurality of contacts are formed over the epitaxial layer, the plurality of contacts respectively form ohmic contacts with the epitaxial layer.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: December 1, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Kuei-Sung Chang, Chia-Hua Chu, Shang-Ying Tsai
  • Patent number: 10843915
    Abstract: A method for forming a MEMS device may include performing a silicon-on-nothing process to form a cavity in a monocrystalline silicon substrate at a first depth relative to a top surface of the monocrystalline silicon substrate; forming, in an electrically conductive electrode region of the monocrystalline silicon substrate, an electrically insulated region extending to a second depth that is less than the first depth relative to the top surface of the monocrystalline silicon substrate; and etching the monocrystalline silicon substrate to expose a gap between a first electrode and a second electrode, wherein the second electrode is separated from the first electrode, within a first depth region, by a first distance defined by the electrically insulated region and the gap, and wherein the second electrode is separated from the first electrode, within a second depth region, by a second distance defined by the gap.
    Type: Grant
    Filed: April 12, 2019
    Date of Patent: November 24, 2020
    Assignee: Infineon Dresdon GmbH & Co. KG
    Inventors: Sebastian Pregl, Uwe Rudolph
  • Patent number: 10809859
    Abstract: A capacitive sensor includes: a resinous panel that has a translucent property, a main surface of the panel being a manipulation surface; a sensor substrate placed so as to face another main surface of the panel, the other main surface being opposite to the manipulation surface of the panel, the sensor substrate having a glass base material and a transparent electrode provided on at least one main surface of the base material; an intermediate layer that has a translucent property, the intermediate layer being disposed between the panel and the sensor substrate; a first adhesive layer disposed between the panel and the intermediate layer, the first adhesive layer bonding the panel and the intermediate layer together; and a second adhesive layer disposed between the sensor substrate and the intermediate layer, the second adhesive layer bonding the sensor substrate and the intermediate layer together.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: October 20, 2020
    Assignee: Alps Alpine Co., Ltd.
    Inventors: Hideto Sasagawa, Takashi Asakawa, Takefumi Osaka, Yutaka Takashima
  • Patent number: 10806502
    Abstract: A vapor delivery system and method is provided that is adapted for treating prostate tissue. The vapor delivery system includes a vapor delivery needle configured to deliver condensable vapor energy to tissue. In one method, the vapor delivery system is advanced transurethrally into the patient to access the prostate tissue. The vapor delivery system is properly positioned by measuring and advancing the system based on a field-of-view of an endoscope or camera disposed within the system.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: October 20, 2020
    Assignee: Boston Scientific Scimed, Inc.
    Inventors: Michael Hoey, Roger Noel Hastings
  • Patent number: 10809144
    Abstract: Instead of insert molding a mold member with a resin case to integrate it, a filler is filled into a first opening formed in the resin case while the mold member is disposed therein, whereby integration is performed. This makes it possible to suppress peeling between the mold member and the resin case due to a thermal cycle, and also makes it possible to suppress leakage of a measurement medium to the outside through a gap between the mold member and the resin case.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: October 20, 2020
    Assignee: DENSO CORPORATION
    Inventors: Kazuya Hirasawa, Takuya Sato
  • Patent number: 10795484
    Abstract: The present disclosure provides a force touch structure and a display device. The force touch structure includes a force sensor and a reference layer. A capacitor is formed between the force sensor and the reference layer, the force sensor includes a first pattern layer and a second pattern layer, and the second pattern layer includes a heat dissipation structure.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: October 6, 2020
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventor: Meizhu Zheng
  • Patent number: 10773953
    Abstract: A method of fabricating a MEMS structure includes providing a substrate comprising a logic element region and a MEMS region. Next, a logic element is formed within the logic element region. A nitrogen-containing material layer is formed to cover the logic element region and the MEMS region conformally. Then, part of the nitrogen-containing material layer within the MEMS region is removed to form at least one shrinking region. Subsequently, a dielectric layer is formed to cover the logic element region and MEMS region, and the dielectric layer fills in the shrinking region. After that, the dielectric layer is etched to form at least one releasing hole, wherein the shrinking region surrounds the releasing hole. Finally, the substrate is etched to form a chamber.
    Type: Grant
    Filed: September 7, 2017
    Date of Patent: September 15, 2020
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Meng-Jia Lin, Yung-Hsiao Lee, Weng-Yi Chen, Shih-Wei Li, Chung-Hsien Liu
  • Patent number: 10765708
    Abstract: The present invention relates to composition comprising Lactobacillus rye ferment, dialkylisosorbide and phospholipid. Preferably, the composition further comprises ethoxylated sorbitan fatty acid ester. The composition has been shown to be effective against infections of closed comedones. The invention further relates to a method of preparing the composition, to a roll-on applicator comprising the composition and to the use of the composition in treatment of closed comedones infections.
    Type: Grant
    Filed: December 5, 2016
    Date of Patent: September 8, 2020
    Assignee: JAO Beheer BV
    Inventor: Elzbieta Ewa Brand-Garnys
  • Patent number: 10768408
    Abstract: A buried cavity is formed in a monolithic body to delimit a suspended membrane. A peripheral insulating region defines a supporting frame in the suspended membrane. Trenches extending through the suspended membrane define a rotatable mobile mass carried by the supporting frame. The mobile mass forms an oscillating mass, supporting arms, spring portions, and mobile electrodes that are combfingered to fixed electrodes of the supporting frame. A reflecting region is formed on top of the oscillating mass.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: September 8, 2020
    Assignee: STMicroelectronics S.r.l.
    Inventors: Enri Duqi, Lorenzo Baldo, Roberto Carminati, Flavio Francesco Villa