Strain Sensors Patents (Class 257/417)
  • Patent number: 11112424
    Abstract: A physical quantity sensor includes a sensor element (acceleration sensor element) and a substrate (package) to which the sensor element is attached using a bonding material (resin adhesive), in which, when an elastic modulus of the bonding material is e, 2.0 GPa<e<7.8 GPa is satisfied.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: September 7, 2021
    Inventor: Juichiro Matsuzawa
  • Patent number: 11105629
    Abstract: An acceleration sensor functioning as a physical quantity sensor includes an acceleration sensor element including a substrate, a lid joined to the substrate to form a housing space in the inside, and an acceleration sensor element piece housed in the housing space and capable of detecting a physical quantity, and a circuit element bonded to, by an adhesive material, an upper surface on the opposite side of the acceleration sensor element piece side of the lid. A recess is provided along the outer edge of the lid in an outer edge region of the upper surface of the lid.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: August 31, 2021
    Inventor: Tatsuro Torimoto
  • Patent number: 11081347
    Abstract: In this method for manufacturing a semiconductor element, a modified layer produced by subjecting a substrate (70) to mechanical polishing is removed by heating the substrate (70) under Si vapor pressure. An epitaxial layer formation step, an ion implantation step, an ion activation step, and a second removal step are then performed. In the second removal step, macro-step bunching and insufficient ion-implanted portions of the surface of the substrate (70) performed the ion activation step are removed by heating the substrate (70) under Si vapor pressure. After that, an electrode formation step in which electrodes are formed on the substrate (70) is performed.
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: August 3, 2021
    Assignee: KWANSEI GAKUIN EDUCATIONAL FOUNDATION
    Inventors: Tadaaki Kaneko, Noboru Ohtani, Kenta Hagiwara
  • Patent number: 11064945
    Abstract: Devices, methods, computer-readable media, and systems for determining an identity of a food are disclosed. For example, a method may receive at least one property of at least one component in a sample of a food from an intra-oral device including a spectrometer, the at least one property obtained via the spectrometer, compares the at least one property to a plurality of food signatures, and determines the identity of the food based upon the comparing. In another example, a system may include an intra-oral device and a wireless device. The intra-oral device may include a spectrometer for measuring at least one property of at least one component in a sample of a food. The wireless device may include a processor for receiving the at least one property, comparing the at least one property to a plurality of food signatures, and determining the identity of the food based upon the comparing.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: July 20, 2021
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Juliette Zerick, Eugene Rascle, William Cottrill
  • Patent number: 11054326
    Abstract: In a physical quantity sensor, a first substrate has a recess depressed from a second surface to provide a thin film section adjacent to a first surface, and a second substrate has a first surface bonded to the first surface of the first substrate, and has a hollow depressed from the first surface and facing the recess. The recess and the hollow have such sizes that a projected line defined by projecting an end of a bottom surface in the recess to the first surface of the first substrate surrounds an open end of the hollow. When the thin film section is displaced toward the hollow, a maximum tensile stress is generated at a position on a rear surface of the thin film section intersecting an extended line along a normal direction to the first surface of the first substrate and passing through the open end of the hollow.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: July 6, 2021
    Assignee: DENSO CORPORATION
    Inventors: Yutaka Hayakawa, Hisanori Yokura
  • Patent number: 11034578
    Abstract: A multi-layer sealing film for high seal yield is provided. In some embodiments, a substrate comprises a vent opening extending through the substrate, from an upper side of the substrate to a lower side of the substrate. The upper side of the substrate has a first pressure, and the lower side of the substrate has a second pressure different than the first pressure. The multi-layer sealing film covers and seals the vent opening to prevent the first pressure from equalizing with the second pressure through the vent opening. Further, the multi-layer sealing film comprises a pair of metal layers and a barrier layer sandwiched between metal layers. Also provided is a microelectromechanical systems (MEMS) package comprising the multilayer sealing film, and a method for manufacturing the multi-layer sealing film.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: June 15, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Chien Yang, Ming-Lun Shih, Ren-Dou Lee, Jen-Hao Liu
  • Patent number: 11029227
    Abstract: A pressure sensing element includes a supporting substrate including a cavity. A device layer is bonded to the supporting substrate, with a diaphragm of the device layer covering the cavity in a sealed manner. A plurality of piezoresistors is coupled to the diaphragm. A plurality of metal stress equalizers is disposed on the device layer such that each stress equalizer is generally adjacent to, but separated from, a corresponding piezoresistor. A plurality of metal bond pads is disposed on the device layer. The plurality of stress equalizers are constructed and arranged to reduce thermal hysteresis of the pressure sensing element caused by stress relaxation of the metal bond pads during a cooling and heating cycle of the pressure sensing element.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: June 8, 2021
    Assignee: Vitesco Technologies USA, LLC
    Inventors: Jen-Huang Albert Chiou, Shiuh-Hui Steven Chen
  • Patent number: 11015980
    Abstract: An infrared radiation sensor comprises a substrate, a membrane formed in or at the substrate, a first counter electrode, a second counter electrode, and a composite comprising at least two layers of materials having different coefficients of thermal expansion. At least a portion of the membrane forms a deflectable electrode and the deflectable electrode is electrically floating. A first capacitance is formed between the deflectable electrode and the first counter electrode, and a second capacitance is formed between the deflectable electrode and the second counter electrode. The membrane comprises the composite or is supported at the substrate by the composite. The membrane comprises an absorption region configured to cause deformation of the composite by absorbing infrared radiation, the deformation resulting in a deflection of the deflectable electrode, which causes a change of the first and second capacitances.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: May 25, 2021
    Assignee: Infineon Technologies AG
    Inventors: Vladislav Komenko, Heiko Froehlich, Thoralf Kautzsch, Andrey Kravchenko
  • Patent number: 10994989
    Abstract: A method for producing a microelectromechanical component as well as a wafer system includes steps of: providing a first wafer having a plurality of microelectromechanical base elements; forming a respective container structure on the microelectromechanical base elements at the wafer level; and disposing an oil or a gel within the container structures.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: May 4, 2021
    Assignee: Robert Bosch GmbH
    Inventors: Vijaye Rajaraman, Eckart Schellkes
  • Patent number: 10988373
    Abstract: A MEMS component including a first substrate having at least one first insulating layer and a first metallic coating on a first side; and including a second substrate having at least one second insulating layer and a second metallic coating on a second side, the second substrate including a micromechanical functional element, which is connected electroconductively to the second metallic layer. The first side and the second side are positioned on each other, the first insulating layer and the second insulating layer being interconnected, and the first metallic coating and the second metallic coating being interconnected. A method for manufacturing a MEMS component is also described.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: April 27, 2021
    Assignee: Robert Bosch GmbH
    Inventor: Christoph Schelling
  • Patent number: 10964660
    Abstract: An electronic device assembly includes one or more discrete electronic components mounted onto a substrate having a 3D, 2.5D, or N×2D geometric classification. The substrate surface includes a specific mounting location to which an electronic component is to be electrically connected, where each specific mounting location includes one or more electrical connection points, such as contact pads. An anisotropic conductive film (ACF) is applied to the substrate surface covering the one or more electrical connection points of the specific mounting location, and the electronic component is placed on the ACF and properly aligned with the specific mounting location on the substrate surface. Pressure and heat are applied to compress the ACF to form an electrical interconnection between corresponding pairs of the electrical connection points on the electronic device and the specific mounting location on the substrate surface.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: March 30, 2021
    Assignee: Flex Ltd.
    Inventors: Yoav Alfandari, Yitzchak Shpitzer
  • Patent number: 10964623
    Abstract: An electronic module of a control device of a vehicle includes at least one interconnect device, with electronic structural elements as the control unit, and at least one electronic component electrically connected to the interconnect device via a connecting region, wherein the structural elements of the interconnect device and each connecting region between the interconnect device and each dedicated electronic component are coated with an encapsulating material. Furthermore, a method for encapsulating an electronic module is disclosed.
    Type: Grant
    Filed: March 22, 2016
    Date of Patent: March 30, 2021
    Assignee: ZF FRIEDRICHSHAFEN AG
    Inventor: Hermann Josef Robin
  • Patent number: 10960551
    Abstract: A sensor system according to the present disclosure includes a substrate, a force sensor, a calculation unit, and an output part. The substrate includes a reference plane and an inclined surface. The force sensor is provided on the inclined surface and outputs signals in three-axis directions that correspond to an orthogonal axis direction that is orthogonal to the inclined surface and two-axis directions that are parallel to the reference plane. The calculation unit calculates a pressing force in each coordinate axis direction of rectangular coordinates formed of an axis vertical to the reference plane and two axes parallel to the reference plane and moments around the respective coordinate axes of the rectangular coordinates. The output part outputs calculation results.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: March 30, 2021
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Takahiro Nakayama, Motohiro Fujiyoshi, Yoshiyuki Hata, Yoshiteru Omura
  • Patent number: 10964591
    Abstract: A method includes forming a metal seed layer on a dielectric layer, and forming a patterned mask over the metal seed layer. An opening in the patterned mask is over a first portion of the dielectric layer, and the patterned mask overlaps a second portion of the dielectric layer. The method further includes plating a metal region in the opening, removing the patterned mask to expose portions of the metal seed layer, etching the exposed portions of the metal seed layer, performing a plasma treatment on a surface of the second portion of the dielectric layer, and performing an etching process on the surface of the second portion of the dielectric layer.
    Type: Grant
    Filed: June 24, 2019
    Date of Patent: March 30, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yun Chen Hsieh, Hui-Jung Tsai, Hung-Jui Kuo, Chen-Hua Yu
  • Patent number: 10934161
    Abstract: A MEMS device that includes a lower substrate having an element region on a surface thereof; an upper substrate opposed to the lower substrate; and a bonding section that bonds the lower substrate and the upper substrate to each other around the periphery of the element region. The bonding section has a first region, a second region, and a third region which are sequentially provided in this order from a side closer to the element region to a side farther from the element region. At least one of the first region and the third region contains a hyper-eutectic alloy of one of a first component and a second component, and the second region contains a eutectic alloy of the first component and the second component.
    Type: Grant
    Filed: January 9, 2018
    Date of Patent: March 2, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Masakazu Fukumitsu, Shuhei Yamada
  • Patent number: 10913654
    Abstract: An electronic device includes a package substrate, a circuit assembly, and a housing. The circuit assembly is mounted on the package substrate. The circuit assembly includes a first sealed cavity formed in a device substrate. The housing is mounted on the package substrate to form a second sealed cavity about the circuit assembly.
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: February 9, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Adam Joseph Fruehling, Juan Alejandro Herbsommer, Simon Joshua Jacobs, Benjamin Stassen Cook, James F. Hallas, Randy Long
  • Patent number: 10900995
    Abstract: A method for fabricating a tri-axial MEMS accelerometer that has a top cap silicon wafer and a bottom cap silicon wafer coupled with a measurement mass. The measurement mass has a two level structure, each level having an inner frame coupled to an outer frame by a plurality of first elastic beams, a mass coupled to the inner frame by a plurality of second elastic beams, and a comb coupling structure between the mass and the inner frame. The comb coupling structures are arranged in an orthogonal orientation. The top level and bottom level measurement masses measure acceleration in perpendicular directions. The top level and bottom level measurement masses and the inner frame form an integral unit which moves along a third direction. Acceleration in the third direction is measured from the change in capacitance between the integral unit and the top cap silicon wafer and bottom cap silicon wafer.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: January 26, 2021
    Assignee: CHINESE ACADEMY OF SCIENCES INSTITUTE OF GEOLOGY AND GEOPHYSICS
    Inventors: Chen Sun, Lian Zhong Yu
  • Patent number: 10875761
    Abstract: A micro-electrical-mechanical system (MEMS) device includes one or more slidable connection assemblies for releasably coupling the micro-electrical-mechanical system (MEMS) device to a wafer from which the micro-electrical-mechanical system (MEMS) device was made. The MEMS device may include a MEMS actuation core, and a MEMS electrical connector assembly electrically coupled to the MEMS actuation core configured to be electrically coupled to a printed circuit board.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: December 29, 2020
    Assignee: MEMS Drive, Inc.
    Inventors: Matthew Ng, Xiaolei Liu, Guiqin Wang
  • Patent number: 10869630
    Abstract: A device for measuring the pressure applied between a user's tongue and palate includes a body shaped to fit complimentarily against the user's palate and a pressure sensor affixed to the body such that the device has a total thickness less than 4 millimeters.
    Type: Grant
    Filed: January 26, 2016
    Date of Patent: December 22, 2020
    Assignee: University of Kansas
    Inventor: Jeff P. Searl
  • Patent number: 10850976
    Abstract: Various embodiments of the present disclosure are directed towards a method for forming an integrated chip including an epitaxial layer overlying a microelectromechanical systems (MEMS) substrate. The method includes bonding a MEMS substrate to a carrier substrate, the MEMS substrate includes monocrystalline silicon. An epitaxial layer is formed over the MEMS substrate, the epitaxial layer has a higher doping concentration than the MEMS substrate. A plurality of contacts are formed over the epitaxial layer, the plurality of contacts respectively form ohmic contacts with the epitaxial layer.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: December 1, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Kuei-Sung Chang, Chia-Hua Chu, Shang-Ying Tsai
  • Patent number: 10843915
    Abstract: A method for forming a MEMS device may include performing a silicon-on-nothing process to form a cavity in a monocrystalline silicon substrate at a first depth relative to a top surface of the monocrystalline silicon substrate; forming, in an electrically conductive electrode region of the monocrystalline silicon substrate, an electrically insulated region extending to a second depth that is less than the first depth relative to the top surface of the monocrystalline silicon substrate; and etching the monocrystalline silicon substrate to expose a gap between a first electrode and a second electrode, wherein the second electrode is separated from the first electrode, within a first depth region, by a first distance defined by the electrically insulated region and the gap, and wherein the second electrode is separated from the first electrode, within a second depth region, by a second distance defined by the gap.
    Type: Grant
    Filed: April 12, 2019
    Date of Patent: November 24, 2020
    Assignee: Infineon Dresdon GmbH & Co. KG
    Inventors: Sebastian Pregl, Uwe Rudolph
  • Patent number: 10809859
    Abstract: A capacitive sensor includes: a resinous panel that has a translucent property, a main surface of the panel being a manipulation surface; a sensor substrate placed so as to face another main surface of the panel, the other main surface being opposite to the manipulation surface of the panel, the sensor substrate having a glass base material and a transparent electrode provided on at least one main surface of the base material; an intermediate layer that has a translucent property, the intermediate layer being disposed between the panel and the sensor substrate; a first adhesive layer disposed between the panel and the intermediate layer, the first adhesive layer bonding the panel and the intermediate layer together; and a second adhesive layer disposed between the sensor substrate and the intermediate layer, the second adhesive layer bonding the sensor substrate and the intermediate layer together.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: October 20, 2020
    Assignee: Alps Alpine Co., Ltd.
    Inventors: Hideto Sasagawa, Takashi Asakawa, Takefumi Osaka, Yutaka Takashima
  • Patent number: 10809144
    Abstract: Instead of insert molding a mold member with a resin case to integrate it, a filler is filled into a first opening formed in the resin case while the mold member is disposed therein, whereby integration is performed. This makes it possible to suppress peeling between the mold member and the resin case due to a thermal cycle, and also makes it possible to suppress leakage of a measurement medium to the outside through a gap between the mold member and the resin case.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: October 20, 2020
    Assignee: DENSO CORPORATION
    Inventors: Kazuya Hirasawa, Takuya Sato
  • Patent number: 10806502
    Abstract: A vapor delivery system and method is provided that is adapted for treating prostate tissue. The vapor delivery system includes a vapor delivery needle configured to deliver condensable vapor energy to tissue. In one method, the vapor delivery system is advanced transurethrally into the patient to access the prostate tissue. The vapor delivery system is properly positioned by measuring and advancing the system based on a field-of-view of an endoscope or camera disposed within the system.
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: October 20, 2020
    Assignee: Boston Scientific Scimed, Inc.
    Inventors: Michael Hoey, Roger Noel Hastings
  • Patent number: 10795484
    Abstract: The present disclosure provides a force touch structure and a display device. The force touch structure includes a force sensor and a reference layer. A capacitor is formed between the force sensor and the reference layer, the force sensor includes a first pattern layer and a second pattern layer, and the second pattern layer includes a heat dissipation structure.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: October 6, 2020
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventor: Meizhu Zheng
  • Patent number: 10773953
    Abstract: A method of fabricating a MEMS structure includes providing a substrate comprising a logic element region and a MEMS region. Next, a logic element is formed within the logic element region. A nitrogen-containing material layer is formed to cover the logic element region and the MEMS region conformally. Then, part of the nitrogen-containing material layer within the MEMS region is removed to form at least one shrinking region. Subsequently, a dielectric layer is formed to cover the logic element region and MEMS region, and the dielectric layer fills in the shrinking region. After that, the dielectric layer is etched to form at least one releasing hole, wherein the shrinking region surrounds the releasing hole. Finally, the substrate is etched to form a chamber.
    Type: Grant
    Filed: September 7, 2017
    Date of Patent: September 15, 2020
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Meng-Jia Lin, Yung-Hsiao Lee, Weng-Yi Chen, Shih-Wei Li, Chung-Hsien Liu
  • Patent number: 10768408
    Abstract: A buried cavity is formed in a monolithic body to delimit a suspended membrane. A peripheral insulating region defines a supporting frame in the suspended membrane. Trenches extending through the suspended membrane define a rotatable mobile mass carried by the supporting frame. The mobile mass forms an oscillating mass, supporting arms, spring portions, and mobile electrodes that are combfingered to fixed electrodes of the supporting frame. A reflecting region is formed on top of the oscillating mass.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: September 8, 2020
    Assignee: STMicroelectronics S.r.l.
    Inventors: Enri Duqi, Lorenzo Baldo, Roberto Carminati, Flavio Francesco Villa
  • Patent number: 10765708
    Abstract: The present invention relates to composition comprising Lactobacillus rye ferment, dialkylisosorbide and phospholipid. Preferably, the composition further comprises ethoxylated sorbitan fatty acid ester. The composition has been shown to be effective against infections of closed comedones. The invention further relates to a method of preparing the composition, to a roll-on applicator comprising the composition and to the use of the composition in treatment of closed comedones infections.
    Type: Grant
    Filed: December 5, 2016
    Date of Patent: September 8, 2020
    Assignee: JAO Beheer BV
    Inventor: Elzbieta Ewa Brand-Garnys
  • Patent number: 10753959
    Abstract: A probe card includes a conductive body, an insulation block, and a plurality of conductive microsprings. The insulation block covers at least one side of the body and at least partially encloses the microsprings. A first end of each microspring is connected to the conductive body and a second end is exposed from the insulation block. In operation, the probe card is moved onto one or more semiconductor devices to be tested. As the probe card is moved toward the semiconductor devices, the second ends of the conductive microsprings come into contact with contact pads on the semiconductor devices. The insulation block encloses the microsprings, which prevents the microsprings from buckling or making contact with each other. As a result, the probe card produces fewer false positives and false negatives during the testing process.
    Type: Grant
    Filed: July 16, 2018
    Date of Patent: August 25, 2020
    Assignee: Facebook Technologies, LLC
    Inventors: Pooya Saketi, Christopher Percival
  • Patent number: 10723616
    Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.
    Type: Grant
    Filed: February 4, 2019
    Date of Patent: July 28, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Kirmse, Benjamin Cook, Genki Yano, Stuart Jacobsen
  • Patent number: 10717644
    Abstract: A microelectro-mechanical system (MEMS) device includes a substrate of a semiconductor material having thereon a movable component, a glass substrate bonded to the substrate, an electrostatic biasing layer disposed between the movable component and the glass substrate. A cavity is defined between the movable component and a top surface of the glass substrate. The electrostatic biasing layer completely overlaps with the movable component.
    Type: Grant
    Filed: July 3, 2017
    Date of Patent: July 21, 2020
    Assignee: UNITED MICROELETRONICS CORP.
    Inventor: Linlin Zhao
  • Patent number: 10676343
    Abstract: A multi-layer sealing film for high seal yield is provided. In some embodiments, a substrate comprises a vent opening extending through the substrate, from an upper side of the substrate to a lower side of the substrate. The upper side of the substrate has a first pressure, and the lower side of the substrate has a second pressure different than the first pressure. The multi-layer sealing film covers and seals the vent opening to prevent the first pressure from equalizing with the second pressure through the vent opening. Further, the multi-layer sealing film comprises a pair of metal layers and a barrier layer sandwiched between metal layers. Also provided is a microelectromechanical systems (MEMS) package comprising the multilayer sealing film, and a method for manufacturing the multi-layer sealing film.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: June 9, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Chien Yang, Ming-Lun Shih, Ren-Dou Lee, Jen-Hao Liu
  • Patent number: 10639117
    Abstract: Apparatuses and methods for the haptic sensation of forces at a remote location. Groups of MEMS-based pressure sensors are combined into sensor arrays. In some embodiments, the pressure sensors are encased in silicone or other elastomeric substance to allow for routine use in the aqueous environment of the body. The sensor arrays may be housed in a bio-compatible material (e.g., stainless steel, plastic) and may be attached to a printed circuit board to allow the electrical signal generated by the sensors to be communicated to a user. The sensor arrays may be used with faceplates that directly interact with the target tissue or object. The faceplates may be rough, smooth, serrated, or any other texture. The present apparatuses and methods are particularly well suited for robotic surgery and may be used wherever haptic sensing of forces at a remote location is desired.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: May 5, 2020
    Assignee: University of Pittsburgh—Of the Commonwealth System of Higher Education
    Inventors: Paul J. Johnson, Umamaheswar Duvvuri
  • Patent number: 10633246
    Abstract: A mixed-signal multi-chip package comprises a lead frame, a first die, and a digital die. The first die can provide an analog signal in an analog chip pad of the first die. The digital die can receive the analog signal from the first die through an analog chip pad. The analog input chip pad is coupled with the respective analog output chip pad of the first die by a first bonding wire. The digital die is configured to communicate with external circuitry using a digital signal-bearing signal exchanged via at least one first bond pad of the lead-frame. A second bond pad of the lead frame configured to be coupled to a DC voltage extends laterally along a plane of the lead-frame between the first bond pad and the first bonding wire, to form a DC guard between the first bond pad and the first bonding wire.
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: April 28, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Kimmo Kaija
  • Patent number: 10613668
    Abstract: A touch sensor is provided that includes a transparent, insulating substrate and at least one U-shaped electrically conductive micromesh that includes traces disposed on the substrate. The traces include an elemental metal or an alloy of elemental metal. The touch sensor may be configured to determine a location and a magnitude of a force of a touch.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: April 7, 2020
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Matthew H. Frey, Robert R. Kieschke, Billy L. Weaver
  • Patent number: 10600704
    Abstract: A support substrate has a face above which at least one electronic component is fixed. A peripheral area of the face includes an annular local metal layer. An encapsulating cover for the electronic component includes a peripheral wall having an end edge that is mounted above the peripheral area. The annular metal local layer includes, at the periphery thereof, a series of spaced-apart teeth with notches formed therebetween. The teeth extend as far as the peripheral edge of the support substrate.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: March 24, 2020
    Assignees: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Malta) Ltd
    Inventors: Jerome Lopez, Roseanne Duca
  • Patent number: 10593651
    Abstract: A three-dimensional stacking technique performed in a wafer-to-wafer fashion reducing the machine movement in production. The Wafers are processed with metallic traces and stacked before dicing into separate die stacks. The traces of each layer of the stacks are interconnected via electroless plating.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: March 17, 2020
    Assignee: Invensas Corporation
    Inventors: Belgacem Haba, Ilyas Mohammed, Javier A. Delacruz
  • Patent number: 10572652
    Abstract: A user manages security of one or more user devices by manipulating one or more sensors located in the user's mouth in a predetermined pattern corresponding to a password. The matching of the predetermined pattern to the password unlocks at least a portion of at least one user device.
    Type: Grant
    Filed: February 14, 2019
    Date of Patent: February 25, 2020
    Assignee: International Business Machines Corporation
    Inventors: Faraz Ahmad, Anto Ajay Raj John
  • Patent number: 10526199
    Abstract: An integrated chip including a first substrate, a second substrate overlying the first substrate, and a third substrate overlying the second substrate is provided. The first, second, and third substrates at least partially define a cavity, and the second substrate includes a movable mass in the cavity between the first and third substrates. A getter structure is in the cavity and includes a getter layer and a filter layer. The getter layer comprises a getter material. The filter layer has a first side adjoining the getter layer, and further has a second side that is opposite the first side and that faces the cavity. The filter layer is configured to pass the getter material from the first side to the second side while blocking any impurities.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: January 7, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ting-Jung Chen, Lee-Chuan Tseng
  • Patent number: 10490472
    Abstract: Conventional packages for 5G applications suffer from disadvantages including high mold stress on the die, reduced performance, and increased keep-out zone. To address these and other issues of the conventional packages, it is proposed to pre-apply a wafer-applied material, which remains in place, to form an air cavity between the die and the substrate. The air cavity can enhance the die's performance. Also, since the wafer-applied material can remain in place, the keep-out zone can be reduced. As a result, higher density modules can be fabricated.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: November 26, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Jie Fu, Hong Bok We, Manuel Aldrete
  • Patent number: 10461151
    Abstract: An integrated circuit may include a semiconductor die having a trench formed in a surface of the semiconductor die. One or more circuit components may be formed on the surface of the semiconductor die. The trench can extend into the semiconductor die next to at least one circuit component. The trench may surround the circuit component partially or wholly. The trench may be filled with a material having a lower bulk modulus than the semiconductor die in which the trench is formed.
    Type: Grant
    Filed: October 7, 2016
    Date of Patent: October 29, 2019
    Assignee: Analog Devices Global
    Inventors: Patrick F. M. Poucher, Padraig L. Fitzgerald, John Jude O'Donnell, Oliver J. Kierse, Denis M. O'Connor
  • Patent number: 10458870
    Abstract: A pressure sensor may measure gas or liquid pressure. A chamber may have an inlet that receives the gas or liquid. A flexible diaphragm may be within the chamber that has a surface exposed to the gas or liquid after it flows through the inlet. A pressure sensor system may sense changes in the flexible diaphragm caused by changes in the pressure of the gas or liquid. A pressure-insensitive sensor system may sense changes in the flexible diaphragm that are not caused by changes in the pressure of the gas or liquid. The pressure-insensitive sensor system may be insensitive to changes in the flexible diaphragm caused by changes in the pressure of the gas or liquid.
    Type: Grant
    Filed: November 4, 2016
    Date of Patent: October 29, 2019
    Assignee: MKS Instruments, Inc.
    Inventors: Lei Gu, Paul Lucas, Stephen F. Bart, Phillip W. Sullivan
  • Patent number: 10446954
    Abstract: A ground terminal with a novel structure is provided that enables reliable detection of loosening of a terminal. A ground terminal that is bolted to ground a ground wire of a vehicle-mounted device to a negative terminal of a battery, the ground terminal including: a connection portion that has a bolt insertion hole into which a bolt used for the bolting is inserted. A piezoelectric element is provided surrounding the bolt insertion hole of the connection portion.
    Type: Grant
    Filed: February 6, 2017
    Date of Patent: October 15, 2019
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Tatsurou Sakai
  • Patent number: 10433042
    Abstract: A MEMS multi-module assembly, manufacturing method, and electronics apparatus are disclosed herein. The MEMS multi-module assembly comprises: a first die having a first hole; and a second die stacked on the first die, having a second MEMS device, wherein the second MEMS device is connected outside via the first hole.
    Type: Grant
    Filed: November 3, 2015
    Date of Patent: October 1, 2019
    Assignee: Goertek Inc.
    Inventor: Quanbo Zou
  • Patent number: 10410978
    Abstract: A semiconductor wafer and a method for forming a semiconductor. The semiconductor wafer includes: a first semiconductor component having a first device; a second semiconductor component having a second device; an insulation layer laterally extending to the first semiconductor component and the second semiconductor component; and a grind layer configured on or adjacent to a backside of the semiconductor wafer. Therefore, chipping or cracking can be decreased or avoided when the grind layer is exposed during the thinning process (such as backside grinding).
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: September 10, 2019
    Assignee: Sanken Electric Co., Ltd.
    Inventors: Hiroshi Shikauchi, Tomonori Hotate, Yuki Tanaka, Shinji Kudoh
  • Patent number: 10353508
    Abstract: Provided are a touch display panel and a touch display device. The touch display panel includes at least one semiconductor pressure-sensing touch device, and the semiconductor pressure-sensing touch device includes a first pressure-sensitive resistor, a second pressure-sensitive resistor, a third pressure-sensitive resistor and a fourth pressure-sensitive resistor. A first end of the first pressure-sensitive resistor and a first end of the second pressure-sensitive resistor are connected to a first power inputting terminal, a second end of the first pressure-sensitive resistor and a first end of the fourth pressure-sensitive resistor are connected to a first sense signal measuring terminal, a second end of the fourth pressure-sensitive resistor and a second end of the third pressure-sensitive resistor are connected to a second power inputting terminal.
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: July 16, 2019
    Assignee: XIAMEN TIANMA MICRO-ELECTRONICS CO., LTD.
    Inventors: Jieliang Li, Yong Yuan, Zaiwen Zhu, Qitai Ji, Qijun Yao, Feng Lu
  • Patent number: 10343300
    Abstract: A method for manufacturing a porous body includes a structure forming step that is repeatedly performed a plurality of times and includes: a pore-forming material placing step of placing a pore-forming material 50 for forming pores in the porous body; an aggregate placing step of placing aggregate particles 51 which are part of raw materials of the porous body; a binder placing step of placing binder particles 52 which are part of the raw materials of the porous body; and a binding step of heat-fusing at least part of the placed binder particles 52 to bind aggregate particles 51 together.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: July 9, 2019
    Assignee: NGK Insulators, Ltd.
    Inventors: Satoshi Sakashita, Masayuki Uchida
  • Patent number: 10343896
    Abstract: A method for fabricating an integrated MEMS device and the resulting structure therefore. A control process monitor comprising a MEMS membrane cover can be provided within an integrated CMOS-MEMS package to monitor package leaking or outgassing. The MEMS membrane cover can separate an upper cavity region subject to leaking from a lower cavity subject to outgassing. Differential changes in pressure between these cavities can be detecting by monitoring the deflection of the membrane cover via a plurality of displacement sensors. An integrated MEMS device can be fabricated with a first and second MEMS device configured with a first and second MEMS cavity, respectively. The separate cavities can be formed via etching a capping structure to configure each cavity with a separate cavity volume. By utilizing an outgassing characteristic of a CMOS layer within the integrated MEMS device, the first and second MEMS cavities can be configured with different cavity pressures.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: July 9, 2019
    Assignee: mCube, Inc.
    Inventor: Te-Hsi “Terrence” Lee
  • Patent number: 10331279
    Abstract: A transducer converts an actuation, applied to the transducer, into a raw actuation signal. The sensor device comprises an acceleration intermediary for converting an acceleration of the transducer into an actuation which is applied to the transducer, an underlying surface state detector for generating an underlying surface state signal by evaluating the raw actuation signal and an actuation signal generator for generating the actuation signal, processed in dependence on an underlying surface state, by evaluating the raw actuation signal taking into account the underlying surface state signal. Furthermore, the invention relates to a corresponding vehicle and to a corresponding method for generating an actuation signal which is processed in dependence on an underlying surface state.
    Type: Grant
    Filed: November 22, 2014
    Date of Patent: June 25, 2019
    Assignee: AUDI AG
    Inventor: Michael Wachinger
  • Patent number: 10313797
    Abstract: A microphone, a manufacturing method and a control method of the microphone are provided. The microphone includes an insulating layer bonded to a surface of a substrate in which a sound inlet is formed and includes a plurality of sound apertures. A diaphragm is formed at a position that corresponds to the sound inlet of the substrate on an upper surface of the insulating layer. A displacement adjusting layer is disposed in a circumference of the diaphragm on the upper surface of the insulating layer and is configured to adjust hardness of the diaphragm based on an input sound. A fixing layer is disposed on the diaphragm and the displacement adjusting layer while spaced apart from the diaphragm and the displacement adjusting layer.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: June 4, 2019
    Assignee: Hyundai Motor Company
    Inventor: Ilseon Yoo