Abstract: The fixed end of an acceleration detection beam of a semiconductor acceleration detecting apparatus is mounted onto a board through a supporting base. A weight for increasing the sensitivity to acceleration is disposed on the free end of the acceleration detection beam. A limit stop for limiting excessive displacement of the weight in two directions surrounds part of the weight. Therefore, the displacement of the weight can be controlled with a high degree of accuracy. Resistance to impact is also improved.
Abstract: A resin sealed semiconductor device includes a semiconductor chip formed on a substrate and sealed with resin. A concave portion is formed on a major surface of a semiconductor substrate between an insulating film for isolation and an edge of the major surface of the semiconductor substrate. This concave portion is filled with a buffer member having an elastic modulus smaller than that of the material of the semiconductor substrate. Mechanical stress applied to an edge of the semiconductor substrate, caused by the callosity of resin, is absorbed and reduced by the buffer member. A portion of the semiconductor substrate between the concave portion and the insulating film for isolation prevents the remainder of the mechanical stress from being transmitted from the buffer member to the insulating film and circuit elements.