Means To Reduce Sensitivity To Physical Deformation Patents (Class 257/420)
  • Patent number: 5231879
    Abstract: The fixed end of an acceleration detection beam of a semiconductor acceleration detecting apparatus is mounted onto a board through a supporting base. A weight for increasing the sensitivity to acceleration is disposed on the free end of the acceleration detection beam. A limit stop for limiting excessive displacement of the weight in two directions surrounds part of the weight. Therefore, the displacement of the weight can be controlled with a high degree of accuracy. Resistance to impact is also improved.
    Type: Grant
    Filed: March 4, 1992
    Date of Patent: August 3, 1993
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Masahiro Yamamoto
  • Patent number: 5187558
    Abstract: A resin sealed semiconductor device includes a semiconductor chip formed on a substrate and sealed with resin. A concave portion is formed on a major surface of a semiconductor substrate between an insulating film for isolation and an edge of the major surface of the semiconductor substrate. This concave portion is filled with a buffer member having an elastic modulus smaller than that of the material of the semiconductor substrate. Mechanical stress applied to an edge of the semiconductor substrate, caused by the callosity of resin, is absorbed and reduced by the buffer member. A portion of the semiconductor substrate between the concave portion and the insulating film for isolation prevents the remainder of the mechanical stress from being transmitted from the buffer member to the insulating film and circuit elements.
    Type: Grant
    Filed: May 1, 1990
    Date of Patent: February 16, 1993
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yuichi Nakashima, Mitsuhiro Tomikawa, Hirohisa Yamamoto