Abstract: The invention relates to a radiation detector (10), comprising an array of pixels (1), wherein each pixel (1) comprises a conversion layer of a semiconductor material (4) for converting incident radiation into electrical signals and wherein each pixel (1) is surrounded by a trench (3) that is at least partly filled with a barrier material that absorbs at least a part of photons generated by the incident radiation. The invention also relates to a method of manufacturing such a radiation detector (10).

Abstract: To increase total power in a betavoltaic device, it is desirable to have greater radioisotope material and/or semiconductor surface area, rather than greater radioisotope material volume. An example of this invention is a high power density betavoltaic battery. In one example of this invention, tritium is used as a fuel source. In other examples, radioisotopes, such as Nickel-63, Phosphorus-33 or promethium, may be used. The semiconductor used in this invention may include, but is not limited to, Si, GaAs, GaP, GaN, diamond, and SiC. For example (for purposes of illustration/example, only), tritium will be referenced as an exemplary fuel source, and SiC will be referenced as an exemplary semiconductor material. Other variations and examples are also discussed and given.

Abstract: A large area SDD detector having linear anodes surrounded by steering electrodes and having an oblong, circular, hexagonal, or rectangular shape. The detectors feature stop rings having a junction on the irradiation side and an ohmic contact on the anode side and/or irradiation side. The irradiation and anode stop ring biasing configuration influences the leakage current flowing to the anode and, hence, the overall efficiency of the active area of the detector. A gettering process is also described for creation of the disclosed SDD detectors. The SDD detector may utilize a segmented configuration having multiple anode segments and kick electrodes for reduction of the detector's surface electric field. In another embodiment, a number of strip-like anodes are linked together to form an interdigitated SDD detector for use with neutron detection. Further described is a wraparound structure for use with Ge detectors to minimize capacitance.

Abstract: A neutron sensing material detector includes an anode; a cathode; and a semiconductor material disposed between the anode and the cathode. An electric field is applied between the anode and cathode. The semiconductor material is composed of a ternary composition of stoichiometry LiM2+GV and exhibits an antifluorite-type ordering, where the stoichiometric fractions are Li=1, M2+=1, and GV=1. Electron-hole pairs are created by absorption of radiation, and the electron-hole pairs are detected by the current they generate between the anode and the cathode. The anode may include an array of pixels to provide improved spatial and energy resolution over the face of the anode. The signal value for each pixel can be mapped to a color or grey scale normalized to all the other pixel signal values for a particular moment in time. A guard ring or guard grid may be provided to reduce leakage current.

Abstract: A radiation detector of the ?E-E type is proposed.

Abstract: Energy devices such as energy conversion devices and energy storage devices and methods for the manufacture of such devices. The devices include a support member having an array of pore channels having a small average pore channel diameter and having a pore channel length. Material layers that may include energy conversion materials and conductive materials are coaxially disposed within the pore channels to form material rods having a relatively small cross-section and a relatively long length. By varying the structure of the materials in the pore channels, various energy devices can be fabricated, such as photovoltaic (PV) devices, radiation detectors, capacitors, batteries and the like.

Abstract: An intermediate layer is located between a recording photoconductive layer and an electrode, which is either one of a bias electrode and a reference electrode, and which is located on the side at positive electric potential with respect to a charge accumulating section at the time of readout of electric charges of the charge accumulating section. The intermediate layer is an a-Se layer containing, as a specific substance, at least one kind of substance selected from the group consisting of an alkali metal fluoride, an alkaline earth metal fluoride, an alkali metal oxide, an alkaline earth metal oxide, SiOx, and GeOx, where x represents a number satisfying 0.5?x?1.5, in a concentration falling within the range of 0.003 mol % to 0.03 mol %.

Abstract: The object of the invention is a detector (20) of radon and its daughter products that are present in the ambient air, including in particular aerosols, characterized in that it comprises: A silicon pellet that integrates a PN junction with a deserted zone, designed to emit signals under the action of the radiation that is emitted by said radon and said daughter products, A passivation layer (22) that covers this silicon pellet and that makes it possible for the detector to work in the open air, and A conductive layer (24) that covers the passivation layer and that forms an electrode for collecting radionuclides. The invention also covers the detection device that includes said detector.

Abstract: Gray tone lithography is used to form curved silicon topographies for semiconductor based solid-state imaging devices. The imagers are curved to a specific curvature and shaped directly for the specific application; such as curved focal planes. The curvature of the backside is independent from the front surface, which allows thinning of the detector using standard semiconductor processing.

Abstract: An object of the present invention is to provide a method for manufacturing a semiconductor device having a semiconductor element capable of reducing a cost and improving a throughput with a minute structure, and further, a method for manufacturing a liquid crystal television and an EL television. According to one feature of the invention, a method for manufacturing a semiconductor device comprises the steps of: forming a light absorption layer over a substrate, forming a first region over the light absorption layer by using a solution, generating heat by irradiating the light absorption layer with laser light, and forming a first film pattern by heating the first region with the heat.

Abstract: One embodiment of a radiation sensing capacitor is presented. The radiation sensing capacitor may include a silicon layer and an insulator layer coupled to the silicon layer. The radiation sensing capacitor may also include a silicon-insulator interface region coupling the silicon layer to the insulator layer and a plurality of hole-trapping precursors formed in the insulator layer proximate to the silicon-insulator interface region.

Abstract: A semiconductor radiation sensor (100), comprising a substrate (102), a carrier material (104) mounted to the substrate (102), and a semiconductor detector (106) mounted to the carrier material (104). A radiation sensitive portion of the semiconductor detector (106) is oriented towards the carrier material (104) and generally away from the substrate (102), and the carrier material is adapted to transmit radiation to the radiation sensitive portion of the semiconductor detector (106). A dosimeter comprising the radiation sensor (100) and a method of manufacturing the radiation sensor (100) are also provided.

Abstract: A device for coupling energy in a plasmon wave to an electron beam includes a metal transmission line having a pointed end; a generator mechanism constructed and adapted to generate a beam of charged particles; and a detector microcircuit disposed adjacent to the generator mechanism. The generator mechanism and the detector microcircuit are disposed adjacent the pointed end of the metal transmission line and wherein a beam of charged particles from the generator mechanism to the detector microcircuit electrically couples the plasmon wave traveling along the metal transmission line to the microcircuit.

Abstract: A nano-resonating structure constructed and adapted to couple energy from a beam of charged particles into said nano-resonating structure and to transmit coupled energy outside the nano-resonating structure. A plurality of the nano-resonant substructures may be formed adjacent one another in a stacked array, and each may have various shapes, including segmented portions of shaped structures, circular, semi-circular, oval, square, rectangular, semi-rectangular, C-shaped, U-shaped and other shapes as well as designs having a segmented outer surface or area, and arranged in a vertically stacked array comprised of one or more ultra-small resonant structures. The vertically stacked arrays may be symmetric or asymmetric, tilted, and/or staggered.

Abstract: A semiconductor nanowire is coated with a chemical coating layer that comprises a functional material which modulates the quantity of free charge carriers within the semiconductor nanowire. The outer surface of the chemical coating layer includes a chemical group that facilitates bonding with molecules to be detected through electrostatic forces. The bonding between the chemical coating layer and the molecules alters the electrical charge distribution in the chemical coating layer, which alters the amount of the free charge carriers and the conductivity in the semiconductor nanowire. The coated semiconductor nanowire may be employed as a chemical sensor for the type of chemicals that bonds with the functional material in the chemical coating layer. Detection of such chemicals may indicate pH of a solution, a vapor pressure of a reactive material in gas phase, and/or a concentration of a molecule in a solution.

Abstract: The invention relates to a detector arrangement (100), a method for the detection of electrical charge carriers and use of an ONO field effect transistor for detection of an electrical charge. The detector arrangement (100) has an ONO field effect transistor embodied on and/or in a substrate (101), for the detection of electrical charge carriers, such that the electrical charge carrier (103) for detection may be introduced into die ONO field effect transistor layer sequence (102), a recording unit (104), coupled to the ONO field effect transistor, for recording an electrical signal characteristic of the amount and/or the charge carrier type for the electrical charge carrier (103) introduced into the ONO layer sequence (102) and an analytical unit for determining the amount and/or the charge carrier type of the electrical charge carrier (103) introduced into the ONO layer sequence (102) from the characteristic electrical signal.

Abstract: An electron tube of the present invention includes: a vacuum vessel including a face plate portion made of synthetic silica and having a surface on which a photoelectric surface is provided, a stem portion arranged facing the photoelectric surface and made of synthetic silica, and a side tube portion having one end connected to the face plate portion and the other end connected to the stem portion and made of synthetic silica; a projection portion arranged in the vacuum vessel, extending from the stem portion toward the photoelectric surface, and made of synthetic silica; and an electron detector arranged on the projection portion, for detecting electrons from the photoelectric surface, and made of silicon.

Abstract: Disclosed herein is a solid-state imaging element which includes a plurality of drive signal inputs, a plurality of bus lines, and a plurality of vertical transfer register electrodes. In the solid-state imaging element, a charge accumulated in light-receiving elements in a pixel region is vertically transferred by the drive signals input to the electrodes. Each of the electrodes has a contact part connected to the second contact and having a width smaller than a width of the electrodes in the pixel region, and a blank region is formed between predetermined adjacent two of the contact parts so that a width of the blank region is larger than a distance between respective two of the contact parts other than the predetermined adjacent two of the contact parts. The first contact is disposed on the blank region.

Abstract: A photoelectronic device and an avalanche self-quenching process for a photoelectronic device are described. The photoelectronic device comprises a nanoscale semiconductor multiplication region and a nanoscale doped semiconductor quenching structure including a depletion region and an undepletion region. The photoelectronic device can act as a single photon detector or a single carrier multiplier. The avalanche self-quenching process allows electrical field reduction in the multiplication region by movement of the multiplication carriers, thus quenching the avalanche.

Abstract: Non-streaming high-efficiency perforated semiconductor neutron detectors, method of making same and measuring wands and detector modules utilizing same are disclosed. The detectors have improved mechanical structure, flattened angular detector responses, and reduced leakage current. A plurality of such detectors can be assembled into imaging arrays, and can be used for neutron radiography, remote neutron sensing, cold neutron imaging, SNM monitoring, and various other applications.

Abstract: A method of inducing explosive atomization of materials is provided using a metal-oxide-semiconductor (MOS)-based structure under electrical excitation. Explosive atomization of the gate electrode and surrounding dielectric materials creates a microplasma that is substantially confined with the device at the metal/dielectric interface. The device can generate a microplasma in either the accumulation or inversion regime. The high degree of confinement of the microplasma allows chip-scale implementation of atomic emission spectroscopy and detection using a minimal amount of analyte.

Abstract: The invention provides a cross section evaluating apparatus capable of analyzing the cross sectional structure in a state where the temperature of the specimen is regulated. There is disclosed an information acquisition apparatus comprising a stage for placing the specimen, temperature regulation means for regulating the temperature of the specimen, exposure means for exposing a surface, of which information is desired, of the specimen, and information acquisition means for acquiring information relating to the surface exposed by the exposure means.

Abstract: The present invention provides a standard reference component for calibration for performing magnification calibration used in the scanning electron microscope with high precision, and provides a scanning electron microscope technique using it.

Abstract: A compound semiconductor radiation detector includes a body of compound semiconducting material having an electrode on at least one surface thereof. The electrode includes a layer of a compound of a first element and a second element. The first element is platinum and the second element includes at least one of the following: chromium, cobalt, gallium, germanium, indium, molybdenum, nickel, palladium, ruthenium, silicon, silver, tantalum, titanium, tungsten, vanadium, zirconium, manganese, iron, magnesium, copper, tin, or gold. The layer can further include sublayers, each of which is made from a different one of the second elements and platinum as the first element.

Abstract: An electron detector (30) for detection of electrons comprises a semiconductor wafer (11) having a central portion (12) with a thickness of at most 150 ?m, preferably at most 100 ?m, formed by etching an area of a thicker wafer. On opposite sides of the central portion (12) there are n-type and p-type contacts (16, 31). In operation, a reverse bias is applied across the contacts (16, 31) and electrons incident on the layer (15) of intrinsic semiconductor material between the contacts (16, 31) generate electron-hole pairs which accelerate towards the contacts (16, 31) where they may detected as a signal. Conductive terminals (24, 32) contact the contacts (16, 31) and are connected to a signal processing circuit in IC chips (28, 37) mounted to the semiconductor wafer (11) outside the active area of the detector (30). The contacts (16, 31) are shaped as arrays of strips extending orthogonally on the two sides of the intrinsic layer (15) to provide two-dimensional spatial resolution.

Abstract: Semiconductor detector includes semiconductor substrate (HK), source region (S), drain region (D), external gate region (G) and inner gate region (IG) for collecting free charge carriers generated in semiconductor substrate, wherein inner gate region is arranged in semiconductor substrate at least partially under external gate region to control conduction channel (K) from below as a function of the accumulated charge carriers, as well as with clear contact (CL) for the removal of the accumulated charge carriers from inner gate region, as well as with drain-clear region (DCG) that can be selectively controlled as an auxiliary clear contact or as a drain. Barrier contact (B) is arranged in a lateral direction between external gate region and drain-clear region to build up a controllable potential barrier between inner gate region and clear contact that prevents the charge carriers accumulated in inner gate region from being removed by suction from clear contact.

Abstract: A PIN diode-based monolithic Nuclear Event Detector and method of manufacturing same for use in detecting a desired level of gamma radiation, in which a PIN diode is integrated with signal processing circuitry, for example CMOS circuitry, in a single thin-film Silicon On Insulator (SOI) chip. The PIN diode is implemented in the p- substrate layer. The signal processing circuitry is located in a thin semiconductor layer and is in electrical communication with the PIN diode. The PIN diode may be integrated with the signal processing circuitry onto a single chip, or may be fabricated stand alone using SOI methods according to the method of the invention.

Abstract: Some embodiments include methods for fabricating an alpha particle emitter and detector associated with an integrated circuit chip. Some embodiments include an integrated circuit chip comprising an alpha particle emitter and detector supported by a semiconductor substrate. Some embodiments include an apparatus for obtaining backscatter data from a sample utilizing an alpha particle emission and detection system supported by a semiconductor substrate. Some embodiments include methods of backscatter analysis utilizing a semiconductor substrate containing an alpha particle emitter and an alpha particle sensor.

Abstract: The invention provides a standard component for calibration that enables a calibration position to be easily specified in order to calibrate accurately a scale factor in the electron-beam system, and provides an electron-beam system using it. High-accuracy metrology calibration capable of specifying a calibration position can be realized by forming a mark pattern or labeled material for identifying the calibration position in proximity of a superlattice pattern of the standard component for system calibration. The standard component for calibration is one that calibrates a scale factor of an electron-beam system based on a signal of secondary charged particles detected by irradiation of a primary electron beam emitted from the electron-beam system on a substrate having a cross section of a superlattice of a multi-layer structure in which different materials are deposited alternately.

Abstract: An indium tin oxide (ITO) target including calcium of about 0.001% to about 10% by atom, compared with an indium atom, and an ITO transparent electrode for a display apparatus manufactured from an ITO target are provided. A method of manufacturing the ITO target, the method including: preparing a slurry by mixing an indium oxide powder, a tin oxide powder, and a calcium-containing compound powder; granulating the slurry by milling and drying the slurry to prepare a granulated powder; shaping the granulated powder to form a shaped body; and sintering the shaped body. The ITO target including calcium manufactured by the method can reduce a number of times nodules and arcs are generated during sputtering, thereby growing a film which is able to be used for a long period of time.

Abstract: Boron carbide heteroisomer semiconductor devices are used as particle detectors. The boron carbide semiconductor devices produce electric current in response to incident particles, such as alpha particles, neutrons, or photons.

Abstract: A system in a package (SIP) or multi-chip module (200, 300, 400) (MCM) uses an electron beam (235, 335, 435) for electrically coupling between microcircuits (230, 330, 430) and (232, 332, 432). In one embodiment, the micro-circuits (230, 430) and (232, 432) can be configured in a side-by-side configuration. In another embodiment, the micro-circuits (330) and (332) can be configured in a chip-on-chip configuration. In yet another embodiment, the electron beam (435) can include a plurality of electron beams (436) and appear as ribbon shaped between two micro-circuits (430, 432). Further, the fabrication to form the electron source (234, 334, 434) and the deflector (261, 356, 461) can be at the final metallization step of the process.

Abstract: A photoelectric conversion device including a photoelectric conversion part including a pair of electrodes and a photoelectric conversion layer provided between the pair of electrodes, wherein the photoelectric conversion part further includes a first charge blocking layer for reducing an injection of a charge into the photoelectric conversion layer from one of the pair of electrodes when a voltage is applied between the pair of electrodes, the first charge blocking layer being provided between the one of the pair of electrodes and the photoelectric conversion layer; and the first charge blocking layer has a relative dielectric constant larger than a relative dielectric constant of the photoelectric conversion layer.

Abstract: The Grunn equation: Depth = 0.046 ? ? ( V acc ) n ? is modified to accurately predict depth of electron beam penetration into a target material. A two-layer stack is formed comprising a thickness of the target material overlying a detection material exhibiting greater sensitivity to the electron beam than the target material. The target material is exposed to electron beam radiation of different energies, with the threshold energy resulting in a changed physical property of the detection material below a predetermined value marking a penetration depth corresponding to the target material thickness. Utilizing the threshold energy (Vacc), the target material thickness (Depth), and the known target material density (?), the numerical power “n” of the Grunn equation is calculated to fit experimental results. So modified, the Grunn equation accurately predicts the depth of penetration of electron beams of varying energies into the target material.

Abstract: A method and apparatus for creating both segmented and unsegmented radiation detectors which can operate at room temperature. The devices include a metal contact layer, and an n-type blocking contact formed from a thin layer of amorphous semiconductor. In one embodiment the material beneath the n-type contact is n-type material, such as lithium compensated silicon that forms the active region of the device. The active layer has been compensated to a degree at which the device may be fully depleted at low bias voltages. A p-type blocking contact layer, or a p-type donor material can be formed beneath a second metal contact layer to complete the device structure. When the contacts to the device are segmented, the device is capable of position sensitive detection and spectroscopy of ionizing radiation, such as photons, electrons, and ions.

Abstract: The invention provides a cross section evaluating apparatus capable of analyzing the cross sectional structure in a state where the temperature of the specimen is regulated. There is disclosed an information acquisition apparatus comprising a stage for placing the specimen, temperature regulation means for regulating the temperature of the specimen, exposure means for exposing a surface, of which information is desired, of the specimen, and information acquisition means for acquiring information relating to the surface exposed by the exposure means.

Abstract: An avalanche photodiode including a multiplication layer is provided. The multiplication layer may include a well region and a barrier region. The well region may include a material having a higher carrier ionization probability than a material used to form the barrier region.

Abstract: A particle detector assembly includes a superconducting absorber to which is coupled superconducting tunnel junction detectors for detecting particles incident on the absorber. Each superconducting tunnel junction detector includes superconducting tunnel junction devices connected in parallel.

Abstract: This invention relates to an electrooptic system array having a plurality of electron lenses. The electrooptic system array includes upper, middle, and lower electrodes arranged along the paths of a plurality of charged-particle beams, the upper, middle, and lower electrodes having pluralities of apertures on the paths of the plurality of charged-particle beams, an upper shield electrode which is interposed between the upper and middle electrodes and has a plurality of shields corresponding to the respective paths of the charged-particle beams, and a lower shield electrode which is interposed between the lower and middle electrodes and has a plurality of shields corresponding to the respective paths of the charged-particle beams.

Abstract: A micro-power generator, comprises an electrically insulating substrate; a semiconductor layer affixed to the substrate; electrodes affixed to the semiconductor layer for collecting electrical charges emitted by a radioisotope source; a radio-isotope source interposed between the electrodes; and electrical circuitry operably coupled to the electrodes for transforming the electrical charges into a controlled output.

Abstract: A photosensitive device for enabling high speed detection of electromagnetic radiation. The device includes recessed electrodes for providing a generally homogeneous electric field in an active region. Carriers generated in the active region are detected using the recessed electrodes.

Abstract: The present neutron sensing device includes a first substantially planar array of flash memory cells, a second substantially planar array of flash memory cells having an edge adjacent an edge of the first substantially planar array of flash memory cells, and a third substantially planar array of flash memory cells having a first edge adjacent an edge adjacent an edge of the first substantially planar array of flash memory cells and a second edge adjacent an edge of the second substantially planar array of flash memory cells.

Abstract: A semiconductor device with laser-programmable fuses for repairing a memory defect found after production, in which guard rings and fuse patterns are designed to take up less chip space. The semiconductor device has a fuse pattern running parallel to the longitudinal axis of a rectangular guard ring, and patterns branching from the fuse pattern and drawn out of the guard ring in the direction perpendicular to that axis. The semiconductor device also has a plurality of memory cell arrays, each coupled to an I/O port for receiving and sending memory signals. One of those arrays is reserved as a redundant memory cell array for repair purposes. The device further has switch circuits for switching the connection between the I/O ports and memory cell arrays, selecting either default memory cell arrays of the I/O ports or their adjacent memory cell arrays, including the redundant memory cell array.

Abstract: The present invention is a solid state detector that has internal gain and incorporates a special readout technique to determine the input position at which a detected signal originated without introducing any dead space to the active area of the device. In a preferred embodiment of the invention, the detector is a silicon avalanche photodiode that provides a two dimensional position sensitive readout for each event that is detected.

Abstract: This invention relates to MRAM technology and new MRAM memory element designs. Specifically, this invention relates to the use of ferromagnetic layers of different sizes in an MRAM element. This reduces magnetic coupling between a pinned layer and a sense layer and provides a more effective memory element.

Abstract: A power source converts &agr;-particle energy into electricity by coulomb collision in doped diamond films. Alpha particle decay from curium-244 creates electron-hole pairs by freeing electrons and holes inside the crystal lattice in N- and P-doped diamond films. Ohmic contacts provide electrical connection to an electronic device. Due to the built-in electric field at the rectifying junction across the N- and P-doped diamond films, the free electrons are constrained to traveling in generally one direction. This one direction then supplies electrons in a manner similar to that of a battery. The radioactive curium layer may be disposed on diamond films for even distribution of &agr;-particle radiation. The resulting power source may be mounted on a diamond substrate that serves to insulate structures below the diamond substrate from &agr;-particle emission. Additional insulation or isolation may be provided in order to prevent damage from &agr;-particle collision.

Abstract: A Hall effect device comprising: (a) an electrically-conductive layer or plate having a top surface; and (b) a ferromagnetic layer, where the conductive film or layer is composed of high mobility semiconductors. Also, a Hall effect device can have a ferromagnetic element that is a multilayer (e.g., a bilayer), and a device in which the Hall plate comprises an indium compound, germanium or mixtures thereof. The devices are useful for a variety of applications such as a memory element in a nonvolatile random access memory array (NRAM) and as a logic gate.

Abstract: A semiconductor device having a trench isolation region including an anti-oxidative liner formed to be thin enough to minimize etch wastage caused by a wet etching solution according to a wet loading effect, and a trench isolation method of forming the same. The semiconductor device includes a silicon substrate and a trench isolation region formed in the silicon substrate. A silicon epitaxial growth layer contacts the silicon substrate at a bottom surface of the trench isolation region and fills the lower half of the trench isolation region. A first oxide layer has an L-shaped cross-section and extends from a sidewall of the trench isolation region to a portion of the bottom surface of the trench isolation region. An anti-oxidative liner has an L-shaped cross-section, and extends between the first oxide layer and the silicon epitaxial growth layer, with its inner surface contacting the silicon epitaxial growth layer.

Abstract: A tunneling barrier for a spin dependent tunneling (SDT) device is disclosed that includes a plurality of ferromagnetic particles. The presence of such particles in the tunneling barrier has been found to increase a magnetoresistance or &Dgr;R/R response, improving the signal and the signal to noise ratio. Such an increased &Dgr;R/R response also offers the possibility of decreasing an area of the tunnel barrier layer and/or increasing a thickness of the tunnel barrier layer. Decreasing the area of the tunnel barrier layer can afford improvements in resolution of devices such as MR sensors and increased density of devices such as of MRAM cells. Increasing the thickness of the tunnel barrier can afford improvements in manufacturing such as increased yield.

Abstract: A test structure for evaluating plasma damage in thin gate oxides is formed with a single polysilicon floating gate EEPROM device on which an antenna structure delivers charge to a floating gate through a tunnel oxide. The floating gate extends beyond the MOSFET channel in one direction, passing over field oxide and terminating in a pad over a thin tunnel oxide window formed over an isolated n+ diffusion. The n+ diffusion is connected to a metal antenna structure which is exposed to a processing plasma. Charge accumulated on the antenna during plasma exposure causes a tunnel current to flow through the tunnel oxide, and charge to accumulate on the floating gate. A second extension of the polysilicon floating gate passes over a second field oxide region and terminates in a pad over a thicker oxide formed on a second isolated n+ diffusion. The second n+ diffusion forms the control gate of the EEPROM and is connected by wiring to a probe pad.