Boiling (evaporative) Liquid Patents (Class 257/715)
  • Patent number: 10423735
    Abstract: Techniques that facilitate hybrid modeling for a device under test associated with a cooling system (e.g., a two-phase cooling system) are provided. In one example, information indicative of a first model of a device under test associated with a cooling system is determined. Second information indicative of constraints that define values for an operational quantity related to the cooling system is also determined. Information indicative of a second model for the device under test is generated based on the information indicative of the first model and the second information indicative of the one or more constraints. In an aspect, a first simulation process is performed to determine first thermal properties for a first simulation domain associated with the device under test. In another aspect, a second simulation process is performed to determine second thermal properties for a second simulation domain associated with the device under test.
    Type: Grant
    Filed: June 29, 2016
    Date of Patent: September 24, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Timothy Joseph Chainer, Pritish Ranjan Parida
  • Patent number: 10403560
    Abstract: Particular embodiments described herein provide for a thermal cooling system that is part of a device that includes a hole-in-motherboard configuration. The device can include a substrate, one or more dies on a top portion of the substrate, one or more printed circuit boards below the substrate, where the printed circuit boards are coupled to the substrate with solder balls, and one or more land side capacitors below the substrate. A thermal conducting plate, phase change material, and one or more sponge walls to help insulate the solder balls from the thermal conductive layer can be located in the hole of the hole-in-motherboard configuration and help transfer heat and thermal energy away from the device.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: September 3, 2019
    Assignee: Intel Corporation
    Inventors: Bijendra Singh, Sachin Bedare
  • Patent number: 10314214
    Abstract: A vapor chamber with electromagnetic shielding function is for dissipating the heat generated by an electronic component. The vapor chamber includes a capillary structure, a support structure, and a working fluid. The vapor chamber includes an extension portion and a frame, and the extension portion extends from the main body of the vapor chamber and has a first coupling structure. The frame has side walls to surround the electronic component in a plane, and a second coupling structure is disposed on each of the side walls. The first coupling structure is engaged with the second coupling structure, so that the vapor chamber detachably covers the electronic component to perform the electromagnetic shielding function.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: June 4, 2019
    Assignee: GETAC TECHNOLOGY CORPORATION
    Inventor: Ping-Wei Lee
  • Patent number: 10045464
    Abstract: The present invention provides a heat dissipation device including a baseplate, one or more heat pipes in thermal communication with the baseplate, where the one or more heat pipes has one or more internal cavities, one or more vapor chambers coupled to the one or more heat pipes, where the one or more vapor chambers has one or more internal cavities, where the one or more internal cavities of the one or more heat pipes and the one or more internal cavities of the one or more the vapor chambers are contiguous, where the one or more vapor chambers extends from the one or more heat pipes, and heat conducting fins coupled to the one or more vapor chambers, where the one or more heat conducting fins extends from the one or more vapor chambers.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: August 7, 2018
    Assignee: International Business Machines Corporation
    Inventors: Xiaojin Wei, Allan C. VanDeventer
  • Patent number: 9716299
    Abstract: Thermal interface materials and methods of manufacturing the same are disclosed. The thermal interface material can include a matrix and a filler. The filler can include graphene and multilayer graphene disposed within the matrix. Alternatively, the thermal interface material can also include a matrix, a metallic filler, and a graphene filler.
    Type: Grant
    Filed: October 24, 2013
    Date of Patent: July 25, 2017
    Assignee: The Regents of the University of California
    Inventor: Alexander A. Balandin
  • Patent number: 9013877
    Abstract: The purpose of the present invention is to provide a power semiconductor device which has a light weight, high heat dissipation efficiency, and high rigidity. The power semiconductor device including a base 1, semiconductor circuits 2 which are arranged on the base 1, and a cooling fin 3 which cools each of the semiconductor circuits 2, in which one or more protruding portions 1a, 1b are formed on the base 1, widths of the protruding portions 1a, 1b in a direction parallel to the base 1 surface being longer than a thickness of the base 1, thereby providing power semiconductor devices 100, 200, 300, 400 which have a light weight, high heat dissipation efficiency, and high rigidity.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: April 21, 2015
    Assignee: Hitachi Power Semiconductor Device, Ltd.
    Inventors: Yu Harubeppu, Takayuki Kushima, Yasuhiro Nemoto, Keisuke Horiuchi, Hisashi Tanie
  • Patent number: 9001513
    Abstract: A semiconductor switch insulation protection device and a power supply assembly. Said semiconductor switch protection device comprises a semiconductor switch having a metal component, an insulation component, and a pin installed at a bottom plane of said insulation component, and an insulation protection cover having a body with a second hole and a side belt. A front surface of said metal component is installed on a back surface of said insulation component. A metal portion, with a first hole and having a first height, is extended above an upper plane of said insulation component. Said second hole and said side belt are extended toward a back surface of said body, respectively, to form a hole column having a second height and a sidewall having a third height. Said metal portion is disposed in a groove formed by said back surface of said body, hole column and sidewall.
    Type: Grant
    Filed: August 14, 2012
    Date of Patent: April 7, 2015
    Assignee: Delta Electronics (Shanghai) Co., Ltd.
    Inventors: Lifeng Pan, Hongming Li
  • Patent number: 8987893
    Abstract: Embodiments of the present disclosure provide an apparatus that comprises a connection circuit situated within a substrate and configured to communicatively couple a first integrated circuit disposed adjacent to a top surface of the apparatus to a second integrated circuit disposed adjacent to a bottom surface of the apparatus. The apparatus further comprises one or more enclosed heat dissipation structures situated within the substrate and configured to convey heat away from the first and second integrated circuits.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: March 24, 2015
    Assignee: Marvell International Ltd.
    Inventors: Sehat Sutardja, Albert Wu
  • Patent number: 8957517
    Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.
    Type: Grant
    Filed: September 12, 2013
    Date of Patent: February 17, 2015
    Assignee: DENSO CORPORATION
    Inventors: Kuniaki Mamitsu, Takahisa Kaneko, Masaya Tonomoto, Masayoshi Nishihata, Hiroyuki Wado, Chikage Noritake, Eiji Nomura, Toshiki Itoh
  • Patent number: 8953320
    Abstract: Cooling apparatus and methods are provided for partial immersion-cooling of multiple electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a compartment about the components, and a fluid disposed within the compartment. First and second electronic components are at least partially non-immersed within the fluid, with the first component being a different type of electronic component with different configuration than the second component. A vapor condenser is provided with a vapor-condensing surface disposed within the compartment for condensing fluid vapor, and a condensate redirect structure is disposed within the compartment between the vapor condenser and the first and second components. The redirect structure is differently configured over the first electronic component compared with over the second electronic component, and provides a different pattern of condensate drip over the first component compared with over the second component.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: February 10, 2015
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt, Robert E. Simons
  • Patent number: 8953317
    Abstract: Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid. A vapor-condenser and one or more wicking components are also provided. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the wicking component(s) is disposed within the fluid-tight compartment in physical contact with at least a portion of one or more thermally conductive condenser fins of the thermally conductive condenser fins extending within the compartment.
    Type: Grant
    Filed: October 26, 2011
    Date of Patent: February 10, 2015
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons
  • Patent number: 8953319
    Abstract: A heat-dissipating module applied to a circuit board having an electronic element is disclosed. The heat-dissipating module includes a plurality of connecting portions, a contacting portion and a folded portion. The heat-dissipating module is connected to the circuit board by the connecting portions, and a first surface of the contacting portion contacts the electronic element. The folded portion is connected to the contacting portion. The heat-dissipating module is suitable for a thin and light electronic device and has firm structure.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: February 10, 2015
    Assignee: Asustek Computer Inc.
    Inventor: Cheng-Yu Wang
  • Patent number: 8944150
    Abstract: A heat dissipating device includes a chamber with an evaporation portion and a condensation portion, the chamber including a refrigerant. The chamber further includes an evaporation portion scraping brush provided corresponding to the evaporation portion, the evaporation portion scraping brush being able to sweep relative to an inner surface of the evaporation portion. A refrigerant liquid film is formed on the inner surface of the evaporation portion. Since the fluid refrigerant is uniformly applied to an inner surface of the evaporation portion to form a liquid film, the heat dissipating ability of the heat pipe heat dissipating device is improved, and the heat dissipating uniformity of the heat pipe heat dissipating device is enhanced. A heat dissipating method is also provided.
    Type: Grant
    Filed: August 4, 2009
    Date of Patent: February 3, 2015
    Assignee: Empire Technology Development LLC
    Inventor: Hao Wang
  • Patent number: 8946882
    Abstract: A semiconductor module includes at least one intermediate plate which has heat conductivity, power semiconductor elements which are provided for respective main surfaces of the intermediate plate, heat sinks which are arranged so that the power semiconductor elements are held between the heat sinks and the intermediate plate, and a mold part which seals the intermediate plate, the power semiconductor elements, and the heat sinks with mold resin. Surfaces of the heat sinks opposite to the side of the power semiconductor elements are exposed from the mold part. The intermediate plate has an intermediate radiator which projects in the direction parallel to the main surface from the mold part.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: February 3, 2015
    Assignee: Denso Corporation
    Inventors: Chikage Kato, Yoshiyuki Yamauchi
  • Patent number: 8937383
    Abstract: The semiconductor package as well as a method for making it and using it is disclosed. The semiconductor package comprises a semiconductor chip having at least one heat-generating semiconductor device and a volumetrically expandable chamber disposed to sealingly surround the semiconductor chip, the volumetrically expandable chamber filled entirely with a non-electrically conductive liquid in contact with the semiconductor device and circulated within the volumetrically expandable chamber at least in part by the generated heat of the at least one semiconductor device to cool the at least one semiconductor device.
    Type: Grant
    Filed: October 23, 2013
    Date of Patent: January 20, 2015
    Assignee: The Boeing Company
    Inventors: Andrew G. Laquer, Ernest E. Bunch
  • Patent number: 8934250
    Abstract: Cooling apparatuses and methods are provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The cooling apparatus includes a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board.
    Type: Grant
    Filed: September 26, 2012
    Date of Patent: January 13, 2015
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt, Robert E. Simons
  • Patent number: 8933557
    Abstract: A semiconductor module including a cooling unit by which a fine cooling effect is obtained is provided. A plurality of cooling flow paths (21c) which communicate with both of a refrigerant introduction flow path which extends from a refrigerant introduction inlet and a refrigerant discharge flow path which extends to a refrigerant discharge outlet are arranged in parallel with one another in a cooling unit (20). Fins (22) are arranged in each cooling flow path (21c). Semiconductor elements (32) and (33) are arranged over the cooling unit (20) so that the semiconductor elements (32) and (33) are thermally connected to the fins (22). By doing so, a semiconductor module (10) is formed. Heat generated by the semiconductor elements (32) and (33) is conducted to the fins (22) arranged in each cooling flow path (21c) and is removed by a refrigerant which flows along each cooling flow path (21c).
    Type: Grant
    Filed: July 28, 2010
    Date of Patent: January 13, 2015
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Hiromichi Gohara, Akira Morozumi, Keiichi Higuchi
  • Patent number: 8929080
    Abstract: A method is provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The method includes providing a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: January 6, 2015
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt, Robert E. Simons
  • Patent number: 8921702
    Abstract: In one possible implementation, a thermal plane structure includes a non-wicking structural microtruss between opposing surfaces of a multilayer structure and a thermal transport medium within the thermal plane structure for fluid and vapor transport between a thermal source and a thermal sink. A microtruss wick is located between the opposing surfaces and extends between the thermal source and the thermal sink.
    Type: Grant
    Filed: January 21, 2010
    Date of Patent: December 30, 2014
    Assignee: HRL Laboratories, LLC
    Inventors: William B. Carter, Peter D. Brewer, Adam F. Gross, Jeffrey L. Rogers, Keith V. Guinn, Alan J. Jacobsen
  • Patent number: 8917507
    Abstract: A cooling device is provided. The cooling device is equipped with an electronic substrate on which a heating element has been mounted, and comprises a thermal diffusion unit of a plate-like shape. A front surface of the thermal diffusion unit thermally contacts a first circuit mounting surface of the electronic substrate. A rear face of the thermal diffusion unit thermally contacts a second circuit mounting surface of the electronic substrate. And, the thermal diffusion unit diffuses heat from the heating element according to vaporization and condensation principles of a refrigerant sealed therein.
    Type: Grant
    Filed: April 16, 2010
    Date of Patent: December 23, 2014
    Assignee: Molex Incorporated
    Inventor: Hideo Nagasawa
  • Patent number: 8902581
    Abstract: A notebook computer is provided with: a casing in which electronic components including a CPU are accommodated; and a heat-dissipating unit including a heat-dissipating component 37 having plural fins, and a fan 31 for supplying air to the heat-dissipating component 37. A communicating path 35 is formed between an air outlet 32b of the fan 31 and a surface 37b of the heat-dissipating component 37 on a side thereof that opposes the fan 31, so as to communicate them. An opening 32c is formed in a fan case 32 between the air outlet 32b and a main unit 33 of the fan. A duct 36 is provided so as to communicate the opening 32c with the heat-dissipating component 37. With this structure, an electronic device can be provided which has a built-in heat-dissipating unit that can restrain increase in cost and weight, and remove dust on the heat-dissipating component.
    Type: Grant
    Filed: July 24, 2012
    Date of Patent: December 2, 2014
    Assignee: Panasonic Corporation
    Inventors: Shinji Goto, Kazuhiro Shiraga, Naoyuki Ito
  • Patent number: 8884426
    Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.
    Type: Grant
    Filed: March 20, 2014
    Date of Patent: November 11, 2014
    Assignee: DENSO CORPORATION
    Inventors: Kuniaki Mamitsu, Takahisa Kaneko, Masaya Tonomoto, Masayoshi Nishihata, Hiroyuki Wado, Chikage Noritake, Eiji Nomura, Toshiki Itoh
  • Patent number: 8879261
    Abstract: A heat-dissipating device for an electronic apparatus can include: a thermal base coupled to a first electronic component in such a manner that enables heat-transfer therebetween so that heat generated by the first electronic component mounted on a substrate is absorbed thereby; and a vibrating capillary-shaped heat-pipe loop comprising a first heat-absorption portion coupled with the thermal base in such a manner that enables heat-transfer therebetween and a heat-dissipating portion configured to dissipate heat absorbed by the first heat-absorption portion, the heat-pipe loop having working fluid injected thereinto. The heat-pipe loop can be radially disposed with a central area thereof hollowed out, and an assembly area of a coupling member can be exposed in the central area so that the coupling member for coupling the thermal base to the substrate is coupled through the central area.
    Type: Grant
    Filed: October 25, 2012
    Date of Patent: November 4, 2014
    Assignee: Icepipe Corporation
    Inventor: Sang-Cheol Lee
  • Patent number: 8879260
    Abstract: The memory module comprises a circuit board with a first and a second side, wherein memory chips are arranged at least on the first side. A longitudinally extending module heat conductor is arranged on the first side. The module heat conductor comprises a contact surface configured to contact a heat transfer system.
    Type: Grant
    Filed: August 7, 2012
    Date of Patent: November 4, 2014
    Assignee: Qimonda AG
    Inventors: Sven Kalms, Christian Weiss
  • Patent number: 8879259
    Abstract: A cooling system for an onboard electrical power converter in which a heat dissipation surface extends parallel to a flow of cooling air draft includes: a coolant tank containing coolant that includes a bottom surface being in thermal contact with the heat dissipation surface; a first conduit provided connecting to an upper surface of the coolant tank, the coolant flowing into the first conduit; a heat exchanger that comprises second conduits arranged with opposing the upper surface, and conducts the coolant to upstream; and a return unit that returns the coolant to the coolant tank; wherein the heat exchanger comprises heat dissipation fins through which the cooling air draft passes from a first to a second side, the heat dissipation fins being provided on surfaces of the second conduits, the first side not facing the coolant tank and the second side facing the coolant tank.
    Type: Grant
    Filed: August 19, 2011
    Date of Patent: November 4, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Osamu Suzuki, Yosuke Yasuda, Keisuke Horiuchi, Tomoo Hayashi, Atsuo Nishihara, Sunao Funakoshi
  • Patent number: 8873237
    Abstract: One embodiment of a system for cooling a heat-generating device includes a base adapted to be coupled to the heat-generating device, a housing coupled to the base, a liquid channel formed between the base and the housing, where a heat transfer liquid may be circulated through the liquid channel to remove heat generated by the heat-generated device, and a heat pipe disposed within the liquid channel, where the heat pipe increases the heat transfer surface area to which the heat transfer liquid is exposed. Among other things, the heat pipe advantageously increases the heat transfer surface area to which the heat transfer liquid is exposed and efficiently spreads the heat generated by the heat-generating device over that heat transfer surface area. The result is enhanced heat transfer through the liquid channel relative to prior art cooling systems.
    Type: Grant
    Filed: September 11, 2008
    Date of Patent: October 28, 2014
    Assignee: NVIDIA Corporation
    Inventor: Zoran Stefanoski
  • Patent number: 8837139
    Abstract: A flat radiator with flat type heat pipe and its application for portable computers is provided. The heat pipe in a radiator use tubular type and plate type structures. An air convective extended heat exchange surface surrounds and is over against the fan impeller, such that the radiator is extremely compacted, and the heat transport distance in heat pipe is shortened. Further introducing enhanced convective heat transfer structure and setting the fins according to the aerodynamics improve the heat dissipating capacity. The restrictions to a radiator when installing are reduced, which helps to implement the standardization of the radiator series. Also portable computers using the radiator are provided.
    Type: Grant
    Filed: July 28, 2008
    Date of Patent: September 16, 2014
    Inventor: Biao Qin
  • Patent number: 8836092
    Abstract: A lead frame for assembling a semiconductor device has a die pad surrounded by lead fingers. Each of the lead fingers has a proximal end close to but spaced from an edge of the die pad and a distal end farther from the die pad. A semiconductor die is attached to a surface of the die pad. The die has die bonding pads on its upper surface that are electrically connected to the proximal ends of the lead fingers with bond wires. An encapsulation material covers the bond wires, semiconductor die and the proximal ends of the lead fingers. Prior to assembly, hot spots of the die are determined and the lead fingers closest to the hot spots are selected to project closer to the die than the other lead fingers. These longer lead fingers assist in dissipating the heat at the die hot spot.
    Type: Grant
    Filed: October 29, 2012
    Date of Patent: September 16, 2014
    Assignee: FreeScale Semiconductor, Inc.
    Inventors: Chetan Verma, Piyush Kumar Mishra, Cheong Chiang Ng
  • Publication number: 20140252590
    Abstract: A semiconductor module cooler for supplying a refrigerant from exterior into a water jacket and cooling a semiconductor device disposed on an outer surface of the cooler, includes a heat sink thermally connected to the semiconductor device; a first flow path extending from a refrigerant inlet and arranged with a guide portion having an inclined surface for guiding the refrigerant toward one side surface of the heat sink; a second flow path extending toward a refrigerant outlet and formed with a sidewall parallel to the other side surface of the heat sink; a flow velocity adjustment plate disposed in the second flow path and formed parallel to the other side surface of the heat sink at a distance therefrom; and a third flow path formed at a position communicating the first flow path and the second flow path. The heat sink is disposed in the third flow path.
    Type: Application
    Filed: September 5, 2012
    Publication date: September 11, 2014
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Hiromichi Gohara, Akira Morozumi, Takeshi Ichimura
  • Patent number: 8829669
    Abstract: A semiconductor device configured to enable efficient cooling of an element and downsizing of the device. The semiconductor device including an element unit connected to a surface of a cooler. A support member that has a condenser housing chamber that houses the condenser. The condenser has two parallel planar surfaces that are parallel with each other. The condenser housing chamber has a parallel opposing surface that is arranged in parallel with the element unit arrangement surface and faces the element unit arrangement surface, and houses the condenser in a state where the two parallel planar surfaces are arranged in parallel with the parallel opposing surface. The support member is fixed to the cooler in a state where the parallel opposing surface presses the element unit toward the cooler.
    Type: Grant
    Filed: December 21, 2011
    Date of Patent: September 9, 2014
    Assignees: Aisin Aw Co., Ltd., Toyota Jidosha Kabushiki Kaisha
    Inventors: Yutaka Hotta, Tatsuyuki Uechi
  • Publication number: 20140239487
    Abstract: The present invention is an improvement in a molded semiconductor package and the method for its manufacture. The package comprises a substrate, a semiconductor die mounted on the substrate, a molding compound encircling the die on the substrate, a lid on the molding compound, and a heat pipe extending between the semiconductor die and the lid. Preferably, the heat pipe is formed so that it encircles the die. The package is assembled by mounting the die on the substrate, applying the molding compound to the substrate while a channel is formed in the molding compound adjacent the semiconductor die, inserting a heat pipe material in the channel, and mounting the lid on the molding compound and the heat pipe material.
    Type: Application
    Filed: February 28, 2013
    Publication date: August 28, 2014
    Applicant: Altera Corporation
    Inventor: Altera Corporation
  • Patent number: 8806749
    Abstract: Cooling apparatuses, cooled electronic modules and methods of fabrication are provided for fluid immersion-cooling of an electronic component(s). The method includes, for instance: securing a housing about an electronic component to be cooled, the housing at least partially surrounding and forming a compartment about the electronic component to be cooled; disposing a fluid within the compartment, wherein the electronic component to be cooled is at least partially immersed within the fluid, and wherein the fluid comprises water; and providing a deionizing structure within the compartment, the deionizing structure comprising deionizing material, the deionizing material ensuring deionization of the fluid within the compartment, wherein the deionizing structure is configured to accommodate boiling of the fluid within the compartment.
    Type: Grant
    Filed: November 26, 2012
    Date of Patent: August 19, 2014
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Madhusudan K. Iyengar, Robert E. Simons, Prabjit Singh
  • Patent number: 8780560
    Abstract: There is provided a loop heat pipe which includes an evaporator that internally includes at least one wick built, a condenser, a liquid pipe and a vapor pipe that connect the evaporator and the condenser to each other, and a heat dispersion cavity that is formed inside the evaporator, and disperses a vapor, wherein the wick includes, a first wick that is porous, a second wick that is porous, the second wick being inserted into the first wick from the liquid pipe side and including a pore size larger than the first wick, and a vapor channel that is defined between the first wick and the second wick. The vapor channel is connected at an end on the liquid pipe side to the heat dispersion cavity.
    Type: Grant
    Filed: August 6, 2012
    Date of Patent: July 15, 2014
    Assignee: Fujitsu Limited
    Inventors: Susumu Ogata, Hiroki Uchida, Seiji Hibino, Takeshi Shioga, Takahiro Kimura
  • Patent number: 8756810
    Abstract: A board-shaped heat dissipating device includes a board body having a plane face with a recess formed thereon, a heat conducting element fitted in the recess, at least one groove formed on any one of the board body and the heat conducting element, and at least one heat pipe pressed into the groove to flush with an open side of the groove. After the heat pipe is pressed into the groove and the heat conducting element is firmly fitted in the recess, portions of the heat conducting element that are higher than the plane face are removed through a cut operation, so that the heat conducting element is flush with the plane face of the board body to reduce the space occupied by the heat dissipating device. With the above arrangements, the problem of thermal resistance can be avoided and upgraded overall heat dissipation efficiency can be achieved.
    Type: Grant
    Filed: January 20, 2012
    Date of Patent: June 24, 2014
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Ping Chen, Shu-Chun Yu
  • Patent number: 8755186
    Abstract: An economical heat pipe type cooling device with high performance and stable start at low environmental temperatures below 0° C., and a railcar control equipment using the invented heat pipe type cooling device are provided. The midsection between two bents formed on a heat pipe is used as an evaporator; lengths of two distal sections to be used as the condenser sections are intentionally differentiated each from the other; and the condenser section of greater length is provided with heat radiating fins more than those on the condenser section of shorter length. This configuration permits each of two condenser sections to be provided with mutually different condensing capacity and accordingly the condenser section of shorter length works to cool heat-generating elements even though the condenser section of greater length would suffer from freezing problem at low temperatures. A sufficient cooling effect is rendered at ordinary temperature.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: June 17, 2014
    Assignee: Hitachi Power Solutions Co., Ltd.
    Inventors: Hironori Kitajima, Hitoshi Sakayori, Yuuzou Shiraishi
  • Patent number: 8749053
    Abstract: A method of ion implantation comprising: providing a plasma within a plasma region of a chamber; positively biasing a first grid plate, wherein the first grid plate comprises a plurality of apertures; negatively biasing a second grid plate, wherein the second grid plate comprises a plurality of apertures; flowing ions from the plasma in the plasma region through the apertures in the positively-biased first grid plate; flowing at least a portion of the ions that flowed through the apertures in the positively-biased first grid plate through the apertures in the negatively-biased second grid plate; and implanting a substrate with at least a portion of the ions that flowed through the apertures in the negatively-biased second grid plate.
    Type: Grant
    Filed: June 22, 2010
    Date of Patent: June 10, 2014
    Assignee: Intevac, Inc.
    Inventors: Babak Adibi, Moon Chun
  • Patent number: 8739405
    Abstract: An evaporator for a looped heat pipe (LHP) system, in which a working fluid circulates to cool heat generating electronic components that generate heat during operation, the evaporator including: a body comprising an inlet through which the working fluid enters and an outlet through which the working fluid is discharged; a sintered wick that is included in the body, wherein the sintered wick is formed by sintering a metal powder, and a plurality of pores are formed in the sintered wick; and an additional layer that is formed on a vaporization surface of the sintered wick where evaporation of the working fluid occurs, wherein a plurality of through holes are formed in the additional layer such that the working fluid changed into a vapor state passes through the additional layer after passing the sintered wick.
    Type: Grant
    Filed: November 23, 2011
    Date of Patent: June 3, 2014
    Assignee: Zalman Tech Co., Ltd.
    Inventors: Jee Hoon Choi, Jung Hyun Yoo, Byung Ho Sung, Yun Keun Lee, Min Whan Seo
  • Patent number: 8684564
    Abstract: The present invention relates to an LED illumination apparatus. The apparatus includes a body having a lower portion adapted for coupling to a power socket and an upper portion provided with a power source module accommodating chamber. A heat-dissipating module includes a funnel-shaped hollow case disposed at a top end of the upper portion and filled with a coolant fluid, wherein the hollow case has a small diameter open end adjacent to the body and a large diameter open end remote from the body. A light source module includes amounting substrate disposed at the small diameter open end, an LED mounted on the mounting substrate, and a power source module disposed within the power source module accommodating chamber in a manner electrically connected to and supplying working power to the LED.
    Type: Grant
    Filed: September 27, 2010
    Date of Patent: April 1, 2014
    Inventors: Yu-Nung Shen, Tsung-Chi Wang
  • Patent number: 8644020
    Abstract: A server rack sub-assembly includes at least one motherboard having a perimeter; a plurality of heat-generating electronic devices mounted on the motherboard in an area of the motherboard thermally decoupled from the motherboard perimeter; one or more brackets including heat transfer surfaces and attached to the motherboard along at least a portion of the motherboard perimeter; and a heat transfer device thermally coupled to the area of the motherboard that is thermally decoupled from the motherboard perimeter and the one or more brackets. The one or more brackets are adapted to receive a cooling airflow circulated over the bracket and to convectively transfer heat into the cooling airflow and are further adapted to couple the motherboard to a server rack assembly. The heat transfer device is arranged to conductively transfer heat from the one or more electronic devices to the brackets.
    Type: Grant
    Filed: December 1, 2010
    Date of Patent: February 4, 2014
    Assignee: Google Inc.
    Inventors: Michael Lau, Richard C. Bruns, Melanie Beauchemin
  • Patent number: 8623705
    Abstract: The formation of electronic assemblies is described. In one embodiment, an electronic assembly includes a semiconductor die and a plurality of spaced apart nanotube structures on the semiconductor die. The electronic assembly also includes a fluid positioned between the spaced apart nanotube structures on the semiconductor die. The electronic assembly also includes a endcap covering the plurality of nanotube structures and the fluid, wherein the endcap is positioned to define a gap between the nanotube structures and an interior surface of the endcap. The endcap is also positioned to form a closed chamber including the working fluid, the nanotube structures, and the gap between the nanotube structures and the interior surface of the endcap.
    Type: Grant
    Filed: March 10, 2011
    Date of Patent: January 7, 2014
    Assignee: Intel Corporation
    Inventors: Unnikrishnan Vadakkanmaruveedu, Gregory Martin Chrysler, James G. Maveety
  • Patent number: 8593805
    Abstract: A thermal module includes a centrifugal fan and a circuit board. The circuit board defines a through hole therein. The centrifugal fan includes a top plate located above the circuit board and aligned with the through hole, a first sidewall extending from a circumferential edge of the top plate toward the circuit board, a bottom plate located below the circuit board and aligned with the through hole, a second sidewall extending from a circumferential edge of the bottom plate toward the circuit board, and an impeller. The first sidewall abuts a top surface of the circuit board around the through hole. The second sidewall abuts a bottom surface of the circuit board around the through hole. The impeller is smaller than the through hole. The impeller extends through to be located in the through hole.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: November 26, 2013
    Assignee: Foxconn Technology Co., Ltd.
    Inventor: Rung-An Chen
  • Patent number: 8592971
    Abstract: The semiconductor package as well as a method for making it and using it is disclosed. The semiconductor package comprises a semiconductor chip having at least one heat-generating semiconductor device and a volumetrically expandable chamber disposed to sealingly surround the semiconductor chip, the volumetrically expandable chamber filled entirely with a non-electrically conductive liquid in contact with the semiconductor device and circulated within the volumetrically expandable chamber at least in part by the generated heat of the at least one semiconductor device to cool the at least one semiconductor device.
    Type: Grant
    Filed: December 15, 2009
    Date of Patent: November 26, 2013
    Assignee: The Boeing Company
    Inventors: Andrew G. Laquer, Ernest E. Bunch
  • Patent number: 8564952
    Abstract: A heat sink, and cooled electronic structure and cooled electronic apparatus utilizing the heat sink, are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels and one or more vapor-condensing channels. A membrane is disposed between the coolant-carrying channel(s) and the vapor-condensing channel(s). The membrane includes at least one vapor-permeable region, at least a portion of which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s) to the vapor-condensing channel(s). The heat sink further includes one or more coolant inlets coupled to provide a first liquid coolant flow to the coolant-carrying channel(s), and a second liquid coolant flow to condense vapor within the vapor-condensing channel(s).
    Type: Grant
    Filed: July 25, 2011
    Date of Patent: October 22, 2013
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madusudan K. Iyengar, Robert E. Simons
  • Patent number: 8563365
    Abstract: An exemplary embodiment of the present invention provides a chip for use in fabricating a three-dimensional integrated circuit, the chip comprising a wafer, one or more metallic-filled, electrical vias, and one or more hollow, fluidic vias. The wafer can comprise a first surface and a second surface. The one or more metallic-filled, electrical vias can extend through the wafer. Each electrical via can be in electrical communication with an electrical interconnect proximate the first surface, providing electrical communication between chips in the integrated circuit. The one or more hollow, fluidic vias can extend through the wafer. Each fluidic via can be in fluid communication with a fluidic interconnect, providing fluid communication between adjacent chips in the integrated circuit. Each fluidic interconnect can comprise a first end proximate the first surface, a second end, and a cap proximate the second end, defining an air-filled space within the fluidic interconnect.
    Type: Grant
    Filed: March 9, 2012
    Date of Patent: October 22, 2013
    Assignee: Georgia Tech Research Corporation
    Inventors: Calvin Richard King, Jr., Jesal Zevari, James D. Meindl, Muhannad S. Bakir
  • Patent number: 8558375
    Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.
    Type: Grant
    Filed: June 28, 2011
    Date of Patent: October 15, 2013
    Assignee: DENSO CORPORATION
    Inventors: Kuniaki Mamitsu, Takahisa Kaneko, Masaya Tonomoto, Masayoshi Nishihata, Hiroyuki Wado, Chikage Noritake, Eiji Nomura, Toshiki Itoh
  • Patent number: 8546930
    Abstract: Three dimensional integrated circuits with double sided power, coolant, and data features and methods of constructing same are provided. According to some embodiments, an integrated circuit package can generally comprise one or more semiconductor wafers and opposing end substrates. The semiconductor wafers can each have a top exterior surface and a bottom exterior surface. The plurality of semiconductor wafers can form a multi-dimensional wafer stack of die wafers such that adjacent wafers have facing surfaces. Each of the semiconductor wafers can comprise one or more channels formed through the wafers. A portion of the channels can extend generally between the top and bottom exterior surfaces of the semiconductor wafers. A portion of the channels can carry conductors for coupling the wafers and/or coolant for cooling the wafers. The opposing end substrates can be disposed proximate opposing ends of the multi-dimensional stack.
    Type: Grant
    Filed: January 26, 2010
    Date of Patent: October 1, 2013
    Assignee: Georgia Tech Research Corporation
    Inventors: Muhannad S. Bakir, Gang Huang
  • Publication number: 20130241043
    Abstract: A semiconductor module includes at least one intermediate plate which has heat conductivity, power semiconductor elements which are provided for respective main surfaces of the intermediate plate, heat sinks which are arranged so that the power semiconductor elements are held between the heat sinks and the intermediate plate, and a mold part which seals the intermediate plate, the power semiconductor elements, and the heat sinks with mold resin. Surfaces of the heat sinks opposite to the side of the power semiconductor elements are exposed from the mold part. The intermediate plate has an intermediate radiator which projects in the direction parallel to the main surface from the mold part.
    Type: Application
    Filed: March 13, 2013
    Publication date: September 19, 2013
    Applicant: DENSO CORPORATION
    Inventors: Chikage KATO, Yoshiyuki YAMAUCHI
  • Patent number: 8498841
    Abstract: Methods and apparatus are provided for use with thermal electric cooling devices (TECDs). An apparatus is mapped so as to identify the heat dissipating entities and zones thereof. A first cooling plan is devised in accordance with the mapping, the cooling plan being dependant upon TECDs. At least one other cooling plan is devised that is distinct from the first cooling plan. The coefficient of performance (COP) for each of the cooling plans is calculated. One of the cooling plans is selected and implemented in accordance with a comparison of the COPs. Precision, zone-oriented cooling is provided, avoiding excessive material scale and wasted energy.
    Type: Grant
    Filed: April 21, 2010
    Date of Patent: July 30, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Amip Shah, Chandrakant Patel
  • Patent number: 8488323
    Abstract: An electronic device has a ventilation system with an inlet section that receives inlet air that travels past components of the computing device to be cooled and exits at an outlet section. The air carries heat away from the components. A liquid heat transfer system captures heat generated by the components and transfers the captured heat to the inlet section of the ventilation system to warm the inlet air before it travels past the components to be cooled.
    Type: Grant
    Filed: December 3, 2010
    Date of Patent: July 16, 2013
    Assignee: Microsoft Corporation
    Inventors: Eric C. Peterson, Christian L. Belady
  • Patent number: 8421235
    Abstract: The semiconductor device has a unit stack body including a plurality of units stacked on one another. Each unit includes a power terminal constituted of a lead part and a connection part. The connection part is formed with a projection and a recess. When the units are stacked on one another, the projection of one unit is fitted to the recess of the adjacent unit, so that the power terminals of the respective unit are connected to one another.
    Type: Grant
    Filed: June 30, 2011
    Date of Patent: April 16, 2013
    Assignee: Denso Corporation
    Inventors: Shigeo Ide, Akihiro Niimi