Abstract: Disclosed is a heatsink device of video graphics array (VGA) and chipset. The main characteristic is making an integrated design for heatsink devices. Using a heatsink plate stacks on VGA and chipset instead of several ones as before. The heatsink plate has more heat dissipation area than that of conventional heatsink. The device also integrates other heat generated elements stacking below the heatsink plate to dissipating more heat, so as to increase heat dissipation effect of the heatsink plate. The device makes the operation of VGA and chipset more effectively and increases their life-time.

Abstract: A method and device for cooling an integrated circuit is provided. A method and device using a gas to cool circuit structures such as a number of air bridge structures is provided. A method and device using a boiling liquid to cool circuit structures is provided. Further provided is a method of controlling chip temperature. This allows circuit and device designers an opportunity to design more efficient structures. Some properties that exhibit less variation when temperature ranges are controlled include electromigration, conductivity, operating speed, and reliability.

Abstract: A heat dissipating type printed circuit board and its structure for conducting heat with a heat pipe include a substrate, a signal circuit disposed on a surface of the substrate and electrically coupled to an electronic component, a heat dissipating layer disposed on another surface of the substrate, and at least one heat pipe, each having a heated end and a condensing end extended from the heated end. The substrate includes a through hole passing through the heat dissipating layer, and the heat dissipating layer includes an adhering layer disposed at a surface proximate to the surroundings of the heat pipe, and a distal end of the heated end of the heat pipe is covered by the adhering layer, and the adhering layer is extended from the surface of the heat dissipating layer to a corresponding position of the electronic component.

Abstract: A backlight unit is provided with LEDs having a cooling structure. The backlight according to an embodiment includes a heat pipe, which is disposed below a PCB having the LEDs thereon, and a heat sink connected with the heat pipe. In operation, heat generated from the LEDs is conducted via the PCB and the heat pipe and is radiated by the heat sink.

Abstract: A heat dissipation device for an electronic unit includes a heat sink (10), a pair of first heat pipes (20) and a pair of second heat pipes (30). The heat sink includes a base (12) for contacting with the electronic unit (42), a plate (14) spaced from the base, and a plurality of fins (16) arranged between the base and the plate. The first heat pipes are attached to the heat sink and include evaporating portions (22) sandwiched between the base and a bottom portion (162) of the fins for absorbing heat from the base, and condensing portions (24) thermally sandwiched between a top portion (164) of the fins and the plate. The second heat pipes are attached to the heat sink and sandwiched between the base and the bottom portion of the fins.

Abstract: Methods and systems for auxiliary cooling of electrical device housings are provided. In one embodiment, an electronics device enclosure system is provided. The system comprises a housing, wherein the housing encloses one or more electronic devices; a backplane situated within the housing wherein at least one of the one or more electronic devices are coupled to the backplane; and an auxiliary cooling system coupled to the backplane and adapted to receive electrical power from one or more power sources, wherein the auxiliary cooling system comprises one or both of a thermoelectric cooling module and a fan, and wherein the auxiliary cooling system is adapted to increase the heat transfer from the one or more electronic devices to an environment external to the housing.

Abstract: A heat dissipation device includes a heat dissipation body and a heat conducting body thermally combined with the heat dissipation device. The heat dissipation body includes a central portion defining a through hole therein and a plurality of fin extending from a periphery of the central portion. Each of the fins branches a plurality of portions at an end thereof. The heat conducting body includes a column thermally fitted in the through hole of the central portion of the heat dissipation body. A cavity is defined between the column and the central portion of the heat dissipation body. The cavity contains a phase-changeable medium therein, which becomes vapor once the column absorbs heat from a heat-generating electronic device.

Abstract: A two-phase cooling system operated at atmospheric pressure. A reservoir containing cooling fluid has a stack that is vented to the atmosphere. The stack is shaped to allow condensation of substantially all of the cooling fluid in vapor form entering the stack. Condensation may be enhanced by cooling the stack, such as with flowing air along the outer walls of the stack or placing a thermoelectric device in contact with the stack. The system provides high thermal capacity but is easy to use and service.

Abstract: Systems and devices are disclosed utilizing a silicon-containing barrier layer. A semiconductor device is disclosed and includes a substrate, a gate oxide, a silicon-containing barrier layer and a gate electrode. The gate oxide is formed over the substrate. The silicon-containing barrier layer is formed over the gate oxide by causing silicon atoms of a precursor layer to react with a reactive agent. The gate electrode is formed over the silicon-containing barrier layer.

Abstract: A thermal module includes a thermal body, at least one thermal tube, and a holding part. The thermal tube includes a heat receiving portion and condenser terminals connecting with the thermal body, wherein the heat receiving portion has a plane. The holding part includes a plate body with trenches therein, wherein the trenches has through holes and a connecting part formed between the through holes. The through holes are used for receiving and holding the heat receiving portion of the thermal tube. The connecting part are connected with a top surface of the heat receiving portion. Thus, thermal transfer is speed up, and the thermal module is assembled without a thermal treatment which causing a copper reduction reaction, resulting in improvement of thermal conduction, reduction of cost, and manufacturing time saving.

Abstract: A cascaded die mounting device and method using spring contacts for die attachment, with or without metallic bonds between the contacts and the dies, is disclosed. One embodiment is for the direct refrigerant cooling of an inverter/converter carrying higher power levels than most of the low power circuits previously taught, and does not require using a heat sink.

Abstract: A heat dissipation device includes a base, at least one heat pipe having an evaporating section and a condensing section, at least one reinforcing member without phase-change therein, and a plurality of fins. The evaporating section of the heat pipe contacts the base. The condensing section of the heat pipe departs from the base. The fins are stacked on the heat pipe and the reinforcing member. Therefore, the heat dissipation device has steady configuration and low cost.

Abstract: An apparatus includes a heat receiving portion which receives heat within a footprint from a heat generating structure, and a cooling arrangement which causes flow of a coolant that absorbs heat at the heat receiving portion, the cooling arrangement being disposed in its entirety within a width of the footprint in a particular direction. A different feature involves an apparatus which includes a heat receiving portion at which a coolant receives heat, and a coolant separating portion which receives coolant traveling away from the heat receiving portion, and which separates liquid coolant from vapor coolant.

Abstract: Embodiments of the present invention include an apparatus, method, and system for a thermal management arrangement having a low heat flux channel flow coupled to high heat flux channels.

Abstract: This invention provides a cooler having an excellent cooling performance, which is capable of being downsized and low-profiled, an electronic apparatus and a method for fabricating the cooler. The cooler (1) comprises lower board member (10) and upper complex board members. The lower board member (10) is made from plastic material and has a cavity portion (11) for allowing water or vapor to be circulated therein. The upper complex board members comprise board member (20) for a condenser part, upper board member (30), and board member (40) for a wick part. The board members (20) and (40) for the condenser part and the wick part, respectively, are made from metallic material having higher thermal conductivity such as copper and nickel. Each of the members has a groove for allowing them to be served as the condenser and the wick.

Abstract: There is provided a small-size electronic heat pump device which is low in power consumption and which secures a vacuum gap without use of an additional circuit. The electronic heat pump device includes an emitter 1 and a collector 2. An electrically and thermally insulative spacer section 5 for keeping a space, i.e. vacuum gap G between an emitter electrode 11 and a collector electrode 21 constant is integrally formed in a semiconductor substrate 20 of the collector 2, which makes it possible to maintain the vacuum gap to be a specified space while a back flow of heat is prevented in a simple structure with a reduced number of component parts.

Abstract: Programmed material consolidation processes for fabricating heat sinks include the selective consolidation of previously unconsolidated material. The heat dissipation element of the heat sink that has been fabricated by such processes can have non-linear or convoluted passageways therethrough to enhance air flow. An optical recognition system may be used in conjunction with programmed material consolidation processes to ensure that a heat sink is fabricated or positioned on the appropriate location of an electronic component, such as a semiconductor device.

Abstract: A stacked array of low profile heat pipes each with a plurality of micro tubes extended therethrough. The stacked low profile heat pipes are placed into thermal connection with heat producing components. A heat transfer fluid is contained in the micro tubes of the low profile heat pipes and removes the heat from the heat producing components.

Abstract: A compact, thin type and high cooling performance cooling device, an electronic apparatus and a method of manufacturing the same are provided. The cooling device (1) has a pair of a first substrate (2) and a second substrate (3) which are made of such a material having a low thermal diffusibility as glass, formed rectangular and bonded together via a silicon member (4). On bonding surfaces of these substrates (2) and (3), grooves (5) and (6) are formed. These grooves (5) and (6) are formed so as to function as a heat pipe of a loop type when these substrates (2) and (3) are bonded.

Abstract: To realize a integrally constructed cooler of the heat pipe type which ensures the achievement of sufficient cooling capacity and the realization of a simple, compact and inexpensive cooler, that is especially low in height, employing and incorporating ingeniously a heat pipe, there is provided a heat pipe type cooler comprising: a heat receiving plate 3; a heat radiator having a configuration of a plurality of horizontally oriented heat radiation plates 5 extending vertically; and a heat pipe H having a generally U or V shaped profile, the middle portion of which is secured to the heat receiving plate 3: and wherein each end of the heat pipe H passes through the heat radiation plates 5.

Abstract: A stacked array of low profile heat pipes each with a plurality of micro tubes extended therethrough. The stacked low profile heat pipes are placed into thermal connection with heat producing components. A heat transfer fluid is contained in the micro tubes of the low profile heat pipes and removes the heat from the heat producing components.

Abstract: An apparatus is provided for dissipating heat from a semiconductor device that meets dimensional requirements for the semiconductor device and provides enhanced cooling for the semiconductor device. The apparatus provides a relatively large surface area for transferring heat away from a semiconductor device, and provides for enhanced coolant flow through or around the apparatus. The apparatus includes a channel that may accommodate a heat pipe to further enhance transfer of heat away from the semiconductor device.

Abstract: A thermal dissipation apparatus for implementing chassis conducted cooling for a server. The apparatus includes a heat sink having a first surface and a second surface. The first surface is adapted to accept a chip thermal interface for a chip. The second surface is adapted to accept a chassis thermal interface for a chassis surface, wherein the second surface implements a thermal conductive path from the chip to the chassis surface.

Abstract: A heat dissipation device includes a mounting plate (21) for mounting the heat dissipation device to a circuit board (3) on which a CPU (4) and a plurality of capacitors (31) are mounted, a heat sink (20), a core (25), and a fan (1) mounted on the heat sink. The heat sink locates above the mounting plate and includes a hollow cylinder (202) and a plurality of curved fins (204) extending outwardly from the cylinder. The core includes a base (26) for contacting the CPU and a post (27) extending from the base through the mounting plate to be received in the cylinder. The mounting plate is spaced from the circuit board to allow the capacitors to locate between the mounting plate and the circuit board. The mounting plate defines a plurality of openings (23) for providing access for cooled air from the fan to the CPU and the capacitors.

Abstract: Apparatus and methods are provided for microchannel cooling of electronic devices such as IC chips, which enable efficient and low operating pressure microchannel cooling of high power density electronic devices having a non-uniform power density distribution, which are mounted face down on a package substrate. For example, integrated microchannel cooler devices (or microchannel heat sink devices) for cooling IC chips are designed to provide uniform flow and distribution of coolant fluid and minimize pressure drops along coolant flow paths, as well as provide variable localized cooling capabilities for high power density regions (or “hot spots”) of IC chips with higher than average power densities.

Abstract: Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the special and temporal characteristics of the device temperature profiles.

Abstract: An apparatus for cooling heat producing devices is disclosed. In one embodiment, the apparatus includes a heat absorber attached to a first end of a base. Both the base and the heat absorber may be formed of a thermally conductive material, and a width of the heat absorber is greater than a width of the base.

Abstract: A heat sink according to the present invention is configured to comprise: a plurality of heat dissipating fins having at least bottom portions which form a heat receiving surface thermally connected to a heat generating electronic component; and a heat-transfer connecting member for, by passing through each of said plurality of heat dissipating fins arranged in parallel, connecting said plurality of heat dissipating fins in such a manner that said bottom portions form said heat receiving surface.

Abstract: To accommodate high power densities associated with high-performance integrated circuits, an integrated circuit (IC) package includes a heat-dissipating structure in which heat is dissipated from a surface of one or more dice to a heat spreader. The heat spreader has a fluid-conducting channel formed therein, and a fluid coolant may be circulated through the channel via a micropump. In an embodiment, the channel is located at or near a surface of the heat spreader, and a heat-generating IC is in thermal contact with the heat spreader. In an embodiment, the IC is a thinned die that is coupled to the heat spreader via a thinned thermal interface material. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

Abstract: A heat sink assembly includes a block formed of a thermally conductive material. For example, the thermally conductive material includes thermally conductive polymer. A heat conduit (e.g., a heat pipe) extends through a substantial portion of the block. In one example arrangement, airflow channels extend through portions of the block.

Abstract: An evaporator having an enhanced flow channel design for use in a computer system is described. Specifically, micro-channels of the evaporator comprise nucleation sites and different channel widths. The enhanced flow channel design improves heat transfer from a computer component to a working fluid.

Abstract: The present invention relates to a radiator sheet improvement and more particularly to a structure with enhanced strength and increased heat exchange surface after assembling, which is achieved first by forming large holes and adjacent small holes on each radiator sheet, wherein a radiator tube passing through each large hole and a solder rod or tin solder inserted into each small hole, and then by using heat to melt solder to fill the space between the radiator sheet and the radiator tube, thereby enabling a firm bonding effect therebetween.

Abstract: A heat dissipating device incorporating heat pipes includes a heat sink (10), a first heat pipe (50) and a second heat pipe (70). The heat sink has a first base (11), a second base (21) and a plurality of fins sandwiched between the first and second bases. Each of the heat pipes has a heat-absorption end (51, 71) and a heat-dissipation end (52, 72). The heat-absorption ends of the first and second heat pipes contact the first base of the heat sink. The heat-dissipation end of the first heat pipe is inserted in the substantial middle portion of the fins, and the heat-dissipation end of the second heat pipe is inserted between the second base and the fins.

Abstract: An apparatus includes a heat receiving portion which receives heat within a footprint from a heat generating structure, and a cooling arrangement which causes flow of a coolant that absorbs heat at the heat receiving portion, the cooling arrangement being disposed in its entirety within a width of the footprint in a particular direction. A different feature involves an apparatus which includes a heat receiving portion at which a coolant receives heat, and a coolant separating portion which receives coolant traveling away from the heat receiving portion, and which separates liquid coolant from vapor coolant.

Abstract: A method of controlling temperature of a heat source in contact with a heat exchanging surface of a heat exchanger, wherein the heat exchanging surface is substantially aligned along a plane. The method comprises channeling a first temperature fluid to the heat exchanging surface, wherein the first temperature fluid undergoes thermal exchange with the heat source along the heat exchanging surface. The method comprises channeling a second temperature fluid from the heat exchange surface, wherein fluid is channeled to minimize temperature differences along the heat source. The temperature differences are minimized by optimizing and controlling the fluidic and thermal resistances in the heat exchanger. The resistances to the fluid are influenced by size, volume and surface area of heat transferring features, multiple pumps, fixed and variable valves and flow impedance elements in the fluid path, pressure and flow rate control of the fluid, and other factors.

Abstract: The present invention relates to an apparatus and method for dissipating heat from high-power electronic devices. The assembly includes a high-current substrate, such as a printed circuit board supporting an electronic device, a heat pipe thermally coupled with the electronic device and an assembly case which also forms a heat sink, and thermal transient suppression material which may be thermally coupled with the electronic device and the heat pipe.

Abstract: The apparatus is a heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of more highly heat conductive material for only that part of the wick in the region which contacts the heat source, so that there is superior heat conductivity in that region.

Abstract: A three-dimensional integrated circuit that provides reduced interconnect signal delay over known 2-dimensional systems. The three-dimensional integrated circuit also allows improved circuit cooling. The three-dimensional integrated circuit includes two or more electrically connected integrated circuits, separated by a cooling channel.

Abstract: A stack of heat generating integrated circuit chips may be provided with intervening cooling integrated circuit chips. The cooling integrated circuit chips may include microchannels for the flow of the cooling fluid. The cooling fluid may be pumped using the integrated electroosmotic pumps. Removal of cooling fluid gases may be accomplished using integrated re-combiners in some embodiments.

Abstract: A cooling device for a chip in a portable computer that uses a horizontal flat fan in the corner of a portable computer housing with air outlets through heatsinks that enhance exhaust air flow over heat pipes from the chip and out through the computer housing. The exhaust is through the adjacent vertical walls of the computer housing. Separate heat pipes go directly from the chip to fins located at the outlet at the wall.

Abstract: The subject invention provides a heat sink for a liquid cooled cooling assembly for removing heat generated by an electronic device. The heat sink includes a flow diverter having a hyperbolic cross section disposed on a base for absorbing a significant portion of the heat from the electronic device. An inlet tube directs an impinging flow of cooling fluid directly onto the flow diverter to remove the heat stored within the flow diverter. A spiral wall extends in an increasing spiral from the flow diverter to define a spiral channel for discharging the flow of cooling fluid. The spiral wall includes a plurality of louvers for creating turbulence in the flow of cooling fluid for maintaining a high heat transfer coefficient between the spiral wall and the cooling fluid.

Abstract: A heat dissipating device includes a heat receiving unit having a heat receiving surface thermally connected to a heat generating object and a heat dissipating surface in an opposite to the receiving surface, a heat transferring unit mounted on the dissipating surface, transferring the heat received in the heat receiving surface, and diffusing the transferred heat to the dissipating surface, and a heat dissipating unit mounted on the dissipating surface and dissipating the diffused heat. An electronic apparatus includes a circuit board having an electronic part generating heat, a main body installing the circuit board, and the heat dissipating device described above.

Abstract: The apparatus is a heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of more highly heat conductive material for only that part of the wick in the region which contacts the heat source, so that there is superior heat conductivity in that region.

Abstract: A vapor-liquid separating type heat pipe device includes a heat sink member mountable on a heat source, tubular outer and inner bodies, a heat transfer fluid, a top vapor passage, and a bottom liquid passage. The outer body has an outer peripheral wall defining an inner chamber. The inner body is disposed in the inner chamber, and has an inner peripheral wall defining thereinside an evaporating space and cooperating with the outer peripheral wall to define a condensing space therebetween. The fluid is introduced into the inner chamber. The vapor passage is provided between and is in fluid communication with the evaporating and condensing spaces. The liquid passage is provided between and is in fluid communication with the condensing space and the heat sink member. The vapor and liquid passages are located proximate to the top and bottom ends of the inner and outer bodies, respectively.

Abstract: A technique for increasing the thermal capability of a portable electronic device includes transferring dissipated heat from a heat source disposed within the portable electronic device to at least one heat exchanger via at least one respective thermal transfer device. This may be in addition to another heat exchanger connected to the heat source via another thermal transfer device. At least one external fan is disposed adjacent to the at least one heat exchanger and dissipated heat transferred from the heat source to the at least one heat exchanger is removed via a flow of air generated by the at least one external fan. This may be in addition to an internal fan disposed adjacent the another heat exchanger to dissipate heat transferred from the heat source to the anther heat exchanger via flow of air generated by the internal fan. The at least one thermal transfer device may be a heat pipe. The portable electronic device may be a notebook computer and the heat source disposed therein may be a processor.

Abstract: A substantially flat heat transferring device and a method of fabricating the same are provided. The device includes a lower plate, an upper plate, a wick plate, and a liquid-phase coolant, while the lower plate contacts a heat source at its bottom. The upper plate is hermetically coupled with the lower plate along its edge to form a void therebetween. The wick plate is provided between the upper plate and the lower plate and is maintained in position relative to the lower plate by surface tension of the liquid-phase coolant. The liquid-phase coolant transfers heat by circulating between a vaporization part, where the heat source is located, to a condensing part. Here, the wick plate includes a plurality of holes and a plurality of planar wicks and makes the liquid-phase coolant flow from the condensing part to the vaporization part by capillary force between itself and the lower plate.

Abstract: An apparatus for cooling single and multiple high-flux and ultra-high-flux heat dissipating devices, comprising a liquid coolant module having a base plate and a cover plate defining therebetween a liquid coolant chamber with a liquid coolant inlet port and a liquid coolant outlet port in fluid communication with the liquid coolant chamber; at least one heat dissipating device mounted to the liquid coolant module; a multi-level-cooling-enhancement stud mounted upon each heat dissipating device and disposed within the liquid coolant module; and apparatus for inducing phase change nucleate boiling of a subcooled liquid coolant within the liquid coolant module to enhance its cooling performance.

Abstract: A heat conductive plate includes a hollow case and a plurality of grooves respectively formed on the inner top wall and the inner bottom wall of the case. In addition, a plurality of supporting members are positioned in the case by way of powder sintering, wherein each surface of the supporting members has a porous wick structure formed thereon. Thus, the case can be sustained by the supports with each wick structure firmly mounted in the grooves of the inner walls thereof. When performing heat transferring, the working fluid is heated to be formed as vapor by the electronic element mounted on the outer bottom surface so as to flow toward the inner top surface of the case. The working fluid is then cooled to be liquid again to be absorbed by the wick structures of the supporting members and be transported toward the inner bottom of the case.

Abstract: A heat dissipating device incorporating heat pipes is disclosed. The heat dissipating device includes a base, a plurality of heat-dissipating fins and at least one heat pipe. The heat pipe includes an evaporating portion attached to the base, a middle-portion and a condensing portion extending through the fins. Bottoms of the evaporating portion of the heat pipe and the base are coplanar, and the condensing portion extends opposite to the evaporating portion.

Abstract: A liquid cooling system includes a cooling unit (100) and a coolant driving unit (200). The cooling unit includes a first cooling body (110) defining a first cavity, a second cooling body (130) defining a second cavity in communication with the first cooling body (110), and a heat sink (150) sandwiched between the first and second cooling bodies. The coolant driving unit is in flow communication with the first and second cooling bodies respectively, so that the first and second cooling bodies and the coolant driving unit together form a loop. Circulation of the coolant in the loop causes the heat generated by the heat generating component to be capable of being transferred from the first and second cooling bodies to the heat sink for dissipation.