Abstract: The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. One embodiment of a heat transfer apparatus include but not limited to, a spring-biased member comprising a first side member, a second side member, and a connecting member adapted for spring-biased removable attachment to a heat-producing device. Another embodiment of a heat transfer apparatus is a spring-biased carrier that attaches to a heat-producing device and which carries a member, such as a finned plate. Another embodiment of a heat transfer apparatus is a spring-biased member comprising fingers for conducting thermal energy to a structure. Another embodiment of a heat transfer apparatus is a spring-biased clip used to attach separate heat-spreading/dissipating members, such as a finned plate, against a heat-producing member.

Abstract: The present invention provides methods and apparatus related to preventing adhesive contamination of the electrical contacts of a semiconductor device in a stacked semiconductor device package. The methods and apparatus include providing a first semiconductor device with an adhesive flow control dam located on an upper surface thereof. The dam is positioned between electrical contacts and a substrate attach site on the upper surface of the first semiconductor device. The dam is rendered of a sufficient height and shape to block applied adhesive from flowing over the electrical contacts of the first semiconductor device when a second substrate is mounted onto the upper surface of the first semiconductor device. The semiconductor device package may be encapsulated with the dam in place or with the dam removed. The adhesive flow control dam thus protects the electrical contacts of the first semiconductor device from contamination by excess adhesive, which can result in unusable electrical contacts.

Abstract: A circuit board support assembly includes a frame, a circuit board, an electronic component and at least one attachment structure. The at least one attachment structure is non-rotatably attached to the frame. The at least one attachment structure supports the electronic component relative to the circuit board.

Abstract: Electronic equipment comprises a wiring board, an electronic component mounted on the wiring board and having a heat dissipation portion on a surface thereof, and an insulating heat dissipation plate thermally connected to the electronic component, wherein the heat dissipation portion is directly connected to the heat dissipation plate via a heat conductive bonding material that includes metal. The heat dissipation plate is a ceramic plate having at least one land for connecting the electronic component thereto, or a resin plate containing highly heat conductive material. By directly connecting the insulating heat dissipation plate to an electronic component generating heat, an insulating plate between the heat dissipation plate and the electronic component is not required.

Abstract: In order to provide an improved heat transfer interface between an solid state device and a heat sink to which it is soldered, one or more “vents” are provided in the interface between the solid state device and the heat sink to prevent the entrapment of gases that could form solder voids. Advantageously, the provision of such vents in the interface surface geometry of the semiconductor may be effected by the use of appropriate masking and etching following the epitaxial regrowth process. Alternatively, the heat sink or a solder preform may be provided with suitable notches. The use of such “die-bond vents” also allows solder, after melting, to be forced under the chip by external gas pressure such that no solder voids are left.

Abstract: A surface mount-type microelectronic component assembly which does not physically attach the microelectronic component to its carrier substrate. Electrical contact is achieved between the microelectronic component and the carrier with solder balls attached to either the microelectronic component or the carrier substrate. A force is exerted on the assembly to achieve sufficient electrical contact between the microelectronic component and the carrier substrate.

Abstract: A reusable thermal solution attachment system that provides a quick and easy method for securing and removing a thermal solution from a circuit board without the use of tape, adhesives or fasteners. In one embodiment, the system includes two plates and a set of locking pins to secure the circuit board between the plates. The resulting mechanism is easy to attach and remove during testing operations or can be permanently installed in desktop environments.

Abstract: The power semiconductor module (1) comprises a housing (5), a covering panel (11) and at least two submodules (21, 22). The submodules (21, 22) each comprise at least one semiconductor chip, which has two main electrodes which are electrically conductively connected to main connections (3, 4) of the submodules. The submodules (21, 22) are arranged alongside one another, and one of their two main surfaces is pressed against the covering panel (11) of the module. The submodules are electrically connected in series. The maximun blocking voltage of the module is doubled by connecting the submodules, which are arranged alongside one another, in series. This reduces the length and the costs of the stack for hihg-voltage switch since fewer components are required for the same blocking voltages, in particular fewer modules and cooling elements.

Abstract: A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.

Abstract: A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.

Abstract: A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.

Abstract: An anchoring mechanism and method are provided for securing a component to a printed circuit board. The anchoring mechanism may include a loop, a first leg extending from the loop, and a second leg extending from the loop. The first leg may mount through a first hole of the printed circuit board and include a compressible section to compress when inserted into the first hole and to expand after passing through the first hole. The compressible section of the first leg may support solder between the anchoring mechanism and the first hole. Likewise, the second leg may mount through a second hole of the printed circuit board and include a compressible section to compress when inserted into the second hole and to expand after passing through the second hole. The compressible section of the second leg may support solder between the anchoring mechanism and the second hole.

Abstract: A heat-sinking apparatus (62, 64, 66, and 68) containing a light-transparent pane (72) is configured in a way that enables the pane to be brought into contact with a device (40) such as a semiconductor device without significantly damaging the pane. A main spreader body (120) of a heat spreader (66) in the heat-sinking apparatus preferably consists largely of copper and is connected to the pane, preferably consisting largely of diamond, by way of a combination of metals that facilitates heat transfer from the pane to the heat spreader.

Abstract: A heat sink fastener for securing a heat sink to a CPU is described as having a holding down spring plate. The holding down spring plate has a flat bearing portion at one end, a first hook plate extended from one end of the holding down spring plate remote from the flat bearing portion, a second hook plate coupled to the flat bearing portion of the holding down spring plate, and a locking lever pivoted to the second hook plate in direction substantially perpendicular to the holding down spring plate and turnable relative to the second hook plate between a locked position and an unlocked position. The locking lever has a cam peripherally supported on the flat bearing portion of the holding down spring plate.

Abstract: In order to provide an improved heat transfer interface between an solid state device and a heat sink to which it is soldered, one or more “vents” are provided in the interface between the solid state device and the heat sink to prevent the entrapment of gases that could form solder voids. Advantageously, the provision of such vents in the interface surface geometry of the semiconductor may be effected by the use of appropriate masking and etching following the epitaxial regrowth process. Alternatively, the heat sink or a solder preform may be provided with suitable notches. The use of such “die-bond vents” also allows solder, after melting, to be forced under the chip by external gas pressure such that no solder voids are left.

Abstract: Disclosed herein is a semiconductor device in which a semiconductor chip is bonded at its pad to an electrode of a circuit substrate via a coil spring by solder-connecting both ends of the spring respectively to the pad and the electrode. There is provided a material having low solder wettability that covers at least part of the surface of the coil spring, so that the solder is prevented from being sucked into the Interior of the coil spring.

Abstract: A replaceable integrated circuit device which replaces the connecting socket, the interposer and the pins in prior art with plural solder balls on the bottom of the integrated circuit package contacting and connecting the corresponding contact pad on the circuit board for electrical conduction. The contacting surface of the solder balls and the corresponding contact pad can be made as plane or as curve as possible to increase the contacting area. More over, there are many buckling apparatus placed on the circuit board to buckle the integrated circuit package and the circuit board firmly and to provide the extra downward force to make the solder balls and the corresponding contact pad contact and connect each other tightly. In the present invention, for the solder balls contacting the contact pads of the circuit board directly, which reduce the space that a connecting socket used in prior art and improve the usage ratio of the layout on a circuit board.

Abstract: A heat sink and processor assembly that can be easily installed and uninstalled from a circuit board without tools. One preferred embodiment of the heat sink assembly comprises a heat sink component, an alignment cage attached to the base of the heat sink and having an attachment point for releasably attaching a processor. The heat sink assembly further comprises a plurality of alignment pins and alignment tabs that are affixed to the base of the heat sink and interface with a specially designed socket and circuit board so as to align the mating components. The processor chip is installed onto the heat sink and then the combined assembly is installed onto a circuit board mounted socket. The alignment mechanisms provide a method for installing a processor without using tools or having to manually align the processor pins to the socket receptacles.

Abstract: An integrated circuit attachment implementation includes a mechanism for inserting and securely holding a replaceable component to an integrated circuit. The mechanism includes a top plate, leaf springs in contact with the top plate, a leaf spring cradle that carries the leaf springs, with the cradle including upper projections that project through corresponding slots in the top plate, a pin inserted through openings in the upper projections, and a linear slide cam located on an upper surface of the top plate between the upper projections and further located below the pin. The cam operates in a first position to transfer a load the replaceable component to securely hold the replaceable component to the integrated circuit and a second position to allow placement of the replaceable component on the integrated circuit.

Abstract: A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.

Abstract: A heat dissipation assembly includes a fan (10), a mounting bracket (20), a clip (30), a heat sink (40), and a mounting frame (50). The fan is mounted to the mounting bracket. The clip is bent from an elongated thread or rod of wire or suitable wirelike material. The clip includes a central horizontal part (302), and a pair of resilient arms (304) extending perpendicularly from opposite ends of the horizontal part. A groove (402) is laterally defined through parallel fins (403) of the heat sink, and receives the horizontal part of the clip therein. The combined fan and mounting bracket is attached to the combined heat sink and clip to form a subassembly. Thus, the clip is secured in the heat sink in advance. The subassembly is received in the mounting frame. Two apertures (504) of the mounting frame respectively engagingly receive two hooks (306) of the resilient arms.

Abstract: An internally matching type transistor includes a semiconductor element and an internally matching circuit, and includes a resonant circuit for short-circuiting differential frequencies of two signals of different frequencies is employed as the internally matching circuit. Thereby, intermodulation distortion characteristics in the internally matching type transistor 1 can be improved. Therefore, complicated operations, such as adjustment by externally connecting a resonant circuit to a semiconductor device, can be eliminated, and the internally matching type transistor 1 of improved intermodulation distortion characteristics can be provided as a stand-alone part.

Abstract: A spring spacer assembly maintains thermal contact between a thermal transfer surface of a heat sink and a heat-generating electrical component mounted on a printed circuit board between the printed circuit board and the thermal transfer surface. The spring spacer assembly comprises a face defining a fixation segment and a deflectible finger extending from the fixation segment, and a fixation element for securing the face to the heat sink. A spacer extends from the fixation segment for passage through the printed circuit board into abutment with the thermal transfer surface. A protrusion extends from the finger for passage through the printed circuit board into contact with the heat-generating electrical component. The finger is biased toward the thermal transfer surface and urges the heat-generating electrical component into thermal contact with the thermal transfer surface. The fixation element secures the face to the heat sink with the spacer secured in abutment with the thermal transfer surface.

Abstract: A side-exhaust heat dissipation module for cooling an electronic device. The side-exhaust heat dissipation module comprises a base, a fan, a fin assembly and an airflow guiding cover. The fan is disposed on one side of the base. The fin assembly is disposed on the base and composed of a plurality of parallel fins. The fin assembly has a concave end spaced from the fan by a predetermined distance. The airflow guiding cover is disposed on the fin assembly. The airflow guiding cover is gradually expanded and extended from the fan to cover the fin assembly.

Abstract: A mounting fitting of a heat sink of the present invention is unitarily formed of a first spring, a second spring, a central part disposed in the boundary between the first and second springs, a first arm connected to an end of the first spring on the opposite side from the fulcrum, a second arm connected to an end of the second spring on the opposite side from the fulcrum, a plate part formed in the second spring and near the second arm and having a small hole, and a stopper formed in a space between the second spring and arm. The fitting allows safe removal of the heat sink.

Abstract: A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.

Abstract: A spring element used in a temporary package for testing semiconductors is provided. The spring element is compressed so as to press the semiconductor, either in the form of a bare semiconductor die or as part of a package, against an interconnect structure. The spring element is configured so that it provides sufficient pressure to keep the contacts on the semiconductor in electrical contact with the interconnect structure. Material is added and/or removed from the spring element so that it has the desired modulus of elasticity. The shape of the spring element may also be varied to change the modulus of elasticity, the spring constant, and the force transfer capabilities of the spring element. The spring element also includes conductive material to increase the thermal and electrical conductivity of the spring element.

Abstract: An electronic assembly for conducting heat from a semiconductor device, such as a power flip chip, attached to a substrate. The substrate has a first region with conductors thereon, a second region surrounding and supporting the first region, and a third region surrounding and supporting the second region, with the second region being more flexible than the first and third regions. The chip is mounted to the first region of the substrate, and has solder connections on a first surface thereof that are registered with the conductors on the first region of the substrate. A heat-conductive member thermally contacts a second surface of the chip oppositely disposed from the first surface. A biasing element contacts the first region of the substrate to bias the chip into thermal contact with the heat-conductive member.

Abstract: A clip which can be used to retain a component assembly in a carrier during pick-and-place and thermal assembly operations is provided. The clip comprises an elongate bridgepiece having opposed ends; a pair of legs, each depending from one of the opposed ends of the bridgepiece, the legs being shaped in dimensions to mate with complementary apertures in the carrier to releasably lock the bridgepiece to the carrier at a fixed height therefrom; and a plurality of deformable formations on an underside of the bridgepiece in between the legs, the deformable formations being shaped, dimensioned, and positioned to deform when brought to bear against a component in the carrier in a manner that regularly inward forces are applied to the component along at least two intersecting axes, the forces being symmetrically distributed with respect to the component.

Abstract: Disclosed is a spring clip apparatus for holding one or more heat generating components, such as field effect transistors (FETs) and diodes, firmly against a heat receiving side of a finned heat radiating device having slots within or between the fins. In a finned heat sink, a moving arm of the clip slides into and makes contact with the heat sink in the slot and the confines of the slot prevent further sideways movement while another arm contact point of the clip holds the component firmly in position against the heat sink opposite the moving arm contact point. Clips may be both single and dual arm and may be configured for holding from one to multiple components in contact with the heat sink. The clip may also be used in a similar manner with a non-finned heat sink.

Abstract: A cooling device for cooling one or more electrical and/or electronic components, also referred to as E-components. The cooling device includes at least one cooling body which is assigned to the E-component and which is connected to the same in a thermoconductive manner. According to this invention, it is possible to achieve an effective heat exchange and thus a high operating efficiency in such a system. Thus, according to this invention the cooling body is in thermoconductive contact with a granular, liquid or pasty filling material that is capable of conducting heat. The liquid or pasty material is retained at least in areas by a flexible membrane, and the membrane is connected to a surface of the E-component.

Abstract: In accordance with a press contact type semiconductor device, a metallic body having macroscopic vacancies inside is arranged between a main electrode of the semiconductor device and a main electrode plate, or between an intermediate electrode plate arranged on a respective main plane of the semiconductor element and a main electrode plate.

Abstract: An electrically conductive strap is connected to an electrically conductive first connector at one end and connected to an electrically conductive second connector at the other end. Both connectors are mounted on the substrate so that the connected strap extends over a portion of the mechanical component, or otherwise cooperates with the mechanical component, to secure the mechanical component in the desired position. Also, the connection between the strap and the first connector electrically couples the strap to the first connector while the connection between the strap and the second connector electrically couples the strap to the second connector. At least one of the connectors, the first connector for example, is also electrically coupled to a first reference voltage preferably available on the substrate. The electrical condition of the second connector may then be used to indicate whether the strap and therefore the mechanical component is in place on the substrate.

Abstract: An operating device (10) for detaching a heat sink (40) from a heat-generating electronic device (30) includes a bracket (12) and four handles (14) rotatably connected to the bracket. The bracket includes a pair of first beams (16) and a pair of second beams (18). The second beams perpendicularly connect with the first beams. An opening (21) is thereby defined in a central section of the bracket. A pair of symmetrically opposite pivots (20) extends from each end of each first beam. The handles each include an operating portion (22), and a pressing portion (24) perpendicular to the operating portion. A pair of pivot holes (26) is defined in two junctions of the operating portion and the pressing portion, pivotably receiving corresponding pivots of the bracket.

Abstract: A semiconductor device including a semiconductor substrate having a thickness of not more than 300 &mgr;m and a resin layer formed on a face thereof. A plurality of conductor sections formed in and through the resin layer, and a plurality of electrodes located on the resin layer and connected by the conductor sections to electrodes of semiconductor elements located on the substrate. The resin layer includes at least one of silica, alumina, zirconia, quartz fiber, glass fiber resin fiber and inorganic particles capable of absorbing ionic impurities.

Abstract: Heat dissipation systems and structures which are employed in the cooling of electronic devices and/or semiconductor integrated-circuit chips which are installed in computer and/or communications systems. Moreover, disclosed is a method for implementing the heat dissipation systems and structures.

Abstract: The subject of the present invention is a device (1) for mounting at least two electrical components (4A, 4B) on a printed circuit card (2), the card (2) comprising connection pads on both of its sides. According to the invention, the card (2) is traversed by holes (11-14) for receiving mounting means that extend through the printed circuit card in order to mount the electrical components (4A, 4B) on opposite sides of the card. Another subject of the invention is the tool (35) for mounting or removing an electrical component mounted on a printed circuit card as mentioned above. This tool comprises means for exerting pressure on a first electrical component (4A) attached to a first side of the printed circuit card, in order to mount or remove a second electrical component (4B) on the opposite side of the printed circuit card (2).

Abstract: A clamp and heat block assembly for wire bonding a semiconductor package assembly. The package assembly has a semiconductor chip having a plurality of bond pads on an upper surface the chip, a chip paddle secured to a bottom surface of the chip by an adhesive, a plurality of tie bars being connected to corners of the chip paddle and externally extending from the chip paddle, a plurality of leads radially formed at regular intervals along and spaced apart from the chip paddle and extending towards the chip paddle. The package assembly further includes a plurality of conductive wires electrically connected to the leads and the chip. The heat block assembly includes a heat block, a guide block, and a clamp. The guide block has a raised portion for receiving the heat block, which has a groove mating with the raised portion of the guide block. The guide block and heat block are secured to the package assembly by the clamp, which engages the package assembly on an upper surface of the leads.

Abstract: A clamping assembly for use in conjunction with high voltage solid state devices. The clamping assembly includes a clamp frame having upper and lower clamping plates substantially composed of aluminum and joined together by four dielectric rods composed of glass laminate material. The clamping assembly further includes a compression assembly mounted in the upper clamping plate and including several spring washers disposed in a recess defined by the upper clamping plate. The position of a compression cap attached to the upper clamping plate by eight cap screws can by adjusted by way of the cap screws so as to compress, or deflect, the spring washers. The spring washers in turn exert a compressive force that is a function of the spring constant k of the spring washers as well as of the distance over which the spring washers are compressed by the compression cap. The compressive force thus generated is transmitted to a pivot ball seated in a recess collectively defined by the spring washers.

Abstract: A heat sink base pad mainly has a heat sink base with a plurality of heat sink holes disposed on the face plate of the base and a heat tube pivotally disposed at the lower end of the face plate thereof to increase the self-heat convection of the bottom portion of the notebook computer placed on the heat sink base and to disperse the heat for quickly dissipating the heat source so as to efficiently reduce the temperature.

Abstract: A readily demountable socketless package to circuit board assembly is disclosed. The assembly includes a soft solder area and a metallic contact element, each located on copper pads. The metallic contact element is adapted to sufficiently penetrate the soft solder area to provide electrical contact. The metallic contact element can be either a sharp metallic element or a spring. Compressive force from a clamping mechanism ensures a secure electrical contact and adequate thermal performance.

Abstract: A semiconductor chip is shown containing an integral heat spreading layer that more effectively transmits heat from the die to ambient as a result of spreading the heat out on the die over a larger cross sectional area. Local hot spots are minimized which allows the semiconductor chip to operate at a higher frequency for a given upper threshold temperature. Also shown is a method of manufacturing such a semiconductor chip, and the associated method of cooling a semiconductor chip.

Abstract: A buckle of an IC heat dissipating device for installing a heat dissipating fin device to a top surface of an IC located in an IC socket comprises a pair of clamping arms; a supporting frame being fixed to a top of the heat dissipating fin device; and an operation rod having a camshaft and a lever for rotating the camshaft. The camshaft passes through the supporting frame and is capable of rotating freely. In operation position, the cam of the camshaft will eject the pivotal connection of the clamping arms and the clamping arms will bend and deform. By the restoring force of these clamping arms, the ears at two ends of the clamping arms have sufficient forces to hook the hooks at two sides of the IC socket. In installing the present invention, the user only needs to press an operation portion slightly.

Abstract: Two types of thermal management devices for efficiently dissipating heat generated by high performance electronic devices, such as microprocessors for desktop and server computers producing a power of near 200 Watts and high power electronic devices that are small and thin, such as those used in telephones, radios, laptop computers, and handheld devices. An integrated heat sink and spreader for cooling an item has a vapor chamber heat sink with a thinner first wall and a thicker second wall. The thicker second wall is engageable with the item in efficient heat transferring relationship. A plurality of heat-radiating fins are attached to the thinner first wall. An embedded direct heat pipe attachment includes a heat pipe embedded in a spreader plate that is in direct heat transferring contact with an item through a thin, uniform layer of thermal interface material.

Abstract: A CPU heat sink fastener includes several fasteners with press button on top and a tenor on bottom. After the fastener passes through the heat sink, it applies an elastic part as pressure mechanism to fix the fastener on the fixing hole of the circuitry board. A stable plate with several holding cylinders; each of the fasteners is placed inside one cylinder; an elastic part is under the press button. Two stretch plates with fixing through hole are located in the proper position in the heat sink. The heat sink is on right top of the CPU; the stable plate is on right top of the heat sink to make the holding cylinder faces directly with the stretch plate. Users can push the press button of the fastener and make the tenor pass through the through hole and fix firmly on the fixing through hole of the circuitry board.

Abstract: A semiconductor package is mounted to a support plate through a base. The base is inserted between a rear face of the semiconductor package and a front face of the support plate. An electrical connection mechanism is provided to connect the semiconductor package to the support plate pass. This mechanism passes through the base. The mounting of the semiconductor package is accomplished by a variety of structures to fasten the package onto the said support plate. These structures cooperate with and are placed below the rear face of the semiconductor package.

Abstract: A semiconductor package with stacked chips is proposed, in which a first chip mounted on and electrically connected to a chip carrier is attached with a rigid interposer thereto, while the rigid interposer has a second chip disposed thereon in a manner that the rigid interposer is interposed between the first chip and the second chip. With the use of the rigid interposer, the second chip stacked on the first chip can be positioned in planarly parallel to the chip carrier, allowing bonding wires for electrically connecting the second chip to the chip carrier to be bonded completely. Moreover, the second chip has portions thereof not located right above the first chip to be firmly supported by the rigid interposer, and thus the second chip can be prevented from cracking in the wire bonding process.

Abstract: In one embodiment, the present invention is a heat sink apparatus comprising a heat sink device and a heat sink shroud. The heat sink device is for transferring heat from a heat source. The heat sink shroud is thermally coupled with the heat sink device. Hence, the heat sink shroud transfers heat from the heat sink device and dissipates the heat generated by the heat source.

Abstract: A heat sink assembly includes a heat sink (20), a clip (40), and a spring clamp (60). The heat sink includes a base (21), pin fins (23), and slots (25, 27) defined between respective adjacent rows of the pins in perpendicular crisscross fashion. The clip made from a flexible metal wire includes a central body (41) with a raised portion (43), and two arms (45) extending perpendicularly but in different directions from opposite ends of the body. A hook (47) is formed at a free end of each arm. The spring clamp includes an elongate central pressing portion (61). A longitudinal opening (63) defined in the pressing portion engagingly receives the raised portion. Two pairs of elastically deformable wings (65) extend from respective opposite sides of the pressing portion. The clamp is resiliently retained in corresponding slots of the heat sink, and thus secures the clip to the heat sink.

Abstract: A heat-dissipating device is adapted for use with a multi-layer circuit board having a grounding layer and that has an electronic component mounted thereon. The heat-dissipating device includes a heat-dissipating member, a grounding member and a connecting member. The heat-dissipating member is adapted to be disposed on a heat-radiating side of the electronic component. The grounding member includes a grounding tail and a grounding body connected to the grounding tail. The grounding tail is adapted to pass through the circuit board to connect electrically with the grounding layer and to dispose the grounding body between the heat-dissipating member and the circuit board. The connecting member interconnects the heat-dissipating member and the grounding member, and is adapted to be secured on the circuit board. The connecting member cooperates with the grounding member to make electrical connection between the heat-dissipating member and the grounding layer of the circuit board.