Abstract: A power module that includes a lead frame having conductive pads molded in at the base thereof and a heatsink in thermal contact with the conductive pads through a thermally conductive adhesive.

Abstract: A mounting device for a heat sink (200) includes a pair of pivot members (10), two joining members (30), and two pairs of spring members (20). Each pivot member includes a clipping portion (11) for clasping the electric unit (300). The joining members pivotably connect with the pivot members. Each joining member includes a pressing portion (310) for resiliently abutting against the heat sink toward the electric unit. The spring members each includes two end catches (21), (22) secured with the joining member and a corresponding member and capable of providing resilient torsions to drive the clipping portions to engage with the electric unit when the clipping portions rotate to one position away from the electric unit.

Abstract: A fastener for a heat sink of the present invention includes a length-variable operating member (10), a piston member (20), an embracing member (30), a resilient member (40) and a post (58) extending from a printed circuit board (50). The piston member is movable in the operating member when the operating member varies between a shortest length and a longest length. The resilient member covers around the piston member. The embracing member is controllable cooperatively by the piston member and the resilient member to grasp the post or release the post.

Abstract: An assembly includes a circuit board with a ball grid array device attached to a first side of the circuit board. A brace surrounding the ball grid array device has a series of mounting holes and a series of members extending between the mounting holes. The brace is removably secured to the first side of the circuit board at the mounting holes.

Abstract: A retaining device holds a PCB to a heat sink that has channels for receiving the retaining device. The retaining device includes a body having portions configured for receipt into the channels of the heat sink and moveable tabs and protuberances protruding away from a first surface of each moveable tab. A method for holding the PCB to the heat sink is disclosed. A lighting assembly that includes the retaining device is also disclosed.

Abstract: An electronic apparatus includes a housing, a substrate, a bridge, a radiating plate, and a retaining member. The substrate is built in the housing. The bridge has an element portion and is mounted on the substrate. The radiating plate is thermally connected to the element portion. The retaining member has a pressing portion and three feet. The pressing portion is located on an opposite of the element portion about the radiating plate and abuts on the radiating plate. Three feet extend in three directions from the pressing portion and their respective end portions are fixed on the substrate. The retaining member urges the pressing portion toward the radiating plate.

Abstract: A mounting device (10) for mounting a heat sink (20) to a circuit board (40), includes a locking member (16) extending through the heat sink and including a through hole (162) and barbs (172) formed in one end portion thereof for engaging with the circuit board, an operation member (12) including a cylinder (122) and a rod (128) extending from the cylinder into the through hole of the locking member. First and second bumps (178, 179) are formed in the locking member, and a pair of slots (126) is defined in the cylinder for engaging with the first and second bumps at first and second positions respectively. A spring (14) is received in the cylinder, surrounding the rod and compressed between an end of the cylinder and the first bumps. The rod expands the barbs outwardly at the second position and releases the barbs at the first position.

Abstract: A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient cold plate coupled to the surface so as to be biased by a portion of the liquid cooled heat exchanger thereby providing a forced engagement between the liquid cooled heat exchanger, the integrated circuit, and the resilient cold plate.

Abstract: A heat dissipating device assembly for an electronic components (70), includes a heat sink (10) for contacting the electronic component, and a locking device (20) and a back plate unit (40) for cooperatively mounting the heat sink to the electronic component. The locking device includes a retention module (28) located around the electronic component for supporting the heat sink thereon, and a clip (30) pivotably attached to the retention module. The clip includes a pressing portion and a pushing portion. The clip is pivotable between a first position in which the clip presses the heat sink toward the electronic component and a second position in which the clip pushes the heat sink in a direction away from the electronic component.

Abstract: A heat dissipation device includes a mounting plate (21) for mounting the heat dissipation device to a circuit board (3) on which a CPU (4) and a plurality of capacitors (31) are mounted, a heat sink (20), a core (25), and a fan (1) mounted on the heat sink. The heat sink locates above the mounting plate and includes a hollow cylinder (202) and a plurality of curved fins (204) extending outwardly from the cylinder. The core includes a base (26) for contacting the CPU and a post (27) extending from the base through the mounting plate to be received in the cylinder. The mounting plate is spaced from the circuit board to allow the capacitors to locate between the mounting plate and the circuit board. The mounting plate defines a plurality of openings (23) for providing access for cooled air from the fan to the CPU and the capacitors.

Abstract: A circuit board module has a circuit board, a component mounted to the circuit board, and a heat sink assembly. The heat sink assembly includes a base member having a first edge and a second edge. The base member is configured to operate as a thermal conduit between a first location proximate to the component and a second location distal to the component. The heat sink assembly further includes a first rail member coupled to the base member along the first edge of the base member, a second rail member coupled to the base member along the second edge of the base member, and an actuation mechanism coupled to the base member. The actuation mechanism is configured to move portions of the members toward each other when the base member resides at the first location to fasten the base member to the component.

Abstract: A clip (10) includes a body (12) including spaced first and second end portions, a first locking part (20) extending from the first end portion for attaching to a heat sink (80), and a second locking part (30) extending from the second end portion for attaching to a circuit board (50). The first locking part includes a pin (21), a pair of C-shaped spring portions (22), and a compressible mounting portion (23). The spring portions and the mounting portion are for cooperatively sandwiching the heat sink therebetween. The second locking part includes a taper head (30) and a neck (31). The second locking part engages with the circuit board in the neck. The first locking part offsets from the second locking part in a vertical direction. The heat sink of which the mounting holes offset from the mounting holes of the circuit board is therefore fitable to the circuit board.

Abstract: A heat sink retention module for an electronic device includes a base comprising mounting lugs configured to be mounted to a circuit board, and frame elements extending between the mounting lugs to define at least one keep out area interior to the frame elements and at least one keep out area exterior to the frame elements. The frame elements include at least one frame element extending at an oblique angle to another of the frame elements, and heat sink retention posts extend vertically upward from the frame elements.

Abstract: A thermal interface pad is constructed from a plurality of thermal interface plate assemblies. Alternate thermal interface plate assemblies are rotated about 180 degrees from each other within the pad. Each plate assembly includes one or more spring members configured such that the completed thermal interface pad includes a plurality of spring members on at least two sides of the pad. The thermal interface plate assemblies are configured to allow the thermal interface pad to vary greatly in thickness. The pad is sufficiently adjustable in thickness to accommodate gross tolerance differences between multiple heat generating and sinking devices. Rods inserted in openings in the plates may be used to align the plate assemblies and to apply compressive force to the plates, improving the thermal conductivity between adjacent plates and greatly decreasing the overall thermal resistance of the thermal interface pad.

Abstract: The present invention represents a significant advancement in the field of thermal solutions for computer hardware. In one embodiment, a quick-connect system for cooling a heat-generating electronic device is provided. The electronic device is mounted to a first side of a circuit board. The system includes a first plate having an opening and configured to be coupled to the first side of the circuit board. The system further includes a second plate disposed within the opening and coupled to the first plate with a first suspension system, wherein the first suspension system is configured to enable the second plate to be disposed substantially flat against the electronic device when the first plate is coupled to the first side of the circuit board. The system further includes a cooling module thermally coupled to the second plate and configured to dissipate heat transferred from the electronic device to the second plate.

Abstract: A heat slug or spreader is attached directly to a surface of the die in a ball grid array (BGA) package. The heat spreader roughly conforms to the topological profile of the die, underlying substrate, and electrical interconnections between the die and the substrate, such as bond wires. The outer portion of the heat spreader substantially cover the outer portion of the substrate, or alternatively, cover only those portions extending in laterally from the sides of the chip and not the corners. An encapsulant completely covers the heat spreader and die.

Abstract: A chassis air guide thermal cooling solution including a fan to which protruding edges are wedged at wedge grooves of a locating assembly to locate the fan therein, locating notches of a flexible ring are positioned in the locating assembly, an accommodating ring is accommodated around the flexible ring, and the locating assembly is fastened with a locating plate by means of screws; a side panel is devised with ventilation openings for drawing external air or discharging hot air at the interior of the device. The locating assembly is provided with a plurality of flexible openings, and after having fixed the locating plate therein, an assembled position of the chassis air guide thermal cooling solution is adjusted; after having assembled the chassis air guide thermal cooling solution therein, a distance between the accommodating ring and the heat dissipating fan is adjusted using the flexible ring.

Abstract: A heat dissipation device assembly includes a heat sink (20) placed on an electronic component (52) which is mounted on a printed circuit board (PCB) (50) and including a pair of shoulders (23) on opposite sides thereof, a pressing part (30) including a pair of pressing portions (36) supported on the shoulders and a pair of locking portions (34) spaced from the shoulders, a sliding part (40) slidably attached to the pressing part and including a pair of locking portions (41) spaced from the shoulder, and a back plate (60) mounted below the PCB and including four posts (61) extending through the PCB and the heat sink to resilently engage with the locking portions. Each locking portion defines a locking opening (33, 43) including an entrance (33a, 43a) and a locking slot (33b, 43b), the post being capable of extending through the entrance to engage in the locking slot.

Abstract: A locking device for mounting a heat sink to a CPU mounted on a printed circuit board, includes a back plate mounted below the circuit board and having a plurality of fasteners extending upwardly beyond the circuit board, and a plurality of retainers. Each retainer includes an operating member resting on a heat sink, a locking member extending through the operating member, and a pushing member extending through the locking member. The locking member includes a locking structure extending through the heat sink to engage with one of the fasteners. The pushing member includes a taper bottom portion. The pushing member is downward movable to cause the taper bottom portion to disengage the locking structure from the one of the fasteners.

Abstract: An apparatus in one example comprises a plurality of levers that convert a lesser input force to a greater output force for support of a heatsink component coupled with an electronic component.

Abstract: Structures and methods for mounting electronic devices and associated heat sinks to computer modules and other structures are described herein. In one embodiment, a structure for holding a heat sink in contact with an electronic device includes an electronic device holding portion and a heat sink holding portion. The electronic device holding portion is configured to support the electronic device, and the heat sink holding portion is configured to position the heat sink in contact with the electronic device. The structure can further include a spring holding portion configured to laterally support a coil spring. When the coil spring is laterally supported in the spring holding portion, the coil spring exerts a transverse compression force against the heat sink causing the heat sink to press against the electronic device with a uniform, or an approximately uniform, pressure.

Abstract: A mounting apparatus (1) includes a locking pin (10) and an operation member (20) attaching to the locking pin. Resilient prongs (13) are formed at a first end of the locking pin. A detent (16) is formed at a periphery of the locking pin. The operation member comprises a compressing portion (21) capable of compressing the prongs radially to a predetermined compressed state when the operation member moves axially in a first direction from the second end to the first end and capable of releasing the prongs when the operation member moves axially in an opposite second direction to allow the prongs to return to their original states, and a catch (24) to engage with the detent to prevent movement of the operation member in the second direction to maintain the prongs at the predetermined compressed state.

Abstract: A circuit board module has a circuit board which includes a circuit board structure and a set of components mounted to the circuit board structure. The circuit board module further includes a set of heatsinks (i.e., one or more heatsinks) and a heatsink retaining assembly fastened to the circuit board. The heatsink retaining assembly includes (i) a set of brackets, each bracket being elongated in shape and having a first end and a second end, (ii) a frame, and (iii) a fastening mechanism configured to fasten the frame to a circuit board. The frame is configured to simultaneously hold the first and second ends of each bracket relative to the circuit board to enable that bracket to assert holding force on the set of heatsinks.

Abstract: A heat dissipation assembly of the present invention includes a printed circuit board (50), an electronic component (60) mounted on the printed circuit board, a heat dissipation device (70) mounted on the electronic component, four securing members (10) secured to the heat dissipation device and four positioning members (20) extend through the printed circuit board. The positioning members are covered over by four resilient members (30) disposed in the securing members. The positioning members pull the securing members toward the printed circuit board.

Abstract: A heat transfer assembly comprising of an electronic component attached to an attachment point located on a circuit board and a clamping mechanism which applies a downward force against a block. In return, the block applies force against a heat transfer device which contacts the electronic component. The interface between the block and the heat transfer device contain a number of tongues and grooves to allow for positive location of the block against the heat transfer device while the clamping mechanism is fastened to the support. The positive location is configured for applying a localized force against a specific area on the electronic component.

Abstract: An LED display assembly, comprising a grid of electrical conductors; light emitting diodes in association with the grid and in electrical communication with the conductors that provide power for LED operation, the grid operable to receive heat from the diodes during diode operation, and the array configured for passing coolant fluid for transfer of heat to the fluid. LED packages adjustable relative to a mounting grid, are also provided.

Abstract: A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules are arranged in such a manner that main surface directions of these semiconductor modules are positioned in parallel to each other in a interval along a thickness direction thereof. These semiconductor modules are sandwiched by coolant tube having folded portions with fixing members. As a consequence, both surfaces of the semiconductor module can be cooled by a single coolant tube with a uniform pinching force.

Abstract: A locking device, for locking a heat sink (30) to a socket (10) on which an electronic component (20) is mounted, includes a pair of clips (60) each having a handle (62) and a ring (66). The handle includes a pair of first tabs (68) at one end thereof. A pivot (64) is connected between the first tabs and received in a slot (40) defined in an outmost fin of the heat sink. The handle further includes a pair of second tabs (72). The ring includes an opening end and a closed end for engaging with the socket. The opening end includes a pair of pivot portions extending through the second tabs. The handles are pivotable about the corresponding outmost fins between first positions at which the closed end of the rings are engaged with the socket and second positions at which the closed end are disengaged from the socket.

Abstract: A device and method for designing and manufacturing an integrated heat spreader so that the integrated heat spreader will have a flat surface on which to mount a heat sink after being assembled into a package and exposed to the heat of a die. This device and method for designing and manufacturing an integrated heat spreader would generate a heat spreader that would be built compensate for deformations resulting from (1) physical manipulation during assembly (2) thermal gradients during operation and (3) differing rates of expansion and contraction of the package materials coupled with multiple package assembly steps at elevated temperatures so that one surface of the integrated heat spreader would have a flat shape.

Abstract: The apparatus and method may have the following: a spring element that pivots about a pivot axis; a flexible mount coupled to the spring element such that the pivot axis of the spring element is constrained; and at least one portion of the spring element contacting a heat sink, the spring element in combination with the flexible mount deforming to apply a controlled load to the heat sink.

Abstract: A locking device for mounting a heat sink to a CPU mounted on a printed circuit board, includes a first locking member extending the heat sink and the circuit board and having a block for pressing the heat sink, an operating member pivotably connected to the first locking member, a second locking member extending the heat sink and the circuit board and pivotably connected to the operating member, and an actuating structure formed between the first and second locking members. The first and second locking members each includes a hook located below the circuit board. The operating member is pivotable about the first locking member to drive the second locking member to move upwardly and to cause the actuating structure to simultaneously drive the first and second locking members to move away from each other, whereby the hooks engage below the circuit board.

Abstract: Methods of engaging an electronic module interconnected to a circuit board to a heat sink using clamping assemblies that maintain integrities of an interconnection grid array and the electronic module. A loading block having a plurality of legs is positioned at a backside of the module toward the circuit board in a location corresponding to a central area of the interconnection grid array. A spring having a central fastening means and plurality of peripheral securing means is positioned adjacent the loading block. The fastening means is actuated whereby central backside compressive forces are directed at and force the loading block against the circuit board, while forces are applied to the securing means for engaging the securing means into the heat sink such that the electronic module is engaged with the heat sink. The clamping assembly relocates the regions of highest compression on the interconnection array, thereby maintaining the integrity thereof.

Abstract: A housing cover to cause electrical components to engage with at least one component pad of a heat sink, the cover including a projection integrally formed from the housing cover and positioned on the cover for biasing the electrical component against the component pad, and a mechanism that permits a vertical displacement of the projection relative to the vertical displacement of the housing cover. In one example, a slot extends around at least part of the projection so as to substantially decouple a vertical displacement of the projection from a vertical displacement of the housing cover.

Abstract: A heat dissipating device includes a heat sink (50) and two clips (10) for mounting the heat sink to a retention module (60) which surrounds an electronic component (65). The heat sink provides two shoulders (72). Each clip includes a strap (21) supported on one shoulder, a lever (40) having a cam pivotally connected to the strap, two legs (30) pivotally connected to opposite end portions of the strap, and two spring fingers (26) integrally extending from opposite ends of the strap. In assembly, the straps are downwardly pressed and the retention module push the legs to pivot away from the feet from original states toward forced states. When the legs arrive openings of the retention module the fingers urge the legs to enter the openings. The levers are then pivoted to push the straps to move upwardly to thereby cause the legs to firmly engage in the openings.

Abstract: A locking device (30) for mounting a heat sink (40) to a CPU (70), includes a supporting member (32), a pair of locking members (33) pivotably attached to the supporting member and each having a connecting portion (332) and a hook (333), a pressing member (34) resting on the connecting portions, a spring installed between the supporting member and the connecting portions, and an operating member (31) pivotably attached to the supporting member. The operating member is pivotable between a first position at which the operating member abuts against the pressing member and the locking members are located at a released position and a second position at which the abutting portion releases the pressing member to allow the elastic member to drive the locking members to interlock with a retention module around the CPU.

Abstract: A clip (10) includes a main body (20), a buckling piece (40), and a camming member (30). The main body includes a pressing part (22), a first leg (24) extending downwardly from one end of the pressing part, and a supporting portion (26) extending horizontal from an opposite end of the pressing part. The supporting portion defining a hole. The cam member located above the supporting portion which comprises a cam (32) and a handle (34) extending from the cam for rotating the cam. The buckling piece located below the supporting portion which comprises a connecting part (42) and a second leg (44) extending from the connecting part. The connecting part move up through the hole of the supporting portion to pivotally connect with the cam, and the heak sink can be secured to the electronic device by rotating the cam to a locked position from an unlocked position.

Abstract: Means for securing a cooling device includes a main body attached to the cooling device and at least a secure unit. The main body provides at least an axial hole corresponding to the secure unit. The secure unit provides a secure component, which is disposed in the axial hole, and an elastic member, which is disposed in the axial hole to surround the secure component, with a locator being inserted into the engaging part of the main body. The secure unit is biased by the elastic member against the electronic component on the circuit board under a condition of no relative movement and no abrasive wear occurring between the elastic member and the main body due to the locator being inserted into the engaging part. Therefore, no chippings are created to fall down to the circuit board.

Abstract: An IC module assembly includes an IC module including a plurality of pads disposed on a bottom thereof, a plurality of resilient members respectively soldering to the pads, and a PCB having a plurality of conductive patterns arranged on a top thereof and corresponding to the resilient members respectively, whereby the IC module electrically connects the PCB by the resilient members abutting against the conductive patterns of the PCB.

Abstract: A thermal interface for facilitating heat transfer from an electronic component to a heat sink. According to a preferred embodiment, the thermal interface comprises a first planar substrate that defines a first continuous peripheral edge, at least a portion of which extends beyond the interface mating surface between the electronic component and heat sink. Formed upon opposed sides of the substrate are layers of thermally conductive compositions, which preferably comprise certain novel graphitic allotrope compounds. The thermal interface further includes an adhesive deposited upon such portion of the peripheral edge extending beyond the mating surface between the electronic component and heat sink such that the thermal interface may be adhesively secured into position without forming an additional layer at the mating juncture between the electronic component and the heat sink.

Abstract: The present invention relates to a heat sink (1) with a main body (2) for accommodating at least one electronic structural element (5), and with a spring element (3) for pressing the structural element (5) against the main body (2), whereby the spring element (3) is held on the main body (2) by a connecting means. It is provided that the connecting means are configured as a push-on connection (15) and have a projection (7) on the main body (2) and a mounting opening (14) in the spring element (3) for the projection (7), whereby the opening edge (23) of the mounting opening (14) bears, at least in sections, against the lateral surface of the projection (7) under preload resulting from the intrinsic elasticity of the spring element (3) and/or the projection (7).

Abstract: Illustrative embodiments of the present invention include, but are not limited to, a heat sink equipped with a captive socket actuating device designed to facilitate engagement and disengagement of the apparatus to and from an integrated circuit (IC) socket.

Abstract: In some embodiments, a method includes providing a circuit board having a plurality of holes formed therethrough and mounting a spring to an underside of the circuit board such that the mounted spring has a plurality of holes each of which is aligned with a respective one of the holes in the circuit board. Bosses of the spring are each sandwiched between a respective standoff on a chassis and a respective standoff on a heat sink. Holes in the circuit board at the locus of the standoffs are sized so that the circuit board is not sandwiched between the standoffs. The spring presses the circuit board upwardly to bring an integrated circuit in contact with the heat sink.

Abstract: A clamping structure is used to fix a heat-dissipating body on a chip module. The clamping structure comprises a clamping body, two clamping portions, a pivot element, a top frame and a bottom frame. The two clamping portions are respectively connected to two sides of the clamping body and are clamped to the bottom frame. The pivot element is pivotally connected to the clamping body and has a movable portion and an ear piece. The ear piece has a fixed portion and a release portion respectively formed at an end side thereof for fixing and releasing the heat-dissipating body. The clamping structure is used to eliminate a spare gap between the clamping element and the top frame, and clamping element and the bottom frame without using the elastic element. The clamping structure can also be used with a heat sink to form a heat-dissipating module.

Abstract: A method of mounting electrical component assemblies on opposite sides of a printed circuit card including inserting a chock on a first side of the printed circuit card; inserting a standoff and placing a spring around each standoff; pressing the chock against the printed circuit card; mounting a first electrical component assembly on a second side of the printed circuit card; placing a package tool having a plurality of springs on a horizontal support so that when the first mounted electrical component assembly is placed inside the package tool the springs of the package tool come into contact with the first electrical component assembly; removing the chock from the printed circuit card such that the springs of the package tool compensate for the weight of the first electrical component assembly inside the package tool; and mounting a second electrical component assembly on the first side of the printed circuit card.

Abstract: A semiconductor power module (1) comprises at least a substrate (2) including at least a semiconductor element (6, 7, 8) and a pressing device (40) which acts on the substrate (2). The pressing device (40) enables to press the substrate (2), when mounted, on a cooling element (30) so as to evacuate from semiconductor components operational heat losses. The pressing device (40) consists of a housing (10) provided with at least an elastic deformation zone (16, 17, 15, 18, 19).

Abstract: A heat dissipating device for a heat generating unit, includes a heat sink placed on the heat generating unit, and two clip members located at opposite sides of the heat sink for securing the heat sink to the heat generating unit. Each clip member includes an operating member movably attached to the heat sink, and a fastening member connected with the operating member. The operating member is movable from a lower position to an upper position to cause the bottom portion of the fastening member to move upwardly via the operating member acting on the fastening member.

Abstract: A heat sink has a flexure member attached to a base of the heat sink and located between the base and an associated circuit board component. As the heat sink attaches to a circuit board carrying the circuit board component, the flexure member conforms to the surface of the circuit board component, thereby thermally contacting the circuit board component. The flexure member absorbs local tolerance differences on the circuit board component to provide a relatively uniform stress across the surface of the circuit board component. The flexure member further limits the amount of stress generated by the heat sink on the circuit board component. When used in conjunction with a heat sink spanning several circuit board components, the flexure member absorbs global tolerance differences among the circuit board components, thereby providing relatively uniform stresses to all of the circuit board components and limiting the amount of stress experienced by any one circuit board component.

Abstract: A semiconductor module includes a fixed type and transformable type coolers and a flat semiconductor package sandwiched between the coolers. A relative positional relationship of the semiconductor package is fixed with the fixed type cooler, but variable with the transformable type cooler. The transformable type cooler includes a transformable member of a metal thin plate covering a coolant chamber. The semiconductor module includes a sandwiching mechanism causing the fixed type cooler to be pressed toward the transformable type cooler. Fastening adjustment screws of the sandwiching mechanism causes a pressing frame to approach a cooler body of the transformable type cooler. Therefore, the semiconductor package is pressed via the fixed type cooler while the transformable member is slightly transformed. This enhances a degree of contact between the semiconductor package and transformable member via an insulating member.

Abstract: A fastening structure provided by the present invention is used to fastening a heat dissipating device with a printed circuit board in which a plurality of holes is formed. The fastening structure has a back plate disposed underneath the printed circuit board and a plurality of fitting columns, wherein the back plate is perforated with a plurality of holes and each of the fitting columns has an elongate hollow tube and an insertion member projecting from a periphery of one end of the hollow tube. The hollow tube has a threaded internal sidewall and the insertion member has a shape conformal to the respective holes at which the fitting columns are fixed to the back plate.

Abstract: A system for mounting heatsinks, in particular, high-mass heatsinks, on printed circuit boards, such as motherboards. The mounting system includes a backplate, disposed beneath the motherboard, with pins protruding up through the motherboard, and a linkage assembly, which is fixably attached to a base portion of a heatsink assembly. The linkage assembly includes scoops, for grasping the pins during engagement, and a ratcheting system, for compressing the heatsink and thermal interface material onto the package. The mounting system is designed to effectively distribute the heatsink weight, as well as the forces caused by chronic and dynamic stresses, through, rather than upon the motherboard, such as to a chassis. The mounting system thus alleviates stress cracks, component pullout, solderball stress, and other damaging conditions to the motherboard. The mounting system may be engaged and disengaged without the use of tools.