Abstract: Piezoelectric fan assemblies are provided to provide a conduction path and forced convection for space-limited electronic devices in accordance with embodiments of the present invention. The fan blade of a piezoelectric fan is thermally coupled to the heat source, such as, but not limited to, the fins of a heat sink, the condenser of the heat pipe, and to the thermal mass of a heat spreader or block. The high amplitude resonant vibration of the fan blade causes formation of a high velocity unidirectional flow stream. Maximum airflow occurs on axes of the piezoelectric fan's centerline, relative to both width and height dimensions. Air intake is above and below the swept out plane of the fan blade. The air flow provides forced convection for the fan blade and, secondarily, for the heat source.

Abstract: An electronics assembly, for example a computer that may be employed as a network server, has an enclosure, and a plurality of heat-generating components such as microprocessors located inside the enclosure. One or more fans may be provided for maintaining a through flow of air for cooling the components of the assembly. The heat-generating components are located within the enclosure in line with the direction of the flow of air, and the heat-sinks have a configuration such that the air flows over them in parallel. The heat-sinks may each have a flat base for mounting on the component, and a cantilevered portion having one end located on the base, and another end that extends beyond the base and over the base of the other heat-sink, but not in contact with it.

Abstract: A heat dissipation apparatus and method for dissipating heat from a heat source includes a thermal conductive element bonding to the heat source to transfer heat energy generated by the heat source and a vibration source located on the thermal conductive element to accelerate heat transfer to the edges of the thermal conductive element to perform heat exchange with external cooling air and improve cooling efficiency.

Abstract: A heat sink having air flow directors on each of multiple fins attached to a heat sink base. The air flow directors direct air flow from dual fans towards a geometric center of the heat sink base, which is above the hottest part of the integrated circuit (IC) package being cooled by the heat sink. In one embodiment, a protrusion in the geometric center of the heat sink base provides additional cooling from air impingement, and also directs air towards the upper portions of the fins. The use of dual fans allows the fans to run at a lower speed than a single fan, thus reducing an overall fan acoustic level. Furthermore, the dual fans allow for a backup fan if one of the fans should fail.

Abstract: Representative embodiments provide for a circuit device cooling apparatus having a first heat pipe which includes a first heat pipe condenser, and a second heat pipe which includes a second heat pipe condenser. A heat sink is attached to the first heat pipe condenser and the second heat pipe condenser. Another representative embodiment provides for a method of removing heat from a first circuit device and a second circuit device. The method includes providing a heat dissipating member, and connecting the first circuit device to the heat dissipating member with a first heat pipe. the method further includes connecting the second circuit device to the heat dissipating member with a second heat pipe, and providing compliance between the first heat pipe and the second heat pipe.

Abstract: A heat sink for semiconductor components or similar devices, especially produced from an extruded aluminum alloy. The heat sink comprises cooling ribs which rise at a distance from a base plate and which are clamped in an insert groove made in the surface of the base plate, laterally limited by longitudinal or intermediate ribs with a coupling base that has an approximately rectangular cross-section. The coupling bases are held in their insert grooves in a form-fit and are cold-welded with the base plate at least in some sections. Cross ribs extend at a distance to one another on the surfaces of the intermediate ribs and have the form of upset heels that are linked with the coupling base in a form-fit.

Abstract: A thermal management device includes a thermally conductive core, a thermally conductive frame positioned around the core, the frame defining at least one opening, and at least one thermally conductive insert disposed in the opening in the frame.

Abstract: A heat sink assembly includes a heat-conductive base (20), and a plurality of combined fins (30) uprightly attached onto the base. Each fin includes a main body (31), a bottom flange (32) extending from the main body, and two lower abutting plates (34) extending upwardly from the flange. A pair of first locking tabs (342) is formed from outer sides of the lower abutting plate, and extends into corresponding cutouts (36) of the main body of an adjacent fin. Two upper abutting plates (34?) are formed from a top edge of the main body. A second locking tab (40) extends from an outer side of each upper abutting plate, and into a corresponding notch (38) of the main body of the adjacent fin. Then, the first and second locking tabs are bent inwardly to abut against the main body of the adjacent fin. Thus, the fins are firmly combined together.

Abstract: A cooling device primarily for cooling, e.g., integrated circuits or other electronic devices during operation may include a heat sink portion having a plurality of cooling vanes and a heat pipe chamber. Both the cooling vanes and the heat pipe chamber may be integrally formed within the heat sink portion. Because the heat pipe chamber is integrally formed with the cooling vanes, no joints exist between the condensing surface of the heat pipe chamber and the cooling vanes. This, in turn, allows extremely rapid and efficient heat transfer between the heat pipe chamber and the cooling vanes. The cooling device may include extensions of the main heat pipe chamber which project into each of the cooling vanes. In this manner, the condensing surface of the heat pipe chamber is actually moved into the vanes at a position very close to the surface of the vanes where heat transfer into the atmosphere occurs.

Abstract: A heatsink arrangement attached to a semiconductor device includes: a first heatsink placed in close contact with the semiconductor device; and second heatsink placed in close contact with the first heatsink, wherein the first heatsink and the second heatsink are connected to a power supply circuit for the semiconductor device via first connector and second connector, respectively. Thus, the present invention provides a heatsink arrangement for a semiconductor device used in an electric/electronic circuit that radiates less high-frequency noise even when a large current flows through the semiconductor device and that provides a high heat-radiating efficiency.

Abstract: An attaching device is provided for mounting and fixing a semiconductor device and a heat sink provided on the semiconductor device on a board. The attaching device includes a base part fixed to the board, a rotation member provided to the base part rotatably, the rotation member rotated and received at the base part so that the semiconductor device is fixed to the board, and a press mechanism that presses the heat sink to the semiconductor device when the rotation member is rotated.

Abstract: A radiator includes a heat transfer base (30), a heat dissipation member (20) secured to the heat transfer base and a fan (50) mounted to the heat dissipation member. The heat dissipation member comprises a plurality of fins (22) for dissipation heat. Air guide structures are formed between the fins for guiding air from the fan to a middle portion of the heat transfer base and a middle bottom portion of the heat dissipation member in order to enhance heat dissipating efficiency of the radiator.

Abstract: An integrated heat dissipating device has a heat sink, a first set of fins, a second set of fins and at least one heat pipe. The heat sink has a thermal conductive block embedded therein and a through hole exposing the thermal conductive block from a top surface of the heat sink. The first set of fins has a plurality of horizontally extending fins stacked with each other along a vertical direction over the heat sink. The second set of fins is integrated by a plurality of vertically extending fins arranged in a curved shape between the heat sink and the first set of fins. The heat pipe has a vertical extension across the first set of fins and a horizontal extension underneath a bottom of the first set of fins. The horizontal extension is inserted into the through hole in contact with the thermal conductive block.

Abstract: The present invention relates to an integrated circuit system with at least one integrated circuit, a cooling body to dissipate the heat generated by the integrated circuit and a latent heat storage module having a latent heat storage medium. The latent heat storage module is thermally connected to the cooling body in order to temporarily store the heat generated by the integrated circuit and to convey it to the cooling body. The integrated circuit has at least one semiconductor component which is assembled on a substrate and the substrate is in direct thermal contact with the latent heat storage module.

Abstract: A heat dissipating device includes a retention module (20) around an electronic component (15), a heat sink (30) attached to the retention module, and a fan (90). The heat sink includes a plurality of fins (62, 64, 66, 68) and spacers (52) interleaved between the fins, two heat pipes (80) sequentially extending through lower portions of the fins, the spacers and upper portions of the fins to bond the fins and the spacers together. Each spacer includes a flat bottom face for contacting the electronic component, and an arcuate top face. The fins includes two outer fins, and a plurality of inner fins each defining a cutout (62a, 64a) cooperatively defining a chamber between the outer fins. The chamber and the arcuate spacers facilitate cooling air from the fan to blow to opposite sides of the heat sink thereby improving heat dissipation efficiency of the heat sink.

Abstract: A power module is suggested having a simple and cost-effective arrangement and ensuring a reliable operation. To this end, a circuit arrangement comprising at least one electronic component is arranged on a carrier body. A conductor pattern is formed on the top side of the carrier body, and a structured cooling element made of the material of the carrier body, is provided on the bottom side. The invention also relates to a power module as power converter for electric motors.

Abstract: A uniform heat dissipating and cooling heat sink for increasing conductive cooling at locations where conductive cooling and temperature differential is reduced. The heat sink includes a base having a variable thickness with a maximum thickness at the interior thereof and a plurality of fins upstanding from the base with adjacent fins separated by a flow channel having diverging sides.

Abstract: Disclosed are a heat dissipation computer and method. In one embodiment, a heat dissipation apparatus comprises a heat sink that is adapted to receive a processor mounted thereto, the heat sink comprising an internal chamber that is adapted to receive a fluid flow that removes heat from the heat sink. In one embodiment, a method for dissipating heat generated by a processor comprises forcing fluid through an internal chamber formed within a heat sink to which the processor is mounted, forcing the fluid from the internal chamber of the heat sink through at least one hollow prong that extends from the heat sink and that is in fluid communication with the internal chamber of the heat sink, and forcing fluid over exterior surfaces of the at least one hollow prong.

Abstract: A method and device for thermal conduction is provided. Methods of forming heatsinks are provided that include advantages such as the ability to produce intricate detailed features that other manufacturing methods are not capable of. Other advantages provided include a reduction in process time and cost due to the absence of a need to machine components after initial fabrication. Embodiments of heatsinks that are formed using methods provided include features such as sub-fins and other detailed features that cannot be formed using other manufacturing processes. Further embodiments of heatsinks that are formed using methods provided include materials that cannot be formed using other manufacturing processes.

Abstract: A heat-emitting element cooling apparatus that can improve a cooling effect on a heat-emitting element without increasing its size is provided. A heat sink is so constructed that all or part of radiation fins are located outside the contour of a base as seen from a side on which an axial flow fan unit is mounted. Then, the axial flow fan unit is so constructed as to discharge air along the portions of the radiation fin located outside the contour of the base.

Abstract: An electronic apparatus includes a housing, a first heat-generating member provided in the housing, a heat-radiating member thermally connected to the first heat-generating member, a first fan module guiding air to the heat-radiating member, a second heat-generating member provided in the housing, a second fan module discharging air out of the housing, and a wall section provided in the housing, located between the first fan module and the second fan module.

Abstract: The present invention is related to an extendible and flexible heat-dissipation air conduit base as computer heat dissipation device. The invention mainly comprises an air conduit and fixtures. The air conduit is hollow and flexible with fixtures at both ends. Each fixture is in rectangle shape and connects with the air conduit through a circular hole. The fixture also has several positioning holes and through holes for metal wire to pass through and secure the air conduit with the fixture. By this design, the fixture at one end of the air conduit connects to a heat dissipation fan for CPU. Thus, it provides an excellent heat dissipation channel for computer CPU and helps to achieve the desirable heat dissipation effect.

Abstract: A die carrier has a body with a primary surface adapted for attachment to a substrate die. The body at least partially defines a fluid chamber. A fill port and an evacuate port are each fluidically connected to the fluid chamber.

Abstract: A thermo-electro sub-assembly comprises a gas supply, a first duct, a first heatsink adjacent a first device, a second duct, and a second heat sink adjacent a second device. The gas supply may be realized as a fan, a blower, or a compressed gas source. The first duct provides a passageway for delivering pressurized gas from the gas supply to the first heat sink. The duct may include a plurality of vanes for reducing the turbulence and air boundary separation within the duct. The first heatsink is in thermal communication with a first heat-producing device such as a microprocessor. In a preferred embodiment the heatsink comprises an axial shaped folded fin heatsink. The second duct is used to provide a pathway for the air leaving the first heatsink and delivers the air to the second heatsink. The second duct may also include a plurality of vanes for reducing turbulence and boundary flow separation within the second duct.

Abstract: The present invention provides a heat sink assembly. The heat sink assembly comprises a first heat sink with a fan disposed therein, a second heat sink and a heat pipe. The heat pipe has two ends respectively being disposed inside the first heat sink and the second heat sink, The heat pipe is disposed in a side of the first heat sink and the second heat sink and connects the first heat sink and the second heat sink with a space therein for positioning the fan. Therefore, the first heat sink and the second heat sink become a main heat-dissipating region and a sub heat-dissipating region. Heat is dissipated first in the first heat sink (the main heat-dissipating region) and then transferred via the heat pipe to the second heat sink (the sub heat-dissipating region) for being dissipated again.

Abstract: Numerous embodiments of a channeled heat dissipation device and a method of fabrication are disclosed. In one embodiment, a channeled heat dissipation device comprises a base portion having a dissipation surface and a substantially opposed mounting surface, and at least one channel defined in the base portion, wherein said at least one channel extends from said dissipation surface to said mounting surface.

Abstract: An integrated heat-dissipating module includes a heat-dissipating device substantially in contact with a main heat-generating source on a motherboard, a casing capping over the main heat-generating source and substantially in contact with sub heat-generating sources installed around the main heat-generating source, and a heat-dissipating fan installed on a first vent of the casing. The heat produced by the main heat-generating source is transmitted to the air inside the casing via the heat-dissipating device. Then, the hot airflow concentrated within the casing is expelled from a second vent of the casing by the heat-dissipating fan. The casing is made of a high heat conducting material and has a plurality of external heat-dissipating fins extending outward from an outer surface of the casing for quickly transmitting the heat generated by the sub heat-generating sources to the outside. Heat produced by the main heat-generating source and the sub heat-generating sources is dissipated simultaneously.

Abstract: A system and a method for using parallel heat exchangers to disperse heat from a mobile computing system are disclosed. In one possible embodiment, multiple heat exchangers are thermally coupled to a thermal attach platform. Multiple remote heat exchangers may be thermally coupled to the thermal attach platform using a heat pipe for each remote heat exchanger or a single heat pipe for all the remote heat exchangers. In one embodiment, the thermal attach platform may be a copper block or a heat pipe chamber. An air circulation unit may be coupled adjacent to each remote heat exchanger. Direct attachment heat exchangers may be directly attached to the thermal attach platform. An air circulation unit, such as a fan, may be coupled adjacent to the direct attachment heat exchanger, either vertically or horizontally.

Abstract: An integrated crossflow cooler for electronic components comprises a heatsink with at least two openings, a crossflow blower and an electric drive with a stator and a magnetized rotor. The heatsink comprises a base and heat exchanging means; the base provides thermal contact with the electronic component and the heat exchanging means. The crossflow blower hydraulically connected to one of the openings and comprises a casing rigidly built-in to the heatsink and a drum type impeller comprises magnetic means and serves as a magnetized rotor of the electric drive. The stator made as printed circuit board and rigidly built-in to the casing. The integrated crossflow cooler comprises two types of electric drives—when the magnetic means magnetized in the direction parallel to the axis of rotation and when the magnetic means magnetized in the direction perpendicular to the axis of rotation.

Abstract: The present invention is a heat sink with guiding fins comprising a base with a plate part, wherein each side of a pair of two opposite sides of the plate part comprises a declining part; and two groups of fins expanded upwardly from each said declining part, wherein a channel whose top width is wider than its bottom width is form by the tow groups of fins and the base and there is a gap properly set between each two fins. By doing so, the heat sink can guide the flow generated by a fan to form a streamline with pressure and so obtains smaller wind resistance and better heat dissipation for the heat sink.

Abstract: A heat transfer structure includes a heat transfer module having a plurality of heat transfer members in the duct chamber with the density increased in the direction of the flow of the coolant and having a greatest density adjacent to the position of a heat source attached in thermal contact with the heat transfer module. The profile of the duct chamber is adjusted to the position of the heat source to increase the velocity of coolant directly under the heat source and to partially or completely block the coolant flow to the areas which do not need to be temperature adjusted. The heat transfer members may be formed as pin fins fabricated from springs compressed to a predetermined density in a direction perpendicular to the longitudinal axis of the spring (and/or in parallel to the longitudinal axis of the heat transfer module).

Abstract: A flip chip structure contains laterally spaced semiconductor devices such as MOSFETs in a common chip. A deep trench isolates the devices. Contacts are connected to the source drain and gate electrode (or other electrodes) and are interconnected as required for a circuit function either within the chip or on the support board. Ball contacts are connected to the electrodes. The opposite surface of the chip to that in which the devices are formed receives a copper or other metal layer which is patterned to increase its area for heat exchange. The surface of the copper is coated with black oxide to increase its ability to radiate heat.

Abstract: Structures that provide decoupling capacitance to packaged IC devices with reduced capacitor and via parasitic inductance. A capacitive interposer structure is physically interposed between the packaged IC and the PCB, thus eliminating the leads and vias that traverse the PCB in known structures. A capacitive interposer is mounted to a PCB and the packaged IC is mounted on the interposer. The interposer has an array of lands on an upper surface, to which the packaged IC is coupled, and an array of terminals on a lower surface, which are coupled to the PCB. Electrically conductive vias interconnect each land with an associated terminal on the opposite surface of the interposer. Within the interposer, layers of a conductive material alternate with layers of a dielectric material, thus forming parallel plate capacitors between adjacent dielectric layers. Each conductive layer is either electrically coupled to, or is electrically isolated from, each via.

Abstract: Plural CPUs 20-1 through 20-6 are mounted on a circuit board 11, and heat sinks 30-1 through 30-6 are mounted on these CPUS, respectively. The CPUs 20-1 through 20-6 are cooled by an air flow generated by motor fan units 14-1, 14-2, 15-1, and 15-2. The CPUs 20-1 through 20-6 are arranged such that a ratio of a sectional clearance area at the downstream side of the air flow to a sectional area of a tunnel 12 is lower than a corresponding ratio at the upstream side of the air flow. This clearance is formed between a cover member 13 and the heat sinks 30-1 through 30-6. Air flow passages 85 and 86 are formed at both sides at the upstream side. By the air flow passages 85 and 86, the amount of fresh air that is sent to the heat sinks 30-5 and 30-6 at the downstream side is increased. Accordingly, the cooling of the CPUs 20-5 and 20-6 at the downstream side is promoted compared to the conventional case.

Abstract: A stackable heat sink comprising a plurality numbers of metal heat dissipation plates, the heat dissipation plate further comprises a bottom plate, two side plates facing each other locates on both sides of the bottom plate, a bending area is bent from the top of the side plate, two standing plates stretches up from the bending area and facing another standing plate, two fastening plates each is formed on the proper location on the standing plate, the fastening plate is bendable and forms a bending line with the standing plate; two fastening crevices each is located on the junction of the bottom plate and the side plate.

Abstract: A heat sink for free convection cooling in horizontal applications is provided. Specifically, the heat sink includes a plurality of spaced apart cooling fins, which are supported by an angled base. The cooling fins are transversely attached to the base and extend in a substantially vertical direction. In addition, the cooling fins extend beyond an outer edge of the base so that air can flow horizontally beneath the base and then vertically through the spaced apart cooling fins.

Abstract: A double-winged radiator for central processing unit (CPU) includes a heat-transfer block mounted on a top of a CPU that produces a large amount of heat during an operation thereof, and two sets of first radiator fins fixed to two outer ends of at least one heat-transfer tube that is seated on a top of the heat-transfer block. The heat produced by the CPU and transferred to the heat-transfer block is further transferred via the heat-transfer tube to the two sets of first radiator fins that provide large radiating area and high radiating efficiency to allow quick dissipation of heat therefrom. A locating member may be mounted on and between the two sets of first radiator fins to protect the latter from deformation under pressure. One set of second radiator fins may be mounted between the two sets of first radiator fins to provide increased radiating area and efficiency.

Abstract: The present invention provides a radiator that consists of a plurality of f ins, one side of each fin has at least one wing parallel relative to the side, the wing is disposed spaced from the fin. The wing has protruding parts disposed approximately perpendicularly to the wing. The fin has slots positioned relative to a corresponding protruding part. The protruding parts engage with the slots and the protruding parts are bent such that the fins are combined into a radiator. The radiator has following characteristics: simple structure, easily assembled, robust, easily formed, and material-saving.

Abstract: A fan-securing device secures a fan to a heat transfer device that allows for the rapid removal of the fan without disturbing the remainder of the heat transfer device. The fan-securing device includes a base, a fastener for securing the body base to the heat transfer device, and compression tabs for securing the fan to the base.

Abstract: A heat sink is for an element to be cooled has a thermally conductive base and a plurality of thermally conductive pins or fins extending substantially perpendicular from the base, said pins or fins being arranged in a predetermined pattern. The pins at least partially frame thermally conductive projections extending substantially perpendicular from said base which forming a discernable logo having an upper surface and sides for providing plural cooling surfaces. In this instance the 3-D logo performs cooling of the components within a package.

Abstract: A power component assembly for mechatronic integration of power components is disclosed. The assembly includes a circuit board on which a plurality of bare power components is arranged. At least one cooling element is connected to a pressure-mounting frame that holds the power components in thermal contact with the cooling element(s). Heat generated by the power components is thereby dissipated by the cooling element(s).

Abstract: A heat dissipation apparatus is described. The heat dissipation apparatus reduces noise of a notebook computer. The apparatus comprises a heat sink, at least one heat pipe, at least one heat column, a plurality of heat exhausting fins, and at least one fan device. The heat sink catches the heat energy on the central processing unit of the notebook computer. The heat energy is transferred from the heat sink to the heat pipes, and then to the heat columns. The heat columns delivers the heat energy to the heat exhausting fins parallel to each other in a vertical direction and the fan device blows the heat out of the computer. The fan device has an outlet angle aligned with an inlet angle of the heat exhausting fins, and therefore the noise of the computer is reduced. In particular, a heat plate is coupled between the heat columns and the heat pipes. Hence, the heat can be more efficiently delivered to the heat exhausting fins directly from sidewalls of the heat exhausting fins and by way of the columns.

Abstract: A heat-dissipating device includes a hollow heat-transfer member adapted to be disposed on a heat-generating source and confining a vacuum sealed chamber therein, an amount of coolant medium contained in the vacuum sealed chamber for heat exchange, and a plurality of heat-dissipating fins provided on the heat-transfer member. The vacuum sealed chamber has a wider section, a narrower section, and a neck section between the wider and narrower sections. The neck section hampers movement of the coolant medium from the wider section to the narrower section when the heat-transfer member is tilted from an upright position, where the narrower section is disposed above the wider section.

Abstract: A cooling fan device for mounting on top of parallel radiation fins of a radiator. The device includes a seat having a driving section, and an air-guiding fan pivotally connected to the driving section of the seat and including a hub and blades generally radially spaced around an outer periphery of the hub. Supporting sections are extended from two opposite sides of the driving section in directions parallel with the radiation fins of the radiator to support the driving section in the seat. With the supporting section in parallel with the radiation fins, flowing air produced by the air-guiding fan is allowed to flow toward the radiator without hindrance.

Abstract: A base of LED includes a negative pole seat and a positive pole seat. The negative pole seat is made of conductive material with a flat negative pole plate at a lower outer side thereof, an integral negative pole body at an inner side thereof, multiple upright negative pole seat grooves at two lateral sides thereof and a negative pole recess at the top thereof respectively. The positive pole seat also is made of conductive material with a flat positive pole plate at the lower outer side thereof, an integral positive pole body at the inner side thereof, multiple seat grooves extending upright from the bottom at two lateral sides thereof. A crystal grain is located at the negative pole recess and a connecting wire at both ends thereof joined to the positive pole seat and the crystal grain and the negative pole plate and the positive pole plate are adhered to circuit of a circuit board to form a close circuit.

Abstract: A two piece electronic component heat sink and device package comprising a first piece configured to retain electronic components, and a second piece having a hinge region configured to moveably connect the second piece to the first piece, and a snap lock region opposite the hinge region, the snap lock region configured to secure the second piece to the first piece. A two piece electronic component heat sink and device package for a circuit board comprising: a first piece having an index slot for retaining said circuit board, and a second piece having a hinge region configured to pivotably connect the second piece and the first piece, and a snap lock region configured to secure the second piece to the first piece.

Abstract: A heat sink that dissipates heat from an electronic device. The heat sink includes a base that is adapted to be thermally coupled to the electronic device, and a fin that is thermally coupled to the base. The fin includes a first portion made from a first material and a second portion made from a second material. One edge of the first portion and an opposing edge of the second portion form at least one of a lap joint and a butt joint between the first portion and the second portion. In some forms, the first portion of the fin is a copper portion that is thermally coupled to a copper base to conduct thermal energy away from the base, and the second portion of the fin is aluminum.

Abstract: An apparatus and a method for providing a heat sink on an upper surface of a semiconductor chip by placing a heat-dissipating material thereon which forms a portion of a glob top. The apparatus comprises a semiconductor chip attached to and in electrical communication with a substrate. A barrier glob top material is applied to the edges of the semiconductor chip on the surface (“opposing surface”) opposite the surface attached to the substrate to form a wall around a periphery of the opposing surface of the semiconductor chip wherein the barrier glob top material also extends to contact and adhere to the substrate. The wall around the periphery of the opposing surface of the semiconductor chip forms a recess. A heat-dissipating glob top material is disposed within the recess to contact the opposing surface of the semiconductor chip.

Abstract: An electronic apparatus comprises a housing containing a heat-generating component, and a cooling unit. The cooling unit includes a heat sink thermally connected to the heat-generating component, a first air passage for guiding air outside the housing to the heat sink and guiding air heated by heat exchange with the heat sink to the outside of the housing, and a second air passage for guiding air within the housing to the outside of the housing.

Abstract: The assembly includes a mother board having a processor carrier having a processor attached thereto. A heat sink is thermally coupled to the processor carrier and is located on top of the carrier. A voltage regulating module board is electrically coupled to the processor carrier and is configured to be positioned adjacent to the heat sink and at substantially a right angle to the mother board.