Abstract: An active heat sink structure includes at least one heat sink. Each heat sink includes a heat sink base having a top surface with a top surface periphery, a top surface center at a central portion of the top surface, and an oppositely disposed bottom surface. The top surface is preferably flat. The heat sink may be described in relation to a first reference line lying in the top surface and a second reference line lying in the top surface and perpendicular to the first reference line. Where there is more than one heat sink, the heat sinks lie adjacent to each other along the first reference line. A plurality of air flow paths are defined on the top surface of the heat sink base, preferably by fins extending perpendicular to the top surface. Substantially all of the air flow paths direct a flow of air from the top surface center toward the top surface periphery and substantially parallel to the second reference line.

Abstract: Electronic equipment comprises a wiring board, an electronic component mounted on the wiring board and having a heat dissipation portion on a surface thereof, and an insulating heat dissipation plate thermally connected to the electronic component, wherein the heat dissipation portion is directly connected to the heat dissipation plate via a heat conductive bonding material that includes metal. The heat dissipation plate is a ceramic plate having at least one land for connecting the electronic component thereto, or a resin plate containing highly heat conductive material. By directly connecting the insulating heat dissipation plate to an electronic component generating heat, an insulating plate between the heat dissipation plate and the electronic component is not required.

Abstract: A knock down heat sink, and more particularly, to one that comprised of multiple fins overlapped among one another into a stack and a specific spacing is defined between any two abutted fins to provide good heat dispersion and form a reliable heat sink allowing extension as desired for production cost reduction, increased production capability and easier assembly.

Abstract: A heat sink for cooling electrical or electronic devices comprises a spreader plate having a top surface and having a bottom surface for attaching to the electronic device. A folded fin formed from a strip of heat conducting material comprising alternating planar portions and curved portions has one edge abutted to the top surface such that the curved portions extend upwardly from the top surface substantially at a right angle.

Abstract: Numerous embodiments of a channeled heat dissipation device and a method of fabrication are disclosed. In one embodiment, a channeled heat dissipation device comprising a base portion having a dissipation surface and a substantially opposed mounting surface, and at least one channel defined in the base portion, wherein said at least one channel extends from said dissipation surface to said mounting surface.

Abstract: A heat dissipation device includes a heat sink (20), heat pipes (30), a frame (40), and a fan (50). Each heat pipe has a lower first connecting portion (32) and an upper second connecting portion (34). The heat sink includes a base (21), and parallel fins (27) attached on the base. The base includes a top plate (25), and defines a hermetically sealed chamber. Apertures (23) are defined in one side wall (22) of the base, the apertures receiving the first connecting portions. Through holes (29) are transversely defined through the fins, the through holes receiving the second connecting portions. The frame includes an upper plate (41), and two side plates (47). Two arms (49) of each side plate secures the frame on the heat sink. In operation, working liquid in the chamber transfers heat to the top plate and to the second connecting portions by phase transition.

Abstract: In a semiconductor integrated circuit device and a semiconductor integrated circuit chip, being provided for achieving small-sizing and light-weight of the entire cooling structure thereof, without lowering the permissible temperature for an integrated circuit package, a circuit forming layer 2, on which are formed a large number of circuits, is formed on one side surface of a plate-like semiconductor chip 101, and on the other side surface opposing to that forming the circuits thereon, a heat transfer layer 15 is connected with in one body. This heat transfer layer 15 is made of a material similar to that of the semiconductor chip, and within an inside thereof are formed passage ducts 3 to build up a closed flow passage. Within this closed flow passage is enclosed an operating fluid 4, such as, a water or the like, and is provided a resistor film 5 for building up a driving means of the operating fluid, in contact with the operating fluid.

Abstract: A heat sink comprises a base portion, and a multiplicity of thin plate fins erected on the base portion in parallel with each other. The fins are folded in two at their lower ends to form two-ply portions and are fixed by having the two-ply portions inserted into grooves formed in the base portion.

Abstract: Heat dissipating IC devices including at least one IC die comprising a semiconductor substrate with circuitry which utilize thermoelectric effects to more effectively dissipate thermal energy from electronic circuits.

Abstract: A heat dissipating assembly (1) includes a plurality of fins (10), three heat pipes (20), and a base (30). Each fin defines three through holes (11) across a middle portion thereof. A plurality of dome-shaped protruding portions (14) is formed in each fin. The protruding portions are arranged in a regular array of offset rows. Adjacent protruding portions in any row protrude from front and rear faces of the fin in a regular alternating configuration. One end of each heat pipe is respectively inserted into the corresponding through holes of the fins, and an opposite end of each heat pipe is attached in the base. The base is attached on an electronic device, for absorbing heat produced by the electronic device. The protruding portions increase a heat dissipating surface area of the fins, and deflect airflow that passes across the fins in a direction parallel to the fins.

Abstract: A tandem heat sink operable to provide heat dissipation to one or more electronic components. The tandem heat sink apparatus creates air turbulence within the air stream across the one or more components through the use of pins oriented at more than one angle with respect to the base of the tandem heat sink. An airflow across one or more electronic components is disrupted by the geometry of the different pin angles of the tandem heat sink, thereby creating turbulence which increases the efficiency of the heat sink and prevents thermal shading from occurring. When the heat sink is placed on a single component, the heat sink may be situated without any overhang relative to the component due to the turbulence induced by the different pin angles and the resulting increase in heat dissipation efficiency.

Abstract: A heat dissipation device is mounted to an edge of a circuit board for removing heat from an electronic device mounted on the circuit board. The heat dissipation device includes a contact pad made of thermally conductive material and positioned on the electronic device. A top-and-bottom fan structure includes a casing defining an air passage in fluid communication with a front opening to which a heat sink is mounted and top and bottom openings to which top and bottom fans are respectively mounted. Heat pipes extend between the contact pad and the heat sink. Air is sucked into the casing by the fans and flows through the air passage to the heat sink for carrying heat away from the heat sink. The casing is mounted to an edge of the circuit board with the top and bottom fans respectively located above and below the circuit board. Side openings are defined in the casing for discharging air into upper and lower sides of the circuit board for simultaneously cooling the upper and lower sides of the circuit board.

Abstract: A fin structure is disclosed. The fin structure includes a first concavo-convex portion formed with a concave on a first surface of the fin in the direction of thickness and a corresponding convex on a second surface of the fin in the direction of thickness. Besides, a second concavo-convex portion formed with a first concave and second concave on the first surface of the fin in the direction of thickness and a corresponding first convex and a corresponding second convex on the second surface of the fin in the direction of thickness is included as well. Specifically, the first and second concavo-convex portions are symmetrical respect to the center of the fin. Furthermore, the second convex of the second concavo-convex portion on one fin can be exactly received by the concave of the first concavo-convex portion on another fin.

Abstract: A cooling fin assembly according to the invention includes a plurality of cooling fins joined with one another for forming a plurality of vertical and parallel cooling fins mounted on a base of a heat sink. Wherein, two sides at a bottom portion of a main body of each cooling fin are provided with a clasp piece, respectively, a bottom edge of the main body is transversely extended and formed with a connecting piece, and an edge of the connecting piece is further formed with a positioning piece by folding upward. When a second cooling fin is butted against a side edge of the positioning piece of a second cooling fin, the clasp piece of the second cooling fin is clasped at the positioning piece of the first cooling fin, thereby fastening and joining the cooling fins to one another.

Abstract: The present heat dissipation device is provided with a fan frame and a blade structure. The fan frame includes an air inlet, an air outlet, and a curved portion. The air inlet has a non-circular indentation in the vicinity of the curved portion corresponding to the airflow passage. This indentation effectively increases the airflow amount and static pressure of the airflow expelled from the heat dissipation device.

Abstract: A highly efficient heat sink, comprised of a seat, a heat insulation plate, a heat conduction plate and heat dispersion plates. The heat insulation plate and the heat conduction plate are respectively extended from both ends of the seat, the heat insulation plates and heat conduction plate are each curved inward to form heat dispersion plates. An air conduction outlet is provided where the heat dispersion plate is respectively connected to the heat insulation plate and heat conduction plate, and an air vent is provided in the inner side to allow air circulation on each plane of the heat dispersion plate, the heat insulation plate and the conduction plate without heat accumulation inside the sink.

Abstract: A method of forming a Fin structure including a resistor present in the thin vertically oriented semiconductor body is provided. The method includes the steps of forming at least one vertically-oriented semiconductor body having exposed vertical surfaces on a substrate; implanting dopant ions into the exposed vertical surfaces of the at least one semiconductor body off-axis at a concentration and energy sufficient to penetrate into the exposed vertical surfaces of the at least one semiconductor body without saturation; and forming contacts to the at least one semiconductor body. The present invention is directed to a Fin structure which includes a resistor present within the thin vertically oriented semiconductor body.

Abstract: A heat removal system comprising a gas supply, a duct, and a heatsink is presented. The gas supply may be realized as a fan, a blower, or a compressed gas source and is located remotely from the heatsink. The duct provides a passageway for delivering high velocity gas from the gas supply to the first heat sink. The duct includes a plurality of vanes for reducing the turbulence and air boundary separation within the duct. The heatsink is in thermal communication with a heat-producing device such as a microprocessor.

Abstract: A semiconductor package including a conical or pyramidal vapor chamber body coupled to a package bottom to enclose a vapor chamber within which are disposed a semiconductor die and working fluid. A matching conical or pyramidal heatsink is coupled to the vapor chamber body. The conical or pyramidal shape allows a tight fit and good thermal performance, without undue force being applied to the package bottom, and further allows a variety of heatsinks to be used with a standardized shape vapor chamber body.

Abstract: A heat dissipation assembly includes a fan (10), a mounting bracket (20), a clip (30), a heat sink (40), and a mounting frame (50). The fan is mounted to the mounting bracket. The clip is bent from an elongated thread or rod of wire or suitable wirelike material. The clip includes a central horizontal part (302), and a pair of resilient arms (304) extending perpendicularly from opposite ends of the horizontal part. A groove (402) is laterally defined through parallel fins (403) of the heat sink, and receives the horizontal part of the clip therein. The combined fan and mounting bracket is attached to the combined heat sink and clip to form a subassembly. Thus, the clip is secured in the heat sink in advance. The subassembly is received in the mounting frame. Two apertures (504) of the mounting frame respectively engagingly receive two hooks (306) of the resilient arms.

Abstract: An integrated circuit heat dissipation system for reducing the number of junctions in packaged integrated circuits thereby decreasing thermal impedance and increasing thermal dissipation efficiency. The integrated circuit heat dissipation system includes a lid attached to a substrate, a cap attached about the lid creating a heat dissipation chamber, and a semiconductor chip attached to the lid by a thermally conductive adhesive. The lid may or may not form a cavity about the semiconductor chip depending upon the substrate utilized. The lid preferably includes a plurality of fins extending from thereof defining a plurality of channels or a plurality of grooves thereby increasing the heat flux of the lid.

Abstract: A heatsink and a heatsink device using the heatsink are provided. The heatsink is formed of a plurality of thin heatsink plates, and the individual heatsink plates are bound to one another to be radially spread out, thereby enlarging the surface area of the heatsink and increasing its heat-dissipating efficiency. In the heatsink device, the heatsink is installed in an air duct, and cool air is supplied into the air duct by a fan, to thereby further increase the heat-dissipating efficiency. The binding force of the heatsink to a heat-generating source can be elastically maintained, which allows the heatsink to remain bound to the heat-generating source even after an external impact. In addition, by cutting out an upper portion of the heatsink plate, folding lines of the heatsink plate are shortened so that the heat-absorbing portions of the heatsink plates stacked upon one another can be tightly joined to form a heatsink by a reduced force.

Abstract: A heat sink apparatus includes a heat sink having a plurality of circuit board component contact portions and a plurality of fin portions extending from the contact portions. The circuit board component contact portions of the heat sink conform to a surface of the circuit board component when coupled to the circuit board component, thereby providing a thermal coupling between the fin portions of the heat sink and the associated circuit board component. The heat sink apparatus also includes a retainer, such as a double buckling beam retainer, that secures the heat sink to the circuit board component. The retainer causes the circuit board component contact portions of the heat sink conform to the surface of the circuit board component, thereby providing thermal contact between the heat sink and circuit board component contact portions and alleviating the need for a base portion associated with the heat sink, as in conventional mechanisms.

Abstract: A spring spacer assembly maintains thermal contact between a thermal transfer surface of a heat sink and a heat-generating electrical component mounted on a printed circuit board between the printed circuit board and the thermal transfer surface. The spring spacer assembly comprises a face defining a fixation segment and a deflectible finger extending from the fixation segment, and a fixation element for securing the face to the heat sink. A spacer extends from the fixation segment for passage through the printed circuit board into abutment with the thermal transfer surface. A protrusion extends from the finger for passage through the printed circuit board into contact with the heat-generating electrical component. The finger is biased toward the thermal transfer surface and urges the heat-generating electrical component into thermal contact with the thermal transfer surface. The fixation element secures the face to the heat sink with the spacer secured in abutment with the thermal transfer surface.

Abstract: A heat sink for dissipating heat from an electronic component includes a core and a plurality of fins extending outwardly from the core. The fins may be at least partially curved. Each fin may split into a plurality of tines that extend away from the core.

Abstract: A CPU cooling structure is constructed to include a heat sink adapted for mounting on a motherboard to absorb heat from a CPU of the motherboard, a fan provided above the heat sink and adapted for causing currents of air toward the heat sink to carry heat away from the heat sink, and a flow guide mounted on the heat sink to hold the fan above the heat sink, the flow guide having two flow guide holes and an air damper suspended in between the flow guide holes and adapted for guiding air from the fan toward the center area of the heat sink for enabling air to flow through air passages in the heat sink in reversed directions to carry heat away from the heat sink.

Abstract: A plate-like heat sink module with polygonal ground plan or shape has an upper side for securing a heat generating component and an underside comprises cooling ribs. The outside edges of the module have surface structure complementary with one another and with whose assistance a plurality of the identical heat sink modules can be joined in one plane, whereby the surface structures are fashioned so that a heat sink module can be joined to another heat sink module in only one orientation to form an arrangement of the heat sink modules. As a result of the arrangement of heat sink modules, a heat sink for the interconnection of a plurality of capacitors to form a capacitor bank can be produced in an especially flexible way.

Abstract: A side-exhaust heat dissipation module for cooling an electronic device. The side-exhaust heat dissipation module comprises a base, a fan, a fin assembly and an airflow guiding cover. The fan is disposed on one side of the base. The fin assembly is disposed on the base and composed of a plurality of parallel fins. The fin assembly has a concave end spaced from the fan by a predetermined distance. The airflow guiding cover is disposed on the fin assembly. The airflow guiding cover is gradually expanded and extended from the fan to cover the fin assembly.

Abstract: The heat-sink assembly of the invention is attached to the PC board with the use of surface mount technology. The assembly comprises a base part or a base member soldered to the PC board and a top part or a heat-sink member snapped-on through the central opening of the base member by irreversibly deforming bendable lugs which may have a radial or any other suitable shape. The bottom of the heat-sink member may be pushed down to physical contact with the top of the chip or to a position that leaves a space between the bottom of the heat-sink member and the top of the chip, so that the aforementioned space may be filled with a heat-conducting medium. It is an option to use the base part only. If necessary, a second heat-sink member of the same type, which could have different dimensions, can be soldered to the PC board side opposite to the chip. The heat sinks could be used with or without a fan.

Abstract: Methods and apparatus are provided for sealing and reducing warpage in a microsystem device. The microsystem device is assembled with a substrate and packaged.

Abstract: The present invention is directed to a ventilating or cooling element for airflow cooling in a digital data processing apparatus, and it is particularly suited to such apparatus having a high circuit density, or mounted within a restricted chassis or housing, such as the housing of a web server, or of a storage array device for a network server or web server. The cooling element includes a fan that is disposed at an angle to integrate its cooling air with general circulation or air flow through the chassis. The element may mount on a plate, such as the thermally conductive plate of a heat sink, that is adapted for coupling to the chassis and/or contacting a microprocessor chip, and a fan is disposed on the mounting plate at an angle to cool the plate or chip without creating obstructive cross wind. The mounting plate can be disposed within the middle portion of the chassis. The fan or cooling element can be angled so as to direct airflow towards at least a selected portion of the chassis, e.g.

Abstract: A cooler for an electronic device of the present invention is provided with a heatsink and a cross flow blower with an electric motor. The heatsink comprises a base and heat exchanging means made as flat disks, fins or flat plates. The base provides thermal contact with the electronic device and the heat exchanging means. The cross flow blower comprises a drum type impeller with an axis of rotation substantially normal to the base. The flat disks substantially perpendicular to the axis of rotation and located inside of the drum type impeller. The fins or flat plates substantially perpendicular to the axis of rotation and located outside of said drum type impeller. The heatsink further comprises heat-spreading means that provide thermal contact between the base and the flat disks and flat plates. The heat-spreading means may be heat-pipes.

Abstract: A heat sink with fins comprising a group of heat dissipating fins which comprise combination of heat dissipating fins made of at least two kinds of metals having different heat conductivity, and a metal base plate on which surface portion the group of heat dissipating fins are densely jointed.

Abstract: A cooling device includes a heat sink assembly that may also form a housing surrounding a chamber. The housing may be constructed of a plurality of cooling vanes which have elongated openings therebetween allowing air to pass between and cool the vanes. The cooling device operates in an extremely efficient manner, for example, by causing air to pass over the cooling vanes twice.

Abstract: A method, apparatus, and article of manufacture for improving the thermal efficiency for heat transfer from an electronic device using a vortex heatsink arrangement. The apparatus comprises a fin array having a plurality of fins and having a variable fin density, the fin array including a first fin array region proximate to and in thermal contact with the heat dissipating device; a second fin array region distant from the heat dissipating device. The first fin region includes a first fin density and the second fin region includes a second fin density less than the first fin density.

Abstract: A bladed heat sink. The sink includes a connecting board, a plurality of blades, a frame and at least one reinforcing rib. The connecting board is enclosed by the frame. The blades radiate from the connecting board to the frame. Furthermore, the blades are disposed in layers and spaced apart, thereby allowing an airflow to pass between the blades. The blades are also reinforced by the reinforcing rib.

Abstract: A tandem heat sink operable to provide heat dissipation to one or more electronic components. The tandem heat sink apparatus creates air turbulence within the air stream across the one or more components through the use of pins oriented at more than one angle with respect to the base of the tandem heat sink. An airflow across one or more electronic components is disrupted by the geometry of the different pin angles of the tandem heat sink, thereby creating turbulence which increases the efficiency of the heat sink and prevents thermal shading from occurring. When the heat sink is placed on a single component, the heat sink may be situated without any overhang relative to the component due to the turbulence induced by the different pin angles and the resulting increase in heat dissipation efficiency.

Abstract: The present invention discloses improved heatsink designs and methods for cooling a heat source. One embodiment is a heatsink assembly for removing heat from an electronic component, the heatsink assembly comprising a copper-based core section having a first surface generally adapted to conform to an exposed mating surface of an electronic device and a second surface having a generally convex curvature having a greater surface area than the first surface. An aluminum-based outer section has a first surface comprising a concave curvature that is generally adapted to conform to the convex curvature of the core and a second surface. A plurality of fin elements protrude outwardly from the second surface of the outer section. At least one cooling fan can be positioned to direct airflow onto the fin elements. The core section can comprise a semi-spherical shape and can be joined by a finger-joint type connection to the outer section.

Abstract: The heat dissipation device includes a frame and an impeller. The frame has an inlet and an outlet, in which the inlet has a noncircular shape. The inlet can be provided with a blocking board so as to be noncircular. The blocking board suppresses airflow dissipated from a high pressure region of the airflow path in order to enhance outgoing airflow.

Abstract: A design and method for fabricating a foil heat sink including a fin body, wherein the fin body includes a plurality of heat sink fins having a fin head and a fin foot and wherein the plurality of heat sink fins are disposed in a parallel fashion so as to form a plurality of horizontal channels between the plurality of heat sink fins, a fin support, wherein the fin support includes a plurality of fin support structures disposed between the plurality of heat sink fins so as to separate the plurality of heat sink fins and wherein the plurality of fin support structures are disposed adjacent to the fin head so as to form a plurality of vertical channels between the plurality of heat sink fins, and a fin base, wherein the fin base includes a plurality of fin spacers disposed between the plurality of heat sink fins so as to separate the plurality of heat sink fins and wherein the plurality of fin spacers are disposed so as to be adjacent to the fin foot.

Abstract: A heat dissipating assembly (1) includes a plurality of fins (10), three heat pipes (20), and a base (30). Each fin defines three through holes (11) across a middle portion thereof. A plurality of dome-shaped protruding portions (14) is formed in each fin. The protruding portions are arranged in a regular array of offset rows. Adjacent protruding portions in any row protrude from front and rear faces of the fin in a regular alternating configuration. One end of each heat pipe is respectively inserted into the corresponding through holes of the fins, and an opposite end of each heat pipe is attached in the base. The base is attached on an electronic device, for absorbing heat produced by the electronic device. The protruding portions increase a heat dissipating surface area of the fins, and deflect airflow that passes across the fins in a direction parallel to the fins.

Abstract: This invention relates to a radiator fin formed by sintering operation, which comprises a base board formed by means of powder metallurgical sintering and a radiator fin formed by the bent metal sheet. The base board has a plurality of equidistant trenches. The radiator fin is bent in the form of continued rectangles to form a hollow grille with multiple segments. The bottom segment of the radiator fin is milled into a slot, which is fit into the base board. The middle of the base of the said radiator fin is fit perfectly into the trench on the base board. By dint of skrinkage occurred during the sintering operation of the base board, and becomes an integral part of the base board.

Abstract: Heat dissipation systems and structures which are employed in the cooling of electronic devices and/or semiconductor integrated-circuit chips which are installed in computer and/or communications systems. Moreover, disclosed is a method for implementing the heat dissipation systems and structures.

Abstract: A clamp and heat block assembly for wire bonding a semiconductor package assembly. The package assembly has a semiconductor chip having a plurality of bond pads on an upper surface the chip, a chip paddle secured to a bottom surface of the chip by an adhesive, a plurality of tie bars being connected to corners of the chip paddle and externally extending from the chip paddle, a plurality of leads radially formed at regular intervals along and spaced apart from the chip paddle and extending towards the chip paddle. The package assembly further includes a plurality of conductive wires electrically connected to the leads and the chip. The heat block assembly includes a heat block, a guide block, and a clamp. The guide block has a raised portion for receiving the heat block, which has a groove mating with the raised portion of the guide block. The guide block and heat block are secured to the package assembly by the clamp, which engages the package assembly on an upper surface of the leads.

Abstract: A heat dissipating device includes a plurality of plates each having a three-sided base plate portion and a pair of fin plate portions. The base plate portion has a contact side adapted to contact a heat generating object, and two opposite sides forming an angle therebetween and extending to two opposite ends of the contact side. The base plate portions of the plates are disposed in parallel and next to each other to form a stack. The fin plate portions respectively extend outward from the opposite sides of the base plate portions and are bent from the base plate portions to diverge outward and to form air passages therebetween. The heat dissipating device provides a high ratio of the area of the base plate portions to the area of the fin plate portions so that the stack is compact while the fin plate portions maintain a sufficient heat transfer surface area.

Abstract: A heat sink assembly includes a fixing device (10), a fin member (40), and a fan (50). The fixing device is integrally formed by extruding aluminum. The fixing device includes a base (12), two side plates (16) extending upwardly from opposite sides of the base, and an upper plate (18) connecting the side plates and being parallel to the base, thereby defining a space therebetween accommodating the fin member. Four threaded holes (22) are defined in four corners of the upper plate of the fixing device. The fin member is formed by continually bending a metal sheet to yield a concertina-like structure. The fan is box-shaped, and has four through holes (52) defined in four corners thereof. Four screws (60) extend through the through holes of the fan and engage in the threaded holes of the fixing device, thereby attaching the fan to the fixing device.

Abstract: A radiator with positioning and buckling structure includes multiple metal plates, each of which has a main body, and a folded side portion is connected to one or two sides of the main body. The positioning and buckling structure is disposed on each of the metal plates. The positioning and buckling structure includes a snapping piece extending from the folded side portion. The snapping piece has a cleaved groove thereon and at two sides of the snapping piece there is provided two hooking portions. A buckling slot is disposed on the folded side portion of the metal plate corresponding to the snapping piece. The buckling slot is connected to a rear opening having a smaller width than the width of the snapping piece so that the metal plates can be stacked together.

Abstract: A heat sink for cooling electrical or electronic devices comprises a base plate having a top surface and a bottom surface for attaching to the electronic device. At least two vertical plates are affixed to and extend substantially perpendicularly from the top surface in a spaced apart manner and are parallel one to the other. A secondary fin is affixed to and extends between an upper portion of the vertical plates. The secondary fin has a top convoluted edge and a bottom convoluted edge and is oriented such that the bottom convoluted edge faces the top surface of the base plate. The secondary fin includes a plurality of individual fins formed in a convoluted accordion-like manner. The plurality of individual fins define a plurality of secondary fin passageways between adjacent ones of the individual fins wherein each secondary fin passageway extends from the top convoluted edge to the bottom convoluted edge.

Abstract: Graphics card apparatus with improved heat dissipation and including a planar metallic cover plate having an external perimeter configuration that generally corresponds to the plan-form of the printed circuit board used in the graphics card assembly, a plurality of thermal transfer blocks that can be selectively affixed to sources of thermal energy on the graphics card assembly and thermally coupled to the cover plate, and a fan and carriage therefor comprised of a heat sink and flow directing structure. Heat generated by the active board elements is transferred to the thermal blocks, sinked in part to the cover plate and ultimately removed from blocks and plate by air flow drawn into and through thermal baffles or vanes in the cooling structure. The outer surface of the cover plate also provides a broad surface upon which the manufacturer or marketer can display artwork, trademarks or other decorative indicia.

Abstract: An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.