Abstract: Disclosed herein are structures and techniques for underfill flow management in electronic assemblies. For example, in some embodiments, an electronic assembly may include a first component, a second component, an underfill on the first component and at least partially between the first component and the second component, and a material at a surface of the first component, wherein the material is outside a footprint of the second component, and the underfill contacts the material with a contact angle greater than 50 degrees.

Abstract: Embodiments of this application disclose a light-emitting diode chip and a preparation method therefor. The chip includes: an N-type GaN doping layer; three sub-pixel structures respectively formed in three sub-pixel regions at a first surface of the N-type GaN doping layer, where each of the three sub-pixel structures includes a blue-light quantum well structure, an interface barrier layer, a green-light quantum well structure, a charge barrier layer, and a P-type GaN doping layer that grow in sequence; three P-type contact electrodes respectively formed on the three sub-pixel structures, and an N-type contact electrode formed in a remaining region other than the three sub-pixel regions at the first surface of the N-type GaN doping layer; and a red-light colloidal quantum dot structure formed in a region that corresponds to a first sub-pixel region in the three sub-pixel regions and that is at a second surface of the N-type GaN doping layer.

Abstract: A curable organopolysiloxane composition that can be used as a sealant or a bonding agent for optical semiconductor elements is disclosed. The composition comprises: (A) an alkenyl-containing organopolysiloxane that comprises constituent (A-1) of an average compositional formula and constituent (A-2) of an average compositional formula; (B) an organopolysiloxane that contains silicon-bonded hydrogen atoms and comprises a constituent (B-1) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average molecular formula, constituent (B-2) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average compositional formula, and, optionally, constituent (B-3) of an average molecular formula; (C) an adhesion promoter; and (D) a hydrosilylation-reaction catalyst. The composition can form a cured body that possesses long-lasting properties of light transmittance and bondability, and relatively high hardness.

Abstract: A composition comprising: (a) a component comprising units of Ar1SiO3/2, wherein Ar1 is C6-C20 aryl and units of PhCH3SiO2/2, and having Mw from 20,000 to 90,000; and (b) an elastomeric component comprising: (i) a straight-chain organopolysiloxane having at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group; (ii) a branched-chain organopolysiloxane having formula: (RSiO3/2)a(R2SiO2/2)b(R3SiO1/2)c(SiO4/2)d(XO1/2)e where each R is the same or different C1-C20 hydrocarbyl group, 0.1 to 40 mole % of all R's are alkenyl, more than 10 mole % of all R's are C6-C20 aryl, X is a hydrogen atom or alkyl, a is 0.45 to 0.95, b is 0 to 0.25, c is 0.05 to 0.5, d is 0 to 0.1, e is 0 to 0.1, c/a is 0.1 to 0.5; (iii) an organopolysiloxane having at least two silicon-bonded hydrogen atoms; and (iv) a hydrosilylation catalyst.

Abstract: A semiconductor device includes a first semiconductor component having a semiconductor substrate, and a barrier layer disposed at least on or at a portion of the first semiconductor component. The barrier layer includes a polymer material and an organic metal complexing agent covalently bound to the polymer material. In an embodiment, the organic metal complexing agent includes a crown ether and/or cryptand. In an embodiment, the polymer material includes a homopolymer or copolymer resulting from the polymerization of monomers selected from the group consisting of: imides, epoxies, silicones, monomers having functional side chains, methacrylates, and any combinations thereof.

Abstract: Disclosed is a polyimide precursor composition for the production of a flexible board of a photoelectronic device. The polyimide precursor composition includes a polyimide precursor derived from a diamine or acid dianhydride including a structure of Formula 1: wherein R1 to R8, m1, m2, and m3 are as defined in the specification. Also disclosed is a polyimide film produced from the polyimide precursor composition. The polyimide film is obtained by applying the precursor composition to a substrate and curing the composition. The polyimide film has high transparency and good heat resistance. In addition, the polyimide film exhibits good dimensional stability because the substrate does not undergo an increase in stress even during high-temperature heat treatment.

Abstract: An object of the present invention is to provide a composite of silicon oxide nanoparticles and a silsesquioxane polymer, from which a cured film having a low refractive index can be formed inexpensively. Provided are a method of producing a composite of silicon oxide nanoparticles and a silsesquioxane polymer, the method comprising reacting a silsesquioxane polymer having a silanol group at a terminal or a silane monomer with silicon oxide nanoparticles having a hydroxyl group or an alkoxy group on the surface in a mixed solvent of an aqueous solvent and an organic solvent in the presence of a phase transfer catalyst, and a composite produced by the method.

Abstract: A light emitting device includes a light emitting element, a transmissive member, and a light reflective member. The transmissive member is arranged on the light emitting element, and has a wavelength conversion member and a film. The film constitutes at least a part of an outermost surface of a side surface of the transmissive member. A surface free energy of a base material of the film is lower than a surface free energy of a base material of the wavelength conversion layer. The light reflective member encloses a side surface of the light emitting element and the side surface of the transmissive member while a top surface of the transmissive member is exposed from the light reflective member.

Abstract: A silicone-modified epoxy resin composition that offers a cured product excellent in low permeability to gas, mechanical strength, and heat resistance and transparency and further offers an optical semiconductor sealing material excellent in heat cycle resistance, and a cured epoxy resin product obtained by curing the composition. The epoxy resin composition comprises the following components (A) to (C): (A) a silicone-modified epoxy resin having a cyclic siloxane structure, (B) a silicone-modified epoxy resin having a branched siloxane structure, and (C) an epoxy resin curing agent containing a polyvalent carboxylic acid having a tricyclodecane structure and a carboxylic anhydride compound.

Abstract: A base-attached encapsulant for semiconductor encapsulation is used for collectively encapsulating a device-mounted surface of the semiconductor device-mounted substrate having semiconductor devices mounted thereon or a device-formed surface of a semiconductor device-formed wafer having semiconductor devices formed thereon. The base-attached encapsulant has a base and an encapsulating resin layer containing an uncured or semi-cured thermosetting resin component formed onto one of the surfaces of the base, and a linear expansion coefficient ?1 of the semiconductor device to be encapsulated by the base-attached encapsulant, a linear expansion coefficient ?2 of a cured product of the encapsulating resin layer, and a linear expansion coefficient ?3 of the base satisfy both of the following formula (1) and (2); ?1<?3<?2??(1) ?2<?1+?2?2?3<2??(2) wherein the unit of the linear expansion coefficient is ppm/K.

Abstract: In accordance with disclosed embodiments, there are provided high resolution solder resist material for silicon bridge application.

Abstract: An organopolysiloxane having at least 4 terminal hydrosilyl groups per molecule is novel. Also provided is an addition curable silicone composition comprising (A) a linear organopolysiloxane having at least two alkenyl groups per molecule, (B) an organopolysiloxane having at least 4 terminal hydrosilyl groups per molecule, and (C) a hydrosilylation catalyst.

Abstract: A cross-linked composition comprises the reaction product of a first reactant having at least one hydroxyl or amine (functional) group, a second reactant having at least one hydroxyl or amine (functional) group, and a siloxane having at least two terminal anhydride groups reactive with the functional groups of the first and second reactants. The first reactant is selected from the group of first siloxanes having at least one hydroxyl or amine group, a first organic alcohol having at least one hydroxyl group, a first organic amine having at least one amine group, or combinations thereof. The second reactant is selected from the group of second siloxanes having at least one hydroxyl or amine group, a second organic alcohol having at least one hydroxyl group, a second organic amine having at least one amine group, or combinations thereof. If utilized, the first siloxanes and/or second siloxanes are different from the siloxane.

Abstract: A cross-linked composition comprises the reaction product of siloxanes having pendant anhydride groups and a reactant having hydroxyl and/or amine functional groups. The cross-linked composition can be of the following general formula (I): (I). Refer to formula (1) Each X can be of the following general formula (i): (i). Refer to formula (i) Each of W and W* is independently an oxygen atom or N—R, with R independently being a hydrogen atom or R1. Each of Y, R3, and R13 is an independently selected divalent group. Each of R1, R11, R4, R14, R5, and R15 is an independently selected substituted or unsubstituted hydrocarbyl group. Each of w and ww, and each of y and yy, is an independently selected integer from 0 to 1,000. Each of x and xx is an independently selected integer from 1 to 100. Typically, w and y are not simultaneously 0, and ww and yy are not simultaneously 0.

Abstract: A light-emitting device includes a light emitting element, a resin package defining a recessed portion serving as a mounting region of the light emitting element, gate marks each formed on an outer side surface of the resin package, and leads disposed on the bottom surface of the recessed portion and electrically connected to the light emitting element. The light emitting element is mounted on the lead. The gate marks include a first gate mark formed on a first outer side surface of the resin package and a second gate mark formed on an outer side surface which is different than the first outer side surface.

Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability and workability, no surface stickiness, and an excellent adhesive property. The curable composition has excellent thermal resistance, crack resistance, and gas permeability. The curable composition may have stable performance when being applied to a semiconductor device at a high temperature for a long time.

Abstract: Provided a light emitting device comprising: a package; a light emitting element disposed in the package; an encapsulation member that covers the light emitting element, the encapsulation member being formed from a resin composition that contains a fluorescent material, a resin, and nanoparticles selected from at least one of the group consisting of aluminum oxide nanoparticles, titanium oxide nanoparticles, zinc oxide nanoparticles, zirconium oxide nanoparticles, and silicon oxide nanoparticles, wherein when the resin composition includes silicon oxide nanoparticles, the content of the silicon oxide nanoparticles is 0.

Abstract: The present invention provides a case for installing semiconductor element for use in LED etc. formed from a white thermosetting silicone resin composition and a cured material thereof that have low light transmittance rate, excellent moldability and are difficult to cause a burr to occur in molding. Provided is a white thermosetting silicone resin composition for a light-emitting semiconductor device, comprising: (A) a resin organopolysiloxane having a hydroxy group, and exhibiting a weight-average molecular weight of 500 to 20,000 based on polystyrene conversion, (B) an organopolysiloxane having a straight-chain diorganopolysiloxane residue, (C) a white pigment, (D) an inorganic filler other than (C), (E) a silane coupling agent in which a refractive index difference from the resin organopolysiloxane (A) is higher than or equal to 0.02 and a boiling point at atmospheric pressure is higher than or equal to 200° C., and (F) a curing catalyst.

Abstract: A semiconductor apparatus includes a plurality of stack dies which are formed with a predetermined number of channels. The semiconductor apparatus also includes a base die configured to initialize a channel not electrically coupled with the stack dies.

Abstract: The present invention relates to a method of manufacturing an integrated piece comprising a convex cured product and a substrate, the method comprising a step of: depositing dropwise or dispensing a curable silicone composition onto the pre-heated substrate, the composition reaching a torque value of 1 dN·m within 60 seconds from immediately after beginning measurement as measured using a curelastometer according to JIS K 6300-2, at the temperature to which the substrate is heated, and having a viscosity at said temperature of at least 0.05 Pa·s. The method allows for the efficient manufacture of a hemispherical, hemicylindrical, dome-shaped, or similar convex cured product upon a substrate using a curable silicone composition.

Abstract: The present invention provides a thermosetting silicone resin sheet having a phosphor-containing thermosetting silicone resin layer formed in the form of an LED device and a method for producing the same, and a light-emitting apparatus using the thermosetting silicone resin sheet and a method for producing the same. The present invention was accomplished by the phosphor-containing thermosetting silicone resin sheet comprising a substrate film and a phosphor-containing thermosetting silicone resin layer that is a plastic solid or a semi-solid at room temperature composed of a single layer having no adhesive layer, formed by printing and molding a phosphor-containing thermosetting silicone resin composition on the substrate film in the form of an LED device.

Abstract: A thin stacked semiconductor device has a plurality of circuits that are laminated and formed sequentially in a specified pattern to form a multilayer wiring part. At the stage for forming the multilayer wiring part, a filling electrode is formed on the semiconductor substrate such that the surface is covered with an insulating film, a post electrode is formed on specified wiring at the multilayer wiring part, a first insulating layer is formed on one surface of the semiconductor substrate, the surface of the first insulating layer is removed by a specified thickness to expose the post electrode, and the other surface of the semiconductor substrate is ground to expose the filling electrode and to form a through-type electrode. A second insulating layer if formed on one surface of the semiconductor substrate while exposing the forward end of the through-type electrode, and bump electrodes are formed on both electrodes.

Abstract: A gel has improved thermal stability and is the hydrosilylation reaction product of (A) an organopolysiloxane having an average of at least 0.1 silicon-bonded alkenyl group per molecule and (B) a cross-linker having an average of at least 2 silicon-bonded hydrogen atoms per molecule. (A) and (B) react via hydrosilylation in the presence of (C) a hydrosilylation catalyst and (D) a phthalocyanine. The (D) phthalocyanine is present in an amount of from about 0.05 to about 30 weight percent based on a total weight of (A) and (B). The gel has a hardness of less than about 1500 grams as measured after heat ageing at 225° C. for 1000 hours that is calculated as a weight required to insert a TA-23 probe into the gel to a depth of 3 mm.

Abstract: The present invention relates to a method for preparation of an ultraviolet (UV)-curable inorganic-organic hybrid resin containing about or less than 4% volatiles and less than 30% organic residues. The UV-curable inorganic-organic hybrid resin obtained according to this method can be UV-cured within a markedly very short time and enables, upon curing, the formation of a transparent shrink-and crack-free glass-like product having high optical quality, high thermal stability and good bonding properties. In view of these properties, this hybrid resin can be used in various applications such as electro-optic, microelectronic, stereolithography and biophotonic applications.

Abstract: A method of preparing a curable polyorganosiloxane composition including kneading a uniform mixture of an alkenyl group-containing polyorganosiloxane, a polyorganohydrogensiloxane, and a platinum group metal compound, and defoaming the kneaded mixture under reduced pressure, the alkenyl group-containing polyorganosiloxane includes a linear polyorganosiloxane of the formula (I): , R is R1 or R2, and at least two Rs are R1; R1 is C2-C6 alkenyl; R2 is C1-C6 alkyl; and n is a value that yields a viscosity at 23° C. of 10 to 10,000 cPs, a branched polyorganosiloxane containing SiO4/2 and R?3SiO1/2 units, optionally a R?2SiO and/or a R?SiO3/2, R? represents a monovalent aliphatic or alicyclic, and at least three R? groups per molecule are alkenyls, the alkenyl group-containing polyorganosiloxane having a weight ratio of the branched to linear polyorganosiloxane of 1 to 5; and a number of hydrogens bonded to a silicon atom of the polyorganohydrogensiloxane exceeds 2.

Abstract: Provided are a curable composition and its use. The curable composition can exhibit excellent processibility and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions, and that does not cause whitening and surface stickiness.

Abstract: The present invention provides an encapsulant with a base for use in semiconductor encapsulation, for collectively encapsulating a device mounting surface of a substrate on which semiconductor devices are mounted, or a device forming surface of a wafer on which semiconductor devices are formed, the encapsulant comprising the base, an encapsulating resin layer composed of an uncured or semi-cured thermosetting resin formed on one surface of the base, and a surface resin layer formed on the other surface of the base. The encapsulant enables a semiconductor apparatus having a good appearance and laser marking property to be manufactured.

Abstract: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.

Abstract: Provided are a curable composition and its use. The curable composition can exhibit excellent processability and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions, and that does not cause whitening and surface stickiness.

Abstract: Provided is a resin composition for encapsulation including: a curing resin; and an inorganic filler, in which the resin composition encapsulates a semiconductor element provided over a substrate and fills a gap between the substrate and the semiconductor element, and when a particle diameter at a cumulative frequency of 5% in order from the largest particle diameter in a volume particle diameter distribution of particles contained in the inorganic filler is represented by Rmax (?m), and when a maximum peak diameter in the volume particle diameter distribution of the particles contained in the inorganic filler is represented by R (?m), R<Rmax, 1 ?m?R?24 ?m, and R/Rmax?0.45.

Abstract: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening, under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.

Abstract: A curable composition and the use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.

Abstract: A silicone resin is provided. The silicone resin may be effectively used to encapsulate a semiconductor element, for example, a light-emitting element of a light-emitting diode.

Abstract: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.

Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability, workability, and adhesive property, and having no whitening and surface stickiness. The curable composition has excellent thermal resistance at a high temperature, gas barrierability, and crack resistance, and thus, when applied to a semiconductor device, may stably maintain performance of the device at a high temperature for a long time.

Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability and workability, no whitening and surface stickiness, and an excellent adhesive property. Since the curable composition has excellent thermal resistance, gas barrier-ability, and crack resistance, even when a semiconductor device to which the composition is applied is used at a high temperature for a long time, performance of the device may be stably maintained.

Abstract: An adhesive composition useful in bonding a protective glass with a silicon substrate of a semiconductor device contains (A) an epoxy-containing high-molecular compound and (B) a solvent. The compound (A) has a weight average molecular weight of 3,000 to 500,000 and repeating units represented by the following formula (1): wherein R1 to R4 each represent a monovalent hydrocarbon group, m is 1 to 100, a, b, c and d indicate ratios of respective repeating units based on a number of all repeating units and each stand for 0 or a positive number with a proviso that c and d are not 0 at the same time and 0<(c+d)/(a+b+c+d)?1.0 is satisfied, and X and Y are phenolic hydroxyl-containing, divalent aromatic groups.

Abstract: Provided is a curable resin composition capable of forming a cured product which has excellent heat resistance, transparency, and flexibility and particularly excels in reflow resistance and barrier properties to a corrosive gas. The curable resin composition includes a ladder-type polyorganosilsesquioxane and an isocyanurate compound such as a triglycidyl isocyanurate compound, a monoallyl diglycidyl isocyanurate compound, a diallyl monoglycidyl isocyanurate compound, or a triallyl isocyanurate compound.

Abstract: A semiconductor device includes a substrate configured with a plurality of conductive traces. The traces are configured to electrically couple to an integrated circuit (IC) die and at least one of the plurality of conductive traces includes first electrically conductive portions in a first electrically conductive layer of the substrate, second electrically conductive portions in a second electrically conductive layer of the substrate, and first electrically conductive connections between the first electrically conductive portions and the second electrically conductive portions. The first and second electrically conductive portions and the first electrically conductive connections form a continuous path along at least a portion of the at least one of the conductive traces. Time delay of conducting a signal along the at least one of the conductive traces is within a specified amount of time of time delay of conducting a signal along another one of the plurality of conductive traces.

Abstract: Polymer compositions based on polyaniline and carbonyl-functionalized polysilicones, and methods for making these polymer compositions are disclosed in the present application. The polymer compositions have, for example, good solubility, processability, mechanical performance and conductivity.

Abstract: A gel has improved thermal stability and is the ultraviolet hydrosilylation reaction product of (A) an organopolysiloxane having an average of at least 0.1 silicon-bonded alkenyl group per molecule and (B) a cross-linker having an average of at least 2 silicon-bonded hydrogen atoms per molecule. (A) and (B) react via hydrosilylation in the presence of (C) a UV-activated hydrosilylation catalyst comprising at least one of platinum, rhodium, ruthenium, palladium, osmium, and iridium, and (D) a thermal stabilizer. The (D) thermal stabilizer is present in an amount of from about 0.01 to about 30 weight percent based on a total weight of (A) and (B) and having transparency to UV light sufficient for the ultraviolet hydrosilylation reaction product to form.

Abstract: A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si—H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si—Vi) at its terminal end, wherein a ratio (Si—H/Si—Vi) of hydrogen bound to silicon (Si—H) in the first polysiloxane to the alkenyl group bound to silicon (Si—Vi) in the second polysiloxane is about 1 to about 1.

Abstract: Thermosetting resin compositions useful for liquid compression molding encapsulation of a silicon wafer are provided. The so-encapsulated silicon wafers offer improved resistance to warpage, compared to unencapsulated wafers or wafers encapsulated with known encapsulation materials.

Abstract: A semiconductor package includes a semiconductor chip, a first insulating layer formed to cover the semiconductor chip, a wiring structure formed on the first insulating layer. The wiring structure has an alternately layered configuration including wiring layers electrically connected to the semiconductor chip and interlayer insulating layers each located between one of the wiring layers and another. The interlayer insulating layers include an outermost interlayer insulating layer located farthest from a surface of the first insulating layer. A groove formed in the outermost interlayer insulating layer passes through the outermost interlayer insulating layer in a thickness direction.

Abstract: A fiber-containing resin substrate for collectively sealing a semiconductor devices mounting surface of a substrate having the semiconductor devices mounted thereon or a semiconductor devices forming surface of a wafer having semiconductor devices formed thereon, includes: a resin-impregnated fiber base material obtained by impregnating a fiber base material with a thermosetting resin and semi-curing or curing the thermosetting resin; and an uncured resin layer containing an uncured thermosetting resin and formed on one side of the resin-impregnated fiber base material.

Abstract: A silicone resin composition contains a cage octasilsesquioxane having a group represented by the following formula (1), an alkenyl group-containing polysiloxane containing an alkenyl group having a number of moles larger than that of a hydrosilyl group in the cage octasilsesquioxane, a hydrosilylation catalyst, and an organohydrogenpolysiloxane. (where, in formula, R1 represents a monovalent hydrocarbon group selected from a saturated hydrocarbon group and an aromatic hydrocarbon group. R2 represents hydrogen or a monovalent hydrocarbon group selected from a saturated hydrocarbon group and an aromatic hydrocarbon group. The molar ratio of the monovalent hydrocarbon group:hydrogen in R2 in the cage octasilsesquioxane as a whole is, as an average value, in the range of 6.5:1.5 to 5.5:2.5).

Abstract: Provided is a curable composition and its use. The curable composition may exhibit excellent processability and workability. The curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property after curing. The curable composition may provide a cured product exhibiting stable durability and reliability under severe conditions for a long time and having no whitening and surface stickiness.

Abstract: The present invention is a curable organopolysiloxane composition containing (A) a compound shown by the following average composition formula (1), wherein R1 represents an aliphatic unsaturated group, R2 represents a monovalent hydrocarbon group, R3 represents an aliphatic hydrocarbon group, Ar represents an aryl group, and “n” and “m” represent positive numbers which satisfy n?1, m?1, and n+m?10, (B) a hydrogen atom-containing organic silicon compound having at least two silicon atom-bonded hydrogen atoms per one molecule while not having an aliphatic unsaturated group, and (C) a hydrosilylation catalyst which contains a platinum group metal. Thereby, there can be provided a curable organopolysiloxane composition which can give a cured product having high transparency, high refractive index, and excellent thermal shock resistance; an optical device sealing material; and an optical device.

Abstract: A semiconductor package resin composition of the present invention includes an epoxy resin, a curing agent, inorganic particles, nano-particles surface treated with a silane that contains a photopolymerizable functional group, and a photopolymerization initiator.

Abstract: The invention provides a primer composition which adheres a substrate mounting an optical semiconductor device and a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device includes (A) an acrylic resin containing either one or both of an acrylate ester and a methacrylate ester that contains one or more SiCH?CH2 groups in the molecule, and (B) solvent. There can be provided a primer composition in which the adhesion between a substrate mounting an optical semiconductor device and a cured material of an addition reaction curing silicone composition that encapsulates the optical semiconductor device can be improved, the corrosion of a metal electrode formed on the substrate can be prevented, and the heat resistance of a primer itself can be improved.