Including Epoxide Patents (Class 257/793)
  • Patent number: 10461638
    Abstract: A DC-DC converter and corresponding method for transitioning between a discontinuous conduction mode, DCM, and a continuous conduction mode, CCM, wherein the DC-DC converter is configured to power a signal processing system within an integrated circuit, is provided. The method comprises receiving input data, wherein the input data is for inputting into the signal processing system; determining an amplitude of the input data; and transitioning between DCM and CCM based on the amplitude of the input data. A DC-DC converter and respective method for transitioning from CCM to DCM comprising determining an estimated current representative of an inductor current through an inductor of the DC-DC converter; and transitioning from CCM to DCM based on the estimated current, is provided.
    Type: Grant
    Filed: May 21, 2018
    Date of Patent: October 29, 2019
    Assignee: Cirrus Logic, Inc.
    Inventors: Ullas Pazhayaveetil, Sarang Vadnerkar, Theodore M. Burk, Jeffrey May
  • Patent number: 10014235
    Abstract: An underfill material having sufficient curing reactivity, and capable of achieving a small change in viscosity and good electrical connection even when loaded with thermal history, a laminated sheet including the underfill material, and a method for manufacturing a semiconductor device. The underfill material has a melt viscosity at 150° C. before heating treatment of 50 Pa·s or more and 3,000 Pa·s or less, a viscosity change rate of 500% or less, at 150° C. as a result of the heating treatment, and a reaction rate represented by {(Qt?Qh)/Qt}×100% of 90% or more, where Qt is a total calorific value in a process of temperature rise from ?50° C. to 300° C. and Qh is a total calorific value in a process of temperature rise from ?50° C. to 300° C. after heating at 175° C. for 2 hours in a DSC measurement.
    Type: Grant
    Filed: February 20, 2015
    Date of Patent: July 3, 2018
    Assignee: NITTO DENKO CORPORATION
    Inventors: Naohide Takamoto, Hiroyuki Hanazono, Akihiro Fukui
  • Patent number: 9868751
    Abstract: A phosphonium compound, an epoxy resin composition, a method of preparing a phosphonium compound, and a semiconductor device encapsulated with the epoxy resin composition, the compound being represented by Formula 1:
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: January 16, 2018
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Min Gyum Kim, Ki Hyeok Kwon, Dong Hwan Lee, Joo Young Chung, Jin Min Cheon, Jin Woo Choi
  • Patent number: 9850390
    Abstract: An epoxy resin composition for encapsulation of a semiconductor device and a semiconductor device encapsulated with the epoxy resin composition, the composition including an epoxy resin; a curing agent; an inorganic filler; a curing catalyst; and a compound containing at least one hydroxyl group, wherein the curing catalyst includes a phosphonium compound represented by Formula 4:
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: December 26, 2017
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Jin Min Cheon, Ki Hyeok Kwon, Min Gyum Kim, Joo Young Chung, Jin Woo Choi, Seung Han
  • Patent number: 9845391
    Abstract: The invention relates to polymer compositions containing inorganic or organic particles which either have been surface-treated before the production of the compositions or are dispersed by special polyether-modified siloxanes through the production of the compositions.
    Type: Grant
    Filed: December 11, 2014
    Date of Patent: December 19, 2017
    Assignee: Evonik Degussa GmbH
    Inventors: Kathrin Lehmann, Angela Nawracala, Frauke Henning, Christian Mund
  • Patent number: 9708440
    Abstract: A thermosetting resin composition has particular applications in three dimensional (3-D) printing. The thermosetting resin composition exhibits high performance and is characterized by a high temperature two stage cure resin composition. The thermosetting resin composition comprises cyanate esters and other high temperature resins, photo curable monomers, photo initiator, metal catalyst or ionic liquid catalyst. The thermosetting resin composition cures at room temperature to form 3-D objects and upon further post cure these objects exhibit high temperature properties enabling use at temperatures exceeding 150 C.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: July 18, 2017
    Assignee: NOVOSET, LLC
    Inventors: Sajal Das, Christopher N. Das, Patrick Shipman, Benjamin G. Baxter
  • Patent number: 9624369
    Abstract: A liquid resin composition includes a liquid epoxy resin, a liquid curing agent, a curing accelerator and a ceramic filler. The liquid epoxy resin contains a first epoxy resin having a polyalkylene glycol framework. The liquid curing agent has a plurality of phenolic hydroxy groups per molecule. A content of the first epoxy resin in the liquid epoxy resin is in a range from 30% to 70% by mass, inclusive. The ceramic filler has an average particle diameter of 50 ?m or less, and a content of the ceramic filler in the liquid resin composition is in a range from 50% to 90% by mass, inclusive. The liquid resin composition has a viscosity of 100 Pa·s or less at 25° C.
    Type: Grant
    Filed: March 24, 2015
    Date of Patent: April 18, 2017
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Takashi Hasegawa, Takanori Konishi
  • Patent number: 9627304
    Abstract: A method of producing a multiplicity of surface-mountable carrier devices includes: A) providing a carrier plate having a first main face and a second main face located opposite the first main face, B) applying an electrically conductive layer to the first main face, C) applying a solder resist mask to a side of the electrically conductive layer remote from the carrier plate, wherein a multiplicity of adjoining regions are formed on the electrically conductive layer by the solder resist mask, D) applying a solder material to the solder resist mask and the electrically conductive layer, wherein the solder resist mask and the electrically conductive layer are at least partially covered by the solder material, and E) singulating the carrier plate and the electrically conductive layer along and through the solder resist mask and the solder material, wherein the solder material remains at least partially on the solder resist mask.
    Type: Grant
    Filed: October 17, 2013
    Date of Patent: April 18, 2017
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Choo Kean Lim, Chee Jia Chang, Choon Keat Or
  • Patent number: 9288904
    Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of benzoxazine resin; (C) 5 to 50 parts by weight of diallylbisphenol A resin; and (D) 0.05 to 20 parts by weight of an amine curing agent. The halogen-free resin composition includes specific ingredients and proportions thereof to attain low dielectric constant (Dk), low dissipation factor (Df), high heat resistance, and high flame retardation. The halogen-free resin composition is suitable for producing a prepreg or a resin film and thus applicable to copper clad laminates and printed circuit boards.
    Type: Grant
    Filed: January 11, 2013
    Date of Patent: March 15, 2016
    Assignee: ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD
    Inventors: Rong-Tao Wang, Li-Ming Chou, Li-Chih Yu, Yu-Te Lin
  • Patent number: 9117756
    Abstract: A packaged electronic device including an electronic device, a conductive structure, and an encapsulant. The encapsulant has chlorides and a negatively-charged corrosion inhibitor for preventing corrosion of the conductive structure.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: August 25, 2015
    Assignee: FREESCALE SEMICONDUCTOR, INC.
    Inventor: Varughese Mathew
  • Patent number: 9099757
    Abstract: Provided is a battery which has less tendency to experience delamination or loss of short circuit prevention layer and/or active material layer during manufacture and use. A battery comprising a laminated electrode assembly in which a positive electrode, a negative electrode, and a separator are laminated together; wherein an alumina-containing layer containing ?-alumina particles is formed on at least one species selected from among the group consisting of the positive electrode, the negative electrode, and the separator. The fact that alumina-containing layer(s) is or are made to contain ?-alumina particles makes it possible to obtain high bond strength between alumina-containing layer(s) and electrode(s) comprising metal(s), current collector(s) and/or active material(s) making up electrode(s), and/or separator(s).
    Type: Grant
    Filed: September 2, 2011
    Date of Patent: August 4, 2015
    Assignee: GS Yuasa International Ltd.
    Inventors: Kenji Tanaka, Kazuaki Matsuo, Kazuhide Tozuka, Kazuya Okabe
  • Patent number: 9064758
    Abstract: Problems, such as increase in the electrical resistance in the junction(s) of the terminal(s) of a power semiconductor element and the electrode(s) of a peripheral circuit and decrease in the dielectric strength voltage between adjacent junctions, resulting from the insufficient alignment of the power semiconductor element terminal(s) and the the peripheral circuit electrode(s), in the high-capacity module which is intended to attain reduction in size and weight, reduction in surge, and reduction in loss by lamination of the peripheral circuit onto the power circuit, should be reduced. By preparing level difference(s) in the surface of the peripheral circuit board to more accurately align the peripheral circuit board electrode(s) and the power semiconductor element terminal(s) by contact of the level difference(s) and the lateral face(s) of the power semiconductor element at the time of lamination of the power circuit and the peripheral circuit, the above-mentioned problems can be reduced.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: June 23, 2015
    Assignee: NGK Insulators, Ltd.
    Inventors: Shinsuke Yano, Takami Hirai, Tsutomu Nanataki, Hirofumi Yamaguchi
  • Patent number: 9018281
    Abstract: Set of compositions for preparing system-in-package type semiconductor device. The composition set consists of underfill composition for preparing underfill part and encapsulation resin composition for preparing resin encapsulation part. 1) A cured product of the underfill composition has a glass transition temperature, Tg, ?100° C. and is the same with or differs from a Tg of a cured product of the encapsulation resin composition by ?20° C. 2) Total linear expansion coefficient of the cured product of the underfill composition at a temperature not higher than (Tg?30)° C. and a linear expansion coefficient of the cured product of the encapsulation resin composition at a temperature not higher than (Tg?30)° C. is ?42 ppm/° C. 3) A ratio of the linear expansion coefficient of the cured product of the encapsulation resin composition to the linear expansion coefficient of the cured product of the underfill composition ranges from 0.3 to 1.0.
    Type: Grant
    Filed: November 4, 2011
    Date of Patent: April 28, 2015
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kazuaki Sumita, Kaoru Katoh, Taro Shimoda
  • Patent number: 9013049
    Abstract: To provide a resin composition for sealing an optical semiconductor, which is a raw material for a sealing resin layer having good curability and excellent storage stability; preferably a raw material for a sealing resin layer further having excellent weather resistance. The surface sealant for an optical semiconductor of Embodiment 1 according to the present invention contains epoxy resin (a) having two or more epoxy groups in a molecule, and metal complex (b1) which contains at least one metal ion selected from the group consisting of Zn, Bi, Ca, Al, Cd, La and Zr, a tertiary amine capable of forming a complex with the metal ion and having no N—H bond and an anionic ligand having a molecular weight of 17 to 200, in which the surface sealant has a viscosity of 10 to 10000 mPa·s, as measured by E-type viscometer at 25° C. and 1.0 rpm.
    Type: Grant
    Filed: June 22, 2012
    Date of Patent: April 21, 2015
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Yugo Yamamoto, Jun Okabe, Setsuko Oike
  • Patent number: 8987355
    Abstract: The present invention provides an epoxy resin composition for sealing that demonstrates favorable adhesion to a copper lead frame in which oxidation has progressed and has superior mold release and continuous moldability. The epoxy resin composition for sealing includes (A) an epoxy resin, (B) a phenolic resin-based curing agent, (C) an inorganic filler, and (D) a curing accelerator. The curing accelerator (D) has an average particle diameter of 10 ?m or less, and the ratio of particles having a particle diameter in excess of 20 ?m is 1% by weight or less. Also, the curing accelerator (D) includes at least one type of curing accelerator selected from the group consisting of a phosphobetaine compound having a specific structure; adduct of a phosphine compound having a specific structure, and quinone compound; and an adduct of a phosphonium compound having a specific structure, and a silane compound.
    Type: Grant
    Filed: January 26, 2012
    Date of Patent: March 24, 2015
    Assignee: Sumitomo Bakelite Co., Ltd.
    Inventor: Yukiharu Yuzuriha
  • Publication number: 20150054180
    Abstract: The present invention provides a resin composition for encapsulating electronic components that contains a phenol resin curing agent and an epoxy resin, in which either the phenol resin curing agent or the epoxy resin has a biphenyl structure; a resin composition for encapsulating electronic components that contains a phenol resin curing agent and an epoxy resin, in which a glass transition temperature of a cured material is equal to or higher than 200° C., and a weight reduction rate of the cured material is equal to or lower than 0.3%; and an electronic device that includes an electronic component encapsulated with the resin composition.
    Type: Application
    Filed: February 26, 2013
    Publication date: February 26, 2015
    Inventors: Kenji Yoshida, Ken Ukawa, Yusuke Tanaka
  • Patent number: 8957532
    Abstract: The present invention is related to a method for producing a resin compact containing an epoxy resin, a curing agent, a curing accelerator and an inorganic filler. The method includes a kneading and crushing process for preparing a first powder material obtained by mixing, heat-melting, kneading and crushing a first component containing the epoxy resin and the curing agent and the inorganic filler, but not containing the curing accelerator; a pulverizing process for preparing a second powder material obtained by pulverizing a second component containing the curing accelerator; a mixing process for preparing a resin composition by dispersing and mixing the first powder material and the second powder material; and a molding process for obtaining the resin compact by compression-molding the resin composition. This makes it possible to obtain a resin compact (particularly, a resin compact for encapsulation) having superior long term storage stability at room temperature, good curable property and fluidity.
    Type: Grant
    Filed: August 30, 2011
    Date of Patent: February 17, 2015
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Yoshiyuki Takahashi, Hiroshi Utsugi
  • Publication number: 20150035175
    Abstract: An adhesive for a semiconductor, containing an epoxy resin, a curing agent, and a fluxing agent comprising a compound having a group represented by the following formula (1-1) or (1-2): wherein R1 represents an electron-donating group; and a plurality of R1 may be identical or different from each other.
    Type: Application
    Filed: October 1, 2012
    Publication date: February 5, 2015
    Inventors: Kazutaka Honda, Akira Nagai, Makoto Satou
  • Publication number: 20150028497
    Abstract: The present invention provides an encapsulant with a base for use in semiconductor encapsulation, for collectively encapsulating a device mounting surface of a substrate on which semiconductor devices are mounted, or a device forming surface of a wafer on which semiconductor devices are formed, the encapsulant comprising the base, an encapsulating resin layer composed of an uncured or semi-cured thermosetting resin formed on one surface of the base, and a surface resin layer formed on the other surface of the base. The encapsulant enables a semiconductor apparatus having a good appearance and laser marking property to be manufactured.
    Type: Application
    Filed: July 17, 2014
    Publication date: January 29, 2015
    Inventors: Tomoaki NAKAMURA, Toshio SHIOBARA, Hideki AKIBA, Susumu SEKIGUCHI
  • Patent number: 8928158
    Abstract: An epoxy resin composition for encapsulating a semiconductor device includes a curing agent, a curing accelerator, inorganic fillers, and an epoxy resin, the epoxy resin including a first resin represented by Formula 1: wherein R1 and R2 are each independently hydrogen or a C1 to C4 linear or branched alkyl group, and n is a value from 1 to 9 on average.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: January 6, 2015
    Assignee: Cheil Industries Inc.
    Inventors: Seung Han, Ju Mi Kim, Sung Su Park, Eun Jung Lee
  • Patent number: 8921461
    Abstract: An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.
    Type: Grant
    Filed: November 2, 2012
    Date of Patent: December 30, 2014
    Assignee: Sumitomo Bakelite Co., Ltd
    Inventors: Takahiro Kotani, Hidetoshi Seki, Masakatsu Maeda, Kazuya Shigeno, Yoshinori Nishitani
  • Patent number: 8922031
    Abstract: A thermosetting encapsulation adhesive sheet which is used for encapsulating a chip type device (1) having connection electrodes (bumps) (3) and mounted on a wiring circuit board (2). The thermosetting encapsulation adhesive sheet is composed of an epoxy resin composition having a viscosity of 5×104 to 5×106 Pa·s as measured at a temperature of 80 to 120° C. before thermosetting thereof. The thermosetting encapsulation adhesive sheet makes it possible to conveniently encapsulate a hollow device with an improved yield.
    Type: Grant
    Filed: February 27, 2012
    Date of Patent: December 30, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Eiji Toyoda, Hiroshi Noro
  • Patent number: 8889810
    Abstract: An adhesive composition useful in bonding a protective glass with a silicon substrate of a semiconductor device contains (A) an epoxy-containing high-molecular compound and (B) a solvent. The compound (A) has a weight average molecular weight of 3,000 to 500,000 and repeating units represented by the following formula (1): wherein R1 to R4 each represent a monovalent hydrocarbon group, m is 1 to 100, a, b, c and d indicate ratios of respective repeating units based on a number of all repeating units and each stand for 0 or a positive number with a proviso that c and d are not 0 at the same time and 0<(c+d)/(a+b+c+d)?1.0 is satisfied, and X and Y are phenolic hydroxyl-containing, divalent aromatic groups.
    Type: Grant
    Filed: February 22, 2012
    Date of Patent: November 18, 2014
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Takanobu Takeda, Kyoko Soga, Satoshi Asai
  • Patent number: 8883883
    Abstract: Disclosed is a resin composition for encapsulating a semiconductor including a phenol resin (A) having one or more components containing a component (A1) composed of a polymer having a first structural unit and a second structural unit, an epoxy resin (B), and an inorganic filler (C). Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor.
    Type: Grant
    Filed: May 28, 2010
    Date of Patent: November 11, 2014
    Assignee: Sumitomo Bakelite Co., Ltd.
    Inventor: Masahiro Wada
  • Patent number: 8872358
    Abstract: Described herein is a sealant laminated composite for collectively sealing a semiconductor device's mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor device's forming surface of a wafer on which semiconductor devices are formed. The composite can include a support wafer and an uncured resin layer constituted of an uncured thermosetting resin formed on one side of the support wafer. In certain aspects, the sealant laminated composite is very versatile, even when a large diameter or thin substrate or wafer is sealed.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: October 28, 2014
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Toshio Shiobara, Hideki Akiba, Susumu Sekiguchi
  • Patent number: 8853867
    Abstract: A mold compound is provided for encapsulating a semiconductor device (101). The mold compound comprises at least approximately 70% by weight silica fillers, at least approximately 10% by weight epoxy resin system, and beneficial ions that are beneficial with respect to copper ball bond corrosion. A total level of the beneficial ions in the mold compound is at least approximately 100 ppm.
    Type: Grant
    Filed: January 31, 2014
    Date of Patent: October 7, 2014
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Sheila F. Chopin, Varughese Mathew, Leo M. Higgins, III, Chu-Chung Lee
  • Patent number: 8847415
    Abstract: Thermosetting resin compositions useful for liquid compression molding encapsulation of a silicon wafer are provided. The so-encapsulated silicon wafers offer improved resistance to warpage, compared to unencapsulated wafers or wafers encapsulated with known encapsulation materials.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: September 30, 2014
    Assignee: Henkel IP & Holding GmbH
    Inventors: Jie Bai, Afranio Torres-Filho, Kathryn Bearden
  • Publication number: 20140225271
    Abstract: Panelized packaging is described in which a plurality of die units are placed on a dielectric film. The dielectric film is then cured to lock the plurality of die unit in place, which are then encapsulated. The cured dielectric film is then patterned utilizing a mask-less pattering technique.
    Type: Application
    Filed: April 24, 2014
    Publication date: August 14, 2014
    Applicant: DECA Technologies Inc.
    Inventor: Christopher M. Scanlan
  • Patent number: 8779059
    Abstract: An optical semiconductor sealing resin composition includes a rubber-particle-dispersed epoxy resin (A) containing an alicyclic epoxy resin and, dispersed therein, rubber particles, in which the rubber particles comprise a polymer including one or more (meth)acrylic esters as essential monomeric components and have a hydroxyl group and/or a carboxyl group in a surface layer thereof as a functional group capable of reacting with the alicyclic epoxy resin, the rubber particles have an average particle diameter of 10 nm to 500 nm and a maximum particle diameter of 50 nm to 1000 nm, and the difference in refractive index between the rubber particles and a cured article obtained from the optical semiconductor sealing resin composition is within ±0.02. The optical semiconductor sealing resin composition can give a cured article which exhibits excellent cracking resistance while maintaining satisfactory thermal stability and high transparency.
    Type: Grant
    Filed: July 22, 2009
    Date of Patent: July 15, 2014
    Assignee: Daicel Chemical Industries, Ltd.
    Inventors: Atsushi Sato, Hiroyuki Hirakawa
  • Patent number: 8771828
    Abstract: A sealing film which includes a resin layer having a flow within the range of 150 to 1800 ?m at 80° C., or having a resin layer with a viscosity within the range of 10000 to 100000 Pa·s in a B-stage state at 50 to 100° C. in thermosetting viscoelasticity measurement, and containing: (A) both (a1) a high-molecular-weight component including crosslinking functional groups and having a weight-average molecular weight of 100,000 or more and a Tg within the range of ?50 to 50° C., and (a2) a thermosetting component including an epoxy resin as a main component, (B) a filler having an average particle size within the range of 1 to 30 ?m, and (C) a colorant, as well as a manufacturing method thereof and a semiconductor device using the same.
    Type: Grant
    Filed: January 24, 2008
    Date of Patent: July 8, 2014
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Hiroyuki Kawakami, Katsuyasu Niijima, Naoki Tomori, Daichi Takemori, Takuya Imai
  • Patent number: 8749076
    Abstract: The present invention relates to a resin paste composition including an organic compound, and a granular aluminum powder having an average particle diameter of from 2 to 10 ?m and a flake-shaped silver powder having an average particle diameter of from 1 to 5 ?m which are uniformly dispersed in the organic compound, and a semiconductor device manufactured by bonding a semiconductor element onto a supporting member through the resin paste composition and then encapsulating the resulting bonded product. According to the present invention, it is possible to provide a resin paste composition used for bonding an element such as semiconductor chips onto a lead frame which is excellent in not only electrical conductivity and bonding property but also working efficiency without using a large amount of rare and expensive silver, and a semiconductor device having a high productivity and a high reliability.
    Type: Grant
    Filed: June 10, 2011
    Date of Patent: June 10, 2014
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Chiaki Okada, Kazuhiko Yamada, Yukari Inoue
  • Publication number: 20140138857
    Abstract: The invention provides an encapsulant equipped with the supporting substrate which is an encapsulant for collectively encapsulating a semiconductor devices mounting surface of a substrate having semiconductor devices mounting thereon or a semiconductor devices forming surface of a wafer having semiconductor devices forming thereon, and the encapsulant equipped with the supporting substrate comprises a supporting substrate having a difference of a linear expansion coefficient from that of the substrate or the wafer of 5 ppm or less and a thermosetting resin layer being laminated, wherein the thermosetting resin layer has a shape having a height difference to a thickness direction.
    Type: Application
    Filed: October 29, 2013
    Publication date: May 22, 2014
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hideki AKIBA, Toshio SHIOBARA, Susumu SEKIGUCHI, Tomoaki NAKAMURA
  • Patent number: 8710158
    Abstract: The present invention has a purpose of providing an epoxy composition for encapsulating an optical semiconductor element which composition provides a cured product having a low gas permeability and excellent curability in a form of a thin film together with good light transmission and crack resistance. The present invention provides a composition comprising (A) a silicone-modified epoxy compound represented by the formula (1), (B) a curing agent and (C) a polyhydric alcohol. The present invention further provides a composition comprising a composition prepared by reacting (A) the silicone-modified epoxy compound, (B) the curing agent and (C) the polyhydric alcohol and (D) a curing catalyst, and a cured product thereof.
    Type: Grant
    Filed: April 6, 2011
    Date of Patent: April 29, 2014
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Manabu Ueno, Miyuki Wakao, Tsutomu Kashiwagi
  • Patent number: 8710683
    Abstract: According to example embodiments, a wafer level mold may be formed by a method including attaching a substrate to a lower side of a wafer on which a semiconductor chip is arranged, applying molding liquid to an upper and at least one lateral side of the semiconductor chip and an upper side of the wafer where the semiconductor chip is not arranged, loading a fiber onto the applied liquid, forming a mold layer by compression-molding and curing the liquid loaded with the fiber, and separating the substrate from the wafer.
    Type: Grant
    Filed: August 31, 2011
    Date of Patent: April 29, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Tae Hwan Kim
  • Patent number: 8698262
    Abstract: The present invention provides a new type wireless chip that can be used without being fixed on a product. Specifically, a wireless chip can have a new function by a sealing step. One feature of a wireless chip according to the present invention is to have a structure in which an integrated circuit is sealed by films. In particular, the films sealing the integrated circuit have a hollow structure; therefore the wireless chip can have a new function.
    Type: Grant
    Filed: August 30, 2005
    Date of Patent: April 15, 2014
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Takuya Tsurume, Koji Dairiki, Naoto Kusumoto
  • Patent number: 8697803
    Abstract: An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.
    Type: Grant
    Filed: November 2, 2012
    Date of Patent: April 15, 2014
    Assignee: Sumitomo Bakelite Company, Ltd.
    Inventors: Takahiro Kotani, Hidetoshi Seki, Masakatsu Maeda, Kazuya Shigeno, Yoshinori Nishitani
  • Patent number: 8653205
    Abstract: Disclosed is a resin composition for encapsulating a semiconductor containing an epoxy resin (A), a curing agent (B), and an inorganic filler (C), wherein the epoxy resin (A) includes an epoxy resin (A1) having a predetermined structure, and the curing agent (B) includes a phenol resin (B1) having a predetermined structure, wherein the content of a c=1 component included in the total amount of the phenol resin (B1) is not less than 40% in terms of area percentage and the content of a C?4 component is not more than 20% in terms of area percentage, as measured by the area method of gel permeation chromatography. Also disclosed is a semiconductor device obtained by encapsulating a semiconductor element with a cured product of the resin composition for encapsulating a semiconductor.
    Type: Grant
    Filed: March 2, 2010
    Date of Patent: February 18, 2014
    Assignee: Sumitomo Bakelite Co., Ltd.
    Inventor: Masahiro Wada
  • Publication number: 20140015000
    Abstract: The present invention provides a resin composition including an epoxy resin monomer, a novolac resin containing a compound having a structural unit represented by the following general Formula (I), and a filler, in which a particle size distribution of the filler, measured using laser diffractometry, has peaks in the respective ranges of from 0.01 ?m to less than 1 ?m, from 1 ?m to less than 10 ?m, and from 10 ?m to 100 ?m, and the filler contains boron nitride particles having particle sizes of from 10 ?m to 100 ?m. In the general Formula (I), R1 represents an alkyl group, an aryl group, or an aralkyl group. Each of R2 and R3 independently represents a hydrogen atom, an alkyl group, aryl group, or an aralkyl group. m represents a number from 0 to 2; and n represents a number from 1 to 7.
    Type: Application
    Filed: March 28, 2012
    Publication date: January 16, 2014
    Inventors: Tomoo Nishiyama, Atsushi Kuwano, Toshiaki Shirasaka, Naoki Hara, Kensuke Yoshihara, Hideyuki Katagi
  • Publication number: 20140015149
    Abstract: A semiconductor encapsulation adhesive composition comprising (a) an epoxy resin, (b) a curing agent and (c) an antioxidant.
    Type: Application
    Filed: July 2, 2013
    Publication date: January 16, 2014
    Inventors: Kazutaka Honda, Tetsuya Enomoto, Yuuki Nakamura
  • Publication number: 20140008822
    Abstract: Thermosetting resin compositions useful for liquid compression molding encapsulation of a silicon wafer are provided. The so-encapsulated silicon wafers offer improved resistance to warpage, compared to unencapsulated wafers or wafers encapsulated with known encapsulation materials.
    Type: Application
    Filed: March 14, 2013
    Publication date: January 9, 2014
    Applicant: Henkel Corporation
    Inventor: Jie Bai
  • Patent number: 8624346
    Abstract: A semiconductor structure less affected by stress and a method for forming the same are provided. The semiconductor structure includes a semiconductor chip. Stress-sensitive circuits are substantially excluded out of an exclusion zone to reduce the effects of the stress to the stress-sensitive circuits. The stress-sensitive circuits include analog circuits. The exclusion zone preferably includes corner regions of the semiconductor chip, wherein the corner regions preferably have a diagonal length of less than about one percent of the diagonal length of the semiconductor chip. The stress-sensitive analog circuits preferably include devices having channel lengths less than about five times the minimum channel length.
    Type: Grant
    Filed: January 3, 2006
    Date of Patent: January 7, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chao-Yuan Su, Chung-Yi Lin
  • Patent number: 8618674
    Abstract: A semiconductor device includes a carrier and a first chip attached to the carrier. The semiconductor device includes a sintered insulation material over at least a portion of the carrier and the first chip.
    Type: Grant
    Filed: September 25, 2008
    Date of Patent: December 31, 2013
    Assignee: Infineon Technologies AG
    Inventors: Ivan Nikitin, Joachim Mahler
  • Patent number: 8604615
    Abstract: A stack of semiconductor chips, a semiconductor device, and a method of manufacturing are disclosed. The stack of semiconductor chips may comprise a first chip of the stack, a second chip of the stack over the first chip, conductive bumps, a homogeneous integral underfill material, and a molding material. The conductive bumps may extend between an upper surface of the first chip and a lower surface of the second chip. The homogeneous integral underfill material may be interposed between the first chip and the second chip, encapsulate the conductive bumps, and extend along sidewalls of the second chip. The homogeneous integral underfill material may have an upper surface extending in a direction parallel to an upper surface of the second chip and located adjacent the upper surface of the second chip.
    Type: Grant
    Filed: July 1, 2011
    Date of Patent: December 10, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chung-Sun Lee, Jung-Hwan Kim, Tae-Hong Min, Hyun-Jung Song, Sun-Pil Youn
  • Patent number: 8592504
    Abstract: A semiconductor encapsulation material which exhibits a low viscosity and further improved moldability in encapsulation even when highly loaded with an inorganic filler; an amorphous siliceous powder suitable for the preparation of a resin composition useful as the encapsulation material; and a process for the production of the amorphous siliceous powder. An amorphous siliceous powder having a content of Si and Al of 99.5 mass % or above in terms of oxides, wherein the Al content in the particle size region of 15 ?m to less than 70 ?m is 100 to 30000 ppm in terms of oxides; the Al content in the particle size region of 3 ?m to less than 15 ?m is 100 to 7000 ppm in terms of oxides; and the Al content in the whole particle size region is 100 to 25000 ppm in terms of oxides. It is preferable that the (A)/(B) ratio of the Al content (A) in the particle size region of 15 ?m to less than 70 ?m to the Al content (B) in the particle size region of 3 ?m to less than 15 ?m be 1.0 to 20.
    Type: Grant
    Filed: June 16, 2009
    Date of Patent: November 26, 2013
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Yasuhisa Nishi, Syuji Sasaki, Hiroshi Murata
  • Patent number: 8592999
    Abstract: A semiconductor chip includes a first main face and a second main face opposed to the first main face. Side faces connect the first and second main faces. The side faces are at least partially covered with an anti-EBO compound and/or a surface energy reducing compound.
    Type: Grant
    Filed: January 13, 2011
    Date of Patent: November 26, 2013
    Assignee: Infineon Technologies AG
    Inventor: Mathias Vaupel
  • Patent number: 8587133
    Abstract: An improved reliability of a junction region between a bonding wire and an electrode pad in an operation at higher temperature is presented. A semiconductor device includes a semiconductor chip provided on a lead frame, which are encapsulated with an encapsulating resin. Lead frames are provided in both sides of the lead frame. A portion of the lead frame is encapsulated with the encapsulating resin to function as an inner lead. The encapsulating resin is composed of a resin composition that contains substantially no halogen. Further, an exposed portion of the Al pad provided in the semiconductor chip is electrically connected to the inner lead via the AuPd wire.
    Type: Grant
    Filed: August 31, 2011
    Date of Patent: November 19, 2013
    Assignee: Renesas Electronics Corporation
    Inventors: Mitsuru Ohta, Tomoki Kato
  • Patent number: 8552572
    Abstract: Provided is a resin composition for encapsulating a semiconductor which has excellent flame resistance and solder resistance, and can be manufactured at a low cost. The composition includes a phenol resin (A), an epoxy resin (B), and an inorganic filler (C).
    Type: Grant
    Filed: July 22, 2009
    Date of Patent: October 8, 2013
    Assignee: Sumitomo Bakelite Co., Ltd.
    Inventor: Masahiro Wada
  • Patent number: 8546959
    Abstract: Disclosed is a granular resin composition for encapsulating a semiconductor used for a semiconductor device obtained by encapsulating a semiconductor element by compression molding, satisfying the following requirements (a) to (c) on condition that ion viscosity is measured with a dielectric analyzer under a measurement temperature of 175° C. and a measurement frequency of 100 10 Hz: (a) the time from the initiation of the measurement until a decrease of the ion viscosity to the lowest ion viscosity is 20 seconds or shorter; (b) the lowest ion viscosity value is not more than 6.5; and (c) the time interval between the time from the initiation of the measurement until a decrease of the ion viscosity to the lowest ion viscosity and the time from the initiation of the measurement until the ion viscosity reaching 90% of an ion viscosity value measured at 300 seconds is 10 seconds or longer.
    Type: Grant
    Filed: December 2, 2009
    Date of Patent: October 1, 2013
    Assignee: Sumitomo Bakelite Co., Ltd.
    Inventor: Keiichi Tsukurimichi
  • Publication number: 20130241087
    Abstract: A method for producing a semiconductor apparatus with a mold including an upper mold half and a lower mold half, includes: an arranging step of arranging on one of the upper mold half and the lower mold half of the mold a substrate on which a semiconductor device is mounted, the mold being kept at a room temperature or heated to a temperature up to 200° C., and arranging on the other of the upper mold half and the lower mold half a substrate on which no semiconductor device is mounted; an integrating step of integrating the substrate on which the semiconductor device is mounted and the substrate on which no semiconductor device is mounted by molding a thermosetting resin with the mold on which the substrates are arranged; and a step of dicing the integrated substrates taken out of the mold to obtain an individualized semiconductor apparatus.
    Type: Application
    Filed: February 25, 2013
    Publication date: September 19, 2013
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Toshio SHIOBARA, Susumu SEKIGUCHI, Hideki AKIBA
  • Patent number: 8531044
    Abstract: An epoxy resin composition for encapsulating a semiconductor device and a semiconductor device, the composition including an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and an additive, wherein the epoxy resin includes an epoxy resin represented by Formula 1:
    Type: Grant
    Filed: December 28, 2011
    Date of Patent: September 10, 2013
    Assignee: Cheil Industries, Inc.
    Inventors: Seung Han, Yun Ling