With Housing Or Contact Structure Patents (Class 257/99)
  • Patent number: 11075319
    Abstract: Several embodiments of semiconductor systems and associated methods of color corrections are disclosed herein. In one embodiment, a method for producing a light emitting diode (LED) includes forming an (LED) on a substrate, measuring a base emission characteristic of the formed LED, and selecting a phosphor based on the measured base emission characteristic of the formed LED such that a combined emission from the LED and the phosphor at least approximates white light. The method further includes introducing the selected phosphor onto the LED via, for example, inkjet printing.
    Type: Grant
    Filed: June 7, 2019
    Date of Patent: July 27, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Kevin Tetz, Charles M. Watkins
  • Patent number: 11075128
    Abstract: Aspects of the present disclosure include a packaged product including a product, a first encapsulation disposed on top of the product, wherein the first encapsulation is configured to protect the product during an operation of the product, a second encapsulation disposed on top of the first encapsulation, wherein the second encapsulation is configured to protect the product during a testing of the product, and a third encapsulation disposed on top of the second encapsulation, wherein the third encapsulation is configured to protect the product during a transport of the product, wherein at least one of the first encapsulation, the second encapsulation, or the third encapsulation is detachably coupled with the product.
    Type: Grant
    Filed: October 3, 2019
    Date of Patent: July 27, 2021
    Assignee: UTICA LEASECO, LLC
    Inventor: Aarohi Surya Vijh
  • Patent number: 11069842
    Abstract: A method for producing an optoelectronic semiconductor component and an optoelectronic semiconductor component are disclosed. In an embodiment a method include providing a semiconductor layer sequence having an active region and a plurality of emission regions, forming a plurality of first contact points, filling spacings between the first contact points with a molding compound, removing a growth substrate of the semiconductor layer sequence and arranging the semiconductor layer sequence on a connection carrier comprising a control circuit and a plurality of connection surfaces, wherein each of the first contact points is electrically conductively connected to a connection surface, wherein the emission regions are independently controllable by the control circuit, and wherein the molding compound serves as a temporary auxiliary carrier that mechanically stabilizes the semiconductor layer sequence during the removal of the growth substrate.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: July 20, 2021
    Assignee: OSRAM OLED GMBH
    Inventors: Isabel Otto, Christian Leirer
  • Patent number: 11067763
    Abstract: Disclosed are an integrated packaged light engine and signal emitting and receiving method thereof. The light engine includes molded interconnection device in which ceramic substrate is embedded, laser chip, photodiode chip, optical driving chip, transimpedance amplifier chip, array lens module and optical fiber interface provided on the ceramic substrate; the signal transmitting method includes: S1, powering optical drive chip by external power supply; S2, transmitting external signal to optical drive chip, so that laser chip emits optical signal; S3, totally reflecting and then transmitting optical signal by array lens module.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: July 20, 2021
    Assignee: HANGZHOU MO-LINK TECHNOLOGY CO. LTD
    Inventors: Hao Wang, Dong Wang
  • Patent number: 11060697
    Abstract: A light-emitting device may include a ceramic substrate having a reflective component, a light-emitting diode on the ceramic substrate, and a light-converting material over the light-emitting diode. A lighting system may include a ceramic substrate having a reflective component, a plurality of light-emitting diodes connected together in series, wherein the plurality of light-emitting diodes are on the ceramic substrate, and a light-converting material over the plurality of light-emitting diodes. The ceramic substrate may provide electrical insulation between the light-emitting diode and the aluminum carrier. The ceramic substrate may provide thermal conductivity between the light-emitting diode and the aluminum carrier. The reflective component may include zirconium oxide. The ceramic substrate may include aluminum oxide and/or aluminum nitride. The light-converting material may include phosphor. The light-emitting diode may have an epitaxial diode structure.
    Type: Grant
    Filed: May 20, 2020
    Date of Patent: July 13, 2021
    Assignee: BRIDGELUX, INC.
    Inventors: Jesus Del Castillo, Scott West, Vladimir Odnoblyudov
  • Patent number: 11063187
    Abstract: A light emitting device includes: a base member having a first surface including a first region and a second region; a first frame surrounding the first region on the base member; a light emitting element provided on the first region; a light-transmissive first member provided inward of the first frame, and covering the light emitting element; a second frame surrounding the second region; an electronic component provided in the second region; and a non-light-transmissive second member provided inward of the second frame, and covering the electronic component. A part of the first frame and a part of the second frame are integrated with each other. An upper surface of the first member is positioned higher than upper surfaces of the first frame, the second frame, and the second member.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: July 13, 2021
    Assignee: NICHIA CORPORATION
    Inventors: Shinya Okura, Takanobu Sogai, Koji Oshodani
  • Patent number: 11064613
    Abstract: Methods, devices, and systems for encapsulating a flexible electronic device with a waterproof layer are provided. In some embodiments, a manufacturing process is provided where a hotmelt layer is positioned over a flexible substrate that has at least one electronic component. Then, heat and/or pressure are applied to the hotmelt layer causing the hotmelt layer to flow around the at least one component to encapsulate the at least one component and form a waterproof layer. Various embodiments for forming the hotmelt layer and various embodiments of the flexible electronic device with the hotmelt layer are described herein.
    Type: Grant
    Filed: June 24, 2019
    Date of Patent: July 13, 2021
    Assignee: Flex Ltd.
    Inventors: Weifeng Liu, William L. Uy, Dongkai Shangguan
  • Patent number: 11063184
    Abstract: A light-emitting diode includes: a light emitting epitaxial structure including a first-type semiconductor layer, an active layer and a second-type semiconductor layer, and having a first surface as a light emitting surface, and an opposing second surface; a conducting layer formed over the second surface and including a physical plating layer and a chemical plating layer, wherein the physical plating layer is adjacent to the light emitting epitaxial structure and has cracks, and the chemical plating layer fills the cracks in the physical plating layer; and a submount coupled to the light emitting epitaxial laminated layer through the conducting layer.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: July 13, 2021
    Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Chao Jin, Chuang Yu Hsieh, Chen Kang Hsieh, Duxiang Wang, Chaoyu Wu, Chih Pang Ma
  • Patent number: 11056632
    Abstract: A thermoelectric conversion substrate includes an insulating substrate and at least one thermoelectric conversion unit. The insulating substrate has a first surface and a second surface at both sides of the insulating substrate in a thickness direction. The at least one thermoelectric conversion unit is incorporated in the insulating substrate. The at least one thermoelectric conversion unit includes a first thermoelectric member, a second thermoelectric member, and a first electrode disposed on the first surface of the insulating substrate. The first thermoelectric member includes a first tubular member having insulation property and a first semiconductor filled in the first tubular member. The second thermoelectric member includes a second tubular member having insulation property and a second semiconductor filled in the second tubular member. The second semiconductor has carriers different from carriers of the first semiconductor.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: July 6, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takuji Aoyama, Satoshi Maeshima, Tatsuo Sasaoka, Junya Tanaka, Noboru Yamamoto
  • Patent number: 11056543
    Abstract: The present invention provides a display panel and a manufacturing method thereof, the display panel includes a packaging structure, and the packaging structure includes a first inorganic layer, a color filter layer, a second inorganic layer. The color filter layer is disposed between the first inorganic layer and the second inorganic layer, and the color filter layer includes a red photoresist, a green photoresist, and a blue photoresist; and the red photoresist is disposed on a light-emitting side of the red light-emitting pixels, the green photoresist is disposed on a light-emitting side of the green light-emitting pixels, and the blue photoresist is disposed on a light-emitting side of the blue light-emitting pixels.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: July 6, 2021
    Inventor: Yuanhang Li
  • Patent number: 11056623
    Abstract: The light-emitting device includes a light-emitting element, a light-transmissive member, a light-blocking layer and a light-reflective member. The light-transmissive member has a first main surface and a second main surface opposite to each other. The first main surface and the second main surface are smaller than a light-emitting surface of the light-emitting element. The first main surface faces the light-emitting surface of the light-emitting element. The light-blocking layer is disposed on the light-emitting surface to cover a region between an outer edge of the light-emitting surface and an outer edge of the first main surface. The light-reflective member covers at least a portion of lateral surfaces of the light-emitting element and at least a portion of the light-transmissive member. The light-blocking layer extends inward of the outer edge of the first main surface.
    Type: Grant
    Filed: November 20, 2019
    Date of Patent: July 6, 2021
    Assignee: NICHIA CORPORATION
    Inventor: Yoshihiko Nishioka
  • Patent number: 11056624
    Abstract: A method of manufacturing a package includes providing a lead frame including a lead and a molded resin having an upper surface on which a depressed portion is formed to house a light-emitting element, the molded resin being formed integrally with the lead. The method further includes disposing the molded resin in a cavity of a mold in a state where the depressed portion of the molded resin is closed, and applying an ink to the upper surface of the molded resin and at least a portion of lateral surfaces of the molded resin by supplying the ink into the cavity, the ink having a darker color than an inner surface of the depressed portion. The method also includes removing the molded resin from the mold, the molded resin being applied with the ink.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: July 6, 2021
    Assignee: NICHIA CORPORATION
    Inventor: Takayuki Mitsunaga
  • Patent number: 11049792
    Abstract: A semiconductor device package includes a heatsink platform, with a ceramic isolation layer bonded to the heatsink platform. A semiconductor die may be disposed on the ceramic isolation layer, with mold material disposed on the ceramic isolation layer and surrounding at least a portion of the semiconductor die. A redistribution layer may be disposed on the semiconductor die and the mold material. Such packages, and similar, enable the use of a thin, inexpensive device substrate, while providing an efficient thermal path to the heatsink platform, while the redistribution layer enables electrical connections that are short, low-resistance, low-inductance, and low-loss connections.
    Type: Grant
    Filed: May 6, 2020
    Date of Patent: June 29, 2021
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Gareth Pryce Weale, Joseph Steffler, Yik Yee Tan
  • Patent number: 11043475
    Abstract: A light emitting device includes a substrate, a plurality of light emitting elements disposed in a light-emitting region on the substrate, at least one first wiring part surrounding the light-emitting region, at least one second wiring part, together with the at least one first wiring part, demarcating the light-emitting region into a plurality of demarcated regions, a first wall formed along and covering the at least one first wiring part to surround the light-emitting region, at least one second wall formed along and covering corresponding one or more of the at least one second wiring part, and a light-transmissive member containing a wavelength converting material, covering an entire light-emitting region.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: June 22, 2021
    Assignee: NICHIA CORPORATION
    Inventor: Yusuke Kawano
  • Patent number: 11038090
    Abstract: A method of manufacturing an optoelectronic component includes providing a carrier with an upper side; arranging an optoelectronic semiconductor chip above the upper side of the carrier; arranging a casting material over the upper side of the carrier, wherein the optoelectronic semiconductor chip is embedded in the casting material, and the casting material forms a cast surface; and removing a portion of the casting material at the cast surface, wherein a topography is generated at the cast surface, and the removal of a portion of the casting material at the cast surface takes place through laser interference structuring.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: June 15, 2021
    Assignee: OSRAM OLED GmbH
    Inventors: Daniel Leisen, Herbert Brunner, Emilia Dinu, Jens Eberhard, Christina Keith, Markus Pindl, Thomas Reeswinkel, Daniel Richter, Christopher Wiesmann, Ludwig Peyker, Alexander Linkov
  • Patent number: 11039534
    Abstract: An electronic component module includes an electronic component, a resin structure body, a through wiring, a wiring layer, and a close-contact layer. The resin structure body covers at least a portion of the electronic component. The through wiring extends through the resin structure body. The wiring layer electrically connects the electronic component and the through wiring to each other. The close-contact layer is provided between the resin structure body and the through wiring and is in contact with the resin structure body and the through wiring. The close-contact layer includes an inorganic insulation film.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: June 15, 2021
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hiroshi Somada, Takashi Iwamoto, Yoshiharu Suemori
  • Patent number: 11024773
    Abstract: The present invention discloses a micro-LED with vertical structure, display device, electronics apparatus and manufacturing method. The micro-LED with vertical structure comprises: a bottom electrode bonded on a display substrate; a first type doped region provided above the bottom electrode; a second type doped region provided above the first type doped region; and a side-contact electrode covering at least one part of a peripheral of the second type doped region.
    Type: Grant
    Filed: November 6, 2016
    Date of Patent: June 1, 2021
    Assignee: GOERTEK. INC
    Inventors: Quanbo Zou, Peixuan Chen, Xiangxu Feng
  • Patent number: 11025341
    Abstract: An LED module (200) comprising: a first set of LEDs (D1) for emitting illumination to illuminate an environment, arranged within a first circuit path; a second set of one or more LEDs (D2) for emitting light, arranged within a second circuit path; both the first and second sets being powered by a portion of the power received via a same pair of input terminals, and the first circuit path being longer than the second circuit path; and filter circuitry (206, 208) arranged to filter a modulation in the power received via the terminals, the filtering comprising allowing a component of the modulation at a predetermined modulation frequency to be passed only to the second set of LEDs (D2) and not the first set (D1), thereby causing a corresponding signal to be embedded in the light emitted by the second set but not in the illumination emitted by the first set.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: June 1, 2021
    Assignee: SIGNIFY HOLDING B.V.
    Inventors: Kumar Arulandu, Johan-Paul Marie Gerard Linnartz, Michel Germe, Amir Khalid, Olivia Qiu, David Derrien
  • Patent number: 11024771
    Abstract: A method for manufacturing a light emitting device includes: providing a substrate defining a mounting region having a wiring pattern on an upper face thereof; forming a plurality of bumps arranged in a plurality of columns extending parallel to each other with a distance between adjacent ones of the bumps in one of the columns arranged closest to an outer edge of the mounting region is larger than a distance between adjacent ones of the bumps arranged on an inner side in a plan view, and the bumps include first bumps and second bumps with the first bumps including first large bumps and first small bumps, with all the bumps in the one of the columns arranged closest to the outer edge are the same size; mounting the light emitting element onto the bumps in a flip-chip manner; and forming a cover member.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: June 1, 2021
    Assignee: NICHIA CORPORATION
    Inventors: Kenji Ozeki, Akira Goto
  • Patent number: 11018279
    Abstract: A light emitting device can include a sapphire substrate; a first conductivity type semiconductor layer disposed on the sapphire substrate; an active layer disposed on the first conductivity type semiconductor layer; a plurality of p-type conductors disposed on the active layer, and separated from each other; a first pad disposed on the first conductivity type semiconductor layer; and a second pad disposed on the plurality of p-type conductors, in which the plurality of p-type conductors are arranged in a first direction, the second pad is spaced apart from the first pad in a second direction, the second direction is perpendicular to the first direction, each of the plurality of p-type conductors has a first width in the first direction and a second width in the second direction, the first width being less than the second width, the plurality of p-type conductors are evenly spaced apart by a first distance in the first direction, and the first distance being less than the first width of each of the plurality
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: May 25, 2021
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Yong Gyeong Lee, Min Sung Kim, Su Ik Park, Youn Joon Sung, Kwang Yong Choi
  • Patent number: 11016348
    Abstract: A display panel includes: a first substrate having a top surface and a side surface, the top surface including a display area and a non-display area outside the display area; a second substrate facing the first substrate; a first insulating structure disposed between the second substrate and the first substrate, wherein the first insulating structure overlaps the non-display area without overlapping the display area; a pixel disposed between the first substrate and the second substrate and overlapping the display area; a signal line having a side surface substantially aligned with the side surface of the first substrate, wherein the signal line is disposed on the first substrate; a second insulating structure overlapping the signal line and disposed between the first substrate and the first insulating structure, wherein the second insulating structure has a side surface substantially aligned with the side surface of the first substrate; and a connection pad being in contact with the side surface of the signal
    Type: Grant
    Filed: July 7, 2020
    Date of Patent: May 25, 2021
    Assignee: Samsung Display Co., Ltd.
    Inventors: Seungki Song, Chansol Yoo, Jinjoo Ha, Joonhyeong Kim
  • Patent number: 11011680
    Abstract: A light-emitting device includes a semiconductor structure including a first semiconductor layer, a second semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer; a via penetrating the second semiconductor layer and the active layer to expose a surface of the first semiconductor layer; a first electrode formed in the via and on the second semiconductor layer; a second electrode formed on the second semiconductor layer; and an insulating structure covering the first electrode, the second electrode and the semiconductor structure and including a first opening to expose the first electrode and a second opening to expose the second electrode, wherein the first electrode and the second electrode respectively include a metal layer contacting the insulating layer, the metal layer includes a material including a surface tension value larger than 1500 dyne/cm and a standard reduction potential larger than 0.3 V.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: May 18, 2021
    Assignee: Epistar Corporation
    Inventors: Yi-Hung Lin, Chao-Hsing Chen, Jia-Kuen Wang, Tzu-Yao Tseng, Jen-Chieh Yu, Guan-Wu Chen
  • Patent number: 11011654
    Abstract: A photodiode with a lens cap is provided, having a header with a photodiode active surface area where the photodiode active surface area has a diameter dF. Further included is a cap having a fused-in lens, the fused-in lens having a diameter dL shown in a top plan view of the cap. The ratio of the diameter of the fused-in lens to the diameter of the photodiode active surface area, dL/dF, is greater than 30.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: May 18, 2021
    Assignee: Schott AG
    Inventors: Robert Hettler, René Nauthe, Georg Mittermeier
  • Patent number: 11011681
    Abstract: The present application discloses a light-emitting device comprises a semiconductor light-emitting element, a transparent element covering the semiconductor light-emitting element, an insulating layer which connects to the transparent element, an intermediate layer which connects to the insulating layer; and a conductive adhesive material connecting to the intermediate layer.
    Type: Grant
    Filed: November 14, 2014
    Date of Patent: May 18, 2021
    Assignee: Epistar Corporation
    Inventors: Chien-Liang Liu, Ming-Chi Hsu, Shih-An Liao, Jen-Chieh Yu, Min-Hsun Hsieh, Jia-Tay Kuo, Yu-His Sung, Po-Chang Chen
  • Patent number: 11005012
    Abstract: Embodiments of the invention include a flip chip semiconductor light emitting device and a wavelength converting structure disposed in a path of light extracted from the flip chip semiconductor light emitting device. A substrate with a textured top surface is positioned with the bottom surface facing the wavelength converting structure. The wavelength converting structure is disposed between the substrate and the flip chip semiconductor light emitting device.
    Type: Grant
    Filed: October 10, 2016
    Date of Patent: May 11, 2021
    Assignee: Lumileds LLC
    Inventor: Toni Lopez
  • Patent number: 11004891
    Abstract: A light emitting device includes at least three light emitting elements arranged side by side, and one or more light transmissive members each containing a phosphor and covering the light emitting elements. The at least three light emitting elements include two outer light emitting elements arranged on outer sides, and an inner light emitting element arranged between the two outer light emitting elements and having a different peak emission wavelength than a peak emission wavelength of the two outer light emitting elements. The phosphor has a longer peak emission wavelength than the peak emission wavelengths of the outer light emitting elements and the peak emission wavelength of the inner light emitting element. The two outer light emitting elements and the inner light emitting element are connected in series.
    Type: Grant
    Filed: February 7, 2017
    Date of Patent: May 11, 2021
    Assignee: NICHIA CORPORATION
    Inventors: Seitaro Akagawa, Takeshi Morikawa, Kentaro Nishigaki
  • Patent number: 11005019
    Abstract: A structure with micro devices includes a substrate, at least one micro device, and at least one holding structure. The micro device is disposed on the substrate. The micro device has a top surface and a bottom surface opposite to each other, a peripheral surface connected with the top surface and the bottom surface, a first-type electrode, and a second-type electrode. The holding structure is disposed on the substrate and is away from the first-type electrode and the second-type electrode. The holding structure includes at least one connecting portion and at least one holding portion. The connecting portion is disposed on an edge of the top surface of the micro device. The holding portion is connected to the connecting portion and extends onto the substrate.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: May 11, 2021
    Assignee: PlayNitride Inc.
    Inventors: Chih-Ling Wu, Yi-Min Su, Yu-Yun Lo
  • Patent number: 10998466
    Abstract: An embodiment relates to a light emitting device comprise a second electrode which includes indium tin oxide (ITO), an ohmic characteristic between a second semiconductor layer and the second electrode is improved and a driving voltage is also improved. An embodiment relates to a light emitting device comprise a capping layer that can overlap the second semiconductor layer with the second electrode interposed therebetween and include a material of which a difference in thermal expansion coefficient with the second semiconductor layer is 3 or less. Therefore, since the capping layer is electrically connected to the second electrode, delamination and lifting of an interface between the second electrode and the second semiconductor layer is prevented, and reliability of the light emitting device is improved.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: May 4, 2021
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Kwang Yong Choi, Min Sung Kim, Su Ik Park, Youn Joon Sung, Yong Gyeong Lee
  • Patent number: 10995944
    Abstract: The present teaching relates to an illumination module for emitting light directed in parallel in a main emission direction, having a reflector with a focus lying on the front side thereof. At least one LED light source is arranged substantially at the focus of the reflector for radiating light into the reflector. A heatsink is arranged on the rear side of the reflector. The LED light source is oriented counter to the main emission direction. The reflector is configured to direct the light radiated into the reflector by the at least one LED light source in parallel and emit the light in the direction of the main emission direction. The at least one LED light source is held by means of at least one connecting web extending from the heatsink to the LED light source.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: May 4, 2021
    Assignee: LITEstudio OG
    Inventors: Michael Tschager, Thomas Welz
  • Patent number: 10998464
    Abstract: A flip-chip light emitting diode (LED), a display device including at least one flip-chip LED, and a method of manufacturing the LED. The flip-chip LED including a light-emitting layer; an n-type semiconductor layer laminated on a lower part of the light-emitting layer; a p-type semiconductor layer laminated on an upper part of the light-emitting layer; a first electrode that is electrically connected to the n-type semiconductor layer via a first contact hole formed in the LED; a second electrode that is electrically connected to the p-type semiconductor layer, and is electrically insulated from the first electrode; a metal layer provided in a first area, a second area, and a third area; a third electrode that is formed on the metal layer in the third area, is electrically connected to the metal layer, and is electrically insulated from the first electrode and the second electrode; and a plurality of insulating layers.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: May 4, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jinhee Kang, Jaephil Shim
  • Patent number: 10985150
    Abstract: A display device is provided. The display device includes a supporting film and a flexible substrate disposed on the supporting film. The display device also includes a driving layer disposed on the flexible substrate, and a conductive pad disposed on the driving layer. The display device further includes a light-emitting diode disposed on the conductive pad and electrically connected to the conductive pad, wherein the supporting film has a first hardness, the flexible substrate has a second hardness, and the first hardness is greater than or equal to the second hardness.
    Type: Grant
    Filed: February 5, 2020
    Date of Patent: April 20, 2021
    Assignee: INNOLUX CORPORATION
    Inventors: Yuan-Lin Wu, Yu-Hsien Wu, Kuan-Feng Lee, Tsung-Han Tsai
  • Patent number: 10985206
    Abstract: A chip-scale package type light emitting diode is provided. In the light emitting diode according to one embodiment, an opening exposing a pad metal layer is separated from an opening of a lower insulation layer which exposes an ohmic reflection layer formed on a mesa. Therefore, it is possible to prevent solder, particularly Sn, from diffusing and contaminating the ohmic reflection layer.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: April 20, 2021
    Assignee: Seoul Viosys Co., Ltd.
    Inventors: Se Hee Oh, Jong Kyu Kim, Joon Sub Lee
  • Patent number: 10986737
    Abstract: A method of restricting a micro device on a conductive pad is provided. The method includes: forming the conductive pad having a first lateral length on a substrate; forming a liquid layer on the conductive pad; and placing the micro device having a second lateral length over the conductive pad such that the micro device is in contact with the liquid layer and is gripped by a capillary force produced by the liquid layer between the micro device and the conductive pad, the micro device comprising an electrode facing the conductive pad, wherein the first lateral length is less than or equal to twice of the second lateral length.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: April 20, 2021
    Assignee: MIKRO MESA TECHNOLOGY CO., LTD.
    Inventor: Li-Yi Chen
  • Patent number: 10978402
    Abstract: In accordance with certain embodiments, a light-emitting element composed of one or more discrete units configured for light emission is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the light-emitting element or non-coplanarity of the semiconductor die contacts.
    Type: Grant
    Filed: April 7, 2020
    Date of Patent: April 13, 2021
    Assignee: COOLEDGE LIGHTING INC.
    Inventors: Michael A. Tischler, Philippe M. Schick, Ian Ashdown, Calvin Wade Sheen, Paul Jungwirth
  • Patent number: 10971480
    Abstract: The present invention provides a display panel and a manufacturing method thereof. The display panel comprises a micro light emitting diode and a thin film transistor electrically coupled to the micro light emitting diode. The micro light emitting diode comprises a P type semiconductor and a N type semiconductor. The P type semiconductor is close to the thin film transistor and the N type semiconductor is configured at one side of the P type semiconductor away from the thin film transistor. One surface of the N type semiconductor away from the P type semiconductor is roughened by a plasma surface treatment process. Since a thickness of the N type semiconductor is larger than a thickness of the P type semiconductor, the crystal quality of material of the N type semiconductor will not be affected as the N type semiconductor is roughened to increase the light efficiency.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: April 6, 2021
    Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Zhiwu Wang
  • Patent number: 10971572
    Abstract: A flexible OLED panel for a lighting device according to the present invention includes a substrate which is made of a polymer material and has a first light extracting pattern provided on a lower surface thereof; an auxiliary wiring pattern which is arranged on the substrate; a first electrode which is arranged on the substrate on which the auxiliary wiring pattern is arranged; a passivation layer which is arranged on the first electrode, at least on an area on which the auxiliary wiring pattern is arranged; an OLED light emitting structure which is arranged on the first electrode on which the passivation layer is arranged; a second electrode which is arranged on the OLED light emitting structure; and an encapsulation layer which is arranged on the second electrode.
    Type: Grant
    Filed: December 4, 2018
    Date of Patent: April 6, 2021
    Assignee: LG Display Co., Ltd.
    Inventors: Kyu-Hwang Lee, Taejoon Song, Chulho Kim, Jungeun Lee, Shin-Bok Lee, Taeok Kim
  • Patent number: 10966318
    Abstract: A component carrier includes an electrically insulating layer structure having a first main surface and a second main surface with a through hole extending through the electrically insulating layer structure between the first main surface and the second main surface. An electrically conductive bridge structure connects opposing sidewalls of the electrically insulating layer structure delimiting the through hole. A vertical thickness of the electrically insulating layer structure is not more than 200 ?m and a narrowest vertical thickness of the bridge structure is at least 20 ?m.
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: March 30, 2021
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Ismadi Bin Ismail, Valerian Yun Khim Chung, Alex Yucun Dou, Seok Kim Tay
  • Patent number: 10964860
    Abstract: A method of packaging a semiconductor illumination module is provided. The method includes the following steps. In a step (a), a substrate is provided. The substrate is selected from one of a flexible printed circuit board, a metal core circuit board, a printed circuit board or a ceramic printed circuit board. The substrate includes a solder mask layer with an opening, and the opening has a width R. In a step (b), a light-emitting element is installed in the opening. In a step (c), an encapsulant injection device is used to inject a packaging encapsulant into the opening. In a step (d), a sealed lens structure is formed to cover the light-emitting element, wherein the sealed lens structure has a height h.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: March 30, 2021
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Hung-Wei Kuo, Ya-Chin Tu, Chung-Yuan Chen
  • Patent number: 10964911
    Abstract: A thin-film encapsulation structure of an active-matrix organic light-emitting, diode (AMOLED) is provided, and a touch electrode layer is disposed thereon. The thin-film encapsulation structure includes a first ceramic layer, an organic layer, and a second ceramic layer. The second ceramic layer has a first film layer and a second film layer; a side end of the second film layer is contracted inward so that a recessed first step portion is defined at the side end of the second film layer and a side end of the first film layer. The second ceramic layer is changed into a design of a multi-layer stacked structure, and a recessed step portion is formed at the side ends of the upper and lower layers. Therefore, the traces can be placed in a larger space and resistant to line breakage, thereby ensuring the yield and product performance.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: March 30, 2021
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
    Inventor: Xuwen Cao
  • Patent number: 10957735
    Abstract: An LED display includes a wafer-level substrate, a first adhesive layer, a plurality of first light-emitting assemblies, and a first conductive structure. The wafer-level substrate includes a plurality of control circuits, each of which has a conductive contact. The first adhesive layer is disposed on the wafer-level substrate. Each first light-emitting assembly includes a plurality of first LED structures disposed on the first adhesive layer. The first conductive structure is electrically connected between the corresponding first LED structure and the control circuit. Thereby, each first light-emitting assembly including a plurality of first LED structures and a wafer-level substrate having a plurality of control circuits can be connected to each other through a first adhesive layer.
    Type: Grant
    Filed: April 19, 2019
    Date of Patent: March 23, 2021
    Assignee: ASTI GLOBAL INC., TAIWAN
    Inventor: Chien-Shou Liao
  • Patent number: 10959336
    Abstract: A method of liquid assisted binding is provided. The method includes: forming a conductive pad on the substrate; placing a micro device on the conductive pad, such that the micro device is in contact with the conductive pad in which the micro device comprises an electrode facing the conductive pad; forming a liquid layer on the micro device and the substrate after said placing, such that a part of the liquid layer penetrates between the micro device and the conductive pad, and the micro device is gripped by a capillary force produced by said part of the liquid layer; and evaporating the liquid layer such that the electrode is bound to the conductive pad and is in electrical connection with the conductive pad.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: March 23, 2021
    Assignee: MIKRO MESA TECHNOLOGY CO., LTD.
    Inventor: Li-Yi Chen
  • Patent number: 10950756
    Abstract: The embodiments of the present invention relate to a light emitting device, a method for manufacturing a light emitting device, a light emitting device package, and a lighting device. A light emitting device according to an embodiment has: a light emitting structure including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer disposed between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer; a passivation layer disposed on the light emitting structure; and an insulating reflective layer disposed on the passivation layer. The passivation layer may include a first region disposed on an upper surface of the light emitting structure, and a second region disposed on side surfaces of the first conductivity type semiconductor layer, the second conductivity type semiconductor layer, and the active layer.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: March 16, 2021
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sung Min Hwang, Sun Woo Park, Chang Hyeong Lee
  • Patent number: 10943892
    Abstract: A light-emitting semiconductor chip, a light-emitting component and a method for producing a light-emitting component are disclosed. In an embodiment a light-emitting semiconductor chip includes a light-transmissive substrate having a top surface, a bottom surface opposite the top surface, a first side and a second side surface arranged opposite the first side surface, a semiconductor body arranged on the top surface of the substrate and a contacting including a first current distribution structure and a second current distribution structure, wherein the first current distribution structure and the second current distribution structure are freely accessible from a side of the semiconductor body facing away from the substrate, and wherein the semiconductor chip, on the side of the semiconductor body facing away from the substrate and on the bottom surface of the substrate, is free of any connection point configured to electrically contact the first and second current distribution structures.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: March 9, 2021
    Assignee: OSRAM OLED GMBH
    Inventor: Siegfried Herrmann
  • Patent number: 10943860
    Abstract: A semiconductor device assembly that includes a flexible member having a first portion connected to a substrate and a connector attached to a second portion of the flexible member. The connector is electrically connected to the substrate via a conducting layer within the flexible member. The substrate may be a semiconductor device, such as a chip. The connector may be configured to connect the semiconductor device to another semiconductor device assembly or a system board, such as a printed circuit board. A material may encapsulate at least a portion of the substrate of the semiconductor assembly. The semiconductor device assembly may be formed by selectively connecting the flexible member to a first substrate. A second substrate and connector may then be connected to the flexible member. A release layer may be used to release the assembly of the second substrate, flexible member, and connector from the first substrate.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: March 9, 2021
    Assignee: MICRON TECHNOLOGY, INC.
    Inventors: Chan H. Yoo, Eiichi Nakano
  • Patent number: 10943861
    Abstract: A semiconductor device includes a semiconductor element, a first lead supporting the semiconductor element, a second lead separated from the first lead, and a connection lead electrically connecting the semiconductor element to the second lead. The connection lead has an end portion soldered to the second lead. This connection-lead end portion has a first surface facing the semiconductor element and a second surface opposite to the first surface. The second lead is formed with a recess that is open toward the semiconductor element. The recess has a side surface facing the second surface of the connection-lead end portion. A solder contact area of the second surface of the connection-lead end portion is larger than a solder contact area of the first surface of the connection-lead end portion.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: March 9, 2021
    Assignee: ROHM CO., LTD.
    Inventors: Kota Ise, Koshun Saito
  • Patent number: 10937938
    Abstract: A light emitting device includes a first light emitting cell, a second light emitting cell, a first conductive pattern, a second conductive pattern, and a connection pattern. The connection pattern includes contact portions electrically connected to a second conductivity type semiconductor layer of the first light emitting cell and a first conductivity type semiconductor layer of the second light emitting cell. At an edge of a first region facing the second light emitting cell, one contact portion of the first conductive pattern is disposed between the contact portions of the connection pattern electrically connected to the second conductivity type semiconductor layer of the first light emitting cell, and one contact portion of the first conductive pattern is open outwards.
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: March 2, 2021
    Assignee: SEOUL VIOSYS CO., LTD.
    Inventors: Se Hee Oh, Min Woo Kang, Jong Kyu Kim, Hyun A Kim
  • Patent number: 10937671
    Abstract: Matching of coefficient of thermal expansion for heat spreaders and carrier die can facilitate optoelectronic die alignment. In one example, an apparatus comprises a carrier die comprising a first coefficient of thermal expansion, two or more optoelectronic die disposed on the carrier die, and a spreader. The spreader can comprise a second material coefficient of thermal expansion matched to the first coefficient of thermal expansion. Additionally, a thermal interface material is disposed between the spreader and the one or more optoelectronic die.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: March 2, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Fuad Elias Doany, Mark Schultz
  • Patent number: 10935202
    Abstract: The invention describes a LED lighting unit comprising a heatsink; an LED module mounted onto the heatsink, which LED module comprises a carrier, a number of LED dies mounted on the carrier, and LED electrode contacts formed on the carrier; an overmould formed to encase the heatsink and to expose the mounting surface region of the heatsink upon which the LED module is mounted; and an electrical interface also encased in the overmould and arranged to electrically connect the LED module to a power supply. The invention further describes a method of manufacturing such an LED lighting unit.
    Type: Grant
    Filed: October 9, 2017
    Date of Patent: March 2, 2021
    Assignee: LUMILEDS LLC
    Inventors: Jürgen Mertens, Astrid Marchewka
  • Patent number: 10937996
    Abstract: A display apparatus, comprising an element substrate including a display portion formed by arraying a plurality of organic light emitting elements on a base and a connecting portion provided on the base so as to be separated from the display portion, a driving substrate connected to the connecting portion so as to be configured to drive the display portion, and a heat-insulating portion provided between the display portion and the connecting portion in planar view in the base and configured to have lower heat conductivity than the base.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: March 2, 2021
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Hidemasa Oshige
  • Patent number: 10928567
    Abstract: A plurality of light-emitting units (140) are provided on a first surface (100a) of a substrate (100) and are separated from each other. Each light-emitting unit (140) includes a light-transmitting first electrode (110), an organic layer (120), and a light-reflective second electrode (130). The organic layer (120) is located between the first electrode (110) and the second electrode (130). A light-transmitting region is located between the light-emitting units (140) and transmits light in the thickness direction of a light-emitting device (10). An optical filter (200) overlaps the light-transmitting region and does not overlap the plurality of light-emitting units (140).
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: February 23, 2021
    Assignee: PIONEER CORPORATION
    Inventors: Teruichi Watanabe, Hiroki Tan, Isamu Ohshita