With Housing Or Contact Structure Patents (Class 257/99)
  • Patent number: 11411139
    Abstract: Textured optoelectronic devices and associated methods of manufacture are disclosed herein, in several embodiments, a method of manufacturing a solid state optoelectronic device can include forming a conductive transparent texturing material on a substrate. The method can further include forming a transparent conductive material on the texturing material. Upon heating the device, the texturing material causes the conductive material to grow a plurality of protuberances. The protuberances can improve current spreading and light extraction from the device.
    Type: Grant
    Filed: July 7, 2020
    Date of Patent: August 9, 2022
    Assignee: Micron Technology, Inc.
    Inventors: Lifang Xu, Scott D. Schellhammer, Shan Ming Mou, Michael J. Bernhardt
  • Patent number: 11411138
    Abstract: The present disclosure relates to a display device and a fabrication method thereof, and more particularly, to a display device using a semiconductor light emitting device. The display device includes a semiconductor light emitting device disposed on a substrate, and having a first conductive electrode disposed on an upper edge of the semiconductor light emitting device, and a second conductive electrode disposed on an upper central portion of the semiconductor light emitting device and surrounded by the first conductive electrode, a passivation layer disposed to cover a part of an upper surface of the semiconductor light emitting device, a first wiring electrode electrically connected to the first conductive electrode and a second wiring electrode electrically connected to the second conductive electrode.
    Type: Grant
    Filed: January 28, 2020
    Date of Patent: August 9, 2022
    Assignee: LG ELECTRONICS INC.
    Inventors: Junghoon Kim, Byoungkwon Cho
  • Patent number: 11411054
    Abstract: A display apparatus includes: a substrate including a thin-film transistor including an electrode, a non-display area, and a pad area including a lower and an upper conductive layer facing each other with an insulating layer therebetween. The lower conductive layer includes: a first conductive layer defining an end surface of the display apparatus, and a second conductive layer spaced apart from the first conductive layer to define a space between the first and second conductive layers, the insulating layer defines a first opening portion corresponding to the space, and the upper conductive layer is in a same layer as the electrode of the thin-film transistor, the upper conductive layer extending into the first opening portion corresponding to the space between the first and second conductive layers.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: August 9, 2022
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jungtae Kim, Dongyoon So, Youngrae Kim, Kyungmin Park
  • Patent number: 11411143
    Abstract: A light emitting device includes a substrate including a light emitting region. A first electrode is in the light emitting region. A second electrode is in the light emitting region and spaced apart from the first electrode. A light emitting element is between the first electrode and the second electrode. A first contact electrode connects an end of the light emitting element to the first electrode. A second contact electrode connects another end of the light emitting element to the second electrode. The first contact electrode and the second contact electrode have a thickness larger than or equal to that of the first electrode and the second electrode.
    Type: Grant
    Filed: July 5, 2019
    Date of Patent: August 9, 2022
    Assignee: Samsung Display Co., Ltd.
    Inventor: Seung Hoon Lee
  • Patent number: 11401446
    Abstract: An object of the present invention is to provide an electroconductive adhesive composition which has excellent thermal conductivity and which, even when repeatedly undergoing fluctuations in temperature, is less apt to cause adherend separation. The present invention relates to an electroconductive adhesive composition which contains: an electroconductive filler (A) containing metal particles (a1) having an average particle diameter of 0.5-10 ?m and silver particles (a2) having an average particle diameter of 10-200 nm; and particles (B) of a thermoplastic resin which is solid at 25° C.
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: August 2, 2022
    Assignee: TANAKA KIKINZOKU KOGYO K.K.
    Inventors: Koyo Kobori, Yoshito Imai, Shintaroh Abe, Takeshi Kondo
  • Patent number: 11398537
    Abstract: An organic light-emitting display apparatus includes: a first substrate; an insulating layer on the first substrate; a signal wiring on the insulating layer; an organic light-emitting device on the first substrate, the organic light-emitting device defining an active area and including a first electrode, a second electrode, and an intermediate layer between the first and second electrodes; a passivation layer on the insulating layer; and a metal layer on the passivation layer at an outer region adjacent to the active area, separated from the first electrode, and contacting the second electrode and the signal wiring, wherein a first opening is in the passivation layer at the outer region, and the metal layer contacts the insulating layer at the first opening.
    Type: Grant
    Filed: May 26, 2020
    Date of Patent: July 26, 2022
    Assignee: Samsung Display Co., Ltd.
    Inventors: Won-Kyu Kwak, Han-Sung Bae, Sun-Youl Lee
  • Patent number: 11393803
    Abstract: A light emitting device includes a substrate and a light emitting element mounted on the substrate, a light transmissive member, covering member, first and second protruding members, and a protective element. The light transmissive member is disposed on an upper surface of the light emitting element. The covering member covers an upper surface of the substrate, a lateral surface of the light emitting element, and at least a portion of a lateral surface of the light transmissive member such that an upper surface of the light transmissive member is exposed. The first protruding member and the second protruding member are provided on the substrate such that the light emitting element and the light transmissive member are positioned between the first protruding member and the second protruding member. The protective element is mounted on the substrate so as to be positioned between the light emitting element and the second protruding member.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: July 19, 2022
    Assignee: NICHIA CORPORATION
    Inventors: Kenji Ozeki, Hiroki Fukuta
  • Patent number: 11391986
    Abstract: A display apparatus includes a display panel configured to display an image; a light source module provided behind a rear surface of the display panel and configured to emit light to the display panel, the light source module including a glass substrate and a light source provided behind a rear surface of the glass substrate; and a rear chassis covering the display panel and the light source module, wherein the light source is provided between the glass substrate and the rear chassis.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: July 19, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sungho Kim, Chanhong Park, Junghyun Yoon, Hyojae Jang, Sungho Choi
  • Patent number: 11393946
    Abstract: The present invention discloses a micro LED structure including a first semiconductor layer, a first electrode, a second electrode, and an active layer. The first semiconductor layer has two opposite sides defined as a first surface and a second surface. The first semiconductor layer has a doped region located therein and exposed on the first surface. A pn junction is formed between the doped region and the first semiconductor layer. The first electrode and the second electrode, located on the first surface, are capable of electrically connecting to the first semiconductor layer and the doped region respectively. The active layer is adjacent to the second surface. Wherein the first semiconductor layer is a first doping type, and the doped region is a second doping type different from the first doping type, and the first semiconductor layer and the pn junction are located at identical side of the active layer.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: July 19, 2022
    Assignee: PlayNitride Display Co., Ltd.
    Inventors: Yen-Chun Tseng, Tzu-Yang Lin, Yi-Chun Shih
  • Patent number: 11387378
    Abstract: A photodetector includes an UV transparent n-type structure, an UV transparent p-type structure, and a photon absorbing region sandwiched between the n-type structure and the p-type structure; a p-contact layer formed on the p-type structure; and a p-ohmic contact of a thickness in the range of 0.2-100 nm formed on the p-contact layer, wherein the p-ohmic contact comprises one or more layer of metal oxide.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: July 12, 2022
    Assignee: BOLB INC.
    Inventors: Jianping Zhang, Ling Zhou, Ying Gao
  • Patent number: 11387394
    Abstract: A micro light-emitting diode device includes a substrate, a micro light-emitting diode, a first protection layer and a second protection layer. The micro light-emitting diode is adapted to be disposed on the substrate. The first protection layer is disposed on a first portion of an outer side wall of the micro light-emitting diode and has a gap from the substrate. The second protection layer is disposed on a second portion of the outer side wall of the micro light-emitting diode. The second protection layer is located in the gap between the first protection layer and the substrate and covers a part of the first protection layer. A maximum thickness of the first protection layer on the outer side wall is less than a maximum thickness of the second protection layer on the outer side wall.
    Type: Grant
    Filed: December 10, 2019
    Date of Patent: July 12, 2022
    Assignee: PlayNitride Display Co., Ltd.
    Inventors: Pei-Hsin Chen, Yi-Chun Shih, Chih-Ling Wu
  • Patent number: 11380863
    Abstract: Embodiments of a flexible electroluminescent (EL) device are described. An EL device includes a device stack and a flexible substrate configured to support the device stack. The device stack can include a anode and a cathode, a quantum dot (QD) film positioned between the anode and the cathode and configured to produce light having a first peak wavelength. The device stack further includes a patterned insulating layer disposed on the anode and configured to form electrically active regions in the device stack and to control emission of the light from the EL device through the electrically active regions. The EL device further includes an encapsulation layer disposed on the cathode.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: July 5, 2022
    Assignee: Nanosys, Inc.
    Inventors: Donald A. Zehnder, Dylan C. Hamilton, Ruiqing Ma, Jesse R. Manders
  • Patent number: 11367809
    Abstract: Embodiments relate to a light emitting device package and a light source device. A light emitting device package according to the embodiment may include a first package body; a second package body disposed on the first package body, and comprising an opening passing through an upper surface and a lower surface of the second package body; and a light emitting device disposed in the opening, and comprising a first bonding part and a second bonding part. The first package body may include a first opening and a second opening that pass through an upper surface and a lower surface of the first package body. The upper surface of the first package body may be coupled with the lower surface of the second package body, the first bonding part may be disposed on the first opening, and the second bonding part may be disposed on the second opening.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: June 21, 2022
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Ki Seok Kim, Won Jung Kim, June O Song, Chang Man Lim
  • Patent number: 11362482
    Abstract: An integrated Fourier domain mode-locked optoelectronic oscillator and its application and a communication system are provided, which relates to the technical field of microwave photonics. The integrated Fourier domain mode-locked optoelectronic oscillator includes an optoelectronic chip and an electronic chip. The optoelectronic chip includes a laser, a modulator, an optical notch filter, and a photodetector coupled via an optical waveguide. The electronic chip includes an electrical amplifier and a power splitter coupled via a coplanar microwave waveguide. The volume, weight and power consumption of the Fourier domain mode-locked optoelectronic oscillator is greatly reduced by integrating all the devices on the chip. A tunable sweeping microwave signal output is realized, and the sweeping speed of the output signal is increased. The integrated Fourier domain mode-locked optoelectronic oscillator can be used in radars and communication systems.
    Type: Grant
    Filed: May 11, 2020
    Date of Patent: June 14, 2022
    Assignee: Institute of Semiconductors, Chinese Academy of Sciences
    Inventors: Ming Li, Tengfei Hao, Dapeng Liu, Nuannuan Shi, Wei Li, Ninghua Zhu
  • Patent number: 11355681
    Abstract: A light emitting device including a fluorescent material with reduced hue, and a method of manufacturing the light emitting device are provided. A light emitting device 100 includes: a light emitting element 1; a first light-transmissive member 3 covering the light emitting element 1; and a light diffusing member 5 contained in the first light-transmissive member 3. The light diffusing member 5 includes hollow particles. The surface of the first light-transmissive member 3 has irregular shapes attributed to the light diffusing member 5. The first light-transmissive member 3 is covered with a second light-transmissive member 4. The second light-transmissive member 4 has a convex structure in which the center is the uppermost point. The irregular shapes attributed to the light diffusing member 5 are covered with the second light-transmissive member 4.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: June 7, 2022
    Assignee: NICHIA CORPORATION
    Inventors: Shoichi Kashihara, Masanobu Sato
  • Patent number: 11355679
    Abstract: The light emitting device package disclosed in the embodiment includes a package body including first and second frames, and a first body disposed between the first and second frames; a second body disposed on the package body and including a cavity and a sub-cavity spaced apart from the cavity; a light emitting device disposed in the cavity and including first and second bonding portions; and a protection device disposed in the sub-cavity, wherein the package body and the second body may be coupled to an adhesive member.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: June 7, 2022
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Won Jung Kim, Ki Seok Kim, June O Song, Chang Man Lim
  • Patent number: 11355652
    Abstract: Diodes employing one or more Group III-Nitride polarization junctions. A III-N polarization junction may include two III-N material layers having opposite crystal polarities. The opposing polarities may induce a two-dimensional charge sheet (e.g., 2D electron gas) within each of the two III-N material layers. Opposing crystal polarities may be induced through introduction of an intervening layer between two III-N material layers. The intervening layer may be of a material other than a Group III-Nitride. Where a P-i-N diode structure includes two Group III-Nitride polarization junctions, opposing crystal polarities at a first of such junctions may induce a 2D electron gas (2DEG), while opposing crystal polarities at a second of such junctions may induce a 2D hole gas (2DHG). Diode terminals may then couple to each of the 2DEG and 2DHG.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: June 7, 2022
    Assignee: Intel Corporation
    Inventors: Han Wui Then, Marko Radosavljevic, Sansaptak Dasgupta
  • Patent number: 11339948
    Abstract: A light-emitting device includes a lens of refractive index n having a spherical exit surface of radius R and a luminous element positioned such that at least a portion of an edge of an emitting surface of the luminous element lies on a sphere of radius R/n opposite the exit surface, whereby that portion of the edge of the emitting surface is aplanatically imaged by the spherical exit surface. The light-emitting device may further include one or more reflective sidewalls arranged to reflect a fraction of light emitted from the luminous element before it is refracted by the exit surface. A luminaire incorporating a housing and a light-emitting device of this type is also provided, which may include one or more additional optical elements such as reflectors or lenses to further direct and shape light from the light-emitting device.
    Type: Grant
    Filed: June 1, 2020
    Date of Patent: May 24, 2022
    Assignee: Quarkstar LLC
    Inventors: George E. Smith, Robert C. Gardner
  • Patent number: 11335880
    Abstract: A display includes a display section including a flexible base and an image display layer that is supported by the flexible base and displays an image by utilizing an organic light-emitting phenomenon, in which the display section has a display surface on which the image is to be displayed, a back surface located opposite to the display surface, and a side surface located between the display surface and the back surface and coupled to each of the display surface and the back surface, and a protector provided along at least a portion of the side surface of the display section. The protector includes a metal layer and covers a region extending from a portion of the display surface through the side surface to a portion of the back surface.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: May 17, 2022
    Inventors: Takeshi Yamamoto, Soya Araki, Yoshinori Tachikawa, Yoichiro Eshita, Yohei Azuma, Hayato Niwa
  • Patent number: 11337347
    Abstract: A system for transferring a micro LED includes a micro LED dropped into a solution. The system further includes a micro LED grip body immersed in the solution, the micro LED grip body including a porous member having pores, and gripping the micro LED with a grip surface where the pores are provided. An upper surface of the porous member is configured with a seating recess having a guide inclined portion on which the micro LED is mounted and a shielding portion provided around the seating recess.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: May 17, 2022
    Assignee: POINT ENGINEERING CO., LTD.
    Inventors: Bum Mo Ahn, Seung Ho Park, Sung Hyun Byun
  • Patent number: 11329195
    Abstract: A semiconductor light-emitting device includes a substrate; a first semiconductor layer and a second semiconductor layer formed on the substrate, wherein the first semiconductor layer includes a first exposed portion and a second portion; a plurality of first trenches formed on the substrate and including a surface composed by the first exposed portion; a second trench formed on the substrate and including a surface composed by the second exposed portion at a periphery region of the semiconductor light-emitting device, wherein each of the plurality of first trenches is branched from the second trench; and a patterned metal layer formed on the second semiconductor layer and including a first metal region and a second metal region, and portions of the second metal region are formed in the plurality of first trenches and the second trench to electrically connect to the first exposed portion and the second exposed portion.
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: May 10, 2022
    Assignee: EPISTAR CORPORATION
    Inventors: Chao-Hsing Chen, Jia-Kuen Wang, Tzu-Yao Tseng, Tsung-Hsun Chiang, Bo-Jiun Hu, Wen-Hung Chuang, Yu-Ling Lin
  • Patent number: 11329196
    Abstract: A mounting structure for mounting a set of optoelectronic devices is provided. A mounting structure for a set of optoelectronic devices can include: a body formed of an insulating material; and a heatsink element embedded within the body. A heatsink can be located adjacent to the mounting structure. The set of optoelectronic devices can be mounted on a side of the mounting structure opposite of the heatsink.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: May 10, 2022
    Assignee: Sensor Electronic Technology, Inc.
    Inventors: Michael Shur, Grigory Simin, Alexander Dobrinsky
  • Patent number: 11322485
    Abstract: The present disclosure relates to the field of display, specifically, to a mass transfer method for a light-emitting unit, an array substrate, and a display device. The method comprises: providing a plurality of light-emitting units in an array, wherein each light-emitting unit comprises a first electrode extending to a side edge of the light-emitting unit; providing a base substrate comprising a plurality of areas in an array, each area comprising a second electrode and an electro-curable adhesive thereon; picking up the light-emitting units by a transfer device; applying voltages to the first and second electrodes respectively; aligning the transfer device with the base substrate, such that a portion of each first electrode extending to the side edge of the light-emitting unit contacts a respective electro-curable adhesive; and separating the transfer device from the light-emitting units, such that each light-emitting unit is transferred to a respective area of the base substrate.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: May 3, 2022
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventor: Chengtan Zhao
  • Patent number: 11322486
    Abstract: Discussed is a display device including a lower substrate on which a lower electrode is disposed; a flat layer disposed on the lower substrate and having a plurality of holes; a plurality of light-emitting devices respectively disposed in of the plurality of holes; a magnetic portion disposed on the lower substrate and having an magnetic property; and a reaction portion disposed at each of the plurality of light-emitting devices and forming an attractive force with the magnetic portion, wherein a magnetization direction of the magnetic portion is perpendicular to the lower substrate.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: May 3, 2022
    Assignee: LG ELECTRONICS INC.
    Inventor: Kiseong Jeon
  • Patent number: 11318318
    Abstract: A device casing includes a wall having a metallic substrate and electrical connection of a feedthrough that includes a metal through-element made at least in a zone of isolation of the area of the feedthrough from the substrate material, in the form of an islet of closed contour, physically and electrically isolated from the substrate. An interface for coupling the through-element to the substrate provides the mechanical securing of the through-element to the substrate and the electrical isolation thereof and includes a peripheral lateral layer made of an electrically isolating material that surrounds the through-element over the whole periphery thereof and extends transversally through the thickness of the thinned area of the substrate. The substrate, the through-element and the lateral layer form a monolithically integrated unit, and the lateral layer provides essentially and directly both the mechanical securing and the electrical isolation between through-element and substrate.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: May 3, 2022
    Inventor: Bertrand Boutaud
  • Patent number: 11322671
    Abstract: The present disclosure provides a light-emitting diode, a method for manufacturing the same, a backlight source and a display device. The light-emitting diode includes a support having a bottom wall, a light-emitting chip on the support, and a die bonding structure. A through hole is provided in the bottom wall. At least a portion of the die bonding structure is located in the through hole. The light-emitting chip is attached to the bottom wall through the die bonding structure.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: May 3, 2022
    Assignees: BOE OPTICAL SCIENCE AND TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventor: Tao Wang
  • Patent number: 11322667
    Abstract: A semiconductor device package includes a light emitting device disposed on a body, and at least one resin disposed between the body and the light emitting device. The body may include first and second opening parts passing through the body from the upper surface of the body, and at least one recess concavely provided from the upper surface of the body towards the lower surface of the body. The light emitting device may include a first bonding part disposed on the first opening part, and a second bonding part disposed on the second opening part. The at least one recess may be disposed between the first and second opening parts, and along the circumferences of the first and second opening parts. The at least one resin may be provided to the at least one recess. The at least one resin may include a reflective material.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: May 3, 2022
    Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
    Inventors: Chang Man Lim, June O Song, Won Jung Kim
  • Patent number: 11317495
    Abstract: An LED lighting device is disclosed. The LED lighting device includes an LED circuit having at least two LEDs that are mounted on a substrate and separated from each other by a distance of 3 millimeters or less. At least one of the at least two LEDs includes a different phosphor coating than that of at least one other LED of the at least two LEDs. The LED lighting device also includes a switch selectable by an end user to enable a change in a color of light emitted from the LED lighting device by causing one of at least a change in brightness or turning ‘on’ or ‘off’ the at least one LED with the different phosphor coating of the at least two LEDs in the LED circuit. The substrate and the switch are integrated within the LED lighting device.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: April 26, 2022
    Assignee: Lynk Labs, Inc.
    Inventors: Michael Miskin, Robert L. Kottritsch
  • Patent number: 11309460
    Abstract: A light-emitting device includes a first lead having a first lateral surface, a second lead having a second lateral surface, and a resin portion. The first lateral surface of a first lead facing a second lead has a first recess that is recessed so as to be away from the second lead toward the first lead in a top view, and is continuous with an end of a first groove. The second lateral surface of the second lead facing the first lead has a second recess that is recessed so as to be away from the first lead toward the second lead in the top view, and is continuous with an end of a second groove. In the top view, a part of the resin portion is continuously disposed between the end of the first groove and the end of the second groove.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: April 19, 2022
    Assignee: NICHIA CORPORATION
    Inventor: Ryosuke Wakaki
  • Patent number: 11296056
    Abstract: Embodiments of the present disclosure relate to a light-emitting device package and an electronic device. In an embodiment, a light-emitting device package is provided that includes a lead frame, at least two light-emitting devices mounted on the lead frame and configured to emit different wavelengths of a same color of light, and a phosphor configured to emit light having a color different from the color of light emitted from the at least two light-emitting devices. The embodiments of the present disclosure also relate to an electronic device including the light-emitting device package as a light source. According to the embodiments of the present disclosure, various expressible color spaces can be selectively expressed.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: April 5, 2022
    Assignee: LG Display Co., Ltd.
    Inventors: JeYoung Moon, SangHo Han
  • Patent number: 11287312
    Abstract: An optical system and a method of manufacturing an optical system are provided. The optical system includes a carrier, a light emitter, a light receiver, a block structure and an encapsulant. The light emitter is disposed on the carrier. The light receiver is disposed on the carrier and physically spaced apart from the light emitter. The light receiver has a light detecting area. The block structure is disposed on the carrier. The encapsulant is disposed on the carrier and covers the light emitter, the light receiver and the block structure. The encapsulant has a recess over the block structure.
    Type: Grant
    Filed: May 7, 2019
    Date of Patent: March 29, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Hsin-Ying Ho, Ying-Chung Chen
  • Patent number: 11285453
    Abstract: A moisture and hydrogen adsorption getter is provided. The moisture and hydrogen adsorption getter includes a silicon substrate including a concave portion and a convex portion, a silicon oxide layer conformally provided along a surface of the concave portion and a surface of the convex portion and configured to adsorb moisture, and a hydrogen adsorption pattern disposed on the silicon oxide layer. A portion of the silicon oxide layer is exposed between portions of the hydrogen adsorption pattern.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: March 29, 2022
    Assignee: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY ERICA CAMPUS
    Inventors: Yongho Choa, Nusia Eom, Hyoryoung Lim
  • Patent number: 11282981
    Abstract: A light emitting diode pixel for a display including a substrate, a first LED sub-unit disposed on the substrate, a second LED sub-unit disposed on the first LED sub-unit, a third LED sub-unit disposed on at least one of the first and second LED sub-units, and vias formed in the substrate, in which each of the first to third LED sub-units comprises a first conductivity type semiconductor layer and a second conductivity type semiconductor layer, and each of the vias is electrically connected to at least one of the first, second, and third LED sub-units.
    Type: Grant
    Filed: November 22, 2018
    Date of Patent: March 22, 2022
    Assignee: Seoul Viosys Co., Ltd.
    Inventors: Chang Yeon Kim, Jong Hyeon Chae, Chung Hoon Lee, Seong Gyu Jang, Jong Min Jang, Ho Joon Lee
  • Patent number: 11276801
    Abstract: A light-emitting element includes: a semiconductor stacked body; an insulating film located on a p-type semiconductor layer; a p-side electrode located on the insulating film, the p-side electrode comprising a pad portion and an extension portion, the extension portion being continuous with the pad portion in a first direction; a light-transmissive conductive film located on the p-type semiconductor layer and on the insulating film, the light-transmissive conductive film having an opening that is continuous along the extension portion on the insulating film; and a reflective film located between the insulating film and the p-side electrode in the opening. The opening includes a first opening and a second opening. In the second direction, the light-transmissive conductive film is electrically connected to the extension portion of the p-side electrode at a portion adjacent to a region where the first opening is located.
    Type: Grant
    Filed: March 4, 2020
    Date of Patent: March 15, 2022
    Assignee: NICHIA CORPORATION
    Inventor: Shun Kitahama
  • Patent number: 11264370
    Abstract: A light-emitting diode (LED) package structure includes a substrate, an LED, a side wall, an encapsulant, and a waterproof protective coating. The LED is disposed on the substrate, the side wall defines a through hole and is disposed on the substrate, and the LED is accommodated in the through hole. The encapsulant is filled in the through hole and covers the LED. A heterojunction is disposed between the encapsulant and the side wall, and the waterproof protective coating seals the heterojunction. Furthermore, the encapsulant includes a first fluoropolymer, the waterproof protective coating includes a second fluoropolymer, and the light transmittance of the first fluoropolymer is greater than that of the second fluoropolymer.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: March 1, 2022
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Wei-Te Cheng, Kuo-Ming Chiu, Kai-Chieh Liang, Jie-Ting Tsai
  • Patent number: 11264542
    Abstract: A light-emitting device includes a substrate comprising a base member, a first wiring, a second wiring, and a via hole; at least one light-emitting element electrically connected to and disposed on the first wiring; and a covering member having light reflectivity and covering a lateral surface of the light-emitting element and a front surface of the substrate. The base member defines a plurality of depressed portions separated from the via hole in a front view and opening on a back surface and a bottom surface of the base member. The substrate includes a third wiring covering at least one of inner walls of the plurality of depressed portions and electrically connected to the second wiring. A depth of each of the plurality of depressed portions defined from the back surface toward the front surface is larger on a bottom surface side than on an upper surface side of the base member.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: March 1, 2022
    Assignee: NICHIA CORPORATION
    Inventors: Takuya Nakabayashi, Tomokazu Maruyama, Tetsuya Ishikawa
  • Patent number: 11258040
    Abstract: A display device includes an active region and a non-active region. The display device includes a display panel and a polarizing member which is disposed on a surface of the display panel, where the display panel and the polarizing member include a first through hole which penetrates the display panel and the polarizing member in a thickness direction and a hole coating layer which is disposed on an inner wall of the polarizing member of the first through hole.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: February 22, 2022
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventor: Chang Hee Won
  • Patent number: 11257800
    Abstract: A method of manufacturing a light emitting device includes: providing a plurality of first element structures each including a submount, a light emitting element, and a light transmissive member, in this order; disposing the first element structures on a sheet member such that the submount in each of the first element structures faces the sheet member; and forming a first cover member on the sheet member so as to cover lateral faces of the first element structures.
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: February 22, 2022
    Assignee: NICHIA CORPORATION
    Inventors: Takashi Ishii, Dai Wakamatsu, Hiroaki Kageyama
  • Patent number: 11257999
    Abstract: A light emitting element mounting base member for mounting a light emitting element is provided that includes electrical conductor cores, light-reflecting insulating members, and light blocking resin. The insulating members each cover a lateral surface of each of the electrical conductor cores. The insulating members have a reflectivity of 70% or more to light emission wavelength of the light emitting element in a range of 440 nm to 630 nm. The light blocking resin joins at least two insulating members, and is capable of blocking light from the light emitting element by reflecting or absorbing the light. At least one upper surface of the electrical conductor cores, at least one lower surface of the electrical conductor cores are exposed from the insulating members and the light blocking resin respectively.
    Type: Grant
    Filed: July 22, 2020
    Date of Patent: February 22, 2022
    Assignee: NICHIA CORPORATION
    Inventor: Yukitoshi Marutani
  • Patent number: 11251335
    Abstract: A light emitting diode pixel for a display including a substrate, a first LED sub-unit disposed on the substrate, a second LED sub-unit disposed on the first LED sub-unit, a third LED sub-unit disposed on at least one of the first and second LED sub-units, and vias formed in the substrate, in which each of the first to third LED sub-units comprises a first conductivity type semiconductor layer and a second conductivity type semiconductor layer, and each of the vias is electrically connected to at least one of the first, second, and third LED sub-units.
    Type: Grant
    Filed: November 22, 2018
    Date of Patent: February 15, 2022
    Assignee: Seoul Viosys Co., Ltd.
    Inventors: Chang Yeon Kim, Jong Hyeon Chae, Chung Hoon Lee, Seong Gyu Jang, Jong Min Jang, Ho Joon Lee
  • Patent number: 11250735
    Abstract: A flexible display is provided and includes a flexible panel and a backplane disposed on the flexible panel. The flexible panel includes a display section, a bonding section, and a bending section between the display section and the bonding section. The bonding section is connected to the backplane through a bonding layer in response to the bending section being bent and the bonding section reaching a back side of the backplane. The bonding layer includes at least three layers of adhesive layers.
    Type: Grant
    Filed: May 7, 2019
    Date of Patent: February 15, 2022
    Assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
    Inventor: Cuilin Zhu
  • Patent number: 11251347
    Abstract: A semiconductor light source includes at least one first emission unit, at least one second emission unit, and an optics, wherein the optical system has an inner region that converges radiation from the first emission unit, the optical system has an outer region that expands radiation from the second emission unit, a first light emission region of the inner region completely covers the first emission unit when viewed in plan view, and at least partially covers the second emission unit, a second light emission region of the outer region is partially or completely beside the second emission unit when viewed in plan view, and the inner region and the outer region have differently shaped light entry regions.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: February 15, 2022
    Assignee: OSRAM OLED GmbH
    Inventors: Ulrich Streppel, Désirée Queren
  • Patent number: 11239387
    Abstract: A light emitting diode includes: a substrate; a semiconductor stack disposed on the substrate and including a lower semiconductor layer, an upper semiconductor layer and an active layer interposed between the lower semiconductor layer and the upper semiconductor layer, the semiconductor stack having an isolation groove exposing the substrate through the upper semiconductor layer, the active layer and the lower semiconductor layer; a first electrode pad and an upper extension portion electrically connected to the upper semiconductor layer; a second electrode pad and a lower extension portion electrically connected to the lower semiconductor layer; a connecting portion connecting the upper extension portion and the lower extension portion to each other across the isolation groove; a first current blocking layer interposed between the lower extension portion and the lower semiconductor layer; and a second current blocking layer interposed between the second electrode pad and the lower semiconductor layer.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: February 1, 2022
    Assignee: Seoul Viosys Co., Ltd.
    Inventors: Keum Ju Lee, Seom Geun Lee, Kyoung Wan Kim, Yong Woo Ryu, Mi Na Jang
  • Patent number: 11237430
    Abstract: A display module is provided, which provides a first sealing structure disposed between a flexible circuit board and a surface of a cover plate facing a backlight housing and a second sealing structure disposed between the flexible circuit board and a surface of a side wall of the backlight housing facing the cover plate. It can isolate the external water vapor and dust from entering the interior of the display module, thereby improving the dustproof and waterproof capabilities of the display module, and further improving the reliability of the display module.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: February 1, 2022
    Assignee: WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Shiyuan Xiao
  • Patent number: 11231631
    Abstract: The disclosed embodiments generally relate to a method, system and apparatus for forming a custom-sized display panel. An exemplary method to form a custom display from a large sheet of pixels includes: providing a sheet of pixels having a TFT substrate, a liquid crystal layer and a second substrate, the sheet of pixels having a first perimeter, the liquid crystal medium interposed between the TFT substrate and the second substrate; forming a display panel from the sheet of pixels, the display panel having a display panel perimeter, the second display having a first edge defined by the TFT substrate extending beyond the second substrate to thereby expose an electrical trace on the TFT substrate; sealing the liquid crystal layer on the first edge; conductively exposing the electrical trace on the TFT substrate; and forming a column driver line on the TFT substrate to communicate a driver signal to the second display.
    Type: Grant
    Filed: August 17, 2020
    Date of Patent: January 25, 2022
    Inventor: Richard McCartney
  • Patent number: 11227979
    Abstract: A light-emitting device includes a substrate comprising a base member, a first wiring, a second wiring, and a via hole; at least one light-emitting element electrically connected to and disposed on the first wiring; and a covering member having light reflectivity and covering a lateral surface of the light-emitting element and a front surface of the substrate. The base member defines a plurality of depressed portions separated from the via hole in a front view and opening on a back surface and a bottom surface of the base member. The substrate includes a third wiring covering at least one of inner walls of the plurality of depressed portions and electrically connected to the second wiring. A depth of each of the plurality of depressed portions defined from the back surface toward the front surface is larger on a bottom surface side than on an upper surface side of the base member.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: January 18, 2022
    Assignee: NICHIA CORPORATION
    Inventors: Takuya Nakabayashi, Tomokazu Maruyama, Tetsuya Ishikawa
  • Patent number: 11227556
    Abstract: A display apparatus includes: a liquid crystal panel; and a light apparatus on which the liquid crystal panel is disposed, the light apparatus including: a substrate; a plurality of dimming blocks including a first dimming block and a second dimming block disposed immediately next to the first dimming block, each of the plurality of dimming blocks including at least one respective light source disposed on a first side of the substrate; and a plurality of driving devices disposed on the first side of the substrate and including a first driving device disposed in the first dimming block and a second driving device disposed in the second dimming block, each driving device of the plurality of driving devices being configured to provide a driving current to the at least one respective light source included in a respective one of the plurality of dimming blocks, wherein the first driving device and the second driving device are disposed at relatively different positions respectively within the first dimming block a
    Type: Grant
    Filed: June 17, 2021
    Date of Patent: January 18, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sungyeol Kim, Sungbok Yang, Seokwoo Yong, Kyehoon Lee, Junsung Choi
  • Patent number: 11222999
    Abstract: A device with a lead frame, a moulded body and a plurality of semiconductor chips configured to generate radiation is specified, wherein the lead frame has two connection parts for external electrical contacting of the device; the moulded body is formed to the lead frame; the moulded body is transmissive to the radiation generated during operation of the device; and the semiconductor chips are arranged on a front-side of the moulded body and each of the semiconductor chips overlap with the device with the moulded body in plan view of the device. Furthermore, a method for producing devices is specified.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: January 11, 2022
    Assignee: OSRAM OLED GmbH
    Inventors: Reiner Windisch, Florian Bösl, Andreas Dobner, Matthias Sperl
  • Patent number: 11222994
    Abstract: A light emitting diode pixel for a display including a substrate, a first LED sub-unit disposed on the substrate, a second LED sub-unit disposed on the first LED sub-unit, a third LED sub-unit disposed on at least one of the first and second LED sub-units, and vias formed in the substrate, in which each of the first to third LED sub-units comprises a first conductivity type semiconductor layer and a second conductivity type semiconductor layer, and each of the vias is electrically connected to at least one of the first, second, and third LED sub-units.
    Type: Grant
    Filed: November 22, 2018
    Date of Patent: January 11, 2022
    Assignee: Seoul Viosys Co., Ltd.
    Inventors: Chang Yeon Kim, Jong Hyeon Chae, Chung Hoon Lee, Seong Gyu Jang, Jong Min Jang, Ho Joon Lee
  • Patent number: 11223028
    Abstract: Provided are an encapsulation film, a product for encapsulating an organic electronic device (OED) using the same, and a method of encapsulating an OED. The encapsulation film may effectively block moisture or oxygen permeating into the OED from an external environment, provide high reliability due to increases in a lifespan and durability of the OED, and minimize align errors in a process of attaching the film to a substrate.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: January 11, 2022
    Assignee: LG Chem, Ltd.
    Inventors: Hyun Jee Yoo, Seung Min Lee, Hyun Suk Kim, Suk Ky Chang, Jung Ok Moon