With Housing Or Contact Structure Patents (Class 257/99)
  • Patent number: 10734369
    Abstract: A receiver optical module that receives an optical signal and generating an electrical signal corresponding to the optical signal is disclosed. The module includes a photodiode (PD), a sub-mount, a pre-amplifier, and a stem. The sub-mount, which is made of insulating material, mounts the PD thereon. The pre-amplifier, which receives the photocurrent generated by the PD, mounts the PD through the sub-mount with an adhesive. The pre-amplifier generates an electrical signal corresponding to the photocurrent and has signal pads and other pads. The stem, which mounts the pre-amplifier, provides lead terminals wire-bonded with the signal pads of the pre-amplifier. The signal pads make distances against the sub-mount that are greater than distances from the other pads to the sub-mount.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: August 4, 2020
    Assignee: Sumitomo Electric Device Innovations, Inc.
    Inventor: Kyohei Maekawa
  • Patent number: 10734552
    Abstract: An embodiment provides a semiconductor device including a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer, an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer, and a plurality of recesses passing through the second conductive semiconductor layer and the active layer and extending to a portion of the first conductive semiconductor layer; a plurality of first electrodes disposed inside the plurality of recesses and electrically connected with the first conductive semiconductor layer; and a second electrode electrically connected with the second conductive semiconductor layer, wherein a ratio of a first area of where the plurality of first electrodes are in contact with the first conductive semiconductor layer and a second area of where the second electrode is in contact with the second conductive semiconductor layer (first area:second area) ranges from 1:3 to 1:10.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: August 4, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Su Ik Park, Youn Joon Sung, Min Sung Kim, Yong Gyeong Lee, Eun Dk Lee
  • Patent number: 10734550
    Abstract: Disclosed herein is a semiconductor device including: a semiconductor structure including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer interposed between the first conductive semiconductor layer and the second conductive semiconductor layer; a first insulating layer disposed on the semiconductor structure; a first electrode disposed on the first conductive semiconductor layer through a first hole of the first insulating layer; a second electrode disposed on the second conductive semiconductor layer through a second hole of the first insulating layer; a first cover electrode disposed on the first electrode; and a second cover electrode disposed on the second electrode, wherein the second cover electrode includes a plurality of pads, and a connecting portion configured to connect the plurality of pads, a width of the connecting portion is smallest at a central position between the adjacent pads, and an area ratio between the second cover electrode and the
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: August 4, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Youn Joon Sung, Rak Jun Choi
  • Patent number: 10734557
    Abstract: A light-emitting device includes a package structure and a light-emitting chip. The package structure has a light exiting surface, a rear surface facing away from the light exiting surface, a groove inward recessed on the rear surface, and an outer surrounding side wall surrounding the groove. The light-emitting chip is disposed in the groove. The width of the package structure gradually decreases from the light exiting surface to the rear surface. The width of the groove gradually increases from inside to outside of the groove.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: August 4, 2020
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Liangliang Luo, Shu-yong Jia, Wen Lee, Ke-qin Guo
  • Patent number: 10727385
    Abstract: According to one embodiment, a light emitting device includes a first lead, a light emitting element, and a first bonding member. The light emitting element includes a semiconductor stacked body and a first electrode. The semiconductor stacked body includes a light emitting layer. The first electrode is below the semiconductor stacked body. The first bonding member electrically connects the first lead and the first electrode. A lower surface of the first electrode includes a first protrusion, a second protrusion, and a first depression. The first depression is located between the first and second protrusions. The first protrusion has a first side surface. The second protrusion has a second side surface facing the first side surface. The first bonding member contacts at least a part of the first side surface. At least a part of the second side surface is separated from the first bonding member.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: July 28, 2020
    Assignee: NICHIA CORPORATION
    Inventor: Ryosuke Wakaki
  • Patent number: 10727383
    Abstract: An LED package structure includes a substrate, an electrode layer and an insulating layer in a coplanar arrangement and disposed on the substrate, an LED chip mounted on the electrode layer and the insulating layer, a phosphor sheet covering entirely a top surface of the LED chip, a first translucent layer disposed on a light emitting surface of the phosphor sheet, and a reflective housing covering the side surfaces of the LED chip and the side surfaces of the phosphor sheet. The light emitting surface has a central region and a ring-shaped region surrounding the central region. The first translucent layer covers at least 60% of an area of the ring-shaped region. A refractive index of the first translucent layer is larger than one and is smaller than that of the phosphor sheet. A top surface of the reflective housing is substantially flush with the light emitting surface.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: July 28, 2020
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Yu-Yu Chang, Shih-Chiang Yen, Yi-Hsuan Chen, Chen-Hsiu Lin
  • Patent number: 10727381
    Abstract: A light emitting device according to one embodiment of the present disclosure includes a light emitting element, a fluorescent material layer, a reflective film, a light-transmissive member, and an absorbing layer. The light emitting element emits first light. The fluorescent material layer is disposed on the light emitting element. The fluorescent material layer is excited by the first light to emit second light being longer in wavelength than the first light. The reflective film is disposed on the fluorescent material layer to reflect part of the first light and transmit the second light. The light-transmissive member is disposed on the reflective film. The absorbing layer is disposed on the light-transmissive member to absorb part of the first light. The light emitting element is identical in area to or smaller in area than the fluorescent material layer in a plan view.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: July 28, 2020
    Assignee: NICHIA CORPORATION
    Inventor: Taiki Yuasa
  • Patent number: 10720550
    Abstract: A method of fabricating an LED includes: providing an epitaxial structure having a growth substrate, a first-type semiconductor layer, an active layer and a second-type semiconductor layer; forming an extended electrode and performing thermal treatment to form ohmic contact with the second-type semiconductor layer; providing a temporary substrate bonded with the epitaxial structure, and removing the growth substrate to expose the surface of the first-type semiconductor layer; forming an ohmic contact layer, a mirror layer and a bonding layer over the exposed surface of the first-type semiconductor layer; providing a conductive substrate bonded with the bonding layer, and removing the temporary substrate to expose part of the surface of the second-type semiconductor layer and the extended electrode; forming a roughening surface via etching of the exposed second-type semiconductor layer; and providing a bonding wire electrode forming a closed loop with the extended electrode.
    Type: Grant
    Filed: September 22, 2018
    Date of Patent: July 21, 2020
    Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Cheng Meng, Chun-Yi Wu, Shufan Yang, Duxiang Wang
  • Patent number: 10720476
    Abstract: A method of manufacturing a flexible display device includes forming a base substrate on a first sacrificial layer formed on a first supporting substrate, forming a display device array on the base substrate, forming a second sacrificial layer on a second supporting substrate, forming a touch array on the second sacrificial layer, adhering the first supporting substrate onto the second supporting substrate using an adhesive, irradiating laser energy onto the first sacrificial layer to remove the first sacrificial layer and separate the first supporting substrate from the base substrate, and irradiating laser energy onto the second sacrificial layer to separate interfaces of the second supporting substrate and the second sacrificial layer from each other, such that the second sacrificial layer is fixed on the touch array. The second sacrificial layer includes at least one of oxidized molybdenum, lead zirconate titanate, gallium nitride, and an amorphous silicon based inorganic material.
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: July 21, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: In Jun Bae, Ji Hye Park, Jae Hwan Oh
  • Patent number: 10720556
    Abstract: A method for manufacturing a light emitting device includes the steps of: disposing a light emitting element on a base; disposing a single or plurality of light-transmissive members on the base so that the light emitting element is interposed between and spaced apart from at least one pair of opposing portions of the single or plurality of light-transmissive members; covering the base, the at least one pair of opposing portions of the single or plurality of light-transmissive members, and the light emitting element with a sealing member containing a phosphor; and cutting the base, the at least one pair of opposing portions of the single or plurality of light-transmissive members, and the sealing member, along paths on which the at least one pair of opposing portions are disposed.
    Type: Grant
    Filed: December 31, 2018
    Date of Patent: July 21, 2020
    Assignee: NICHIA CORPORATION
    Inventor: Yuki Shiota
  • Patent number: 10692843
    Abstract: A flexible polymeric dielectric layer (12) having first and second major surfaces, the first major surface having a conductive layer (20) thereon, the dielectric layer having at least one conduit (10) extending from the second major surface to the first major surface, the conduit having at least one lateral dimension of at least about one centimeter and being at least partially filled with conductive material (18), the conductive layer including at least one conductive feature (21) substantially aligned with the conduit (10), the conductive feature (21) supporting a plurality of light emitting semiconductor devices (22).
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: June 23, 2020
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Ravi Palaniswamy, Jian Xia Gao, Alejandro Aldrin A. Narag, II, Nathan P. Kreutter, Andrew J. Ouderkirk
  • Patent number: 10692545
    Abstract: Systems, apparatuses, and methods for performing efficient data transfer in a computing system are disclosed. A termination voltage generator includes an inverter-based chopper circuit, which uses a first group of an even number of serially connected inverters coupled between the output node of the chopper circuit and the gate terminal of an output pmos transistor. Additionally, a second group of an even number of serially connected inverters is coupled between the output node and the gate terminal of an output nmos transistor. A replica inverter includes two serially connected pmos transistors and two serially connected nmos transistors. Each of one pmos transistor and one nmos transistor receives a generated voltage set as the expected value of the termination voltage. Each of the other pmos transistor and nmos transistor receives an output based on a comparison between the expected value to the output of the replica inverter.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: June 23, 2020
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Milam Paraschou, Balwinder Singh, Gerald R. Talbot, Alushulla Jack Ambundo, Edoardo Prete, Thomas H. Likens, III, Michael A. Margules
  • Patent number: 10693041
    Abstract: High-performance light-emitting diode together with apparatus and method embodiments thereto are disclosed. The light emitting diode devices emit at a wavelength of 390 nm to 470 nm or at a wavelength of 405 nm to 430 nm. Light emitting diode devices are characterized by having a geometric relationship (e.g., aspect ratio) between a lateral dimension of the device and a vertical dimension of the device such that the geometric aspect ratio forms a volumetric light emitting diode that delivers a substantially flat current density across the device (e.g., as measured across a lateral dimension of the active region). The light emitting diode devices are characterized by having a current density in the active region of greater than about 175 Amps/cm2.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: June 23, 2020
    Assignee: SORAA, INC.
    Inventors: Michael J. Cich, Aurelien J. F. David, Christophe Hurni, Rafael Aldaz, Michael Ragan Krames
  • Patent number: 10683454
    Abstract: The present invention relates to a phosphor, a method for preparing the phosphor, an optoelectronic component, and a method for producing the optoelectronic component. The phosphor has the following general formula: La3(1?x)Ga1?yGe5(1?z)O16: 3xA3+, yCr3+, 5zB4+, where x, y, and z do not equal to 0 simultaneously; A represents at least one of Gd and Yb; B represents at least one of Sn, Nb, and Ta. For the phosphor, its emission spectrum is within a red visible light region and a near-infrared region when excited by blue visible light, purple visible light or ultraviolet light; and it has a wide reflection spectrum and a high radiant flux. Therefore, it can be used in optoelectronic components such as LEDs to meet requirements of current medical testing, food composition analysis, security cameras, iris/facial recognition, virtual reality, gaming notebook and light detection and ranging applications.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: June 16, 2020
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Veeramani Rajendran, Mu-Huai Fang, Ru-Shi Liu, Ho Chang, Kuang-Mao Lu, Yan-Shen Lin, Chieh-Yu Kang, Gabriel Nicolo A. De Guzman, Shu-Fen Hu
  • Patent number: 10686106
    Abstract: The disclosure discloses an optoelectronic element comprising: an optoelectronic unit comprising a first metal layer, a second metal layer, and an outermost lateral surface; an insulating layer having a first portion overlapping the optoelectronic unit and extending beyond the lateral surface, and a second portion separated from the first portion in a cross-sectional view; and a first conductive layer formed on the insulating layer.
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: June 16, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Cheng-Nan Han, Tsung-Xian Lee, Min-Hsun Hsieh, Hung-Hsuan Chen, Hsin-Mao Liu, Hsing-Chao Chen, Ching-San Tao, Chih-Peng Ni, Tzer-Perng Chen, Jen-Chau Wu
  • Patent number: 10673016
    Abstract: A display device includes: a substrate; a plurality of pixels on the substrate; an organic encapsulation layer covering a pixel area including at least one pixel; a first inorganic encapsulation layer on the organic encapsulation layer and having a first crack at a pixel area gap; and a second inorganic encapsulation layer on the first inorganic encapsulation layer and filling the first crack.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: June 2, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Oh June Kwon, Jin Koo Kang, Chung Sock Choi
  • Patent number: 10672951
    Abstract: The light emitting element is provided to comprise: a first conductive type semiconductor layer; a mesa; a current blocking layer; a transparent electrode; a first electrode pad and a first electrode extension; a second electrode pad and a second electrode extension; and an insulation layer partially located on the lower portion of the first electrode, wherein the mesa includes at least one groove formed on a side thereof, the first conductive type semiconductor layer is partially exposed through the groove, the insulation layer includes an opening through which the exposed first conductive type semiconductor layer is at least partially exposed, the first electrode extension includes extension contact portions in contact with the first conductive type semiconductor layer through an opening, and the second electrode extension includes an end with a width different from the average width of the second electrode extension.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: June 2, 2020
    Assignee: SEOUL VIOSYS CO., LTD.
    Inventors: Duk Il Suh, Ye Seul Kim, Kyoung Wan Kim, Sang Won Woo, Ji Hye Kim
  • Patent number: 10672961
    Abstract: A light-emitting element package includes a package body having a cavity; a first lead frame and a second lead frame disposed on the package body; a light-emitting element disposed on the bottom surface of the cavity and electrically connected to the first lead frame and the second lead frame; and a molding part surrounding the light-emitting element and disposed in at least a portion of the cavity. Each of the lead frames includes a first part corresponding to a portion of the bottom surface and side walls of the cavity; a second part corresponding to a portion of an upper surface and outer side surfaces of the package body; and a connection part disposed between the first part and the second part width of the connection part is narrower than the width of the first part and the second part in a region adjacent to the connection part.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: June 2, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Byeong Hwang Min, Gam Gon Kim, Bong Kul Min, Byeong Duck Lee
  • Patent number: 10665753
    Abstract: A vertical ultraviolet light-emitting diode has, on an aluminum polar plane of an n-type AlN single crystal substrate, a layer represented by n-type AlXGa1-XN (wherein X is a rational number satisfying 0.5?X?1.0), an active layer, a layer represented by p-type AlYGa1-YN (wherein Y is a rational number satisfying 0.5?Y?1.0) and a p-type GaN layer in this order and which is equipped with a p-electrode formed on the p-type GaN layer and an n-electrode partially provided on a plane on the opposite side to the aluminum polar plane of the n-type AlN single crystal substrate, preferably an n-electrode formed by providing at least one opening functioning as a light extraction window, wherein the shortest distance between the n-electrode and an arbitrary point in a portion where the n-electrode is not provided, is not more than 400 ?m.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: May 26, 2020
    Assignee: Stanley Electric Co., Ltd.
    Inventor: Toru Kinoshita
  • Patent number: 10665573
    Abstract: The invention provides a manufacturing method of micro LED display panel and micro LED display panel. In the manufacturing method, an elastic conductive layer is formed on the upper pixel electrode on the package substrate. When the package substrate and the driving substrate are assembled, the upper pixel electrode and the upper electrode of the micro LED are electrically connected through the elastic conductive layer, and the elasticity of the elastic conductive layer is utilized to fill the height difference between the individual micro LEDs, avoid poor connection between the upper pixel electrode and the upper electrode of the micro LED, and improve the assembling effect of the micro LED display panel and the process yield of the micro LED display panel.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: May 26, 2020
    Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Lixuan Chen
  • Patent number: 10665758
    Abstract: A component having a metal carrier and a method for producing a component are disclosed. In an embodiment the component includes a carrier having a metallic carrier layer, an insulating layer and a first through-contact extending in a vertical direction throughout the carrier layer, wherein the through-contact is electrically isolated from the carrier layer via the insulating layer. The component further includes a semiconductor body and a wiring structure arranged in the vertical direction between the carrier and the semiconductor body at least places and electrically contacting the semiconductor body, wherein the wiring structure has a first connection area and a second connection area, wherein the connection areas adjoin the carrier and are assigned to different electrical polarities of the component, wherein the first through-contact is in electrical contact with one of the connection areas, and wherein the component is configured to be externally electrically connectable via the carrier.
    Type: Grant
    Filed: July 14, 2016
    Date of Patent: May 26, 2020
    Assignee: OSRAM OLED GmbH
    Inventors: Christian Leirer, Thomas Schwarz, Lutz Höppel
  • Patent number: 10660325
    Abstract: The invention concerns an apparatus and a method for deterring birds, comprising a frame fixedly disposed on a structure; a laser light generator connected with the frame, including a laser light source for generating a laser light beam; a supply circuit for supplying the laser light source; driving means connected with the laser light generator, for having at least a part of the laser light generator move; and a control element for controlling the laser light source and the drivable part of the laser light generator, wherein the driving means are arranged for causing a movement to be executed of at least a drivable part of the laser light generator. Thus, an apparatus and a method are obtained having a greater effect in deterring birds.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: May 26, 2020
    Assignee: Steinar Holding B.V.
    Inventors: Steinar Finn Boye Henskes, Pim Roelof Clement Tammes, Tim Sprang
  • Patent number: 10655828
    Abstract: An LED package structure includes an LED frame, a driver frame unit, a housing, LED chips, a driver chip, and a light-permeable package body. The LED frame includes a carrying segment and two bent leads connected to the carrying segment. The driver frame unit includes two side frames each having a functional segment and a bent lead. The housing has a cavity exposing the carrying segment and the two functional segments. The bent leads protrude from a lateral surface of the housing, and curvedly extend to a bottom surface of the housing. The LED chips are mounted on the carrying segment. The driver chip is fixed to one of the two functional segments, and is electrically connected to the other functional segment and the LED chips. The light-permeable package body is filled in the cavity so as to embed the LED chips and the driver chip.
    Type: Grant
    Filed: February 12, 2019
    Date of Patent: May 19, 2020
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Chen-Hsiu Lin, Ming-Kun Weng
  • Patent number: 10658550
    Abstract: A light-emitting diode (LED) package structure includes: a support; an LED chip; and a package cover, wherein: a support circuit is formed over the support; the LED chip is arranged over the support and electrically coupled to the support circuit; a lower surface periphery of the package cover is provided with a groove structure filled with organic binder; and the package cover is arranged over the LED chip and connected to the support via the organic binder.
    Type: Grant
    Filed: November 10, 2018
    Date of Patent: May 19, 2020
    Assignee: XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.
    Inventors: Junpeng Shi, Qiuxia Lin, Zhenduan Lin, Chen-Ke Hsu, Chih-Wei Chao
  • Patent number: 10658545
    Abstract: Provided is a light emitting device capable of reducing light attenuation within the element and having high light extraction efficiency, and a method of manufacturing the light emitting device. The light emitting device has a light emitting element having a light transmissive member and semiconductor stacked layer portion, electrodes disposed on the semiconductor stacked layer portion in this order. The light emitting element has a first region and a second region from the light transmissive member side. The light transmissive member has a third region and a fourth region from the light emitting element side. The first region has an irregular atomic arrangement compared with the second region. The third region has an irregular atomic arrangement compared with the fourth region. The first region and the third region are directly bonded.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: May 19, 2020
    Assignee: NICHIA CORPORATION
    Inventor: Masatsugu Ichikawa
  • Patent number: 10658440
    Abstract: An organic light emitting diode display device includes a substrate including a display region, wherein a plurality of pixel regions are defined in the display region; a first electrode over the substrate and in each of the plurality of pixel regions; a bank including a lower layer and an upper layer on the first electrode, the lower layer disposed on edges of the first electrode and having a first width and a first thickness, the upper layer disposed on the lower layer and having a second width smaller than the first width; an organic emitting layer on the first electrode and a portion of the lower layer; and a second electrode on the organic emitting layer and covering an entire surface of the display region.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: May 19, 2020
    Assignee: LG Display Co., Ltd.
    Inventors: Dae-Jung Choi, Jae-Ki Lee, Ki-Soub Yang, Hwang-Un Seo, Hong-Myeong Jeon, Seung-Ryul Choi, A-Ryoung Lee, Han-Hee Kim, Geum-Young Lee, Kang-Hyun Kim
  • Patent number: 10658452
    Abstract: A display apparatus includes a substrate including a display area and a peripheral area disposed outside of the display area, a plurality of wiring lines disposed in the peripheral area, and an interlayer insulating layer covering the plurality of wiring lines. The interlayer insulating layer includes an upper surface having a first concave-convex surface corresponding to the plurality of wiring lines. The display apparatus further includes a first conductive layer disposed on the interlayer insulating layer and including a second upper surface having a second concave-convex surface corresponding to the first concave-convex surface, a planarization layer disposed on the first conductive layer and having a flat upper surface, a second conductive layer disposed on the planarization layer and having a flat upper surface, and a polarization plate disposed on the second conductive layer.
    Type: Grant
    Filed: March 25, 2019
    Date of Patent: May 19, 2020
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Chulhyun Choi, Zail Lhee, Keunsoo Lee, Kyungchan Chae, Kwangmin Kim, Wonkyu Kwak, Kiwook Kim, Yangwan Kim, Hyunjoon Kim, Jisu Na, Joongsoo Moon
  • Patent number: 10651128
    Abstract: In accordance with certain embodiments, a light-emitting element composed of one or more discrete units configured for light emission is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the light-emitting element or non-coplanarity of the semiconductor die contacts.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: May 12, 2020
    Assignee: COOLEDGE LIGHTING INC.
    Inventors: Michael A. Tischler, Philippe M. Schick, Ian Ashdown, Calvin Wade Sheen, Paul Jungwirth
  • Patent number: 10651119
    Abstract: The present disclosure includes: a flexible resin substrate made of a polyimide resin; an adhesion layer provided on the resin substrate; a semiconductor element mounted face down to the resin substrate and fixed to the resin substrate through the adhesion layer; a via hole provided in the resin substrate to correspond to an element electrode of the semiconductor element; a module electrode provided to the resin substrate to be in contact with the element electrode of the semiconductor element through the via hole; a protruding portion provided, around the element electrode or in a peripheral edge portion of the semiconductor element, on a surface of the semiconductor element; and an escape portion for the adhesion layer covering a head portion of the protruding portion to escape, the escape portion being provided in a region, of the resin substrate, corresponding to the protruding portion.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: May 12, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Takayuki Takano, Tasuku Kawashima
  • Patent number: 10643981
    Abstract: Planar surface mount (SM) micro light emitting diodes (?LEDs) are presented. The fabrication method provides a MOCVD LED structure with a stack including a first doped semiconductor in a first plane, a MQW layer overlying the first doped semiconductor in a second plane, and a second doped semiconductor overlying the MQW layer in a third plane. An electrical insulator is conformally deposited over the etched stack in a fourth plane, and etched to expose the second doped semiconductor, creating a first via. Etching exposes the first doped semiconductor, creating a second via. A first electrode is connected to the second doped semiconductor through the first via, and has a substrate interface surface in a fifth plane with an average planarity tolerance of less than 10 nanometers. A second electrode is connected to the first doped semiconductor through the second via, and has a substrate interface surface in the fifth plane.
    Type: Grant
    Filed: May 8, 2019
    Date of Patent: May 5, 2020
    Assignee: eLux, Inc.
    Inventors: Paul J. Schuele, Changqing Zhan, Kenji Sasaki, Kurt Ulmer, Jong-Jan Lee
  • Patent number: 10644205
    Abstract: A light-emitting diode (LED) package includes: an LED having a polygonal shape in a plan view; a light-transmissive layer directing light from the LED in an upward direction; a wavelength conversion layer changing a wavelength of the light emitted through the light-transmissive layer; and a coating layer covering the light-transmissive layer and reflecting the light emitted through the light-transmissive layer in the upward direction. In a plan view of the light-transmissive layer, a length from a first point corresponding to a vertex of the LED to a second point corresponding to an end of an extension of a diagonal of the LED is greater than or equal to a length from the first point to a third point corresponding to an end of an extension of a side of the LED.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: May 5, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-kuk Lee, Moon-sub Kim, Sung-jin Ahn, Suk-ho Yoon, Seung-hwan Lee
  • Patent number: 10636952
    Abstract: A flexible Peltier device in which emitting heat conversion properties between Peltier elements and an object transferring heat may be improved and a flexible heat-emitting sheet having the Peltier elements bonded thereto may be bent without worrying the separation there between. A flexible Peltier device includes a single or plural Peltier element which is disposed on one surface side of a heat-emitting sheet having flexibility made from heat-conductive rubber containing a heat conductive filler and each semiconductor element which has a heating side and a cooling side and composes the Peltier element at least one of the heating side and the cooling side is bonded integrally to the heat-emitting sheet by a direct covalent bond and/or by an indirect covalent bond through a molecular adhesive at active groups existing on each other surfaces.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: April 28, 2020
    Assignee: ASAHI FR R&D CO., LTD.
    Inventors: Kazuhisa Takagi, Koichi Abe, Nobuyoshi Watanabe, Syuhei Toyoshima
  • Patent number: 10629774
    Abstract: A semiconductor device includes a substrate; first and second semiconductor layers arranged on the substrate and having different conductive types; a third semiconductor layer arranged between the first semiconductor layer and the second semiconductor layer; a first electrode arranged on the first semiconductor layer so as to be electrically connected to the first semiconductor layer; a second electrode arranged on the second semiconductor layer so as to be electrically connected to the second semiconductor layer; and a first insulating layer arranged, between the first electrode and the second electrode, on the exposed first, second and third semiconductor layers, wherein a first end part, close to the second electrode, among both end parts of the first electrode, and/or a second end part, which is both end parts of the second electrode, has an electric field dispersion part.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: April 21, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Jung Hun Oh
  • Patent number: 10629578
    Abstract: An arrangement includes a carrier; an optoelectronic component arranged on the carrier; and a material arranged on the carrier, wherein the carrier includes at least one structural element that hinders flow of the material in a flow direction, the structural element extends transversely to the flow direction, and the structural element has a rounding radius in a plane perpendicular to the transverse extent of the structural element less than 20 ?m.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: April 21, 2020
    Assignee: OSRAM OLED GmbH
    Inventors: Daniel Leisen, Markus Pindl, Simon Jerebic
  • Patent number: 10619842
    Abstract: The present invention belongs to the technical field of high-power LED lamps, and relates to a high-power LED lamp with a heat dissipation effect, including a shell body. The shell body includes a heat sink main body and a heat sink cover board covering on a back surface of the heat sink main body. A plurality of heat pipes are embedded between the heat sink main body and the heat sink cover board, and an LED chip is placed on a front surface of the heat sink main body. The position of the heat sink main body where the LED chip is placed is the chip heat collecting area, all the heat pipes pass under the chip heat collecting area, and are in close contact with the chip heat collecting area.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: April 14, 2020
    Assignee: WUXI JINSHUN LIGHTING TECHNOLOGY CO., LTD.
    Inventor: Haijun Wang
  • Patent number: 10622511
    Abstract: A method of fabricating an illuminated optical device includes forming an electrically conductive circuit. A lens at least partially encapsulates the LED. Additional material may be formed around the lens without obstructing a light-transmitting surface of the lens.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: April 14, 2020
    Assignee: Innotec, Corp.
    Inventors: Jonathan R. DeYoung, Hendrick Harms
  • Patent number: 10622520
    Abstract: A semiconductor light emitting device includes a light-emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, a first transparent electrode layer on the second conductivity-type semiconductor layer, a first insulating layer on the first transparent electrode layer, the first insulating layer including a plurality of through-holes, a reflective electrode layer on the first insulating layer and connected to the first transparent electrode layer through the plurality of through-holes, and a transparent protection layer covering upper and side surfaces of the reflective electrode layer, the transparent protection layer being on a portion of the first insulating layer.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: April 14, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ju Heon Yoon, Jung Hwan Kil, Tae Hun Kim, Hwa Ryong Song, Jae In Sim
  • Patent number: 10615314
    Abstract: A light-emitting device includes a substrate including a substrate second upper surface provided between a substrate bottom surface and a substrate first upper surface in a height direction. A light-emitting element to emit ultraviolet light is provided on the substrate first upper surface. A protective element includes a protective element upper surface provided between the substrate first upper surface and the substrate second upper surface in the height direction. A frame is bonded to the substrate first upper surface via adhesive members to surround the light-emitting element. The frame includes a frame lower surface opposite to the substrate first upper surface and the substrate second upper surface in the height direction to provide a gap between the substrate first upper surface and the frame lower surface. A space in which the light-emitting element is provided communicates with an outside of the light-emitting device via the gap.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: April 7, 2020
    Assignee: NICHIA CORPORATION
    Inventors: Takuya Yamanoi, Nobuhiro Ubahara, Hiroaki Matsumura
  • Patent number: 10615101
    Abstract: An electronic device includes: a base; a wiring pattern formed on the base; an electronic element disposed on the wiring pattern; and a bonding layer interposed between the electronic element and the wiring pattern, wherein an opening is formed in the wiring pattern and the bonding layer is in contact with a portion of the base exposed by the opening in the wiring pattern.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: April 7, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Yasunobu Shoji, Tomoichiro Toyama
  • Patent number: 10607960
    Abstract: The present disclosure relates to a substrate structure with selective surface finishes used in flip chip assembly, and a process for making the same. The disclosed substrate structure includes a substrate body, a metal structure with a first finish area and a second finish area, a first surface finish, and a second surface finish. The metal structure is formed on a top surface of the substrate body, the first surface finish is formed over the first finish area of the metal structure, and the second surface finish is formed over the second finish area of the metal structure. The first surface finish is different from the second surface finish.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: March 31, 2020
    Assignee: Qorvo US, Inc.
    Inventors: Thomas Scott Morris, Robert Hartmann
  • Patent number: 10608153
    Abstract: A light emitting device package is provided. The light emitting device package may include a body having first to sixth side surfaces and a cavity on the first side surface, first and second lead frames on a bottom of the cavity, and a light emitting chip on at least one of the first and second lead frames. The first and second lead frames may have first and second bonding portions on first and second outer side areas of the body and a first heat and second radiating portions bent from the first and second bonding portions. The first and second recesses may include an upper area inclined at a first angle and a lower areas inclined at a second angle from the upper area. The second angle may be smaller than the first angle, and the first and second heat radiating portions of the first and second lead frames may be provided on the lower areas.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: March 31, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Sung Ho Kim
  • Patent number: 10600945
    Abstract: The light emitting device package disclosed in the embodiment includes: first and second frames having first and second through holes; a body disposed between the first and second frames; a light emitting device including a first bonding pad and a second bonding pad; and a conductive part in the first and second through holes. wherein at least one of the first and second bonding pads faces the first and second frames and overlaps with the first and second through holes and includes a contact region contacting the conductive part and a first non-contact non-contacting the conducive part.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: March 24, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Chang Man Lim, Ki Seok Kim, Young Shin Kim, June O Song, Ju Hyeon Oh, Chang Hyeong Lee, Tae Sung Lee, Se Yeon Jung, Byung Yeon Choi, Sung Min Hwang
  • Patent number: 10593849
    Abstract: This disclosure discloses a light-emitting device. The light-emitting device includes: a heat-dissipating structure having a first part and a second part separated from the first part; a light-emitting unit including a light-emitting element with a first pad formed on the first part; and a first transparent enclosing the light-emitting element and having a sidewall; and an adhesive material covering a portion of the sidewall.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: March 17, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Min-Hsun Hsieh, Biing-Jye Lee, Yih-Hua Renn, Jai-Tai Kuo
  • Patent number: 10593839
    Abstract: A contact for solid state light sources is described. The solid state light source can include an active region, such as a light emitting multiple quantum well, and a semiconductor layer, such as a p-type layer, from which carriers (e.g., holes) enter the active region. A contact can be located adjacent to the semiconductor layer and include a plurality of small area contacts extending only partially through the semiconductor layer. The plurality of small area contacts can have a characteristic lateral size at an interface between the small area contact and the semiconductor layer equal to or smaller than a characteristic depletion region width for the plurality of small area contacts.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: March 17, 2020
    Assignee: Sensor Electronic Technology, Inc.
    Inventors: Grigory Simin, Michael Shur, Alexander Dobrinsky
  • Patent number: 10591435
    Abstract: Electropolymerized polymer or copolymer films on a conducting substrate (e.g., graphene) and methods of making such films. The films may be part of multilayer structures. The films can be formed by anodic or cathodic electropolymerization of monomers. The films and structures (e.g., multilayer structures) can be used in devices such as, for example, electrochromic devices, electrical-energy storage devices, photo-voltaic devices, field-effect transistor devices, electrical devices, electronic devices, energy-generation devices, and microfluidic devices.
    Type: Grant
    Filed: April 3, 2015
    Date of Patent: March 17, 2020
    Assignee: Cornell University
    Inventors: Sean Conte, Gabriel G. Rodriguez-Calero, Cen Tan, Kenneth Hernandez-Burgos, Hector D. Abruna, Nicole Ritzert, Daniel C. Ralph, Wan Li
  • Patent number: 10593848
    Abstract: A light-emitting element package according to one embodiment includes first and second lead frames electrically separated from each other; a package body including a slope configured to define a cavity along with at least one of the first or second lead frame; and at least one element unit disposed in an element area of at least one of the first or second lead frame, the element unit including a light-emitting element and a protective element, wherein the package body is disposed between the protective element and the light-emitting element.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: March 17, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Dong Hyun Yu, Bong Kul Min
  • Patent number: 10586895
    Abstract: A LED chip including a first semiconductor layer; an active layer; a second semiconductor layer; a plurality of indentations, wherein each indentation extends downward to reach and expose the first semiconductor layer, wherein each indentation includes a bottom part and two side surfaces in a cross sectional view; an exposing area exposing the first semiconductor layer at a side of the LED chip; a first metal layer disposed on the second semiconductor layer and electrically connecting to the first semiconductor layer; and a first insulating layer formed between the first metal layer and the second semiconductor layer to isolate the first metal layer from the second semiconductor layer; wherein the first metal layer continuously extends to the plurality of indentations, covers the bottom part, the two side surfaces of each indentation and a top surface of the second semiconductor layer around the two side surfaces and contacts the exposing area; and wherein the first metal layer includes a plurality of recesse
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: March 10, 2020
    Assignee: Epistar Corporation
    Inventors: Han-Zhong Liao, Chih-Hsuan Lu, Fang-I Li, Wei-Kang Cheng, Shyi-Ming Pan
  • Patent number: 10586940
    Abstract: There provide an organic light emitting diode substrate and preparation method thereof and a display panel. The preparation method includes: forming a pixel defining layer which defines a pixel region and has a via hole on a base; forming an auxiliary electrode in the via hole; forming a capsule structure encapsulating a conductive liquid on the auxiliary electrode; expanding the capsule structure to be broken so as to enable the conductive liquid to form a connection electrode; and forming a first electrode covering the base, the first electrode being connected to the auxiliary electrode through the connection electrode. In the present disclosure, the connection electrode is formed through the capsule structure encapsulating the conductive liquid, so that the first electrode is connected to the auxiliary electrode through the connection electrode. The preparation process is simpler and the production cost is lower.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: March 10, 2020
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventor: Donghui Yu
  • Patent number: 10586829
    Abstract: Monolithic pixels are implemented by laterally disposed green, blue and red micro-LED sub-pixels separated by dielectric sidewalls. The green and blue sub-pixels are formed with nitride-based material layers while the red sub-pixel is formed with non-nitride-based material layers that yield an optically-efficient red sub-pixel that is intensity-balanced with the green and blue sub-pixels.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: March 10, 2020
    Inventor: Myung Cheol Yoo
  • Patent number: 10586788
    Abstract: A method of producing an optoelectronic component includes providing an optoelectronic semiconductor chip having a first surface on which a first electrical contact and a second electrical contact are arranged; arranging a protection diode on the first contact and the second contact; galvanically growing a first pin on the first electrical contact and a second pin on the second electrical contact; and embedding the first pin, the second pin, and the protection diode in a molded body.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: March 10, 2020
    Assignee: OSRAM OLED GmbH
    Inventors: Jürgen Moosburger, Lutz Höppel, Norwin von Malm