With Housing Or Contact Structure Patents (Class 257/99)
  • Patent number: 10388824
    Abstract: An n-side flattening electrode and a p-side flattening electrode are formed apart from each other on a predetermined region on an insulating film. Recesses are formed according to the level difference due to holes on the surfaces of the n-side flattening electrode and the p-side flattening electrode. Subsequently, the surfaces of the n-side flattening electrode and the p-side flattening electrode are ground until the surfaces become flat. After removal of oxide film, an n-side junction electrode and a p-side junction electrode are formed on the n-side flattening electrode and the p-side flattening electrode, respectively. Since the surfaces of the n-side flattening electrode and the p-side flattening electrode are flattened, the surfaces of the n-side junction electrode and the p-side junction electrode become flat so that the thickness is uniform.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: August 20, 2019
    Assignee: TOYODA GOSEI CO., LTD.
    Inventor: Shingo Totani
  • Patent number: 10388840
    Abstract: Disclosed is a light emitting device and a method of manufacturing the same. The light emitting device includes a body, a first electrode installed in the body and a second electrode separated from the first electrode, a light emitting chip formed on one of the first and second electrodes, and electrically connected to the first and second electrodes, and a protective cap projecting between the first and second electrodes.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: August 20, 2019
    Assignee: LG Innotek Co., Ltd.
    Inventor: Jae Joon Yoon
  • Patent number: 10381294
    Abstract: An electronic device comprises a carrier, a leadframe, a package body and a plurality of electronic components. The carrier has an open top surface, a closed bottom surface and sidewalls extending between the closed bottom surface and the open top surface. The carrier has a circular cavity in its open top surface extending toward the closed bottom surface. The carrier includes a leadframe including a die pad and a plurality of leads. The leads are physically isolated from the die pad by at least one gap. The package body partially encapsulates the leadframe such that a portion of an upper surface of the die pad and a portion of each of the leads are exposed from the package body. The exposed portions of the leads are arranged radially along the die pad. The electronic components are disposed on the die pad.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: August 13, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Hsun-Wei Chan
  • Patent number: 10381533
    Abstract: Disclosed is an optical semiconductor device having an optical semiconductor mounting element including a recess. On an inner side face of the recess is a thermosetting resin composition for light reflection, which, after curing, can realize high reflectance in a range of visible light to near ultraviolet light, has excellent heat deterioration resistance and tablet moldability, and is less likely to cause burrs during transfer molding, and a process for producing the resin composition, and an optical semiconductor element mounting substrate and an optical semiconductor device using the resin composition. The heat curable resin composition for light reflection comprises a heat curable component and a white pigment and is characterized in that the length of burrs caused upon transfer molding under conditions of molding temperature of 100° C. to 200° C.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: August 13, 2019
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Hayato Kotani, Naoyuki Urasaki, Kanako Yuasa, Akira Nagai, Mitsuyoshi Hamada
  • Patent number: 10381535
    Abstract: High-voltage solid-state transducer (SST) devices and associated systems and methods are disclosed herein. An SST device in accordance with a particular embodiment of the present technology includes a carrier substrate, a first terminal, a second terminal and a plurality of SST dies connected in series between the first and second terminals. The individual SST dies can include a transducer structure having a p-n junction, a first contact and a second contact. The transducer structure forms a boundary between a first region and a second region with the carrier substrate being in the first region. The first and second terminals can be configured to receive an output voltage and each SST die can have a forward junction voltage less than the output voltage.
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: August 13, 2019
    Assignee: Micron Technology, Inc.
    Inventor: Martin F. Schubert
  • Patent number: 10371345
    Abstract: A light emitting diode (LED) module for a light fixture includes a substrate with an upper surface and a lower surface. Various pressure multiplying pads are integrally connected to the lower surface, and each pressure multiplying pad extends away from the lower surface. LEDs are attached to the upper surface, along with a set of conductive lines so that each conductive line electrically connects a corresponding LED to a power inputs. Each of the pressure multiplying pads may be positioned opposite a corresponding LED. A flexible lens cover may cover the upper surface and the LEDs, while leaving the lower surface and pressure multiplying pads exposed so that the pads can contact a heat sink of the light fixture.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: August 6, 2019
    Assignee: Eaton Intelligent Power Limited
    Inventors: Christopher D. Nolan, Joseph R. Casper, Walten Peter Owens, Joseph J. Witkowski
  • Patent number: 10371357
    Abstract: An electronic component may include e.g. a solid-state light radiation source, preferably a LED light radiation source, is provided with electrical contact pads for soldering onto a mounting board. The electrical contact pads are arranged over a soldering area having a central portion and a peripheral portion surrounding said central portion. The electrical contact pads include at least one first electrical contact pad arranged at central portion of the soldering area, and at least one second electrical contact pad arranged at peripheral portion of the soldering area.
    Type: Grant
    Filed: November 11, 2015
    Date of Patent: August 6, 2019
    Assignee: OSRAM GmbH
    Inventors: Franco Zanon, Alessio Griffoni
  • Patent number: 10374002
    Abstract: A layered structure includes a thyristor and a light-emitting element. The thyristor at least includes four layers. The four layers are an anode layer, a first gate layer, a second gate layer, and a cathode layer arranged in this order. The light-emitting element is disposed such that the light-emitting element and the thyristor are connected in series. The thyristor includes a semiconductor layer having a bandgap energy smaller than bandgap energies of the four layers.
    Type: Grant
    Filed: February 8, 2018
    Date of Patent: August 6, 2019
    Assignee: FUJI XEROX CO., LTD.
    Inventor: Takashi Kondo
  • Patent number: 10366945
    Abstract: A lead frame includes at least one row of a plurality of unit regions arranged in a first direction. Each of the unit regions includes: a first lead; a second lead; and an isolation region configured to isolate the first lead from the second lead, the isolation region including a bent portion that is located at an end part of the second lead. The first lead has an extending portion extending along the end part of the second lead. The plurality of unit regions includes a first unit region, and a second unit region that is adjacent to the first unit region in the first direction. The first lead of the first unit region is connected to the first lead or second lead of the second unit region via the extending portion.
    Type: Grant
    Filed: February 8, 2017
    Date of Patent: July 30, 2019
    Assignee: NICHIA CORPORATION
    Inventor: Takuya Nakabayashi
  • Patent number: 10359181
    Abstract: An electrode pattern (13) formed on a ceramics layer (2) in a substrate for a light emitting device (circuit board (320)) of the present invention includes a first metal layer (5), a second metal layer (7), and an electrode terminal unit (10), and the thickness of a part at which the electrode terminal unit (10) is not formed in the electrode pattern (13) is at least equal to or greater than 35 ?m. Accordingly, it is possible to suppress heat resistance to be low.
    Type: Grant
    Filed: October 20, 2015
    Date of Patent: July 23, 2019
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Masahiro Konishi, Shin Itoh, Hiroshi Yamashita, Ippei Yamaguchi, Hiroyuki Nokubo, Yoshiaki Itakura
  • Patent number: 10359183
    Abstract: Examples of the present disclosure are related to systems and methods for lighting fixtures. More particularly, embodiments disclose lighting fixtures utilizing metal core PCB (MCPCB) for thermal, mechanical, and/or optical controls.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: July 23, 2019
    Assignee: Fluence Bioengineering, Inc.
    Inventor: Dung Duong
  • Patent number: 10361352
    Abstract: A present invention includes at least two light cups and a composite material base. The composite material base comprises a first surface, a second surface and a third surface adjacent to the first surface, and a fourth surface opposite to the first surface. The at least two light cups are formed on the first surface. At least two first metal plates and at least two second metal plates having different polarities and corresponding to the quantity of the light cups are provided on the second surface. One ends of the at least two first and second metal plates individually pass through the composite material base and extend into the light cup to form two electrode contacts, and the other ends of the at least two first metal plates extend to the fourth surface to form an exposed heat dissipation structure.
    Type: Grant
    Filed: March 22, 2018
    Date of Patent: July 23, 2019
    Assignee: Excellence Opto, Inc.
    Inventors: Chun-Der Wu, Tzeng-Guang Tsai, Kuo-Shu Tseng, Chih-Chiang Chang
  • Patent number: 10355186
    Abstract: A flexible lighting element is provided, comprising: a first substrate; first and second conductive elements over the first substrate; a light-emitting element having first and second contacts that are both on a first surface of the light-emitting element, the first and second contacts being electrically connected to the first and second conductive elements, respectively, and the light-emitting element emitting light from a second surface opposite the first surface; a transparent layer located adjacent to the second surface; and a transparent affixing layer located between the first substrate and the transparent layer, wherein the transparent layer and the transparent affixing layer are both sufficiently transparent to visible light that they will not decrease light transmittance below 70%, and the first and second conductive layers are at least partially transparent to visible light, or are 300 ?m or smaller in width, or are concealed by a design feature from a viewing direction.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: July 16, 2019
    Assignee: Grote Industries, LLC
    Inventors: William L. Corwin, Donald Lee Gramlich, Jr., Scott J. Jones, Martin J. Marx, Cesar Perez-Bolivar, George M. Richardson, II, James E. Roberts
  • Patent number: 10355184
    Abstract: A light-emitting diode package comprising: a substrate having one or more first pads, one or more second pads, a first terminal, and a second terminal, which are all formed on the upper surface; a plurality of light-emitting diode chips loaded on the one or more first pads and electrically connected to the first pad and the second pad; and a reflector coupled to an upper part of the substrate and having an opening part through which the plurality of light-emitting diode chips is exposed, wherein the first pad is formed as one body with the substrate, and the first terminal or the second terminal are connected to an external power source and formed to have a predetermined height at the upper surface of the substrate.
    Type: Grant
    Filed: September 7, 2016
    Date of Patent: July 16, 2019
    Assignee: SEOUL VIOSYS CO., LTD.
    Inventors: Jun Yong Park, In Kyu Park, Yeo Jin Yoon
  • Patent number: 10347554
    Abstract: An electronic component which comprises an electrically conductive carrier, an electronic chip on the carrier, an encapsulant encapsulating at least part of at least one of the carrier and the electronic chip, and a functional structure covering a surface portion of the encapsulant, wherein at least part of the covered surface portion of the encapsulant is spatially selectively roughened.
    Type: Grant
    Filed: March 19, 2017
    Date of Patent: July 9, 2019
    Assignee: Infineon Technologies AG
    Inventors: Norbert Joson Santos, Edward Fuergut, Sanjay Kumar Murugan
  • Patent number: 10347797
    Abstract: A light emitting device includes a mounting board, a light emitting element, first and second light reflecting members, a light transmissive member and a sealing member. The first light reflecting member surrounds a lateral surface of the light emitting element while a top surface of the light emitting element is exposed from the first light reflecting member. The second light reflecting member surrounds an outer periphery of the light emitting element in a plan view. The second light reflecting member is in contact with the first light reflecting member with at least a part of the second light reflecting member being positioned higher than the first light reflecting member. The light transmissive member is disposed inside the second light reflecting member. The light transmissive member includes a wavelength conversion substance. The sealing member covers the first and second light reflecting members and the light transmissive member.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: July 9, 2019
    Assignee: NICHIA CORPORATION
    Inventors: Yuta Oka, Hiroto Tamaki
  • Patent number: 10347570
    Abstract: An electronic device comprises a carrier, a leadframe, a package body and a plurality of electronic components. The carrier has an open top surface, a closed bottom surface and sidewalls extending between the closed bottom surface and the open top surface. The carrier has a circular cavity in its open top surface extending toward the closed bottom surface. The carrier includes a leadframe including a die pad and a plurality of leads. The leads are physically isolated from the die pad by at least one gap. The package body partially encapsulates the leadframe such that a portion of an upper surface of the die pad and a portion of each of the leads are exposed from the package body. The exposed portions of the leads are arranged radially along the die pad. The electronic components are disposed on the die pad.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: July 9, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC. KAOHSIUNG
    Inventor: Hsun-Wei Chan
  • Patent number: 10340419
    Abstract: A light emitting device includes first and second electrodes spaced apart from each other on a substrate, at least one bar-type LED having a first end on the first electrode and a second end on the second electrode, and an insulative support body between the substrate and the bar-type LED. The at least one bar-type LED has a length greater than a width.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: July 2, 2019
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Dae Hyun Kim, Jong Hyuk Kang, Joo Yeol Lee, Hyun Deok Im, Chi O Cho, Hyun Min Cho
  • Patent number: 10340432
    Abstract: A light emitting device is provided that includes an integral heat dissipation element. This heat dissipation element is included in the leadframe that is used to facilitate fabrication of the light emitting device, to provide a single common substrate that forms both the heat dissipation element and the conductive elements for coupling the light emitting device to external sources of power. The heat dissipation element may extend beyond the protective structure that surrounds the light emitting element to facilitate heat dissipation to the surrounding medium.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: July 2, 2019
    Assignee: Lumileds LLC
    Inventors: Axel Mehnert, Dusan Golubovic, Marcus Franciscus Donker, Hendrik Jan Eggink, Rene Van Honschooten, Theodoor Cornelis Treurniet
  • Patent number: 10333025
    Abstract: An ultraviolet light emitting device including a first conductivity-type AlGaN semiconductor layer; an active layer disposed on the first conductivity-type AlGaN semiconductor layer and having an AlGaN semiconductor; a second conductivity-type AlGaN semiconductor layer disposed on the active layer and having an upper surface divided into a first region and a second region; second conductivity-type nitride patterns disposed on the first region of the second conductivity-type AlGaN semiconductor layer and having an energy band gap that is smaller than an energy band gap of the second conductivity-type AlGaN semiconductor layer; a transparent electrode layer covering the second conductivity-type nitride patterns and the second region of the second conductivity-type AlGaN semiconductor layer; a light-transmissive dielectric layer disposed on the transparent electrode layer between the second conductivity-type nitride patterns; and a metal electrode disposed on the transparent electrode layer overlying the second
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: June 25, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young Hwan Park, Mi Hyun Kim, Joo Sung Kim
  • Patent number: 10333038
    Abstract: In an LED module, modes to solve such a problem that a loss in the output of light discharged into the atmosphere occurs are embodied. Specifically, in an LED module in which an LED chip is sealed with a sealing resin, a surface of the sealing resin is covered with a thin film, the thin film is made of a material having a smaller linear expansion coefficient than the sealing resin, and an irregular surface is provided on a surface of the thin film such that light from the LED chip is multiply reflected.
    Type: Grant
    Filed: March 23, 2016
    Date of Patent: June 25, 2019
    Assignee: TORAY ENGINEERING CO., LTD.
    Inventors: Takayoshi Fujimoto, Masamichi Yamashita, Masaki Mori, Yutaka Oka
  • Patent number: 10326047
    Abstract: A light-emitting diode including a semiconductor epitaxial layer, a first electrode, and a second electrode is provided. The semiconductor epitaxial layer includes a first-type doped semiconductor layer, a second-type doped semiconductor layer, and a quantum well layer. A recessed portion is formed in the semiconductor epitaxial layer. The recessed portion separates the second-type doped semiconductor layer, the quantum well layer, and a portion of the first-type doped semiconductor layer and defines a first region and a second region on the semiconductor epitaxial layer. The first electrode is located in the first region and electrically connected to at least a portion of the first-type doped semiconductor layer and at least a portion of the second-type doped semiconductor layer. The second electrode is located in the second region and electrically connected to the second-type doped semiconductor layer.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: June 18, 2019
    Assignee: Genesis Photonics Inc.
    Inventors: Tsung-Syun Huang, Jing-En Huang, Yu-Chen Kuo, Yan-Ting Lan, Kai-Shun Kang, Fei-Lung Lu, Teng-Hsien Lai, Yi-Ru Huang
  • Patent number: 10326102
    Abstract: A flexible display apparatus includes a substrate, a thin film encapsulation layer, a plurality of spacers, and at least one layer of a blocking dam in the non-display region. The substrate includes a display region having a plurality of pixels and a non-display region adjacent to the display region. The thin film encapsulation layer is over the substrate. The spacers are between the substrate and the thin film encapsulation layer and are arranged around a pixel region. A different arrangement of spacers are in a center region and an edge region of the display region. The different arrangement may correspond to at least one of a size and a number of the spacers.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: June 18, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventor: Sungun Park
  • Patent number: 10319887
    Abstract: A semiconductor light-emitting device includes a base, a light-emitting element and a sealing resin. The base includes an obverse surface and a reverse surface spaced in a first direction, first side surfaces spaced in a second direction crossing the first direction, and second side surfaces spaced in a third direction crossing the first and second directions. The light-emitting element is on the base obverse surface. The sealing resin for covering the light-emitting element is smaller than the base in plan. The base has a wiring pattern connected to the light-emitting element and including an obverse surface electrode on the base obverse surface. The base also has a resist layer including a pattern-covering portion overlapping with the obverse surface electrode. The pattern-covering portion includes a resin outflow preventing portion, disposed outside the sealing resin in plan and extends continuously from one second side surface to the other.
    Type: Grant
    Filed: July 6, 2017
    Date of Patent: June 11, 2019
    Assignee: ROHM CO., LTD.
    Inventors: Masahiko Kobayakawa, Tomoichiro Toyama
  • Patent number: 10319706
    Abstract: A method for fabricating a micro-LED module is disclosed. The method includes: preparing a micro-LED including a plurality of electrode pads and a plurality of LED cells; preparing a submount substrate including a plurality of electrodes corresponding to the plurality of electrode pads; and flip-bonding the micro-LED to the submount substrate through a plurality of solders located between the plurality of electrode pads and the plurality of electrodes. The flip-bonding includes heating the plurality of solders by a laser.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: June 11, 2019
    Assignee: LUMENS CO., LTD.
    Inventors: Taekyung Yoo, Daewon Kim, Seongbok Yoon, Yelim Won, Myungji Moon, Hanbeet Chang, Yongpil Kim, Jaesoon Park
  • Patent number: 10310200
    Abstract: An optical transmission module includes a receptacle-type optical part, a holder part, and a cover part. The receptacle-type optical part includes a resin molding and a device part. The resin molding is provided with a ferrule insertion hole extending in a first direction and a first fitting part in a surface perpendicular to the first direction. The holder part contains resin and includes a back surface plate provided with a second fitting part fitted to the first fitting part and an upper surface plate provided with a third fitting part provided in parallel to the first direction. The cover part is inserted along the first direction between the holder and receptacle-type optical part. The cover part includes an upper surface plate provided with a fourth fitting part capable of fitting to the third fitting part. The cover part is extractable along the first direction from a housed position.
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: June 4, 2019
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
    Inventor: Kazuyuki Ohashi
  • Patent number: 10305062
    Abstract: Disclosed is a lighting assembly including a substrate, at least one electrode region, and a light emitting region. The light emitting region surrounds at least one surrounded electrode region of the at least one electrode region. Also disclosed is a lighting device including the lighting assembly.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: May 28, 2019
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventor: Chiehhsing Chung
  • Patent number: 10297787
    Abstract: Disclosed herein are methods for welding a first substrate and a second substrate, the method comprising bringing the first and second substrates into contact to form a substrate interface, and directing a laser beam operating at a predetermined wavelength through the second substrate onto the substrate interface, wherein the first substrate absorbs light from the laser beam in an amount sufficient to form a weld between the first substrate and the second substrate. The disclosure also relates to glass and/or glass-ceramic packaging and OLED display produced according to the methods disclosed herein.
    Type: Grant
    Filed: April 20, 2015
    Date of Patent: May 21, 2019
    Assignee: Corning Incorporated
    Inventors: Matthew John Dejneka, Alexander Mikhailovich Streltsov
  • Patent number: 10297735
    Abstract: Embodiments relate to a light emitting device package having an improved luminous flux, and the light emitting device package includes a body including a cavity, a first lead frame and a second lead frame exposed on a bottom surface of the cavity and separate from each other by an electrode separating member, a first light emitting device disposed on the first lead frame, a second light emitting device disposed on the second lead frame, and a Zener diode disposed on the first lead frame or the second lead frame, and disposed more closely to the electrode separating member than to the first light emitting device and the second light emitting device. Here, the electrode separating member diagonally separate the first lead frame and the second lead frame along a width direction of the body.
    Type: Grant
    Filed: March 15, 2016
    Date of Patent: May 21, 2019
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Mi Jin Lee, Min Jae Kim
  • Patent number: 10297734
    Abstract: An LED module is provided with a lead, an LED chip mounted on the obverse surface of the lead, and a case covering at least a part of the lead. The case has a side wall surrounding the LED chip. The lead includes a thin extension whose bottom surface is spaced apart upward from the reverse surface of the lead in the thickness direction of the lead. The case is provided with a holding portion that covers at least a part of each of the top surface and the bottom surface of the first thin extension.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: May 21, 2019
    Assignee: ROHM CO., LTD.
    Inventor: Masahiko Kobayakawa
  • Patent number: 10290783
    Abstract: An LED bracket, an LED device and an LED display screen are disclosed. The LED bracket includes a metal bracket and a cup cover wrapping the metal bracket. The metal bracket includes a first metal pin embedded into the cup cover and a second metal pin exposed from the cup cover. A part, located on a top of the second metal pin, in the cup cover is a reflection cup. A light absorbing layer is disposed on a part of an outer side face of the reflection cup.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: May 14, 2019
    Assignee: Foshan NationStar Optoelectronics Co., Ltd.
    Inventors: Chuanbiao Liu, Xiaofeng Liu, Zongxian Xie, Qiang Zhao, Kailiang Fan, Kuai Qin, Lu Yang
  • Patent number: 10276632
    Abstract: The present invention relates to a display device and, particularly, to a display device using semiconductor light-emitting diodes. In the display device according to the present invention, at least one of the semiconductor light-emitting diodes comprises: a first conductive electrode and a second conductive electrode; a first conductive semiconductor layer having the first conductive electrode arranged thereon; a second conductive semiconductor layer overlapping with the first conductive semiconductor layer in a vertical direction, and having the second conductive electrode arranged thereon; and an active layer arranged between the first conductive semiconductor layer and the second conductive semiconductor layer, wherein a connecting unit electrically connected to the first conductive electrode is formed on one surface of the first conductive semiconductor layer, and the connecting unit is arranged so as to lean to one side on the basis of the second conductive electrode along the horizontal direction.
    Type: Grant
    Filed: September 2, 2015
    Date of Patent: April 30, 2019
    Assignee: LG ELECTRONICS INC.
    Inventor: Eunah Lee
  • Patent number: 10276769
    Abstract: A light emitting device in which a bonding pad is soldered to a mounting substrate, wherein the bonding pad may be formed in various shapes that can minimize the occurrence of voids during soldering or heat fusion.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: April 30, 2019
    Assignee: SEOUL VIOSYS CO., LTD.
    Inventors: Jong Hyeon Chae, So Ra Lee, Kyung Hee Ye
  • Patent number: 10276765
    Abstract: A substrate (5A) includes an aluminum substrate body (10), a reflection layer (12) that is formed between an electrode pattern (20) which obtains electrical connection with a light emitting element (6) and the aluminum substrate body (10) and that contains first ceramics which reflect light from the light emitting element (6), and an intermediate layer (11) that contains second ceramics which are formed by thermal spraying and reinforces dielectric strength performance of the reflection layer (12).
    Type: Grant
    Filed: November 11, 2014
    Date of Patent: April 30, 2019
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Masahiro Konishi, Shin Itoh
  • Patent number: 10268860
    Abstract: One embodiment of a system and method for imaging objects from a barcode scanner may include generating a first color light source drive signal having a first duty cycle and a second color light source drive signal having a second duty cycle that is greater than the first duty cycle. In response to applying the first and second color light source drive signals to first and second color light sources, respectively, combining light beams generated by the first and second color light sources to produce a white illumination beam. An image sensor may generate image data of an object inclusive of a chine readable indicia captured in an image by the image sensor while illuminated by the white illumination beam. The machine readable indicia of the object in the image data may be read.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: April 23, 2019
    Assignee: Datalogic ADC, Inc.
    Inventor: WenLiang Gao
  • Patent number: 10269886
    Abstract: An organic electroluminescent display device and a manufacturing method thereof are disclosed. The organic electroluminescent display device includes a substrate, a first thin film transistor disposed on the substrate, a second thin film transistor disposed on the first thin film transistor, a first light emitting element electrically connected with a drain of the first thin film transistor, wherein the first light emitting element comprises a first electrode, a first light emitting layer and a second electrode which are stacked, a second light emitting element electrically connected with a drain of the second thin film transistor, wherein the second light emitting element is disposed on the second thin film transistor and comprises a third electrode, a second light emitting layer and a fourth electrode, wherein the second light emitting element is configured to emit white light.
    Type: Grant
    Filed: July 13, 2016
    Date of Patent: April 23, 2019
    Assignee: BOE Technology Group Co., Ltd.
    Inventors: Lung Pao Hsin, Kelvin Chiang
  • Patent number: 10259912
    Abstract: A curable organopolysiloxane composition which is capable of maintaining the refractive index and gas barrier at a certain level by incorporating diphenyl group into a silicone resin and maintaining the phenyl content at a certain level.
    Type: Grant
    Filed: August 19, 2016
    Date of Patent: April 16, 2019
    Assignee: KCC CORPORATION
    Inventors: Kyoung Jin Bok, Seung Kwang Seo, Jung Mo An, Seung Han Kim
  • Patent number: 10263154
    Abstract: An embodiment relates to a light-emitting device comprising: a light-emitting structure which comprises a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer, and comprises a plurality of first recesses passing through the second conductive semiconductor layer and active layer and disposed on a part of an area of the first conductive semiconductor layer; a first electrode which is electrically connected to the first conductive semiconductor layer inside the plurality of first recesses; a conductive support substrate which is electrically connected to the first electrode; a second electrode which is electrically connected to the second conductive semiconductor layer; and an insulating layer which is disposed between the conductive support substrate and second conductive semiconductor layer, wherein a second recess passes through the first conductive semiconducto
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: April 16, 2019
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Su Ik Park, Min Sung Kim, Youn Joon Sung, Yong Gyeong Lee, Kwang Yong Choi
  • Patent number: 10263207
    Abstract: Provided are a perovskite light emitting device containing an exciton buffer layer, and a method for manufacturing the same. A light emitting device of the present invention comprises: an exciton buffer layer in which a first electrode, a conductive layer disposed on the first electrode and comprising a conductive material, and a surface buffer layer containing fluorine-based material having lower surface energy than the conductive material are sequentially deposited; a light-emitting layer disposed on the exciton buffer layer and containing an organic-inorganic hybrid perovskite light emitting body; and a second electrode disposed on the light-emitting layer.
    Type: Grant
    Filed: November 6, 2015
    Date of Patent: April 16, 2019
    Assignee: POSTECH ACADEMY-INDUSTRY FOUNDATION
    Inventors: Taewoo Lee, Sanghyuk Im, Himchan Cho, Younghoon Kim
  • Patent number: 10263166
    Abstract: A light emitting device includes a light emitting element; a light reflecting member having an Ag-containing layer on a surface thereof; and a protective film having a thickness of 1 nm to 300 nm and covering a surface of the light reflecting member, the protective film covering a surface of the light reflecting member, in which the Ag-containing layer has a thickness of 0.1 ?m to 0.5 ?m.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: April 16, 2019
    Assignee: NICHIA CORPORATION
    Inventors: Masakazu Sakamoto, Yoshiki Sato, Yasuo Kato
  • Patent number: 10256371
    Abstract: A light-emitting diode (LED) chip including a first semiconductor layer; an active layer disposed on the first semiconductor layer; a second semiconductor layer disposed on said active layer; one or a plurality of indentations, comprising a bottom part extending downward through the second semiconductor layer and the active layer to reach the first semiconductor layer and exposing the first semiconductor layer; a plurality of metal layers, comprising a first metal layer connecting to the first semiconductor layer through the bottom part, and a second metal layer deposited on the first metal layer; and an insulating layer formed between the first and the second metal layers, disposed on the indentation and covering the first metal layer, wherein the second metal layer comprises one or a plurality of recesses at a top surface thereof corresponding to the one or plurality of indentations.
    Type: Grant
    Filed: August 14, 2015
    Date of Patent: April 9, 2019
    Assignee: EPISTAR CORPORATION
    Inventors: Han-Zhong Liao, Chih-Hsuan Lu, Fang-I Li, Wei-Kang Cheng, Shyi-Ming Pan
  • Patent number: 10256370
    Abstract: The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer under the first conductive semiconductor layer, and a second conductive semiconductor layer under the active layer; a plurality of first electrodes disposed under the light emitting structure and electrically connected to the first conductive semiconductor layer by passing through the second conductive semiconductor layer, the active layer and a portion of the first conductive semiconductor layer; a second electrode disposed under the light emitting structure to be electrically connected to the second conductive semiconductor layer; a first insulating layer disposed around the first electrode to insulate the first electrode from the second electrode; a bonding layer electrically connected to the second electrode by passing through the first electrode and the first insulating layer; and a second insulating layer around the bonding layer.
    Type: Grant
    Filed: July 11, 2014
    Date of Patent: April 9, 2019
    Assignee: LG Innotek Co., Ltd.
    Inventor: Ji Hyung Moon
  • Patent number: 10249848
    Abstract: An organic light-emitting panel includes a reflective electrode, a functional layer, having a single or multi-layer structure, located on the reflective electrode, an organic light-emitting layer located on the functional layer, a transparent electrode located above the organic light-emitting layer, a low refractive index layer located on the transparent electrode, and a first thin-film sealing layer located on the low refractive index layer. The low refractive index layer has a lower refractive index than both the transparent electrode and the first thin-film sealing layer. Difference between respective refractive indices of the low refractive index layer and the transparent electrode is 0.4-1.1. Difference between respective refractive indices of the low refractive index layer and the first thin-film sealing layer is 0.1-0.8. The low refractive index layer has thickness of 20-130 nm.
    Type: Grant
    Filed: July 17, 2012
    Date of Patent: April 2, 2019
    Assignee: JOLED INC.
    Inventors: Kazuhiro Yoneda, Keiko Kurata, Noriyuki Matsusue
  • Patent number: 10233074
    Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: March 19, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Kirmse, Benjamin Cook, Genki Yano, Stuart Jacobsen
  • Patent number: 10234545
    Abstract: An embodiment of the invention provides apparatus for providing light pulses comprising a light source electrically connected to a low inductance configuration of electrodes for electrically connecting the light source to a power supply.
    Type: Grant
    Filed: December 1, 2010
    Date of Patent: March 19, 2019
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Avner Sander, Giora Yahav, Asaf Pellman, Shlomo Felzenshtein, Eli Larry, David Mandelboum
  • Patent number: 10236396
    Abstract: There are provided an electronic device including a first electrode, a second electrode and a photoelectric conversion layer sandwiched between the first electrode and the second electrode, the first electrode including an amorphous oxide composed of at least a quaternary compound of indium, gallium and/or aluminum, zinc and oxygen, and a difference between a work function value of the second electrode and a work function value of the first electrode being 0.4 eV or more; and a method of producing an electrode for the electronic device.
    Type: Grant
    Filed: April 9, 2014
    Date of Patent: March 19, 2019
    Assignee: Sony Corporation
    Inventors: Toshiki Moriwaki, Toru Udaka
  • Patent number: 10230031
    Abstract: An electromagnetic radiation-emitting assembly is disclosed. In an embodiment the assembly includes an electromagnetic radiation-emitting component arranged above a carrier, the electromagnetic radiation-emitting component including a first side facing away from the carrier, a second side facing the carrier, and at least one side wall connecting the first side and the second side of the electromagnetic radiation-emitting component to one another, an encapsulating body, into which the electromagnetic radiation-emitting component is embedded, which adjoins the first side and the side wall of the electromagnetic radiation-emitting component, a potting material at least partly surrounding the encapsulating body and a reflector body at least partly surrounding the potting material.
    Type: Grant
    Filed: March 16, 2016
    Date of Patent: March 12, 2019
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Luca Haiberger, Sam Chou
  • Patent number: 10224308
    Abstract: The present invention discloses a transferring method, a manufacturing method, a device and an electronic apparatus of micro-LED. The method for transferring micro-LED comprises: forming micro-LEDs on a laser-transparent original substrate; irradiating the original substrate with laser from the original substrate side to lift-off the micro-LEDs from the original substrate; bring the micro-LEDs into contact with pads preset on a receiving substrate through a contactless action.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: March 5, 2019
    Assignee: GOERTEK, INC.
    Inventors: Quanbo Zou, Zhe Wang
  • Patent number: 10217962
    Abstract: A bank partitions a plurality of pixels and has an opening in each of the plurality of pixels. An organic layer includes a light emitting layer, and covers the bank opening. A first inorganic barrier layer is formed of an inorganic material, and covers the bank and the organic layer. A plurality of organic barrier portions are formed of organic materials, and are disposed on the first inorganic barrier layer. A second inorganic barrier layer is formed of the inorganic material, and covers the first inorganic barrier layer and the plurality of organic barrier portions. A recessed portion is formed on the bank and the first inorganic barrier layer (for example, the recessed portion is formed in an area which covers a contact hole), and a portion of the organic barrier portion is formed in the recessed portion.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: February 26, 2019
    Assignee: Japan Display Inc.
    Inventor: Daisuke Kato
  • Patent number: 10215937
    Abstract: An optoelectronic package includes a wiring substrate having a holding plane, an optoelectronic chip, a reflective material, an optical element and an adhesive. The optoelectronic chip is mounted on the holding plane and electrically connected to the wiring substrate. The optoelectronic chip has an upper surface, a functional region and a side surface connected to the upper surface. The reflective material is on the holding plane and surrounds the optoelectronic chip. The reflective material covers the side surface and has an inclined surface. The inclined surface surrounds the upper surface and extends from an edge of the upper surface. The height of the reflective material at the inclined surface decreases from the optoelectronic chip toward a direction away from the optoelectronic chip. The adhesive covers the reflective material and the upper surface and is connected between the optoelectronic chip and the optical element.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: February 26, 2019
    Assignee: UNISTARS CORPORATION
    Inventors: Shang-Yi Wu, Hsin-Hsien Hsieh