Application Of Specified Conductive Layer (epo) Patents (Class 257/E21.083)
  • Thermal interface material for combined reflow
    Patent number: 7629203
    Abstract: A combined thermal interface material and second layer interconnect reflow material and method are disclosed.
    Type: Grant
    Filed: March 31, 2008
    Date of Patent: December 8, 2009
    Assignee: Intel Corporation
    Inventors: Daewoong Suh, Sabina Houle, Edward A Zarbock