Manufacture Or Treatment Of Semiconductor Device (epo) Patents (Class 257/E21.002)
- Device having semiconductor body comprising carbon, e.g., diamond, diamond-like carbon (EPO) (Class 257/E21.041)
- Device having semiconductor body comprising silicon carbide (SiC) (EPO) (Class 257/E21.054)
- Device having semiconductor body comprising selenium (Se) or tellurium (Te) (EPO) (Class 257/E21.068)
- Device having semiconductor body comprising cuprous oxide (Cu 2 O) or cuprous iodide (CuI) (EPO) (Class 257/E21.078)
- Device having semiconductor body comprising Group IV elements or Group III-V compounds with or without impurities, e.g., doping materials (EPO) (Class 257/E21.085)
- Device having semiconductor body other than carbon, Si, Ge, SiC, Se, Te, Cu 2 O, CuI, and Group III-V compounds with or without impurities, e.g., doping materials (EPO) (Class 257/E21.459)
- Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (EPO) (Class 257/E21.499)