Lateral Bipolar Transistor In Combination With Diode, Capacitor, Or Resistor (epo) Patents (Class 257/E27.043)
  • Patent number: 7838879
    Abstract: An array substrate includes a substrate, a thin film transistor, a passivation layer, a pixel electrode and a storage capacitor. The thin film transistor includes a gate electrode formed on the substrate, a gate insulation layer formed on the substrate having the gate electrode, a semiconductor layer formed on the gate insulation layer and a data electrode formed on the semiconductor layer. The passivation layer is formed on the substrate having the data electrode and the pixel electrode is electrically connected to the data electrode through a contact hole formed through the passivation layer. The storage capacitor includes a first storage capacitor electrode that is spaced apart from the gate electrode of the thin film transistor and a second storage capacitor electrode that is formed on the gate insulation and including a same material as the pixel electrode.
    Type: Grant
    Filed: July 26, 2006
    Date of Patent: November 23, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Jin-Suk Park
  • Patent number: 7633139
    Abstract: The invention is directed to a semiconductor device having a diode element which prevents a leakage current due to a vertical parasitic bipolar transistor and enhances current efficiency. An element isolation insulation film is provided on an N well layer, and a first P+ layer and a second P+ layer are formed on the N well layer surrounded by the element isolation insulation film, the second P+ layer being formed at a distance from the first P+ layer. An electrode layer is formed on the N well layer between the first P+ layer and the second P+ layer. An N+ layer for a contact is formed on the N well layer between the element isolation insulation film and other element isolation insulation film. The first P+ layer is connected with an anode wiring, and the electrode layer, the second P+ layer, and the N+ layer are connected with a cathode wiring. A diode element utilizing a lateral PNP bipolar transistor is thus formed on the semiconductor substrate.
    Type: Grant
    Filed: April 16, 2007
    Date of Patent: December 15, 2009
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Takashi Hiroshima, Kazutomo Goshima
  • Patent number: 7569903
    Abstract: One embodiment of the invention relates to a component arrangement including a load and an open-load detector. The load transistor has a first transistor region arranged in a semiconductor body, a second transistor region arranged in the semiconductor body and a third transistor region arranged between the first transistor region and the second transistor region and doped in complementary fashion to the first transistor region and the second transistor region. The open-load detector has a sense region arranged in the third transistor region and of conduction type complementary to the third transistor region and having an evaluation circuit connected to the sense region.
    Type: Grant
    Filed: March 7, 2006
    Date of Patent: August 4, 2009
    Assignee: Infineon Technologies Austria AG
    Inventors: Emanuele Bodano, Nicola Macri