Abstract: A semiconductor device structure includes a region of semiconductor material with a first major surface and an opposing second major surface. A contact structure is disposed in a first portion of the region of semiconductor material and includes a tub structure extending from adjacent a first portion of the first major surface. A plurality of structures comprising portions of the region of semiconductor material extend outward from a lower surface of the tub structure. In some embodiments, the plurality of structures comprises a plurality of free-standing structures. A conductive material is disposed within the tub structure and laterally surrounding the plurality of structures. In one embodiment, the contact structure facilitates the fabrication of a monolithic series switching diode structure having a low-resistance substrate contact.

Abstract: A two terminal device which can be used for the rectification of the current. Internally it has a regenerative coupling between MOS gates of opposite type and probe regions. This regenerative coupling allows to achieve performance better than that of ideal diode.

Abstract: A semiconductor device includes conductive features within a gate electrode level region that are each fabricated from a respective originating rectangular-shaped layout feature having a centerline aligned parallel to a first direction. The conductive features form gate electrodes of first and second PMOS transistor devices, and first and second NMOS transistor devices. The gate electrodes of the first PMOS and first NMOS transistor devices extend along a first gate electrode track. The gate electrodes of the second PMOS and second NMOS transistor devices extend along a second gate electrode track. A first set of interconnected conductors electrically connect the gate electrodes of the first PMOS and second NMOS transistor devices. A second set of interconnected conductors electrically connect the gate electrodes of the second PMOS and first NMOS transistor devices. The first and second sets of interconnected conductors traverse across each other within different levels of the semiconductor device.

Abstract: A semiconductor device includes a cross-coupled transistor configuration formed by first and second PMOS transistors defined over first and second p-type diffusion regions, and by first and second NMOS transistors defined over first and second n-type diffusion regions, with each diffusion region electrically connected to a common node. Gate electrodes of the PMOS and NMOS transistors are formed by conductive features which extend in only a first parallel direction. The first and second p-type diffusion regions are formed in a spaced apart manner, such that no single line of extent that extends perpendicular to the first parallel direction intersects both the first and second p-type diffusion regions. The first and second n-type diffusion regions are formed in a spaced apart manner, such that no single line of extent that extends perpendicular to the first parallel direction intersects both the first and second n-type diffusion regions.

Abstract: A first gate level feature forms gate electrodes of a first transistor of a first transistor type and a first transistor of a second transistor type. A second gate level feature forms a gate electrode of a second transistor of the first transistor type. A third gate level feature forms a gate electrode of a second transistor of the second transistor type. The gate electrodes of the second transistors of the first and second transistor types are positioned on opposite sides of a gate electrode track along which the gate electrodes of the first transistors of the first and second transistor types are positioned. The gate electrodes of the second transistors of the first and second transistor types are electrically connected to each other through an electrical connection that includes respective gate contacts and a conductive interconnect structure.

Abstract: A first linear-shaped conductive structure (LCS) forms a gate electrode (GE) of a first transistor of a first transistor type. A second LCS forms a GE of a first transistor of a second transistor type. A third LCS forms a GE of a second transistor of the first transistor type. A fourth LCS forms a GE of a second transistor of the second transistor type. Each of the first, second, third, and fourth LCS's has a respective electrical connection area. The electrical connection areas of the first and third LCS's are offset from each other. The GE of the first transistor of the first transistor type is electrically connected to the GE of the second transistor of the second transistor type. The GE of the second transistor of the first transistor type is electrically connected to the GE of the first transistor of the second transistor type.

Abstract: A first gate level feature forms gate electrodes of a first transistor of a first transistor type and a first transistor of a second transistor type. A second gate level feature forms a gate electrode of a second transistor of the first transistor type. A third gate level feature forms a gate electrode of a second transistor of the second transistor type. The gate electrodes of the second transistors of the first and second transistor types are electrically connected to each other. The gate electrodes of the second transistors of the first and second transistor types are positioned on opposite sides of a gate electrode track along which the gate electrodes of the first transistors of the first and second transistor types are positioned.

Abstract: A semiconductor device has a semiconductor chip, an internal circuit region arranged on an inner side of the semiconductor chip, and a bonding pad region arranged adjacently to the internal circuit region. A diode-type ESD protection circuit is formed of a junction between a first conductivity type diffusion layer for fixing a substrate potential of the semiconductor chip and a pair of second conductivity type diffusion layers arranged on an inner side of the first conductivity type diffusion layer. The first conductivity type diffusion layer is arranged on an entire peripheral region or a part of the peripheral region of the semiconductor chip with the peripheral region being outside of the internal circuit region and the bonding pad region. One of the pair of second conductivity type diffusion layers comprising a diffusion layer for breakdown adjustment at a junction portion with the first conductivity type diffusion layer.

Abstract: A strain enhanced transistor is provided having a strain inducing layer overlying a gate electrode. The gate electrode has sloped sidewalls over the channel region of the transistor.

Abstract: A plurality of PMOS transistors are provided on a substrate along an X-axis direction such that a gate length direction of each of the PMOS transistors is parallel to the X-axis direction. A plurality of NMOS transistors are provided on the substrate along the X-axis direction such that a gate length direction of each of the NMOS transistors is parallel to the X-axis direction, and each of the plurality of NMOS transistors is opposed to a corresponding one of the PMOS transistors in the Y-axis direction. Gate lines respectively correspond to the PMOS transistors and the NMOS transistors, and are arranged parallel to each other and extend linearly along the Y-axis direction such that each of the gate lines passes through gate areas of the PMOS transistors and NMOS transistors which correspond to each of the gate lines.

Abstract: A semiconductor device with at least two gate regions. The device includes a substrate region including a surface, a source region in the substrate region, and a drain region in the substrate region. The drain region and the source region are separate from each other. Additionally, the device includes a first gate region on the surface, a second gate region on the surface, and an insulation region on the surface and between the first gate region and the second gate region. The first gate region and the second gate region are separated by the insulation region. The first gate region is capable of forming a first channel in the substrate region. The first channel is from the source region to the drain region. The second gate region is capable of forming a second channel in the substrate region. The second channel is from the source region to the drain region.

Abstract: First and second p-type diffusion regions, and first and second n-type diffusion regions are formed in a semiconductor device. Each diffusion region is electrically connected to a common node. Gate electrodes are formed from conductive features that are each defined within any one gate level channel that is uniquely associated with and defined along one of a number of parallel gate electrode tracks. The first and second p-type diffusion regions are formed in a spaced apart manner relative to the first parallel direction, such that no single line of extent that extends across the substrate perpendicular to the first parallel direction intersects both the first and second p-type diffusion regions. At least a portion of the first n-type diffusion region and at least a portion of the second n-type diffusion region are formed over a common line of extent that extends across the substrate perpendicular to the first parallel direction.

Abstract: A semiconductor device includes a substrate having a plurality of diffusion regions defined therein to form first and second p-type diffusion regions, and first and second n-type diffusion regions, with each of these diffusion regions electrically connected to a common node. The first p-type active area and the second p-type active area are contiguously formed together. The first n-type active area and the second n-type active area are contiguously formed together. Gate electrodes are formed from conductive features that are each defined within any one gate level channel. Each gate level channel is uniquely associated with and defined along one of a number of parallel oriented gate electrode tracks. A first PMOS transistor gate electrode is electrically connected to a second NMOS transistor gate electrode, and a second PMOS transistor gate electrode is electrically connected to a first NMOS transistor gate electrode.

Abstract: First and second PMOS transistors are defined over first and second p-type diffusion regions. First and second NMOS transistors are defined over first and second n-type diffusion regions. Each diffusion region is electrically connected to a common node. Gate electrodes are formed from conductive features that are each defined within any one gate level channel that is uniquely associated with and defined along one of a number of parallel gate electrode tracks. The first and second p-type diffusion regions are formed in a spaced apart manner, such that no single line of extent that extends perpendicular to the first parallel direction intersects both the first and second p-type diffusion regions. The first and second n-type diffusion regions are formed in a spaced apart manner, such that no single line of extent that extends perpendicular to the first parallel direction intersects both the first and second n-type diffusion regions.

Abstract: A semiconductor device includes first and second p-type diffusion regions, and first and second n-type diffusion regions that are each electrically connected to a common node. Gate electrodes are formed from conductive features that are each defined within any one gate level channel that is uniquely associated with and defined along one of a number of parallel gate electrode tracks. The gate electrodes include gate electrodes of first and second PMOS transistor devices, and first and second NMOS transistor devices. Widths of the first and second p-type diffusion regions are substantially equal, such that the first and second PMOS transistor devices have substantially equal widths. Widths of the first and second n-type diffusion regions are substantially equal, such that the first and second NMOS transistor devices have substantially equal widths. The first and second PMOS and first and second NMOS transistor devices form a cross-coupled transistor configuration.

Abstract: A semiconductor device includes a substrate having a plurality of diffusion regions defined therein to form first and second p-type diffusion regions, and first and second n-type diffusion regions, with each of these diffusion regions electrically connected to a common node. The first p-type active area and the second p-type active area are contiguously formed together. The first n-type active area and the second n-type active area are contiguously formed together. Each of a number of conductive features within a gate electrode level region of the semiconductor device is fabricated from a respective originating rectangular-shaped layout feature. A centerline of each originating rectangular-shaped layout feature is aligned in a parallel manner. A first PMOS transistor gate electrode is electrically connected to a second NMOS transistor gate electrode, and a second PMOS transistor gate electrode is electrically connected to a first NMOS transistor gate electrode.

Abstract: A semiconductor device includes conductive features within a gate electrode level region that are each fabricated from a respective originating rectangular-shaped layout feature having a centerline aligned parallel to a first direction. The conductive features form gate electrodes of first and second PMOS transistor devices, and first and second NMOS transistor devices. The gate electrodes of the first PMOS and first NMOS transistor devices extend along a first gate electrode track. The gate electrodes of the second PMOS and second NMOS transistor devices extend along a second gate electrode track. A first set of interconnected conductors electrically connect the gate electrodes of the first PMOS and second NMOS transistor devices. A second set of interconnected conductors electrically connect the gate electrodes of the second PMOS and first NMOS transistor devices. The first and second sets of interconnected conductors traverse across each other within different levels of the semiconductor device.

Abstract: A semiconductor device includes a cross-coupled transistor configuration formed by first and second PMOS transistors defined over first and second p-type diffusion regions, and by first and second NMOS transistors defined over first and second n-type diffusion regions, with each diffusion region electrically connected to a common node. Gate electrodes of the PMOS and NMOS transistors are formed by conductive features which extend in only a first parallel direction. The first and second p-type diffusion regions are formed in a spaced apart manner, such that no single line of extent that extends perpendicular to the first parallel direction intersects both the first and second p-type diffusion regions. The first and second n-type diffusion regions are formed in a spaced apart manner, such that no single line of extent that extends perpendicular to the first parallel direction intersects both the first and second n-type diffusion regions.

Abstract: A microelectronic unit, an interconnection substrate, and a method of fabricating a microelectronic unit are disclosed. A microelectronic unit can include a semiconductor element having a plurality of active semiconductor devices therein, the semiconductor element having a first opening extending from a rear surface partially through the semiconductor element towards a front surface and at least one second opening, and a dielectric region overlying a surface of the semiconductor element in the first opening. The microelectronic unit can include at least one conductive interconnect electrically connected to a respective conductive via and extending away therefrom within the aperture. In a particular embodiment, at least one conductive interconnect can extend within the first opening and at least one second opening, the conductive interconnect being electrically connected with a conductive pad having a top surface exposed at the front surface of the semiconductor element.

Abstract: An EEPROM according to the present invention includes: a semiconductor layer of a first conductive type; and a first insulating film formed on the semiconductor layer. A first impurity region, a second impurity region, a third impurity region, a fourth impurity region, and a fifth impurity region of a second conductive type are formed in top layer portions of the semiconductor layer. On the first insulating film, a select gate, a first floating gate, and a second floating gate are respectively disposed opposite a region between the first impurity region and the second impurity region, a region between the second impurity region and the third impurity region, and a region between the third impurity region and the fourth impurity region. In the first insulating film, a first tunnel window and a second tunnel window are respectively formed at portions in contact with the first floating gate and the second floating gate.

Abstract: A semiconductor device includes a first semiconductor layer and a first semiconductor element located in the first semiconductor layer. The semiconductor device also includes a second semiconductor layer of a transparent semiconductor material. The second semiconductor layer is disposed on the first semiconductor layer covering the first semiconductor element. The semiconductor device also includes a second semiconductor element located in the second semiconductor layer. The semiconductor device also includes a wire extending within the second semiconductor layer and electrically connecting the first and second semiconductor elements.

Abstract: A semiconductor device includes a pair of transistors formed in a first conductive type semiconductor substrate. Each of the transistors contains a collector region of a second conductive type, opposite to the first conductive type, formed in the semiconductor substrate, a base region of the first conductive type formed in the collector region, and an emitter region of the second conductive type formed in the base region, the collector region of one transistor of the pair of transistors being separated from that of the other transistor. The semiconductor device further includes a first region of the first conductive type formed between the collector regions of the pair of transistors, and a buried layer of the second conductive type formed in the semiconductor substrate under the collector region of one transistor of the pair of transistors to connect the collector regions of the transistors therethrough.