Abstract: Provided is a method of fabricating a semiconductor device. The method includes providing a device substrate having a front side and a back side, the device substrate having a first refractive index, forming an embedded target over the front side of the device substrate, forming a reflective layer over the embedded target, forming a media layer over the back side of the device substrate, the media layer having a second refractive index less than the first refractive index, and projecting radiation through the media layer and the device substrate from the back side so that the embedded target is detected for a semiconductor process.

Abstract: The solar battery according to embodiments includes a substrate having an effective area and an edge area disposed outside the effective area; and a solar battery cell formed on the effective area of the substrate and comprising a first electrode, a light absorbing layer, and a second electrode. A step portion is formed on the substrate corresponding to the edge area.

Abstract: A method for forming a solar cell electrode, comprising the steps of: applying a conductive paste comprising an organic binder and inorganic components comprising conductive powder and glass frit onto a passivation layer with at least 200 nm thickness formed on one surface or on both front and back surfaces of a silicon substrate, wherein the softening point of the glass frit is 395° C. or lower; and firing the conductive paste applied onto the passivation layer.

Abstract: There are provided a solar cell and a method of manufacturing the same. The solar cell includes: a solar cell unit absorbing sunlight to generate electricity; a surface treatment layer formed on at least one of upper and lower surfaces of the solar cell unit by a condensation reaction of a compound having a functional group —Y having a lone pair and an alkoxy group —OR; and a metal electrode layer bonded to the functional group —Y having the lone pair of the surface treatment layer. The solar cell has excellent energy conversion efficiency.

Abstract: Photovoltaic conductive features and processes for forming photovoltaic conductive features are described. The process comprises (a) providing a substrate comprising a passivation layer disposed on a silicon layer; (b) depositing a surface modifying material onto at least a portion of the passivation layer; (c) depositing a composition comprising at least one of metallic nanoparticles comprising a metal or a metal precursor to the metal onto at least a portion of the substrate; and (d) heating the composition such that it forms at least a portion of a photovoltaic conductive feature in electrical contact with the silicon layer, wherein at least one of the composition or the surface modifying material etches a region of the passivation layer. When the surface modifying material is a UV-curable material, the process comprises the additional step of curing the UV-curable material.

Abstract: A solar cell panel and a method for manufacturing the same are discussed. The solar cell panel includes a plurality of solar cells each including a substrate and a plurality of electrode parts positioned on a surface of the substrate, an interconnector electrically connecting the electrode parts of adjacent ones of the plurality of solar cells to one another, and conductive adhesive films including a resin and a plurality of conductive particles dispersed in the resin. The conductive adhesive films is pressed between the electrode parts and the interconnector to electrically connect the electrode parts to the interconnector. A plurality of uneven portions are positioned on at least one of an upper surface and a lower surface of the interconnector.

Abstract: Fabrication methods for a flexible device for retina prosthesis are described. Layered structures including an array of pixel units may be formed over a substrate. Each pixel unit may comprise a processing circuitry, a micro electrode and a photo sensor. A first set of biocompatible layers may be formed over the layered structures. The substrate may be thinned down to a controlled thickness of the substrate to allow bending of the substrate to the curvature of a retina. A second set of biocompatible layers may be formed over the thinned substrate. The second set of biocompatible layers may be in contact with the first set of biocompatible layers to form a biocompatible seal wrapping around the device to allow long-term contact of the device with retina tissues. Micro electrodes of the pixel units may be exposed through the openings of these biocompatible layers.

Abstract: An imaging device package includes: an imaging device chip; a substrate on which the imaging device chip is mounted; a wire that electrically connects the imaging device chip and the substrate at a peripheral edge of the substrate around the imaging device chip; a supporting body that supports an optical member with respect to the substrate; and a bonding section that bonds the supporting body to the substrate while sealing the wire and a bonding terminal of the wire at the peripheral edge of the substrate.

Abstract: A method of manufacturing photo-semiconductor device that has a photoconductive semiconductor film provided with electrodes and formed on a second substrate, the semiconductor film being formed by epitaxial growth on a first semiconductor substrate different from the second substrate, the second substrate being also provided with electrodes, the electrodes of the second substrate and the electrodes of the photoconductive semiconductor film being held in contact with each other.

Abstract: A imaging device includes a first insulating substrate having a through hole, a connection electrode and a first wiring conductor, a second insulating substrate having outside terminals and a second wiring conductor, and an imaging element including a light-receiving portion arranged at a center portion on an upper surface thereof and a connection terminal arranged at an outer peripheral portion thereof, at least one of the lower surface of the first insulating substrate and the upper surface of the second insulating substrate including a recess portion, the through hole being located on an inner side thereof, the imaging element being arranged below the first insulating substrate such that the light-receiving portion is located within the through hole, the connection terminal being electrically connected to the connection electrode, the imaging element being accommodated inside the recess portion, outer peripheral portions of the first insulating substrate and the second insulating substrate being electrical

Abstract: Disclosed are a solar cell apparatus and a method for manufacturing the same. The solar cell apparatus includes a substrate; a back electrode layer on the substrate; a light absorbing layer on the back electrode layer; a front electrode layer on the light absorbing layer; and a connection wire extending from the front electrode layer and connected to the back electrode layer through the light absorbing layer, wherein the connection wire directly makes contact with an inner side of a recess formed in the back electrode layer.

Abstract: In various embodiments, a method for producing a solar cell is provided. In accordance with the method, through-holes may be formed in a solar cell substrate having the basic doping of a first conduction type. Furthermore, predetermined surface regions of a first surface of the solar cell substrate which include at least one portion of the through-holes may be highly doped with a second, opposite conduction type; and simultaneously or subsequently other surface regions of the first surface are lightly doped with the second conduction type. Furthermore, first and second metallic contacts may subsequently be formed in such a way that the second metallic contacts are electrically isolated from the first metallic contacts.

Abstract: Solar cells and methods for their manufacture are disclosed. An example method may include providing a substrate comprising a base layer and introducing n-type dopant to the front surface of the base layer by ion implantation. The substrate may be annealed by heating the substrate to a temperature to anneal the implant damage and activate the introduced dopant, thereby forming an n-type doped layer into the front surface of the base layer. Oxygen may be introduced during the annealing step to form a passivating oxide layer on the n-type doped layer. Back contacts may be screen-printed on the back surface of the base layer, and a p-type doped layer may be formed at the interface of the back surface of the base layer and the back contacts during firing of the back contacts. The back contacts may provide an electrical connection to the p-type doped layer.

Abstract: Fabrication methods and structures relating to backplanes for back contact solar cells that provide for solar cell substrate reinforcement and electrical interconnects are described. The method comprises depositing an interdigitated pattern of base electrodes and emitter electrodes on a backside surface of a semiconductor substrate, forming electrically conductive emitter plugs and base plugs on the interdigitated pattern, and attaching a backplane having a second interdigitated pattern of base electrodes and emitter electrodes at the conductive emitter and base plugs to form electrical interconnects.

Abstract: An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device disposed at the first surface; a protection layer located on the second surface of the substrate, wherein the protection layer has an opening; a light shielding layer located on the second surface of the substrate, wherein a portion of the light shielding layer extends into the opening of the protection layer; a conducting bump disposed on the second surface of the substrate and filled in the opening of the protection layer; and a conducting layer located between the substrate and the protection layer, wherein the conducting layer electrically connects the optoelectronic device to the conducting bump.

Abstract: Embodiments of the invention generally provide a solar cell formation process that includes the formation of metal contacts over heavily doped regions that are formed in a desired pattern on a surface of a substrate. Embodiments of the invention also provide an inspection system and supporting hardware that is used to reliably position a similarly shaped, or patterned, metal contact structure on the patterned heavily doped regions to allow an Ohmic contact to be made. The metal contact structure, such as fingers and busbars, are formed on the heavily doped regions so that a high quality electrical connection can be formed between these two regions.

Abstract: A photoelectric conversion device and a method for making same are provided wherein a porous photoelectrode is prevented from dissolution in an electrolyte, a surface plasmon resonance effect can be well obtained, and a drastic improvement in photoelectric conversion efficiency can be attained. In a photoelectric conversion device having a structure wherein an electrolyte layer (6) is filled between a porous photoelectrode (3) formed on a transparent substrate (1) and a counter electrode (4), the porous photoelectrode (3) is constituted of metal/metal oxide fine particles (7) including a core made of a metal and a shell surrounding the core and made of a metal oxide. In a dye-sensitized photoelectric conversion device, a sensitizing dye (8) is adsorbed on the surface of the porous photoelectrode (3).

Abstract: A solar cell according to an embodiment includes a pattern layer arranged on a substrate and including a uneven pattern; a back electrode arranged on the pattern layer; a light absorption layer arranged on the back electrode; a buffer layer on the light absorption layer; and a front layer arranged on the buffer layer. The method fabricating a solar cell according to an embodiment includes forming a pattern layer including a uneven pattern on a substrate; forming a back electrode on the pattern layer; forming a light absorption layer on the back electrode; forming a buffer layer on the light absorption layer; and forming a front electrode on the buffer layer.

Abstract: An organic thin film photovoltaic device includes an optically transmissive electrode layer on a substrate. A hole transport layer is formed on the electrode layer. First, second and third p type organic layers are disposed one after another on the hole transport layer. An n-type organic layer is disposed on a concave region and a convex region of a trench region that is configured to pass through the first and second p-type organic layers and be bounded by the third p-type organic layer. An electron transport layer is formed on the n-type organic layer, and a metallic nanoparticle layer is formed on a surface of a concave region and a convex region of the electron transport layer. A cathode electrode layer fills the trench region and covers the metallic nanoparticle layer.

Abstract: Disclosed are a solar cell with an interconnection sheet, wherein at least either of the connection between a first conductive electrode of a back electrode type solar cell and a first conductive wire of an interconnection sheet and the connection between a second conductive electrode of the back electrode type solar cell and a second conductive wire of the interconnection sheet is electrically established by a conductive substance, and the conductive substance contains a metal which is in contact with at least either of the electrodes and the wires without metal bonding, a solar cell module containing the solar cell with an interconnection sheet, and a method for producing the solar cell with an interconnection sheet.

Abstract: Provided is a method for generating, and for connecting in series, stripe-shaped elements, wherein less space is required for the series connection as compared to the prior art.

Abstract: In one embodiment, active diffusion junctions of a solar cell are formed by diffusing dopants from dopant sources selectively deposited on the back side of a wafer. The dopant sources may be selectively deposited using a printing method, for example. Multiple dopant sources may be employed to form active diffusion regions of varying doping levels. For example, three or four active diffusion regions may be fabricated to optimize the silicon/dielectric, silicon/metal, or both interfaces of a solar cell. The front side of the wafer may be textured prior to forming the dopant sources using a texturing process that minimizes removal of wafer material. Openings to allow metal gridlines to be connected to the active diffusion junctions may be formed using a self-aligned contact opening etch process to minimize the effects of misalignments.

Abstract: A solar cell module capable of reducing stress to which an extraction wiring member connected to an extraction electrode portion is subjected from a sealer is obtained. This solar cell module includes a solar cell formed on a substrate having insulating properties, an extraction electrode portion extracting electric charges generated by the solar cell, formed on the substrate, an extraction wiring member collecting electric charges, connected to the extraction electrode portion, a covering member covering at least part of the extraction wiring member, and a sealer sealing the solar cell, the extraction electrode portion, the extraction wiring member, and the covering member in a state of covering the solar cell, the extraction electrode portion, the extraction wiring member, and the covering member.

Abstract: An integrated circuit includes active circuitry disposed at a surface of a semiconductor body and an interconnect region disposed above the semiconductor body. A thermoelectric material is disposed in an upper portion of the interconnect region away from the semiconductor body. The thermoelectric material is configured to deliver electrical energy when exposed to a temperature gradient. This material can be used, for example, in a method for detecting the repackaging of the integrated circuit after it has been originally packaged.

Abstract: A semiconductor substrate includes a photodiode on a support substrate. An insulating layer is provided between the support substrate and the semiconductor substrate. A first conductive pattern is provided in the insulating layer. A first through electrode penetrates the support substrate to be in contact with the first conductive pattern.

Abstract: A photoelectric conversion device includes a semiconductor substrate, an insulating layer provided on the semiconductor substrate, an electrode provided on the insulating layer, a photoelectric conversion film provided on the electrode for converting received light to charges, a line connected between the electrode and the semiconductor substrate, a first planar electrode provided in the insulating layer and connected to the electrode, and a second planar electrode provided in the insulating layer between the first planar electrode and the semiconductor substrate.

Abstract: An apparatus includes a conductive or semiconductive substrate and a dielectric layer located directly thereon. A semiconductor layer is located directly on the dielectric layer. The semiconductor layer includes a ridge waveguide and a heater strip extending parallel to the ridge waveguide. The heater strip is electrically isolated from the ridge waveguide and is doped to carry a current therein about parallel to the ridge waveguide.

Abstract: An integrated circuit (IC) combination of a target integrated circuit (TIC) and a plurality of thin film photovoltaic cells (PV) connected thereto. The IC comprises a target integrated circuit (TIC) having a top surface and a bottom surface; a plurality of thin film photovoltaic (PV) cells formed over at least one of the top surface and the bottom surface of the TIC, each PV cell includes at least a lower conducting layer (LCL) and an upper conducting layer (UCL); and a conducting path connecting at least a UCL of a first PV cell to at least a LCL of a second PV cell, wherein at least a first array of PV cells comprised of at least a first portion of the plurality of PV cells is connected by the respective UCL and LCL of each PV cell to provide a first voltage output.

Abstract: A solar battery includes: a plurality of rear electrode patterns, a light absorption layer, a front electrode, an interconnection, a separation pattern, and a dummy layer. The rear electrode patterns are disposed on a substrate and spaced apart from each other. The light absorption layer is disposed on the rear electrode patterns. The front electrode is disposed on the light absorption layer. The interconnection is a part of the front electrode penetrating the light absorption layer and electrically connected to the rear electrode patterns. The separation pattern penetrates the light absorption layer and the front electrode for defining unit cells. The dummy layer is disposed between the interconnection and the separation pattern. The dummy layer has a top surface lower than that of the front electrode.

Abstract: Methods for forming a thin film solar cell are provided. In one aspect, a thin film solar cell is formed by providing a back contact comprising a reflective material and an interface metal, applying a solder paste slurry that include a paste flux and metal particles to the interface metal and soldering at least one buss wire to back contact.

Abstract: One embodiment of the present invention provides a solar cell panel that includes a front-side cover, a back-side cover, a number of solar cells situated between the front-side cover and the back-side cover, and a number of maximum power point tracking (MPPT) devices situated between the front-side cover and the back-side cover.

Abstract: A solar cell includes a first conductivity type substrate; an emitter unit having a second conductivity type opposite to the first conductivity type, and forming a p-n junction with the substrate; an anti-reflective film positioned on the emitter unit; a plurality of first electrodes positioned on the anti-reflective film and connected with the emitter unit; and a second electrode connected with the substrate, wherein the emitter unit includes a first region and a second region that are positioned between an outermost first electrode among the plurality of first electrodes and the edge of the substrate, and a thickness of the first region gradually increases in going from the edge of the substrate to the outermost first electrode, and a thickness of the second region is uniform.

Abstract: A solid-state imaging device includes a substrate in which a plurality of pixels including photoelectric converters are formed, a wiring layer that includes wirings in a plurality of layers formed via an interlayer insulating film in a front surface side of the substrate, a base electrode pad portion that includes a portion of the wirings formed in the wiring layer, an opening that penetrates the substrate from a rear surface side of the substrate and reaches the base electrode pad portion, and an embedded electrode pad layer that is formed so as to be embedded in the opening by electroless plating.

Abstract: A method is disclosed for making contact with a semiconductor substrate, in particular for making contact with solar cells, in which a metallic seed structure is generated on the surface through a dielectric or passivating layer by means of an LIFT process, and the seed structure is then reinforced.

Abstract: Energy harvesting devices include a substrate coupled with a photovoltaic material and a plurality of resonance elements associated with the substrate. The resonance elements are configured to collect energy in at least visible and infrared light spectra. Each resonance element is capacitively coupled with the photovoltaic material, and may be configured to resonate at a bandgap energy of the photovoltaic material. Systems include a photovoltaic material coupled with a feedpoint of a resonance element. Methods for harvesting energy include exposing a resonance element having a resonant electromagnetic radiation having a frequency between approximately 20 THz and approximately 1,000 THz, absorbing at least a portion of the electromagnetic radiation with the resonance element, and resonating the resonance element at a bandgap energy of an underlying photovoltaic material.

Abstract: There is presented a solar cell comprising a semiconductor substrate of one conductivity-type, a layer of the opposite conductivity-type provided on a surface side of the semiconductor substrate, a surface electrode formed thereon, and a backside electrode formed on a backside of the semiconductor substrate, wherein the semiconductor substrate is formed with protrusions and recesses on the surface side thereof, and spaces that are filled with a glass component of an electrode material of the surface electrode are present in bottom portions of the recesses. This arrangement has eliminated a conventional problem in that silver in the electrode material gets into the bottom portions of the recesses and causes defects to be generated in the recesses due to stress generated during forming of the electrode.

Abstract: A solar cell includes a photoactive, semiconductive absorber layer configured to generate excess charge carriers of opposed polarity by light incident on a front of the absorber layer during operation. The absorber layer is configured to separate and move, via at least one electric field formed in the absorber layer, the photogenerated excess charge carriers of opposed polarity over a minimal effective diffusion length Leff,min. The absorber layer has a thickness Lx of 0<Lx?Leff,min. First contact elements are configured to remove the excess charge carriers of a first polarity on a rear of the absorber layer. Second contact elements are configured remove the excess charge carriers of a second polarity on the rear of the absorber layer. At least one undoped, electrically insulating second passivation region is disposed in an alternating, neighboring arrangement with a first passivation region on the rear of the absorber layer.

Abstract: The present invention provides a solar cell and manufacturing method thereof. The solar cell according to the present invention comprises: first and second electrodes, at least one of which has light transmitting properties; two or more photoelectric conversion layers positioned between the first and second electrodes; and a transflective conductive layer positioned between the photoelectric conversion layers. Further, tunneling layers are also provided between the photoelectric conversion layers and the transflective conductive layer. The efficiency of the solar cell can be improved, as compared with the prior art, by providing tunneling layers and a transflective conductive layer in this way.

Abstract: Provided are a solar cell apparatus and a method of manufacturing the same. The solar cell apparatus includes: a substrate; a back electrode layer on the substrate; a light absorbing layer on the back electrode layer; and a front electrode layer on the light absorbing layer. A groove is formed in an outline portion of the substrate.

Abstract: An etching paste having a doping function for etching a thin film on a silicon wafer and a method of forming a selective emitter of a solar cell, the etching paste including an n-type or p-type dopant; a binder; and a solvent.

Abstract: A phototransistor includes a source electrode and a gate electrode which have the same electric potential, a transparent electrode formed on a surface of an interlayer insulating film so as to be located above a channel region, and a refresh controller for reducing a charge accumulated in a portion of the channel region, the portion facing the transparent electrode, by applying a voltage between the transparent electrode, and the gate electrode and the source electrode.

Abstract: A method is described for manufacturing an optoelectric device comprising the steps of providing (S1) a layer (10) of an optoelectric active material between a first electrode (22) and a second electrode (32), providing (S2) a patterned electrically insulating layer structure (60) at at least one of said electrodes (32), the patterned electrically insulating layer structure (60) having openings (62), providing (S3) an electrolyte (70) in said openings (62), depositing (S3) a metallic layer in said openings from the electrolyte by electroplating, characterized in that the electrolyte (70) is formed by an ionic liquid.

Abstract: Disclosed are a solar cell and a method of fabricating the same. The solar cell includes a substrate, a rear electrode layer provided on the substrate, a light absorbing layer provided on the rear electrode, and a front electrode layer provided on the light absorbing layer. The rear electrode layer includes a first conductive layer provided on the substrate, a second conductive layer provided on the first conductive layer and having a grain size different from a grain size of the first conductive layer, and a third conductive layer provided on the second conductive layer and having a grain size different from the grain size of the second conductive layer.

Abstract: A photoelectric conversion element includes an insulating film, a first electrode, a light receiving layer, and a second electrode. The first electrode is formed on the insulating film and is made of titanium oxynitride. The light receiving layer is formed on the first electrode and includes an organic material. A composition of the first electrode just before forming the light receiving layer meets (1) a requirement that an amount of oxygen contained in the whole of the first electrode is 75 atm % or more of an amount of titanium, or (2) a requirement that in a range of from the substrate side of the first electrode to 10 nm or a range of from the substrate side of the first electrode to ? of the thickness of the first electrode, an amount of oxygen is 40 atm % or more of an amount of titanium.

Abstract: A multi-pixel photodetector array may include a semiconductor substrate having a back side and a front side, Geiger mode avalanche photodiodes (GM-APDs) on the semiconductor substrate, each including an anode contact, and a common cathode for the GM-APDs and having a first connection lead on the backside of the semiconductor substrate. The multi-pixel photodetector array may include a second connection lead, and a common anode on the front side of the semiconductor substrate and configured to couple in common the anode contacts of the GM-APDs to the second connection lead. Each GM-APD may be configured to generate, when a photon impinges thereon, a current pulse of different shape for discrimination by an external circuit connected to the common cathode and the common anode.

Abstract: According to the present invention, a highly sensitive photo-sensing element and a sensor driver circuit are prepared by planer process on an insulating substrate by using only polycrystalline material. Both the photo-sensing element and the sensor driver circuit are made of polycrystalline silicon film. As the photo-sensing element, a photo transistor is formed by using TFT, which comprises a first electrode 11 prepared on an insulating substrate 10, a photoelectric conversion region 14 and a second electrode 12, and a third electrode 13 disposed above the photoelectric conversion region 14. An impurity layer positioned closer to an intrinsic layer (density of active impurities is 1017 cm?3 or lower) is provided on the regions 15 and 16 on both sides under the third electrode 13 or on one of the regions 15 or 16 on one side.

Abstract: A device, system, and method for solar cell construction and layer transfer are disclosed herein. An exemplary method of solar cell construction involves providing a silicon donor substrate. A porous layer is formed on the donor substrate. A first portion of a solar cell is constructed on the porous layer of the donor substrate. The solar cell and donor substrate are bonded to a flexible substrate. The flexible substrate and the first portion of a solar cell are then separated from the donor substrate at the porous layer. A second portion of a solar cell may then be constructed on the first portion of a solar cell providing a single completed solar cell.

Abstract: Methods and apparatus are provided for solder bonding entities to solid materials. One or more through apertures are formed in a solid material. Solder paste is introduced into each through aperture. Respective entities having solderable surface features are disposed in overlying alignment with the through apertures. The arrangement is heated causing molten solder paste to wet the solderable surface features and the solid material. Cooling results in the electrical and mechanical bonding of the entities to the solid material. Devices having substantially planar form factors and without lead wires can be electrically and mechanically secured to a supporting conductive stratum.

Abstract: A solar cell containing an electrode, wherein the electrode is formed by firing a conductive paste, wherein the conductive paste includes an organic binder, a solvent, conductive particles, glass frits and a compound containing Al, Ga, In or Tl. A method for producing a solar cell by forming an electrode by firing a conductive paste, wherein the conductive paste includes an organic binder, a solvent, conductive particles, glass frits and a compound containing Al, Ga, In or Tl.

Abstract: A tandem thin-film silicon solar cell comprises a transparent substrate, a first unit cell positioned on the transparent substrate, the first unit cell comprising a p-type window layer, an i-type absorber layer and an n-type layer, an intermediate reflection layer positioned on the first unit cell, the intermediate reflection layer including a hydrogenated n-type microcrystalline silicon oxide of which the oxygen concentration is profiled to be gradually increased and a second unit cell positioned on the intermediate reflection layer, the second unit cell comprising a p-type window layer, an i-type absorber layer and an n-type layer.