Adapted For Surface Mounting (epo) Patents (Class 257/E33.057)
  • Patent number: 9041020
    Abstract: The invention relates to an optoelectronic semiconductor component, comprising a substrate-free optoelectronic semiconductor chip (1), which has a first main surface (1a) on an upper face and a second main surface (1b) on a lower face, and a metal carrier (2), which is arranged on the lower face of the optoelectronic semiconductor chip (1), wherein the metal carrier (2) protrudes over the optoelectronic semiconductor chip (1) in at least one lateral direction (1) and the metal carrier (2) is deposited on the second main surface (1b) of the optoelectronic semiconductor chip (1) using a galvanic or electroless plating method.
    Type: Grant
    Filed: July 27, 2011
    Date of Patent: May 26, 2015
    Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
    Inventors: Siegfried Herrmann, Helmut Fischer
  • Patent number: 9034672
    Abstract: A method of manufacturing a light-emitting device includes forming a first optical element on a first carrier, wherein the first optical element comprises an opening; forming a light-emitting element in the opening; forming a second optical element on the light-emitting element; forming a second carrier on the first optical element and the second optical element; removing the first carrier after forming the second carrier on the first optical element and the second optical element; and forming two separated conductive structures under the first optical element.
    Type: Grant
    Filed: June 19, 2012
    Date of Patent: May 19, 2015
    Assignee: EPISTAR CORPORATION
    Inventor: Chao-Hsing Chen
  • Patent number: 9035439
    Abstract: The present embodiments provide surface mount devices and/or systems. In some embodiments, the surface mount devices comprise a casing having a recess formed extending at least partially into said casing; and first and second leads each of which is at least partially encased by said casing and each of which has a portion exposed through said recess, wherein at least one of said first and second leads has one or more size reduction features in its said exposed portion that reduces the surface area to provide an increased surface bonding area to said casing around said lead.
    Type: Grant
    Filed: January 28, 2010
    Date of Patent: May 19, 2015
    Assignee: Cree Huizhou Solid State Lighting Company Limited
    Inventors: Wong Xuan, Xie Jian Hui, Cheng Siu Cheong
  • Patent number: 9029890
    Abstract: A light-emitting device disclosed herein comprises a patterned substrate having a plurality of cones, wherein a space is between two adjacent cones. A light-emitting stack formed on the cones. Furthermore, the cones comprise an area ratio of a top area of the cone and a bottom area of the cone which is less than 0.0064.
    Type: Grant
    Filed: July 12, 2012
    Date of Patent: May 12, 2015
    Assignee: Epistar Corporation
    Inventors: Chung-Ying Chang, Dennis Wang, Jenq-Dar Tsay
  • Patent number: 9029907
    Abstract: An optoelectronic semiconductor component includes a radiation emitting semiconductor chip having a radiation coupling out area. Electromagnetic radiation generated in the semiconductor chip leaves the semiconductor chip via the radiation coupling out area. A converter element is disposed downstream of the semiconductor chip at its radiation coupling out area. The converter element is configured to convert electromagnetic radiation emitted by the semiconductor chip. The converter element has a first surface facing away from the radiation coupling out area. A reflective encapsulation encapsulates the semiconductor chip and portions of the converter element at side areas in a form-fitting manner. The first surface of the converter element is free of the reflective encapsulation.
    Type: Grant
    Filed: November 17, 2010
    Date of Patent: May 12, 2015
    Assignee: Osram Opto Semiconductor GmbH
    Inventors: Gertrud Kräuter, Bernd Barchmann, Krister Bergenek, Michael Zitzlsperger, Johann Ramchen
  • Patent number: 9024340
    Abstract: A light emitting apparatus and a production method of the apparatus are provided that can emit light with less color unevenness at high luminance. The apparatus includes a light emitting device, a transparent member receiving incident light emitted from the device, and a covering member. The transparent member is formed of an inorganic material light conversion member including an externally exposed emission surface, and a side surface contiguous to the emission surface. The covering member contains a reflective material, and covers at least the side surfaces of the transparent member. Substantially only the emission surface serves as the emission area of the apparatus. It is possible to provide emitted light having excellent directivity and luminance. Emitted light can be easily optically controlled. In the case where each light emitting apparatus is used as a unit light source, the apparatus has high secondary usability.
    Type: Grant
    Filed: November 26, 2008
    Date of Patent: May 5, 2015
    Assignee: Nichia Corporation
    Inventors: Shunsuke Minato, Masahiko Sano
  • Patent number: 8987775
    Abstract: Embodiments include a light emitting device package. The light emitting device package comprises a housing including a cavity; a light emitting device positioned in the cavity; a lead frame including a first section electrically connected to the light emitting device in the cavity, a second section, which penetrates the housing, extending from the first section and a third section, which is exposed to outside air, extending from the second section; and a metal layer positioned on an area defined by a distance which is distant from the housing in the second section of the lead frame.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: March 24, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventor: Ki Bum Kim
  • Patent number: 8981418
    Abstract: An SMT LED device includes an LED and a circuit board supporting the LED. A pair of first solder pads are formed on the circuit board and spaced from each other. The LED includes two solder slugs extending downwardly from a bottom the LED. A positioning hole is formed at each first solder pad corresponding a position of a corresponding solder slug. A second solder pad is received in the positioning hole. Each solder slug is received in one corresponding positioning hole and electrically connected to corresponding first and second solder pads by a reflow soldering process. The present disclosure also provides a method for manufacturing the SMT LED device.
    Type: Grant
    Filed: August 12, 2012
    Date of Patent: March 17, 2015
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chih-Chen Lai
  • Patent number: 8981416
    Abstract: An organic light-emitting diode has a carrier substrate. The light-emitting diode also contains an active layer that generates and emits electromagnetic radiation at a carrier front face. The active layer is mounted on the carrier substrate. At least one contacting device is located on a carrier rear face and is arranged simultaneously for electrical contacting and for mechanical attachment of the light-emitting diode. The contacting device includes a contact region. The contact region and/or the contacting device, seen in a side view parallel to the carrier rear face, are elevated in a U-shape or L-shape above the carrier rear face and/or extend in a lateral direction away from the active layer.
    Type: Grant
    Filed: December 3, 2012
    Date of Patent: March 17, 2015
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventor: Simon Schicktanz
  • Patent number: 8975100
    Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.
    Type: Grant
    Filed: October 21, 2013
    Date of Patent: March 10, 2015
    Assignee: Nichia Corporation
    Inventors: Masato Fujitomo, Hiroto Tamaki, Shinji Nishijima, Yuichiro Tanda, Tomohide Miki
  • Patent number: 8975659
    Abstract: A chip on board light emitting diode (LED) device includes a LED device, a printed circuit board (PCB) and a dissipation unit array. The LED device includes a LED substrate, a first contact pad and a second contact pad above the LED substrate and a thermal layer formed on top surface of the LED device. The thermal layer includes a thermal conductive material. A printed circuit board (PCB) includes a PCB substrate with a thermal projection extending from surface of the PCB substrate, and a first and a second electrode pads above the PCB substrate. The thermal projection and the PCB substrate include the thermal conductive material. The dissipation unit array includes a plurality of dissipation units each disposed between the LED device and the PCB. The thermal layer is thermally coupled to the thermal projection via at least one dissipation unit. Each of the first and second contact pads is electrically coupled to the corresponding electrode pad via at least one dissipation unit.
    Type: Grant
    Filed: June 13, 2013
    Date of Patent: March 10, 2015
    Assignee: Cofan USA, Inc.
    Inventor: Pao Chen
  • Patent number: 8975646
    Abstract: An optoelectronic semiconductor component comprising at least one radiation emitting semiconductor chip disposed in a recess of a housing base body, wherein the recess is bounded laterally by a wall surrounding the semiconductor chip and is at least partially filled with an encapsulant that covers the semiconductor chip and is well transparent to an electromagnetic radiation emitted by the semiconductor chip An inner side of the wall, bounding the recess, is configured such that, as viewed looking down on the front side of the semiconductor component, a subarea of the inner side is formed which extends ring-like all the way around the semiconductor chip and which is in shadow as viewed from the radiation emitting semiconductor chip and which is at least partially covered by encapsulant all the way around the semiconductor chip. A housing base body for such a semiconductor component is also specified.
    Type: Grant
    Filed: May 12, 2005
    Date of Patent: March 10, 2015
    Assignee: Osram Opto Semiconductors GmbH
    Inventor: Karlheinz Arndt
  • Patent number: 8952402
    Abstract: Solid-state radiation transducer (SSRT) devices and methods of manufacturing and using SSRT devices are disclosed herein. One embodiment of the SSRT device includes a radiation transducer (e.g., a light-emitting diode) and a transmissive support assembly including a transmissive support member, such as a transmissive support member including a converter material. A lead can be positioned at a back side of the transmissive support member. The radiation transducer can be flip-chip mounted to the transmissive support assembly. For example, a solder connection can be present between a contact of the radiation transducer and the lead of the transmissive support assembly.
    Type: Grant
    Filed: August 26, 2011
    Date of Patent: February 10, 2015
    Assignee: Micron Technology, Inc.
    Inventor: Sameer S. Vadhavkar
  • Patent number: 8928014
    Abstract: In accordance with certain embodiments, an electric device includes a flexible substrate having first and second conductive traces on a first surface thereof and separated by a gap therebetween, an electronic component spanning the gap, and a stiffener configured to substantially prevent flexing of the substrate proximate the gap during flexing of the substrate.
    Type: Grant
    Filed: August 12, 2013
    Date of Patent: January 6, 2015
    Assignee: Cooledge Lighting Inc.
    Inventors: Michael A. Tischler, Paul Palfreyman, Philippe M. Schick
  • Patent number: 8921130
    Abstract: Methods for producing and placing wavelength converting structures for use in a solid state lighting assembly are disclosed. The wavelength converting structures may take the form of thin film converters including a substrate and one or more thin films of wavelength conversion material.
    Type: Grant
    Filed: March 14, 2012
    Date of Patent: December 30, 2014
    Assignee: OSRAM SYLVANIA Inc.
    Inventors: Darshan Kundaliya, Jeffery Serre
  • Patent number: 8912637
    Abstract: A method and apparatus for enhancing the thermal performance of semiconductor packages effectively. The concept of this invention is to provide silicon nanowires on the backside of an integrated circuit die to directly attach the die to the substrate, thereby improving the interface between die and substrate, and thus enhancing thermal performance and enhancing reliability by improving adhesion.
    Type: Grant
    Filed: September 23, 2013
    Date of Patent: December 16, 2014
    Assignee: Texas Instruments Incorporated
    Inventor: Rongwei Zhang
  • Patent number: 8907368
    Abstract: The present invention is directed to a lighting apparatus. In one embodiment the lighting apparatus includes a plurality of light emitting diode (LED) chips. A first optic is coupled to the plurality of LED chips. A diffuser is coupled to the first optic. In addition, a second optic is coupled to the diffuser.
    Type: Grant
    Filed: November 7, 2008
    Date of Patent: December 9, 2014
    Assignee: Dialight Corporation
    Inventor: John Patrick Peck
  • Patent number: 8901586
    Abstract: Disclosed are a light emitting device and a method of manufacturing the same. The light emitting device includes a substrate; a light emitting structure disposed on the substrate and having a stack structure in which a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer are stacked; a lens disposed on the light emitting structure; and a first terminal portion and a second terminal portion electrically connected to the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, respectively. At least one of the first and second terminal portions extends from a top surface of the light emitting structure along respective side surfaces of the light emitting structure and the substrate.
    Type: Grant
    Filed: July 12, 2011
    Date of Patent: December 2, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hak Hwan Kim, Ho Sun Paek, Hyung Kun Kim, Sung Kyong Oh, Jong In Yang
  • Patent number: 8890203
    Abstract: A lead 1 includes a die-bonding portion 11 with an opening 11a penetrating in a thickness direction. Another lead 2 is spaced from the lead 1. An LED unit 3 includes an LED chip 30 with a electrode terminal 31 connected to the lead 1 and another electrode terminal 32 connected to the lead 2. The LED unit 3, mounted on a surface of the die-bonding portion 11 on a first side in z direction, overlaps the opening 11a. A wire 52 connects the lead 2 and the electrode terminal 32. A support member 4 supporting the leads 1-2 is held in contact with another surface of the die-bonding portion 11 on a second side in z direction. These arrangements ensure efficient heat dissipation from the LED chip 30 and efficient use of light emitted from the LED chip 3.
    Type: Grant
    Filed: April 28, 2011
    Date of Patent: November 18, 2014
    Assignee: Rohm Co., Ltd.
    Inventor: Masahiko Kobayakawa
  • Patent number: 8890185
    Abstract: A nitride-based semiconductor light-emitting element disclosed in the present application includes: an active layer having a growing plane which is an m-plane and which is made of a GaN-based semiconductor; and at least one radiation surface at which light from the active layer is to be radiated. The radiation surface has a plurality of protrusions on the m-plane. A base of each of the plurality of protrusions is a region inside a closed curve, and a shape of the base has a major axis and a minor axis. An angle between the major axis and an extending direction of an a-axis of a crystal is not more than 45°.
    Type: Grant
    Filed: April 23, 2013
    Date of Patent: November 18, 2014
    Assignee: Panasonic Corporation
    Inventors: Atsushi Yamada, Akira Inoue, Toshiya Yokogawa
  • Patent number: 8872330
    Abstract: A thin-film semiconductor component having a carrier layer and a layer stack which is arranged on the carrier layer, the layer stack containing a semiconductor material and being provided for emitting radiation, wherein a heat dissipating layer provided for cooling the semiconductor component is applied on the carrier layer. A component assembly is also disclosed.
    Type: Grant
    Filed: July 16, 2007
    Date of Patent: October 28, 2014
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Siegfried Herrmann, Berthold Hahn
  • Patent number: 8872296
    Abstract: The present invention provides a chip module structure for particles protection. The structure includes a substrate. A chip is configured on the substrate, with a sensing area. A holder is disposed on the substrate, wherein the holder has a first rib. A transparent material is disposed on the holder, substantially aligning to the sensing area. A lens holder is disposed on the holder, and a lens is configured on the lens holder, substantially aligning to the transparent material and the sensing area. The lens has a second rib, wherein the second rib is disposed corresponding to the first rib for blocking particles entering into the chip module structure.
    Type: Grant
    Filed: November 1, 2012
    Date of Patent: October 28, 2014
    Assignee: Lite-On Technology Corporation
    Inventor: Shin-Dar Jan
  • Patent number: 8866246
    Abstract: The present invention provides a holder on chip module structure including a substrate. A chip is configured on the substrate, with a sensing area. A holder is disposed on the substrate, wherein a portion of the holder is directly contacted to the chip to reduce the tilt between the chip and the holder. A transparent material is disposed on the holder, substantially aligning to the sensing area. A lens holder is disposed on the holder, and a lens is configured on the lens holder, substantially aligning to the transparent material and the sensing area.
    Type: Grant
    Filed: November 1, 2012
    Date of Patent: October 21, 2014
    Assignee: LarView Technologies Corporation
    Inventor: Shin-Dar Jan
  • Patent number: 8866169
    Abstract: A light emitter package having increased feature sizes for improved luminous flux and efficacy. An emitter chip is disposed on a submount with a lens that covers the emitter chip. In some cases, the ratio of the width of the light emitter chip to the width of said lens in a given direction is 0.5 or greater. Increased feature sizes allow the package to emit light more efficiently. Some packages include submounts having square dimensions greater than 3.5 mm used in conjunction with larger emitter chips. Materials having higher thermal conductivities are used to fabricate the submounts, providing the package with better thermal management.
    Type: Grant
    Filed: April 9, 2010
    Date of Patent: October 21, 2014
    Assignee: Cree, Inc.
    Inventors: David Emerson, Brian Collins, Michael Bergmann, John Edmond, Eric Tarsa, Peter Andrews, Bernd Keller, Christopher Hussell, Amber Salter
  • Patent number: 8860069
    Abstract: A light-emitting device package. The light-emitting device package includes a lead frame comprising a plurality of separate leads; a molding member that fixes the plurality of leads and comprises an opening portion that exposes the lead frame; and a light-emitting device chip that is attached on the lead frame in the opening portion and emits light through an upper surface portion of the light-emitting device chip, wherein a height of the molding member is lower than a height of the light-emitting device chip with respect to the lead frame.
    Type: Grant
    Filed: February 3, 2012
    Date of Patent: October 14, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Cheol-jun Yoo, Young-hee Song
  • Patent number: 8860045
    Abstract: An embodiment of the present invention provides a light emitting device including: a transparent substrate; a wiring layer disposed on the transparent substrate; a plurality of light emitting diode chips disposed on the transparent substrate and electrically connected to the wiring layer; and an opposite substrate disposed on the transparent substrate to sandwich the light emitting diode chips and the wiring layer, wherein no wiring layer is disposed on a surface of the opposite substrate facing the light emitting diode chips.
    Type: Grant
    Filed: August 4, 2012
    Date of Patent: October 14, 2014
    Assignee: Kun Hsin Technology
    Inventor: Kun-Chuan Lin
  • Patent number: 8853733
    Abstract: An light-emitting diode (LED) package includes a substrate, a electrode structure embedded in the substrate, and a plurality of LED chips electrically connecting with the electrode structure. The substrate includes a main portion and a protruding portion extending from a bottom surface of the main portion. The main portion is located above the protruding portion. The electrode structure includes a first, a second and a third electrode spaced from each other. The third electrode is located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of the top surface of the main portion. Bottom surfaces of the first and second electrodes are exposed out of the bottom surface of the main portion. Bottom surface of the third electrode is covered by the protruding portion. The present disclosure also relates to a method for manufacturing the LED package.
    Type: Grant
    Filed: August 12, 2013
    Date of Patent: October 7, 2014
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Che-Hsang Huang, Pin-Chuan Chen, Lung-Hsin Chen, Wen-Liang Tseng, Yu-Liang Huang
  • Patent number: 8841692
    Abstract: A lead frame comprises on a same plane, a pad part including an LED chip mounting upper surface A on which at least an LED chip is to be mounted, and a lead part including an electric connection area C in which an electric connection with the LED chip is made. A relationship between an area S1 of the mounting upper surface of the pad part 2 and an area S2 of a radiating lower surface opposite to the mounting upper surface is represented by 0<S1<S2. Side surfaces of the pad part between the mounting upper surface and the radiating lower surface are provided with stepped parts or tapered parts which spread in a direction from the mounting upper surface toward the radiating lower surface and hold a resin-filled during molding.
    Type: Grant
    Filed: February 4, 2011
    Date of Patent: September 23, 2014
    Assignee: Toppan Printing Co., Ltd.
    Inventors: Osamu Yoshioka, Hitoshi Motomura, Takehito Tsukamoto
  • Patent number: 8841694
    Abstract: A LED module with separate heat-dissipation and electrical conduction paths is disclosed, having a metal substrate; a plastic layer, including one or more hollow regions, and attached to the metal substrate; one or more conducting elements attached to the plastic layer; one or more LED chips positioned in the one or more hollow regions of the plastic layer and directly attached to the metal substrate; and a plurality of conducting wires for electrically connecting the one or more conducting elements and the one or more LED chips; wherein inner sides of the one or more hollow regions include one or more inclined surfaces each having an included angle with an upper surface of the metal substrate, and the included angle is between 90˜180 degrees.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: September 23, 2014
    Assignee: LITUP Technology Co. Ltd.
    Inventors: Chih-Chen Lin, Tsung-I Lin, Ying-Che Sung
  • Patent number: 8816386
    Abstract: A flip-chip LED including a light emitting structure, a first dielectric layer, a first metal layer, a second metal layer, and a second dielectric layer is provided. The light emitting structure includes a first conductive layer, an active layer, and a second conductive layer. The active layer is disposed on the first conductive layer, and the second conductive layer is disposed on the active layer. The first metal layer is disposed on the light emitting structure and is contact with the first conductive layer, and part of the first metal layer is disposed on the first dielectric layer. The second metal layer is disposed on the light emitting structure and is in contact with the second conductive layer, and part of the second metal layer is disposed on the first dielectric layer. The second dielectric layer is disposed on the first dielectric layer. The first conductive layer includes a rough surface so as to improve a light extraction efficiency.
    Type: Grant
    Filed: January 16, 2014
    Date of Patent: August 26, 2014
    Assignee: Epistar Corporation
    Inventors: Tzer-Perng Chen, Jen-Chau Wu, Chuan-Cheng Tu, Yuh-Ren Shieh
  • Patent number: 8802459
    Abstract: A surface mount lateral light emitting apparatus, which includes a light emitting device; a first lead frame connected to the light emitting device; a second lead frame connected to the light emitting device; a first resin molding body in which a concave portion for mounting the light emitting device is formed and the first lead frame and the second lead frame are fixed; and a second resin molding body which covers the light emitting device to form a light emitting surface in the concave portion of the first resin molding body, wherein the first resin molding body contains a filler or a light diffusion agent; wherein in a periphery of the concave portion, a width of at least one side of the first resin molding body is not more than 0.2 mm; and wherein the first resin molding body and the second resin molding body are formed with a thermosetting resin.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: August 12, 2014
    Assignee: Nichia Corporation
    Inventor: Masaki Hayashi
  • Patent number: 8791468
    Abstract: A method of fabricating a gallium nitride (GaN) thin layer, by which a high-quality GaN layer may be grown on a large-area substrate using an electrode layer suspended above a substrate, a GaN film structure fabricated using the method, and a semiconductor device including the GaN film structure. The method includes forming a sacrificial layer on a substrate, forming a first buffer layer on the sacrificial layer, forming an electrode layer on the first buffer layer, forming a second buffer layer on the electrode layer, partially etching the sacrificial layer to form at least two support members configured to support the first buffer layer and form at least one air cavity between the substrate and the first buffer layer, and forming a GaN thin layer on the second buffer layer.
    Type: Grant
    Filed: October 11, 2011
    Date of Patent: July 29, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joo-ho Lee, Jun-hee Choi, Sang-hun Lee, Mi-jeong Song
  • Patent number: 8766313
    Abstract: A mounting board including a pair of patterned electrodes, a lower surface and an upper surface opposed thereto on which a substrate of an electronic component is to be mounted, a pass-through hole penetrating through the upper surface and the lower surface, and a peripheral side surface that defines the pass-through hole. The pass-through hole includes a plurality of penetrating grooves that are cut into the mounting board and penetrate through the upper and lower surfaces. The plurality of penetrating grooves electrically split the pair of patterned electrodes. The pair of patterned electrodes is partly positioned inside the peripheral side surface, and a connection portion connecting the at least one pair of patterned electrodes and at least one pair of patterned electrodes provided on the upper surface of the substrate of the electronic component is to be disposed inside the peripheral side surface that defines the pass-through hole.
    Type: Grant
    Filed: February 23, 2011
    Date of Patent: July 1, 2014
    Assignees: Citizen Electronics Co., Ltd., Citizen Holdings Co., Ltd., Panasonic Corporation
    Inventors: Kohsuke Kashitani, Koichi Fukasawa, Jun Takashima, Katsuyuki Kiyozumi
  • Patent number: 8741673
    Abstract: The present invention relates to a polarized light emitting diode (LED) device and the method for manufacturing the same, in which the LED device comprises: a base, a light emitting diode (LED) chip, a polarizing waveguide and a packaging material. In an exemplary embodiment, the LED chip is disposed on the base and is configured with a first light-emitting surface for outputting light therefrom; and the waveguide, being comprised of a polarization layer, a reflection layer, a conversion layer and a light transmitting layer, is disposed at the optical path of the light emitted from the LED chip; and the packaging material is used for packaging the waveguide, the LED chip and the base into a package.
    Type: Grant
    Filed: January 9, 2012
    Date of Patent: June 3, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Cheng-Huan Chen, Han-Ping Yang, Hung-Yi Lin, Cheng-Hsuan Lin
  • Patent number: 8728937
    Abstract: For semiconductor chips using thin film technology, an active layer sequence is applied to a growth substrate, on which a reflective electrically conductive contact material layer is then formed. The active layer sequence is patterned to form active layer stacks, and reflective electrically conductive contact material layer is patterned to be located on each active layer stack. Then, a flexible, electrically conductive foil is applied to the contact material layers as an auxiliary carrier layer, and the growth substrate is removed.
    Type: Grant
    Filed: January 8, 2010
    Date of Patent: May 20, 2014
    Assignee: Osram Opto Semiconductors GmbH
    Inventors: Andreas Ploessl, Stephan Kaiser, Volker Härle, Berthold Hahn
  • Patent number: 8723195
    Abstract: A light emitting device includes a substrate having a rectangular outer shape in a top view, a plurality of LED chips, a resin frame formed on the primary surface of the substrate and provided annularly so as to surround a mounting area in which the LED chips are provided, an anode-side electrode land and a cathode-side electrode land which are electrodes to be connected to an external voltage supply of said light emitting device. An electrode wiring pattern may be formed on the primary surface of the substrate including (i) an anode line extending from the anode-side electrode land to a portion under the resin frame and (ii) a cathode line extending from the cathode-side electrode land to the other portion under the resin frame.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: May 13, 2014
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Shinya Ishizaki, Makoto Agatani, Tomokazu Nada, Toshio Hata
  • Patent number: 8723217
    Abstract: Disclosed is a light emitting diode package having a simplified configuration and high color reproducibility. The light emitting diode package includes a package body, first and second light emitting diode chips received in the package body, a lead frame electrically connected to the first and second light emitting diode chips, the lead frame serving to adjust color of light according to the ratio of current of the first and second light emitting diode chips, and a light conversion layer configured to cover the first and second light emitting diode chips, the light conversion layer serving to convert light emitted from the first and second light emitting diode chips into a particular wavelength of light so as to emit a desired wavelength of light.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: May 13, 2014
    Assignee: LG Display Co., Ltd.
    Inventor: Je-Young Moon
  • Patent number: 8716735
    Abstract: A light-emitting diode has a metal structure, a light-emitting chip, and a bowl structure. The metal structure has a platform and a heat sink. The platform has a top face, a first side, and a second side opposite to the first side. A first reflector and a second reflector respectively extend from the first side and the second side. The heat sink extends below the top face and has a drop from the bottom surfaces of the first reflector and the second reflector. The light-emitting chip is disposed on the top face. The bowl structure covers the outer surface of the metal structure and shields the bottom surfaces of the first reflector and the second reflector. A thermal dispassion surface of the heat sink is exposed from the bowl structure. An inner surface of bowl wall has a plurality of reflection structures to promote the light extraction efficiency.
    Type: Grant
    Filed: March 8, 2012
    Date of Patent: May 6, 2014
    Assignee: Lextar Electronics Corp.
    Inventors: Feng-Jung Hsu, Chin-Chang Hsu, Chun-Wei Wang, Jian-Chin Liang
  • Patent number: 8716734
    Abstract: An LED package includes a substrate, an electrode layer, a light-emitting chip, a reflection cup and an encapsulation. The substrate includes a first surface, an opposite second surface, and two side surfaces. The electrode layer is consisted of a positive electrode and a negative electrode, each of which extends from the first surface to the second surface via a respective side surface. The light-emitting chip is located on the first surface of the substrate and electrically connected to the electrode layer. The reflection cup comprises a first part covering the electrode layer on the side surfaces of the substrate, a second part with a bowl-like shape on the first surface of the substrate and surrounding the light-emitting chip. The encapsulation is filled in the second part of the reflection cup.
    Type: Grant
    Filed: December 23, 2011
    Date of Patent: May 6, 2014
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Ming-Ta Tsai, Ching-Chung Chen
  • Patent number: 8710536
    Abstract: A high efficiency light emitting diode with a composite high reflectivity layer integral to said LED to improve emission efficiency. One embodiment of a light emitting diode (LED) chip comprises an LED and a composite high reflectivity layer integral to the LED to reflect light emitted from the active region. The composite layer comprises a first layer, and alternating plurality of second and third layers on the first layer, and a reflective layer on the topmost of said plurality of second and third layers. The second and third layers have a different index of refraction, and the first layer is at least three times thicker than the thickest of the second and third layers. For composite layers internal to the LED chip, conductive vias can be included through the composite layer to allow an electrical signal to pass through the composite layer to the LED.
    Type: Grant
    Filed: October 7, 2013
    Date of Patent: April 29, 2014
    Assignee: Cree, Inc.
    Inventors: James Ibbetson, Ting Li, Monica Hansen
  • Patent number: 8710539
    Abstract: Provided is a metal foil laminate that: has heat resistance; has high reflectance in the visible light range; has little decrease in reflectance in environments with a high-temperature thermal load; is compatible with large surface areas; and can be used for printed circuit boards for mounting LEDs that have excellent adhesion with metals. The metal foil laminate is characterized in that: a laminate has metal foil on at least one side of a resin layer (A) containing a polyorganosiloxane and an inorganic filler; the 90° peel strength between said resin layer (A) and said metal foil is at least 0.95 kN/m, and the mean reflectance at wavelengths of 400 to 800 nm on the surface that is exposed when the resin layer (A) is exposed by peeling and removing said metal foil is at least 80%; and the decrease in the reflectance at a wavelength of 470 nm after being treated with heat for 10 minutes at 260° C. is not more than 5%.
    Type: Grant
    Filed: July 26, 2011
    Date of Patent: April 29, 2014
    Assignee: Mitsubishi Plastics, Inc.
    Inventors: Jun Matsui, Tomohiko Terai, Syuuji Suzuki
  • Patent number: 8698185
    Abstract: Provided are a light emitting device and a light unit. The light emitting device includes a package body including a body, a plurality of electrodes on the body, and a concave portion on at least one of the plurality of electrodes, a light emitting chip including a convex portion corresponding to the concave portion to couple and attach the concave portion to the convex portion, the light emitting chip including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, and an adhesion layer on a bottom surface of the light emitting chip.
    Type: Grant
    Filed: February 15, 2011
    Date of Patent: April 15, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventors: Jae Cheon Han, Jung Hyeok Bae, Young Kyu Jeong, Da Jeong Song
  • Patent number: 8698184
    Abstract: A light emitting diode chip a support layer having a first face and a second face opposite the first face, a diode region on the first face of the support layer, and a bond pad on the second face of the support layer. The bond pad includes a gold-tin structure having a weight percentage of tin of 50% or more. The light emitting diode chip may include a plurality of active regions that are connected in electrical series on the light emitting diode chip.
    Type: Grant
    Filed: January 21, 2011
    Date of Patent: April 15, 2014
    Assignee: Cree, Inc.
    Inventors: Michael John Bergmann, Christopher D. Williams, Kevin Shawne Schneider, Kevin Haberern, Matthew Donofrio
  • Patent number: 8686461
    Abstract: A light emitting diode (LED) die includes a first substrate having a first surface and an opposing second surface; a second substrate on the second surface of the first substrate; a p-type semiconductor layer on the first surface of the first substrate; a multiple quantum well (MQW) layer on the p-type semiconductor layer configured to emit light; and an n-type semiconductor layer on the multiple quantum well (MQW) layer.
    Type: Grant
    Filed: December 14, 2011
    Date of Patent: April 1, 2014
    Assignee: SemiLEDS Optoelectronics Co., Ltd.
    Inventors: Jiunn-Yi Chu, Chen-Fu Chu, Chao-Chen Cheng
  • Patent number: 8674387
    Abstract: A light emitting device is provided with a base member, an interconnect pattern disposed on an upper surface of the base member, a light reflecting layer comprising a first layer disposed on a part of the interconnect pattern and formed from a metal material, and a second layer made of a dielectric multilayer reflecting film made with stacked layers of dielectric films having different refractive indices and covering an upper surface and side surfaces of the first layer, a light emitting element chip fixed so as to face at least a part of the light reflecting layer, and a light transmissive sealing member sealing the light reflecting layer and the light emitting element chip.
    Type: Grant
    Filed: April 16, 2010
    Date of Patent: March 18, 2014
    Assignee: Nichia Corporation
    Inventor: Daisuke Sanga
  • Patent number: 8659047
    Abstract: A light emitting device includes a substrate having an element mounting area in a principal surface thereof. The light emitting device also includes at least one light emitting element mounted in the element mounting area of the substrate. The light emitting device also includes a heat transfer member provided on the substrate. The heat transfer member has a thermal conductivity different from thermal conductivity of the substrate so as to form uneven thermal resistance distribution in the element mounting area. Thermal resistance in a heat radiation path through the substrate for release of heat emitted from the light emitting element changes with the mounting position of the light emitting element.
    Type: Grant
    Filed: May 10, 2011
    Date of Patent: February 25, 2014
    Assignee: Stanley Electric Co., Ltd.
    Inventor: Ryosuke Kondo
  • Patent number: 8633643
    Abstract: Disclosed are an LED package, an LED package module having the same and a manufacturing method thereof, and a head lamp module having the same and a control method thereof. The light emitting diode package includes: a package substrate; a light emitting diode chip mounted on one surface of the package substrate; an electrode pad formed on the other surface of the package substrate and electrically connected to the light emitting diode chip; and a heat radiation pad formed on the other surface of the package substrate and electrically insulated from the electrode pad.
    Type: Grant
    Filed: November 30, 2010
    Date of Patent: January 21, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young Jin Lee, Hyung Kun Kim
  • Patent number: 8614456
    Abstract: An LED die (3) is arranged with an adhesive (4) on an LED PCB (6). The LED PCB (6) has on the side opposite to the LED die (3) rear side contacts (7). Through this a self-contained LED lamp is formed, which e.g. can be applied by means of SMT to a board (9) or introduced into a lamp socket. In accordance with the invention, the rear side contacts (7) cover at least the half area, preferably the entire area apart from necessary exceptions, of the LED PCB (6). Through this, the heat can be discharged with slight thermal resistance. Preferably a cooling body (11) is arranged on the rear side of the board (9). In this case it is expedient if the board (9) has through-contacts for increasing the thermal conductivity.
    Type: Grant
    Filed: June 9, 2004
    Date of Patent: December 24, 2013
    Assignee: Tridonic Optoelectronics GmbH
    Inventor: Günther Leising
  • Patent number: 8610146
    Abstract: Provided is an LED package including a metal substrate that has one or more via holes formed therein; an insulating layer that is formed on a surface of the metal substrate including inner surfaces of the via holes; a plurality of metal patterns that are formed on the insulating layer and are electrically isolated from one another; and an LED chip that is mounted on a metal pattern among the plurality of metal patterns.
    Type: Grant
    Filed: September 26, 2008
    Date of Patent: December 17, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang Hyun Shin, Seog Moon Choi, Young Ki Lee
  • Patent number: RE44811
    Abstract: The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess.
    Type: Grant
    Filed: December 19, 2011
    Date of Patent: March 18, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seon Goo Lee, Chang Wook Kim, Kyung Taeg Han