Abstract: A method for fabricating light emitting diode (LEDs) comprises providing a plurality of LEDs on a substrate wafer, each of which has an n-type and p-type layer of Group-III nitride material formed on a SiC substrate with the n-type layer sandwiched between the substrate and p-type layer. A conductive carrier is provided having a lateral surface to hold the LEDs. The LEDs are flip-chip mounted on the lateral surface of the conductive carrier. The SiC substrate is removed from the LEDs such that the n-type layer is the top-most layer. A respective contact is deposited on the n-type layer of each of the LEDs and the carrier is separated into portions such that each of the LEDs is separated from the others, with each of the LEDs mounted to a respective portion of said carrier.

Abstract: An LED chip package structure with high-efficiency light-emitting effect includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips arranged on the substrate body, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids respectively covered on the LED chips.

Abstract: In one embodiment of the invention, a bonding material is used to bond a substitute substrate to the LED, wherein the bonding material does not including gold or tin. The bonding material preferably includes gallium (Ga), such as a combination of Ga and Al or Cu. This bonding material has high thermal conductivity, high strength, high temperature stability and is low cost. In another embodiment of the invention, the substitute substrate is first thinned before it is bonded to the LED structure, so that the substitute substrate is flexible and conforms to the shape of the LED structure. In yet another embodiment of the invention, an apparatus is used for bonding a substitute substrate to a LED which includes a plurality of semiconductor epitaxial layers, said semiconductor epitaxial layers having been grown on the growth substrate so that said semiconductor epitaxial layers are curved in shape.

Abstract: A light-emitting module includes a module substrate, semiconductor light-emitting elements and a connection substrate. On one face of the module substrate, a conductive layer is formed. The semiconductor light-emitting elements and the connection substrate are mounted on the conductive layer of the module substrate. Electric wires, which extend from a lighting circuit, are connected to the connection substrate. Power is supplied to the semiconductor light-emitting elements through the connection substrate and the conductive layer of the module substrate.

Abstract: A semiconductor light emitting device includes a semiconductor light emitting element, a lead electrically connected to the semiconductor light emitting element, and a resin package covering the semiconductor light emitting element and part of the lead. The resin package includes a lens facing the semiconductor light emitting element. The lead includes an exposed portion that is not covered by the resin package. The exposed portion includes a first portion and a second portion, where the first portion has a first mount surface oriented backward along the optical axis of the lens, and the second portion has a second mount surface oriented perpendicularly to the optical axis of the lens.

Abstract: A high efficiency light emitting diode with a composite high reflectivity layer integral to said LED to improve emission efficiency. One embodiment of a light emitting diode (LED) chip comprises an LED and a composite high reflectivity layer integral to the LED to reflect light emitted from the active region. The composite layer comprises a first layer, and alternating plurality of second and third layers on the first layer, and a reflective layer on the topmost of said plurality of second and third layers. The second and third layers have a different index of refraction, and the first layer is at least three times thicker than the thickest of the second and third layers. For composite layers internal to the LED chip, conductive vias can be included through the composite layer to allow an electrical signal to pass through the composite layer to the LED.

Abstract: An assembly method to enable local electrical bonds between zones located on a face of a first substrate and corresponding zones located on a face of a second substrate, the faces being located facing each other, at least one of the substrates having a surface topography. The method forms an intermediate layer including at least one burial layer on the face of the substrate or substrates having a surface topography to make it (them) compatible with molecular bonding of the faces of substrates to each other from a topographic point of view, resistivity and/or thickness of the intermediate layer being chosen to enable the local electrical bonds, brings the two faces into contact, the substrates positioned to create electrical bonds between areas on the first substrate and corresponding areas on the second substrate, and bonds the faces by molecular bonding.

Abstract: A semiconductor based component with radiation-emitting properties. A glass substrate (1) is provided, which has a first surface (2) and a second surface (1), where a semiconductor element (5) with radiation-emitting properties is accommodated on the first surface (2). Also disclosed is a method for fabricating a semiconductor based component, with the following steps: providing a glass substrate (1), application of a semiconductor element (5) to the first surface (2) of the glass substrate. Also disclosed is a receptacle for a semiconductor based component in which two electrical contact areas (13) are provided, which can be electrically connected to contact areas (7) of the semiconductor based component.

Abstract: A submount for mounting an LED chip includes a substrate, a die attach pad configured to receive an LED chip on an upper surface of the substrate, a first meniscus control feature on the substrate surrounding the die attach pad and defining a first encapsulant region of the upper surface of the substrate, and a second meniscus control feature on the substrate surrounding the first encapsulant region and defining a second encapsulant region of the upper surface of the substrate. The first and second meniscus control features may be substantially coplanar with the die attach pad. A packaged LED includes a submount as described above and further includes an LED chip on the die attach pad, a first encapsulant on the substrate within the first encapsulant region, and a second encapsulant on the substrate within the second encapsulant region and covering the first encapsulant. Method embodiments are also disclosed.

Abstract: A light emitting device package is provided. The light emitting device package includes a substrate including a first cavity having a first depth and a lateral surface inclined with respect to a bottom surface and a second cavity having a second depth recessed from the bottom surface of the first cavity and a lateral surface perpendicular to the bottom surface of the first cavity, a first electrode layer and a second electrode layer on the substrate, and a light emitting diode within the second cavity, the light emitting diode being electrically connected to the first and second electrode layers.

Abstract: A method for manufacturing a light emitting diode (LED) assembly comprises the steps of: preparing a chip carrier comprising a carrier substrate, a P type electrode and an N type electrode, and arranging an LED chip onto the carrier substrate to electrically connect the LED chip with the P type electrode and the N type electrode; packaging the LED chip with a light-transmissible packaging gel and making the P type electrode and the N type electrode exposed to form a molded LED chip cell; preparing an arrangement carrier comprising a arrangement carrier substrate, a P type electrode plate and an N type electrode plate; forming an arrangement recess on the arrangement carrier substrate; and arranging the molded LED chip cell into the arrangement recess to make the P type electrode and the N type electrode electrically connect to the P type electrode plate and the N type electrode plate respectively.

Abstract: A method for manufacturing a light emitting diode (LED) assembly comprises the steps of: preparing a chip carrier comprising a carrier substrate, a P type electrode and an N type electrode, and arranging an LED chip onto the carrier substrate to electrically connect the LED chip with the P type electrode and the N type electrode; packaging the LED chip with a light-transmissible packaging gel and making the P type electrode and the N type electrode exposed to form a molded LED chip cell; preparing an arrangement carrier comprising a arrangement carrier substrate, a P type electrode plate and an N type electrode plate; forming an arrangement recess on the arrangement carrier substrate; and arranging the molded LED chip cell into the arrangement recess to make the P type electrode and the N type electrode electrically connect to the P type electrode plate and the N type electrode plate respectively.

Abstract: A light-emitting diode (LED) is fabricated by forming the LED segments with bond pads covering greater than 85% of a mounting surface of the LED segments and isolation trenches that electrically isolate the LED segments, mounting the LED segments on a submount with a bond pad that couples two or more bond pads from the LED segments, and applying a laser lift-off to remove the growth substrate from the LED layer.

Abstract: A light-emitting diode package 1 of the present invention is a light-emitting diode package including: a diode group 2D made of a plurality of light-emitting diode chips 2 connected in series and a lead group 3 connected to the diode group 2D, in which the lead group 3 includes: a pair of external leads 31 and 32 as terminals of the diode group 2D and auxiliary leads 33 the number of which is one less than that of the light-emitting diode chips 2, in which the plurality of the light-emitting diode chips 2 are arranged in one line on a first external lead 31 of the pair of external leads 31 and 32, in which the auxiliary leads 33 are arranged on one or both sides of a row made of the plurality of light-emitting diode chips 2, and in which the adjacent light-emitting diode chips 2 of the plurality of light-emitting diode chips 2 are connected in series via the auxiliary leads 33.

Abstract: An LED diode package includes a heat connecting part for mounting a light emitting part on an upper surface thereof, frames electrically connected to the light emitting part while holding the heat connecting part and a molded part fixing the heat connecting part and the frames together. The light emitting part generates light in response to current applied thereto, and the upper surface of the heat connecting part is protruded beyond an upper surface of the molded part to a predetermined height. This can optimize the unique beam angle of the light source thereby to maximize lighting efficiency as well as prevent overflow of the encapsulating material in the assembling process of the lens, which may otherwise soil adjacent components.

Abstract: An optical device package comprises: a metal frame including a substrate and a rectangular die pad portion integrally connected to the substrate, wherein the substrate is a metal plate, and the die pad portion is bent from the substrate such that the die pad portion extends from the substrate at an angle of 90 degrees; signal lead pins extend in the opposite directions from the die pad portion relative to the substrate such that the first lead pins intersect the principal surfaces of the substrate at a right angle and are spaced apart from the metal frame; and a molded resin member including a plate-like resin base extending across and in contact with one of the principal surfaces of the substrate, wherein the signal lead pins protrude from a surface of the resin base; surfaces of the signal lead pins are covered with the molded resin member; and the metal frame and the signal lead pins are secured in place by the molded resin member.

Abstract: A light-emitting module fabrication method includes the steps of (a) forming component contacts and positive-bonding and negative-bonding contacts on a circuit layout on a substrate, (b) electrically bonding the pins of electronic components to the component contacts and P-electrode bonding pads and N-electrode bonding pads of light-emitting chips to the positive-bonding and negative-bonding contacts at the substrate, (c) employing a coating technique to cover light-emitting surfaces of each of the light-emitting chips with a respective phosphor layer, and (d) employing a curing technique to cure the phosphor layers.

Abstract: An external component, typically a surface mount passive, is attached to a semiconductor die. In some embodiments the passive is placed directly over exposed pads on the semiconductor die and attached using conductive tape or conductive epoxy. In some embodiments the passive is attached to the semiconductor die using non-conductive adhesive and wire bonded to bond pads on the semiconductor die and/or to pads on a substrate to which the semiconductor die is attached.

Abstract: A light source apparatus and a fabrication method thereof can prevent light interference between light emitting devices adjacent to each other and increase the luminous efficiency by collecting light emitted from the side of the light emitting device toward the front of a metal stem by forming grooves at a sub-mounts, bonding the light emitting device to the inside of the groove by a flip chip bonding method and forming a reflective layer inside the groove.

Abstract: A surface mountable device having a circuit device and a base section. The circuit device includes top and bottom layers having a top contact and a bottom contact, respectively. The base section includes a substrate having a top base surface and a bottom base surface. The top base surface includes a top electrode bonded to the bottom contact, and the bottom base surface includes first and second bottom electrodes that are electrically isolated from one another. The top electrode is connected to the first bottom electrode, and the second bottom electrode is connected to the top contact by a vertical conductor. An insulating layer is bonded to a surface of the circuit device and covers a portion of a vertical surface of the bottom layer. The vertical conductor includes a layer of metal bonded to the insulating layer.

Abstract: A circuit board for a light emitting diode package improved in heat radiation efficiency and a manufacturing method thereof. In a simple manufacturing process, insulating layers are formed by anodizing on a portion of a thermally conductive board body and plated with a conductive material. In the light emitting diode package, a board body is made of a thermally conductive metal. Insulating oxidation layers are formed at a pair of opposing edges of the board body. First conductive patterns are formed on the insulating oxidation layers, respectively. Also, second conductive patterns are formed in contact with the board body at a predetermined distance from the first conductive patterns, respectively. The light emitting diode package ensures heat generated from the light emitting diode to radiate faster and more effectively. Additionally, the insulating layers are formed integral with the board body by anodizing, thus enhancing productivity and durance.

Abstract: An LED package structure includes a first LED chip, a second LED chip arranged on the minor light-emitting surface of the first LED chip, a conductive unit connected between the electrode areas for parallel or serially connecting the two LED chips together, and two external electric conduction units for electrically connecting both the first and second electrode areas of the first LED chip with an external circuit.

Abstract: A light emitting apparatus and a production method of the apparatus are provided that can emit light with less color unevenness at high luminance. The apparatus includes a light emitting device, a transparent member receiving incident light emitted from the device, and a covering member. The transparent member is formed of an inorganic material light conversion member including an externally exposed emission surface, and a side surface contiguous to the emission surface. The covering member contains a reflective material, and covers at least the side surfaces of the transparent member. Substantially only the emission surface serves as the emission area of the apparatus. It is possible to provide emitted light having excellent directivity and luminance. Emitted light can be easily optically controlled. In the case where each light emitting apparatus is used as a unit light source, the apparatus has high secondary usability.

Abstract: An electronic device according to the invention includes a housing, a recess containing an optoelectronic component, and a film including a polyimide, which is over the recess covering the optoelectronic component.

Abstract: A semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region is formed. A first metal contact is formed on a portion of the n-type region and a second metal contact is formed on a portion of the p-type region. The first and second metal contacts are formed on a same side of the semiconductor structure. A dielectric material is disposed between the first and second metal contacts. The dielectric material is in direct contact with a portion of the semiconductor structure, a portion of the first metal contact, and a portion of the second metal contact.

Abstract: An LED housing, in which a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a neck between them. Fixing parts have first ends engaged with the neck. An electrical connecting part has a wire connecting area placed adjacent to the chip mounting area and an external power connecting area connected to the wire connecting area. A housing body of molding material integrally holds the heat conducting part, the fixing parts and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The LED housing fixes the neck of the heat conducting part at both sides, thereby stably coupling the heat conducting part to the housing body. The fixing parts can spread heat from the heat conducting part to lateral regions of the LED housing, thereby more efficiently spreading heat.

Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series.

Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series.

Abstract: Light emitting diode (LED) dies are fabricated by forming LED layers including a first conductivity type layer, a light-emitting layer, and a second conductivity type layer. Trenches are formed in the LED layers that reach at least partially into the first conductivity type layer. Electrically insulation regions are formed in or next to at least portions of the first conductivity type layer along the die edges. A first conductivity bond pad layer is formed to electrically contact the first conductivity type layer and extend over the singulation streets between the LED dies. A second conductivity bond pad layer is formed to electrically contact the second conductivity type layer, and extend over the singulation streets between the LED dies and the electrically insulated portions of the first conductivity type layer. The LED dies are mounted to submounts and the LED dies are singulated along the singulation streets between the LED dies.

Abstract: A new SMD (surface mount devices) package design for efficiently removing heat from LED Chip(s) is involved in this invention. Different from the regular SMD package, which electrical isolated materials like Alumina or AlN are used, the substrate material here is metal like Copper, Aluminum and so on. Also, different from regular design, which most time only has one LED chip inside, current design will at least have two or more LED chips (or chip groups) in one package. All chips are electrical connected via metal blocks, traces or wire-bond. This type of structure is generally fabricated via chemical etching and then filled with dielectric material inside to form a strong package. Because the thermal conductivity of the metal is much higher than the ceramics, the package thermal resistance is much lower than the ceramics based package. Also, the cost of the package is much lower than ceramics package. Moreover, emitting area in one package is much larger than the current arts.

Abstract: A flip chip type LED lighting device manufacturing method includes the step of providing a strip, the step of providing a submount, the step of forming a metal bonding layer on the strip or submount, the step of bonding the submount to the strip, and the step of cutting the structure thus obtained into individual flip chip type LED lighting devices.

Abstract: An LED substrate comprises holes having an elliptical shape through which fixing screws are inserted. The fixing screw has a head portion, an unthreaded neck portion whose diameter smaller than that of the head portion, and a threaded shaft portion whose diameter smaller than that of the neck portion. A major axis of the hole is larger than the diameter of the head portion, and a minor axis thereof is smaller than the diameter of the head portion and larger than the diameter of the neck portion. The LED substrate further comprises counterbored recesses to which anchoring claws provided in a cabinet are fitted. A width of the counterbored recess in a direction of the major axis of the hole is larger than that of the anchoring claw. The counterbored recesses are formed on both of two sides of the LED substrate facing each other in a first direction.

Abstract: A manufacturing method of a mounting part of a semiconductor light emitting element comprising: preparing a semiconductor light emitting element including an electrode which has a surface, and a board which has a surface; forming a plurality of bump material bodies on at least one of the surface of the electrode and the surface of the board by shaping bump material into islands, wherein the bump material is paste in which metal particles are dispersed, a top surface and a bottom surface of the bump material bodies have different areas, and the top surface is practically flat; solidifying the bump material bodies by thermally processing the bump material bodies; and fixing the semiconductor light emitting element and the board through the bumps.

Abstract: Provided are a light emitting device package and a lighting system comprising the same. The light emitting device package comprises a package body having an inclined side surface and a light emitting device on the inclined side surface of the package body.

Abstract: LED packages are provided that include a material that is both thermally conductive and has a coefficient of thermal expansion that is matched to that of an LED. The material can be a ceramic such as aluminum nitride. The package has a body that includes a bottom surface and a cavity disposed into the body. The cavity has a floor for bonding to the LED so that the LED sits within the cavity. The thermally conductive material is disposed between the floor of the cavity and the bottom surface of the package. The body can be fabricated from a number of layers where the thermally conductive material is in a layer disposed between the floor and the bottom surface. The other layers of the body can also be fabricated from the thermally conductive material. A light emitting device is made by attaching the LED to the LED package.

Abstract: There is provided a packaging apparatus of a terahertz device, the apparatus including: a terahertz device having an active region at which terahertz wave is radiated or detected; a device substrate mounting the terahertz device whose active region is positioned at an opening region formed at the center of the device substrate, and electrically connecting the terahertz device and an external terminal to each other; a ball lens block arranged and fixed to an upper part of the terahertz device; and upper and lower cases receiving the device substrate mounted with the terahertz device therein and opening region vertical upper and lower portions of the active region of the terahertz device.

Abstract: A surface mount LED apparatus is provided which can prevent separation of the surface of an LED chip from a sealing resin portion. Patterned circuits on a substrate are provided with a device mounting region and a wire bond region, and an increased-thickness portion having a thickness 1.6 times or more than the greater of the thickness of the device mounting region and the thickness of the wire bond region. When the apparatus is heated, this configuration allows for inducing interfacial separation between the increased-thickness portion and the sealing resin portion earlier than interfacial separation is induced between the LED chip and the sealing resin portion. This configuration can prevent interfacial separation between the LED chip and the sealing resin portion.

Abstract: A method of producing a lamp, including: mounting light emitting junctions in respective receptacles; mounting the receptacles on a curved support structure so as to form a three-dimensional array; and placing the light emitting junctions in electrical connection with the support structure.

Abstract: The invention consists of inserting electronic components into a glazing, in particular a laminated glazing, in order to create new features, in particular for automotive applications, windscreen, rear window or side windows. The inserted electronic components can be optoelectronic components such as light-emitting diodes (LEDs) providing a lighting function for the glazing, e.g. interior lighting of an automobile. The electrical connections are provided by means of a conductive layer so that they are virtually invisible.

Abstract: A solid-state light source includes a substrate, a solid-state light-emitting chip, a plurality of micro-members and a light-permeable encapsulation. The substrate has a substantially flat surface. The solid-state light-emitting chip is arranged on the substantially flat surface of the substrate and electrically connected to the substrate. The micro-members are arranged on the surface of the substrate and parallel with the solid-state light emitting chip. The light-permeable encapsulation is arranged on the surface of the substrate and covers the solid-state light-emitting chip and the micro-members.

Abstract: A thermally conductive structure of a light emitting diode (LED) includes a vapor chamber, an insulating layer, an electrically conductive layer and a plurality of LEDs. In the invention, the insulating layer is plated over a surface of the vapor chamber; the electrically conductive layer disposed on the insulating layer is electrically separated from the vapor chamber and has a first electrode and a second electrode; and the LEDs arranged on the insulating layer respectively have a first leg connected to the first electrode and a second leg connected to the second electrode; thereby, the invention has an excellent performance of thermal conduction and heat dissipation, which is capable of prolonging the lifespan of LED.

Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series.

Abstract: Provided is a light emitting diode (LED) manufactured by using a wafer bonding method and a method of manufacturing a LED by using a wafer bonding method. The wafer bonding method may include interposing a stress relaxation layer formed of a metal between a semiconductor layer and a bonding substrate. When the stress relaxation layer is used, stress between the bonding substrate and a growth substrate may be offset due to the flexibility of metal, and accordingly, bending or warpage of the bonding substrate may be reduced or prevented.

Abstract: Silicon substrates are applied to the package structure of solid-state lighting devices. Wet etching is performed to both top and bottom surfaces of the silicon substrate to form reflecting cavity and electrode access holes. Materials of the reflecting layer and electrode can be different from each other whose preferred materials can be chosen in accordance with a correspondent function. Formation of the electrode can be patterned by an etching method or a lift-off method.

Abstract: A light emitting device includes a plurality of chips efficiently disposed in a limited space of an opening that has an approximately elliptical or elongate-circular opening shape. The device includes a lead having a slit formed between a portion for bonding a wire to and a portion for mounting chips on, thereby to prevent extrusion of an adhesive and eliminate defective bonding.

Abstract: A solid-state element has: a semiconductor layer formed on a substrate, the semiconductor layer having a first layer that corresponds to an emission area of the solid-state element to and a second layer through which current is supplied to the first layer; a light discharge surface through which light emitted from the first layer is externally discharged, the light discharge surface being located on the side of the substrate; and an electrode having a plurality of regions that are of a conductive material and are in ohmic-contact with the second layer.

Abstract: A highly reliable, high voltage AC/DC LED device with integrated protection mechanism is disclosed. The protection element can be a current-limiting resistor, monolithically integrated on LED chip, or a discrete resistor assembled in the lamp package or submount. The protection elements may also include other parts integrated on a submount.

Abstract: An LED and a surface mounting LED substrate for use in production of multi-faced surface mounting LEDs can include a resist layer on a conductor pattern that runs from an LED chip-mounted upper surface along a side portion and to a lower surface of the LED substrate. The resist layer is formed at least at a portion that is folded and runs along the lower surface and across a cutting line for separating/dividing at least the multi-faced surface mounting LEDs into discrete surface mounting LEDs. The resist layer is configured to suppress a burr that sometimes develops at a section of the conductor pattern during cutting/dicing of the multi-faced surface mounting LED substrate.

Abstract: A polarless surface mounting light emitting diode comprises a substrate; an upper surface of the substrate being etched with four independent metal thin film blocks; a lower surface of the substrate being formed with two independent metal thin film blocks; two ends of the substrate being formed with electroplated through holes; a plurality of metal thin films adhered upon the upper and lower surfaces of the substrate; two light emitting assemblies, each light emitting assembly being formed by a chip resistor and a chip light emitting diode; and a package layer. The connection of the polarless surface mounting light emitting diode of the present invention is not limited by the polarity. Any end of the polarless surface mounting light emitting diode can be connected to positive electrode or negative electrode.

Abstract: Provided is a light emitting diode package in accordance with the present invention including a lead frame composed of at least a pair of lead terminals; a mold receiving a part of the lead frame therein and equipped with an irradiation window opened to radiate light, and further including one or more holes formed to expose a part of a bottom surface of the lead frame received in the inside of the mold; an LED chip mounted on the lead frame positioned in the mold; an electrode connection unit for electrically connecting the LED chip and the lead frame; and a molding agent composed of any one selected from transparent epoxy, silicon, and phosphor blends charged in the mold and protecting the LED chip.