Abstract: A LED (light emitting diode) packaging structure includes a base, a LED chip, a gel-blocking structure and a phosphor layer. The LED chip disposed on the base and electrically connected to the base. The LED chip having a substrate and a semiconductor layer formed on the substrate. The gel-blocking structure is disposed on the substrate of the LED chip and surrounding the semiconductor layer. The phosphor layer is filled within a space defined by the gel-blocking structure, the substrate and the semiconductor layer. The present invention also discloses a fabricating method of the LED packaging structure.

Abstract: The present invention is directed to LED packages and methods utilizing waterproof and UV resistant packages with improved structural integrity. In some embodiments, the improved structural integrity is provided by various features in the lead frame that the casing material encompasses to improve the adhesion between the lead frame and the casing for a stronger, waterproof package. Moreover, in some embodiments the improved structural integrity and waterproofing is further provided by improved adhesion between the encapsulant and the casing. Some embodiments also provide for improved wire bonds, with the length, thickness, and loop height of the wire bonds controlled and optimized for improved adhesion between the wire bonds and the encapsulant as well as improved reliability.

Abstract: An exemplary LED package includes first and second electrodes, an LED chip and two electrically conductive wires. The first electrode has a top surface and an opposite bottom surface. A recess is defined in the top surface of the first electrode. The second electrode has a top surface and an opposite bottom surface. A recess is defined in the top surface of the second electrode. The LED chip has a bottom surface attached to the top surface of the first electrode, and a top surface on which a first pad and a second pad are formed. One of the electrically conductive wires has an end connecting to the first pad and an opposite end joining with a bottom of the recess of the first electrode. The other has an end connecting to the second pad and an opposite end joining with a bottom of the recess of the second electrode.

Abstract: A light-emitting diode (LED) structure with an improved heat transfer path with a lower thermal resistance than conventional LED lamps is provided. For some embodiments, a surface-mountable light-emitting diode structure is provided having an active layer deposited on a substrate directly bonded to a metal plate that is substantially exposed for low thermal resistance by positioning the metal plate at the bottom of the light-emitting diode structure. This metal plate may then be soldered to a printed circuit board (PCB) that includes a heat sink. For some embodiments of the invention, the metal plate is thermally and electrically conductively coupled through several heat conduction layers to a large heat sink that may be included in the structure.

Abstract: An organic light emitting display device which prevents deterioration of an organic light emitting diode (OLED), the organic light emitting display device includes a first substrate including a display unit that includes at least one organic light emitting diode (OLED), a second substrate facing the first substrate and bonded to the first substrate, a sealant arranged surrounding the display unit and bonding the first substrate to the second substrate, a dam portion arranged between the display unit and the sealant and surrounding a periphery of the display unit and including a plurality of magnetic particles and a filling material arranged within an inner space of the dam portion and between the first and second substrates and including a plurality of magnetic particles.

Abstract: An improved LED device is disclosed and includes at least one active layer in communication with an energy source and configured to emit a first electromagnetic signal within a first wavelength range and at least a second electromagnetic signal within at least a second wavelength range, a substrate configured to support the active layer, at least one coating layer applied to a surface of the substrate, the coating layer, configured for 0-90 degree incidence, to reflect at least 95% of the first electromagnetic signal at the first wavelength range and transmit at least 95% of the second electromagnetic signal at the second wavelength range, at least one metal layer applied to the coating layer and configured to transmit the second electromagnetic signal at the second wavelength range therethrough, and an encapsulation device positioned to encapsulate the active layer.

Abstract: According to one embodiment, an LED package includes a first and a second lead frame separated from each other, an LED chip, a wire and a resin body. The LED chip is provided above the first and second lead frames, and has a pair of terminals provided on an upper surface of the LED chip. One of the terminals is connected to the first lead frame and one other terminal is connected to the second lead frame. The wire is drawn out from the one terminal horizontally to connect the one terminal to the first lead frame. The resin body covers the LED chip and the wire, an upper surface, a part of a lower surface and a part of an end surface of each of the first and second lead frames to expose a remaining part of the lower surface and a remaining part of the lower surface.

Abstract: Provided is a method of fabricating a light-emitting diode (LED) device. The method includes providing a wafer. The wafer has light-emitting diode (LED) devices formed thereon. The method includes immersing the wafer into a polymer solution that has a surface tension lower than that of acetic acid. The polymer solution contains a liquid polymer and phosphor particles. The method includes lifting the wafer out of the polymer solution at a substantially constant speed. The method includes drying the wafer. The above processes form a conformal coating layer at least partially around the LED devices. The coating layer includes the phosphor particles. The coating layer also has a substantially uniform thickness.

Abstract: A method for manufacturing a light emitting diode (LED) package is provided. The method includes preparing a package body including a first lead frame formed with a cavity and inserted on one side of a bottom surface of the cavity and a second lead frame inserted on the other side, mounting an LED chip on the bottom surface and electrically connecting the LED chip with the first lead frame and the second lead frame, forming a molding portion by a molding resin in the cavity, connecting, to the package body, a first mold corresponding to the molding portion and including a through hole having an inner surface linearly or non-linearly inclined, connecting a second mold to an upper surface of the first mold, forming a lens portion on the molding portion by a transparent resin, and separating the first mold and the second mold from the package body.

Abstract: System for flash-free overmolding of LED array substrates. In an aspect, a method is provided for molding encapsulations onto an LED array substrate. The method includes attaching a protective tape onto a substrate surface of the substrate so that openings in the protective tape align with LED devices of the substrate and applying molding material onto a molding surface of a molding tool and to portions of the substrate exposed through the openings in the protective tape. The method also includes pressing the molding surface and the substrate surface together at a selected pressure and a selected temperature so that encapsulations are formed on the portions of the substrate exposed through the openings in the protective tape, separating the molding surface from the substrate surface, and removing the protective tape so that molding material flash is removed from the substrate leaving a clean molded substrate.

Abstract: There is provided a resin dispensing apparatus for a light emitting device package and a method of manufacturing a light emitting device package using the same. The resin dispensing apparatus includes a resin dispensing part including a resin storage portion filled with a resin therein and a resin discharge portion combined with the resin storage portion and discharging the resin therefrom; a supporting part having a light emitting device package disposed on an upper surface thereof and electrically connected to the light emitting device package; a voltage applying part having both terminals respectively connected to the resin dispensing part and the supporting part to apply a voltage thereto; and a sensing part electrically connected to the resin dispensing part and the supporting part individually and sensing a contact between the resin dispensing part and the light emitting device package with an electrical signal.

Abstract: A light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.

Abstract: The present invention is a phosphor expressed by the general formula (A1?xRxM2X)m(M2X4)n (wherein the element A is one or more types of element selected from Li, Na, Be, Mg, Ca, Sr, Ba, Sc, Y, La, Gd, and Lu, the element R is one or more types of activating agent selected from Mn, Ce, Pr, Nd, Sm, Eu, Tb, Dy, Ho, Er, Tm, and Yb, the element M is one or more types of element selected from Si, Ge, Sn, Ti, Hf, Zr, Be, B, Al, Ga, In, Tl, and Zn, the element X is one or more types of element selected from oxygen and nitrogen, n and m are integers of 1 or more, and x is a real number defined by 0<x<1), as well as a manufacturing method for the same, and a light-emitting device that uses this phosphor.

Abstract: An organic light-emitting display device includes a plurality of first and second electrodes which are spaced apart from each other on a substrate, a plurality of light-emitting layers between the first and second electrodes, a flexible thin encapsulation film on the second electrodes, and a color filter on the flexible thin encapsulation film.

Abstract: An LED and manufacturing method therefor. The LED comprises a compound semiconductor structure having first and second compound layers and active layer, first and second electrode layers atop the second compound semiconductor layer and connected to the two compound. An insulating layer is coated in regions other than where the first and second electrode layers are located. A conducting adhesive layer is formed atop the non-conductive substrate, connecting the same to the first electrode layer and insulating layer. Formed on one side surface of the non-conductive substrate and adhesive layer is a first electrode connection layer connected to the conducting adhesive layer. A second electrode connection layer on the other side surface is connected to the second electrode layer.

Abstract: A method for manufacturing light emitting diodes includes steps of: providing a base have an upper conductive layer and a lower conductive layer on a top face and a bottom face thereof, respectively; forming a plurality of through holes in the base; defining a plurality of grooves to divide the upper and lower conductive layers into discrete strips; forming a connection layer on an inner circumferential face of each hole to connect the opposite strips of the upper and lower conductive layers; filling a supporting layer in an upper portion of each hole; forming a reinforcing layer on the supporting layer and the upper conductive layer; fixing chips on the reinforcing layer and electrically connecting the chips with the strips of the upper conductive layer; forming an encapsulant on the reinforcing layer; and cutting the base into individual LEDs along the holes.

Abstract: An LED package structure with a deposited-type phosphor layer includes a substrate unit, a light-emitting unit and a package unit. The substrate unit includes at least one circuit substrate. The light-emitting unit includes a plurality of LED chips disposed on and electrically connected to the at least one circuit substrate. The package unit includes at least one package resin body formed by a mold structure. The at least one package resin body is formed on the at least one circuit substrate to cover the LED chips, and the at least one package resin body includes a continuous phosphor layer formed therein and deposited on outer surfaces of the LED chips by centrifugal force. Hence, the instant disclosure provides the continuous phosphor layer with the deposited phosphor powders for covering the outer surfaces of the LED chips, thus the light-emitting efficiency of the LED package structure can be increased actually.

Abstract: The present invention provides an LED package structure which has a housing, a first electrode plate, a second electrode plate, a LED chip and a Zener diode. The LED chip is mounted in the recess, and a first electrode and a second electrode of the LED chip are electrically connected to the first electrode plate and the second electrode plate, respectively. The Zener diode is embedded in the housing, and a second electrode and a first electrode of the Zener diode is electrically connected to the first electrode plate and the second electrode plate, respectively. The Zener diode of the present invention is embedded in the housing, so that it can prevent from affecting the luminous flux of the LED chip.

Abstract: A lighting device (1;15) comprising at least one flexible printed circuit board (3) which is populated with at least one semiconductor light source, comprising a potting material overlaid on at least one populated side of the printed circuit board so as to leave at least one emission surface of the semiconductor light source (2) exposed; an adhesive element at least partially covering a top side of the semiconductor light source, wherein the adhesive element (7) protrudes partially from the potting compound (10), is enclosed around its sides by the potting compound (10) in an adhesive manner and has better adhesion to the potting compound (10) than does the semiconductor light source.

Abstract: A light emitting device package includes: first and second electrodes, at least a portion of a lower surface thereof being exposed; a light emitting device disposed on an upper surface of at least one of the first and second electrodes; a reflection wall disposed on the upper surface of the first and second electrodes and surrounding the light emitting device to form a mounting part therein; and a fluorescent film disposed on the reflection wall to cover an upper portion of the mounting part. The mounting part is filled with air.

Abstract: An LED package includes a substrate, an LED chip, a transparent thermal insulation layer and an encapsulation including phosphor. The LED chip is arranged on the substrate and electrically connected to the substrate. The transparent thermal insulation layer is located between the LED package and the package layer whereby the phosphor is not affected by a high temperature generated by the LED chip when the LED chip is activated to generate light.

Abstract: A method of manufacturing an LED package includes mounting a large panel frame/substrate (LPF/S) having a substantially square shape to a ring. The LPF/S includes a plurality of die pads and a corresponding plurality of leads arranged in a matrix pattern. Each of the die pads includes a planar chip attach surface. An LED chip is attached to the planar chip attach surface of each of the die pads. An encapsulant material is applied overlaying the LED chips and at least a part of the LPF/S. Each die pad and corresponding leads are separated from the LPF/S to form individual LED packages. The steps of attaching the LED chips and applying the encapsulant material are performed while the LPF/S is mounted to the ring.

Abstract: An optical device includes at least one optical die (4) that is embedded, at least peripherally, in a plate made of an encapsulation material so that the optical die may transmit light, from one side of the plate to the other. An electronic package is formed by a semiconductor device which includes at least one optical, integrated-circuit chip with the optical device placed so that the optical die lies above optical integrated circuits formed in or on the integrated circuit chip. The optical device is attached onto the semiconductor device.

Abstract: A light emitting apparatus comprises an electrically insulating base member; a pair of electrically conductive pattern portions formed on an upper surface of the base member; at least one light emitting device that is electrically connected to the pair of electrically conductive pattern portions; and a resin portion that surrounds at least a side surface of the at least one light emitting device and partially covers the pair of electrically conductive pattern portions. Each of the pair of electrically conductive pattern portions extends toward a periphery of the base member from resin-covered parts of the electrically conductive pattern portions. At least the resin-covered parts of each of the electrically conductive pattern portions has at least one elongated through hole extending in a direction in which the electrically conductive pattern portions extend from the resin-covered parts, wherein the resin portion contacts the base member via the through holes.

Abstract: An organic light emitting diode (OLED) display device and a method of manufacturing the same is disclosed. In one embodiment, the OLED device includes a substrate; a display unit formed on a display area of the substrate; and an encapsulating film covering i) the display unit and ii) a non-display area surrounding the display area, wherein the density and thickness of the encapsulating film increase in a direction from a center portion of the encapsulating film to an edge portion of the encapsulating film.

Abstract: A light emitting diode (LED) formed by depositing an LED chip and coupling a stability layer to the LED chip. Semiconductor nanocrystals are placed in a first matrix material to form a nanocrystal complex layer. The nanocrystal complex layer is deposited on top of the stability layer. A thickness of the stability layer is chosen to maximizes a power of a light output by the nanocrystal complex layer. The matrix material and the stability layer can be of the same type of material. Additional layers of matrix material can be deposited on top of the nanocrystal complex layer. These additional layers can comprise matrix material only or can comprise matrix material and semiconductor nanocrystals to form another nanocrystal complex layer.

Abstract: The invention relates to a sealed thin-film device (10, 12, 14), to a method of repairing a sealing layer (20) applied to a thin-film device (30) to produce the sealed thin-film device, to a system (200) for repairing the sealing layer applied to the thin-film device to generate the sealed thin-film device and to a computer program product. The sealed thin-film device comprises a thin-film device and a sealing layer applied on the thin-film device for protecting the thin-film device from environmental influence. The sealed thin-film device further comprises locally applied mending material (40; 42, 44) for sealing a local breach (50) in the sealing layer. An effect of this sealed thin-film device is that the operational life-time of the sealed thin-film device is improved. Furthermore, the production yield of the production of sealed thin-film devices is improved.

Abstract: A light emitting diode (LED) package includes a substrate, a light emitting diode (LED) die mounted to the substrate, a frame on the substrate, a wire bonded to the light emitting diode (LED) die and to the substrate, and a transparent dome configured as a lens encapsulating the light emitting diode (LED) die. A method for fabricating a light emitting diode (LED) package includes the steps of: providing a substrate; forming a frame on the substrate; attaching a light emitting diode (LED) die to the substrate; wire bonding a wire to the light emitting diode (LED) die and to the substrate; and dispensing a transparent encapsulation material on the frame configured to form a transparent dome and lens for encapsulating the light emitting diode (LED) die.

Abstract: A method of manufacturing a flexible display device is provided. The method includes: preparing a first flexible substrate on which a display unit is formed; forming an encapsulation unit including a base substrate, a second flexible substrate formed on the base substrate, and a barrier layer formed on the second flexible substrate; combining the encapsulation unit with the display unit; and separating the base substrate from the second flexible substrate by using a difference between a coefficient of thermal expansion of the base substrate and a coefficient of thermal expansion of the second flexible substrate, by applying a heated solution between the base substrate and the second flexible substrate. The flexible display device is easily manufactured since the base substrate and the second flexible substrate, which have different coefficients of thermal expansion and are coupled to each other, are separable from each other by applying the heated solution.

Abstract: An optoelectronic semiconductor component includes a carrier and at least one semiconductor layer sequence. The semiconductor layer sequence includes at least one active layer. The semiconductor layer sequence is furthermore mounted on the carrier. The semiconductor component furthermore includes a metal mirror located between the carrier and the semiconductor layer sequence. The carrier and the semiconductor layer sequence project laterally beyond the metal mirror. The metal mirror is laterally surrounded by a radiation-transmissive encapsulation layer.

Abstract: A semiconductor light emitting device may include a first lead; a second lead; a first semiconductor light emitting element mounted on the first lead, being configured to emit a light having an optical emission spectrum no more than 400 nm from a light extraction surface of the first semiconductor light emitting element; a second semiconductor light emitting element mounted on the second lead, being configured to emit a light having a peak wavelength in no less than 550 nm; an ultraviolet absorbing layer configured to cover the light extraction surface of the first semiconductor light emitting element; and a sealing resin configured to cover the ultraviolet absorbing layer, first semiconductor light emitting element and the second semiconductor light emitting element.

Abstract: A light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.

Abstract: A method for producing a semiconductor optical device includes the steps of forming a semiconductor region including a ridge structure on a substrate; forming an insulating film on the semiconductor region; forming a non-photosensitive resin region on the insulating film, forming a first mask that defines a scribe area; forming the scribe area by etching using the first mask; after removing the first mask, forming an insulating layer by etching the insulating film, forming an electrode on the ridge structure and the non-photosensitive resin region to produce a substrate product; forming a scribe line on a surface of the semiconductor region in the scribe area of the substrate product; and cutting the product along the scribe line to form a semiconductor laser bar.

Abstract: A semiconductor light emitting device package according to an embodiment comprising: a package body comprising a groove section; an electrode in the groove section; at least one semiconductor light emitting device electrically connected to the electrode in the groove section of the package body; an interconnection pattern on an outer peripheral surface of the package body and electrically connected to the electrode, wherein a part of the interconnection pattern is on a bottom surface of the package body; and a metal pattern is on the bottom surface of the package body corresponding to an area in which the semiconductor light emitting device is located.

Abstract: A high-power light-emitting diode (LED) lamp has a plurality of units. Each unit includes an LED die and a thermo-electric cooling device coupled to the LED die. A power source supplies a fixed current to the thermo-electric cooling device wherein the fixed current is based on heat generated by the LED die in normal operation. Accordingly, the unit operates without a controller.

Abstract: An optical element package includes: an optical element in a form of a chip, and a lens resin having a convex lens surface covering an optical functional surface of the optical element. The convex lens surface is formed as a rough surface having a plurality of minute convex curved surfaces having a vertex in a direction perpendicular to a plane in contact with each part of the convex lens surface.

Abstract: A solid element device includes a solid element, an electric power receiving and supplying part for receiving electric power from and supplying the electric power to the solid element, and an inorganic sealing material for sealing the solid element. The inorganic sealing material includes a low melting glass selected from SiO2—Nb2O5-based, B2O3—F-based, P2O5—F-based, P2O5—ZnO-based, SiO2—B2O3—La2O3-based, and SiO2—B2O3-based low melting glasses.

Abstract: Disclosed herein is a display panel including a mounting substrate in which one or more light-emitting devices each including one or more light-emitting elements are mounted on a circuit substrate; and a transparent substrate disposed to face the light-emitting device side of the mounting substrate, wherein the transparent substrate has a transparent base material and a resin layer formed on the mounting substrate side of the transparent base material, and the resin layer is in contact with the light-emitting device and has, formed on an upper surface or a side surface of the light-emitting device, an inclined part which spreads from the light-emitting device side toward the transparent base material side.

Abstract: A light emitting diode sealing member includes a light emitting diode sealing layer, and a lens mold layer laminated on the light emitting diode sealing layer.

Abstract: A light emitting diode package comprises a substrate, a light emitting diode chip, an encapsulating layer and a transparent surrounding layer. The surrounding layer is disposed on the substrate and encompasses the encapsulating layer, wherein the hardness of the surrounding layer is greater than the encapsulating layer. A method for manufacturing the light emitting diode package is also provided.

Abstract: A light emitting device containing a semiconductor light emitting component and a phosphor, the phosphor is capable of absorbing a part of light emitted by the light emitting component and emitting light of a wavelength different from that of the absorbed light, is provided. A straight line connecting a point of chromaticity corresponding to a spectrum generated by the light emitting component and a point of chromaticity corresponding to a spectrum generated by the phosphor is substantially along a black body radiation locus in a chromaticity diagram.

Abstract: A semiconductor light emitting device (A1) includes a case (1) and a plurality of semiconductor light emitting elements (3) arranged in the case. The case (1) is formed with a plurality of reflectors (11) each in the form of a truncated cone surrounding a respective one of the semiconductor light emitting elements (3). Current is applied to each of the semiconductor light emitting elements (3) via two wires (6). Each of the wires (6) includes a first end, and a second end opposite to the first end. The first end is connected to the semiconductor light emitting element (3), whereas the second end is located outside the space surrounded by the reflector (11).

Abstract: A light emitting device package includes a base, a light emitting element, a mask, metal wires, an encapsulating layer and a cover layer. The base has a first surface bearing electrical structure thereon and an opposite second surface. The mask is arranged on the first surface to define a space receiving the light emitting element. Two openings are defined in the mask. The light emitting element has two pads exposed to an outside through the two openings respectively. The metal wires electrically connect the pads and the electrical structures. The encapsulating layer is filled in the space and two through holes in the base and encapsulates the light emitting element. The encapsulating layer is separated from the metal wires. The cover layer covers and protects the mask and the metal wires. A method of manufacturing the package is also provided.

Abstract: An LED package structure includes a heat conductive plate defining a concave groove therein, an LED die received in the concave groove, an eutectic layer sandwiched between the heat conductive plate and the substrate, a transparent encapsulant encapsulating the LED die on the heat conductive plate. The heat conductive plate forms an electrode circuit layer on the heat conductive plate around the concave groove. The LED die forms electrodes electrically connected with the electrode circuit layer. An electrically insulating heat conduction grease filled around the substrate and the eutectic layer.

Abstract: A lead frame structure, a packaging structure and a lighting unit are disclosed. The lead frame structure includes at least two first lead frame units having a space therebetween, and the two first lead frame units are arranged in an opposite manner. Each the first lead frame unit has a first conducting portion, a second conducting portion, and a first connection portion between the first and the second conducting portions. Moreover, the first connection portion has at least two grooves on a surface thereof.

Abstract: An exemplary method of manufacturing an LED package includes providing a base, the base having a reflecting cup with a receiving recess defined therein; an LED chip is then mounted on the base and secured in a bottom of the receiving recess; thereafter, a dispensing nozzle is used to apply an encapsulating material into the receiving recess to encapsulate the LED chip; finally, the encapsulating material is baked to form an encapsulating layer. The dispensing nozzle moves relative to the receiving recess during the application of the encapsulating material. A depth of the receiving recess is varied. Parameters of the application of the encapsulating material into the receiving recess by the dispensing nozzle vary in response to a change of the depth of the receiving recess.

Abstract: A light emitting diode (LED) package module and the manufacturing method thereof are presented. A plurality of LEDs and a plurality of semiconductor elements are disposed on a silicon substrate, and then a plurality of lenses is formed above the positions of the plurality of the LEDs, and the plurality of the lenses is corresponding to the plurality of the LEDs. Then, a plurality of package units is defined on the silicon substrate, and each package unit has a semiconductor element and at least one LED. After that, the silicon substrate is cut to form a plurality of LED package modules, and each LED package module has at least one package unit.

Abstract: Disclosed herein is a method of making a light emitting device having an LED die and a molded encapsulant made by polymerizing at least two polymerizable compositions. The method includes: (a) providing an LED package having an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated; (b) providing a mold having a cavity filled with a second polymerizable composition; (c) contacting the first and second polymerizable compositions; (d) polymerizing the first and second polymerizable compositions to form first and second polymerized compositions, respectively, wherein the first and second polymerized compositions are bonded together; and (e) optionally separating the mold from the second polymerized composition. Light emitting devices prepared according to the method are also described.

Abstract: According to one embodiment, a light emitting device includes a light emitting element, a light reflector and a sealing resin layer. The light emitting element has a first major surface and a side surface and has an optical axis of emitted light perpendicular to the first major surface. The light reflector has a light reflecting surface capable of reflecting emission light from the side surface of the light emitting element. The sealing resin layer covers the light emitting element and the light reflecting surface, and includes a first curved surface having a vertex on the optical axis and being convex toward light emitting side and an envelope surface generated by moving a second curved surface. The second curved surface has a vertex on a line passing through the light reflecting surface and being parallel to the optical axis and is convex toward the light emitting side.

Abstract: A method for forming a transparent electrode on a visible light-emitting diode is described. A visible light-emitting diode element is provided, and the visible light-emitting diode element has a substrate, an epitaxial structure and a metal electrode. The metal electrode and the epitaxial structure are located on the same side of the substrate, or located respectively on the different sides of the substrate. An ohmic metal layer is formed on a surface of the epitaxial structure. The ohmic metal layer is annealed. The ohmic metal layer is removed to expose the surface of the epitaxial structure. A transparent electrode layer is formed on the exposed surface. A metal pad is formed on the transparent electrode layer.