Abstract: A light emitting device of the present invention has a package constituted by a molded article having a light emitting face, a bottom face that is contiguous with the light emitting face, and a rear face that is on the opposite side from the light emitting face, and a pair of leads that are partially embedded in the molded article, protrude from the bottom face, and have ends that bend toward either the light emitting face or the rear face, and a light emitting element that is disposed on one of the pair of leads, the molded article has a front protruding part that protrudes on the light emitting face side, and a rear protruding part that protrudes on the rear face side, between the leads on the bottom face.

Abstract: An organic optoelectronic device includes a substrate, an anode, a cathode, an active region comprising an organic material, an encapsulation that isolates the active region from an ambient environment, wherein the encapsulation comprises a housing, and a first hermetically sealed electrical path through the housing.

Abstract: Certain example embodiments relate to improved lighting systems and/or methods of making the same. In certain example embodiments, a lighting system includes a glass substrate with one or more apertures. An LED or other light source is disposed at one end of the aperture such that light from the LED directed through the aperture of the glass substrate exits the opposite end of the aperture. Inner surfaces of the aperture have a mirroring material such as silver to reflect the emitted light from the LED. In certain example embodiments, a remote phosphor article or layer is disposed opposite the LED at the other end of the aperture. In certain example embodiment, a lens is disposed in the aperture, between the remote phosphor article and the LED.

Abstract: Light emitting devices and components having excellent chemical resistance and related methods are disclosed. In one embodiment, a component of a light emitting device can include a silver (Ag) portion, which can be silver on a substrate, and a protective layer disposed over the Ag portion. The protective layer can at least partially include an inorganic material for increasing the chemical resistance of the Ag portion.

Abstract: An LED (light emitting diode) module includes a circuit board and a plurality of LEDs mounted on the circuit board. The circuit board includes a support layer, an insulative layer and a conductive layer sequentially stacked on each other. The circuit board is embossed to form a plurality of pleats on top and bottom surfaces thereof, to thereby increase heat dissipation area of the circuit board.

Abstract: A silicone resin composition includes (1) an organopolysiloxane having at least two alkenylsilyl groups in one molecule, (2) an organopolysiloxane having at least two hydrosilyl groups in one molecule, (3) a hydrosilylation catalyst, and (4) a curing retarder, wherein the curing retarder contains tetraalkylammonium hydroxide.

Abstract: A method for manufacturing LEDs (light emitting diodes) includes steps: providing a substrate; attaching an adhesive layer on the substrate; forming a blocking layer on the adhesive layer, the blocking layer having a plurality of first holes and second holes alternating with and spaced from the first holes; forming a conductive layer including first leads and second leads in the first holes and the second holes; removing the blocking layer; forming a housing layer on the adhesive layer, the housing layer having a plurality of cavities to expose the first leads and second leads; fixing chips on the first leads and electrically connecting the chips with the first and second leads; forming encapsulants in the cavities to seal the chips; and removing the substrate and adhesive layer from the housing layer and the conductive layer.

Abstract: A method of manufacturing a light-emitting device includes providing a plate-shaped substrate, forming a lattice frame on a light-emitting element mounting surface of the plate-shaped substrate, mounting a light-emitting device in an opening of the lattice frame on the light-emitting element mounting surface, sealing the light-emitting element by supplying a sealing material into the opening of the lattice frame, and cutting the lattice frame and the plate-shaped substrate so as to split the lattice flame to obtain a plurality of light-emitting devices with a sidewall.

Abstract: An LED includes a base, a pair of leads fixed on the base, a housing fixed on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity in a central area thereof and a chamber adjacent to a circumferential periphery thereof. Top faces of the leads are exposed in the chamber. A blocking wall is formed in the chamber to contact the exposed top faces of the leads. A bonding force between the blocking wall and the leads is larger than that between the leads and the housing. A method for manufacturing the LED is also disclosed.

Abstract: A method for making a light emitting module includes: a. providing a flexible substrate; b. forming a plurality of rigid portions in the flexible substrate; c. forming an electrically conductive layer on the rigid portions, the electrically conductive layer having several electrodes apart from each other; d. arranging a plurality of LED dies on the electrically conductive layer with each LED die striding over and electrically connected to two neighboring electrodes; e. forming an encapsulating layer to cover the LED dies; and f. cutting through the flexible substrate. At least one of above steps b, c, d, e is performed by a roll applying process.

Abstract: A vapor deposition apparatus, which is capable of performing a thin film deposition process and improving characteristics of a formed thin film, includes a chamber having an exhaust opening; a stage located in the chamber, and including a plurality of mounting surfaces on which the plurality of substrates may be mounted; and an injection unit having at least one injection opening for injecting a gas into the chamber in a direction parallel with surfaces of the plurality of substrates.

Abstract: The present invention relates to a light emitting diode (LED), which enables a filler material for filling up a hole or opening of a substrate to prevent a resin of an encapsulant formed on the substrate from leaking and to enhance cohesion between the substrate and a resin portion formed in the hole or opening, and a method for fabricating the LED package. According to an embodiment of the present invention, there is provided an LED package, which comprises an LED chip; a substrate having the LED chip mounted thereon, the substrate having a hole or opening formed therein; an encapsulant formed on the substrate to encapsulate the LED chip; a resin portion for filling in the hole or opening; and a filler material for filling up a gap between the resin portion and the substrate.

Abstract: A light-emitting device capable of producing white light includes at least two types of LED elements and at least one encapsulant material. Each of the LED elements has an epitaxial light-emitting layer grown on a substrate; and the epitaxial light-emitting layers for the LED elements are the same series of AlGaInN materials having emission wavelengths in a region from violet to green light and different from one another by at least 30 nm. The encapsulant material encapsulates the LED elements and contains an adequate amount of fluorescent powder, which can be excited to emit complementary color lights to mix with color lights from the LED elements to produce bluish, yellowish, greenish or reddish white light. At least two types of the white light-emitting devices can be differently arrayed in a module or a system to produce a white light with high color-rendering index and good light mixing effect.

Abstract: A compact and efficient LED array lighting component comprising a circuit board with an array of LED chips mounted on it and electrically interconnected. A plurality of primary lenses is included, each of which is formed directly over each LED chip and/or a sub-group of the LED chips. A heat sink is included with the circuit board mounted to the heat sink so that heat from the LED chips spreads into the heat sink. In some embodiments the circuit board can be thermally conductive and electrically insulating. Method of forming an LED component are also disclosed utilizing chip-on-board mounting techniques for mounting the LED chips on the circuit board, and molding of the primary lenses directly over the LED chips individually or in sub-groups of LED chips.

Abstract: A light emitting diode package includes an electrically insulated base, first and second electrodes, an LED chip, a voltage stabilizing module, and an encapsulative layer. The base has a first surface and an opposite second surface. The first and second electrodes are formed on the first surface of the base. The LED chip is electrically connected to the first and second electrodes. The voltage stabilizing module is formed on the first surface of the base, positioned between and electrically connected to the first and second electrodes. The voltage stabilizing module connects to the LED chip in reverse parallel and has a polarity arranged opposite to that of the LED chip. The voltage stabilizing module has an annular shape and encircles the first electrode. The encapsulative layer is formed on the base and covers the LED chip.

Abstract: An LED device with improved LED efficiency is presented. A top surface of a circuit board carrying the LED die is covered with a reflective layer. The reflective surface on top of the circuit board allows the light reflected off a surface of a waveguide to be recycled by being redirected back to the waveguide.

Abstract: A curable composition is provided. A cured product showing excellent light extraction efficiency, crack resistance, hardness, thermal shock resistance and adhesive strength after a curing, as well as showing excellent processability and workability is provided. Also, surface stickiness may be prevented in the cured product without causing turbidity etc.

Abstract: The present invention relates to a curable composition. A curable composition may be provided; which shows excellent processability and workability; which shows excellent light extraction efficiency, crack resistance, hardness, thermal shock resistance and adhesive strength after curing; and which has excellent reliability and long-term reliability under high-temperature and/or high-moisture conditions. Also, turbidity and surface stickiness may be prevented in the cured product.

Abstract: A highly reliable light-emitting module or light-emitting device is provided. A method for manufacturing a highly reliable light-emitting module is provided. The light-emitting module includes, between a first substrate and a second substrate, a first electrode provided over the first substrate, a second electrode provided over the first electrode with a layer containing a light-emitting organic compound interposed therebetween, and a sacrifice layer formed using a liquid material provided over the second electrode.

Abstract: An atomic layer deposition apparatus and a sealing method of an organic light emitting device using the same are disclosed. In one embodiment, the atomic layer deposition apparatus improves a structure of the purge gas injection nozzle so as to increase the exhaust efficiency of the purge gas in an atomic layer deposition process, which increases a speed of a purge process. As a result, it is possible to improve a deposition speed and a quality of a sealing film when a sealing process for sealing the organic light emitting device is implemented by using the atomic layer deposition.

Abstract: A light-emitting apparatus includes a substrate, at least one light emitting diode (LED) die, a sealant align layer, and a first sealant. The substrate has a die disposing area. The LED die is disposed on the die disposing area. The sealant align layer is disposed on the substrate. The first sealant at least partially covers the LED die and contacts with the sealant align layer. The light-emitting apparatus can avoid the light emitted from the LED die to be blocked and can have higher light efficiency.

Abstract: A light emitting diode package includes a substrate with a first metal layer, a second metal layer and an insulating layer between the first metal layer and the second metal layer. A cavity is defined in the insulating layer and the second metal layer. The second metal layer surrounding the cavity is divided into a first conductive portion and a second conductive portion. An LED chip is positioned inside the cavity and on an upper surface of the first metal layer. The LED chip has two electrodes electrically connected to the first conductive portion and the second conductive portion respectively. The cavity is filled with an encapsulation to cover the LED chip. A method for manufacturing the LED package is also disclosed.

Abstract: A method for making a flexible OLED lighting device includes forming a plurality of OLED elements on a flexible planar substrate, wherein at least one of the OLED elements includes a continuous respective anode layer formed over the substrate, one or more organic light emitting materials formed over the anode layer, a cathode layer formed over the light emitting materials, and an encapsulating protective cover formed over the cathode layer. At least one of the OLED elements defines a continuous light region on the substrate, wherein the substrate and combination of OLED elements define an active light area. The active light area is bendable from a flat planar configuration to a bend configuration having a design bending radius. The thickness of the cathode layer is formed between a minimum thickness value and a maximum thickness value as a function of the size of the active light area and the design bending radius. An OLED in accordance with these aspects is also provided.

Abstract: A light-emitting diode (LED) module and an LED packaging method. As the LED module is packaged under the consideration of candela distribution, each of the lead frames of the LED chips packaged in the LED module is bended for tilting the LED chips by different angles to exhibit various lighting effects. Meanwhile, in the LED packaging method, a plurality of LED chips can be loaded on board rapidly and aligned by one operation to result in less deviation in the candela distribution curve.

Abstract: A light-emitting diode includes: an epitaxial substrate; a light-emitting unit including a lower semiconductor layer, and at least two epitaxial units that are separately formed on the lower semiconductor layer, the epitaxial units cooperating with the lower semiconductor layer to define two light-emitting sources that are capable of emitting different colors of light; and an electrode unit including a first electrode which is formed on an exposed portion of the lower semiconductor layer exposed from the epitaxial units, and at least two second electrodes each of which is formed on a corresponding one of the epitaxial units. A method for forming a light-emitting diode is also disclosed.

Abstract: An LED package includes a substrate with two opposite lateral bulging portions, an LED die, an electrode structure, and a reflective layer. The substrate includes a first substrate and a second substrate stacked together; the first substrate and the second substrate are transparent; and the substrate includes an emitting surface for emitting light of the LED package. The electrode structure is sandwiched between the first substrate and the second substrate. The LED die is mounted in the substrate and electrically connected to the electrode structure. The reflective layer is formed on an outer surface of the substrate except the emitting surface and the bulging portions. The disclosure also provides a method for manufacturing such an LED package.

Abstract: An organic light emitting diode lighting apparatus is disclosed. In one embodiment, the apparatus includes: a substrate main body, an organic light emitting element formed on the substrate main body and a sealing cap bonded with the substrate main body and covering and sealing the organic light emitting element. The sealing cap may further include a surface facing the organic light emitting element and the surface is divided into a plurality of thickness parts having different thicknesses.

Abstract: An LED encapsulation resin body disclosed in the present application includes: a phosphor; a heat resistance material arranged on, or in the vicinity of, a surface of the phosphor; and a silicone resin in which the phosphor with the heat resistance material arranged thereon is dispersed.

Abstract: When metal junction between a first electrode and a second electrode is executed as ultrasonic bonding between metals including at least copper, the ultrasonic bonding is performed in a state that a contact interface between the first electrode and the second electrode is covered with a bonding auxiliary agent. As a result, formation of oxide at a bonding interface between the first electrode and the second electrode due to execution of the ultrasonic bonding can be suppressed. Therefore, while a desired bonding strength is ensured, ultrasonic bonding with copper used for the first electrode or the second electrode can be fulfilled and cost cuts in mounting of semiconductor devices can be achieved.

Abstract: An optoelectronic component includes at least one inorganic optoelectronically active semiconductor component having an active region that emits or receives light during operation, and a sealing material applied by atomic layer deposition on at least one surface region, the sealing material covering the surface region in a hermetically impermeable manner.

Abstract: An object is to provide a highly reliable light emitting device which is thin and is not damaged by external local pressure. Further, another object is to manufacture a light emitting device with a high yield by preventing defects of a shape and characteristics due to external stress in a manufacture process. A light emitting element is sealed between a first structure body in which a fibrous body is impregnated with an organic resin and a second structure body in which a fibrous body is impregnated with an organic resin, whereby a highly reliable light emitting device which is thin and has intensity can be provided. Further, a light emitting device can be manufactured with a high yield by preventing defects of a shape and characteristics in a manufacture process.

Abstract: Light emitting devices include a light emitting diode die on a mounting substrate and a conformal gel layer on the mounting substrate and/or on the light emitting diode die. The conformal gel layer may at least partially fill a gap between the light emitting diode die and the mounting substrate. A phosphor layer and/or a molded dome may be provided on the conformal gel layer. The conformal gel layer may be fabricated by spraying and/or dispensing the gel that is diluted in the solvent.

Abstract: In a method for producing a radiation-emitting optoelectronic component, a semiconductor chip is mounted by a first main area onto a carrier body and is electrically conductively connected at a first contact area to a first connection region, and a transparent electrically insulating encapsulation layer is applied to the chip and the carrier body. A first cutout in the encapsulation layer for at least partly uncovering a second contact area of the chip is produced, and a second cutout in the encapsulation layer for at least partly uncovering a second connection region of the carrier body is produced. Finally, an electrically conductive layer, which electrically conductively connects the second contact area of the semiconductor chip and the second connection region of the carrier body, is applied.

Abstract: A light emitting device is fabricated by providing a mounting substrate and an array of light emitting diode dies adjacent the mounting substrate to define gaps. A gel that is diluted in a solvent is applied on the substrate and on the array of light emitting dies. At least some of the solvent is evaporated so that the gel remains in the gaps, but does not completely cover the light emitting diode dies. For example, the gel substantially recedes from the substrate beyond the array of light emitting diode dies and also substantially recedes from an outer face of the light emitting diode dies. Related light emitting device structures are also described.

Abstract: To allow a direct connection of a light source to a 230V/50 Hz or 120V/60 Hz AC network and to ensure safe operation and easy adaptation to user requirements when mounting, the light source includes a series connection which is connected to a bridge rectifier (GL) and includes at least two LED arrays strands, which have several interconnected individual LEDs, and a pre-resistor, which are arranged on a plate-like, electrically contacting carrier that dissipates heat, has protection against contact and carries the at least two array-LED-strands. For direct operation in an AC voltage supply, the sum of the flow voltages of the LED arrays (U1 . . . Un) is dimensioned such that it is equivalent to at least 75%, preferably 80% and a maximum of 85% of the amplitude of the rectified AC voltage at the nominal voltage, and that the array-LED-strand will be conductive if crossing the sum of flow voltages.

Abstract: A silicone resin composition includes a cage octasilsesquioxane; a polysiloxane containing alkenyl groups at both ends containing an alkenyl group having the number of moles smaller than the number of moles of the hydrosilyl group of the cage octasilsesquioxane; a hydrosilylation catalyst; a hydroxyl group-containing polysiloxane, organohydrogenpolysiloxane, or a polysiloxane containing alkenyl groups at side chain.

Abstract: A method for packaging LEDs includes steps of: forming a substrate with a rectangular frame, a plurality of first and second electrode strips received within the frame and alternately arranged along a width direction of the frame; forming a carrier layer on each pair of the first and second electrode strips, the carrier layer defining a plurality of recesses; arranging an LED die in each recess and electrically connecting the LED die with first and second electrodes; forming an encapsulation in each recess to cover the LED die; and cutting the first and second electrode strips along the width direction of the frame to obtain a plurality of separated LED packages each including the first and second electrodes, the LED die, the encapsulation and a part of the carrier layer.

Abstract: Provided herein are electronic devices including arrays of printable light emitting diodes (LEDs) having device geometries and dimensions providing enhanced thermal management and control relative to conventional LED-based lighting systems. The systems and methods described provide large area, transparent, and/or flexible LED arrays useful for a range of applications in microelectronics, including display and lightning technology. Methods are also provided for assembling and using electronic devices including thermally managed arrays of printable light emitting diodes (LEDs).

Abstract: A semiconductor light emitting device (A) includes a lead frame (1) having a constant thickness, a semiconductor light emitting element (2) supported by the lead frame (1), a case (4) covering part of the lead frame (1) and a light transmitting member (5) covering the semiconductor light emitting element (2). The lead frame (1) includes a die bonding pad (11a) and an elevated portion (11b). The die bonding pad (11a) includes an obverse surface on which the semiconductor light emitting element (2) is mounted, and a reverse surface exposed from the case (4). The elevated portion (11b) is shifted in position from the die bonding pad (11a) in the direction normal to the obverse surface of the die bonding pad (11a).

Abstract: A method for manufacturing an LED package, comprising steps of: providing a substrate, the substrate forming a plurality of spaced rough areas on a surface thereof, each of the rough areas forming a rough structure thereon, a block layer being provided on a remaining part of the surface of the substrate relative to the rough areas; forming a metal layer on a top surface of each rough structure; forming a reflector on the substrate, the reflector defining a cavity and surrounding two adjacent metal layers; arranging an LED chip in the cavity, the LED chip electrically connecting to the two adjacent metal layers; forming an encapsulation layer in the cavity to seal the LED; and separating the substrate from the metal layers, the encapsulation layer and the reflector.

Abstract: An organic light emitting device and a method for manufacturing that same are discussed, which can reduce thickness and weight of the device as well as the manufacturing cost. The organic light emitting device includes according to an embodiment an organic light emitting diode (OLED) formed on a glass substrate; an adhesive layer formed to cover the OLED; and a metal foil formed on the adhesive layer to seal the OLED and bonded to the glass substrate, wherein the metal foil is formed of an alloy having the same or substantially the same thermal expansion coefficient as that of the glass substrate.

Abstract: The light emitting device has a light emitting element 101, and translucent material 102 that passes incident light from the light emitting element 101 and emits that light to the outside. The sides of the translucent material 102 perimeter are inclined surfaces 107 that become wider from the upper surface to the lower surface. The area of the lower surface of the translucent material 102 is formed larger than the area of the upper surface of the light emitting element 101. The lower surface of the translucent material 102 and the upper surface of the light emitting element 101 are joined together, and the part of the lower surface of the translucent material 102 that is not joined with the light emitting element 101 and the inclined surfaces 101 are covered by light reflecting resin 103.

Abstract: There is provided a vacuum tray including a pocket part; a seating part being stepped downwardly from a bottom surface of the pocket part and having a light emitting device seated therein; and a cavity part being stepped downwardly from edges of the seating part and having an electrode terminal of the light emitting device accommodated therein. The pocket part may include a plurality of pocket parts having a matrix structure, such that the plurality of pocket parts are arranged in columns and rows.

Abstract: The present invention provides an optical semiconductor sealing material comprising a radically polymerized polymer of a methacrylate ester having an alicyclic hydrocarbon group containing 7 or more carbon atoms, e.g. an adamantyl group, a norbornyl group, or a dicyclopentanyl group; and an optical semiconductor sealing material comprising a radically polymerized polymer of 50 to 97 mass % of the methacrylate ester and 3 to 50 mass % of acrylate ester having a hydroxyl group. The optical semiconductor sealing material of the present invention is highly transparent and stable to UV light and thus does not undergo yellowing. In addition, the material exhibits excellent compatibility between heat resistance and refractive index, does not undergo deformation or cracking during heating processes such as reflow soldering, and shows high processability.

Abstract: A light emitting device includes a body having a recess; a barrier section protruding upward over a bottom surface of the recess and dividing the bottom surface of the recess into a plurality of regions; a plurality of light emitting diodes including a first diode disposed in a first region of the bottom surface of the recess and a second diode disposed in a second region of the bottom surface of the recess; a plurality of lead electrodes spaced apart from each other in the recess and selectively connected to the light emitting diodes; wires connecting the lead electrodes to the light emitting diodes; a resin layer in the recess; and at least one concave part in the barrier section. The concave part has a height lower than a top surface of the barrier section and higher than the bottom surface of the recess and the wires are provided in the concave part to connect the lead electrodes to the light emitting diodes disposed in opposition to each other.

Abstract: A method for forming wavelength-conversion LED encapsulant structure includes forming an LED encapsulant structure body, forming a layer of a wavelength-conversion material on a first surface, disposing the first surface to cause the wavelength-conversion material to be in contact with a surface region of the LED encapsulant structure body, applying a pressure between the first surface and the surface region of the LED encapsulant structure body, and causing at least a portion of the wavelength-conversion material to be at least partially embedded in the surface region of the LED encapsulant structure body.

Abstract: The present invention provides a plasma display device that has light emission properties with short persistence where green light has a persistence time of 3.5 msec or less, that is excellent in luminance, luminance degradation resistance, and color tone, and that is suitable for, for example, a stereoscopic image display device.

Abstract: A light-emitting device has a light source disposed on a support. A matrix material including a dispersion of beads is disposed over the light source. The refractive index of the beads is different from the refractive index of the matrix material. The light source may include an LED. The matrix material may include a lens.

Abstract: A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.

Abstract: Disclosed are a light emitting device and a light emitting device package having the same. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer interposed between the first conductive semiconductor layer and the second conductive semiconductor layer, an electrode electrically connected to the first conductive semiconductor layer, a reflective layer under the second conductive semiconductor layer, a protective layer disposed around a lower surface of the second conductive semiconductor layer, and a buffer layer disposed on at least one of top and lower surfaces of the protective layer.