Abstract: An organic light emitting diode display includes a substrate, a white pixel and a color pixel, each including an emission area, a non-emission area, a thin film transistor on the substrate, and an organic light emitting element on the substrate and electrically connected to the thin film transistor and configured to emit light at the emission area, a color filter layer between the organic light emitting element of the color pixel and the substrate at the emission area of the color pixel, and an overcoat layer having an overcoat opening corresponding to the emission area of the white pixel, and covering the color filter layer between the organic light emitting element of the color pixel and the color filter layer.

Abstract: A light-emitting diode comprises a light-emitting diode chip having a first semiconductor layer, a first electrode, an active layer formed on the first semiconductor layer, a second semiconductor layer formed on the active layer and a second electrode formed on the second semiconductor layer. The first semiconductor layer, the active layer, the second semiconductor layer and the second electrode sequentially compose a stacked multilayer. A blind hole penetrates the second electrode, the second semiconductor layer, the active layer and inside the first semiconductor layer. The first electrode is disposed on the first semiconductor layer inside the blind hole. A first supporting layer and a second supporting layer are respectively disposed on the first electrode and the second electrode, wherein the first supporting layer and the second supporting layer are separated from each other. A method for manufacturing the light-emitting diode is also provided in the disclosure.

Abstract: A semiconductor light emitting device, including a reflective electrode layer; a second conductive semiconductor layer formed on a portion of a top surface of the reflective electrode layer; an active layer formed on the second conductive semiconductor layer; a first conductive semiconductor layer formed on the active layer; a first electrode formed under one portion of the first conductive semiconductor layer; and an insulating layer having a lower portion, a first upwardly directed side wall portion at a first side of the first electrode and a second upwardly directed side wall portion at a second side of the first electrode that is opposite to the first side. At least one portion of the lower portion is between the second conductive semiconductor layer and the reflective electrode layer.

Abstract: It is an object to provide a light-emitting device which has high power efficiency and high light-extraction efficiency and emits light uniformly in a plane. It is another object to provide a manufacturing method of the light-emitting device. It is another object to provide a lighting device including the light-emitting device. One embodiment of the present invention provides a light-emitting device which includes: a first electrode provided over a substrate; a layer containing a light-emitting organic compound provided over the first electrode; an island-shaped insulating layer provided over the layer containing the light-emitting organic compound; an island-shaped auxiliary electrode layer provided over the island-shaped insulating layer; and a second electrode having a property of transmitting visible light provided over the layer containing the light-emitting organic compound and the island-shaped auxiliary electrode layer.

Abstract: A light emitting device includes a light emitting layer made of semiconductor; an upper electrode including a bonding electrode capable of connecting a wire thereto and a thin-wire electrode surrounding the bonding electrode with a spacing and including a junction with the bonding electrode, and a current diffusion layer provided between the light emitting layer and the upper electrode and made of semiconductor, the current diffusion layer including a recess that is formed in a non-forming region of the upper electrode and capable of emitting light emitted from the light emitting layer.

Abstract: A panel is disclosed, in which, a patterned semiconductor layer is formed on an insulation layer. The patterned semiconductor layer includes a portion corresponding to an electrode and another portion corresponding to a wiring trace. The portion corresponding to the electrode may be formed as, for example, a channel, and the other portion corresponding to the wiring trace may protect the wiring trace during fabrication process or in the structure from scratching or corrosion.

Abstract: Provided is an oxide thin-film transistor (TFT) substrate that may enhance the display quality of a display device and a method of fabricating the same via a simple process. The oxide TFT substrate includes: a substrate, a gate line, a data line, an oxide TFT, and a pixel electrode. An oxide layer of the oxide TFT includes a first region that has semiconductor characteristics and a channel, and a second region that is conductive and surrounds the first region. A portion of the first region is electrically connected to the pixel electrode, and the second region is electrically connected to the data line.

Abstract: An organic light-emitting display apparatus includes a substrate, a first electrode on the substrate; an intermediate layer on the first electrode, the intermediate layer including an organic light-emitting layer; a second electrode on the intermediate layer, a first inorganic encapsulating layer on the second electrode, the first inorganic encapsulating layer defining a first groove formed therein; a first organic encapsulating layer that is in the first groove defined by the first inorganic encapsulating layer, the first organic encapsulating layer not extending beyond the first groove, and a second inorganic encapsulating layer on the first organic encapsulating layer.

Abstract: An LED includes a base, a first lead and a second lead mounted to the base, a light emitting chip electrically connected to the first lead and the second lead, and an encapsulant sealing the chip. The first lead and the second lead each include a first beam and a second beam connected to each other. Each of the first beam and the second beam has two opposite ends protruding beyond two opposite lateral faces of the base, respectively, for electrically connecting with a circuit board.

Abstract: A light emitting diode package includes a triangular supporting member, a first substrate and a second substrate adhered on first and second inclined sidewalls the supporting member, respectively, a first LED chip and a second LED chip secured on the first substrate and the second substrate, respectively, and a package layer covering the first LED chip and a second LED chip. The first inclined sidewall and a bottom surface of the supporting member cooperatively form a first angle therebetween, and the second inclined sidewall and the bottom surface cooperatively form a second angle therebetween. The first angle and the second angle each range between 0 degree and 90 degrees. A method for making the light emitting diode package is also provided.

Abstract: An LED with a current diffusion structure comprises an N-type semiconductor layer, a light emitting layer, a P-type semiconductor layer, an N-type electrode, a P-type electrode and a current blocking layer. The N-type semiconductor layer, light emitting layer and P-type semiconductor layer form a sandwich structure. The N-type and P-type electrodes are respectively arranged on the N-type and P-type semiconductor layers. The current blocking layer has the pattern of the N-type electrode and is embedded inside the N-type semiconductor layer. Thereby not only current generated by the N-type electrode detours the current blocking layer and uniformly passes through the light emitting layer, but also prevents interface effect to increase impedance. Thus is promoted lighting efficiency of LED. Further, as main light-emitting regions of the light emitting layer are far from the N-type electrode, light shielded by the N-type electrode is reduced and illumination of LED is thus enhanced.

Abstract: An organic light-emitting display apparatus including: a substrate; a plurality of pixels that are formed on the substrate and each have a light emission area from which visible rays are emitted and a transmission area through which external light is transmitted; a pixel circuit portion disposed in each light emission area of the plurality of pixels; a first electrode that is disposed in each light emission area and is electrically connected to the pixel circuit portion; an intermediate layer that is formed on the first electrode and includes an organic emissive layer; a second electrode formed on the intermediate layer; and a capping layer that is disposed on the second electrode and includes a first capping layer corresponding to the light emission area and a second capping layer corresponding to the transmission area. Accordingly, electrical characteristics and image quality of the organic light-emitting display apparatus may be improved.

Abstract: A Group III nitride semiconductor light-emitting device includes a support, a p-electrode provided on the support, a p-type layer including a Group III nitride semiconductor and provided on the p-electrode, an active layer including a Group III nitride semiconductor and provided on the p-type layer, an n-type layer including a Group III nitride semiconductor and provided on the active layer, an n-electrode which is connected to the n-type layer, a first trench having a depth extending from a back surface of the p-type layer on a side of the p-electrode to reach the n-type layer, an auxiliary electrode which is in contact with a back surface of the n-type layer at a bottom of the first trench, but is not in contact with side walls of the first trench, and an insulating film which exhibits light permeability.

Abstract: A manufacturing method of a light emitting device is provided. A first electrode is formed on a substrate. The first electrode includes a patterned conductive layer, and the patterned conductive layer includes an alloy containing a first metal and a second metal. An annealing process is performed on the first electrode, so as to form a passivation layer at least on a side surface of the first electrode. The passivation layer includes a compound of the second metal. A light emitting layer is formed on the first electrode. A second electrode is formed on the light emitting layer.

Abstract: A pixel structure and manufacturing method of the same are described. The pixel structure includes a substrate, a switch transistor, a dielectric layer, a conducting connection line, a driving transistor, a capacitor and a pixel electrode. The substrate defines a transistor region and the switch transistor is disposed on the transistor region. The dielectric layer is disposed on the substrate and covers the switch transistor. The conducting connection line disposed on the dielectric layer is located over the transistor region. The driving transistor disposed on the dielectric layer is vertically stacked over the switch transistor and transistor region. The conducting connection line electrically connects the switch transistor to the driving transistor. The pixel electrode is electrically connected to the driving transistor.

Abstract: An organic light-emitting display apparatus includes a buffer layer that is on a substrate and includes nanoparticles including nickel (Ni), a pixel electrode on the buffer layer, an organic emission layer on the pixel electrode, and an opposite electrode on the organic emission layer. A method of manufacturing the organic light-emitting display apparatus is provided.

Abstract: A display substrate includes a base substrate, a switching element, a protecting layer, an organic layer, a first pixel electrode and a second pixel electrode. The switching element is on the base substrate, and includes a gate electrode, a source electrode and a drain electrode. The protecting layer is on the switching element, and includes a first hole exposing the drain electrode. The organic layer is on the protecting layer, and includes a second hole which exposes a side surface of the protecting layer which defines the first hole and exposes a top surface of the protecting layer which is adjacent to the side surface of the protecting layer. The first pixel electrode is on the organic layer. The second pixel electrode overlaps the first pixel electrode, and is electrically connected to the drain electrode via the first and second holes.

Abstract: According to at least one embodiment of the semiconductor arrangement, the latter comprises a mounting side, at least one optoelectronic semiconductor chip with mutually opposing chip top and bottom, and at least one at least partially radiation-transmissive body with a body bottom, on which the semiconductor chip is mounted such that the chip top faces the body bottom. Moreover, the semiconductor arrangement comprises at least two electrical connection points for electrical contacting of the optoelectronic semiconductor chip, wherein the connection points do not project laterally beyond the body and with their side remote from the semiconductor chip delimit the semiconductor arrangement on the mounting side thereof.

Abstract: According to one embodiment, a semiconductor light emitting device includes a stacked structural body, a first electrode, and a second electrode. The stacked structural body includes a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and a light emitting portion. The stacked structural body has a first major surface on a side of the second semiconductor layer. The first electrode is provided on the first semiconductor. The second electrode is provided on the second semiconductor layer. The first electrode includes a first pad portion and a first extending portion that extends from the first pad portion along a first extending direction. The first extending portion includes a first width-increasing portion. A width of the first width-increasing portion along a direction orthogonal to the first extending direction is increased from the first pad portion toward an end of the first extending portion.

Abstract: A light emitting diode structure and methods of manufacturing the same are disclosed. In an example, a light emitting diode structure includes a crystalline substrate having a thickness that is greater than or equal to about 250 ?m, wherein the crystalline substrate has a first roughened surface and a second roughened surface, the second roughened surface being opposite the first roughened surface; a plurality of epitaxy layers disposed over the first roughened surface, the plurality of epitaxy layers being configured as a light emitting diode; and another substrate bonded to the crystalline substrate such that the plurality of epitaxy layers are disposed between the another substrate and the first roughened surface of the crystalline substrate.

Abstract: A light emitting diode including a substrate, a first semiconductor layer, an active layer, and a second semiconductor layer is provided. The first semiconductor layer includes a first surface and a second surface, and the first surface is connected to the substrate. The active layer and the second semiconductor layer are stacked on the second surface in that order, and a surface of the second semiconductor layer away from the active layer is configured as the light emitting surface. A first electrode electrically is connected with the first semiconductor layer. A second electrode is electrically connected with the second semiconductor layer. A number of three-dimensional nano-structures are located on the surface of the first surface of the first semiconductor layer and aligned side by side, and a cross section of each of the three-dimensional nano-structure is M-shaped.

Abstract: A display panel includes a substrate, a plurality of bottom electrodes, an isolation layer, a plurality of light emitting layers, a top electrode, and at least one first auxiliary electrode. The bottom electrodes and the isolation layer are disposed on the substrate. The isolation layer has a plurality of pixel region openings and at least one buffer region. Each of the pixel region openings respectively exposes the corresponding bottom electrode. The buffer region is disposed between two adjacent pixel region openings. The light emitting layers are respectively disposed on the corresponding bottom electrodes. The top electrode covers the light emitting layers, the isolation layer, and the buffer region. The first auxiliary electrode is disposed in the buffer region.

Abstract: A method of manufacturing an organic light-emitting display device is disclosed. The method includes: uniformly forming an active layer on an entire surface of a substrate on which an organic light-emitting diode, a thin film transistor (TFT), and a capacitor are to be formed; performing a first mask process on the active layer to form a pixel electrode of the organic light-emitting diode, a gate electrode of the TFT, and an upper electrode of the capacitor; performing a second mask process to form an insulating layer having openings that expose the pixel electrode, the upper electrode, and the active layer in a region of the TFT; performing a third mask process to form a source-drain electrode that contacts an exposed portion of the active layer; and performing a fourth mask process to form a pixel-defining layer (PDL) that exposes the pixel electrode and covers the TFT and the capacitor.

Abstract: One or more circuit elements such as silicon diodes, resistors, capacitors, and inductors are disposed between the semiconductor structure of a semiconductor light emitting device and the connection layers used to connect the device to an external structure. In some embodiments, the n-contacts to the semiconductor structure are distributed across multiple vias, which are isolated from the p-contacts by one or more dielectric layers. The circuit elements are formed in the contacts-dielectric layers-connection layers stack.

Abstract: A pixel, a display device using the pixel and a method of driving the display device are provided. The pixel may include an organic light emitting diode, a driving circuit for generating and transmitting driving current depending on data signals to the organic light emitting diode, and at least one switch connected between a power wire for applying a first voltage to the organic light emitting diode and a data line for transmitting the data signals. The at least one switch may include a compensating circuit for electronically connecting the power wire to the data line for a predetermined period to transmit the first voltage through the data line.

Abstract: A light emitting device is disclosed. The light emitting device includes a support member, a light emitting structure disposed over the support member and includes first and second light emitting structures, the first and second light emitting structures including a first semiconductor layer, a second semiconductor layer, and an active layer, a passivation layer disposed on one side surface of the first light emitting structure, a first electrode disposed between the support member and the first semiconductor layer in the first light emitting structure, a second electrode disposed on a side surface of the passivation layer and on the second semiconductor layer in the first light emitting structure, a third electrode disposed between the support member and the first semiconductor layer in the second light emitting structure, an insulation layer disposed with a through hole, and a fourth electrode disposed in the through hole.

Abstract: A pixel structure and its fabrication method are provided. The pixel structure includes a channel layer, a first patterned metal layer, a first insulation layer, a second patterned metal layer, a second insulation layer, and a pixel electrode. The first patterned metal layer includes a data line, a source, and a drain. The first insulation layer has a first opening exposing the drain. The second patterned metal layer includes a scan line and a capacitor electrode. The capacitor electrode has at least one first portion overlapping the data line. The second insulation layer has a second opening communicating with the first opening to expose the drain. The pixel electrode is connected to the drain through the first opening and the second opening and at least overlaps the first portion of the capacitor electrode.

Abstract: To achieve enlargement and high definition of a display portion, a single crystal semiconductor film is used as a transistor in a pixel, and the following steps are included: bonding a plurality of single crystal semiconductor substrates to a base substrate; separating part of the plurality of single crystal semiconductor substrates to form a plurality of regions each comprising a single crystal semiconductor film over the base substrate; forming a plurality of transistors each comprising the single crystal semiconductor film as a channel formation region; and forming a plurality of pixel electrodes over the region provided with the single crystal semiconductor film and a region not provided with the single crystal semiconductor film. Some of the transistors electrically connecting to the pixel electrodes formed over the region not provided with the single crystal semiconductor film are formed in the region provided with the single crystal semiconductor film.

Abstract: The application provides an optoelectronic device structure, comprising a semiconductor stack, comprising a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer; a first electrode electrically connecting with the first conductivity type semiconductor layer, and further comprising a first extension electrode; a second electrode electrically connecting with the second conductivity type semiconductor layer; and a plurality of electrical restraint contact areas between the semiconductor stack and the first extension electrode, wherein the plurality of electrical restraint contact areas is distributed in a variable interval.

Abstract: A package structure and a manufacturing method for the same are provided. The package structure includes a chip, a substrate and at least one adhesive layer. The chip has at least one electrode portion. The substrate has at least one circuit portion. The adhesive layer is disposed between the electrode portion and the circuit portion to form an electrical connection therebetween. The adhesive layer is a material, which comprises a metal compound, with a Negative Coefficient of Thermal Expansion (Negative CTE). Because of the material with a Negative CTE, the alignment shift can be avoided after the chip and the substrate are adhered together.

Abstract: A display substrate includes a base substrate, a switching element, a gate line, a data line and a pixel electrode. Each of the gate line and the data line includes a first metal layer, and a second metal layer directly on the first metal layer. The switching element is on the base substrate, and includes a control electrode and an input electrode or an output electrode. The control electrode includes the first metal layer and excludes the second metal layer, and extends from the gate line. The input electrode or the output electrode includes a second metal layer and excludes the first metal layer. The input electrode extends from the data line. The pixel electrode is electrically connected to the output electrode of the switching element through a first contact hole, and includes a transparent conductive layer.

Abstract: A light emitting device includes a semiconductor light emitting element, a first lead including an element mount portion on which the semiconductor light emitting element is mounted, and a second lead electrically connected to the semiconductor light emitting element. The light emitting device further includes a resin package covering the semiconductor light emitting element and part of each of the first and the second leads. The resin package includes a lens portion facing the semiconductor light emitting element. The first lead includes a pair of standing portions spaced from each other with the element mount portion intervening between them and a pair of terminal portions extending from the standing portions in mutually opposite directions. Each of the standing portions projects from the resin package in a direction away from the lens portion.

Abstract: The present invention relates to a high-voltage light-emitting device suitable for light-emitting diode chip array module. The device comprises a set of light emitting diode chips, about 18-25 chips, deposited on a substrate by using a non-matrix arrangement. Through the adjustments, the high-voltage light-emitting device of the present invention has optimized luminous efficiency.

Abstract: An organic electroluminescent light source including a first organic electroluminescent device and a second organic electroluminescent device is provided. The first organic electroluminescent device is coupled to a first bias voltage to emit a first color light having a color temperature ranging from 2800K to 3500K. The second organic electroluminescent device is coupled to a second bias voltage to emit a second color light. The first color light and the second color light mix to generate a third color light having a color temperature ranging from 3500K to 6500K.

Abstract: A thin film transistor substrate and a method for fabricating the same are discussed. According to an embodiment, the thin film transistor substrate includes a gate line arranged on a substrate in a first direction; a data line arranged in a second direction crossing the gate line to define adjacent first and second pixel regions, the data line being used in common by the first and second pixel regions; an entire common line arranged in the second direction substantially parallel with the data line; a thin film transistor including a gate electrode connected with the gate line, a source electrode connected with the data line, a drain electrode formed to face the source electrode, and an active layer formed to be overlapped with the gate electrode by interposing a gate insulating film between the active layer and the gate electrode; and a pixel electrode connected with the drain electrode.

Abstract: The present invention provides an array substrate, comprising: a base substrate; a pixel electrode pattern and a gate pattern formed on the base substrate, the gate pattern comprises a gate scanning line and a gate electrode of a transistor, both of the gate scanning line and the gate electrode comprise transparent conductive metal layer and the gate metal layer stacking on the substrate, each pixel electrode in the pixel electrode pattern comprises transparent conductive metal layer; a gate insulating layer on the pixel electrode pattern and the gate pattern, an active layer pattern on the gate insulating layer and corresponding to the gate electrode, a via hole in the gate insulating layer for exposing the pixel electrode; and a source/drain pattern on the gate insulating layer, the source/drain pattern comprises a data scanning line crossing with the gate scanning line, source and drain electrodes of the transistor, and the drain electrode is in contact with the pixel electrode through the via hole.

Abstract: A semiconductor light emitting device is provided. The semiconductor light emitting device comprises a plurality of compound semiconductor layers, an electrode layer, a conductive support member and a first buffer member. The compound semiconductor layers comprise a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer. The electrode layer is disposed under the plurality of compound semiconductor layers. The conductive support member is disposed under the electrode layer. The first buffer member is embedded to be spaced apart, in the conductive support member.

Abstract: A light emitting device is disclosed. The disclosed light emitting device includes a light emitting structure including a first-conductivity-type semiconductor layer, an active layer, and a second-conductivity-type semiconductor layer, a second electrode layer disposed beneath the light emitting structure and electrically connected to the second-conductivity-type semiconductor layer, a first electrode layer including a main electrode disposed beneath the second electrode layer, and at least one contact electrode branching from the main electrode and extending through the second electrode layer, the second-conductivity-type semiconductor layer and the active layer, to contact the first-conductivity-type semiconductor layer, and an insulating layer interposed between the first electrode layer and the second electrode layer and between the first electrode layer and the light emitting structure.

Abstract: A light emitting diode is provided. The light emitting diode includes a first semiconductor layer, an active layer and a second semiconductor layer. The active layer is sandwiched between the first semiconductor layer and the second semiconductor layer, and a surface of the second semiconductor layer which is away from the active layer is a light emitting surface. A first electrode is electrically connected with the first semiconductor layer. A second electrode is electrically connected with the second semiconductor layer. A number of three-dimensional nano-structures are formed on the light emitting surface. The number of the three-dimensional nano-structure are aligned side by side, and a cross-section of thee three-dimensional nano-structure is M-shaped.

Abstract: Disclosed is a semiconductor light emitting device. The semiconductor light emitting device includes a light emitting structure including a plurality of compound semiconductor layers including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer; an electrode layer on the plurality of compound semiconductor layers; and a channel layer including protrusion and formed along a peripheral portion of an upper surface of the plurality of compound semiconductor layers.

Abstract: A method for fabricating a photo spacer and an array substrate having the photo spacer are provided. At least one exposure process, a developing process, and a baking process are performed to a photo-sensitive material layer formed a substrate to fabricate a photo spacer, wherein the at least one exposure process includes a back side exposure process. The substrate has a light transmitting region and a light shielding region so that the photo-sensitive material layer is defined into a first block and a second block after the back side exposure process. The developing process is performed to at least remove the second block. A front side exposure process is performed to the first block. The baking process is performed to cure the first block of the photo-sensitive material layer to form a photo spacer.

Abstract: The present invention discloses a thin film transistor (TFT), a manufacturing method thereof, an array substrate, and a liquid crystal display (LCD) device. The TFT comprises a gate electrode and a source electrode. The gate electrode comprises a first metal layer block and a second metal layer block positioned on the first metal layer block. The thermal expansion coefficient of the second metal layer block is less than that of the first metal layer block. The top surface of the first metal layer block is in contact with the bottom surface of the second metal layer block, and the width of the top surface of the first metal layer block accords with that of the bottom surface of the second metal layer block. The present invention can prevent hillocks from being produced, and can effectively avoid the phenomenon of electricity leakage.

Abstract: A pixel structure of a display panel includes a substrate, a thin film transistor (TFT), a first transparent connecting pad, a passivation layer and a transparent pixel electrode. The TFT disposed on the substrate includes a gate electrode, a gate insulating layer, a semiconductor layer, a source electrode and a drain electrode. The gate insulating layer is disposed on the gate electrode, the semiconductor layer is disposed on the gate insulating layer, and the source electrode and the drain electrode are disposed on the semiconductor layer. The first transparent connecting pad disposed on the drain electrode partially overlaps and is electrically connected to the drain electrode. The passivation layer disposed on the first transparent connecting pad includes at least a contact hole. Furthermore, the transparent pixel electrode disposed on the passivation layer is electrically connected to the first transparent connecting pad through the contact hole of the passivation layer.

Abstract: Provided are a light emitting device. The light emitting device comprises a package body, an insulating layer on a surface of the package body, first and second electrode layers on the insulating layer, a light emitting diode disposed on the package body and electrically connected to the first and second electrode layers, a resistor layer connected to the first electrode layer, a first element part in a first doping region within the package body, a second element part in a second doping region within the package body, and a third electrode layer connected to the first element part and the second element part.

Abstract: Solid state lighting (“SSL”) devices with improved contacts and associated methods of manufacturing are disclosed herein. In one embodiment, an SSL device includes a first semiconductor material, a second semiconductor material spaced apart from the first semiconductor material, and an active region between the first and second semiconductor materials. The SSL device also includes an insulative material on the first semiconductor material, the insulative material including a plurality of openings having a size of about 1 nm to about 20 ?m, and a conductive material having discrete portions in the individual openings.

Abstract: Provided is a light emitting device capable of reducing light attenuation within the element and having high light extraction efficiency, and a method of manufacturing the light emitting device. The light emitting device has a light emitting element having a light transmissive member and semiconductor stacked layer portion, electrodes disposed on the semiconductor stacked layer portion in this order. The light emitting element has a first region and a second region from the light transmissive member side. The light transmissive member has a third region and a fourth region from the light emitting element side. The first region has an irregular atomic arrangement compared with the second region. The third region has an irregular atomic arrangement compared with the fourth region. The first region and the third region are directly bonded.

Abstract: A sub-mount having a photodiode region, includes a photodiode which has a first conductivity-type layer arranged in a surface portion of the sub-mount of the photodiode region to form a light-receiving surface and a second conductivity-type region arranged below the first conductivity-type layer and is configured to receive at the light-receiving surface a light emitted from a light-emitting element and convert the light into a photocurrent. A peak light-receiving wavelength at which the photocurrent of the photodiode becomes its maximum value is more than or equal to a minimum emission wavelength of the light-emitting element and less than or equal to a maximum emission wavelength of the light-emitting element.

Abstract: A semiconductor light-emitting device includes a laminated body that is configured to emit light from a main surface thereof, first and second electrodes, each disposed on a surface of the laminated body that is opposite the main surface, a first terminal that is electrically coupled to the first electrode, has a concave edge but not a convex edge, and has at most three exposed sides, and a second terminal that is electrically coupled to the second electrode, has a concave edge but not a convex edge, and has at most three exposed sides.

Abstract: The present invention improves the aperture ratio of a pixel of a reflection-type display device or a reflection type display device without increasing the number of masks and without using a blackmask. A pixel electrode (167) is arranged so as to partially overlap a source wiring (137) for shielding the gap between pixels from light, and a thin film transistor is arranged so as to partially overlap a gate wiring (166) for shielding a channel region of the thin film transistor from light, thereby realizing a high pixel aperture ratio.

Abstract: A high power LED lamp has a GaN chip placed over an AlGaInP chip. A reflector is placed between the two chips. Each of the chips has trenches diverting light for output. The chip pair can be arranged to produce white light having a spectral distribution in the red to blue region that is close to that of daylight. Also, the chip pair can be used to provide an RGB lamp or a red-amber-green traffic lamp. The active regions of both chips can be less than 50 microns away from a heat sink.