Electrical Contact Or Lead (e.g., Lead Frame) (epo) Patents (Class 257/E33.066)
  • Patent number: 9041040
    Abstract: A LED lamp is disclosed which has a plurality of light unit, each of the light unit has at least one flat metal lead for heat dissipation and the lower part of the metal lead is mounted on a heat sink for a further heat dissipation.
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: May 26, 2015
    Assignee: UNILED LIGHTING TAIWAN INC.
    Inventors: Ming-Te Lin, Ming-Yao Lin, Heng Qiu
  • Patent number: 9035439
    Abstract: The present embodiments provide surface mount devices and/or systems. In some embodiments, the surface mount devices comprise a casing having a recess formed extending at least partially into said casing; and first and second leads each of which is at least partially encased by said casing and each of which has a portion exposed through said recess, wherein at least one of said first and second leads has one or more size reduction features in its said exposed portion that reduces the surface area to provide an increased surface bonding area to said casing around said lead.
    Type: Grant
    Filed: January 28, 2010
    Date of Patent: May 19, 2015
    Assignee: Cree Huizhou Solid State Lighting Company Limited
    Inventors: Wong Xuan, Xie Jian Hui, Cheng Siu Cheong
  • Patent number: 9035329
    Abstract: The light-emitting device having an equivalent circuit, includes at least four terminals, numbered from first terminal to fourth terminal, for electrical power feeding; a first light-emitting diode, arranged between the first terminal and the second terminal, configured to not emit light when a voltage is applied between the second terminal and one of the third terminal and the fourth terminal, and configured to emit light when a. voltage is applied between the first terminal and one of the third terminal and the four the terminal; and a second light-emitting diode, arranged between the third terminal and the fourth terminal, and configured to not emit light when the voltage is applied between the third terminal and one of the first terminal and the second terminal and configured to emit light when a voltage is applied between the fourth terminal and one of the first terminal and the second terminal.
    Type: Grant
    Filed: March 15, 2011
    Date of Patent: May 19, 2015
    Assignee: Epistar Corporation
    Inventors: Chao-Hsing Chen, Chien-Kai Chung, Hui-chen Yeh, Yi-Wen Ku
  • Patent number: 9029859
    Abstract: An object is to provide a display device with a high aperture ratio or a semiconductor device in which the area of an element is large. A channel formation region of a TFT with a multi-gate structure is provided under a wiring that is provided between adjacent pixel electrodes (or electrodes of an element). In addition, a channel width direction of each of a plurality of channel formation regions is parallel to a longitudinal direction of the pixel electrode. In addition, when a channel width is longer than a channel length, the area of the channel formation region can be increased.
    Type: Grant
    Filed: May 13, 2014
    Date of Patent: May 12, 2015
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventor: Mizuki Sato
  • Patent number: 9024350
    Abstract: A light emitting module is disclosed. The light emitting module includes a lead frame body, lead frame, a heat spreader, an intermediate heat sink, and at least one light emitting element (LED). The lead frame body defines a cavity which accurately registers the heat spreader and includes optical or reflective walls surrounding the light emitting elements soldered on metallized traces of the heat spreader. The lead frame body encases and supports portions of the lead frame. The lead frame extends from outside the body into the cavity to accurately align with solder pads of the heat spreader. All the pre-aligned mechanical, thermal and electrical contacts are then soldered by solder reflow process under tight environmental control to prevent damage to the light emitting element. A robust, healthy 3-dimensional optical-electro-mechanical assembly having a very low thermal resistance in a thermal path from its light emitting element to its intermediate heatsink is created.
    Type: Grant
    Filed: February 2, 2011
    Date of Patent: May 5, 2015
    Inventor: Ban P Loh
  • Patent number: 9018644
    Abstract: Disclosed is a light emitting device package. The light emitting device package includes a package body having a first cavity and a second cavity; a plurality of reflective frames comprising a first reflective frame and a second reflective frame on the first cavity and the second cavity, respectively, and each of the first reflective frame and the second reflective frame comprises a bottom frame and at least two side wall frames extending from the bottom frame; and a light emitting device on the first reflective frame, wherein the first reflective frame and the second reflective frame are electrically separated from each other.
    Type: Grant
    Filed: October 6, 2014
    Date of Patent: April 28, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventors: Sung Min Kong, Choong Youl Kim, Hee Seok Choi
  • Patent number: 9013032
    Abstract: A plastic SON/QFN package for high power has a pair of oblong metal pins exposed from a surface of the plastic, the pins straddling a corner of the package; each pin has a long axis, the long axes of the pair forming a non-orthogonal angle.
    Type: Grant
    Filed: August 5, 2014
    Date of Patent: April 21, 2015
    Assignee: Texas Instruments Incorporated
    Inventor: Sreenivasan K. Koduri
  • Patent number: 9012948
    Abstract: A light-emitting element includes a supportive substrate; a reflective layer formed on the supportive substrate; a transparent layer formed on the reflective layer; a light-emitting stacked layer formed on the transparent layer; an etching-stop layer formed between the transparent layer and the reflective layer; and a plurality of contact parts formed between the light-emitting stacked layer and the transparent layer.
    Type: Grant
    Filed: July 1, 2011
    Date of Patent: April 21, 2015
    Assignee: Epistar Corporation
    Inventors: Shih-I Chen, Chia-Liang Hsu, Tzu-Chieh Hsu, Han-Min Wu, Ye-Ming Hsu, Chien-Fu Huang, Chao-Hsing Chen, Chiu-Lin Yao, Hsin-Mao Liu, Chien-Kai Chun
  • Patent number: 9006770
    Abstract: A light emitting diode (LED) carrier assembly includes an LED die mounted on a silicon submount, a middle layer that is thermally conductive and electrically isolating disposed below the silicon submount, and a printed circuit board (PCB) disposed below the middle layer. The middle layer is bonded with the silicon submount and the PCB.
    Type: Grant
    Filed: May 18, 2011
    Date of Patent: April 14, 2015
    Assignee: TSMC Solid State Lighting Ltd.
    Inventors: Wei-Yu Yeh, Pei-Wen Ko, Chih-Hsuan Sun, Hsueh-Hung Fu
  • Patent number: 9006869
    Abstract: A light emitting device package is provided comprising a light emitting device including at least one light emitting diode and a body including a first lead frame on which the light emitting device is mounted and a second lead frame spaced apart from the first lead frame, wherein at least one of the first and second lead frames is extending to a bending region in a first direction by a predetermined length on the basis of an outer surface of the body and is bent in a second direction intersecting the first direction.
    Type: Grant
    Filed: June 30, 2011
    Date of Patent: April 14, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventor: JaeJoon Yoon
  • Patent number: 9006773
    Abstract: A housing for an optoelectronic component including a main housing body formed by a first plastics material, and which has a recess, and a coating formed by a second plastics material, and which, at least in a region of the recess, connects at least in places to the main housing body and is in direct contact with the main housing body, wherein the first plastics material is different from the second plastics material, and the first plastics material and the second plastics material differ from one another with regard to at least one of the following material properties: temperature resistance with regard to discoloration, temperature resistance with regard to deformation, temperature resistance with regard to destruction, and resistance to electromagnetic radiation.
    Type: Grant
    Filed: November 2, 2010
    Date of Patent: April 14, 2015
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Gertrud Kräuter, Bernd Barchmann
  • Patent number: 9000465
    Abstract: A light emitting device, comprising: a package which is formed of a resin and has a recess which is provided with a bottom face and two pairs of opposite inner walls surrounding the bottom face, the package having two pairs of opposite side walls made of the inner walls and corresponding outer walls; a lead frame exposed at the bottom face; a light emitting element which is provided on the lead frame; and a sealing resin provided in the recess for sealing the light emitting element, wherein the lead frame has a bottom plate portion and a reflector portion exposed along one of the pair of opposite inner walls, and a first angle between the reflector portion and the bottom face is greater than a second angle between another one of the pair of opposite inner walls which is opposite to the reflector portion and the bottom face, is provided.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: April 7, 2015
    Assignee: Nichia Corporation
    Inventor: Hiroshi Kono
  • Patent number: 8994061
    Abstract: A light emitting diode package includes a first lead frame comprising a first hole cup, a second lead frame comprising a second hole cup and disposed to face the first lead frame with a gap disposed between the first lead frame and the second lead frame, a first light emitting diode chip disposed on the first hole cup, and a second light emitting diode chip disposed on the second hole cup, the first lead frame comprising a first enlarged region formed between the gap and the first hole cup, and the second lead frame comprising a second enlarged region formed between the gap and the second hole cup.
    Type: Grant
    Filed: March 2, 2012
    Date of Patent: March 31, 2015
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Do Hyoung Kang, Oh Sug Kim
  • Patent number: 8994038
    Abstract: Disclosed is a light emitting device package. The light emitting device package includes a package body having a first cavity and a second cavity; a plurality of reflective frames comprising a first reflective frame and a second reflective frame on the first cavity and the second cavity, respectively, and each of the first reflective frame and the second reflective frame comprises a bottom frame and at least two side wall frames extending from the bottom frame; and a light emitting device on the first reflective frame, wherein the first reflective frame and the second reflective frame are electrically separated from each other.
    Type: Grant
    Filed: October 8, 2014
    Date of Patent: March 31, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventors: Sung Min Kong, Choong Youl Kim, Hee Seok Choi
  • Patent number: 8987771
    Abstract: A semiconductor light emitting device is mounted on a support substrate. The support substrate is disposed in an opening in a carrier. In some embodiments, the support substrate is a ceramic tile and the carrier is a low cost material with a lateral extent large enough to support a lens molded over or attached to the carrier.
    Type: Grant
    Filed: November 6, 2012
    Date of Patent: March 24, 2015
    Assignees: Koninklijke Philips N.V., Philips Lumileds Lighting Company, LLC
    Inventors: Serge J. Bierhuizen, James G. Neff
  • Patent number: 8987775
    Abstract: Embodiments include a light emitting device package. The light emitting device package comprises a housing including a cavity; a light emitting device positioned in the cavity; a lead frame including a first section electrically connected to the light emitting device in the cavity, a second section, which penetrates the housing, extending from the first section and a third section, which is exposed to outside air, extending from the second section; and a metal layer positioned on an area defined by a distance which is distant from the housing in the second section of the lead frame.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: March 24, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventor: Ki Bum Kim
  • Patent number: 8987770
    Abstract: A structure of a light emitting diode is provided. In one aspect, a light emitting diode structure comprises a light emitting diode, a conductive frame, and a substrate. The conductive frame is electrically connected to the light emitting diode and has a fixing hole connecting a first side of the conductive frame and a second side of the conductive frame opposite the first side. The fixing hole has a ladder-shaped inner sidewall with a first radius of the inner sidewall adjacent the first side smaller than a second radius of the inner sidewall adjacent the second side. The substrate has a conductive pillar that is received in the fixing hole by entering the fixing hole from the first side of the conductive frame and deformed such that the conductive pillar adheres to the ladder-shaped inner sidewall of the fixing hole.
    Type: Grant
    Filed: April 27, 2011
    Date of Patent: March 24, 2015
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Sheng-Jia Sheu, Chien-Chang Pei
  • Patent number: 8987022
    Abstract: Light-emitting device packages which may be manufactured using post-molding and with improved heat emission performance and optical quality, and methods of manufacturing the light-emitting device packages. The light-emitting device package includes: a heat dissipation pad; a light-emitting device formed on the heat dissipation pad; a pair of lead frames disposed to be spaced apart from each other at both sides of the light-emitting device and the heat dissipation pad; a molding member surrounding the side of the light-emitting device except for an emission surface of the light-emitting device; and bonding wires for electrically connecting the lead frames to the light-emitting device.
    Type: Grant
    Filed: January 5, 2012
    Date of Patent: March 24, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Cheol-jun Yoo, Young-hee Song, Seong-deok Hwang, Sang-hyun Lee
  • Patent number: 8981401
    Abstract: The present invention is a package for optical semiconductor devices, and an optical semiconductor device using the package, which can prevent discoloration of a plating layer formed on a lead frame even when a silicone resin is used as a sealing resin for an optical semiconductor device, and which enables high luminous efficiency for a long time. Specifically, in the package for semiconductor devices, a plating laminate 15, wherein a pure Ag plating layer 4, a thin reflective plating layer 6 serving as the uppermost layer for improving the light reflection ratio, and a resistant plating layer 5 serving as an intermediate layer therebetween and having chemical resistance against at least either metal chlorides or metal sulfides are laminated, is formed on at least the surface of a lead electrode. The reflective plating layer 4 is composed of a pure Ag thin film, and the resistant plating layer 5 is composed of a complete solid solution Au—Ag alloy plating layer.
    Type: Grant
    Filed: September 30, 2009
    Date of Patent: March 17, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Tomoyuki Yamada, Tomohiro Futagami
  • LED
    Patent number: 8981419
    Abstract: An LED includes a base, a pair of leads fixed on the base, a housing fixed on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity in a central area thereof and a chamber adjacent to a circumferential periphery thereof. Top faces of the leads are exposed in the chamber. A blocking wall is formed in the chamber to contact the exposed top faces of the leads. A bonding force between the blocking wall and the leads is larger than that between the leads and the housing.
    Type: Grant
    Filed: June 17, 2013
    Date of Patent: March 17, 2015
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Hsin-Chiang Lin, Pin-Chuan Chen
  • Patent number: 8981418
    Abstract: An SMT LED device includes an LED and a circuit board supporting the LED. A pair of first solder pads are formed on the circuit board and spaced from each other. The LED includes two solder slugs extending downwardly from a bottom the LED. A positioning hole is formed at each first solder pad corresponding a position of a corresponding solder slug. A second solder pad is received in the positioning hole. Each solder slug is received in one corresponding positioning hole and electrically connected to corresponding first and second solder pads by a reflow soldering process. The present disclosure also provides a method for manufacturing the SMT LED device.
    Type: Grant
    Filed: August 12, 2012
    Date of Patent: March 17, 2015
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chih-Chen Lai
  • Patent number: 8969905
    Abstract: A semiconductor light-emitting device (1) of the present invention includes: a substrate (101); a laminated semiconductor layer (20) containing a light-emitting layer, which is formed on the substrate (101); a first electrode (111) formed on the upper surface (106c) of the laminated semiconductor layer (20); and a second electrode (108) formed on an exposed surface (104c) that is formed by partially cutting the laminated semiconductor layer (20), wherein the first electrode (111) includes a transparent electrode (109) containing a hole portion (109a) through which the upper surface (106c) of the laminated semiconductor layer (20) is exposed, a junction layer (110) formed on a bottom surface (109b) and an inner wall (109d) of the hole portion (109a), and a bonding pad electrode (120) formed to cover the junction layer (110).
    Type: Grant
    Filed: December 15, 2009
    Date of Patent: March 3, 2015
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Takehiko Okabe, Daisuke Hiraiwa, Remi Ohba
  • Patent number: 8969892
    Abstract: Disclosed is a light emitting structure comprising a first semiconductor layer, a second semiconductor layer, and an active layer disposed on between the first and second semiconductor layers, a first electrode electrically connected to the first semiconductor layer and a second electrode electrically connected to the second semiconductor layer. The first semiconductor layer is formed, at an edge portion thereof, with a hole, in which a portion of the first electrode is arranged.
    Type: Grant
    Filed: October 11, 2011
    Date of Patent: March 3, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventors: WooSik Lim, SungKyoon Kim, MinGyu Na, SungHo Choo, MyeongSoo Kim, HeeYoung Beom
  • Patent number: 8969859
    Abstract: An object is to provide a display device with a high aperture ratio or a semiconductor device in which the area of an element is large. A channel formation region of a TFT with a multi-gate structure is provided under a wiring that is provided between adjacent pixel electrodes (or electrodes of an element). In addition, a channel width direction of each of a plurality of channel formation regions is parallel to a longitudinal direction of the pixel electrode. In addition, when a channel width is longer than a channel length, the area of the channel formation region can be increased.
    Type: Grant
    Filed: March 22, 2013
    Date of Patent: March 3, 2015
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventor: Mizuki Sato
  • Patent number: 8963196
    Abstract: Disclosed herein is a slim LED package. The slim LED package includes first and second lead frames separated from each other, a chip mounting recess formed on one upper surface region of the first lead frame by reducing a thickness of the one upper surface region below other upper surface regions of the first lead frame, an LED chip mounted on a bottom surface of the chip mounting recess and connected with the second lead frame via a bonding wire, and a transparent encapsulation material protecting the LED chip while supporting the first and second lead frames.
    Type: Grant
    Filed: January 22, 2014
    Date of Patent: February 24, 2015
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventor: Eun Jung Seo
  • Patent number: 8963191
    Abstract: The light emitting device package includes a body provided with a cavity, a first lead frame mounted on the body, a second lead frame mounted on the body and separated from the first lead frame, and a light emitting device mounted in the cavity and disposed between the first lead frame and the second lead frame, the light emitting device is formed by sequentially stacking a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer, the sequentially stacking direction of the first conductivity-type semiconductor layer, the active layer and the second conductivity-type semiconductor layer is parallel with the bottom surface of the cavity, the first lead frame includes a first connection part electrically connected to the first conductivity-type semiconductor layer, and the second lead frame includes a second connection part electrically connected to the second conductivity-type semiconductor layer.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: February 24, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventors: Jiun Kong, Il Seo
  • Patent number: 8957449
    Abstract: A method of manufacturing a light emitting diode, includes a process of forming an n-type nitride semiconductor layer, a light emitting layer, and a p-type nitride semiconductor layer on a temporary substrate, a process of forming a p-type electrode on the p-type nitride semiconductor layer, a process of forming a conductive substrate on the p-type electrode, a process of removing the temporary substrate to expose the n-type nitride semiconductor layer, a process of forming a nanoimprint resist layer on the n-type nitride semiconductor layer, a process of pressing the nanoimprint mold on the nanoimprint resist layer to transfer the nano-pattern onto the nanoimprint resist layer, and a process of separating the nanoimprint mold from the nanoimprint resist layer having the nano-pattern and etching a portion of the nanoimprint resist layer having the nano-pattern to form an n-type electrode.
    Type: Grant
    Filed: October 28, 2011
    Date of Patent: February 17, 2015
    Assignee: Postech Academy-Industry Foundation
    Inventors: Jong Lam Lee, Jun Ho Son, Yang Hee Song
  • Patent number: 8957450
    Abstract: According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a first electrode, a second electrode, an insulating layer, a first interconnect layer, a second interconnect layer, a first metal pillar, a second metal pillar, a film covering a side face of the first metal pillar and a side face of the second metal pillar, and a resin layer. The semiconductor layer includes a light emitting layer, a first major surface, and a second major surface formed on a side opposite to the first major surface. The film has a solder wettability poorer than a solder wettability of the first metal pillar and a solder wettability of the second metal pillar. The resin layer covers at least part of the film.
    Type: Grant
    Filed: June 24, 2013
    Date of Patent: February 17, 2015
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Yoshiaki Sugizaki
  • Patent number: 8956892
    Abstract: Disclosed is a method of fabricating a light-emitting diode package, which comprises a light-emitting chip operative to emit light of a first wavelength range. The method comprises the steps of: dispensing a photoluminescent mixture on the light-emitting chip, the photoluminescent mixture being capable of absorbing a portion of light of the first wavelength range emitted from the light-emitting chip to re-emit light of a second wavelength range; partially curing the photoluminescent mixture by heating the photoluminescent mixture to a pre-curing temperature and then cooling the photoluminescent mixture to below the pre-curing temperature; and fully curing the photoluminescent mixture to harden the photoluminescent mixture. An apparatus for fabricating a light-emitting diode package is also disclosed.
    Type: Grant
    Filed: January 10, 2012
    Date of Patent: February 17, 2015
    Assignee: ASM Technology Singapore Pte. Ltd.
    Inventors: Kui Kam Lam, Ka Yee Mak, Yiu Yan Wong, Ming Li
  • Patent number: 8952407
    Abstract: A light emitting device package may be provided that includes: a package body which includes a first cavity and a second cavity which are formed to be depressed in at least a portion of the package body; a first light emitting device and a second light emitting device, each of which is disposed in the first cavity and the second cavity respectively; and a first fluorescent substance and a second fluorescent substance, each of which is filled in the first cavity and the second cavity respectively.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: February 10, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventor: Won Jin Son
  • Patent number: 8952416
    Abstract: A light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer. A first electrode is coupled to the first conductive semiconductor layer, and a second electrode is coupled to the second conductive semiconductor layer. A channel layer is provided around a lower portion of the light emitting structure. A first conductive support member is coupled to the second electrode and disposed adjacent to the second electrode. A second conductive support member is electrically insulated from the first conductive support member and disposed adjacent to the second electrode. A first connection part is coupled to the first electrode and the second conductive support member.
    Type: Grant
    Filed: August 20, 2013
    Date of Patent: February 10, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventor: Hwan Hee Jeong
  • Patent number: 8941134
    Abstract: A modular package for a light emitting device includes a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness. The leadframe further includes an electrical lead extending laterally away from the second region, and the package further includes a thermoset package body on the leadframe and surrounding the first region. The thermoset package body may be on both the top and bottom surfaces of the second region. A leak barrier may be on the leadframe, and the package body may be on the leak barrier. Methods of forming modular packages including thermoset package bodies on leadframes are also disclosed.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: January 27, 2015
    Assignee: Cree, Inc.
    Inventors: Ban P. Loh, Nicholas W. Medendorp, Jr., Eric Tarsa, Bernd Keller
  • Patent number: 8941143
    Abstract: An OLED lighting element comprises a substrate bearing an OLED structure extending laterally over said substrate and sandwiched between first and second electrode layers. The first electrode layer defines a plurality of electrically conductive tracks and said second electrode layer comprises a substantially continuous electrically conducting layer. The OLED lighting element has an electrical bus-bar connected to said electrically conductive tracks extending substantially completely along the or each lateral edge of said lighting element. The electrically conductive tracks run in a radial direction from a laterally central location within said lighting element towards said bus-bar along said lateral edges of said lighting element. A said track subdivides into a plurality of tracks with increasing distance from said central location. This arrangement makes more efficient use of the conductive tracks.
    Type: Grant
    Filed: July 4, 2011
    Date of Patent: January 27, 2015
    Assignee: Cambridge Display Technology Limited
    Inventor: Euan Smith
  • Patent number: 8935846
    Abstract: A method for contacting a lighting device is provided, wherein the lighting device has a circuit board which is covered at least partly by a sealing compound layer; wherein the lighting device can be separated at a separating point into two lighting device sections and each of the lighting device sections has at least one electrical contact. The method may include: removing at least the sealing compound layer on both sides of the separation point so that the contacts remain covered by a thinner, remaining sealing compound layer; separating the lighting device at the separation point; attaching a connection element at least to the remaining sealing compound layer of at least one of the lighting device sections, wherein the connection element has at least one contacting element, which contacts a respective contact covered by the remaining sealing compound layer after a separation or penetration of the remaining sealing compound layer.
    Type: Grant
    Filed: November 26, 2010
    Date of Patent: January 20, 2015
    Assignee: Osram AG
    Inventors: Andreas Kampfrath, Steffen Strauss
  • Patent number: 8927308
    Abstract: Systems, and methods for the design and fabrication of OLEDs, including large-area OLEDs with metal bus lines, are provided. For a given panel area dimension, target luminous emittance, OLED device structure and efficiency (as given by the JVL characteristics of an equivalent small area pixel), and electrical resistivity and thickness of the bus line material and electrode onto which the bus lines are disposed, a bus line pattern may be designed such that Fill Factor (FF), Luminance Uniformity (U) and Power Loss (PL) may be optimized. One general design objective may be to maximize FF, maximize U and minimize PL. Another approach may be, for example, to define minimum criteria for U and a maximum criteria for PL, and then to optimize the bus line layout to maximize FF. OLED panels including bus lines with different resistances (R1) along a length of the bus line are also described.
    Type: Grant
    Filed: May 12, 2011
    Date of Patent: January 6, 2015
    Assignee: Universal Display Corporation
    Inventors: Huiqing Pang, Peter Levermore, Emory Krall, Kamala Rajan, Ruiqing (Ray) Ma, Paul E. Burrows
  • Patent number: 8928015
    Abstract: A light emitting device including a first conductive type semiconductor layer, an active layer on the first conductive type semiconductor layer, a second conductive type semiconductor layer on the active layer, an electrode layer on the second conductive type semiconductor layer, a first electrode on the first conductive type semiconductor layer, and a second electrode on the second conductive type semiconductor layer and in an opening, the opening being in the electrode layer, wherein the second electrode has a first portion in the opening and a second portion extending from the first portion and overlapping at least a portion of the first electrode.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: January 6, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventors: Woo Sik Lim, Sung Ho Choo
  • Patent number: 8927996
    Abstract: An organic light emitting diode (OLED) display device, including a first substrate and a second substrate facing each other, a sealant arranged between the first and second substrates to adhere the first and second substrates together, a plurality of interconnections arranged on one of the first and second substrates and a plurality of cladding parts covering at least a portion of each of the plurality of interconnections at a location that corresponds to the sealant, each of the cladding parts including a material having a higher melting point than that of the interconnections. By including the cladding parts, a short circuit between the interconnections caused by heat applied to the sealant can be prevented, and safety and reliability of the OLED display device can be improved.
    Type: Grant
    Filed: November 26, 2010
    Date of Patent: January 6, 2015
    Assignee: Samsung Display Co., Ltd.
    Inventors: Seung-Yeon Cho, Zail Lhee, Tae-Wook Kang, Hun Kim, Mi-Sook Suh, Hyun-Chol Bang
  • Patent number: 8928008
    Abstract: A light emitting device package is provided. The light emitting device package comprises a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed within the second cavity; a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: January 6, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventors: Wan Ho Kim, Jun Seok Park
  • Patent number: 8921874
    Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Grant
    Filed: December 17, 2013
    Date of Patent: December 30, 2014
    Assignee: Rohm Co., Ltd.
    Inventors: Masahiko Kobayakawa, Kazuhiro Mireba, Shintaro Yasuda, Junichi Itai, Taisuke Okada
  • Patent number: 8916901
    Abstract: A semiconductor light emitting device includes a light emitting unit, a first and second conductive pillar, a sealing unit, and a first and second terminal. The light emitting unit includes a first and second semiconductor layer and a light emitting layer. The light emitting layer is provided on the first semiconductor layer. The second semiconductor layer is provided on the light emitting layer. The first conductive pillar is provided on the first semiconductor layer. The second conductive pillar is provided on the second semiconductor layer. The sealing unit covers side faces of each of the light emitting unit, the first conductive pillar, and the second conductive pillar. The first terminal is provided on the first conductive pillar and on the sealing unit. The second terminal is provided on the second conductive pillar and on the sealing unit.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: December 23, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Akiya Kimura, Kazuhito Higuchi, Kazuo Shimokawa, Susumu Obata, Toshiya Nakayama, Hisashi Ito
  • Patent number: 8916900
    Abstract: An optoelectronic module includes a radiation-emitting semiconductor component, an electrical component and a carrier substrate. The carrier substrate includes a top and a bottom, wherein first electrical connections are arranged on the bottom and second electrical connections are arranged on the top. The electrical component is arranged on the top of the carrier substrate and is electrically conductively connected with the first electrical connections. The radiation-emitting semiconductor component is arranged on the side of the electrical component remote from the carrier substrate. The radiation-emitting semiconductor component furthermore includes conductive structures electrically conductively connected with the second electrical connections.
    Type: Grant
    Filed: April 28, 2010
    Date of Patent: December 23, 2014
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Georg Bogner, Stefan Gruber
  • Patent number: 8906716
    Abstract: Provided is an optical semiconductor device includes: a light-emitting layer having a first main surface, a second main surface opposed to the first main surface, a first electrode and a second electrode which are formed on the second main surface; a fluorescent layer provided on the first main surface; a light-transmissive layer provided on the fluorescent layer and made of a light-transmissive inorganic material; a first metal post provided on the first electrode; a second metal post provided on the second electrode; a sealing layer provided on the second main surface so as to seal in the first and second metal posts with one ends of the respective first and second metal posts exposed; a first metal layer provided on the exposed end of the first metal post; and a second metal layer provided on the exposed end of the second metal post.
    Type: Grant
    Filed: September 11, 2013
    Date of Patent: December 9, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kazuo Shimokawa, Takashi Koyanagawa, Takeshi Miyagi, Akihiko Happoya, Kazuhito Higuchi, Tomoyuki Kitani
  • Patent number: 8901578
    Abstract: An LED (Light Emitting Diode) module includes an LED unit having one or more LED chips and a case. The case includes: a body including a base plate made of ceramic, the base plate having a main surface and a bottom surface opposite to the main surface; a through conductor penetrating through the base plate; and one or more pads formed on the main surface and making conductive connection with the through conductor, the pads mounting thereon the LED unit. The through conductor includes a main surface exposed portion exposed to the main surface and overlapping the LED unit when viewed from top, a bottom surface reaching portion connected to the main surface exposed portion and reaching the bottom surface. The pads cover at least a portion of the main surface exposed portion.
    Type: Grant
    Filed: May 10, 2012
    Date of Patent: December 2, 2014
    Assignee: Rohm Co., Ltd.
    Inventors: Masahiko Kobayakawa, Shinji Isokawa, Riki Shimabukuro
  • Patent number: 8901586
    Abstract: Disclosed are a light emitting device and a method of manufacturing the same. The light emitting device includes a substrate; a light emitting structure disposed on the substrate and having a stack structure in which a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer are stacked; a lens disposed on the light emitting structure; and a first terminal portion and a second terminal portion electrically connected to the first conductivity type semiconductor layer and the second conductivity type semiconductor layer, respectively. At least one of the first and second terminal portions extends from a top surface of the light emitting structure along respective side surfaces of the light emitting structure and the substrate.
    Type: Grant
    Filed: July 12, 2011
    Date of Patent: December 2, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hak Hwan Kim, Ho Sun Paek, Hyung Kun Kim, Sung Kyong Oh, Jong In Yang
  • Patent number: 8901583
    Abstract: The present invention is directed to LED packages and LED displays utilizing thin/low profile LED packages with improved structural integrity, emission characteristics, and customizable attributes. In some embodiments the improved structural integrity is provided by various features in the lead frame that cooperate with the casing for a stronger package. Moreover, in some embodiments the improved emission characteristics are provided by cavity features such as shape and depth, which provide for increased surface bonding area for multiple LED chips and increased viewing angle, respectively. Some embodiments also provide for gradated packages having customizable top portions for applications using smaller packages, with bottom portions comprising dimensions compatible with customary mechanical/electrical supports.
    Type: Grant
    Filed: April 12, 2010
    Date of Patent: December 2, 2014
    Assignee: Cree Huizhou Opto Limited
    Inventors: Alex Chi Keung Chan, Charles Chak Hau Pang, Ruan Fei Fei
  • Patent number: 8896106
    Abstract: In accordance with an embodiment of the present invention, a semiconductor package includes a first lead frame having a first die paddle, and a second lead frame, which has a second die paddle and a plurality of leads. The second die paddle is disposed over the first die paddle. A semiconductor chip is disposed over the second die paddle. The semiconductor chip has a plurality of contact regions on a first side facing the second lead frame. The plurality of contact regions is coupled to the plurality of leads.
    Type: Grant
    Filed: July 9, 2012
    Date of Patent: November 25, 2014
    Assignee: Infineon Technologies AG
    Inventors: Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Xaver Schloegel, Klaus Schiess
  • Patent number: 8888381
    Abstract: An optical module base is made up of a plurality of lead frames and a resin structure integrally molded with the lead frames and has an optical device mounting part and an optical waveguide mounting part which are formed in the resin structure. Each of the lead frames includes a connection part to which an optical device is to be mounted and electrically connected and a lead part which is continuous with the connection part. A portion of the thickness of the connection part is embedded in the resin structure and is positioned at the optical device mounting part. A sufficient strength of fixing a lead frame on a resin structure integrally molded with the lead frame can be ensured even if the sizes of the lead frames are miniaturized according to the sizes of electrodes of an optical device to be flip-chip bonded.
    Type: Grant
    Filed: April 6, 2013
    Date of Patent: November 18, 2014
    Assignee: Japan Aviation Electronics Industry, Limited
    Inventor: Osamu Hashiguchi
  • Patent number: 8890203
    Abstract: A lead 1 includes a die-bonding portion 11 with an opening 11a penetrating in a thickness direction. Another lead 2 is spaced from the lead 1. An LED unit 3 includes an LED chip 30 with a electrode terminal 31 connected to the lead 1 and another electrode terminal 32 connected to the lead 2. The LED unit 3, mounted on a surface of the die-bonding portion 11 on a first side in z direction, overlaps the opening 11a. A wire 52 connects the lead 2 and the electrode terminal 32. A support member 4 supporting the leads 1-2 is held in contact with another surface of the die-bonding portion 11 on a second side in z direction. These arrangements ensure efficient heat dissipation from the LED chip 30 and efficient use of light emitted from the LED chip 3.
    Type: Grant
    Filed: April 28, 2011
    Date of Patent: November 18, 2014
    Assignee: Rohm Co., Ltd.
    Inventor: Masahiko Kobayakawa
  • Patent number: 8890176
    Abstract: Disclosed is an LED package. The LED package includes a package body, a first frame and a second frame on the package body and a light emitting device chip on the first frame. The first frame is separated from the second frame, and the first frame includes a bottom frame on the package body and at least two sidewall frames extending from the bottom frame and inclined with respect to the bottom frame.
    Type: Grant
    Filed: January 31, 2014
    Date of Patent: November 18, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventors: Sung Min Kong, Choong Youl Kim, Hee Seok Choi
  • Patent number: 8883530
    Abstract: A device manufacturing method including substrate preparation, pixel electrode formation, photosensitive film formation, first part exposure, second part exposure, and development. In first part exposure, after execution of photosensitive film formation, first photomask is arranged to face substrate and exposure is performed to cause first part of photosensitive film to be exposed to light via first photomask. In second part exposure, after or together with execution of first part exposure, second photomask is arranged to face substrate and exposure is performed to cause second part of photosensitive film, which is different from first part at least partially, to be exposed to light via second photomask. In second part exposure, second photomask is arranged such that end thereof overlaps with end of first photomask, and overlap between first and second photomasks positionally corresponds to electrical wire.
    Type: Grant
    Filed: June 7, 2012
    Date of Patent: November 11, 2014
    Assignee: Panasonic Corporation
    Inventor: Seiji Nishiyama