Not Integrated With Device (epo) Patents (Class 257/E33.071)
  • Patent number: 10473292
    Abstract: A luminaire module delivers light with a beam angle of ?. The luminaire module includes a light emitting module and a reflector positioned symmetrically about an axis. Light produced by the light emitting module exits the light emitting module from one or more spatially-extended light emitting portions. The light emitting portion(s) is (are) fully contained within a spatially extended notional design envelope which is used to guide the design of reflector and its corresponding reflective surface, such that when any light exiting the light emitting portions through the design envelope strikes the reflective surface of the reflector, the light does not return to the source and escapes from the luminaire module within a beam angle ?, with no more than a single reflection from a reflector.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: November 12, 2019
    Assignee: Quarkstar LLC
    Inventors: George E. Smith, Robert C. Gardner, Roland H. Haitz, Louis Lerman
  • Patent number: 10133164
    Abstract: A projection display apparatus of the present disclosure includes a solid state light source that emits blue light in a first wavelength range; a wheel having a light-emitting body that emits emission light in a second wavelength range closer to the longer wavelengths than the first wavelength range is and adjacent to the first wavelength range, in response to irradiation with the blue light; a light uniformizing element that uniformizes the blue light and the emission light; a light modulation element that modulates light uniformized by the light uniformizing element; and a projection unit that projects the light modulated by the light modulation element. An end of the light-emitting body that the blue light enters has a dichroic coating that partly reflects the blue light and transmits emission light.
    Type: Grant
    Filed: May 9, 2017
    Date of Patent: November 20, 2018
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventor: Michihiro Okuda
  • Patent number: 9982862
    Abstract: Light guiding elements having a light guiding section extending between a light entrance surface for coupling in light and a light exit surface for coupling out light from the light guiding element through the light exit surface. The light exit surface extends along an exit surface longitudinal direction. The light guiding section has at least a first and a second lateral surface extending from the light entrance surface to the light exit surface such that light can be guided by total internal reflection from the light entrance surface to the light exit surface. The form of the light entrance surface differs from that of the light exit surface. The light guiding section has a roof section extending toward the light exit surface in which the first and the second lateral surfaces taper toward each other with respect to the exit surface longitudinal direction.
    Type: Grant
    Filed: July 24, 2013
    Date of Patent: May 29, 2018
    Assignee: Automotive Lighting Reutlingen GmbH
    Inventors: Emil P. Stefanov, Christian Buchberger
  • Patent number: 9862312
    Abstract: A motion sickness countermeasure system for a user within a vehicle having a light array system configured to output visual stimuli presented in a field of view of the user; and a controller outputting a control signal to the light array system to activate the light array system in such a way as to mimic the visual input one would receive if one were to look outside the vehicle.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: January 9, 2018
    Assignee: THE REGENTS OF THE UNIVERSITY OF MICHIGAN
    Inventors: Michael Sivak, Brandon Schoettle
  • Patent number: 9612511
    Abstract: A solid state light source device for generating a constant broad band light useful in multiple SLM projectors. The light source device includes a blue or UV/near UV excitation light and a moving plate carrying wavelength conversion materials to convert the excitation light into a broad band light. The wavelength conversion materials include red, green, yellow and/or blue phosphors, and may pass some of the blue excitation light. The broad band light outputted by the phosphor plate includes at least two primary color components and has a constant intensity and spectrum as a function of time. The solid state light source device further includes a second light source such as a blue light source, and a light combination device which combines the output light of the moving phosphor plate and the light from the second light source into one beam of constant, broad band light.
    Type: Grant
    Filed: August 24, 2012
    Date of Patent: April 4, 2017
    Assignee: APPOTRONICS CORPORATION LIMITED
    Inventors: Fei Hu, Yi Li, Yi Yang
  • Patent number: 9513539
    Abstract: To provide a projector which enables a stable projection for a long period of time, there is provided a projector comprising a light source unit, a display device, a projection-side optical system, a light guiding optical system and a projector control unit, wherein the light source unit comprises an excitation light source unit comprising an excitation light source and a microlens array and a rectangular green luminescent plate which receives light emitted from the excitation light source to emit light in a green wavelength band, and the microlens array is disposed between the excitation light source and the luminescent plate and has a plurality of micro convex lenses which each have a similar shape to the shape of the luminescent material layer are arranged into a matrix, so as to convert light from excitation light source into a plurality of pencils of light to shine them onto the luminescent plate.
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: December 6, 2016
    Assignee: CASIO COMPUTER CO., LTD.
    Inventor: Hideyuki Kurosaki
  • Patent number: 9509966
    Abstract: A projector in an illumination optical system includes a laser light source, a synchronization signal processor that converts synchronization signals that are synchronized with video signals input from outside the projector into video signals to be used inside the projector, an LD driver that controls a lighting state of the laser light source according to the synchronization signals output from the synchronization signal processor, an LED (Light Emitting Diode) light source, an LED driver that controls a lighting state of the LED light source according to the synchronization signals output from the synchronization signal processor, a rotational state detector that detects a rotational state of a phosphor wheel, and a phosphor wheel driver that, based on a detected result of the rotational state detector, controls the rotational state of the phosphor wheel.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: November 29, 2016
    Assignee: NEC DISPLAY SOLUTIONS, LTD.
    Inventors: Hiroyuki Saitou, Atsushi Katou, Motoyasu Utsunomiya, Akihiro Osaka, Masateru Matsubara
  • Patent number: 9454068
    Abstract: A projection-type image display apparatus includes a light source unit that emits light, an image generating unit that generates image light according to an input video signal, a light-guide optical system that guides the light from the light source unit to the image generating unit, and a projection optical system that projects the image light generated by the image generating unit. The light source unit includes a light source that produces light, phosphor that is excited by the light from the light source, and a dichroic mirror that directs the light from the light source to the phosphor. The dichroic mirror is arranged with an incident angle of the light from the light source being 50° or more and 60° or less.
    Type: Grant
    Filed: October 6, 2015
    Date of Patent: September 27, 2016
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventor: Takaaki Tanaka
  • Patent number: 8969901
    Abstract: A light emitting device includes a first semiconductor layer, an active layer, and a second semiconductor layer, and first and second electrodes electrically connected to the first and second semiconductor layers, respectively. The second electrode includes a reflective pad portion, a transparent electrode layer, a reflective finger portion and an electrode pad portion. The reflective pad portion is disposed in a region of an upper surface of the second semiconductor layer. The transparent electrode layer is disposed on the second semiconductor layer and has an opening encompassing the reflective pad portion such that the transparent electrode layer is not in contact with the reflective pad portion. The reflective finger portion extends from the reflective pad portion and has at least a portion thereof disposed on the transparent electrode layer. The electrode pad portion covers the reflective pad portion to be in contact with the transparent electrode layer.
    Type: Grant
    Filed: May 16, 2013
    Date of Patent: March 3, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jin Young Choi, Jae Ho Han, Ki Seok Kim, Wan Ho Lee, Myeong Ha Kim, Hae Soo Ha
  • Patent number: 8952406
    Abstract: Lighting devices including light-emitting diodes and associated devices, systems, and methods are disclosed herein. A lighting device configured in accordance with a particular embodiment includes a lighting-emitting diode and an optical component along a radiation path of the lighting-emitting diode. The optical component includes a color-converting material with walls defining a pattern, the walls extending generally entirely through a thickness of the color-converting material. A total surface area of the walls within a primary zone of the optical component is greater than a total surface area of color-converting features at a major side of the color-converting material. A method for making a lighting device in accordance with a particular embodiment includes combining an optical component and a light-emitting diode, and shaping a color-converting material of the optical component to have a thickness and a pattern of walls selected to control the color of light output from the lighting device.
    Type: Grant
    Filed: July 12, 2012
    Date of Patent: February 10, 2015
    Assignee: Micron Technology, Inc.
    Inventor: Martin F. Schubert
  • Patent number: 8802464
    Abstract: A method for fabricating a process substrate includes: providing a first substrate; providing a substrate and an auxiliary substrate; contacting the substrate and the auxiliary substrate with each other in a vacuum state, thereby forming micro spaces of a vacuum state between the substrate and the auxiliary substrate; and increasing a pressure at the outside of the contacted substrate and auxiliary substrate to attach the substrate and the auxiliary substrate to each other by a pressure difference between the micro spaces and the outside of the contacted substrate and auxiliary substrate.
    Type: Grant
    Filed: April 30, 2012
    Date of Patent: August 12, 2014
    Assignee: LG Display Co., Ltd.
    Inventors: Jae-Won Lee, Ki-Yong Kim, Jae Young Oh, Yong-Su An, Sung-Ki Kim, Gi-Sang Hong, Jin-Bok Lee, Sang-Hyuk Won, Dong-Kyu Lee
  • Patent number: 8797633
    Abstract: The present invention is directed to a display device assembly which comprises a display device and a luminance enhancement structure. The luminance enhancement structure is directly laminated onto an ITO layer with an adhesive. The assembly of the present invention provides improved performance of the luminance enhancement structure.
    Type: Grant
    Filed: July 15, 2010
    Date of Patent: August 5, 2014
    Assignee: SiPix Imaging, Inc.
    Inventors: Robert A. Sprague, Bryan Hans Chan, Craig Lin
  • Patent number: 8759124
    Abstract: A light emitting apparatus comprises an electrically insulating base member; a pair of electrically conductive pattern portions formed on an upper surface of the base member; at least one light emitting device that is electrically connected to the pair of electrically conductive pattern portions; and a resin portion that surrounds at least a side surface of the at least one light emitting device and partially covers the pair of electrically conductive pattern portions. Each of the pair of electrically conductive pattern portions extends toward a periphery of the base member from resin-covered parts of the electrically conductive pattern portions. At least the resin-covered parts of each of the electrically conductive pattern portions has at least one elongated through hole extending in a direction in which the electrically conductive pattern portions extend from the resin-covered parts, wherein the resin portion contacts the base member via the through holes.
    Type: Grant
    Filed: October 27, 2011
    Date of Patent: June 24, 2014
    Assignee: Nichia Corporation
    Inventors: Tomonori Miyoshi, Kenji Ozeki, Tomoaki Tsuruha
  • Patent number: 8754427
    Abstract: A lens arrangement for an LED display device includes a lens. The lens has a first lens surface and an optical axis. The optical axis penetrates the first lens surface of the lens. Furthermore, the lens arrangement includes a transparent transition body, which is firmly coupled with the lens on the first lens surface, which is more temperature-resistant than the lens and which has an optical axis that is parallel to the optical axis of the lens.
    Type: Grant
    Filed: December 21, 2007
    Date of Patent: June 17, 2014
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Stefan Groetsch, Moritz Engl, Steffen Koehler, Simon Bluemel, Michael Hiegler, Thomas Zeiler
  • Patent number: 8742437
    Abstract: A pixel structure including a substrate, a color filter layer, a conductive light-shielding layer, a buffer layer, a scan line, a data line, an active device, and a pixel electrode is provided. The substrate has a pixel region. The color filter layer is disposed corresponding to the pixel region. The conductive light-shielding layer is disposed corresponding to the periphery of the pixel region. The buffer layer covers the conductive light-shielding layer and color filter layer. The scan line and the data line are disposed on the buffer layer. The active device is disposed on the buffer layer and electrically connected to the scan line and data line. The pixel electrode is disposed on the buffer layer and electrically connected to the active device, wherein an overlapping area between the pixel electrode and the conductive light-shielding layer constitutes a storage capacitor. A method for manufacturing the pixel structure is also provided.
    Type: Grant
    Filed: July 31, 2013
    Date of Patent: June 3, 2014
    Assignee: Au Optronics Corporation
    Inventors: Tsung-Chin Cheng, Zeng-De Chen, Seok-Lyul Lee
  • Patent number: 8741673
    Abstract: The present invention relates to a polarized light emitting diode (LED) device and the method for manufacturing the same, in which the LED device comprises: a base, a light emitting diode (LED) chip, a polarizing waveguide and a packaging material. In an exemplary embodiment, the LED chip is disposed on the base and is configured with a first light-emitting surface for outputting light therefrom; and the waveguide, being comprised of a polarization layer, a reflection layer, a conversion layer and a light transmitting layer, is disposed at the optical path of the light emitted from the LED chip; and the packaging material is used for packaging the waveguide, the LED chip and the base into a package.
    Type: Grant
    Filed: January 9, 2012
    Date of Patent: June 3, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Cheng-Huan Chen, Han-Ping Yang, Hung-Yi Lin, Cheng-Hsuan Lin
  • Patent number: 8735916
    Abstract: A pixel structure including a substrate, a color filter layer, a conductive light-shielding layer, a buffer layer, a scan line, a data line, an active device, and a pixel electrode is provided. The substrate has a pixel region. The color filter layer is disposed corresponding to the pixel region. The conductive light-shielding layer is disposed corresponding to the periphery of the pixel region. The buffer layer covers the conductive light-shielding layer and color filter layer. The scan line and the data line are disposed on the buffer layer. The active device is disposed on the buffer layer and electrically connected to the scan line and data line. The pixel electrode is disposed on the buffer layer and electrically connected to the active device, wherein an overlapping area between the pixel electrode and the conductive light-shielding layer constitutes a storage capacitor. A method for manufacturing the pixel structure is also provided.
    Type: Grant
    Filed: July 31, 2013
    Date of Patent: May 27, 2014
    Assignee: Au Optronics Corporation
    Inventors: Tsung-Chin Cheng, Zeng-De Chen, Seok-Lyul Lee
  • Patent number: 8698174
    Abstract: This invention relates to a semiconductor light-emitting device including a semiconductor light-emitting chip and a transparent carrier. The semiconductor light-emitting chip includes an active layer and transparent substrate. The active layer emits light under a bias. At least a portion of the light emitted from the active layer enters into the transparent carrier through the transparent substrate. The semiconductor light-emitting chip is coupled to the transparent carrier through the transparent substrate. The area of the transparent carrier is larger than that of the active layer.
    Type: Grant
    Filed: April 13, 2007
    Date of Patent: April 15, 2014
    Assignee: Epistar Corporation
    Inventor: Min-Hsun Hsieh
  • Patent number: 8673662
    Abstract: A light-emitting diode (LED) cutting method includes the following steps: positioning and retaining an LED die or an LED epitaxial substrate on a die retainer; introducing a liquid medium for preventing reflection of sound wave between a cutting tool and the die; activating a power source to drive a magnetostrictive material or piezoelectric ceramic material mounted on a machine to serve as a kinetic source by inducing volume expansion/compression that generates an up-and-down piston-like movement; and operating the cutting tool having super hard micro-particles of diamond, CBN, or SiC electroformed on the cutting tool to perform breaking cutting on an LED workpiece.
    Type: Grant
    Filed: July 29, 2009
    Date of Patent: March 18, 2014
    Inventor: Tien-Tsai Lin
  • Patent number: 8648372
    Abstract: A light emitting device includes a plurality of LEDs that each emit light. A wavelength conversion member converts wavelengths of at least part of the light emitted from the LEDs to at least one other wavelength, and outputs light obtained by combining light having at least two wavelengths emitted from the wavelength conversion member. At least part of a light emitting surface of the wavelength conversion member has a surface state that differs from other parts of the light emitting surface.
    Type: Grant
    Filed: April 9, 2010
    Date of Patent: February 11, 2014
    Assignee: Panasonic Corporation
    Inventor: Atsuyoshi Ishimori
  • Patent number: 8643043
    Abstract: An LED lighting device A1 includes a plurality of LED chips 32, an LED unit 2 in which the LED chips 32 are mounted, and a mount 1 holding the LED unit 2. This arrangement allows the appearance or structure of the LED lighting device to be adapted for various applications. For instance, the LED lighting device may be mounted on an indoor ceiling to illuminate the floor surface or an upper part of a wall surface.
    Type: Grant
    Filed: February 19, 2010
    Date of Patent: February 4, 2014
    Assignee: Rohm Co., Ltd.
    Inventors: Hirotaka Shimizu, Mitsunori Nagashima
  • Patent number: 8643033
    Abstract: A light emitting device includes a substrate elongated in a lengthwise direction; a plurality of LED chips disposed on the substrate in an intermediate region in widthwise direction, and aligned along the lengthwise direction at a distance of 80 ?m or less; and interconnection wirings formed on regions outside the intermediate region in the widthwise direction; wherein each of the LED chips has a p-side electrode disposed on the substrate, a p-type semiconductor layer disposed on the p-side electrode, an active layer formed on the p-type semiconductor layer, and an n-type semiconductor layer formed on the active layer, and has a region in which the n-type semiconductor layer, the active layer, and the p-type semiconductor layer are patterned, and an n-side electrode formed selectively on a surface of the n-type semiconductor layer and connected to the p-side electrode of an adjacent LED chip through the interconnection wiring.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: February 4, 2014
    Assignee: Stanley Electric Co., Ltd.
    Inventors: Tatsuma Saito, Mamoru Miyachi
  • Publication number: 20140014988
    Abstract: Lighting devices including light-emitting diodes and associated devices, systems, and methods are disclosed herein. A lighting device configured in accordance with a particular embodiment includes a lighting-emitting diode and an optical component along a radiation path of the lighting-emitting diode. The optical component includes a color-converting material with walls defining a pattern, the walls extending generally entirely through a thickness of the color-converting material. A total surface area of the walls within a primary zone of the optical component is greater than a total surface area of color-converting features at a major side of the color-converting material. A method for making a lighting device in accordance with a particular embodiment includes combining an optical component and a light-emitting diode, and shaping a color-converting material of the optical component to have a thickness and a pattern of walls selected to control the color of light output from the lighting device.
    Type: Application
    Filed: July 12, 2012
    Publication date: January 16, 2014
    Applicant: Micron Technology, Inc.
    Inventor: Martin F. Schubert
  • Publication number: 20130335655
    Abstract: The present invention provides a substrate for array process of panel display device, which includes a cell switch set and a PVSA mode pad set. Cell switch set includes a plurality of switch elements. PSVA mode pad set includes a data scan pad and a common electrode pad. Data scan pad is connected through some switch elements of cell switch set to a plurality of scan lines and data lines. Common electrode pad is connected through switch element to common electrode line in the area. The present invention further provides a panel display device and manufacturing method of liquid crystal display panel. In this manner, the present invention reduces the number of pads in PSVA mode pad set to simplify peripheral routes.
    Type: Application
    Filed: June 26, 2012
    Publication date: December 19, 2013
    Applicant: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO. LTD.
    Inventor: Cheng-hung Chen
  • Publication number: 20130321731
    Abstract: The present invention provides a panel and panel manufacture method, including: completing thin film transistor array and common electrode on glass substrate, forming adjacent substrate pair, adjacent substrate pair including first substrate and second substrate connected by adjacent line, common electrodes on first substrate and second substrate symmetrically distributed with respect to adjacent line; coating a first seal on peripheral area of adjacent substrate pair, coating a second seal along adjacent sides of first substrate and second substrate, second seal and first seal being partially overlapping, at least one of first seal and second seal including conductive particles; boxing adjacent substrate pair and filter substrate pair so that conductive particles conducting common electrodes of adjacent substrate pair and filter substrate pair; cutting adjacent substrate pair and filter substrate pair along adjacent lines to form panel. The present invention also provides a liquid crystal display panel.
    Type: Application
    Filed: June 12, 2012
    Publication date: December 5, 2013
    Applicant: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO. LTD.
    Inventor: Shih-Hsun Lo
  • Patent number: 8597966
    Abstract: A method for producing a semiconductor optical device includes a first etching step of etching a stacked semiconductor layer with a first mask to form a stripe-shaped optical waveguide, the stripe-shaped optical waveguide including first and second stripe-shaped optical waveguides formed on first and second regions of a substrate, respectively; a step of forming a second mask on the stacked semiconductor layer with the first mask left; and a second etching step of etching the stacked semiconductor layer on the first region with the first and second masks. The second mask has a pattern for forming a mesa structure and includes an opening including first and second opening edges remote from side surfaces of the first stripe-shaped optical waveguide. The mesa structure is formed of the first stripe-shaped optical waveguide in the second etching step. The second stripe-shaped optical waveguide formed in the first etching step has a ridge structure.
    Type: Grant
    Filed: January 11, 2013
    Date of Patent: December 3, 2013
    Assignee: Sumitomo Electric Industries Ltd.
    Inventor: Kenji Hiratsuka
  • Patent number: 8530912
    Abstract: A pixel structure including a substrate, a color filter layer, a conductive light-shielding layer, a buffer layer, a scan line, a data line, an active device, and a pixel electrode is provided. The substrate has a pixel region. The color filter layer is disposed corresponding to the pixel region. The conductive light-shielding layer is disposed corresponding to the periphery of the pixel region. The buffer layer covers the conductive light-shielding layer and color filter layer. The scan line and the data line are disposed on the buffer layer. The active device is disposed on the buffer layer and electrically connected to the scan line and data line. The pixel electrode is disposed on the buffer layer and electrically connected to the active device, wherein an overlapping area between the pixel electrode and the conductive light-shielding layer constitutes a storage capacitor. A method for manufacturing the pixel structure is also provided.
    Type: Grant
    Filed: April 27, 2011
    Date of Patent: September 10, 2013
    Assignee: Au Optronics Corporation
    Inventors: Tsung-Chin Cheng, Zeng-De Chen, Seok-Lyul Lee
  • Patent number: 8487333
    Abstract: An LED package includes a substrate, an LED chip, and an encapsulation. The substrate includes a first surface. The LED chip is mounted on the first surface of the substrate. The encapsulation covers the LED chip. The encapsulation includes a transparent main body and a number of carbon nanotubes distributed in the transparent main body; the carbon nanotubes are arranged substantially extending along a same direction whereby light generated by the LED chip is polarized prior to radiation out of the encapsulation.
    Type: Grant
    Filed: June 30, 2011
    Date of Patent: July 16, 2013
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Meng-Hsien Hong, Ko-Wei Chien
  • Publication number: 20130161624
    Abstract: The present invention relates to a display device, which includes a substrate; a first conductive layer disposed on the substrate and including a first terminal; a first insulating layer disposed on the first conductive layer; a second conductive layer disposed on the first insulating layer and including a second terminal; a second insulating layer disposed on the second conductive layer; a profile relieving member disposed on the second insulating layer; and a contact assistant disposed on the profile relieving member, in which the profile relieving member covers a portion of an edge of at least one of the first terminal and the second terminal.
    Type: Application
    Filed: May 17, 2012
    Publication date: June 27, 2013
    Applicant: SAMSUNG DISPLAY CO., LTD.
    Inventors: Seong Young LEE, Kyoung Tai HAN, Kyung-Suk JUNG
  • Patent number: 8455902
    Abstract: An optical device is equipped with a light receiving region 16a and a peripheral circuit region 22 located around the light receiving region 16a on a major surface of an light receiving element 11a; electrodes for external connection 15 electrically connected to the peripheral circuit region 22 formed on a back surface opposite to the major surface of the light receiving element 11a; a transparent member 12 covering the light receiving region 16a adhered on the major surface of the light receiving element 11a with a light-transmitting adhesive 13; and a molding resin 14 for coating side surfaces of the transparent member 12 and the major surface of the light receiving element 11a excluding the region covered with the transparent member 12.
    Type: Grant
    Filed: July 28, 2011
    Date of Patent: June 4, 2013
    Assignee: Panasonic Corporation
    Inventors: Kiyokazu Itoi, Toshiyuki Fukuda, Yoshiki Takayama, Tetsushi Nishio, Tetsumasa Maruo
  • Publication number: 20130126890
    Abstract: A method of forming an active matrix, light emitting diode (LED) array includes removing, from a base substrate, a layer of inorganic LED material originally grown thereupon; and bonding the removed layer of inorganic LED material to an active matrix, thin film transistor (TFT) backplane array.
    Type: Application
    Filed: November 23, 2011
    Publication date: May 23, 2013
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Stephen W. Bedell, Bahman Hekmatshoartabari, Devendra K. Sadana, Ghavam G. Shahidi, Davood Shahrjerdi
  • Patent number: 8444882
    Abstract: An anisotropic conductive film is provided that does not have a light-reflecting layer on a light emitting diode element which causes costs to increase when a light emitting device that uses an LED element is flip-chip mounted, and that does not cause emission efficiency to deteriorate. Further, a light emitting device that uses such an anisotropic conductive film is provided. This anisotropic conductive film has a structure in which a light-reflecting insulating adhesive layer and an anisotropic conductive adhesive layer are laminated, wherein the light-reflecting insulating adhesive layer has a structure in which light-reflecting particles are dispersed in an insulating adhesive. The light emitting device has a structure in which a light emitting diode element is flip-chip-mounted on a substrate, with this anisotropic conductive film provided between a connection terminal on the substrate and a bump for connection of the light emitting diode element.
    Type: Grant
    Filed: February 22, 2010
    Date of Patent: May 21, 2013
    Assignee: Sony Chemical & Information Device Corporation
    Inventors: Shiyuki Kanisawa, Hiroyuki Kumakura, Hidetsugu Namiki
  • Patent number: 8426877
    Abstract: A backlight module comprises a back plate, a first light source module, and an optical component. The optical component includes a side surface and a bottom surface perpendicularly connected to the side surface. The first light source module comprises a plurality of first LEDs disposed on the back plate and at the side surface of the optical component for emitting light at a first wavelength toward the side surface of the optical component. The light is directed in a specific direction by the optical component and then sent out from an emitting surface. The backlight module further comprises a second light source module. The second light source module comprises a plurality of second LEDs disposed near the bottom surface of the optical component for emitting light at a second wavelength toward the bottom surface of the optical component. Light produced after the light at the first wavelength mixes with the light at the second wavelength becomes white light after passing through the optical component.
    Type: Grant
    Filed: April 26, 2011
    Date of Patent: April 23, 2013
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd.
    Inventors: Yanxue Zhang, Yicheng Kuo
  • Publication number: 20130087793
    Abstract: An array substrate includes a base substrate and a contact part. The contact part is disposed on the base substrate. The contact part includes a first metal pattern, a disconnection control pattern and a connecting pattern. The second metal pattern is disposed on a layer different from the first metal pattern, the disconnection control pattern overlaps a side surface of the second metal pattern and a connecting pattern is formed on the first and second metal patterns and the disconnection control pattern and connects the first metal pattern with the second metal pattern.
    Type: Application
    Filed: July 19, 2012
    Publication date: April 11, 2013
    Inventors: Jang-Il Kim, Jae-Jin Song, Sung-Hee Hong, Hyuk-Jin Kim, Kee-Bum Park, Byoung-Sun Na
  • Publication number: 20130064497
    Abstract: Provided is an optical integrated device comprising a first waveguide that is formed on a substrate and includes a first optical path; an electrode formed on the first waveguide; a second waveguide that is formed on the substrate and includes a second optical path; and a transparent waveguide that is formed on the substrate between the first waveguide and the second waveguide, and includes a transparent core that serves as an optical path and is formed of a material having higher bandgap energy than the first optical path. The electrode is formed above the first waveguide and is not formed above the transparent waveguide, and elements including the first waveguide are optically active elements that operate according to current injected thereto.
    Type: Application
    Filed: August 27, 2012
    Publication date: March 14, 2013
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Norihiro IWAI, Hirotatsu ISHII
  • Publication number: 20130056757
    Abstract: A light emitting element in use for an LED array comprises an electrode layer, a semiconductor light emitting layer consisting of a p-type semiconductor layer, an active layer and an n-type semiconductor layer, a first wiring layer formed along and in parallel to one side of the semiconductor light emitting layer, and a plurality of second wiring layers extending from the first wiring layer to the semiconductor light emitting layer and electrically connected to the n-type semiconductor layer on a surface of the semiconductor light emitting layer, wherein a plane shape of the semiconductor light emitting layer comprises two short sides including a portion inclined from a line perpendicular to a upper and a lower sides, and a vertical line from a vertex where the upper side and the short side meet crosses the lower side of the adjacent light emitting element.
    Type: Application
    Filed: August 30, 2012
    Publication date: March 7, 2013
    Applicant: STANLEY ELECTRIC CO., LTD.
    Inventors: Mamoru MIYACHI, Tatsuma SAITO, Mitsunori HARADA
  • Patent number: 8378365
    Abstract: A light emitting diode (LED) package including a carrier, at least one LED chip, and a light guide element is provided. The LED chip is disposed on the carrier. The light guide element including a light transmissive body, a light integration part, a reflective film, and a support part is disposed on the carrier and above the LED chip. The light integration part connected to the light transmissive body and disposed between the light transmissive body and the LED chip has a light incident surface facing the LED chip and at least one side. The side connects the light transmissive body and the light incident surface. The reflective film is disposed on the side. The support part leaning on the carrier is connected to the light transmissive body and surrounds the light integration part. The light transmissive body, the light integration part, and the support part are integrally formed.
    Type: Grant
    Filed: September 15, 2009
    Date of Patent: February 19, 2013
    Assignee: Young Optics Inc.
    Inventors: Mei-Ling Chen, Wen-Chieh Wen, Haw-Woei Pan, Chao-Shun Chen
  • Publication number: 20130026527
    Abstract: Provided is a light emitting device having strong bonding strength between the light emitting element and the wavelength converting member is provided. In the light emitting device, a light emitting element and a wavelength converting member are bonded. Particularly, the light emitting element has, from the wavelength converting member side, a first region and a second region, the wavelength converting member has, from the light emitting element side, a third region and a fourth region. The first region has an irregular atomic arrangement compared with the second region, the third region has an irregular atomic arrangement compared with the fourth region, and the first region and the third region are directly bonded.
    Type: Application
    Filed: April 5, 2011
    Publication date: January 31, 2013
    Inventor: Masatsugu Ichikawa
  • Publication number: 20130023077
    Abstract: A method for manufacturing a semiconductor optical device includes the steps of growing a stacked semiconductor layer on a substrate having a cleavage direction in a first direction; forming a first mask having a plurality of openings arranged in the first direction; forming a mark array by etching the stacked semiconductor layer using the first mask; forming a second mask having first and second openings extending in a second direction intersecting the first direction; forming first and second grooves, and a waveguide mesa by etching the stacked semiconductor layer using the second mask; and producing a laser diode bar by cleaving a substrate product including the waveguide mesa. First and second residual marks are formed on the upper surface of the waveguide mesa. First and second transfer marks are formed on the bottoms of the first and the second grooves, respectively.
    Type: Application
    Filed: July 16, 2012
    Publication date: January 24, 2013
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Kenji HIRATSUKA
  • Publication number: 20130021556
    Abstract: According to one embodiment, a display device includes a main substrate, and a light control layer. The main substrate includes a main base having a main surface, a wavelength selective transmission layer provided on the main surface, and a circuit layer provided on the wavelength selective transmission layer. The light control layer is stacked with the main substrate and has variable optical characteristics. The wavelength selective transmission layer includes lower and upper reflecting layers, and first and second spacer layers. The upper reflecting layer is provided on the lower reflecting layer. The first spacer layer is provided between the lower and upper reflecting layers. The second spacer layer is provided between the lower and upper reflecting layers, and has a different thickness from the first spacer layer. The circuit layer includes first and second pixel electrodes, and first and second switching elements.
    Type: Application
    Filed: May 29, 2012
    Publication date: January 24, 2013
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Hitoshi NAGATO, Takashi MIYAZAKI, Yutaka NAKAI, Hajime YAMAGUCHI, Koji SUZUKI, Rei HASEGAWA
  • Patent number: 8354682
    Abstract: A radiation-emitting component (10) having a layer stack (1) which is based on a semiconductor material and which has an active layer sequence (4) for generating electromagnetic radiation, and a filter element (2) which is arranged after the active layer sequence (4) in the irradiation direction (A) and by means of which a first radiation component is transmitted, and a second radiation component is reflected into the layer stack (1), wherein the second radiation component is subjected to a deflection process or an absorption and emission process, and the deflected or emitted radiation impinges on the filter element (2).
    Type: Grant
    Filed: August 13, 2007
    Date of Patent: January 15, 2013
    Assignee: Osram Opto Semiconductors GmbH
    Inventors: Franz Eberhard, Stefan Grötsch, Norbert Linder, Jürgen Moosburger, Klaus Streubel, Ralph Wirth, Matthias Sabathil, Julius Muschaweck, Krister Bergenek
  • Publication number: 20130009176
    Abstract: A display substrate includes a base substrate, color filter layers, a bottom supporting layer and a light-blocking and maintaining element. The base substrate includes a gate line, a data line crossing the gate line, and a switching element on the base substrate. The color filter layers are adjacent to each other on the base substrate. The bottom supporting layer is between the color filter layers adjacent to each other and on the base substrate. The light-blocking and maintaining element is between the color filter layers adjacent to each other, and on the bottom supporting layer. The light-blocking and maintaining element includes a light blocking portion, and a maintaining portion which overlaps the bottom supporting layer and protrudes from the light blocking portion.
    Type: Application
    Filed: February 28, 2012
    Publication date: January 10, 2013
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-Uk KANG, Chul HUH, Sang-Hun LEE, Gwan-Soo KIM
  • Publication number: 20120280264
    Abstract: A solid-state light source has a wavelength conversion chip affixed to a light emitting diode. Optical coatings, vias, light extraction elements, electrical connections or electrical bond pads can be fabricated on the wavelength conversion chips.
    Type: Application
    Filed: July 11, 2012
    Publication date: November 8, 2012
    Inventors: Karl W. Beeson, Scott M. Zimmerman, William R. Livesay
  • Publication number: 20120274611
    Abstract: This disclosure provides systems, methods and apparatus relating to pixel designs for use in active matrix displays which employ poly-silicon (p-Si) thin-film transistors (TFTs) having dual gate structures to control the pixels. The poly-silicon island of the TFT is configured to take advantage of the black mask area attributable to other non-reflective display components, thus enhancing the fill factor of the display.
    Type: Application
    Filed: April 26, 2011
    Publication date: November 1, 2012
    Applicant: QUALCOMM MEMS TECHNOLOGIES, INC.
    Inventors: Jae Hyeong Seo, Marc Maurice Mignard, Ming-Hau Tung, Russel Allyn Martin
  • Patent number: 8294263
    Abstract: A light-emitting diode packaging structure comprises a light-emitting diode and first and second metal plates on which the light-emitting diode is mounted. The light-emitting diodes includes first and second electrode leads, the second electrode lead having first and second contact surfaces on an outer edge of the second electrode lead. The first metal plate includes at least one clamping portion that clamps and fixes the first electrode lead on the first metal plate. The second metal plate includes at least first and second clamping portions. The first contact surface of the second electrode lead contacts the first clamping portion, and the second contact surface of the second electrode lead contacts the second clamping portion, such that the light-emitting diode is fixed on the second metal plate in at least two dimensions parallel to a primary surface of the second metal plate on which the light-emitting diodes is mounted.
    Type: Grant
    Filed: May 31, 2011
    Date of Patent: October 23, 2012
    Assignee: Everlight Electronics Co., Ltd.
    Inventors: Sheng-Jia Sheu, Chien-Chang Pei
  • Publication number: 20120241795
    Abstract: The present invention provides an optoelectronic module including a substrate, an optoelectronic device and a control unit. The substrate includes a top surface, a bottom surface, a concave structure, a through hole structure and a conductive material. The concave structure is disposed on the top surface. The through hole structure passes through the substrate from the top surface to the bottom surface. The conductive material is filled into the through hole structure. The optoelectronic device is disposed on the substrate for providing or receiving an optical signal. The control unit is configured on the top surface and electrically connected to the conductive material and the optoelectronic device for controlling the optoelectronic device.
    Type: Application
    Filed: March 22, 2012
    Publication date: September 27, 2012
    Applicant: Centera Photonics Inc.
    Inventors: Chia-Chi CHANG, Guan-Fu Lu, Chun-Chiang Yen
  • Publication number: 20120241798
    Abstract: Embodiments of the invention include a substrate comprising a host and a seed layer bonded to the host, and a semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region grown over the seed layer. A variation in index of refraction in a direction perpendicular to a growth direction of the semiconductor structure is disposed between the host and the light emitting layer.
    Type: Application
    Filed: April 30, 2012
    Publication date: September 27, 2012
    Applicants: PHILIPS LUMILEDS LIGHTING COMPANY, LLC, KONINKLIJKE PHILIPS ELECTRONICS N.V.
    Inventors: Aurelien J.F. David, Michael R. Krames, Melvin B. McLaurin
  • Publication number: 20120241800
    Abstract: The present teachings relate to semiconductor-based lighting systems and fixtures which process electromagnetic energy from light emitting diodes or the like. A disclosed exemplary system includes at least one occluded remote phosphor and produces substantially white light of desired characteristics. The remote phosphor extends over at least a portion of a surface of a macro optic at an occluded location such that none of the remote phosphor is directly visible through an optical aperture. The phosphor is responsive to electromagnetic energy from a semiconductor device to emit visible light for the emission through the optical aperture.
    Type: Application
    Filed: June 6, 2012
    Publication date: September 27, 2012
    Applicant: ABL IP Holding LLC
    Inventors: Jack C. Rains, JR., David P. Ramer
  • Patent number: 8269237
    Abstract: A light-emitting device including a light-emitting element emitting excitation light for exciting a fluorescent body, a dispersion body having the fluorescent body dispersed therein, which fluorescent body emits fluorescent light having a wavelength different from that of the excitation light, and a lead frame holding the light-emitting element and the dispersion body, wherein at least a portion of the fluorescent light emitted from the fluorescent body in the dispersion body is output to the outside from a side of the dispersion body receiving the excitation light. With this, a light-emitting device having high light output efficiency and an illumination apparatus and a display apparatus using the light-emitting device are provided.
    Type: Grant
    Filed: December 27, 2005
    Date of Patent: September 18, 2012
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Tatsuya Morioka, Osamu Kawasaki
  • Publication number: 20120161141
    Abstract: According to the present invention, there is provided a white organic light emitting diode (W-OLED) display device for effectively blocking outgas generated from a color filter using silicon nitride having a low water vapor transmission rate as a passivation layer instead of a planarization layer which is an organic insulating layer, and a method of fabricating the same.
    Type: Application
    Filed: December 22, 2011
    Publication date: June 28, 2012
    Inventors: Eun-Ju JEON, Hee-Suk Pang