Abstract: A semiconductor light-emitting element includes: an n-type semiconductor layer made of an n-type AlGaN-based semiconductor material; an active layer provided on the n-type semiconductor layer and made of an AlGaN-based semiconductor material; a p-type semiconductor layer provided on the active layer; and a p-side contact electrode that includes an Rh layer in contact with an upper surface of the p-type semiconductor layer and having a thickness of 10 nm or smaller and an Al layer in contact with an upper surface of the Rh layer and having a thickness of 20 nm or larger.

Abstract: A sliding device that slidably supports a seat body of a vehicle seat is provided. The sliding device includes: a fixed rail; a movable rail; a locking member displaceable between a locking position and an unlocking position, a sliding movement of the movable rail being restricted in the locking position, and restriction of the sliding movement being released in the unlocking position; a retention spring configured to apply to the locking member a retaining force to retain the locking member in the locking position; a release lever configured to displace the locking member to the unlocking position; a return spring configured to apply to the release lever an elastic force to return the release lever to its initial position; and a restrictor configured to restrict a displacement of the release lever.

Abstract: A display apparatus includes: a liquid crystal panel; and a backlight unit configured to provide light to the liquid crystal panel, wherein the backlight unit includes: a substrate; a light emitting diode provided on the substrate; a quantum dot cover covering the light emitting diode and configured to convert a wavelength of light emitted from the light emitting diode; a refractive cover covering the quantum dot cover, wherein a surface of the refractive cover has a recessed portion that is recessed toward the quantum dot cover and a reflector provided in the recessed portion to be positioned above the quantum dot cover, and wherein a diameter of a lower surface of the reflector is smaller than a diameter of an upper surface of the reflector.

Abstract: The LED structure includes a substrate and a plurality of LED units formed on the substrate. Each LED unit includes a bonding layer formed on the substrate, a first doping type semiconductor layer formed on the bonding layer, a second doping type semiconductor layer formed on the first doping type semiconductor layer, a passivation layer formed on the second doping type semiconductor layer and a portion of the first doping type semiconductor layer; and an electrode layer formed on a portion of the passivation layer and contacting the second doping type semiconductor layer. The plurality of LED units include a first LED unit and a second LED unit adjacent to the first LED unit. The first doping type semiconductor layer of the first LED unit horizontally extends to the first doping type semiconductor layer of the second LED unit adjacent to the first LED unit, and the first LED unit and the second LED unit are individually functionable LED units.

Abstract: An ultraviolet light emitting device includes a substrate, an ultraviolet light emitting element, a bonding layer, a fluororesin film, and a fluorocarbon compound. The substrate includes a mounting surface. The ultraviolet light emitting element includes a first surface, a second surface, and a side surface. The bonding layer bonds the electrode on the first surface of the ultraviolet light emitting element and a part of the mounting surface of the substrate. The fluororesin film is a flexible material configured to transmit ultraviolet light. The substrate and the fluororesin film are disposed in a state where the ultraviolet light emitting element is sandwiched therebetween. The fluorocarbon compound is a liquid at normal temperature and pressure. The fluorocarbon compound fills a gap between the side surface of the ultraviolet light emitting element and the fluororesin film in a state of being in contact with the side surface and the fluororesin film.

Abstract: A flip-chip light-emitting diode includes a first conductivity type semiconductor layer, a light-emitting layer, a second conductivity type semiconductor layer, a first transparent dielectric layer, a second transparent dielectric layer, and a distributed Bragg reflector (DBR) structure which are sequentially stacked. The first transparent dielectric layer has a thickness greater than ?/2n1, and the second transparent dielectric layer has a thickness of m?/4n2, wherein m is an odd number, ? is an emission wavelength of the light-emitting layer, n1 is a refractive index of the first transparent dielectric layer, and n2 is a refractive index of the second transparent dielectric layer and is greater than n1.

Abstract: A lighting device includes a substrate, light sources having a first light source on the substrate, a resin layer sealing the plurality of light sources on the substrate; and a light transmitting layer on the resin layer. A surface of the resin layer has an upper surface and side surfaces, and the side surfaces of the resin layer has a convex curved surface. The light transmitting layer has a first flat region on the upper surface of the resin layer and a second curved region on the side surfaces of the resin layer. The convex curved surface of the resin layer and the second curved region of the light transmitting layer overlap the first light source in a vertical direction, and a corner between two adjacent the side surfaces of the resin layer has a convex curved surface.

Abstract: An optical element mounting package includes an optical component and a base. The optical component reflects light. The base has a recess. In the recess, a first mounting portion and a second mounting portion are provided. On the first mounting portion, an optical element is to be mounted. On the second mounting portion, the optical component is mounted. The optical component includes a reflective surface and a transmission film on the reflective surface. A front surface of the transmission film is inclined relative to the reflective surface.

Abstract: In one embodiment, a device registers with a controller for a mesh of overhead access points. The device receives, from the controller, a communication schedule for the device. The device generates a message to be sent to the mesh of overhead access points. The device transmits, according to the communication schedule, the message as a beam cone directed substantially upward relative to the device towards the mesh of overhead access points. The message is received and relayed by one or more particular access points in the mesh without the device previously performing a wireless association exchange with those one or more particular access points.

Abstract: Disclosed is a semiconductor light emitting device comprising a semiconductor light emitting chip having electrodes; a mold, which has a first surface roughness and includes a bottom portion where the semiconductor light emitting chip is arranged and through holes formed in the bottom portion, with the through holes being comprised of a surface having a second surface roughness different from the first surface roughness, wherein at least one side of the mold facing the semiconductor light emitting chip is made of a material capable of reflecting at least 95% of light emitted by the semiconductor light emitting chip; and conductive parts provided in the through holes for electrical communication with the electrodes.

Abstract: A wearable device includes a housing having a cavity and a thermal interposer disposed within the cavity of the housing and thermally coupled to the housing to draw thermal energy from one or more electrical components of the wearable device and to transfer the thermal energy to the housing.

Abstract: A diffusion member includes a first layer and a second layer, in this order, wherein the first layer has a light transmissivity and a light diffusivity, in the second layer, a reflectance of light increases as an absolute value of an incident angle with respect to a first layer side surface of the second layer decreases, and a transmittance of light increases as an absolute value of an incident angle with respect to a first layer side surface of the second layer increases.

Abstract: A terahertz device includes a base member, a terahertz element, an antenna base, and a reflection film. The terahertz element is mounted on the base member and configured to generate an electromagnetic wave. The antenna base is located opposing the base member and includes an antenna surface. The reflection film is formed on the antenna surface to reflect at least part of the electromagnetic wave generated by the terahertz element in one direction.

Abstract: According to some embodiments of the present disclosure, there is provided a display device including a substrate, a light emitting element on the substrate and emitting first light, a wavelength conversion layer on the light emitting element and including wavelength conversion particles for converting the first light into second light, a first selective transmission film between the light emitting element and the wavelength conversion layer and reflecting the first light and the second light, which are incident from the wavelength conversion layer, and a second selective transmission film on the wavelength conversion layer and reflecting the first light incident from the wavelength conversion layer and transmitting the second light.

Abstract: A display substrate includes a base, a plurality of light-emitting devices disposed on a side of the base, and a light adjustment layer. The plurality of light-emitting devices are spaced apart from each other. At least part of the light adjustment layer is located in gaps among the plurality of light-emitting devices, so that side walls of at least one of the plurality of light-emitting devices are surrounded by the light adjustment layer. A material of the light adjustment layer includes a light-absorbing material. The light adjustment layer is configured to absorb light incident on the light adjustment layer.

Abstract: Head-mounted virtual and augmented reality display systems include a light projector with one or more emissive micro-displays having a first resolution and a pixel pitch. The projector outputs light forming frames of virtual content having at least a portion associated with a second resolution greater than the first resolution. The projector outputs light forming a first subframe of the rendered frame at the first resolution, and parts of the projector are shifted using actuators, such that physical positions of light output for individual pixels occupy gaps between the old locations of light output for individual pixels. The projector then outputs light forming a second subframe of the rendered frame. The first and second subframes are outputted within the flicker fusion threshold. Advantageously, an emissive micro-display (e.g., micro-LED display) having a low resolution can form a frame having a higher resolution by using the same light emitters to function as multiple pixels of that frame.

Abstract: A display device according to an embodiment includes a light emitting unit including a first light emitting diode to emit first blue light, a second light emitting diode to emit second blue light, the second blue light being different from the first blue light in central wavelength, and a quantum dot color conversion unit including a quantum dot color conversion layer on and overlapping the second light emitting diode.

Abstract: A system and corresponding method is disclosed for monitoring and conducting large-scale performance verification of a city's lighting infrastructure. In particular, the current invention combines measurements of lighting performance measurements along city roadways with regulatory requirements for the roadways. In various embodiments, the current invention then presents a three-dimensional visualization of the adequacy of existing roadway lighting with respect to these regulatory requirements.

Abstract: Discussed is a backlight unit, including a base substrate; a partition wall on the base substrate and including a plurality of grooves; semiconductor light-emitting devices on the base substrate and in the plurality of grooves, respectively; a phosphor layer defined in each of the plurality of grooves to cover the semiconductor light-emitting devices and absorbs light in a specific wavelength band to emit light in a wavelength band different from the light in the specific wavelength band; a light diffusion layer that above the phosphor layer and diffuses light; and a spacer between the partition wall and the light diffusion layer, wherein the spacer includes: a body part attached to the partition wall; and a protruding part protruding in a direction toward the light diffusion layer and attached to the light diffusion layer, such that the light diffusion layer and the phosphor layer are spaced apart from each other.

Abstract: A light-emitting element array chip includes: a first light-emitting element array that includes a first light-emitting element including a first substrate, a light-emitting element layer formed on the first substrate, and a first cathode electrode electrically connected to the light-emitting element layer; and a second light-emitting element array that includes a second light-emitting element including a second substrate, a non-p-type lower reflector formed on the second substrate, and a second cathode electrode electrically connected to the non-p-type lower reflector, in which the first light-emitting element array is provided on an emission surface side of the second light-emitting element array.

Abstract: A display device includes a first substrate, a first circuit structure, and light-emitting element package structures. The first circuit structure is located above the first substrate, and the first circuit structure has holes. Light-emitting element package structures are located above the first circuit structure. Each light-emitting element package structure includes a second substrate and at least one light-emitting element. The light emitting element is located between the second substrate and the first substrate, emitting toward the first circuit substrate, and overlapping with corresponding hole of the first circuit structure. The width of the corresponding hole near the first substrate is greater than the width of the corresponding hole near the second substrate.

Abstract: A light emitting module unit includes a circuit board and a light emitting device. The light emitting device includes a plurality of light emitting elements electrically coupled through the circuit board, one or more electrodes arranged on a first surface of the plurality of light emitting elements, a surface barrier formed on a second surface of one or more of the plurality of light emitting elements, and an encapsulation portion disposed above a third surface of the plurality of light emitting elements. The surface barrier is disposed between the encapsulation portion and the second surface of one or more of the plurality of light emitting elements.

Abstract: This specification discloses LED arrays comprising a grid structure that physically and optically isolates adjacent LEDs or groups of LEDs in the array from each other. The grid structure comprises an arrangement of walls defining cells. Individual LEDs or groups of LEDs in the array are positioned within different ones of the cells, separated from adjacent LEDs or groups of LEDs by the grid walls. This specification also discloses fabrication processes for such LED arrays. In these fabrication processes, the grid structure is formed as a separate monolithic structure. The LEDs or pcLEDs are arranged on and attached to a substrate (for example, a printed circuit board), after which the grid structure is attached to the substrate in registry with the arrangement of LEDs or pcLEDs.

Abstract: A photoconversion device includes a first wavelength converter and a long-pass filter. The first wavelength converter receives excitation light from an output portion and emits fluorescence having a longer wavelength than the excitation light. The long-pass filter transmits the fluorescence emitted by the first wavelength converter and reflects the excitation light transmitted through or reflected from the first wavelength converter to enter the first wavelength converter.

Abstract: A light emitting device for a display according to an exemplary embodiment includes a first LED stack, a second LED stack located under the first LED stack, and a third LED stack located under the second LED stack. The light emitting device further includes a first bonding layer, a second bonding layer, a first planarization layer, a second planarization layer, lower buried vias, and upper buried vias. The first planarization layer is recessed inwardly to expose an edge of the second LED stack.

Abstract: A display panel is provided. The display panel includes a substrate, a thin film transistor array layer disposed on the substrate, a light emitting device layer disposed on the thin film transistor array layer, a thin film encapsulation layer disposed on the light emitting device layer, a phase retardation layer disposed within the thin film encapsulation layer, and a linear polarizing layer disposed within the thin film encapsulation layer. By removing a conventional polarizer, a problem in a conventional display panel that disposition of a polarizer limits a thickness of the entire display panel and reduces bending performance of the display panel is solved.

Abstract: A light emitting device includes: a package including a first lead, a second lead, and a molded body; and a light emitting element provided on the second lead. The first lead includes a first electrode terminal having a first thickness in a thickness direction, and a first holding portion connected to the first electrode terminal and having a thickness smaller than the first thickness in the thickness direction, the first holding portion having a front surface and a rear surface opposite to the front surface in the thickness direction. The second lead includes a second electrode terminal facing the first electrode terminal in the thickness direction, and a connection electrically connected to the first lead. The molded body holds the first lead and the second lead and covers the front surface and the rear surface of the first holding portion.

Abstract: A white light emitting device includes: first light-emitting units to which a first current is applied; and second light-emitting units to which a second current which is different from the first current is applied. When the first current is applied to the first light-emitting units and the second current is applied to the second light-emitting units, an average emission chromaticity of the first light-emitting units and an average emission chromaticity of the second light-emitting units are identical colors. When the same current is applied to both the first light-emitting units and the second light-emitting units, the average emission chromaticity of the first light-emitting units and the average emission chromaticity of the second light-emitting units are non-identical colors.

Abstract: A wavelength-selective optical reception device includes a photoreceptor (21) that converts optical signals (201) into electric signals and outputs the electric signals, a base (31) on which the photoreceptor (21) is provided, a housing (41) that is mounted on the base (31) and surrounds the photoreceptor (21) along with the base (31), and that is provided with a window (51) to pass optical signals (203) including the optical signals (201) and including optical signals (202) of a wavelength different from a first wavelength of the optical signals (201) and a window (52) to pass the optical signals (202), and an optical filter (61) that is disposed inside the housing between the window (51) and the photoreceptor (21) along the optical axis (205) of the optical signals (203), and that outputs, out of the optical signals (203) that enter thereto, the optical signals (201) toward the photoreceptor (21), and reflects the optical signals (202) toward a near side in a direction of travel of the optical signals (203)

Abstract: A light-emitting device and a display device using the same are disclosed. The light-emitting device improves the reliability of a process of disposing light-emitting devices. The light-emitting device is configured to ensure electrical connections even if the light-emitting device is inverted while being disposed on a substrate. The light-emitting device includes an n-type semiconductor layer and a p-type semiconductor layer. N-type electrodes and p-type electrodes are disposed on both sides of top and bottom surfaces of the light-emitting device. Contact holes are provided to electrically connect one of the n-type electrodes to the n-type semiconductor layer and one of the p-type electrodes to the p-type semiconductor layer. When the light-emitting device is inverted while being disposed on a substrate, the light-emitting device operates ordinarily, thereby reducing the defect rate of a display device.

Abstract: A semiconductor light-emitting device includes a light-emitting structure including a first semiconductor layer, an active layer, and a second semiconductor layer which are sequentially stacked, a first insulating layer on the second semiconductor layer with a plurality of first openings having first widths and a plurality of second openings having second widths different from the first widths, a first electrode electrically connected to the first semiconductor layer through the first openings, a first sub-electrode layer between the second semiconductor layer and the first insulating layer, the first sub-electrode layer being exposed through the second openings, and a second sub-electrode layer on the first insulating layer, the second sub-electrode layer being connected to the first sub-electrode layer through the second openings, wherein a first distance between the first openings closest to each other is different from a second distance between the second openings closest to each other.

Abstract: A display panel including a circuit board including first pads, first light emitting devices disposed on the circuit board and including pads, at least one second light emitting device disposed on the circuit board and including pads, metal bonding layers disposed between the pads of the first light emitting devices and the first pads on the circuit board, and a conductive material layer electrically connecting the pads of the second light emitting device to the first pads on the circuit board, in which the conductive material layer includes a conductive portion and a non-conductive portion.

Abstract: A light-emitting device includes a base member, a plurality of light sources on or above an upper surface of the base member, and a reflector that comprises a plurality of surrounding portions. Each of the plurality of surrounding portions surrounds a respective one of the plurality of light sources in a plan view. Each of the plurality of surrounding portions has inclined lateral surfaces widened upward. Intervals between adjacent ones of the plurality of light sources are constant in the plan view. Upper peripheries of the inclined lateral surfaces of each of the plurality of surrounding portions define an opening having a substantially rectangular shape. The plurality of surrounding portions include a plurality of first surrounding portions and a plurality of second surrounding portions surrounding the plurality of first surrounding portions.

Abstract: A light emitting module including: a light guide member including: an emission region defined by a sectioning groove, a light source placement part located in the emission region, and a light adjusting hole; and a light source disposed in the light source placement part. In the schematic top view: the light adjusting hole is not positioned on a first straight line connecting (i) a center of the light source and (ii) a point in the sectioning groove that is farthest from the center of the light source, and a first lateral face of the light adjusting hole has a first region, and a line normal to the first region is oblique to a second straight line connecting (i) the center of the light source and (ii) a point in the sectioning groove that is closest to the center of the light source.

Abstract: A combination standoff and LED includes a surface mount solder standoff which can be either threaded or unthreaded, and a surface mount LED disposed and fixed in the center of the base of the standoff. The combination standoff and LED is adapted to receive a lightpipe via the either threaded or unthreaded portion of the surface mount solder standoff. This combination standoff and LED results in a single piece of hardware which simplifies the physical PCBA layout design and removes any Computer Aided Design (CAD) placement errors that would normally be present if two separate hardware components were placed together manually.

Abstract: The light emitting device includes: at least one light emitting element including a light-extracting surface and at least one lateral surface; a wavelength converting member including; a first upper surface and a second upper surface, a lower surface located at an opposite side from the first upper surface and the second upper surface, at least one first lateral surface connecting the second upper surface and the first upper surface, and at least one second lateral surface connecting the second upper surface and the lower surface, in which a thickness between the lower surface and the first upper surface is smaller than a thickness between the lower surface and the second upper surface, and the first upper surface is located at an opposite side from the light-extracting surface of a corresponding one of the at least one light emitting element, and the lower surface is located facing the light-extracting surface of the corresponding one of the at least one light emitting element; a covering member covering the

Abstract: An exterior aircraft light includes a mounting board, a light source arranged on the mounting board and a lens arranged over the light source. The lens includes a first lens portion on a first side of a cross-sectional center plane, which is orthogonal to the mounting board and which runs through the light source, and a second lens portion on a second side of the cross-sectional center plane. The light also includes a reflector, arranged to reflect light, emitted by the light source into the first lens portion, towards the second lens portion, wherein the lens fully encloses the light source and the reflector.

Abstract: A light emitting device includes a ceramic substrate, a light emitting element, and a wiring. The light emitting element is formed on an upper surface of the ceramic substrate. The wiring is arranged inside the ceramic substrate and is electrically and directly connected to the light emitting element. The light emitting element includes a structure in which a lower semiconductor layer, an active layer, and an upper semiconductor layer are sequentially stacked.

Abstract: An article with a color change portion and a method of changing color. The article includes at least one color change portion capable of changing colors. The color change portion includes composite material including a photonic lattice. The color change portion can change colors according to one or more performance parameters. The article can be connected to a computer and the color change portion can be controlled using the computer.

Abstract: Disclosed are a display device and a backlight module comprising a backplane and a backlight part provided on the backplane, in which a seam is provided between the two adjacent backlight parts; an adjustment part is installed at the seam; the adjustment part comprises: a connecting portion, an end of which is installed on the backplane through the seam, in which a depth at which the connecting portion is installed in the backplane is adjustable; and an adjustment portion provided at an end of the connecting portion away from the backplane, in which an outer diameter of the adjustment portion tapers along a direction toward the backplane, and an end of the adjustment portion enters the seam.

Abstract: An LED-filament comprising: a partially light transmissive substrate; a plurality of LED chips on a front face of the substrate; a photoluminescence material that is in direct contact with and covers all of the plurality of LED chips; and a light scattering layer that is in direct contact with and covers at least the photoluminescence material, wherein the light scattering layer comprises particles of light scattering material, and wherein the photoluminescence material comprises broadband green to red photoluminescence materials and narrowband red photoluminescence material.

Abstract: An apparatus includes a substrate, a light emitter mounted on the substrate, and a light receiver, including a light sensitive region, mounted on the substrate. The substrate includes one or more light blocking vias arranged to prevent at least some light produced by the light emitter from traveling through the substrate and thereby generating optical cross-talk in the light receiver.

Abstract: Provided is a backlight unit, a display apparatus, and a method of manufacturing the display apparatus capable of securing a uniform and wide illumination area with a small number of light sources through reflection of a reflective layer. The backlight unit includes a plurality of light sources configured to emit light; a first reflective layer configured to reflect the light emitted from the plurality of light sources; and a second reflective layer configured to reflect the light reflected from the first reflective layer, wherein an amount of reflection from the first reflective layer and an amount of transmission through the first reflective layer are different from each other according to an angle of incidence of light incident on the first reflective layer.

Abstract: An optical receptacle includes an optical receptacle main body and a cylindrical fixing member. The optical receptacle main body includes a first optical surface, a second optical surface, and an annular groove disposed to surround a first central axis of the first optical surface or disposed to surround a second central axis of the second optical surface. The fixing member is configured with a material with a smaller linear expansion coefficient than that of the optical receptacle main body, and is fit to the groove so as to be in contact with at least a part of an inner surface of the groove.

Abstract: A method of producing an optoelectronic semiconductor component includes providing a carrier; arranging at least one optoelectronic semiconductor chip at a top side of the carrier, wherein the semiconductor chip includes semiconductor layers deposited on a substrate; forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip and at least some of the layers deposited on the substrate are free of the shaped body such that these layers are not covered or completely exposed; and removing the carrier.

Abstract: A display apparatus includes a liquid crystal panel, and a backlight unit configured to emit light to the liquid crystal panel. The backlight unit includes a substrate, a light emitting diode (LED) provided on the substrate and configured to emit light, and a refractive cover formed by being provided at a plurality of points separated from each other, and configured to enclose the LED.

Abstract: A multilayer stack in the form of a Bragg reflector comprising a graded interfacial layer and a method of manufacturing are disclosed. The graded interfacial layer eliminates the formation of low-reflectivity interfaces in a multilayer stack and reduces roughness of interfaces in a multilayer stack.

Abstract: A light-emitting device includes an ultraviolet light LED sealed in a package. The LED is bonded to a substrate with an alloy bonding material. The LED is covered with an enclosed gas containing oxygen gas and further covered with a lid member that is hermetically bonded to the substrate. The lid member defines a space filled with the enclosed gas and constitutes the package. The lid member transmits the ultraviolet light emitted from the LED.

Abstract: A semiconductor device includes a case enclosing a region where a semiconductor element as a component of an electric circuit exists. A resin part is fixed to an inside of the case in contact with the region. The resin part is provided with a conductive film, which is a part of the electric circuit. The conductive film is provided in the resin part so that the conductive film comes into contact with the region.

Abstract: A wiring board includes: a metal plate having first and second surfaces opposite to each other, and having at least one through-hole penetrating through the first and second surfaces; at least one conductive via respectively disposed in the through-hole and spaced apart from the metal plate; an insulating structure including at least one through-insulating portion disposed between the through-hole and the conductive via, and a first insulating layer and a second insulating layer extending from the through-insulating portion and disposed in first regions surrounding the conductive via, on the first surface and the second surface, respectively; at least one first upper pad disposed on the first insulating layer and electrically connected to the conductive via; at least one first lower pad disposed on the second insulating layer and electrically connected to the conductive via; a second upper pad disposed on the first surface of the metal plate; and a second lower pad disposed on the second surface of the metal