Abstract: A display panel is provided. The display panel includes a substrate, a thin film transistor array layer disposed on the substrate, a light emitting device layer disposed on the thin film transistor array layer, a thin film encapsulation layer disposed on the light emitting device layer, a phase retardation layer disposed within the thin film encapsulation layer, and a linear polarizing layer disposed within the thin film encapsulation layer. By removing a conventional polarizer, a problem in a conventional display panel that disposition of a polarizer limits a thickness of the entire display panel and reduces bending performance of the display panel is solved.

Abstract: A light emitting device for a display according to an exemplary embodiment includes a first LED stack, a second LED stack located under the first LED stack, and a third LED stack located under the second LED stack. The light emitting device further includes a first bonding layer, a second bonding layer, a first planarization layer, a second planarization layer, lower buried vias, and upper buried vias. The first planarization layer is recessed inwardly to expose an edge of the second LED stack.

Abstract: A light emitting device includes: a package including a first lead, a second lead, and a molded body; and a light emitting element provided on the second lead. The first lead includes a first electrode terminal having a first thickness in a thickness direction, and a first holding portion connected to the first electrode terminal and having a thickness smaller than the first thickness in the thickness direction, the first holding portion having a front surface and a rear surface opposite to the front surface in the thickness direction. The second lead includes a second electrode terminal facing the first electrode terminal in the thickness direction, and a connection electrically connected to the first lead. The molded body holds the first lead and the second lead and covers the front surface and the rear surface of the first holding portion.

Abstract: A white light emitting device includes: first light-emitting units to which a first current is applied; and second light-emitting units to which a second current which is different from the first current is applied. When the first current is applied to the first light-emitting units and the second current is applied to the second light-emitting units, an average emission chromaticity of the first light-emitting units and an average emission chromaticity of the second light-emitting units are identical colors. When the same current is applied to both the first light-emitting units and the second light-emitting units, the average emission chromaticity of the first light-emitting units and the average emission chromaticity of the second light-emitting units are non-identical colors.

Abstract: A wavelength-selective optical reception device includes a photoreceptor (21) that converts optical signals (201) into electric signals and outputs the electric signals, a base (31) on which the photoreceptor (21) is provided, a housing (41) that is mounted on the base (31) and surrounds the photoreceptor (21) along with the base (31), and that is provided with a window (51) to pass optical signals (203) including the optical signals (201) and including optical signals (202) of a wavelength different from a first wavelength of the optical signals (201) and a window (52) to pass the optical signals (202), and an optical filter (61) that is disposed inside the housing between the window (51) and the photoreceptor (21) along the optical axis (205) of the optical signals (203), and that outputs, out of the optical signals (203) that enter thereto, the optical signals (201) toward the photoreceptor (21), and reflects the optical signals (202) toward a near side in a direction of travel of the optical signals (203)

Abstract: A light-emitting device and a display device using the same are disclosed. The light-emitting device improves the reliability of a process of disposing light-emitting devices. The light-emitting device is configured to ensure electrical connections even if the light-emitting device is inverted while being disposed on a substrate. The light-emitting device includes an n-type semiconductor layer and a p-type semiconductor layer. N-type electrodes and p-type electrodes are disposed on both sides of top and bottom surfaces of the light-emitting device. Contact holes are provided to electrically connect one of the n-type electrodes to the n-type semiconductor layer and one of the p-type electrodes to the p-type semiconductor layer. When the light-emitting device is inverted while being disposed on a substrate, the light-emitting device operates ordinarily, thereby reducing the defect rate of a display device.

Abstract: A semiconductor light-emitting device includes a light-emitting structure including a first semiconductor layer, an active layer, and a second semiconductor layer which are sequentially stacked, a first insulating layer on the second semiconductor layer with a plurality of first openings having first widths and a plurality of second openings having second widths different from the first widths, a first electrode electrically connected to the first semiconductor layer through the first openings, a first sub-electrode layer between the second semiconductor layer and the first insulating layer, the first sub-electrode layer being exposed through the second openings, and a second sub-electrode layer on the first insulating layer, the second sub-electrode layer being connected to the first sub-electrode layer through the second openings, wherein a first distance between the first openings closest to each other is different from a second distance between the second openings closest to each other.

Abstract: A display panel including a circuit board including first pads, first light emitting devices disposed on the circuit board and including pads, at least one second light emitting device disposed on the circuit board and including pads, metal bonding layers disposed between the pads of the first light emitting devices and the first pads on the circuit board, and a conductive material layer electrically connecting the pads of the second light emitting device to the first pads on the circuit board, in which the conductive material layer includes a conductive portion and a non-conductive portion.

Abstract: A light emitting module including: a light guide member including: an emission region defined by a sectioning groove, a light source placement part located in the emission region, and a light adjusting hole; and a light source disposed in the light source placement part. In the schematic top view: the light adjusting hole is not positioned on a first straight line connecting (i) a center of the light source and (ii) a point in the sectioning groove that is farthest from the center of the light source, and a first lateral face of the light adjusting hole has a first region, and a line normal to the first region is oblique to a second straight line connecting (i) the center of the light source and (ii) a point in the sectioning groove that is closest to the center of the light source.

Abstract: A light-emitting device includes a base member, a plurality of light sources on or above an upper surface of the base member, and a reflector that comprises a plurality of surrounding portions. Each of the plurality of surrounding portions surrounds a respective one of the plurality of light sources in a plan view. Each of the plurality of surrounding portions has inclined lateral surfaces widened upward. Intervals between adjacent ones of the plurality of light sources are constant in the plan view. Upper peripheries of the inclined lateral surfaces of each of the plurality of surrounding portions define an opening having a substantially rectangular shape. The plurality of surrounding portions include a plurality of first surrounding portions and a plurality of second surrounding portions surrounding the plurality of first surrounding portions.

Abstract: A combination standoff and LED includes a surface mount solder standoff which can be either threaded or unthreaded, and a surface mount LED disposed and fixed in the center of the base of the standoff. The combination standoff and LED is adapted to receive a lightpipe via the either threaded or unthreaded portion of the surface mount solder standoff. This combination standoff and LED results in a single piece of hardware which simplifies the physical PCBA layout design and removes any Computer Aided Design (CAD) placement errors that would normally be present if two separate hardware components were placed together manually.

Abstract: The light emitting device includes: at least one light emitting element including a light-extracting surface and at least one lateral surface; a wavelength converting member including; a first upper surface and a second upper surface, a lower surface located at an opposite side from the first upper surface and the second upper surface, at least one first lateral surface connecting the second upper surface and the first upper surface, and at least one second lateral surface connecting the second upper surface and the lower surface, in which a thickness between the lower surface and the first upper surface is smaller than a thickness between the lower surface and the second upper surface, and the first upper surface is located at an opposite side from the light-extracting surface of a corresponding one of the at least one light emitting element, and the lower surface is located facing the light-extracting surface of the corresponding one of the at least one light emitting element; a covering member covering the

Abstract: An exterior aircraft light includes a mounting board, a light source arranged on the mounting board and a lens arranged over the light source. The lens includes a first lens portion on a first side of a cross-sectional center plane, which is orthogonal to the mounting board and which runs through the light source, and a second lens portion on a second side of the cross-sectional center plane. The light also includes a reflector, arranged to reflect light, emitted by the light source into the first lens portion, towards the second lens portion, wherein the lens fully encloses the light source and the reflector.

Abstract: A light emitting device includes a ceramic substrate, a light emitting element, and a wiring. The light emitting element is formed on an upper surface of the ceramic substrate. The wiring is arranged inside the ceramic substrate and is electrically and directly connected to the light emitting element. The light emitting element includes a structure in which a lower semiconductor layer, an active layer, and an upper semiconductor layer are sequentially stacked.

Abstract: An article with a color change portion and a method of changing color. The article includes at least one color change portion capable of changing colors. The color change portion includes composite material including a photonic lattice. The color change portion can change colors according to one or more performance parameters. The article can be connected to a computer and the color change portion can be controlled using the computer.

Abstract: Disclosed are a display device and a backlight module comprising a backplane and a backlight part provided on the backplane, in which a seam is provided between the two adjacent backlight parts; an adjustment part is installed at the seam; the adjustment part comprises: a connecting portion, an end of which is installed on the backplane through the seam, in which a depth at which the connecting portion is installed in the backplane is adjustable; and an adjustment portion provided at an end of the connecting portion away from the backplane, in which an outer diameter of the adjustment portion tapers along a direction toward the backplane, and an end of the adjustment portion enters the seam.

Abstract: An LED-filament comprising: a partially light transmissive substrate; a plurality of LED chips on a front face of the substrate; a photoluminescence material that is in direct contact with and covers all of the plurality of LED chips; and a light scattering layer that is in direct contact with and covers at least the photoluminescence material, wherein the light scattering layer comprises particles of light scattering material, and wherein the photoluminescence material comprises broadband green to red photoluminescence materials and narrowband red photoluminescence material.

Abstract: An apparatus includes a substrate, a light emitter mounted on the substrate, and a light receiver, including a light sensitive region, mounted on the substrate. The substrate includes one or more light blocking vias arranged to prevent at least some light produced by the light emitter from traveling through the substrate and thereby generating optical cross-talk in the light receiver.

Abstract: Provided is a backlight unit, a display apparatus, and a method of manufacturing the display apparatus capable of securing a uniform and wide illumination area with a small number of light sources through reflection of a reflective layer. The backlight unit includes a plurality of light sources configured to emit light; a first reflective layer configured to reflect the light emitted from the plurality of light sources; and a second reflective layer configured to reflect the light reflected from the first reflective layer, wherein an amount of reflection from the first reflective layer and an amount of transmission through the first reflective layer are different from each other according to an angle of incidence of light incident on the first reflective layer.

Abstract: An optical receptacle includes an optical receptacle main body and a cylindrical fixing member. The optical receptacle main body includes a first optical surface, a second optical surface, and an annular groove disposed to surround a first central axis of the first optical surface or disposed to surround a second central axis of the second optical surface. The fixing member is configured with a material with a smaller linear expansion coefficient than that of the optical receptacle main body, and is fit to the groove so as to be in contact with at least a part of an inner surface of the groove.

Abstract: A method of producing an optoelectronic semiconductor component includes providing a carrier; arranging at least one optoelectronic semiconductor chip at a top side of the carrier, wherein the semiconductor chip includes semiconductor layers deposited on a substrate; forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip and at least some of the layers deposited on the substrate are free of the shaped body such that these layers are not covered or completely exposed; and removing the carrier.

Abstract: A multilayer stack in the form of a Bragg reflector comprising a graded interfacial layer and a method of manufacturing are disclosed. The graded interfacial layer eliminates the formation of low-reflectivity interfaces in a multilayer stack and reduces roughness of interfaces in a multilayer stack.

Abstract: A display apparatus includes a liquid crystal panel, and a backlight unit configured to emit light to the liquid crystal panel. The backlight unit includes a substrate, a light emitting diode (LED) provided on the substrate and configured to emit light, and a refractive cover formed by being provided at a plurality of points separated from each other, and configured to enclose the LED.

Abstract: A light-emitting device includes an ultraviolet light LED sealed in a package. The LED is bonded to a substrate with an alloy bonding material. The LED is covered with an enclosed gas containing oxygen gas and further covered with a lid member that is hermetically bonded to the substrate. The lid member defines a space filled with the enclosed gas and constitutes the package. The lid member transmits the ultraviolet light emitted from the LED.

Abstract: A semiconductor device includes a case enclosing a region where a semiconductor element as a component of an electric circuit exists. A resin part is fixed to an inside of the case in contact with the region. The resin part is provided with a conductive film, which is a part of the electric circuit. The conductive film is provided in the resin part so that the conductive film comes into contact with the region.

Abstract: A wiring board includes: a metal plate having first and second surfaces opposite to each other, and having at least one through-hole penetrating through the first and second surfaces; at least one conductive via respectively disposed in the through-hole and spaced apart from the metal plate; an insulating structure including at least one through-insulating portion disposed between the through-hole and the conductive via, and a first insulating layer and a second insulating layer extending from the through-insulating portion and disposed in first regions surrounding the conductive via, on the first surface and the second surface, respectively; at least one first upper pad disposed on the first insulating layer and electrically connected to the conductive via; at least one first lower pad disposed on the second insulating layer and electrically connected to the conductive via; a second upper pad disposed on the first surface of the metal plate; and a second lower pad disposed on the second surface of the metal

Abstract: Solid-state radiation transducer (SSRT) devices having buried contacts that are at least partially transparent and associated systems and methods are disclosed herein. An SSRT device configured in accordance with a particular embodiment can include a radiation transducer including a first semiconductor material, a second semiconductor material, and an active region between the first semiconductor material and the second semiconductor material. The SSRT device can further include first and second contacts electrically coupled to the first and second semiconductor materials, respectively. The second contact can include a plurality of buried-contact elements electrically coupled to the second semiconductor material. Individual buried-contact elements can have a transparent portion directly adjacent to the second semiconductor material. The second contact can further include a base portion extending between the buried-contact elements, such as a base portion that is least partially planar and reflective.

Abstract: An electronic device including a light emitting element, a wavelength conversion layer, a conductive wire and a wavelength selection layer is provided by the present disclosure. The light emitting element is configured to emit a light. The wavelength conversion layer is configured to convert the light. The conductive wire is electrically connected to the light emitting element. The wavelength selection layer is disposed between the conductive wire and the wavelength conversion layer, wherein the conductive wire is cured by an energy beam, and the wavelength selection layer is configured to block the energy beam.

Abstract: An LED device includes an epitaxial layered structure, a current spreading layer, a first insulating layer and a reflective structure. The current spreading layer is formed on a surface of the epitaxial layered structure. The first insulating layer is formed over the current spreading layer, and is formed with at least one first through hole to expose the current spreading layer. The reflective structure is formed on the first insulating layer, extends into the first through hole, and contacts with the current spreading layer. The current spreading layer is formed with at least one opening structure to expose the surface of the epitaxial layered structure.

Abstract: A lead frame includes: a frame body; a plurality of leads individually projecting from the frame body; and a recess formed across one surfaces of the leads adjacent to each other with the frame body therebetween, the recess including a first recess, and a second recess partially overlapping the first recess in a bottom surface thereof and having a smaller depth than the first recess.

Abstract: An LED module according to the present invention includes an LED unit 2 and a case 1, where the LED unit includes an LED chip 21, and the case 1 includes a main body 11 made of a ceramic material and a pad 12a on which the LED unit 2 is mounted. The outer edge 121a of the pad 12a is positioned inward of the outer edge 2a of the LED unit 2 as viewed in plan. These arrangements prevent the light emission amount of the LED module A1 from reducing with time.

Abstract: A light-emitting device includes an insulating base member having thermal conductivity of 10 W/m·K or more; a light-emitting element that has a cathode electrode and an anode electrode and is provided on a front surface side of the base member; a capacitive element that is provided on the base member and supplies an electric current to the light-emitting element; and a reference potential wire that is provided on a rear surface side of the base member and is connected to an external reference potential. The reference potential wire is connected to the capacitive element and is insulated from the cathode electrode and the anode electrode.

Abstract: A light-emitting device includes: a plurality of light sources configured to be disposed on a substrate; a light diffusion member configured to commonly cover the plurality of light sources; and a plurality of wavelength conversion members configured to be disposed between the light sources and the light diffusion member in a thickness direction and disposed in regions corresponding to the plurality of light sources in a plane, respectively, and configured to convert light with a first wavelength from the light sources into light with a second wavelength.

Abstract: Disclosed is a light-emitting diode which includes a light-emitting epitaxial layered unit, an insulation layer, a transparent conductive layer, a protective layer, a first electrode, and a second electrode. The light-emitting epitaxial layered unit includes a first semiconductor layer, a second semiconductor layer, and a light-emitting layer sandwiched between the first and second semiconductor layers, and has a first electrode region which includes a pad area and an extension area. The insulation layer is disposed on the first semiconductor layer and at the extension area of the first electrode region. Also disclosed is a method for manufacturing the light-emitting diode.

Abstract: A lighting device disclosed in an embodiment of the invention includes a substrate; a plurality of light emitting devices on the substrate; a first reflective layer on the substrate; a resin layer on the first reflective layer and including a first surface from which light emitted from the light emitting device is extracted; a second reflective layer on the resin layer; and a light extraction layer on the first surface of the resin layer, wherein the first surface of the resin layer has a convex portion having a convex exit surface facing to each of the light emitting devices, and concave portions between the convex portions, and the light extraction layer may include a first extraction portion having protrusions on each exit surface, and second extraction portions concave between the plurality of protrusions.

Abstract: A light emitting device includes: a base; a first semiconductor laser element disposed on an upper surface of the base and configured to emit first light; a first light reflecting member disposed on the upper surface of the base, the first light reflecting member having a first light reflecting face including a plane configured to reflect the first light; a second semiconductor laser element disposed on an upper surface of the base and configured to emit second light; a second light reflecting member disposed on the upper surface of the base, the second light reflecting member having a second light reflecting face including a plane configured to reflect the second light; and a phosphor member onto which the first light reflected from the first light reflecting member and the second light reflected from the second light reflecting member are irradiated.

Abstract: A light emitting device includes a base; a plurality of semiconductor laser elements disposed on the base and configured to emit light laterally from the plurality of semiconductor laser elements; a reflecting member disposed on the base and configured to reflect light from the semiconductor laser elements; a surrounding part disposed on the base and surrounding the semiconductor laser elements and the reflecting member; a wiring part disposed on the base so as to extend to a location outside of the surrounding part; a radiating body disposed on the surrounding part and having an opening; and a wavelength converting member that is located in the opening of the radiating body, the wavelength converting member being configured to convert a wavelength of light that is emitted from the plurality of semiconductor laser elements and reflected upward by the reflecting member.

Abstract: An organic light-emitting diode display panel includes a substrate and a light-emitting pixel array disposed on the substrate, and the light-emitting pixel array includes a plurality of light-emitting pixels. Each of the plurality of light-emitting pixels comprises a convex structure layer, a light-emitting element, a planarization layer and a microlens structure which are sequentially stacked on the substrate. The convex structure layer comprises at least one convex structure which is convex in a direction facing away from the substrate and at least one convex surface where each of the at least one convex structure is in contact with the light-emitting element. The microlens structure and convex structure are aligned each other that their vertical projections on the substrate overlap with a vertical projection of the light-emitting element on the substrate.

Abstract: A lighting device and a method of manufacturing a lighting device are described. A lighting device includes a heat sink providing a first mounting area for at least one LED element, a second mounting area for at least one electrical connection assembly, and a cavity adjacent the first mounting area. An inner part is arranged at least partially inside the cavity and includes at least a first and a second connection terminal and at least one electrical connection path. The first and the second connection terminal are provided on a surface of the inner part. The first connection terminal is arranged between the first mounting area and the second connection terminal. The second connection terminal is arranged between the second mounting area and the first connection terminal. The electrical connection path is provided at least partially inside the inner part connecting the first and second electrical terminal.

Abstract: Provided is a method of manufacturing a semiconductor optical device, which makes it possible to reduce the thickness of a semiconductor optical device including InGaAsP-based III-V compound semiconductor layers containing at least In and P to a thickness smaller than that of conventional devices, and provide a semiconductor optical device. The method of manufacturing a semiconductor optical device includes a step of forming a semiconductor laminate on the InP growth substrate; a step of bonding the semiconductor laminate to the support substrate formed from a Si substrate, with at least the metal bonding layer therebetween; and a step of removing the InP growth substrate.

Abstract: In an embodiment a light-emitting component includes a housing and an edge emitting semiconductor laser arranged in the housing, wherein the semiconductor laser is configured to emit light at a side face in an angle range, wherein the housing includes an emission opening for emitting the light, wherein the semiconductor laser is arranged in a first layer having a first material, wherein a second layer is arranged on the first layer, the second layer having a second material, wherein the first layer and the second layer are transmissive to the light, wherein the second layer is arranged between the first layer and the emission opening, wherein the emission opening lies at least partly outside the angle range of the semiconductor laser, and wherein a part of the light is directed directly onto an interface between the first and second layers.

Abstract: A light emitting element housing package of the present disclosure includes a base part including a first surface including a first recessed part for mounting a light emitting element. Surface roughness Sa of at least such a region of a bottom surface of the first recessed part that is opposite to a light emitting element mounted on the first recessed part is smaller than surface roughness Sa of a region other than the first recessed part of the first surface. Further, a light emitting device of the present disclosure includes the light emitting element housing package and a light emitting element housed in the light emitting element housing package. Further, a light emitting module of the present disclosure includes the light emitting device and a module substrate on which the light emitting device is mounted.

Abstract: An object of the present invention is to provide an optical device that can accomplish both the effect of preventing external light reflection and the improvement of utilization efficiency of light emitted from an organic electroluminescent element. The object is achieved by an optical device having an organic electroluminescent substrate, a circularly polarized light-separating layer that has a liquid crystal alignment pattern, in which the direction of an optical axis derived from a liquid crystal compound changes while continuously rotating in one direction in a plane, and separates light into right-handed circularly polarized light and left-handed circularly polarized light, a patterned retardation layer that converts circularly polarized light into linearly polarized light and has a plurality of regions among which the direction of a slow axis varies in the same plane, and a polarizer.

Abstract: A light emitting device includes: a light emitting element having a dominant wavelength in a range greater than or equal to 380 nm and less than or equal to 470 nm; a wavelength conversion member that is disposed on the light emitting element and includes: a translucent member, and a first fluorescent material layer interposed between the light emitting element and the translucent material, the first fluorescent material layer comprising a resin that contains a first fluorescent material, and the first fluorescent material comprising at least one compound selected from (Ca, Sr)AlSiN3: Eu and (Ca, Sr, Ba)2Si5N8: Eu; and a covering member that covers sides of the wavelength conversion member and surrounds the light emitting element, the covering member comprising light reflecting material and a second fluorescent material, and the second fluorescent material comprising at least one compound selected from (Ca, Sr)AlSiN3: Eu and (Ca, Sr, Ba)2Si5N8: Eu.

Abstract: The invention relates to a light emitting device (LED), especially a LED at least partly embedded in transparent or translucent silicone fill, whereby the embedded LED is housed in a white silicone housing. Here and in the following, the wording transparent silicone fill always means a transparent or translucent silicone material. The invention further relates to a method for embedding the LED partly in a white silicone housing on the one hand and partly in transparent silicone fill on the other hand. The invention finally relates to the transparent silicone fill. The inner part of the LED device is at least partly embedded in transparent silicone fill, wherein the at least partly embedded LED device is housed in a white silicone housing comprising a white box silicone. A part of the inner part of the LED device is embedded in the white box silicone.

Abstract: A light source assembly, a backlight module, and a display device are provided in the field of display technology. The light source assembly includes a light source and a collimator. The collimator is arranged on a side of the light source where a light-emergent surface is located. When light emitted from the light source is incident on a preset surface of the collimator, a first included angle is formed between the light and the light-emergent surface. When the light is emitted out of the preset surface, a second included angle is formed between the light and the light-emergent surface. The first included angle is less than the second included angle, and the amount of light incident on per unit area of the preset surface is greater than a preset light amount threshold.

Abstract: A solid state lamp for retrofit of an HID includes a circumferential array of solid state light sources mounted on circuit boards, a heat sink located in the lamp's interior volume, and a fan positioned in the interior volume to force airflow across the heat sink. A capper assembly includes at least one aperture to vent the interior volume, and an intermediate circuit board within the capper assembly. The intermediate circuit board distributes electrical power to the circuit boards by tabs and contacts extending from the boards that are mechanically bonded together. An optical transmissive shield is positioned exterior to the circumferential array, and can include prismatic structures to direct light emitted from the LED sources in an off axis direction.

Abstract: A light source module includes a plurality of light emitting dies provided on a bearing surface of a substrate, an encapsulation layer covering the bearing surface and the light emitting dies, a plurality of reflecting recesses respectively formed opposite the plurality of light emitting dies on a light exit surface of the encapsulation layer and having a surrounding surface inclined relative to the light exit surface, and a plurality of reflection patterns respectively disposed in the plurality of reflecting recesses. A display panel might be coupled to the light emitting surface.

Abstract: An appliance includes a user interface assembly. The user interface assembly includes a plurality of indicator lights mounted on a printed circuit board. An opaque material is disposed within the printed circuit board between adjacent indicator lights of the plurality of indicator lights. The adjacent indicator lights are optically separated by the opaque material.

Abstract: Laterally insulated integrated circuit chips are fabricated from a semiconductor wafer. Peripheral trenches are formed in the wafer which laterally delimit integrated circuit chips to be formed. A depth of the peripheral trenches is greater than or equal to a desired final thickness of the integrated circuit chips. The peripheral trenches are formed by a process which repeats successive steps of a) ion etching using a sulfur hexafluoride plasma, and b) passivating using an octafluorocyclobutane plasma. Upon completion of the step of forming the peripheral trenches, lateral walls of the peripheral trenches are covered by an insulating layer of a polyfluoroethene. A thinning step is performed on the lower surface of the wafer until a bottom of the peripheral trenches is reached. The insulating layer is not removed.