Abstract: The described technology includes a side emitting light emitting diode (LED) package with a bevel light emitting surface, and LED displays including the disclosed LED packages. The LED package can include a substrate, an LED chip, a light converter, and a cap. The LED chip can be positioned over the substrate, and the light converter can comprise a transparent material also positioned over the substrate and surrounding the LED chip. The cap can be positioned over the light converter to inhibit emission of light perpendicular to the surface of the substrate. The outer side surfaces of the light converter can be inclined, so that the light converter is wider at the base than at the top. The incline angle can be selected to collimate emitted light. LED displays including the disclosed LED packages can include multiple LED packages affixed to a printed circuit board (PCB) along with other components.

Abstract: The invention relates to an illuminating device (1) comprising a substrate (2), a non-transparent spacer (4) which is connected to the substrate (2) so as to be hermetically sealed, an opening in the spacer (4), opposite said substrate (2), and an illumination element (3) positioned beneath the spacer (4) and beneath the opening, which element is connected to the substrate (2) so as to be hermetically sealed, characterized in that the opening in the spacer (4) is closed, so as to be hermetically sealed, by an optical element (5) consisting of a glass material the volume of which comprises at least one luminophore and thus constitutes a luminescent composite glass material.

Abstract: A sterilization module includes a main body having an opening on the top surface thereof, a transparent member which is arranged on the inside of the main body so as to cover the opening, and through which light passes, an inner sealing member which is made of an elastic material and which covers the side surface of the transparent member, a light emitting module that comprises a substrate and a light emitting element installed on the upper surface of the substrate, and which emits light through the transparent member, and an inner holder which is fastened to the inner side surface of the main body and fixes the light emitting module to the inside of the main body.

Abstract: A light emitting device includes a package for surface mounting, the package including at least three leads defining a first recess, a second recess, and a third recess. A first light emitting element is disposed in the first recess and emits first light, a second light emitting element is disposed in the second recess and emits second light, and a third light emitting element is disposed in the third recess and emits third light. A first colored resin member is disposed in the first recess, a second colored resin member is disposed in the second recess, and a third colored resin member is disposed in the third. A mold resin including a first lens portion, a second lens portion, and a third lens portion each overlapping a recess of a respective one of the plurality of leads.

Abstract: A light emitting device includes a substrate, a conductive layer, first and second reflective layers, a light emitting element, and an encapsulation layer. The conductive layer is disposed on the substrate. The first reflective layer covers the conductive layer and has an opening exposing a portion of the conductive layer. The light emitting element is disposed in the opening and electrically connects to the conductive layer. The second reflective layer is disposed on the first reflective layer and surrounds the light emitting element. The second reflective layer has an outer diameter. A top surface of the second reflective layer is lower than a top surface of the light emitting element. The encapsulation layer covers the light emitting element. There is a height between a highest point of the encapsulation layer and an upper surface of the first reflective layer. The encapsulating layer is directly contact with the outer diameter.

Abstract: A display device includes a display panel including a display area and a non-display area surrounding the display area, and a metal wiring layer disposed on at least a portion of the non-display area, an encapsulation substrate disposed on the display panel, a sealing member which is disposed between the display panel and the encapsulation substrate and bonds the display panel to the encapsulation substrate and a first fusion region provided in at least a partial region between the sealing member and the encapsulation substrate, where the first fusion region has no physical boundary, and where at least a portion of the sealing member is disposed on the metal wiring layer in the non-display area, and the first fusion region is separated from the metal wiring layer while overlapping the metal wiring layer in a thickness direction.

Abstract: A plurality of waveguide structures are formed in at least one silicon layer of a first member. The first member includes: a first surface of a first silicon dioxide layer that is attached to a second member that consists essentially of an optically transmissive material having a thermal conductivity less than about 50 W/(m·K), and a second surface of material that was deposited over at least some of the plurality of waveguide structures. An array of phase shifters is formed in one or more layers of the first member. An array of temperature controlling elements are in proximity to the array of phase shifters.

Abstract: A light emitting apparatus includes a substrate, a plurality of light emitting structures, a window, and a reflector. The substrate has a luminous region and a non-luminous region. The plurality of light emitting structures is disposed on the luminous region of the substrate. The window has a dome shape and is disposed to cover the luminous region. The window is configured to control a traveling path of light emitted from the a plurality of light emitting structures. The reflector is configured to support the window and reflect the light emitted from the plurality of light emitting structures. The reflector has an opening that exposes the plurality of light emitting structures mounted on the substrate. A distance between two adjacent light emitting structures of the plurality of light emitting structures is 500 micrometers or less.

Abstract: A light-emitting module includes a light-guiding plate having an upper surface with a first hole and having a rectangular shape in a top view, and a light-emitting element opposite to the first hole and disposed opposite to the upper surface. The first hole includes a first portion and a second portion between the first portion and the upper surface. The first portion is provided with a first opening at a boundary between the first portion and the second portion and a first lateral surface inclined with respect to the upper surface. A shape of the first opening in the top view is defined by a first axis parallel to a short side of the rectangular shape of the light-guiding plate and a second axis parallel to a long side of the rectangular shape and shorter than the first axis in a plan view.

Abstract: A circular car side LED projection lamp installed onto a car body and used as a warning light includes a lamp base, a light panel, a light guide frame and a lamp cover. Both light panel and light guide frame are installed in the lamp base, covered by the lamp cover, and connected to the lamp base. The light panel has a drive circuit and plural first LEDs connected to the drive circuit, spaced from each other, and arranged on at least two opposite sides of the light panel. The light guide frame is covered onto the light panel, and two opposite sides of its inner frame perimeter are in a serrated shape with convex teeth extending downwardly to form a light guide part which is covered onto each first LED to receive and guide a beam from each first LED to form a side light.

Abstract: An optoelectronic device includes a substrate, an optoelectronic semiconductor component being arranged on the substrate and having a light-emitting surface, preferably on the upper side of the optoelectronic semiconductor component, and a cover being arranged on the substrate for covering the optoelectronic semiconductor component, the cover providing a cavity which surrounds the optoelectronic semiconductor component when the cover is arranged on the substrate, the cover having at least one channel which extends along a first direction in the cover from the outside to the cavity, and the first direction being not parallel to the substrate and preferably extending at least approximately perpendicular to the substrate.

Abstract: A lighting apparatus comprises a plurality of light modules; each module comprises: a hollow body provided with a light box having a light exit opening and housing a LED light source controlled by a control unit; a diffusing screen positioned on the opening to uniform the light passing through the opening; a closure cover, positioned above the diffusing screen; a transparent capacitive film positioned on a face of the closure cover and connected to the control unit to define a touch control device of the module; the modules are shaped as respective polyhedral sectors arranged around the first axis and each module defines an independent light module controlled by the respective touch control device independently of the other modules.

Abstract: A light guide plate, a backlight module and a display device in the field of display technology are provided. The light guide plate includes a light guide plate body and a prism structure located at at least one end of the light guide plate body. The prism structure includes a light incident surface and at least one reflective surface, and incident light from the light incident surface is can be reflected by the at least one reflective surface into the light guide plate body.

Abstract: A light shaping article includes a solid optic having a cross-sectional profile including an input interface; a convex output surface opposite the input interface; a concave first side surface extending between the input interface and the convex output surface; and a second side surface opposite the concave first side surface extending from between input interface to the convex output surface. The concave first side surface and the convex output surface are configured such that, when the solid optic receives input light having an input angular range in a plane of the cross-sectional profile, the solid optic guides the light to and emits the light from the output surface in an output angular range in the plane. A prevalent propagation direction of output light in the output angular range is tilted toward the second side surface relative to a prevalent propagation direction of input light in the input angular range.

Abstract: Disclosed are an LED light source, an LED light source manufacturing method, and their direct display device. The LED light source includes a base, at least an LED chip, an anti-vulcanization structure, a light excitation structure, an encapsulation structure and a protection structure. The LED light source can overcome catalyst poison or vulcanization of the light-emitting material effectively to improve product yield and reliability of the LED light source. In the meantime, the LED light source has the feature of a better light emission performance.

Abstract: Disclosed are an LED light source, an LED light source manufacturing method, and their direct display device. The LED light source includes a base, at least an LED chip, an anti-vulcanization structure, a light excitation structure, an encapsulation structure and a protection structure. The LED light source can overcome catalyst poison or vulcanization of the light-emitting material effectively to improve product yield and reliability of the LED light source. In the meantime, the LED light source has the feature of a better light emission performance.

Abstract: A light-emitting device comprises a first optical element covering an LED and covered by a second optical element. The first optical element has: a first incident surface on which light emitted from the LED is incident; a recessed first reflecting surface, above the first incident surface, and reflecting to the side the light is incident via the first incident surface from the LED; and a first emitting surface across the periphery of the first reflecting surface, which emits the light from the first reflecting surface. The second optical element has: an incident-reflecting surface formed by, concentric second incident surfaces on which light emitted from the first emitting surface is incident, and second reflecting surfaces alternately with the second incident surfaces, that reflect upward the light incident on the second incident surfaces; and a second emitting surface above the incident-reflecting surface, that emit light reflected by the second light reflecting surfaces.

Abstract: A light-emitting device comprises a first optical element covering an LED and covered by a second optical element. The first optical element has: a first incident surface on which light emitted from the LED is incident; a recessed first reflecting surface, above the first incident surface, and reflecting to the side the light is incident via the first incident surface from the LED; and a first emitting surface across the periphery of the first reflecting surface, which emits the light from the first reflecting surface. The second optical element has: an incident-reflecting surface formed by, concentric second incident surfaces on which light emitted from the first emitting surface is incident, and second reflecting surfaces alternately with the second incident surfaces, that reflect upward the light incident on the second incident surfaces; and a second emitting surface above the incident-reflecting surface, that emit light reflected by the second light reflecting surfaces.

Abstract: An optical diffuser for a light may comprise an optical body having a substantially flat base at one end thereof and a complex lens structure at the opposing end thereof. The complex lens may have a plurality of curved optical surfaces and may produce a beam of light having a non-uniform light intensity. The optical diffuser may be attached to a light by a holder, and the holder may be movable on the light to place the optical diffuser in front of a light source.

Abstract: The present disclosure provides a semiconductor device for high efficiently releasing heat generated from a semiconductor element to the outside.

Abstract: Disclosed are an optical member and a backlight unit including the same, the optical member comprising: a lens including a first optical surface, a second optical surface facing the first optical surface, and a third optical surface interconnecting the first optical surface and second optical surface; and a cover which is disposed on the second optical surface and has a light transmittance of 5 to 30%.

Abstract: Lighting system. Bowl reflector has rim defining horizon and aperture, first light-reflective surface defining cavity, first parabolic surface. Funnel reflector has flared funnel-shaped body: central axis; second light-reflective surface aligned along axis; second parabolic surface; tip located within cavity along axis; profile including parabolic curves converging towards tip. Optically-transparent body aligned with second light-reflective surface along axis; with: bases spaced apart by side surface; first base facing light source. Second parabolic surface has ring of focal points at first position within cavity, equidistant from second parabolic surface; ring encircles first point on axis. Second parabolic surface has axes of symmetry intersecting with and radiating in directions all around axis from second point. Axes of symmetry intersect with focal points. Second point on axis between first point and horizon.

Abstract: A planar illumination apparatus includes: a plurality of light sources that are disposed linearly and that emit light; and a light guide plate that has a lateral surface on which the light sources are disposed so as to face the lateral surface and includes extended portions each extending in directions in which the extended portions are spaced away from each other from both ends of the lateral surface and are away from the light sources. The light guide plate has a light emitting region that is either in contact with a boundary or disposed on a side opposite to one of the extended portions with respect to the boundary, in which the boundary is established between an emission range of an end portion light source on a side adjacent to the extended portion and a region different from the emission range.

Abstract: A spacer member is provided within a display apparatus that includes a heat-emitting light source and a thermally deformable light guide plate. In one embodiment, the spacer member includes a pair of spacer members disposed at sides of the light source and engaging the light guide plate so as to space the light source from a light receiving incident surface of the PGP by a predetermined distance.

Abstract: Embodiments provide a light-emitting device package including at least one light source and a lens disposed on the light source. The lens includes a lower surface facing the light source, an upper surface opposite to the lower surface, and a side surface located between the lower surface and the upper surface, the side surface having at least one indented portion.

Abstract: A lighting device including: a source emitting a light cone; an electronic control circuit; a wall defining an enclosure including a first area through which the light cone passes, and a second area complementary to the first area; and a diffuser directing part of the light by backscattering towards the second area. The diffuser includes a first part oriented perpendicular to the axis of revolution of the light cone and forming a first divergent lens, and a second part forming a second divergent lens having a shape of a flared truncated cone with its axis of revolution parallel to the axis of revolution of the light cone, in which a larger diameter end is closest to the light source and a smaller diameter end is adjacent to the first part and surrounds the first part.

Abstract: An illumination tens includes a light incident surface that defines a cavity and has a flat top surface and lateral flanks, the light incident surface configured to receive light from an underlying light emitting element, a light exiting surface having a central indentation and surrounding toroid, and a bottom surface connecting the light incident surface and the light exiting surface. The lateral flank includes a first region extending from the top surface and a second region extended from the first region, the second region is a curved surface, of which the center of the curvature thereof lies on the illumination lens, an intersection of the second region and a horizontal optical axis forms a first point, and the first point is disposed lower than a second point where the bottom surface and the light exiting surface intersect.

Abstract: A lens includes a light incident surface and a light output surface. The light incident surface includes a first region having points equidistant from the central point of a light emission surface of the light emitting element. The first region satisfies ?a??1??b, wherein ?1 is a first incident angle of any light emitting from the light emitting element. In a second region with 0°<?1??b+20°, the first incident angle of light having a minimum value of ?2/?1 is between ?a and ?b, and ?2/?1>0.9. In a third region with 0°<?1??b+10°, the first incident angle of light having a minimum value of ?3/?1 is between ?a and ?b, and ?3/?1>0.9. ?2 is a second incident angle of the light of ?1 when traveling in the lens, and ?3 is a third incident angle of the light of ?1 when emitting out of the lens.

Abstract: A semiconductor device package having a cavity formed using film-assisted molding techniques is provided. Through the use of such techniques the cavity can be formed in specific locations in the molded package, such as on top of a device die mounted on the package substrate or a lead frame. In order to overcome cavity wall angular limitations introduced by conformability issues associated with film-assisted molding, a gel reservoir feature is formed so that gel used to protect components in the cavity does not come in contact with a lid covering the cavity or the junction between the lid and the package attachment region. The gel reservoir is used in conjunction with a formed level setting feature that controls the height of gel in the cavity. Benefits include decreased volume of the cavity, thereby decreasing an amount of gel-fill needed and thus reducing production cost of the package.

Abstract: An organic light emitting display panel includes a substrate, an organic light emitting diode disposed on a first side of the substrate, and a first light scattering layer disposed on a second side of the substrate opposite to the first side of the substrate, where the first light scattering layer includes a transparent thin layer including an indium, and a plurality of first micro-lenses is disposed on a plasma-treated side of the first light scattering layer.

Abstract: A light-emitting device includes a light-emitting element mounted on a lead frame, and a sealing material sealing the light-emitting element and having a thickness of not more than 1 mm and including a silicone resin as a main component. The sealing material includes a first gas barrier layer that a physical property value obtained by dividing a difference between a value of an average spin-spin relaxation time of 1H nuclei at a resonance frequency of 25 MHz at 140° C. and that at 25° C. by 115 is not more than 3.5 and the average spin-spin relaxation time at 140° C. is not more than 500 ?sec.

Abstract: According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a p-side electrode, an n-side electrode, a phosphor layer, and a transparent film. The semiconductor layer has a first face, a second face opposite to the first face, and a light emitting layer. The p-side electrode is provided on the second face in an area including the light emitting layer. The n-side electrode is provided on the second face in an area not including the light emitting layer. The phosphor layer is provided on the first face. The phosphor layer includes a transparent resin and phosphor dispersed in the transparent resin. The transparent film is provided on the phosphor layer and has an adhesiveness lower than an adhesiveness of the transparent resin.

Abstract: A light-emitting device includes a first semiconductor layer; an active layer formed on the first semiconductor layer; a second semiconductor layer formed on the active layer; and a first pad formed on the second semiconductor layer, wherein the second semiconductor layer comprises a first region right under the first pad and a plurality of voids formed in the first region, wherein the region outside the first region in the second semiconductor layer is devoid of voids, and an area of the first region is smaller than that of the first pad in top view and the area of the first pad is smaller than that of the second semiconductor layer in top view, and the light emitted from the active layer is extracted from a top surface of the second semiconductor layer opposite the first semiconductor layer.

Abstract: According to an embodiment, a semiconductor light emitting device includes a semiconductor layer, a p-side electrode, n-side electrode and a resin layer. The semiconductor layer has a first face and a second face opposite to the first face, and includes a light emitting layer. The p-side electrode is provided on the semiconductor layer on the second face side. The n-side electrode is provided on the semiconductor layer on the second face side. The resin layer is provided on the first face and transmits light emitted from the light emitting layer, the resin layer including a top surface opposite to the first face and four side faces provided along an outer edge of the first face and connected to the top surface, the resin layer including a scattering substance scattering the light emitted from the light emitting layer.

Abstract: An LED includes a base, a pair of leads fixed on the base, a housing fixed on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity in a central area thereof and a chamber adjacent to a circumferential periphery thereof. Top faces of the leads are exposed in the chamber. A blocking wall is formed in the chamber to contact the exposed top faces of the leads. A bonding force between the blocking wall and the leads is larger than that between the leads and the housing.

Abstract: A light emitting device includes a first resin layer which is made of transparent resin and provided outside a solid-state light-emitting element mounted on a mounting substrate; and a second resin layer which is provided outside the first resin layer and made of transparent resin that contains a phosphor which is excited with a luminescence wavelength of the solid-state light-emitting element, wherein when the refractive index of the solid-state light-emitting element is set to be N1, the refractive index of the first resin layer is set to be N2, and the refractive index of the second resin layer is set to be N3, the relationship of N1?N2?N3?1 is established.

Abstract: A light-emitting panel includes: a substrate; and a light-emitting functional multilayer formed on the substrate, wherein the light-emitting functional multilayer including a first functional layer and a second functional layer, a thickness of part of the first functional layer positioned in a first light-emitting region is smaller than a thickness of part of the first functional layer positioned in a second light-emitting region, a thickness of part of the second functional layer positioned in the first light-emitting region is greater than a thickness of part of the second functional layer positioned in the second light-emitting region, and when the light-emitting functional multilayer is viewed in a layering direction thereof, the first light-emitting region and the second light-emitting region are adjacent or distant from each other in a direction perpendicular to the layering direction, and each include a plurality of pixels that are each composed of a plurality of adjacent sub-pixels.

Abstract: Various embodiments of the present invention are directed to optical devices comprising planar lenses. In one aspect, an optical device includes two or more planar lenses (208,209), and one or more dielectric layers (210-212). Each planar lens includes a non-periodic, sub-wavelength grating layer (1110), and each dielectric layer is disposed adjacent to at least one planar lens to form a solid structure. The two or more planar lenses are substantially parallel and arranged to have a common optical axis (214) so that light transmitted through the optical device substantially parallel to the optical axis is refracted by the two or more planar lenses.

Abstract: A light emitting diode (LED) includes a substrate, a buffer layer and an epitaxial structure. The substrate has a first surface with a patterning structure formed thereon. The patterning structure includes a plurality of projections. The buffer layer is arranged on the first surface of the substrate. The epitaxial structure is arranged on the buffer layer. The epitaxial structure includes a first semiconductor layer, an active layer and a second semiconductor layer arranged on the buffer layer in sequence. The first semiconductor layer has a second surface attached to the active layer. A distance between a peak of each the projections and the second surface of the first semiconductor layer is ranged from 0.5 ?m to 2.5 ?m.

Abstract: A light emitting device includes a light emitting element that emits light having a wavelength of 250 nm to 500 nm and a fluorescent layer that is disposed on the light emitting element. The fluorescent layer includes a phosphor having a composition expressed by the equation, ((M1?x1Eux1)3?ySi13?zAl3+zO2+uN21?w), and an average particle diameter of 12 ?m or more, wherein in the equation, M is an element that is selected from IA group elements, IIA group elements, IIIA group elements, IIIB group elements except Al, rare-earth elements, and IVB group elements, and x1, y, z, u, and w satisfy each of the inequalities simultaneously, that is to say each of the following inequalities is satisfied by the choice of values of the identified paramaters within the noted ranges of 0<x1<1, ?0.1<y<0.3, ?3<z?1, ?3<u?w?1.5, 2<u, w<21.

Abstract: A light emitting die package and a method of manufacturing the die package are disclosed. The die package includes a leadframe, at least one light emitting device (LED), a molded body, and a lens. The leadframe includes a plurality of leads and has a top side and a bottom side. A portion of the leadframe defines a mounting pad. The LED device is mounted on the mounting pad. The molded body is integrated with portions of the leadframe and defines an opening on the top side of the leadframe, the opening surrounding the mounting pad. The molded body further includes latches on the bottom side of the leadframe. The lens is coupled to the molded body. A composite lens is used as both reflector and imaging tool to collect and direct light emitted by LED(s) for desired spectral and luminous performance.

Abstract: A light emitting device and method of manufacture are described. In an embodiment, the light emitting device includes a micro LED device, a light pipe around the micro LED device to cause internal reflection of incident light from the micro LED device within the light pipe, and a wavelength conversion layer comprising phosphor particles over the light pipe. Exemplary phosphor particles include quantum dots that exhibit luminescence due to their size, or particles that exhibit luminescence due to their composition.

Abstract: A lighting device includes a semiconductor light emitting device (LED) configured to emit light having a first peak wavelength upon the application of a voltage thereto, an element in adjacent, spaced-apart relationship with the LED, and a pattern of discrete lumiphor-containing regions on a surface of, or within, the element. The lumiphor-containing regions are configured to receive light emitted by the LED and convert at least a portion of the received light to light having a longer wavelength than the first peak wavelength. The remote element may be a lens, a reflective element, or a combination thereof.

Abstract: This invention discloses an infrared light-emitting diode. The infrared light-emitting diode comprises: only one core for emitting infrared light; a packaging body which at least comprises a first surface that is convex and in front of the core and a second surface that is plane and on one side of the core; and leads connected to the core and extending to outside of the packaging body; wherein the infrared light emitted by the core forms at least two beams of infrared light in different directions after being emitted from the packaging body through the first surface and the second surface. With such infrared LED and the touch screen, touch system and interactive display based on the LED, at least two beams of infrared light in different directions can be emitted requiring only one core.

Abstract: Processing for a silicon photonics wafer is provided. A silicon photonics wafer that includes an active silicon photonics layer, a thin buried oxide layer, and a silicon substrate is received. The thin buried oxide layer is located between the active silicon photonics layer and the silicon substrate. An electrical CMOS wafer that includes an active electrical layer is also received. The active silicon photonics layer of the silicon photonics wafer is flip chip bonded to the active electrical layer of the electrical CMOS wafer. The silicon substrate is removed exposing a backside surface of the thin buried oxide layer. A low-optical refractive index backing wafer is added to the exposed backside surface of the thin buried oxide layer. The low-optical refractive index backing wafer is a glass substrate or silicon substrate wafer. The silicon substrate wafer includes a thick oxide layer that is attached to the thin buried oxide layer.

Abstract: A nitride-based semiconductor light-emitting element disclosed in the present application includes: an active layer having a growing plane which is an m-plane and which is made of a GaN-based semiconductor; and at least one radiation surface at which light from the active layer is to be radiated. The radiation surface has a plurality of protrusions on the m-plane. A base of each of the plurality of protrusions is a region inside a closed curve, and a shape of the base has a major axis and a minor axis. An angle between the major axis and an extending direction of an a-axis of a crystal is not more than 45°.

Abstract: An electromagnetic wave conversion structure consists of a substrate, a plurality of electromagnetic wave conversion units forming a two-dimensional array, a reflective film and a plurality of reflective layers. The substrate has a first surface and a second surface disposed opposite to the first surface. The second surface consists of a plurality of trenches formed in the body of the substrate. Each electromagnetic wave conversion units is disposed in each trench, is used to absorb first electromagnetic waves with a first wavelength and is used to emit second electromagnetic waves with a second wavelength. The first wavelength is shorter than the second wavelength. The reflective film covers the first surface of the substrate and is used to reflect the second electromagnetic wave. Each of the reflective layers is disposed on the sidewall of each trench of the corresponding electromagnetic wave conversion unit.

Abstract: An exemplary LED module includes an LED and a lens covering the LED. The lens includes a light-guiding portion over the LED and retaining portions protruding downwardly from the light-guiding portion. The LED includes a substrate, a first electrode and a second electrode mounted on the substrate, and an LED chip electrically connecting the first electrode and the second electrode respectively. Through holes are defined in the first electrode and the second electrode, respectively. Each retaining portion includes a first rugged portion and a second rugged portion. The retaining portions are inserted into the through holes correspondingly, the first rugged portion connects glue filled in a corresponding through hole, and the second rugged portion abuts the substrate, whereby the lens and the substrate are securely connected together.

Abstract: A semiconductor based component with radiation-emitting properties. A glass substrate (1) is provided, which has a first surface (2) and a second surface (1), where a semiconductor element (5) with radiation-emitting properties is accommodated on the first surface (2). Also disclosed is a method for fabricating a semiconductor based component, with the following steps: providing a glass substrate (1), application of a semiconductor element (5) to the first surface (2) of the glass substrate. Also disclosed is a receptacle for a semiconductor based component in which two electrical contact areas (13) are provided, which can be electrically connected to contact areas (7) of the semiconductor based component.

Abstract: The present invention provides a chip module structure for particles protection. The structure includes a substrate. A chip is configured on the substrate, with a sensing area. A holder is disposed on the substrate, wherein the holder has a first rib. A transparent material is disposed on the holder, substantially aligning to the sensing area. A lens holder is disposed on the holder, and a lens is configured on the lens holder, substantially aligning to the transparent material and the sensing area. The lens has a second rib, wherein the second rib is disposed corresponding to the first rib for blocking particles entering into the chip module structure.