Abstract: A capacitor forming method includes forming an electrically conductive support material over a substrate, with the support material containing at least 25 at % carbon. The method includes forming an opening through at least the support material where the opening has an aspect ratio of at least 20:1 within a thickness of the support material. After forming the opening, the method includes processing the support material to effect a reduction in conductivity, and forming a capacitor structure in the opening.

Abstract: An integrated capacitive device includes an electrically conducting comb, at least some of whose teeth form first electrodes of capacitors, and electrically conducting fingers extending between the teeth of the comb so as to form second electrodes of the capacitors. The device includes a first finger-teeth set having a single reference finger forming a reference capacitor having a reference capacitive value, at least one second finger-teeth set including several fingers, the reference finger and the number of fingers of the second finger-teeth set or sets forming a geometric series with ratio two. At least one additional set includes a single additional finger forming, with at least one tooth of the comb, an additional capacitor having an additional capacitive value substantially equal to half the reference capacitive value.

Abstract: An energy storage device includes a plurality of unit cells stacked therein, each of the unit cells including a cell body, a positive terminal disposed at one side of the cell body, and a negative terminal disposed in the cell body to form a constant rotation angle with the positive terminal with reference to a center of the cell body, wherein the plurality of cell units are stacked in such a manner that another unit cell is rotated as much as the constant rotation angle with reference to one unit cell. Temperature distribution, that is, heat distribution in the energy storage device can be kept even, and heat transmission efficiency between the terminals and the external air can be improved and thus cooling efficiency can be improved. Also, a resistance value is reduced by improving a cooling function so that performance and reliability of a product can be improved.

Abstract: Provided are a conductive paste composition for inner electrodes and a method of manufacturing a multilayer ceramic capacitor using the same. The conductive paste composition for inner electrodes includes a metal powder having an average particle size ranging from 50 nm to 300 nm, and 4 to 10 parts by weight of a binder resin. The binder resin contains at least one resin selected from the group consisting of a high-molecular-weight polyvinylbutyral resin having a weight-average molecular weight of 250 thousand to 400 thousand, a low-molecular-weight polyvinylbutyral resin having a weight-average molecular weight of 50 thousand to 150 thousand, and a rosin ester.

Abstract: The present subject matter relates to the use of current splitting and routing techniques to distribute current uniformly among the various layers of a device to achieve a high Q-factor. Such current splitting can allow the use of relatively narrow interconnects and feeds while maintaining a high Q. Specifically, for example a micro-electromechanical systems (MEMS) device can comprise a metal layer comprising a first portion and a second portion that is electrically separated from the first portion. A first terminus can be independently connected to each of the first portion and the second portion of the metal layer, wherein the first portion defines a first path between the metal layer and the first terminus, and the second portion defines a second path between the metal layer and the first terminus.

Abstract: Methods are provided for production of pre-collapsed capacitive micro-machined ultrasonic transducers (cMUTs). Methods disclosed generally include the steps of obtaining a nearly completed traditional cMUT structure prior to etching and sealing the membrane, defining holes through the membrane of the cMUT structure for each electrode ring fixed relative to the top face of the membrane, applying a bias voltage across the membrane and substrate of the cMUT structure so as to collapse the areas of the membrane proximate to the holes to or toward the substrate, fixing and sealing the collapsed areas of the membrane to the substrate by applying an encasing layer, and discontinuing or reducing the bias voltage. CMUT assemblies are provided, including packaged assemblies, integrated assemblies with an integrated circuit/chip (e.g., a beam-steering chip) and a cMUT/lens assembly. Advantageous cMUT-based applications utilizing the disclosed pre-collapsed cMUTs are also provided, e.g.

Abstract: A reaction container for manufacturing a capacitor element, in which the liquid level in each individual chamber (compartment) of a container can be adjusted to the same level, adjustment to achieve uniformity of electrolytic solution in each individual chamber can also be performed, and with which a uniform dielectric layer or a uniform semiconductor layer can be formed with respect to a plurality of conductive members in a stable manner while maintaining a constant range of formation thereof. The reaction container (1) for manufacturing a capacitor element includes a container (2) which accommodates electrolytic solution (19) therein, a partitioning frame (3) which can partition the inside of the container (2) into a plurality of individual chambers (9), negative electrode members (6) individually arranged in each of the individual chambers (9), and a constant-current source (7) electrically connected to the cathode members 6.

Abstract: A negative electrode and a power storage device are provided, which have one of an alloy-based particle and an alloy-based whisker and a carbon film including 1 to 50 graphene layers. A surface of the alloy-based particle or the alloy-based whisker is covered with the carbon film. In addition, a method of manufacturing a negative electrode and a method of manufacturing a power storage device are provided, which have the step of mixing an alloy-based particle or an alloy-based whisker with graphene oxide, and the step of heating the mixture in a vacuum or in a reducing atmosphere.

Abstract: Disclosed is a silicon condenser microphone including a backplate having a plurality of perforations therethrough, a diaphragm opposed from the backplate for forming a capacitor. The diaphragm includes a first part and a second part received in the first part, the second part being capable of vibrating relative to the backplate. The first part is connected to the ground and the second part is connected to a bias voltage.

Abstract: Disclosed herein are a method for pre-doping an anode and a lithium ion capacitor storage device including the same. The method of the present invention includes: disposing lithium metal films and anodes alternately; and charging the lithium metal films and the anodes to directly pre-dope lithium metal contained in the lithium metal films onto the anodes. The lithium ion capacitor storage device is manufactured by the method. According to the present invention, the lithium ion capacitor storage device including the anode can provide a high-capacitance capacitor capable of operating even at a high voltage range of up to 3.8V to 2.0V, and ensure high reliability even in a high-temperature (60° C.) cycle.

Abstract: A capacitor includes a first heating element and a first capacitor region. The first capacitor region includes dielectric layers and internal electrodes. The internal electrodes are arranged between the dielectric layers. The first heating element and the first capacitor region are connected to each other in a thermally conductive manner.

Abstract: A method of producing an electric storage device includes a fastening that includes fastening a laminate that includes a lithium foil and a metal foil to at least one of a first separator and a second separator using a bonding member, and a winding that includes winding the first separator, the second separator, the laminate, a cathode, and an anode to obtain a wound element, one of the first separator and the second separator being disposed between the cathode and the anode.

Abstract: A method of manufacturing a capacitor-embedded printed circuit board that includes fabricating a capacitor substrate having at least one inner electrode formed on one side of a dielectric layer; aligning a semi-cured insulation layer with one side of a core layer, and aligning the capacitor substrate with the semi-cured insulation layer such that the inner electrode faces the semi-cured insulation layer; and collectively stacking the core layer, the semi-cured insulation layer, and the capacitor substrate.

Abstract: A chip capacitor and interconnecting wiring is described incorporating a metal insulator metal (MIM) capacitor, tapered vias and vias coupled to one or both of the top and bottom electrodes of the capacitor in an integrated circuit. A design structure tangibly embodied in a machine readable medium is described incorporating computer readable code defining a MIM capacitor, tapered vias, vias and wiring levels in an integrated circuit.

Abstract: A supercapacitor including at least one first electrode substrate having a surface coated with an active material, and at least one second electrode substrate having a surface coated with the active material, wherein the at least one first electrode substrate has a polarity reverse to that of the at least one second electrode substrate. The at least one first and second electrode substrates are stacked in an alternating arrangement. A plurality of the first electrode substrate having the same polarity or a plurality of the second electrode substrate having the same polarity is connected in parallel. The at least one first and second electrode substrates include stacking portions each having opposite surfaces arranged with a frame-shaped insulating ring. An electrolyte is accommodated in spaces enclosed by the opposite surfaces of each stacking portion of the at least one first and second electrode substrates and each insulating ring.

Abstract: An energy storage device and a method of manufacturing the same are disclosed. The energy storage device includes a circuit board, a conductive cover disposed above the circuit board, a sealing structure, a metal coating layer, and an electrochemical cell. The sealing structure is disposed between the circuit board and the circumference of the conductive cover such that the circuit board, the conductive cover, and the sealing structure together form a sealed space where the electrochemical cell is disposed. The metal coating layer continuously covers a part of the conductive cover, an exposed portion of the sealing structure, and a part of the circuit board. Therefore, even if the energy storage device needs to be heated during a product assembly, the metal coating layer can keep the sealing structure structurally stable, and the electrolyte of the electrochemical cell will not leak; the whole energy storage device therefore can keeps undamaged.

Abstract: A capacitor assembly that is thermally and mechanically stable in high temperature environments is provided. Thermal stability is provided by enclosing and hermetically sealing the capacitor element within a housing in the presence of a gaseous atmosphere that contains an inert gas, thereby limiting the amount of oxygen and moisture supplied to the solid electrolyte of the capacitor. To provide the assembly with good mechanical stability, a polymeric restraint is also employed that is positioned adjacent to and in contact with one or more surfaces of the capacitor element. Without intending to be limited by theory, it is believed that the strength and rigidity of the polymeric restraint can help the capacitor element better withstand vibrational forces incurred during use without resulting in delamination. In this manner, the capacitor assembly is able to better function in high temperature environments.

Abstract: A surface mount electrical interconnect adapted to provide an interface between solder balls on a BGA device and a PCB. A socket substrate is provided with a first surface, a second surface, and a plurality of openings sized and configured to receive the solder balls on the BGA device. A plurality of electrically conductive contact tabs are attached to the socket substrate so that contact tips on the contact tabs extend into the openings. The contact tips electrically couple with the BGA device when the solder balls are positioned in the openings. Vias electrically couple the contact tabs to contact pads located proximate the second surface of the socket substrate. Solder balls are bonded to the contact pads to electrically and mechanically couple the electrical interconnect to the PCB.

Abstract: A powder compaction press having opposed rib and channel punches which are interleaved and a production method are used to produce capacitor elements having a uniform compaction density and which are free of surface imperfections.

Abstract: There is disclosed a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes a multilayer body having a first side and a second side opposite to each other and having a third side and a fourth side connecting the first side to the second side, a plurality of inner electrodes formed in the multilayer body and having distal edges exposed to the first side or the second side, first and second side members formed on the first and second sides to cover the distal edges of the plurality of inner elecrodes, and outer electrodes formed on the third side and the fourth side to be electrically connected to the inner electrodes. An angle between a virtual line connecting the distal edges of the plurality of inner electrodes and the first side member or the second side member is less than 90° (?/2).

Abstract: The present invention is directed to methods for forming an inverter circuit for operating a drive motor of an electric vehicle, which can more effectively reduce the switching noise generated by a power module during the operation of an inverter.

Abstract: A method for forming a capacitor dielectric includes depositing a tantalum oxide layer over a substrate, performing a post-treatment on the tantalum oxide layer to provide the tantalum oxide layer with a tetragonal phase, and depositing a zirconium oxide layer over the tantalum oxide layer such that the zirconium oxide layer has a tetragonal phase.

Abstract: A method for forming a plurality of strips to be used for formulating high-breakdown strength and high-temperature capacitors is disclosed. The method includes forming a metalized substrate having a particular pattern, masking a portion of the metalized substrate, coating the metalized substrate with a dielectric material and removing the masking material and thus the dielectric layer from a portion of the metalized layer to form a contact surface. In lieu of placing a masking material on the metalized substrate, the exposed contact area can be formed by shielding a portion of the metalized substrate while depositing the dielectric layer.

Abstract: The present invention provides a method for fabricating a supercapacitor-like electronic battery. The steps for fabricating a supercapacitor-like electronic battery are as follows. A first current collector is formed on a substrate. A first electrode is formed on the first current collector. A first electrode is formed from a first solid state electrolyte and a first conductive material where the first conductive material is irreversible to the mobile ions contained in the first solid state electrolyte and the first conductive material exceeds the percolation limit. An electrolyte is formed on the first electrode. A second electrode is formed on the electrolyte. The second electrode is formed from a second solid state electrolyte and a second conductive material where the second conductive material is irreversible to the mobile ions contained in the second solid state electrolyte and the second conductive material exceeds the percolation limit. A second current collector is formed on the second electrode.

Abstract: An electronic device package includes first and second electrodes of a package substrate. The first electrode has fingers formed from a first metal level and is configured to operate at a first DC potential. The second electrode has fingers formed from the first metal level interdigitated with the fingers of the first electrode. A via conductively connects the second electrode to a second metal level. The second metal level is configured to operate at a second DC potential. The first and second DC potentials are thereby capacitively coupled through the interdigitated electrodes.

Abstract: A process for preparing a solid electrolytic capacitor comprising application of coverage enhancing catalyst followed by application of a conducting polymer layer. Coverage enhancing catalyst is removed after coating and curing.

Abstract: A method for manufacturing a multilayer electronic component includes a step of preparing a laminate which includes a plurality of stacked insulator layers and a plurality of internal electrodes extending along the interfaces between the insulator layers, and in which an end of each of the plurality of internal electrodes is exposed at a predetermined surface corresponding to one of the first and second end surfaces; a step of forming external electrodes on the predetermined surfaces; and a step of forming thick-film edge electrodes at edge portions. The step of forming external electrodes includes a step of attaching a plurality of conductive particles having a particle size of about 1 ?m or more to the predetermined surfaces of the laminate, and a step of performing plating directly on the predetermined surfaces to which the conductive particles are attached.

Abstract: A method for manufacturing a TiN/Ta2O5/TiN capacitor, including the steps of depositing, on a TiN layer, a Ta2O5 layer by a plasma enhanced atomic deposition method (PEALD), within a temperature range from 200 to 250° C., by repeating the successive steps of: depositing a tantalum layer from a precursor at a partial pressure ranging between 0.05 and 10 Pa; and applying an oxygen plasma at an oxygen pressure ranging between 1 and 2000 Pa.

Abstract: Provided is a method of manufacturing a capacitive electromechanical transducer, including: forming a lower electrode layer on a substrate; forming a sacrificial layer on the lower electrode layer; forming by application a resist layer on the sacrificial layer to form a cavity pattern; forming an insulating layer above regions including a region that contains the resist layer used to form the cavity pattern, and then removing a part of the insulating layer that is formed above the resist layer along with the resist layer, thereby leaving the insulating layer in the other regions than the region where the cavity pattern has been formed; forming a vibrating film above the region where the cavity pattern has been formed and the regions where the insulating layer remains; and removing the sacrificial layer to form a cavity.

Abstract: A MOS RF surveillance and/or identification tag, and methods for its manufacture and use. The tag includes an interposer, an antenna/inductor, and integrated circuitry on the interposer. The integrated circuitry has a lowest layer in physical contact with the interposer. The method of manufacture includes forming a lowest layer of integrated circuitry on an interposer, forming successive layers of the integrated circuitry on the lowest layer of integrated circuitry, and attaching an electrically conductive functional layer to the interposer. Alternatively, an electrically conductive structure may be formed from a functional layer attached to the interposer. The method of use includes causing/inducing a current in the present tag sufficient for it to generate, reflect or modulate a detectable electromagnetic signal, detecting the signal, and optionally, processing information conveyed by the detectable electromagnetic signal.

Abstract: A method for producing a multilayer component is described. A stack of green foils, to which inner electrodes including palladium oxide are applied, is sintered. The sintered stack is provided with a silver paste on two or more sides for outer electrodes that are burned into the sintered stack in a further temperature step.

Abstract: A method of fabricating an electronic device includes selectively forming a glass layer on a ceramic substrate by printing, baking the glass layer, and forming a capacitor on the glass layer, the capacitor including metal electrodes and a dielectric layer interposed between the metal electrodes.

Abstract: There are provided a conductive paste composition for a termination electrode, and a multilayer ceramic capacitor including the same and a manufacturing method thereof. The conductive paste composition includes 100 parts by weight of conductive metal powder and 0.1 to 10 parts by weight of ceramic powder having an average particle size of 50 to 500 nm. The conductive paste composition described above may achieve a high firing density even in the case that it is used in the manufacturing of a thin film, and inhibit the occurrence of blisters, a delamination failure of the termination electrode during calcination of the electrode, thereby producing a compact and thin film.

Abstract: The assembly or design of the energy conductors (103, 104, 502) of a storage element (101, 305, 501) for electric energy has specific assembly or design elements (201, 202, 203, 204, 301, 302, 303, 404, 405, 406, 407, 412, 413), which counteract a polarity reversal of the storage element or storage elements upon assembly of such storage elements with other similar storage elements to form a storage block, or upon connection of a storage block to an energy consumer or energy supplier equipped with corresponding contact or retaining elements.

Abstract: An object is to obtain a dielectric layer constituting material, a capacitor circuit forming piece, etc. in which unnecessary dielectric layer is removed except capacitor circuit parts that improve accuracy of position of an embedded capacitor circuit in a multi-layer printed wiring board. For the purpose of achieving the object, “a method for manufacturing a dielectric layer constituting material characterized in that step a is a step for forming a first electrode circuit by etching a conductor layer on one side of a metal clad dielectric comprising a conductor layer on each side of a dielectric layer; step b is a step for removing the dielectric layer that is exposed between the first electrode circuits to manufacture the dielectric layer constituting material; and the step a is conducted and then the step b is conducted” is adopted.

Abstract: A multilayer ceramic condenser includes a multilayer main body, a first outer electrode, a second outer electrode, a first side part and a second side part. The multilayer main body has a first side, a second side, a third side and a fourth side. The multilayer main body includes a plurality of inner electrodes and a dielectric layer between the inner electrodes. The dielectric layer is formed by a first ceramic dielectric powder. The first side part and the second side part are formed on the second side and the fourth side of the multilayer main body, and formed by a second ceramic dielectric powder having a smaller particle diameter than the first ceramic dielectric powder. A mean grain size of the first side part or the second side part is similar to or smaller than that of the dielectric layer of the multilayer main body.

Abstract: In a capacitor structure and method of forming the same, a first electrode, a second electrode, and a first insulation layer are sequentially formed on a substrate. The first and second electrodes and the first insulation layer are covered with a second insulation layer on the substrate. A first plug is in contact with the second electrode through the second insulation layer. A second plug is in contact with the first electrode through the first and second insulation layer. A third insulation layer is formed on the second insulation layer. Third and fourth comb-shaped electrodes are formed in the third insulation layer. The third electrode is contact with the first plug and the fourth electrode is contact with the second plug while facing the third electrode. Thus, the teeth of the comb-shaped electrodes are alternately arranged and spaced apart in the third insulation layer.

Abstract: Disclosed are a multilayer ceramic condenser and a method of manufacturing a multilayer ceramic condenser. There is provided a method of manufacturing a multilayer ceramic condenser, including: printing a plurality of stripe-type inner electrode patterns on a ceramic green sheet in parallel; forming a laminate by stacking ceramic green sheets on which a plurality of stripe-type inner electrode patterns are formed; cutting the laminate so that a first inner electrode pattern and a second inner electrode pattern are alternately stacked; and forming a first side part and a second side part by applying ceramic slurry in order to cover the side of the laminate to which both the first inner electrode pattern and the second inner electrode pattern are exposed.

Abstract: Disclosed are a multilayer ceramic condenser and a method of manufacturing the same. The method includes printing a plurality of stripe-type inner electrode patterns in parallel on ceramic green sheets; forming a laminate by staking the ceramic green sheets having the plurality of stripe-type inner electrode patterns printed thereon; cutting the laminate in order to have a structure in which first and second inner electrode patterns are alternately stacked; and forming a first side part and a second side part by applying ceramic slurry in order to cover the sides of the laminate to which the first and second inner electrode patterns are exposed.

Abstract: The electrical conductivity of ionically conductive polymers can be increased by polymerizing a mixture of a polymer precursor and an electrolyte in the presence of an electric field. Methods for making ionically conductive polymers can include providing a mixture containing an electrolyte and a polymer precursor, and polymerizing the polymer precursor while applying an electric field to the mixture. Ionically conductive polymers so prepared can be used in electrical devices. Methods for making electrical devices containing the ionically conductive polymers are also described.

Abstract: A high density capacitor and low density capacitor simultaneously formed on a single wafer and a method of manufacture is provided. The method includes depositing a bottom plate on a dielectric material; depositing a low-k dielectric on the bottom plate; depositing a high-k dielectric on the low-k dielectric and the bottom plate; depositing a top plate on the high-k dielectric; and etching a portion of the bottom plate and the high-k dielectric to form a first metal-insulator-metal (MIM) capacitor having a dielectric stack with a first thickness and a second MIM capacitor having a dielectric stack with a second thickness different than the first thickness.

Abstract: A trench capacitor structure is provided. The trench capacitor structure includes a substrate, a trench formed in the substrate, a plurality of scallops formed in the sidewalls of the trench, and at least one capacitor formed within at least one of the scallops. The disclosure also provides a method of manufacturing the trench capacitor structure.

Abstract: There are provided a ceramic composition for a multilayer ceramic capacitor, a multilayer ceramic capacitor comprising the same, and a method of manufacturing the multilayer ceramic capacitor. The ceramic composition includes a dielectric ceramic powder; an organic binder; and an antistatic agent represented by a specific Chemical Formula. A ceramic green sheet comprising the ceramic composition according to an exemplary embodiment of the present invention only generates a small amount of static electricity and shows excellent mechanical physical properties even in the case that the thickness thereof is thin.

Abstract: Methods of fabricating an array capacitor are disclosed, in which via structures of the array capacitor have increased uniformity in their transverse areas. One method involves perforating a capacitor body to form first holes extending from a first surface and partially through the capacitor body. The capacitor body may be further perforated to form second holes extending from a second opposed surface of the capacitor body. The second holes are to connect to the first holes to provide through holes extending across a thickness of the capacitor body. An appropriate conductive material may then be filled in the through holes to form via structures with increased uniformity in their transverse areas.

Abstract: Disclosed herein is a conductive paste composition. The conductive paste composition according to the exemplary embodiment of the present invention includes a conductive powder including nickel or a nickel alloy; a spherical particulate inhibitor including BaTiO3 powders; and a glass composition having Chemical Formula of aLi2O-bK2O-cCaO-dBaO-eB2O3-fSiO2, wherein a, b, c, d, e, and f satisfy a+b+c+d+e+f=100, 2?a?10, 2?b?10, 0?c?25, 0?d?25, 5?e?20, and 50?f?80.

Abstract: A method of reforming a wet-tantalum capacitor includes providing a medical device comprising a wet-tantalum capacitor. The capacitor has a rated voltage and including a hydrated anodic deposit. The method further includes charging the capacitor to a voltage that is less than approximately seventy-five percent of the rated voltage and at least partially discharging the capacitor after the charging step. The charging step is performed at a sufficient voltage to dehydrate the anodic deposit while not significantly decreasing the service life of the capacitor.

Abstract: In a method of manufacturing ceramic capacitor according to the present invention, a pair of interdigitated internal electrodes are arranged perpendicularly to the surface of the substrate, subsequent to which the respective end faces of this pair of internal electrodes are exposed, and a pair of external electrodes are formed at these exposed end faces. In this method of manufacturing ceramic capacitor, formation of the external electrodes on the end faces of the respective internal electrodes, with these internal electrodes being interdigitately integrally-formed and the end faces thereof being exposed, it possible to reliably and easily form the external electrodes.

Abstract: A wet electrolytic capacitor that contains a sintered anode positioned with an interior space of a metal casing is provided. The anode and metal casing are of a size such that the anode occupies a substantial portion of the volume of the interior space. More particularly, the anode typically occupies about 70 vol. % or more, in some embodiments about 75 vol. % or more, in some embodiments from about 80 vol. % to about 98 vol. %, and in some embodiments, from about 85 vol. % to 95 vol. % of the interior space. Among other things, the use of an anode that occupies such a large portion of the interior space enhances volumetric efficiency and other electrical properties of the resulting capacitor.

Abstract: Disclosed are a multilayer ceramic electronic component and a method of manufacturing the same. There is provided a multilayer ceramic electronic component, including: a ceramic main body in which a plurality of dielectric layers having an average thickness of 1 ?m or less are stacked; and inner electrode layers formed on the dielectric layers and having connectivity of 90% or more expressed by the following Equation, wherein the ratio of the thickness of the inner electrode layer to the thickness of the dielectric layer is between 0.8:1 and 1.3:1. The Equation is as follows.

Abstract: Methods of fabricating an array capacitor are disclosed, in which via structures of the array capacitor have increased uniformity in their transverse areas. One method involves perforating a capacitor body to form first holes extending from a first surface and partially through the capacitor body. The capacitor body may be further perforated to form second holes extending from a second opposed surface of the capacitor body. The second holes are to connect to the first holes to provide through holes extending across a thickness of the capacitor body. An appropriate conductive material may then be filled in the through holes to form via structures with increased uniformity in their transverse areas.