Dividing Sequentially From Leading End, E.g., By Cutting Or Breaking Patents (Class 29/417)
  • Patent number: 8528174
    Abstract: Ultrasound transducers can be fabricated by bonding a block of piezoelectric material having a conductive coating to a flex circuit that has a conductive region and at least 20 conductive traces disposed on an insulating substrate. The block of piezoelectric material is then diced so as to cut all the way through the block of piezoelectric material and all the way through the conductive region, and part way through, but not completely through, the insulating substrate. The dicing is performed so that the first conductive region is divided into at least 20 regions that are electrically isolated from each other, and each of the at least 20 regions is in electrical contact with a respective one of the at least 20 conductive traces.
    Type: Grant
    Filed: November 8, 2012
    Date of Patent: September 10, 2013
    Assignee: Imacor Inc.
    Inventors: Edward Paul Harhen, Mitchell Thompson
  • Patent number: 8522432
    Abstract: A method for manufacturing radial pistons for a hydraulic motor by machining cylindrical transverse holes at regular intervals in a bar, and, in order to form two adjacent pistons, cutting up the bar on a transverse cutting-up plane passing through one of said holes so that a first portion of said hole forms a cradle-shaped recess in the base of the first one of the two adjacent pistons and so that another portion of said hole forms a cradle-shaped recess in the top of the second one of the two adjacent pistons.
    Type: Grant
    Filed: December 8, 2011
    Date of Patent: September 3, 2013
    Assignee: Poclain Hydraulics Industrie
    Inventors: Gilles Lemaire, Alain Noel
  • Patent number: 8510933
    Abstract: Provided is a field pole magnet to be installed in a rotor or a stator of a permanent magnet rotary machine, the field pole magnet including: multiple magnet pieces (31 to 34) formed by breaking and dividing a single permanent magnet; and at least one magnet-piece holding member (40) configured to hold these magnet pieces (31 to 34).
    Type: Grant
    Filed: September 29, 2009
    Date of Patent: August 20, 2013
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Ryou Murakami, Hideki Nishimura, Nobuo Kino, Tomihito Hashimoto
  • Patent number: 8499443
    Abstract: A package manufacturing method capable of easily manufacturing a penetration electrode-attached base board having excellent shape accuracy with a high degree of flatness without forming cracks or the like is provided. The package manufacturing method includes an insertion hole forming step of forming insertion holes in one surface of a base board wafer so as not to penetrate through the base board wafer; a core portion insertion step of inserting conductive core portions made of a metal material into the insertion holes; a welding step of heating the base board wafer to a temperature higher than the softening point of the glass material so as to weld the base board wafer to the core portions while holding the one surface side of the base board wafer with a receiving mold and pressing the other surface of the base board wafer with a flat pressurizing mold; a cooling step of cooling the base board wafer; and a polishing step of polishing both surfaces of the base board wafer.
    Type: Grant
    Filed: January 4, 2011
    Date of Patent: August 6, 2013
    Assignee: Seiko Instruments Inc.
    Inventor: Yoshifumi Yoshida
  • Patent number: 8495812
    Abstract: A method of manufacturing a highly reliable magnetic head slider, with a simplified manufacturing process which provides reduction in manufacturing time and costs, is provided. The manufacturing method includes a multi-layer forming step for forming a magnetic head section in a multi-layered manner, the magnetic head section including a read element and/or a write element and a magnetic shield for magnetically shielding the read element and/or the write element, and the magnetic head slider is manufactured by being cut off from a multi-layered body having the magnetic head section. The manufacturing method further includes, after the multi-layer forming step, a shield end removing step for removing end portions in a width direction of the magnetic shield located on the flying surface side of the magnetic head slider.
    Type: Grant
    Filed: November 26, 2008
    Date of Patent: July 30, 2013
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Ryuji Fujii, Jian Hui Huang, Anthony Reymund Melad Binarao, Shao Hui Yang, Tatsuya Shimizu
  • Patent number: 8429808
    Abstract: A method for fabricating electrostatic transducers and arrays electrically separates the substrate segments of the transducer elements from each other using a technique involving two cutting steps, in which the first step forms a patterned opening in the substrate to make a partial separation of substrate segments, and the second step completes the separation after the substrate segments have been secured to prevent instability of the substrate segments upon completion of the second step. The securing of the substrate segments may be accomplished by filling a nonconductive material in the partial separation or securing the transducer array on a support substrate. When the substrate is conductive, the separated substrate segments serve as separate bottom electrodes that can be individually addressed. The method is especially useful for fabricating ID transducer arrays.
    Type: Grant
    Filed: December 3, 2008
    Date of Patent: April 30, 2013
    Assignee: Kolo Technologies, Inc.
    Inventor: Yongli Huang
  • Patent number: 8418353
    Abstract: A method for providing energy assisted magnetic recording (EAMR) heads using a substrate are described. The substrate has front and back sides and apertures therein. The apertures are through-holes between the front and back sides of the substrate. The method includes providing a transmission medium in the apertures and fabricating EAMR transducers on the front side of the substrate. The EAMR transducers correspond to the apertures and the EAMR heads. The method also includes electrically insulating the back side of the substrate. The back side of the substrate is also prepared for mounting of the lasers. The lasers then are coupled the back side of the substrate. The lasers correspond to the EAMR heads and are configured to provide light through the apertures to the EAMR transducers. The method also includes separating the substrate into the EAMR heads.
    Type: Grant
    Filed: December 23, 2009
    Date of Patent: April 16, 2013
    Assignee: Western Digital (Fremont), LLC
    Inventors: Mark Moravec, Suwanchai Kongdum, Anucha Nontprasat
  • Patent number: 8413318
    Abstract: A method for manufacturing an armature core is provided, in which a plurality of split cores, which are formed by laminating core pieces produced through punching by punching dies, are coupled together to form an annular shape as a whole, so as to manufacture one armature core. The method includes: preparing a plurality of sets of the split cores, each set having three split cores, so as to form one armature core; and arranging the three split cores in each set at intervals of 120° in the circumferential direction. The three split cores in each set are formed by core pieces that have been punched by the same part of the same punching die.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: April 9, 2013
    Assignee: Asmo Co., Ltd.
    Inventors: Shinji Ikeda, Kenji Yoshimura, Shingo Matsuoka
  • Patent number: 8413313
    Abstract: The present invention provides divided-end artificial limbs and methods for making divided-end artificial limbs that are inexpensive, simple, and customizable. A limb is formed by dividing an end of an elongated shaft member into extending prongs that are shaped into custom lengths and curvatures. Furthermore, the method of the present invention provides affixing a sole plate to the limb, reinforcement of the prongs by nesting additional prongs within the elongated shaft member, dividing the proximal end of the shaft member into circumferentially spaced-apart fingers, and dividing a midsection of the shaft member into circumferentially spaced-apart flexing vanes. The present invention also provides that the prongs may be further modified by division into toe and heel extensions or by wrapping a prong around another prong to form a sole. Methods of reducing stress concentration using bolts and stress relief holes in these limbs are also presented.
    Type: Grant
    Filed: November 5, 2010
    Date of Patent: April 9, 2013
    Inventors: David Delon Williams, William G. Pitt, Peter Austin Jepsen, Douglas Turley Wright, Carl Jay Ellingson, Daniel August Susumu Marler
  • Patent number: 8408037
    Abstract: The present invention is premised upon method of manufacturing rolled pierce nuts having a predetermined profile from a metal rod, more particularly to a method and apparatus delivering greater manufacturing flexibility through the use of multiple stations with flexible inputs and outputs.
    Type: Grant
    Filed: June 22, 2012
    Date of Patent: April 2, 2013
    Assignee: Fastner Advance Products
    Inventors: William Lamb, Andrew Rowbotham, Kim Crampton, Michael Behm, Ron Hall
  • Patent number: 8402654
    Abstract: A nozzle plate cutting off method for cutting off the nozzle plate from a primary processing plate including a frame body, a nozzle plate which has multiple nozzle holes for ejecting droplets and is separately arranged inside the frame body, and a connection portion arranged at a clearance between the frame body and the nozzle plate to connect the frame body to the nozzle plate. In the nozzle plate cutting off method, a punching tool is used to punch out the nozzle plate at a connection region of the connection portion with the nozzle plate, there by cutting off the nozzle plate from the primary processing plate.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: March 26, 2013
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventor: Hikaru Nakamoto
  • Patent number: 8365398
    Abstract: Using developed photo-resist materials at the side walls of silicon substrates, the preferred embodiments of the present invention improve alignment accuracy of stacked substrates. Such alignment accuracy improves the area efficiency of side-wall connections as well as through-hole connections. The parasitic impedances of stacked substrate connections are also improved.
    Type: Grant
    Filed: April 10, 2011
    Date of Patent: February 5, 2013
    Inventor: Jeng-Jye Shau
  • Patent number: 8365382
    Abstract: A pipe from a plastic material having memory properties is extruded. The extruded pipe is cut to form a pipe part (7). The pipe part (7) is warmed and the end (6b) of the pipe part (7) is bent. The pipe part (7) forms a clamping ring (6) and the bent end (6b) of the pipe part (7) forms a stop edge (10) in the clamping ring (6).
    Type: Grant
    Filed: July 2, 2007
    Date of Patent: February 5, 2013
    Assignee: Uponor Innovation AB
    Inventor: Bengt Hedström
  • Patent number: 8359728
    Abstract: A method for manufacturing a corrosion sensor includes applying a first layer of non-conductive material to a substrate, writing a conductive material at discrete locations on the non-conductive material, and writing the conductive material at discrete locations on the previously written conductive material. The method further includes applying a second layer of non-conductive material over the conductive material and machining at least a portion of the second layer of non-conductive material to expose at least a portion of the conductive material.
    Type: Grant
    Filed: January 6, 2011
    Date of Patent: January 29, 2013
    Assignee: General Electric Company
    Inventors: Rebecca Evelyn Hefner, Paul Stephen DiMascio
  • Patent number: 8341814
    Abstract: Methods are provided for manufacturing piezoelectric devices. In an exemplary method, a base wafer is prepared that defines an array of multiple bases. Between each base on the wafer is a through-hole defined in respective parts by the respective edge surfaces of adjacent bases. A piezoelectric wafer is prepared that defines an array of multiple piezoelectric frames each having a piezoelectric vibrating piece and a surrounding frame portion. The vibrating piece includes an excitation electrode and extraction electrode. The extraction electrode extends to the through-hole. An adhesive is applied to a surface of the frame portion including a surface of the extraction electrode. The adhesive bonds the piezoelectric wafer to the base wafer. Excess adhesive is removed from the through-hole to expose a portion of the extraction electrode in the through-hole.
    Type: Grant
    Filed: January 28, 2011
    Date of Patent: January 1, 2013
    Assignee: Nihon Dempa Kogyo Co., Ltd.
    Inventor: Masahiro Yoshimatsu
  • Patent number: 8307521
    Abstract: A method for manufacturing an acceleration sensing unit includes: providing an element support substrate in which a plurality of element supporting members is arranged so as to form a plane, each of the element supporting members being coupled to the other element supporting member through a supporting part and having a fixed part and a movable part that is supported by the fixed part through a beam, the beam having a flexibility with which the movable part is displaced along an acceleration detection axis direction when an acceleration is applied to the movable part; providing an stress sensing element substrate in which a plurality of stress sensing elements is arranged so as to form a plane, each of the stress sensing elements being coupled to the other stress sensing element through an element supporting part and having a stress sensing part and fixed ends that are formed so as to have a single body with the stress sensing part at both ends of the stress sensing part; disposing the stress sensing element
    Type: Grant
    Filed: April 27, 2011
    Date of Patent: November 13, 2012
    Assignee: Seiko Epson Corporation
    Inventor: Yoshikuni Saito
  • Patent number: 8302277
    Abstract: A method of manufacturing a module is provided that can alleviate a decrease in cutting yield. This method includes: a step of mounting, on a wiring board having a plurality of mounting regions enclosed by cutting lines on its upper surface, an electronic component in each of the mounting regions; a step of cutting the wiring board along the cutting lines; a step of forming a sealing resin layer so as to seal the electronic component to cover at least part of upper and side surfaces of the cut wiring board; and a step of cutting the sealing resin layer along cut portions (cutting lines) of the cut wiring board.
    Type: Grant
    Filed: October 31, 2008
    Date of Patent: November 6, 2012
    Assignee: Rohm Co., Ltd.
    Inventors: Akihiro Koga, Shigenori Makino
  • Patent number: 8296920
    Abstract: A hand tool includes a plate-like body having a connection end from which a handle is integrally connected there which includes a first section and a second section. A grip is connected to the second section. The first section extends from the connection end by an upward angle and the second section integrally extends from the first section by an angle and toward opposite to the connection end. Each of the first and second sections includes a wall which is a curved wall and faces downward. The hand tool is punched from a metal board and includes a plate-like body and an extension portion which is then bent to form the handle and a grip is connected to the handle.
    Type: Grant
    Filed: October 24, 2008
    Date of Patent: October 30, 2012
    Inventor: Yu-Hwa Lin
  • Patent number: 8250745
    Abstract: A process for manufacturing a single microcircuit into an integrated cochlear electrode array includes securing and supporting a nonconductive film substrate; attaching a metallic ribbon to a surface of the substrate; machining a flat multiconductor microcircuit from the ribbon to produce a flat elongated multiconductor tail portion with spaced outwardly exposed electrode receiving pads, and a flat multiconductor head portion connected to the tail portion and having spaced outwardly exposed attachment pads; laminating the flat microcircuit between the film substrate and an insulating cover; excising the laminated microcircuit from the film substrate with the electrode receiving pads exposed; wrapping the tail portion of the excised laminated microcircuit into a helix with the exposed electrode receiving pads wrapped around the insulating cover; mounting and electrically connecting the ring electrodes on and to the exposed electrode pads; and overmolding the helix tail portion with a polymeric material to read
    Type: Grant
    Filed: December 18, 2008
    Date of Patent: August 28, 2012
    Assignee: Advanced Bionics, LLC
    Inventor: William G. Orinski
  • Patent number: 8240035
    Abstract: A circuit module and a manufacturing method for the same, reduce a possibility that a defect area where an electrically conductive resin is not coated may occur in a shield layer. A mother board is prepared. A plurality of electronic components are mounted on a principal surface of the mother board. An insulator layer is arranged so as to cover the principal surface of the mother board and the electronic components. The insulator layer is cut such that grooves and projections are formed in and on the principal surface of the insulator layer and the insulator layer has a predetermined thickness H. An electrically conductive resin is coated on the principal surface of the insulator layer to form a shield layer. The mother board including the insulator layer and the shield layer both formed thereon is divided to obtain a plurality of circuit modules.
    Type: Grant
    Filed: January 12, 2011
    Date of Patent: August 14, 2012
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hiroshi Nishikawa, Makoto Fujita, Fumikiyo Kawahara
  • Patent number: 8230597
    Abstract: A method for forming a component includes forming a workpiece into a hollow preform cylinder concentric with an axis and including an inner surface that extends along the axis, placing within the preform cylinder a mandrel having an outer surface, flow-forming the inner surface and the outer surface of the preform cylinder such that the inner surface of the cylinder conforms to at least a portion of the outer surface of the mandrel, and cutting the flow formed cylinder transversely with respect to the axis into segments, each segment having an axial length.
    Type: Grant
    Filed: October 3, 2008
    Date of Patent: July 31, 2012
    Assignee: Ford Global Technologies, LLC
    Inventors: Joseph Szuba, Rodney G. Whitbeck, Keith Hughes
  • Patent number: 8230563
    Abstract: A method for forming a piezoelectric component includes forming a plurality of sets of first piezoelectric elements having comb-shaped electrodes and wiring electrodes on a principal surface of a piezoelectric substrate base material, forming a protective film, a seed layer, and terminal electrodes, and removing the seed layer by etching. The method further includes preparing another piezoelectric substrate and performing resin-sealing by laminating a photosensitive resin film onto a principal surface side of the piezoelectric substrate base material. Cu electroplating is performed upon the terminal electrodes, and the piezoelectric substrate base material is cut along dicing lines to obtain individual piezoelectric components. The piezoelectric component includes a first piezoelectric element and a plurality of second piezoelectric elements with the second piezoelectric elements sealed by a resin seal layer such that a hollow section is formed between opposing principal surfaces thereof.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: July 31, 2012
    Assignee: Nihon Dempa Kogyo Co., Ltd.
    Inventor: Toshimasa Tsuda
  • Patent number: 8201333
    Abstract: Universal master boards and methods of making flush door skins and doors from the universal master boards are disclosed. The universal master boards each have an expansive surface with a graphic design of at least first depressions and second depressions in at least first and second surface regions, respectively. The first depressions simulate a first wood grain pattern, and the second depressions simulate a second wood grain pattern aligned in a different direction than the simulated first wood grain pattern. The universal master boards may be cut and demarcated selectively to establish different assortments of simulated wood patterns and different ornamental features, such as stiles and rails.
    Type: Grant
    Filed: February 25, 2009
    Date of Patent: June 19, 2012
    Assignee: Masonite Corporation
    Inventors: Gregory J. Wysock, Steven K. Lynch, Robert C. Allen
  • Patent number: 8176606
    Abstract: To carry out frequency adjustment easily, accurately and efficiently and achieve low cost formation and promotion of maintenance performance without being influenced by a size of a piezoelectric vibrating piece, there is provided a method of fabricating a piezoelectric vibrating piece which is a method of fabricating a piezoelectric vibrating pieces having a piezoelectric plate 11, a pair of exciting electrodes 12, 13, and a pair of mount electrodes electrodes 15, 16 by utilizing a wafer S, the method including an outer shape forming step of forming a frame portion S1 at the wafer and forming a plurality of piezoelectric plates to be connected to the frame portion by way of a connecting portion 11a, an electrode forming step of respectively forming pairs of exciting electrodes and pairs of mount electrodes to the plurality of piezoelectric plates and forming a plurality of pairs of extended electrodes S2, S3 to be respectively electrically connected to the pairs of mount electrodes by way of the connecting po
    Type: Grant
    Filed: January 27, 2009
    Date of Patent: May 15, 2012
    Assignee: Seiko Instruments Inc.
    Inventor: Takashi Kobayashi
  • Patent number: 8161643
    Abstract: A cooling jacket for a motor includes an extruded jacket body having an outer peripheral surface, an inner peripheral surface, and a plurality of discrete cooling passages located between the inner and outer peripheral surfaces that provide multi-directional fluid flow. A fluid inlet is provided to direct cooling fluid into the jacket body and a fluid outlet to direct heated fluid away from the jacket body.
    Type: Grant
    Filed: September 22, 2009
    Date of Patent: April 24, 2012
    Assignee: ArvinMeritor Technology, LLC
    Inventors: Mark C. Smith, Adam Ritchie, Vern Caron, Dennis A. Kramer
  • Patent number: 8146225
    Abstract: For forming a clamping ring first the pipe is extruded. The extruded pipe is cut to form a pipe part. While extruding the pipe, its inner diameter is formed smaller than the outer diameter of a pipe onto which the clamping ring is positioned before making a pipe connection. The inner diameter of the pipe part is made larger by removing material from the inside of the pipe part but only over part of the length of the pipe part such that a stop edge is formed. The clamping ring is used on a pipe when making a pipe connection.
    Type: Grant
    Filed: December 14, 2007
    Date of Patent: April 3, 2012
    Assignee: Uponor Innovation AB
    Inventors: Kathryn Marie Olinger, Tim Cota
  • Patent number: 8141242
    Abstract: A method for fabricating a gold finger of a circuit board is provided. First, a circuit board having a board edge for cutting is provided. Next, a copper conducting wire pattern is formed on the circuit board. The copper conducting wire pattern includes a plurality of gold finger bodies and a plurality of tie bars. Each tie bar is connected to a corresponding gold finger body, and the tie bars are disposed across the board edge. Thereafter, a surface of each gold finger body is plated with gold, and the tie bars on the board edge are removed by etching. Because the tie bars on the board edge are removed, tear resistance of the gold finger is maintained after cutting the board edge.
    Type: Grant
    Filed: October 26, 2007
    Date of Patent: March 27, 2012
    Assignee: Nanya Technology Corporation
    Inventors: Tsu-Shun Huang, Han-Ning Pei
  • Patent number: 8136220
    Abstract: A process for the manufacture of small sensors with reproducible surfaces, including electrochemical sensors. One process includes forming channels in the surface of a substrate and disposing a conductive material in the channels to form an electrode. The conductive material can also be formed on the substrate by other impact and non-impact methods. In a preferred embodiment, the method includes cutting the substrate to form a sensor having a connector portion and a transcutaneous portion, the two portions having edges that define one continuous straight line.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: March 20, 2012
    Assignee: Abbott Diabetes Care Inc.
    Inventors: James Say, Michael F. Tomasco, Adam Heller, Yoram Gal, Behrad Aria, Ephraim Heller, Phillip John Plante, Mark S. Vreeke
  • Patent number: 8127448
    Abstract: The machine employs a forming collar to shape a continuous web of material longitudinally about a barrel with the longitudinal edges splayed outwardly and over each other. A sewing machine spaced radially from the barrel secures the longitudinal edges together to form a sleeve having an outwardly directed flap. In another embodiment, the machine employs two forming collars to shape a pair of webs about the barrel with outwardly splayed edges on two sides and two sewing machines to secure the edges together to form a pair of flaps. The seam(s) can be sewn at one of a plurality of spacings from the barrel to form a drainage line element of a different diameter from a standard diameter without need to adjust or replace other components of the fabricating machine.
    Type: Grant
    Filed: November 5, 2010
    Date of Patent: March 6, 2012
    Inventors: Harry Bussey, Jr., Buddy Harry Bussey, III
  • Patent number: 8104154
    Abstract: To efficiently fabricate a high quality piezoelectric vibrating piece regardless of an accuracy of an outer shape of a wafer, there is provided a method of fabricating a plurality of piezoelectric vibrating pieces at a time utilizing a wafer S, the method including a step of forming two or more of through holes 40 and forming outer shapes of a plurality of piezoelectric plates 10 simultaneously with the through holes by constituting reference points G by centers of the through holes by etching the wafer by a photolithography technology, a step of preparing a jig for a wafer having inserting pins formed to project by a number the same as a number of the through holes from above a flat plate portion, thereafter, mounting the wafer on the flat plate portion in a state of inserting the inserting pin into the through hole, a step of forming an electrode on outer surfaces of the plurality of piezoelectric plates, and a step of cutting to separate the plurality of piezoelectric plates from the wafer to fragment, and
    Type: Grant
    Filed: January 21, 2009
    Date of Patent: January 31, 2012
    Assignee: Seiko Instruments Inc.
    Inventors: Mitsuo Tomiyama, Takashi Kobayashi, Kazuyoshi Sugama
  • Publication number: 20120011722
    Abstract: Method and Apparatus for fabricating a spacer frame for use in an insulating glass unit. One of a multiple number of possible spacer frame materials is chosen for the spacer frame. An elongated strip of the material is moved to a notching station where notches are formed at corner locations. The character of the notches is adjusted based on the selection of the metal strip material and more particularly to achieve bending of the material in an repeatable, straightforward manner. Better control over the notching process is also achieved by exhaust flow control of a double acting cylinder. A positioning spacer achieve very accurate side to side positioning of a die and anvil to precisely notch and deform the metal strip. Downstream from the notching station the metal strip is bent into a channel shaped elongated frame member having side walls. Further downstream a leading strip of channel shaped material is severed or separated from succeeding material still passing through the notching and bending station.
    Type: Application
    Filed: June 10, 2011
    Publication date: January 19, 2012
    Applicant: GED Integrated Solutions, Inc.
    Inventors: WILLIAM A. BRIESE, Timothy B. McGlinchy, John Grismer
  • Patent number: 8087140
    Abstract: A processing speed of each mechanisms in a cutting section is controlled such that all polarizing films housed in a container in advance are used in a joining process and simultaneously a new container with polarizing films housed therein that are cut by a size of a liquid crystal panel is loaded from the cutting section. Here, a fracture included in the polarizing film is cut and removed in the cutting section while a delayed time due to this process is shortened by controlling at least a processing speed in a processing mechanism in a cutting mechanism among mechanisms provided in the cutting section and the joining section.
    Type: Grant
    Filed: April 6, 2009
    Date of Patent: January 3, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Satoru Koshio, Kazuo Kitada, Tomokazu Yura, Takuya Nakazono
  • Patent number: 8087135
    Abstract: A piezoelectric vibrator manufacturing method includes a cavity forming step for forming depressions for a cavities on at least one of two wafers; a bonding electrode film forming step for forming bonding electrode films on bonded surfaces of the both wafers; a mount pattern forming step for forming a pair of mount patterns in the cavity; a through hole forming step for forming a pair of through holes in the cavity; a through electrode forming step for forming a pair of through electrodes electrically connected with the pattern in the cavity; a mount step for electrically connecting the pattern and a piezoelectric vibrating strip, a superimposing step for superimposing the both wafers and storing getter materials; a bonding step for anodically bonding the both wafers to fabricating a wafer member; a gettering step for adjusting the degree of vacuum in the interior of the cavity while measuring a series resonance resistance value; and a cutting step for cutting the wafer member into individual pieces.
    Type: Grant
    Filed: June 2, 2010
    Date of Patent: January 3, 2012
    Assignee: Seiko Instruments Inc.
    Inventors: Keiichi Ouchi, Yuki Hoshi
  • Patent number: 8061004
    Abstract: The test strip stabilizes skin prior to incision by a lancet tip. The innovative test strip includes a pair of skin contacting tabs that apply pressure linearly to the skin to stretch the skin taut. Beneficially an incision by a lancet tip to an accurate depth can be formed on the taut skin. Moreover, pressure from the tabs is applied linearly to the skin which results in a higher ratio of pressure to surface that can be reached as compared to applying pressure laminarily to skin. Some manufacturing techniques of the skin contacting tabs include cutting or stamping through all of the layers and test area of the test strip to form these tabs. These techniques increase the manufacturing efficiency and cost savings associated with test strips and integrated lancet testing devices. Contamination from other sampling events is eliminated since the test strips are disposed of after each use.
    Type: Grant
    Filed: August 20, 2009
    Date of Patent: November 22, 2011
    Assignee: Roche Diagnostics Operations, Inc.
    Inventor: Michael Keil
  • Patent number: 8056198
    Abstract: A master substrate 15 having a plurality of substrate areas A arranged in a matrix shape is prepared, and a piezoelectric oscillation element 5 is carried in each of the substrate areas A. A main cover 16 made of a metal having a plurality of cover areas B having a one-to-one correspondence with the substrate areas A is placed and joined on the master substrate 15. The main cover 16 is together cut along the outer periphery B? of each of the cover areas B, to simultaneously obtain a plurality of electronic devices. The productivity can be improved by simplifying the assembling steps.
    Type: Grant
    Filed: February 28, 2005
    Date of Patent: November 15, 2011
    Assignee: Kyocera Corporation
    Inventor: Toshio Nakazawa
  • Patent number: 8046891
    Abstract: A pocket plug is made by making a first angled cut and a second angled cut relative to proximate a first line and a first side of an elongate member having a length. A plurality of pocket plugs are made by repeating the first angled cut and the second angled cut a distance apart from the previous second angled cut along the length of the elongate member. Thus, by alternating between the first angled cut and the second angled cut the distance along the length of the elongate member, the plurality of pocket plugs are made.
    Type: Grant
    Filed: October 12, 2007
    Date of Patent: November 1, 2011
    Inventor: Brandon J. Zelazoski
  • Patent number: 8046919
    Abstract: A method of manufacturing a plastic molded shutter assembly that can be customized in size. A shutter of a standard length, or series of shutters of standard lengths are manufactured. A plurality of cuts are made in the shutter, removing a predetermined amount of material from the shutter. The end cap is replaced and fixedly secured to the remaining shutter, resulting in a single shutter of a desired length.
    Type: Grant
    Filed: February 9, 2007
    Date of Patent: November 1, 2011
    Assignee: Pinckney Molded Plastics, Inc.
    Inventors: Timothy J. Coughlin, Donald Verna, Richard C. Kruyer
  • Patent number: 8028407
    Abstract: A method of producing substrate 3 having feedthrough electrodes for an inkjet head, including: a step of forming grooves in the substrate 1 in the same pitch as that of the inkjet head; a step of setting conductive member 101 in the grooves; a step of adhering covering substrate 2 onto substrate 1; a step of cutting adhered substrate 1 and covering substrate 2 in a direction perpendicular to that of the grooves in a predetermined width.
    Type: Grant
    Filed: April 3, 2009
    Date of Patent: October 4, 2011
    Assignee: Konica Minolta Holdings, Inc.
    Inventor: Hideo Watanabe
  • Patent number: 8020264
    Abstract: There is provided a method of manufacturing piezoelectric vibrators 1. The method includes a process for through holes 35 and 36, which pass through a base substrate wafer, so that openings of the through holes are opened to the outside of the recesses for cavities C; a process for patterning a bonding layer 30, pairs of mounting layers, and pairs of extraction electrode layers 33 and 34 on the upper surface of the base substrate wafer with the same conductive material; and a process for electrically isolating the extraction electrode layers 34 in the middle by irradiating a part (area S2) of the extraction electrode layers 34, which are formed between the bonding layer and openings of through holes 36, with laser light after both the wafers are anodically bonded to each other. The bonding layer 30 surrounds the recesses, the pairs of mounting layers are in the recesses, and the pairs of extraction electrode layers 33 and 34 electrically connect the pairs of mounting layers to the bonding layer.
    Type: Grant
    Filed: June 4, 2010
    Date of Patent: September 20, 2011
    Assignee: Seiko Instruments Inc.
    Inventors: Kiyoshi Aratake, Yasuo Kawada
  • Patent number: 8022307
    Abstract: A flexible, fabric-based circuit comprises a non-conductive flexible layer of fabric and a conductive flexible layer of fabric adjacent thereto. A non-conductive thread, an adhesive, and/or other means may be used for attaching the conductive layer to the non-conductive layer. In some embodiments, the layers are attached by a computer-driven embroidery machine at pre-determined portions or locations in accordance with a pre-determined attachment layout before automated cutting. In some other embodiments, an automated milling machine or a computer-driven laser using a pre-designed circuit trace as a template cuts the conductive layer so as to separate an undesired portion of the conductive layer from a desired portion of the conductive layer. Additional layers of conductive fabric may be attached in some embodiments to form a multi-layer construct.
    Type: Grant
    Filed: July 3, 2007
    Date of Patent: September 20, 2011
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventors: Andrew W. Chu, Justin A. Dobbins, Robert C. Scully, Robert C. Trevino, Greg Y. Lin, Patrick W. Fink
  • Patent number: 7992299
    Abstract: The invention relates to a method for the manufacture of tubes bent in a U-shape (hairpin tubes) from a nonferrous metal, immediately following a tube production line. For that purpose, according to the invention, the method for the manufacture of tubes bent in a U-shape from a nonferrous metal, immediately following a tube production line, has the consecutive steps of: a) uncoiling the drawn tube material from a basket winder, b) straightening the drawn tube material, c) annealing and subsequently cooling the drawn tube material before or after cutting, for separation into tube portions, to the starting length for a tube bent in a U-shape, and d) bending the tube portions into a U-shape.
    Type: Grant
    Filed: October 30, 2003
    Date of Patent: August 9, 2011
    Assignee: Wieland-Werke AG
    Inventors: Horst Glatz, Eberhard Lepin, Gerhard Schuez, Martin Straub
  • Patent number: 7954215
    Abstract: A method for manufacturing an acceleration sensing unit includes: providing an element support substrate in which a plurality of element supporting members is arranged so as to form a plane, each of the element supporting members being coupled to the other element supporting member through a supporting part and having a fixed part and a movable part that is supported by the fixed part through a beam, the beam having a flexibility with which the movable part is displaced along an acceleration detection axis direction when an acceleration is applied to the movable part; providing an stress sensing element substrate in which a plurality of stress sensing elements is arranged so as to form a plane, each of the stress sensing elements being coupled to the other stress sensing element through an element supporting part and having a stress sensing part and fixed ends that are formed so as to have a single body with the stress sensing part at both ends of the stress sensing part; disposing the stress sensing element
    Type: Grant
    Filed: January 25, 2008
    Date of Patent: June 7, 2011
    Assignee: Epson Toyocom Corporation
    Inventor: Yoshikuni Saito
  • Patent number: 7950124
    Abstract: The invention relates to a method for joining cathode metal sheets to form crude strips that can be coiled and rolled and for the production of metal strips of a constant thickness from crude strips that have been produced from cathode metal sheets of varying thicknesses. The aim of the invention is to produce metal strips of a high purity that are devoid of non-metallic inclusions. The method can be used whenever highly pure and/or inclusion-free metal in strip or foil form is required in large quantities. The application of said method is only limited by the fact that the metal is deposited electrolytically on cathodes, and if permanent cathodes are used, must be separated from said cathodes without fragmentation. This is possible with the following metals: lead, zinc, tin, copper, nickel, cobalt, cadmium, iron and gold.
    Type: Grant
    Filed: September 1, 2005
    Date of Patent: May 31, 2011
    Inventor: Theodor Stuth
  • Patent number: 7941925
    Abstract: There is disclosed a member for sealing, baffling and/or reinforcing components of an automotive vehicle. The assembly generally includes a carrier, an expandable material and at least one fastener.
    Type: Grant
    Filed: June 25, 2007
    Date of Patent: May 17, 2011
    Assignee: Zephyros, Inc.
    Inventors: Douglas C. Larsen, Thomas D. Kleino, Abraham Kassa, William J. Barz, Matthew Harthcock
  • Patent number: 7941916
    Abstract: A portable memory card including a molded plastic casing formed over a memory device and other circuits mounted on a substrate such that the molding material extends over side edges of the substrate to provide accurate width and thickness dimensions. Contact pads are formed on a lower surface of the PCBA substrate, which is exposed through a bottom of the casing. The PCBA is fabricated on a substrate carrier, then positioned inside of a mold assembly. During the molding process, a rod extends from an upper portion of the mold assembly and pushes the substrate against the lower surface. A vacuum is then applied to hold the substrate against the lower surface of the mold, and the rod is subsequently withdrawn from the mold cavity during injection of the molten molding material. A single cavity mold assembly provides molding material extends over front and back edges of the memory card.
    Type: Grant
    Filed: July 8, 2004
    Date of Patent: May 17, 2011
    Assignee: Super Talent Electronics, Inc.
    Inventors: Paul Hsueh, Jim Ni, Kuang-Yu Wang
  • Patent number: 7934306
    Abstract: A method for packaging micro electromechanical systems (MEMS) microphone has steps of providing a base, arranging and mounting multiple microphone component assemblies on the base, providing a frame, mounting the frame on the base, forming multiple microphone units, providing a cover; mounting the microphone units on the cover and forming multiple MEMS microphones. Therefore, the MEMS microphones can be produced once in large quantities to save production time and costs.
    Type: Grant
    Filed: January 12, 2009
    Date of Patent: May 3, 2011
    Assignee: Tong Hsing Electric Industries, Ltd.
    Inventor: Kuo-Jung Wu
  • Patent number: 7922924
    Abstract: An internal filter includes a lower substrate and an upper substrate. Fluid passages are formed by etching grooves into the surface(s) of the upper and/or lower substrates, and/or in one or more intermediate layers. The filter pores extending between the fluid passages are formed by etching second grooves that fluidly connect the fluid passages. Two or more sets of the one or two intermediate layers can be implemented to provide additional filter passages and/or pores. Each set can be connected to a separate fluid source and/or a separate microfluidic device. In another internal filter, the inlet and outlet passages and the filter pores are formed on the same upper or lower substrate. The inlet and outlet passages are partially formed in a first step. In a second step, the inlet and outlet passages are completed at the same time that the filter pores are formed.
    Type: Grant
    Filed: November 30, 2007
    Date of Patent: April 12, 2011
    Assignee: Xerox Corporation
    Inventor: Gary A. Kneezel
  • Patent number: 7908721
    Abstract: An improved ultrasound transducer assembly, e.g. a thickness-mode transducer assembly includes a plurality of elements comprising piezoelectric material, and a backing material disposed adjacent to a back surface of the plurality of elements. The piezoelectric material and backing material define at least a portion of a side surface, wherein an electrically conductive material is disposed upon and in contact with at least a portion of the side surface. The elements may comprise one or a plurality of front electrodes, and one or a plurality of back electrodes, wherein the front electrode(s) is electrically interconnected to the electrically conductive material disposed on the side surface portion. In a mass processing method, a plurality of thickness-mode ultrasound probe transducer assemblies may be produced, wherein a plurality of interconnected transducer subassemblies comprising a mass backing are processed in tandem.
    Type: Grant
    Filed: June 11, 2007
    Date of Patent: March 22, 2011
    Assignee: Gore Enterprise Holdings, Inc.
    Inventors: Michael Joseph Zipparo, Monica Page Johnson, Clyde Gerald Oakley, Dennis Raymond Dietz, Michael Robert LaBree, Mark Nathaniel Donhowe
  • Patent number: 7877848
    Abstract: An angular velocity sensor includes a tuning-fork vibrator having a base and multiple arms extending from the base. Two arms out of the multiple arms driven to vibrate have first end parts opposite to second end parts connected to the base. The first end parts being wider than the second end parts.
    Type: Grant
    Filed: February 25, 2008
    Date of Patent: February 1, 2011
    Assignee: Tamagawa Seiki Co., Ltd
    Inventors: Hiroshi Tanaka, Yuki Endo, Masanori Yachi, Kazutaka Araya, Yoshinori Uwano
  • Patent number: 7874071
    Abstract: A method of making an ice dispense agitator of a type as may be used in ice and beverage dispensing machines is characterized by manufacturing the agitator as an integral unit by cutting the agitator from flat metal stock and then bending the agitator into a desired final shape.
    Type: Grant
    Filed: March 20, 2006
    Date of Patent: January 25, 2011
    Inventor: Andrew J. Tobler