Dividing Sequentially From Leading End, E.g., By Cutting Or Breaking Patents (Class 29/417)
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Patent number: 7093353Abstract: A hanger taken from a strip of hangers is positioned on a fastening and cutting anvil (6) displaceable between a bottom position, in which it retracts below the level of the support plate (1) and a top position, in which it projects above the plate. A blade (17), the central part of which forms a bridge beneath which the strip of hangers passes, is fixed to the plate, in contact with the anvil.Type: GrantFiled: December 21, 2001Date of Patent: August 22, 2006Assignee: Cassese Societe AnonymeInventors: Pierre Cassese, Alain Cassese, Jean Cassese, Philippe Cassese
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Patent number: 7089637Abstract: A method of producing a piezoelectric/electrostrictive device having a base including a pair of movable parts opposing each other, a fixing part that connects the movable parts with each other at one end thereof, and mounting parts that extend for a predetermined length while holding slit-shaped gaps of a predetermined width along inside surfaces of said movable parts by being turned around at the other end of said movable parts, said piezoelectric/electrostrictive device having a piezoelectric/electrostrictive element disposed on at least one outside surface of said movable parts of said base, wherein a base block obtained by laminating and calcining a large number of ceramic green sheets is adopted as a material for forming said base, and the base including said movable parts, said fixing part, and said mounting parts is formed by cutting said base block at a predetermined site along a lamination direction of said ceramic green sheets.Type: GrantFiled: April 26, 2004Date of Patent: August 15, 2006Assignee: NGK Insulators, Ltd.Inventors: Koji Ikeda, Fumitake Takahashi, Kazuyoshi Shibata
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Patent number: 7089661Abstract: A method is disclosed for packaging a small size memory card, including xD Picture card, Memory Stick™, Secure Digital™ (SD) card, SmartMedia™ (SM) card, Multimedia card (MMC), CompactFlash™ (CF) card and PC card, by moulding over to encapsulate a populated printed circuit board (PCB) (10) to form the standard external dimensions and features of the memory card. The method comprises holding the populated PCB (10) in place in a cavity (44) of at least one mould piece; and moulding over both sides of the populated printed circuit board (10) to encapsulate said board. Various embodiments are disclosed, including means for holding the populated PCB (10) in the moulding cavity (44) for the encapsulation process, which includes transfer moulding and injection moulding processes, one or more moulding steps, and moulding over one part of one side of said board before the other side, and/or simultaneously moulding over both sides of said board.Type: GrantFiled: April 11, 2003Date of Patent: August 15, 2006Inventors: Piau Fong, Chee Kiang Yew, Colin Chun Sing Lum, Matthew Keng Siew Chua
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Patent number: 7086154Abstract: A process of manufacturing a nozzle plate for an ink-jet print head. The nozzle plate includes (a) a substrate having an outside surface which is to be opposed to a print media, an inside surface which is opposite to the outside surface and nozzle holes which are formed through the substrate so as to be open in the outside and inside surfaces, and (b) a non-wetting layer which has a non-wetting characteristic and which covers the outside surface of the substrate. The manufacturing process includes: (i) a masking step of applying a resist on the inside surface of the substrate, and charging the nozzle holes with the insulating material such that portions of the resist protrude outwardly from openings of the nozzle holes on the outside surface; (ii) a non-wetting-layer forming step of forming the non-wetting layer on the outside surface in a plating operation; and (iii) an unmasking step of removing the resist from the substrate.Type: GrantFiled: June 23, 2003Date of Patent: August 8, 2006Assignee: Brother Kogyo Kabushiki KaishaInventors: Atsushi Ito, Tsuyoshi Eguchi, Toshiya Matsuyama, Yasunori Kobayashi, Yumiko Ohashi
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Patent number: 7086153Abstract: Distortion of the cross-sectional shape of a tube when producing a heat exchanger tube by cutting a continuous tube is prevented by forming cutting grooves in a strip material in advance by an upper and bottom cutter. The two side edges of the strip shaped member where stress will concentrate in the next tube forming step, the parts strongly bent, etc. are made thick, while the parts forming the belly surfaces of the tubes are made thin. At least four rollers are divided into two groups and arranged in a zigzag configuration. The continuous tube receives bending force in the forward and reverse directions between the group of rollers and is easily broken at the cutting grooves.Type: GrantFiled: April 2, 2004Date of Patent: August 8, 2006Assignee: DENSO CorporationInventor: Takumi Yamauchi
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Patent number: 7082671Abstract: A recording/reproduction element is mounted on a magnetic head slider via a piezoelectric element so that a displacement of the piezoelectric element performs fine control of the position of the recording/reproduction, thus enabling fine spacing and high track positioning accuracy. This improves linear recording density and track density. A pair of electrodes are formed on both sides of a piezoelectric element to constitute a piezoelectric actuator. One electrode is arranged opposite the rear surface (air flow out end) of a magnetic head slider 11. A recording/reproduction element is arranged on and electrically insulated from the other electrode. The piezoelectric element includes a piezoelectric element displaced in a spacing direction, enabling fine spacing control, a piezoelectric element displaced in the track direction, enabling fine track position control, and a piezoelectric element displaced in a magnetic disc rotation direction, enabling reduction of jitter of a reproduction signal.Type: GrantFiled: June 24, 2004Date of Patent: August 1, 2006Assignee: TDK CorporationInventor: Masahiro Yanagisawa
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Patent number: 7080442Abstract: The present invention relates to a semiconductor electret condenser microphone capable of being reduced in size and including an acoustic sensor 100 and a case 200 for accommodating the acoustic sensor 100, the acoustic sensor 100 has a semiconductor chip 110 forming necessary electronic circuits 111A to 111C, and opening a through hole 112 away from the electronic circuits 111A to 111C, an electrode layer 120 formed on the surface of the semiconductor chip 110 away from the through hole 112, an electret member 130 laminated away from part of the electrode layer 120 and through hole 112, and a diaphragm 140 provided with a spacing 160 to the electret member 130, in which the electrode layer 120 exposed from the electret member 130 is connected to the electrode 111a of the electronic circuit 111A through the case 200 (FIG. 6).Type: GrantFiled: October 21, 2002Date of Patent: July 25, 2006Assignee: Hosiden Electronics Co., Ltd.Inventors: Takao Kawamura, Yoshiaki Ohbayashi, Mamoru Yasuda
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Patent number: 7069630Abstract: A mathod of manufacturing a piezoelectric/electrostrictive divice includes an additional member that is provided at a border between an inner wall surface of a thin plate section formed by a long ceramic plate and a side surface (cutout surface) formed by a short ceramic plate. Assuming that a surface of the additional member forms a curve C as viewed in vertical cross section, the curve C is a free curve having one inflection point. The additional member has a portion C2 which extends along the inner wall surface of the thin plate section with its surface extending substantially in parallel toward the border, and a curved portion C3 which is disposed at a part corresponding to the border.Type: GrantFiled: September 6, 2002Date of Patent: July 4, 2006Assignee: NGK Insulators, Ltd.Inventors: Fumitake Takahashi, Koji Ikeda, Kazuyoshi Shibata
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Patent number: 7065478Abstract: According to one embodiment of the invention, a computerized method for designing a progressive die used in the manufacturing of a part formed from sheet metal includes receiving, at a computer, information regarding one or more features of the part, and determining, by the computer, a blank layout for the part based on the features of the part and the number of parts desired. The computer further determines one or more details of a strip for the blank layout, information regarding a die base based on the details of the strip, and information regarding one or more inserts for die plates of the die base based on operations of the processes needed to form the features in the part. The computerized method further includes generating, by the computer, one or more outputs associated with the progressive die.Type: GrantFiled: December 31, 2001Date of Patent: June 20, 2006Assignee: UGS Corp.Inventor: Shengming Liu
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Patent number: 7047642Abstract: An ink jet recording head and a process for producing the same, and an ink jet recording apparatus are provided that improve the printing performance and also improve the production efficiency. A conjugated body 73 formed by conjugating silicon wafers 50 and 58 is cut, whereby nozzles 22 are opened, and cutting into head chip units is carried out. At this time, deep grooves 84 are formed on the surface of the silicon wafer 58 by anisotropic etching, and they are penetrated by etching on the opposite side. Grooves 90 are formed on the silicon wafer 50 by using the thus penetrated deep grooves 84 as a mask.Type: GrantFiled: April 4, 2002Date of Patent: May 23, 2006Assignee: Fuji Xerox Co., Ltd.Inventors: Masaki Kataoka, Michiaki Murata, Kenji Yamazaki, Yoshihisa Ueda, Norikuni Funatsu, Kumiko Tanaka
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Patent number: 7043838Abstract: A method is provided for making a multi-fluid cartridge for holding multiple fluids in segregated containment localities. The cartridge body contains fluid supply paths in fluid flow communication with the containment localities. A nozzle plate is attached to a device side of each of a plurality of defined ejection head substrates on a semiconductor wafer. Each of the ejection head substrates has a fluid supply side and two or more fluid flow paths therein for supplying fluid from the supply side to the device side thereof. The fluid flow paths in the ejection head substrates have a flow path density of greater than about 1.0 flow paths per millimeter. The wafer is diced to provide a plurality of micro-fluid ejection device structures. A circuit device is attached to the device side of each of the substrates. An adhesive is stencil printed with a bond line density of at least about 1.2 mm?1 on the micro-fluid ejection device structures or on the cartridge body.Type: GrantFiled: June 30, 2004Date of Patent: May 16, 2006Assignee: Lexmark International, Inc.Inventors: Mary C. Smoot, Paul T. Spivey, Melissa M. Waldeck, Craig M. Bertelsen, Sean T. Weaver
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Patent number: 7036205Abstract: A plurality of motors are assembled. A plurality of part-sized stators are provided. Each of the part-sized stators is a split portion of a full-sized stator which has been previously split. The full-sized stator includes a printed circuit board with a plurality of coils. Each part-sized stator is inserted into a respective motor.Type: GrantFiled: February 25, 2003Date of Patent: May 2, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shinji Fukushima, Kazuei Yagi
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Patent number: 7020941Abstract: A method for manufacturing a multilayer ceramic capacitor includes the steps of forming a ceramic slurry, forming ceramic green sheets from the ceramic slurry, printing internal electrode patterns on the ceramic green sheets, generating a laminated body by stacking the ceramic green sheets provided with the internal electrode patterns printed thereon, dicing the laminated body to thereby form chip-shaped ceramic bodies and sintering the chip-shaped ceramic bodies. The ceramic slurry includes a glass component containing one or more additive elements selected from the group consisting of Mn, V, Cr, Mo, Fe, Ni, Cu and Co.Type: GrantFiled: November 6, 2003Date of Patent: April 4, 2006Assignee: Taiyo Yuden Co., Ltd.Inventors: Hirokazu Chazono, Hisamitsu Shizuno, Hiroshi Kishi
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Patent number: 7017257Abstract: A process for directly debonding sliders during single slider processing includes placing the sliders in pockets in a divider with one surface of each slider contacting a tape. A planerization material encapsulates the portions of the sliders which are not in contact with the tape. The planerization material is cured and the assembly is bonded to a process carrier. After ABS are etched into the sliders, the sliders are debonded by heating, cleaned, and inspected. The divider is removed from the carrier with the sliders still attached to the divider by the planerization material. The divider is then sandwiched between two lids to form a shim stack to enhance removal of the planerization material. The planerization material is removed in a hot solvent ultra-sonic bath and the lids are then removed for additional cleaning and inspection of the sliders.Type: GrantFiled: June 16, 2003Date of Patent: March 28, 2006Assignee: Hitachi Global Storage Technologies Netherlands B.V.Inventor: Xavier Charles Lelong
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Patent number: 7013547Abstract: A method and a device for the production of curved spring strip sections. A spring strip runs through a bending unit formed from three separate support points and a reverse bending unit, arranged in series, and formed from a fourth support point. Bent and reverse-bent spring strip sections are separated off from the spring strip in a separator unit. In order to achieve a compact construction for the device, the third support point of the bending unit and the fourth support point of the reverse bending unit are adjustable in position relative to the spring strip, by a controller with pre-set programs.Type: GrantFiled: April 11, 2002Date of Patent: March 21, 2006Assignee: Valeo Systemes d'EssuyageInventors: Oliver Lenzen, Gerald Pachur
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Patent number: 7007371Abstract: A method of manufacturing a speed ring in a continuous process using a magnetizing fixture and a trimming fixture. An unmagnetized magnetic strip is fed into the trolley of a magnetizing fixture, clamped stretched, and magnetized by a coil. The newly magnetized strip is then cut and fed into a trimming fixture. As the magnetized strip goes through the trimming fixture, it runs over a hall effect sensor which determines where a center of a pair of poles is located. Based on where a pair of poles is located the cutting blade of the trimming fixture is activated and a magnetic strip that can be turned into a speed ring is created.Type: GrantFiled: September 24, 2003Date of Patent: March 7, 2006Assignee: Sauer-Danfoss Inc.Inventors: Stanley N. Didier, Scott Kessler
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Patent number: 6996891Abstract: The invention relates to a method for the manufacture of a sensor element and to a sensor element. In the method, both surfaces of a sensor film are provided with metallic electrodes. The sensor element is produced by cutting it from a larger amount of sensor element material. In the manufacture of the sensor element material, the electrodes are produced as a continuous process from roll to roll and the sensor element material is formed by laminating as a continuous process from roll to roll. At least the signal electrode consists of repeated electrode patterns which are at least partially connected to each other via one or more narrow connecting strips, and a sensor element of a desired length and/or shape is produced by cutting the material across the region of the connecting strips.Type: GrantFiled: July 3, 2000Date of Patent: February 14, 2006Assignee: Emfitech OyInventor: Heikki Räisänen
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Patent number: 6988308Abstract: Hard biasing of a magnetoresistive sensor or a spin valve sensor in a magnetic read head is initialized by repeatedly applying a magnetic field to the hard biasing at any level of fabrication of the magnetic read head or any combination of levels of fabrication of the read head such as at the wafer level, row bar level, single slider level, head gimbal assembly (HGA) level and/or head stack assembly (HSA) level.Type: GrantFiled: January 18, 2002Date of Patent: January 24, 2006Assignee: International Business Machines CorporationInventors: Christopher William Bergevin, Carol Inouye Chiu, Robert Yuan-Shih Li, Albert Shou-Chi Su
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Patent number: 6981303Abstract: A method of feeding a blank (31) by cutting a billet (11) for plastic working includes the steps of superimposing a plurality of annular members (15 to 18) having a coefficient of linear expansion smaller than that of the billet and an inside diameter slightly greater than the outside diameter of the billet on one another to assemble a tubular jig (12), inserting the billet into the assembled jig, heating the billet and the jig to a temperature at which the billet is half-molten, and cutting the billet into at least one blank by moving the annular members adjacent to one another in opposite directions. The cutting of the billet does not need a cutting tool, thus causing no wear of blades, and thereby allowing reduction in production cost. The billet can be cut into a plurality of pieces at a time, increasing productivity. Since the blanks can be fed together with the annular members, there is no need to reheat the blanks, providing increased productivity.Type: GrantFiled: July 23, 2002Date of Patent: January 3, 2006Assignee: Honda Giken Kogyo Kabushiki KaishaInventors: Yasuhiro Nakao, Hiroto Shoji, Kunitoshi Sugaya, Takashi Kato, Takaharu Echigo, Satoshi Matsuura
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Patent number: 6978532Abstract: A method of forming a durable mower bed blade is provided in which the grain of the metal is perpendicular to the longitudinal axis of the blade. The blade is formed in part by coining the blade on a hydraulic press which strengthens the cutting edge and other areas to prevent chipping and cracking. Additional steps in the process include shearing the blade to a proper width, heat treating and grinding the edge of the blade to sharpen it.Type: GrantFiled: November 7, 2003Date of Patent: December 27, 2005Assignee: JRM, Inc.Inventor: James R. Merritt
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Patent number: 6973706Abstract: A process for the manufacture of small sensors with reproducible surfaces, including electrochemical sensors. One process includes fanning channels in the surface of a substrate and disposing a conductive material in the channels to form an electrode. The conductive material can also be formed on the substrate by other impact and non-impact methods. In a preferred embodiment, the method includes cutting the substrate to form a sensor having a connector portion and a transcutaneous portion, the two portions having edges that define one continuous straight line.Type: GrantFiled: March 31, 2003Date of Patent: December 13, 2005Assignee: TheraSense, Inc.Inventors: James Say, Michael F. Tomasco, Adam Heller, Yoram Gal, Behrad Aria, Ephraim Heller, Phillip John Plante, Mark S. Vreeke
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Patent number: 6973711Abstract: A method for producing a shim piece for a magnetic resonance imaging (MRI) magnet. The shim piece is used to form a shim of a magnet and is designed to suppress eddy currents in the shim created by the introduction of a gradient magnetic field. The shim piece is formed by a plurality of ferromagnetic rods placed side-by-side and surrounded by a dielectric material.Type: GrantFiled: May 24, 2000Date of Patent: December 13, 2005Assignee: Fonar CorporationInventor: Raymond V. Damadian
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Patent number: 6968603Abstract: A piezoelectric/electrostrictive device includes a pair of mutually opposing thin plate sections, a movable section, and a fixing section for supporting the thin plate sections and the movable section. Piezoelectric/electrostrictive elements are arranged on at least one thin plate section of the pair of thin plate sections. A hole is formed by both inner walls of the pair of thin plate sections, an inner wall of the movable section, and an inner wall of the fixing section. The piezoelectric/electrostrictive device further includes at least one beam section extending from the inner wall of the movable section to the inner wall of the fixing section.Type: GrantFiled: April 15, 2002Date of Patent: November 29, 2005Assignee: NGK Insulators, Ltd.Inventors: Yukihisa Takeuchi, Tsutomu Nanataki, Koji Kimura
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Patent number: 6968616Abstract: A nozzle plate is manufactured by providing a material plate and a punch. The material plate is punched by the punch to form a provisional nozzle orifice hole on the material plate. The punching is repeated such that the provisional holes formed by a given punch are arranged in line. A bulged portion which is bulged on a back side of the material plate is removed to form the completed nozzle orifice.Type: GrantFiled: December 2, 2002Date of Patent: November 29, 2005Assignee: Seiko Epson CorporationInventors: Takashi Nakamura, Nagamitsu Takashima, Tatsuo Furuta
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Patent number: 6957486Abstract: In order to provide a device for the production of gasket layers for single or multiple layered gaskets from one respective gasket layer section of a starting material comprising several continuous gasket layer sections, comprising a follow-on combination tool with several machining stations which follow one another along a direction of feed and in which the gasket layer sections are machined during operating cycles, wherein at least one of the machining stations is designed as a station for cutting outer contour lines, in which facing outer contour lines of two adjacent gasket layers are cut by means of a tool for cutting outer contour lines, and a feeding device, by means of which the gasket layer sections are moved further along the direction of feed by a feed distance v between two operating cycles, with which the outer contour lines of the gasket layers are cut with less resources and the starting material can be better utilized it is suggested that the tool for cutting outer contour lines be designed suType: GrantFiled: June 26, 2001Date of Patent: October 25, 2005Assignee: Elring Klinger AGInventor: Wolfgang Fritz
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Patent number: 6954971Abstract: A fetal heart monitoring system preferably comprising a backing plate having a generally concave front surface and a generally convex back surface, and at least one sensor element attached to the concave front surface for acquiring acoustic fetal heart signals produced by a fetus within a body. The sensor element has a shape that conforms to the generally concave back surface of the backing plate. In one embodiment, the at least one sensor element comprises an inner sensor, and a plurality of outer sensors surrounding the inner sensor. The fetal heart monitoring system can further comprise a web belt, and a web belt guide movably attached to the web belt. The web belt guide being is to the convex back surface of the backing plate.Type: GrantFiled: September 30, 2002Date of Patent: October 18, 2005Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventors: Timothy D. Bryant, Mark W. Wynkoop, Nancy M. H. Holloway, Allan J. Zuckerwar
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Patent number: 6951047Abstract: A SAW element of the present invention includes a plurality of inter-digital transducer (IDT) electrodes on a piezoelectric substrate, grating reflector electrodes disposed on the sides of the IDT electrodes, and a plurality of pad electrodes led from the IDT electrodes and the grating reflector electrodes. A plurality of the pad electrodes includes isolated pad electrodes not directly opposed to the outer periphery of the SAW element, and adjacent pad electrodes directly opposed to the outer periphery thereof A connecting electrode between the isolated pad electrode and the adjacent pad electrode is removed by etching at least before dicing in order to prevent discharge from occurring due to pyroelectricity, and to prevent the electrodes from being damaged.Type: GrantFiled: July 30, 2003Date of Patent: October 4, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Muneko Tomioka, Kiyoharu Yamashita, Mitsuhiro Furukawa
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Patent number: 6947568Abstract: A back plate having a stationary back electrode is secured to a substrate. A diaphragm electrode is mounted on the back plate interposing a spacer. A frame having a sound collecting hole is mounted on the diaphragm electrode.Type: GrantFiled: September 24, 2003Date of Patent: September 20, 2005Assignee: Citizen Electronics Co., Ltd.Inventors: Haruhisa Tanabe, Megumi Horiuchi
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Patent number: 6944938Abstract: A method of forming a head comprises forming a write transducer on a wafer, cutting the wafer to produce a slider bar with a cut surface, and planarizing the cut surface of the slider bar. Forming the write transducer can include forming a first pole layer and forming a first pole pedestal layer over the first pole layer, where the first pole pedestal layer includes a tapered portion defined by a first end having a nose width less than a desired final nose width, and a second end having a zero throat width greater than the desired final nose width. Planarizing the cut surface of the slider bar exposes the first pole pedestal layer until a width thereof approximately equals the desired final nose width.Type: GrantFiled: October 29, 2004Date of Patent: September 20, 2005Assignee: Western Digital (Fremont), Inc.Inventors: Billy W. Crue, Jr., Mark David Thomas, Zhupei Shi, Renuka Apparao
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Patent number: 6938325Abstract: In one embodiment, a method for fabricating electromagnetic meta-materials includes applying first and second array of electromagnetically reactive patterns to first and second non-conducting surfaces, wherein the first array includes at least one of a split ring resonator pattern, a square split ring resonator pattern, and a swiss roll pattern, and the second array includes a thin parallel wire pattern. The first and second non-conducting surfaces are joined together such that the first and second non-conducting surfaces bearing the first and second arrays of electromagnetically reactive patterns are commonly oriented. Alternately, a method may further include slicing between elements of the first and second arrays of electromagnetically reactive patterns in a plane perpendicular to the first and second surfaces to form a plurality of slices, rotating at least one of the slices, and applying a third array of electromagnetically reactive patterns to a third non-conducting surface.Type: GrantFiled: January 31, 2003Date of Patent: September 6, 2005Assignee: The Boeing CompanyInventor: Minas H. Tanielian
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Patent number: 6935002Abstract: A method of manufacturing a nonreciprocal circuit device is performed such that matching capacitors are formed of single-board-type capacitors including capacitor electrodes formed so as to be opposed to each other on both main surfaces of a dielectric substrate with the substrate in between. An outer peripheral edge of a ground electrode (or another connected electrode), to which a capacitor electrode of the single-board-type capacitor is connected, is positioned inwardly from an outer peripheral edge of the capacitor electrode.Type: GrantFiled: February 14, 2000Date of Patent: August 30, 2005Assignee: Murata Manufacturing Co., Ltd.Inventors: Toshihiro Makino, Akihito Masuda, Takashi Kawanami
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Patent number: 6928722Abstract: A recording/reproduction element is mounted on a magnetic head slider via a piezoelectric element so that a displacement of the piezoelectric element performs fine control of the position of the recording/reproduction, thus enabling fine spacing and high track positioning accuracy. This improves linear recording density and track density. A pair of electrodes are formed on both sides of a piezoelectric element to constitute a piezoelectric actuator. One electrode is arranged opposite the rear surface (air flow out end) of a magnetic head slider 11. A recording/reproduction element is arranged on and electrically insulated from the other electrode. The piezoelectric element includes a piezoelectric element displaced in a spacing direction, enabling fine spacing control, a piezoelectric element displaced in the track direction, enabling a fine track position control, and a piezoelectric element displaced in a magnetic disc rotation direction, enabling reduction of jitter of a reproduction signal.Type: GrantFiled: August 5, 2002Date of Patent: August 16, 2005Assignee: TDK CorporationInventor: Masahiro Yanagisawa
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Patent number: 6925693Abstract: A method of fabricating a piezoelectric/electrostrictive device including a driving portion, a movable portion, and a fixing portion for holding the driving portion and the movable portion. The driving portion includes a pair of thin plate portions facing each other, and a film-like piezoelectric/electrostrictive element formed on at least a part of the outer surface of at least one of the thin plate portions. A ceramic green laminate including at least one ceramic green sheet constituting one of the thin plates and at least one ceramic green sheet having at least one hole formed thereon is formed. The ceramic green laminate is sintered to produce a ceramic laminate. A piezoelectric/electrostrictive element is formed by a film formation method on the outer surface of the thin plate portion of the ceramic laminate. The ceramic laminate is then cut with the piezoelectric/electrostrictive element formed thereon.Type: GrantFiled: September 26, 2001Date of Patent: August 9, 2005Assignee: NGK Insulators, Ltd.Inventors: Yukihisa Takeuchi, Tsutomu Nanataki, Toshikazu Hirota, Koji Kimura
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Patent number: 6922879Abstract: An acceleration sensor includes a piezoelectric element and support frames for supporting the ends of the piezoelectric element in the longitudinal direction. The piezoelectric element is formed by stacking an even number of piezoelectric layers greater than or equal to four layers. Electrodes are provided in between the layers and on the front and back faces of the piezoelectric element. The interlayer electrodes including a segmented electrode and lead electrodes are alternately stacked with the piezoelectric layers therebetween. The interlayer electrode in the middle in the thickness direction is a segmented electrode. The piezoelectric layers are polarized in the thickness direction so that charge having the same polarity is extracted from the electrodes when the acceleration is applied. Also, the center portion and both end portions of each piezoelectric layer are polarized in opposite directions.Type: GrantFiled: October 27, 2003Date of Patent: August 2, 2005Assignee: Murata Manufacturing Co., Ltd.Inventor: Mitsugu Ogiura
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Patent number: 6920684Abstract: The fixed layers of all magnetoresistive elements that are formed on the same substrate are magnetized in the same direction. Chips including magnetoresistive elements are cut out individually from the substrate. A magnetic sensor is assembled by combining cut-out chips together with consideration given to the magnetization directions of the fixed layers of the magnetoresistive elements in the chips. In this manner, the fixed layers of the magnetoresistive elements are magnetized by a sufficiently strong magnetic field for magnetization, whereby an output signal having a large absolute value is obtained from the magnetoresistive elements.Type: GrantFiled: August 19, 2002Date of Patent: July 26, 2005Assignee: Alps Electric Co., Ltd.Inventors: Yuichi Shonai, Ichiro Tokunaga, Seiji Kikuchi
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Patent number: 6918165Abstract: A multi-layer capacitor is highly downsized and increased in capacity. A method for manufacturing the multi-layer capacitor includes, in the same vacuum chamber, forming a dielectric layer, treating a surface of the dielectric layer, forming a pattern in a metal electrode, forming the metal electrode on the dielectric layer, and treating a surface of the metal electrode. In this method, etching of the dielectric layer flattens a recessed part generated by an electrical insulation part.Type: GrantFiled: May 14, 2003Date of Patent: July 19, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Koji Arai, Yuichiro Yamada
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Patent number: 6918178Abstract: An improved method of integrally attaching a heat sink to an IC package for enhancing the thermal conductivity of the package. A heat sink matrix, which is dividable into a plurality of individual heat sinks, is attached to an IC package matrix, which is comprised of a plurality of individual IC packages abutting each other in a matrix arrangement. The IC package matrix and the heat sink matrix attached thereto are then simultaneously cut by means of a machine tool into a plurality of individually formed IC packages each with a heat sink attached; thereby, thermal conductivity of a conventional IC package is enhanced.Type: GrantFiled: January 17, 2003Date of Patent: July 19, 2005Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Shin-Hua Chao, Shyh-Ing Wu, Kuan-Neng Liao, Gin-Nan Yeh
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Patent number: 6915547Abstract: A piezoelectric/electrostrictive (P/E) device includes at least one actuator section secured to thin plate sections with an adhesive. The actuator section includes a multilayered member including at least three actuator films, each of which include a P/E layer and electrode films. One or more holes or recesses are formed in portions of the thin plate sections on which the P/E elements are formed. The electrode films contact upper and lower surfaces of respective P/E layers and alternately extend to opposite surfaces thereof. End surface electrodes electrically connect an electrode film that contacts one of the P/E layers and an electrode film that contacts another one of the P/E layers. The end surface electrodes are electrically connected to terminals which are provided on a surface of an outermost layer of the P/E layers, and which are separated from one another by a predetermined distance.Type: GrantFiled: August 1, 2002Date of Patent: July 12, 2005Assignee: NGK Insulators, Ltd.Inventors: Yukihisa Takeuchi, Kazuyoshi Shibata, Masahiko Namerikawa
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Patent number: 6912761Abstract: A method of producing a piezoeIectric resonator includes the steps of forming first to third internal electrodes by printing an electrically conductive paste onto a green sheet, punching out portions of the green sheet having the first to third internal electrodes formed thereon, so that at least three types of green sheets are punched out with a location of the internal electrode serving as a reference location, in which the first sheet is punched out by shifting a punching location by a first shift amount in a first direction with respect to the reference location, the second sheet is punched out by shifting a punching location by the first shift amount in a direction opposite to the first direction, and the third sheet is punched out at the reference location, forming a layered body by stacking the punched out green sheets, and forming a unit by cutting the layered body.Type: GrantFiled: October 12, 2002Date of Patent: July 5, 2005Assignee: Murata Manufacturing Co., Ltd.Inventors: Toshiyuki Yasugi, Yuji Fujino, Shoichi Kawabata, Mamoru Ogawa
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Patent number: 6907656Abstract: A method for manufacturing thermal heads comprises providing a substrate having a first surface, a second surface opposite the first surface, heaters disposed on the first surface, and pairs of electrodes disposed on the first surface, the electrodes of each pair of electrodes being disposed in spaced-apart, confronting relation to each other. A driver IC is mounted on each of the electrodes. The driver ICs are then encapsulated with a resin. Grooves are formed in at least one of the first surface and the second surface of the substrate so that the electrodes of each pair of electrodes are disposed symmetrically with respect to one of the grooves. The substrate is then cut along the grooves to form individual thermal heads each having a heater, at least one of the driver ICs for providing a drive signal to drive the heater, and a sealing element formed by the resin for protecting the driver IC.Type: GrantFiled: January 14, 2000Date of Patent: June 21, 2005Assignee: Seiko Instruments Inc.Inventors: Yoshiaki Saita, Osamu Takizawa
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Patent number: 6901654Abstract: Improved coils and clamps for variable reluctance sensors are disclosed. A method of fabricating a discrete coil involves providing a conductor wound in a coil on a tube. The coil has a coil outer surface that has insulation. A window is opened in the insulation on the coil outer surface to expose conductor of the coil for a contact. A movable core is provided within the tube for adjusting inductance of the coil. In one embodiment, the coil and tube are diced into small coils after the windows for each coil are opened. Another aspect the invention is a clamp comprising an elastic material, a shape memory alloy, and an apparatus for activating the shape memory alloy. The clamp holds the moveable core in its peak position. When the alloy is activated it changes shape and provides a force on the elastic material to change clamping state for resetting the transducer. The coils and clamps can be used for a variety of purposes in addition to the variable reluctance sensors.Type: GrantFiled: January 10, 2001Date of Patent: June 7, 2005Assignee: Microstrain, Inc.Inventors: Steven W. Arms, Michael J Hamel, Steven Ward Mundell, Christophor Pruyn Townsend
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Patent number: 6898831Abstract: A surface acoustic wave device includes interdigital transducer (IDT) electrode and reflectors disposed on a piezoelectric substrate. Each of the IDT electrode and the reflectors has a multi-layer film structure including at least one layer (high specific gravity metal component containing layer) including as a major component a metal with a specific gravity of at least about 15 and having a film-thickness of at least about 10 nm, and at least one layer (low specific gravity metal component containing layer) including as a major component a metal with a specific gravity of up to about 10 and a volume resistivity as a bulk value (at about 20° C.) of up to about 10×10?8 ?·m, and having a film-thickness of at least about 10 nm.Type: GrantFiled: September 6, 2002Date of Patent: May 31, 2005Assignee: Murata Manufacturing Co., Ltd.Inventor: Takashi Iwamoto
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Patent number: 6898834Abstract: A method of reclaiming non-wine affected oak wood from a stave removed from a wine barrel or cask. The wine affected wood is removed as by sawing, the remaining non-wine affected wood is sawn into battens, dressed, straightened and toasted. The reclaimed oak battens can then be immersed in wine.Type: GrantFiled: March 3, 2003Date of Patent: May 31, 2005Assignee: Westbridge Pty LtdInventor: Peter Warren
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Patent number: 6899783Abstract: In order to manufacture a friction plate for a wet clutch including a core plate and a friction member bonded to at least one of annular flat surfaces of the core plate, each friction member including friction member segments, an oil groove being provided between adjacent friction member segments, there is adopted a method including: a step of making a plurality of cuts in at least one band-shaped friction member material in a lengthwise direction to form a plurality of friction member strips; a step of retaining the friction member strips with distances corresponding to the oil grooves being formed between adjacent friction member strips; a step of cutting off a portion of a tip end of at least one of the friction member strips which are located at opposite ends to thereby secure the oil grooves between the friction member segments on the annular flat surface; and a step of superposing friction member segment correspondence portions forming the tip ends of the plurality of friction member strips to the annulType: GrantFiled: December 17, 2003Date of Patent: May 31, 2005Assignee: Kabushiki Kaisha, F.C.C.Inventors: Kensuke Oguri, Tsutomu Tsuboi
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Patent number: 6895652Abstract: A duplex pipe (10) is cut with a cutting tool (30), for cutting connecting ribs (13) from the end face of the duplex pipe (10) which is held with an outer pipe (11) chucked (rib cutting step). The duplex pipe (10) is cut from the end face of the duplex pipe (10) up to the portion thereof corresponding to the exposed length of the inner pipe (12) to thereby form a slit (21) in the outer pipe (11) and connecting ribs (13) (slit forming step). The cutting tool (30) has a guide hole (31) into which the inner pipe (12) can be inserted while guiding the inner pipe outer peripheral surface (12a), a cutting device (32) for cutting the connecting ribs (13), and a guide pin (33) which can be inserted into the inner pipe (12) while guiding the inner pipe inner peripheral surface (12b).Type: GrantFiled: October 15, 2003Date of Patent: May 24, 2005Assignee: Calsonic Kansei CorporationInventors: Hiromi Takasaki, Yoshikazu Takamatsu, Nobuo Ichimura, Susumu Sato
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Patent number: 6895659Abstract: A manufacturing process in which a plurality of fluid jetting apparatuses are formed includes forming and sequentially adhering a heat driving part, a membrane and a nozzle part, respectively. The fluid jetting apparatuses are completed as a wafer unit by forming the nozzle part by forming a nozzle plate on a substrate of a wafer by a spinning process; forming jetting fluid barriers on the nozzle plate by the spinning process; forming jetting fluid chambers in the jetting fluid barriers; forming nozzles in the nozzle plate; and separating the substrate from the nozzle plate after the nozzle part and the membrane are adhered to each other. The forming jetting fluid chambers is accomplished by a process of wet etching, and the forming nozzles is accomplished by a treating apparatus of a laser beam or by a process of reactive ion etching.Type: GrantFiled: October 25, 1999Date of Patent: May 24, 2005Assignee: Samsung Electronics Co., Ltd.Inventors: Jae-ho Moon, Jong-chun Kim, Sung-hee Lee
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Patent number: 6895657Abstract: A method for producing a slider for an optical head includes a slider member adapted for floating and running over a recording medium during recording and/or reproduction of information signals for the recording medium. An optical lens is bonded to the slider member and a magnetic field generator provided on a surface of the slider member carrying the optical lens facing the recording medium. A first step is forming a groove presenting a bottom surface inclined in the depth-wise direction by ejecting a polishing agent dispersed in a compressed gas on a substrate. A second step is charging an electrically conductive material, which proves a terminal electrically connected to the magnetic field generator in the inside of the groove formed in the substrate. A third step is cutting the substrate in the vicinity of an end of the groove to form a plurality of individual slider members.Type: GrantFiled: September 23, 2002Date of Patent: May 24, 2005Assignee: Sony CorporationInventors: Akio Mishima, Toru Katakura
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Patent number: 6892449Abstract: A method of manufacturing a plurality of electro-optical sub-assemblies in parallel is provided. A plurality of printed circuit boards (PCBs) are preferably formed in a panel of flex material. Rigid substrates can be arranged along regions of the PCBs. A plurality of electrical components, including electro-optical semiconductor devices, are preferably located on the rigid substrates. Lens arrays are preferably aligned over the electro-optical semiconductor devices, such as through an alignment mechanism. The PCBs can then be singulated into individual electro-optical sub-assemblies. The rigid substrates can be a plurality of leadframes formed on a matrix leadframe. The matrix leadframe is preferably attached to the panel of flex material such that the leadframes are arranged in proximity to leadframe cutout regions of the PCBs. Electrical interconnections are then preferably formed between the electrical components on the leadframe and the PCBs.Type: GrantFiled: October 9, 2002Date of Patent: May 17, 2005Assignee: Cypress Semiconductor Corp.Inventors: Brenor Brophy, Marc Hartranft, Syed Tariq Shafaat, Jeff Hall
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Patent number: 6883215Abstract: A piezoelectric/electrostrictive device includes a pair of mutually opposing thin plate sections, a movable section, and a fixation section for supporting the thin plate sections and the movable section. One or more piezoelectric/electrostrictive elements are arranged on the pair of thin plate sections. A hole is formed by both inner walls of the pair of thin plate sections, an inner wall of the movable section, and an inner wall of the fixation section. At least one thin plate section of the pair of thin plate sections is previously bent in a direction to make mutual approach so that it has an inwardly convex configuration to the hole.Type: GrantFiled: November 5, 2003Date of Patent: April 26, 2005Assignee: NGK Insulators, Ltd.Inventors: Yukihisa Takeuchi, Tsutomu Nanataki, Koji Kimura
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Patent number: 6877646Abstract: There is provided self piercing rivet comprising a substantially planar metal body portion (160) having deformable tabs (161) symmetrically disposed about a slit (162) as per the first embodiment. The upper portion of the body portion (160) is provided with a V-shaped recess (163) diverging from a point (164) adjacent the centreline of the body portion (160) and terminating at the upper edge (165) of the body portion (160). The V-shaped recess (163) divides the upper portion of the body portion (160) into head tabs (166) disposed to each side of the body portion (160). The upper remaining edges of the head tabs (166) enable the rivet to be partially driven and then set by deformation of the deformable tabs (161) and the head tabs (166) against respective sides of the riveted workpiece. Methods of producing the rivets and tools for their use are also provided.Type: GrantFiled: February 26, 2001Date of Patent: April 12, 2005Assignee: National Innovation Centre (Australia) Pty Ltd.Inventor: Cedric Berkeley Paynter