Abstract: A process for the manufacture of small sensors with reproducible surfaces, including electrochemical sensors. One process includes forming channels in the surface of a substrate and disposing a conductive material in the channels to form an electrode. The conductive material can also be formed on the substrate by other impact and non-impact methods. In a preferred embodiment, the method includes cutting the substrate to form a sensor having a connector portion and a transcutaneous portion, the two portions having edges that define one continuous straight line.

Abstract: A substructure in which a plurality of pre-head portions are aligned in rows is to be cut later so that the pre-head portions are separated from one another. A surface formed by cutting the substructure is lapped to form medium facing surfaces. The substructure includes a plurality of sensors that respectively show individual sensor values corresponding to values of a plurality of different parameters each of which has an influence on characteristics relating to the pole layer and each of which depends on the position of the medium facing surface. The individual sensor values are resistance values each of which varies according to the position of the medium facing surface. The plurality of sensors are electrically connected to each other to form a composite sensor that shows a composite sensor value, which is a resistance value that depends on the resistance values of the plurality of sensors.

Abstract: In a valve housing 11, which is constituted by an section of an extruded billet material, into which are formed inlet and outlet conduits 27, 28, 29, 30, which are substantially arranged in a common plane, and a receiving bore 20 for at least one valve element 21, 26, arranged transversely in relation thereto, the billet material is formed as a profiled element provided with ribs 15, 16, 17, 18 which project from a substantially parallelepiped base body and in which ribs the inlet and outlet conduits 27, 28, 29, 30 open.

Abstract: A method comprises providing a substantially planar slab of piezoelectric material having a top surface. The method further comprises drilling a plurality of holes through the top surface and into the slab. The method further comprises making a plurality of cuts through the top surface and into the slab. The cuts form a plurality of polygons that are generally centered about one of the holes. The method further comprises plating the slab with an electrically conductive material. The method further comprises removing the electrically conductive material from the top surface of the slab. The method further comprises cutting the slab substantially parallel to the top surface.

Abstract: A method for break separation of pieces that can be re-assembled or their starting materials achieves a break separation at a selected break surface. The method includes subjecting a piece to be subjected to break separation to a break force F3, F3? perpendicular to the selected break surface. Also, the method includes applying, before the time at which the piece is subjected to the break force F3, F3?, a compressive force F1-F6? to the piece in a manner such that a tensile stress is produced whose maximum occurs perpendicular to the plane of the break surface, the level of stress produced is below the elastic limit of the material of the piece, and the compressive force F1-F6? continues at least until the piece is first subjected to the break force F3, F3?.

Abstract: A method of making elongated spacer frame members prevents a first spacer frame member in a series of spacer frame members from being scrapped. A supply of thin relatively narrow sheet metal stock is provided. The stock is fed endwise to a stamping station. The stock is passed through the stamping station that stamps the stock to define a scrap length of stock followed by a connected first spacer frame defining length of stock. The scrap length of stock and the connected first spacer frame defining length of stock are fed to a roll forming station. The scrap length of stock and the connected first spacer frame defining length of stock are formed into a rigid linearly extending scrap element having opposite side walls and a base wall and a connected rigid linearly extending first spacer frame element having opposite side walls and a base wall. A connection between the scrap element and the first spacer frame element is then severed.

Abstract: A process for the manufacture of small sensors with reproducible surfaces, including electrochemical sensors. One process includes forming channels in the surface of a substrate and disposing a conductive material in the channels to form an electrode. The conductive material can also be formed on the substrate by other impact and non-impact methods. In a preferred embodiment, the method includes cutting the substrate to form a sensor having a connector portion and a transcutaneous portion, the two portions having edges that define one continuous straight line.

Abstract: A method of making a plurality of flow sensors is provided, each flow sensor having a substrate with a sensing element and flow channel aligned over the sensing element. The sensing element senses at least one property of a fluid. The flow channel is aligned by one or more guide elements formed in an alignment layer. The flow channel across the sensing area is accurately and precisely aligned due to the guide elements provided at the wafer-level, facilitating reliable, low-cost, and consistent results among multiple flow sensors. The flow sensor is adapted for use in harsh environments.

Abstract: A method for manufacturing a magnetic write head having a wrap around magnetic shield. The method allows a highly accurate short wavelength such as 193 mm photolithography to be used to accurately define the placement and critical dimension of wrap around magnetic shield. The method includes the formation of a magnetic write pole, top gap, and side gap and the deposition of a RIEable fill layer thereover, and CMP to planarization. A 193 nm photolithography and ion milling is used to form a mask over the RIEable layer and one or more reactive ion etching processes are performed to pattern the RIEable layer through 193 nm photolithography mask. A wrap around shield can then be electroplated into the opening formed in the RIEable layer.

Abstract: A method for reinforcing, baffling and/or sealing components of an automotive vehicle is disclosed. The method includes providing a carrier and disposing masses of expandable material onto the carrier. The method further provides for providing a fastener connected to the carrier.

Abstract: A method for manufacturing frame-type composite panels to a desired length comprises forming an elongate core-frame composite in which frame members have been received in slots on a slab of core material. The composite is cut to the desired length and the frame is finished by application of end members. The method described herein allows composite frame panels to be formed without restriction on the length typically due to the length of the mold in which the core is formed. A drum for use in a system for creating composite panels is disclosed having protruding rings concentric to the drum. A slab of core material is passed between two such drums which form slots in the slab for receiving frame members when they contact the slabs.

Abstract: A method of producing substrate 3 having feedthrough electrodes for an inkjet head, including: a step of forming grooves in the substrate 1 in the same pitch as that of the inkjet head; a step of setting conductive member 101 in the grooves; a step of adhering covering substrate 2 onto substrate 1; a step of cutting adhered substrate 1 and covering substrate 2 in a direction perpendicular to that of the grooves in a predetermined width.

Abstract: A process for the manufacture of small sensors with reproducible surfaces, including electrochemical sensors. One process includes forming channels in the surface of a substrate and disposing a conductive material in the channels to form an electrode. The conductive material can also be formed on the substrate by other impact and non-impact methods. In a preferred embodiment, the method includes cutting the substrate to form a sensor having a connector portion and a transcutaneous portion, the two portions having edges that define one continuous straight line.

Abstract: A method of manufacturing an acoustic wave device includes: forming a conductive pattern on a wafer made of a piezoelectric substrate having an acoustic wave element, the conductive pattern including a first conductive pattern being continuously formed on a cutting region for individuating the wafer, a second conductive pattern being formed on an electrode region where a plated electrode is to be formed and being connected to the acoustic wave element and a third conductive pattern connecting the first conductive pattern and the second pattern; forming an insulating layer on the wafer so as to have an opening on the second conductive pattern; forming the plated electrode on the second conductive pattern by providing an electrical current to the second conductive pattern via the first conductive pattern and the third conductive pattern; and cutting off and individuating the wafer along the cutting region.

Abstract: Head elements are formed on a wafer to suppress deterioration in pinning strength of a pinned layer, which is caused by ESD generated during air bearing surface polishing of a thin film magnetic head. The wafer is cut into rovers in each of which are connected head elements. Rover air bearing surfaces are polished until an MR elements attain a predetermined height. A final polishing step finishes air bearing surfaces by applying an electroconductive polishing liquid to achieve a predetermined shape and surface roughness with high accuracy. A pinning defect occurrence rate is reduced by suppressing deterioration in pinning strength of a pinned layer of a read element. To achieve this, a specific resistance of the electroconductive polishing liquid is controlled to 5 G?·cm or less. A shallow rail and a deep rail are formed on the air bearing surfaces, and the rover is cut into thin film magnetic heads.

Abstract: An improved vehicle box assembly with an upright front or side panel defined by a monolithic one-piece roll-formed steel sheet member having a desired three-dimensional configuration. The sheet steel member is roll-formed in the lengthwise direction thereof. The panel has a channel, preferably a closed tubular channel on the front panel, roll-formed along one edge of the sheet steel during forming of the panel. The closed tubular edge rail is preferably closed by a seam weld which extends lengthwise therealong and is performed in line with the roll-forming operation. The roll-formed panel is preferably provided with a flat shelf deformed horizontally to extend lengthwise along the panel downwardly from the top rail.

Abstract: This present invention discloses a cutting shield machine used for separating iron shells of connectors from a metal strip. The cutting shield machine includes a worktable, a separation apparatus located in the worktable, a carrying apparatus located in the worktable delivering the metal strip into the separation apparatus, a receiving box located in the worktable for receiving the iron shells from the separation apparatus, a crossing apparatus and a driving apparatus located in the worktable. The separation apparatus has a prop stand located in the worktable, a rotating portion with a columned portion capable of rotation and a pole are fixed in the prop stand in sequence in the transmission direction of the metal strip. The metal strip passes from the top of the rotating portion and the bottom of the pole or from the bottom of the rotating portion and the bottom of the pole.

Abstract: A method of producing an electret condenser microphone capable of reflow mounting includes a first step of providing a backplate substrate having a backplate; a second step of providing an adhesive-backed fluorine-containing resin film formed by stacking an adhesive on a film-shaped fluorine-containing resin material having a surface treated by wet or dry chemical etching; a third step of stacking the adhesive-backed fluorine-containing resin sheet on the backplate of the backplate substrate with the adhesive interposed therebetween; a fourth step of setting the adhesive to firmly secure the fluorine-containing resin material to the backplate of the backplate substrate; and a fifth step of implanting electric charges into the fluorine-containing resin film firmly secured onto the backplate.

Abstract: The invention relates to a method for the manufacture of a sensor element and to a sensor element. In the method, both surfaces of a sensor film are provided with metallic electrodes. The sensor element is produced by cutting it from a larger amount of sensor element material. In the manufacture of the sensor element material, the electrodes are produced as a continuous process from roll to roll and the sensor element material is formed by laminating as a continuous process from roll to roll. At least the signal electrode consists of repeated electrode patterns (41) which are at least partially connected to each other via one or more narrow connecting strips (42), and a sensor element of a desired length and/or shape is produced by cutting the material across the region of the connecting strips.

Abstract: A method of producing a decorative carpet tile may include providing a carpet tile in accordance with the prior art techniques and then treating the carpet tile in one of various manners to provide a separation internal to side edges of the carpet tile. The treatment can include tip shearing side portions relative to an internal portion to provide at least one discontinuity, dripping colors to provide a frame, carving, burning, or otherwise providing a separation internal to the side edges of the carpet tile in various disclosed embodiments.

Abstract: A method of fabricating a condenser tube having a pre-determined tube length and multiple channels including the steps of forming an aperture in a flat strip of metal; moving the flat strip through a plurality of forming operations to fold into an enclosed tube containing channels, which channels include the aperture in their sides and bottoms; and severing the enclosed tube across the aperture to separate the enclosed tube into one condenser tube. The aperture eliminates the need for the channel sides to be severed, hence only the portion of the condenser tube enclosing the channels requires severing. Each pair of apertures is spaced from the next pair of apertures by the pre-determined tube length so that each sever produces one condensing tube of the pre-determined tube length with the apertures being divided into open notches. The invention also includes a heat exchanger utilizing the condenser tube with channel sides containing portions of the apertures.

Abstract: To provide a component built-in wiring board and a manufacturing method thereof capable of further improving component mounting density without deteriorating-reliability.

Abstract: A padlock includes a lock body, a shackle, and a sleeve. The lock body includes opposed front and rear longitudinally extending side walls terminating at first and second end portions. The shackle extends from the first end portion of the lock body. The sleeve covers at least a portion of each of the longitudinally extending side walls, and an internal surface of the sleeve includes at least one longitudinally extending rib contacting at least one of the front and rear longitudinally extending side walls to define a gap between the sleeve and the lock body.

Abstract: A molding process of composite material including high-thermal-conductor and room-temperature magnetic refrigerant comprises the steps of nesting magnetic refrigerant with high-thermal-conductor and connecting them mutually, especially making the room-temperature magnetic-thermal-conductor into sheet, strip or filament, inserting the high-thermal-conductors'sheet, strip or filament in the room-temperature magnetic refrigerant's sheet or filament and connecting them fully. This invention has solved the application of the room-temperature magnetic-thermal-conductor, particularly the application of the room-temperature magnetic-thermal-conductor which is lower thermal-conductor, easier oxidation and powdering. The invention utilizes the high thermal-conductor to solve the problem of room-temperature magnetic refrigerant which is poor in conventional heat exchange, meanwhile decreases the loss of the magnetic-thermal effect.

Abstract: Methods for making devices comprise forming a plurality of transducers on a major surface of a wafer, including forming a plurality of solid layers each having a thickness that is less than one micron; dividing the wafer and the attached transducers into a plurality of units such that each of the units includes a portion of the layers and a substantially planar surface that is substantially perpendicular to the portion of the layers; and removing at least part of the substantially planar surface, including creating, for each transducer, at least one flexible element that is attached the transducer. Conventional problems of connecting a head to the flexure and/or gimbal are eliminated. The heads can be made thinner than is conventional and gimbals and flexures can be more closely aligned with forces arising from interaction with the media surface and from seeking various tracks, reducing torque and dynamic instabilities.

Abstract: To provide a method of manufacturing magnetic head slider which is capable of improving the product quality, simplifying the manufacturing process, and reducing the manufacturing time. This method of manufacturing a magnetic head slider, formed by cutting out from a block member, includes the steps of: processing an end face of the block member forming one surface of a magnetic head slider; holding fixedly the end face of the block member processed; and while maintaining a holding state provided by the step of holding, cutting a portion of the end face side of the block member, and processing a cut surface of the cut portion forming another surface of the magnetic head slider.

Abstract: A wireless communication device such as a cell phone is rendered temporarily inoperable by enclosing the device in a container such as a heat sealable bag (1) which has been metallized so that when the device (2) is sealed in the container (1) it is surrounded by a metal layer (9) which blocks signals to and from the device (3) to thereby render it inoperable. The device is sealed within the container (1) by a seal such as a heat seal which will reveal any attempt to remove the device from the container.

Abstract: A semiconductor device includes a lateral end surface and a connection electrode for external electrical connection. The connection electrode is exposed at the side surface. A manufacturing method of the semiconductor device includes steps of forming a linear recess in a silicon substrate between adjacent semiconductor devices, forming, on an inner surface of the recess, the electrode for external electrical connection of one of the semiconductor devices, and a step of separating the one semiconductor device from another on the silicon substrate by cutting the silicon substrate along the linear recess. Forming the electrode includes steps of forming a metal thin film astride a cutting line at which the silicon substrate is to be cut, forming a resist layer and patterning the resist layer on the metal thin film, growing metal at a portion not having the patterned resist layer, and removing the patterned resist layer and the metal thin film below the patterned resist layer.

Abstract: A method for forming an organic or partly organic switching device, comprising: depositing layers of conducting, semiconducting and/or insulating layers by solution processing and direct printing; defining microgrooves in the multilayer structure by solid state embossing; and forming a switching device inside the microgroove.

Abstract: The sensitivity of the ABS shape of a suspension mounted slider to temperature variations can be greatly reduced if the backside of the slider is lapped to a smooth convex contour that is similar to the ABS shape, rather than to a planar shape, prior to mounting the slider on the suspension. When the backside surfaces of sliders are shaped in this manner, the size of changes in the crown height of the ABS shape due to temperature variations are greatly reduced and the ABS shapes are distributed more tightly, thereby increasing disk drive reliability.

Abstract: Certain example embodiments relate to a method for bonding slider row bars for a photolithography process. A holding device having a sticky surface is formed. A plurality of slider row bars is provided, with each having a first surface for forming an air bearing surface and a second surface opposite the first surface. The slider row bars are secured to the holding device with their first surfaces facing the sticky surface so that the first surfaces of the slider row bars are aligned each other. The slider row bars are bonded together by an encapsulating glue. A carrier is provided, and the carrier is bonded to the second surfaces of the slider row bars. The holding device is removed. The example embodiments also can be used to manufacture sliders.

Abstract: A method comprises providing a substantially planar slab of piezoelectric material having a top surface. The method further comprises drilling a plurality of holes through the top surface and into the slab. The method further comprises making a plurality of cuts through the top surface and into the slab. The cuts form a plurality of polygons that are generally centered about one of the holes. The method further comprises plating the slab with an electrically conductive material. The method further comprises removing the electrically conductive material from the top surface of the slab. The method further comprises cutting the slab substantially parallel to the top surface.

Abstract: A method for bonding slider row bars for photolithography process, includes steps of: providing a first carrier plate having a sticky surface; providing slider row bars each having a first surface for forming ABS and an opposite second surface, and securing each slider row bar to the first carrier plate with its first surface facing the sticky surface; providing an encapsulation glue and dispensing it to the second surfaces and gaps between the slider row bars; providing a second carrier plate and attaching it to the second surfaces through the encapsulation glue; irradiating the first carrier plate and the encapsulation glue with ultraviolet light such that the first carrier plate is removed from the slider row bars, and the encapsulation glue is cured to bond the slider row bars with the second carrier plate together.

Abstract: A tuning fork vibrator includes a long plate-shaped vibration unit having a first principal surface and a second principal surface, a base disposed at one end of the second principal surface of the vibration unit in the longitudinal direction, and a slit for dividing the vibration unit into two legs defining a tuning fork along the longitudinal direction symmetrically in the width direction of the vibration unit. The slit is formed so as to include a portion of the base in the vicinity to the vibration unit.

Abstract: A nozzle plate includes a nozzle surface and a nozzle hole. The nozzle surface defines an ink ejection port. The nozzle hole includes a taper hole portion and a curved-surface hole portion. The taper hole portion has an inner surface of a truncated conical shape and has the smallest diameter at one end thereof. The curved-surface hole portion has an inner surface of a curved-surface shape. The inner diameter of the curved-surface hole portion gradually decreases as approaching from the one end of the taper hole portion to the ink ejection port.

Abstract: A method comprises providing a substantially planar slab of piezoelectric material having a top surface. The method further comprises drilling a plurality of holes through the top surface and into the slab. The method further comprises making a plurality of cuts through the top surface and into the slab. The cuts form a plurality of polygons that are generally centered about one of the holes. The method further comprises plating the slab with an electrically conductive material. The method further comprises removing the electrically conductive material from the top surface of the slab. The method further comprises cutting the slab substantially parallel to the top surface.

Abstract: A superconducting material useful for forming electrolytic devices is made by establishing multiple niobium or tantalum components in a primary billet of a ductile material; working the primary billet through a series of reduction steps to form the niobium or tantalum components into elongated elements; cutting and restacking the resulting elongated elements with a porous confining layer to form a secondary billet, working the secondary billet through a series of reduction steps including twisting and final rolling to thin ribbon cross-sections with greater than 5:1 Aspect Ratios; cutting the resulting elongated billet into sections; and leaching the core and sheath at least in part.

Abstract: A read/write head for a disk drive having a shorting conductor from a shield of the read element to a conductor that runs from the write element to an external electrical contact pad. This allows for the measurement of the electrical isolation between the read sensor and the read shield via the external contact pads. Such a capability allows the electrical isolation to be measured both during the lapping process and subsequent to the heads being diced into separate sliders. This shorting conductor may be in the form of an internal shorting stud or in the form of an interim conductor that passes through the parting zone between adjacent heads. In the latter case, the shorting conductor is broken when the heads are diced so that a head of this embodiment can only be measured for electrical isolation prior to dicing.

Abstract: A slider manufacturing method includes: providing a row bar constructed from multiple slider bodies having a surface for forming an air bearing surface (ABS); forming multiple cutting lines on the surface for forming an ABS of the row bar; forming a stress absorption region adjacent to the cut line in a cutting region defined by two adjacent cutting lines; grinding the surface for forming an ABS of the row bar; and cutting the row bar along the cutting lines to form multiple individual sliders. When the row bar is cut by a cutter into multiple individual sliders along the cutting lines, stress generated in the cutting region adjacent to cutting lines during cutting is partly or fully absorbed by the stress absorption region, reducing the chances of clear edge jumps forming at the edges of the ABS of the slider after the cutting, and disk surface scratching by the slider.

Abstract: A slider separating method includes bonding a row bar containing a plurality of slider-forming portions to a bonding surface of a cutting fixture along a side surface that extends in its length direction; cutting the row bar bonded on the cutting fixture into individual sliders along cutting gaps provided between the slider-forming portions; decreasing bonding force between each diced slider and the bonding surface; and separating the sliders with decreased bonding force from the cutting fixture by pushing each slider along a side direction being parallel to the bonding surface and perpendicular to the length direction and holding and receiving the slider to a slider tray having recesses formed therein which is partitioned according to the sliders. The method can reliably and efficiently separate a row bar containing a plurality of slider-forming portions into individual sliders without depending upon size or arrangement pitch of the sliders and hold these sliders.

Abstract: A method is presented for repairing damaged photomasks for electronic component fabrication processes, particularly for fabrication of the ABS of a disk drive slider. The method includes applying an overcoat of material having index of fraction which is close to the index of refraction of the photoresist material of the damaged photomask to produce a non-scattering boundary surface. The overcoat material preferably includes an overcoat base material which is a polymer having an index of refraction which is in the range of plus or minus 0.1 from the index of refraction of said photoresist material.

Abstract: The overcoat of a slider (alumina) is recessed relative to the slider ABS by a non-abrasive CMP process sufficiently to prevent thermal protrusion of the overcoat during subsequent slider use in a hard disk drive. The CMP process involves the oscillatory and rotational compressional contact between the ABS surface of the slider and a polymerically pre-treated compliant pad that is sprayed by an aqueous alkali lubricating solution having a pH between about 9 and 10. The overcoat is thereby also softened by the lubricating solution and removed by the compressional contact and no use of abrasives is required.

Abstract: There is provided a method of manufacturing a crystal unit, the method including: providing a package wafer including a plurality of connecting terminals each having top and bottom ends exposed to top and bottom surfaces of the package wafer; mounting a crystal blank having an excitation electrode formed thereon on at least one of the connecting terminals of the package wafer; depositing and bonding a cap wafer having a cavity with an open bottom therein on the top surface of the package wafer where the crystal blanks are mounted; and cutting bonding portions between the package wafer and the cap wafer into a plurality of individual crystal units. The crystal unit is reduced in thickness and size, and can be manufactured in mass production and packaged in a single process, thereby increasing lead time and process efficiency.

Abstract: A method, system, and apparatus for transfer of dies using a die plate is described herein. The die plate has a planar body. The body has a plurality of holes therethrough. A support structure and the die plate can be positioned to be closely adjacent to each other such that each die of a plurality of dies attached to the support structure adheres to a first surface of the die plate. The dies can subsequently be transferred from the die plate to one or more destination substrates or other surfaces, by a punching mechanism.

Abstract: A silicon condenser microphone package is disclosed. The silicon condenser microphone package comprises a transducer unit, substrate, and a cover. The substrate includes an upper surface having a recess formed therein. The transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and includes an aperture.

Abstract: A method of preparing a composite sheet unit includes arranging a plurality of sintered piezoelectric thin wires in a uniform direction on a surface of a resin layer is prepared. A plurality of the same are laminated and integrated so that the sintered piezoelectric thin wires are positioned between the resin layers. Here, a curing resin may be impregnated therein so as to form resin-impregnated-cured portions. Then, the lamination is cut in a direction crossing a lengthwise direction of the sintered piezoelectric thin wires, so that a piezocomposite is obtained. Cut surfaces may be ground. By so doing, it is possible to provide a highly reliable piezocomposite having a fine structure at low cost, and to provide an ultrasonic probe for ultrasonic diagnostic equipment, as well as ultrasonic diagnostic equipment using the same.

Abstract: Provided is a method and system for manufacturing a hard drive platen. The method includes depositing two or more types of film around a central core to form a plurality of film layers, each film layer being of a different type than its adjacent layers. Next, the deposited film layers are sectioned to expose a patterned surface. The patterned surface is then planarized and selectively etched to expose patterns comprised of one of the types of film to a predetermined depth to produce a selectively etched surface. Magnetic material it deposited within etches of the surface and the surface is then planarized to form separated magnetic tracks therein.

Abstract: A piezoelectric thin film resonator which can reduce variations in resonant frequency and resonant resistance by uniformly planarizing a structural film, and a method of manufacturing the piezoelectric thin film resonator. The piezoelectric thin film resonator has a substrate having at least one flat major surface; a dielectric film having two support portions supported by the major surface of the substrate and a floating portion which is connected to the support portions and which is disposed over the major surface of the substrate with an airspace layer provided therebetween; and a vibration portion which is formed of a pair of electrodes and a piezoelectric thin film provided therebetween and which is provided on the floating portion of the dielectric film at a side opposite to the airspace layer. A surface of the dielectric film at a side opposite to the substrate is planarized by a plasma treatment using an inert gas or a gas containing an element forming a dielectric film.

Abstract: A producing method of producing a solid state pickup device is provided. Imaging elements are formed on a wafer in a matrix form. Each of the imaging elements has a light receiving surface and plural contact points. Receiving surface border portions are formed on a glass plate to protrude therefrom in a matrix form by etching. The receiving surface border portions are attached to the wafer to surround the light receiving surface in each of the receiving surface border portions. The light receiving surface is spaced from the glass plate. The glass plate is diced outside respectively the receiving surface border portions, to form shield glass for covering the light receiving surface. The wafer is diced for each of the imaging elements, to obtain the solid state pickup device having the shield glass and one of the imaging elements.

Abstract: A method for manufacturing a wiring board having an electronic component disposed on a substrate and an insulating film formed around the electronic component through application of an insulating material, is disclosed. The method includes: cutting off an electronic component forming substrate on which a plurality of the electronic components are formed, after the electronic component forming substrate has been fixed on a supporting member, to individually separate the plurality of the electronic components; performing lyophilic processing on surface of the plurality of the electronic components while the electronic component forming substrate is fixed on the supporting member; and forming an insulating film around an individually separated electronic component, the electronic component being disposed on the substrate in such a manner that the individually separated electronic component is distanced from the supporting member.