Abstract: There is disclosed a method of manufacturing a plurality of removable permanently magnetized elements from a substrate comprising ferrite material. The method prints symbol images on the substrate with an offset, automatic sheet-fed press, and die cuts the symbol images on the substrate with an automatic sheet-fed die cutter to form a plurality of elements forming portions of the substrate. Thereafter, the method magnetizes the ferrite material to permanently magnetize the substrate and form the plurality of permanently magnetized elements. The method reduces wastage, permits for improved substrate registration, more accurate symbol placement on the substrate, higher production speeds, and reduced labor costs.

Abstract: A method and apparatus is provided for forming a printed circuit board or other panel in which an array of vias are arranged in a desired connection grid within one or more layers of the board and then the board and vias are cut to form an edge of the board where a surface of the vias is exposed. The board may be orthogonally mounted on its edge to another thin circuit board or aperture sheet with the exposed surface of each via directly connected to such other board or sheet.

Abstract: A method of making a chip resistor is provided. The method includes the following steps. First, a resistive element is provided on a substrate. Then, a resin layer is formed on the substrate to enclose the resistive element. Then, the substrate and the resin layer are cut in this order. To prevent the breakage of the substrate during the cutting, the resin layer has better machinability than the substrate.

Abstract: A method of manufacturing a magnetic core includes providing a substrate with magnetically permeable material that has a first region and a second region near the first region, providing support to maintain a juxtaposition between the first region and the second region, forming a slit through the magnetically permeable material between the first region and the second region, introducing a binding agent into the slit and removing the support; wherein the binding agent maintains the juxtaposition between the first region and the second region after the support is removed.

Abstract: A method of producing an actuator includes shaping a block of ferroelectric material to provide an active element of the actuator. The element includes a stack of ferroelectric layers with adjacent layers separated by electrodes arranged parallel to end faces of the element. The method includes applying a primary electrode to the end faces, immersing the element and the primary electrode within a dielectric fluid, applying a primary poling voltage to the primary electrode so as to polarize the element in a first polarization direction, applying a secondary external electrode to side faces of the element, and applying a secondary poling voltage to the secondary electrode to polarize alternate layers along the first polarization direction and the other layers along a second, oppositely-directed polarization axis. The method may also include applying a conductive film to the end faces and/or applying heat to help evaporate the dielectric fluid.

Abstract: The method for manufacturing a suspension for disc drive includes a process for manufacturing a semi-finished suspension product integrally including a base plate, a rigid body portion of a load beam, and a pair of connecting portions connecting the base plate and the rigid body portion. The method also includes a process for fixing a spring member, formed independently of the semi-finished suspension product, to the base plate and the rigid body portion of the semi-finished product, and a process for cutting off the connecting portions, projecting individually from the opposite sides of the spring member, from the base plate and the rigid body portion after the spring member is fixed to the semi-finished suspension product.

Abstract: A method of manufacturing an electrical connecting element with a predetermined breaking point is provided, the method comprising the steps of providing a core which comprises fiber reinforced material, of cutting the core at a cutting location where the predetermined breaking point is to be, and thereby creating a cut in the core, of adding at least one layer of material including a dielectric in a non-hardened state, the at least one layer at least partially covering the cut, and thereby at least partially filling the cut with dielectric material, of hardening the dielectric material, and of cutting through the layer of material at the cutting location.

Abstract: Methods for producing micromachined layered devices having a membrane layer and a first and second layer on both sides of the membrane layer are disclosed. The method includes applying a membrane layer to a substrate, opening a window in the substrate so as to enable the addition of layers from both sides of the membrane layer while the substrate is made into a frame that supports the membrane layer during processing, adding at least one layer on each side of the membrane either simultaneously or on one side at a time, and removing the device from the substrate frame.

Abstract: A magnetic write head and method for bulk fabrication of the same are provided. A trench is formed in a nonmagnetic substrate. A first magnetically permeable layer is deposited in the trench of the substrate. An optional first insulating layer is deposited in the trench. A conducting circuit is defined in the trench. The conducting circuit creates the magnetic flux. An optional second insulating layer is deposited in the trench. Writer gaps are patterned and then a second magnetic layer is added over the second insulating layer. The substrate is divided to form individual write heads.

Abstract: A method of making an encoder for use in a speed sensor includes providing a metal tube. A material containing ferrite is then extruded over the metal tube to produce an encoder tube. The encoder tube is cut to a given length to form an encoder. The encoder is then magnetized within a magnetic field.

Abstract: A method of manufacturing an ultrasonic probe including the steps of forming a plurality of first slits on a layered assembly having a first imner electrode member and a second inner electrode member through a top surface of the layered assembly and forming a plurality of second slits through a bottom surface of the layered assembly, forming a first vertical electrode layer on each side surface within each of the first slits, forming a second vertical electrode layer on each side surface within each one of the second slits and forming a plurality of separating slits on the layered assembly to divide the layered assembly into a plurality of transducer elements.

Abstract: A manufacturing method of producing a non-reciprocal circuit device, which is much smaller than a conventional counterpart, with excellent mass productivity. A support substrate having support portions arranged therein in a lattice-like form is produced, and a previously manufactured gyromagnetic component is bonded on each of the support portions. Then, a permanent magnet plate is bonded. The permanent magnet plate has a plane area which covers all the gyromagnetic components. Subsequently, the entire structure is cut in accordance with each gyromagnetic component.

Abstract: In this manufacturing method for a frame body, after ring rolling a metal material to form a ring-shaped member, a rectangular member is formed by pressing and deforming this ring-shaped member in the radial direction. At this time, an angle of corner portions that impart the rectangular shape to the rectangular member is formed smaller than an angle of the frame body that is to be obtained by die forging the rectangular member. According to the frame body obtained by this manufacturing method for a frame body, it is possible to increase the mechanical strength, and in particular, the creep strength. Furthermore, when forming the frame body, the occurrence of defects during manufacture may be restrained, it becomes possible to realize a reduction of the amount of waste metal material and the manufacturing time, and thereby this frame body may be formed inexpensively.

Abstract: A manufacturing method of a flying magnetic head slider includes a step of providing a substrate with a plurality of inductive write head elements formed thereon, each head element having a pair of magnetic poles facing to each other via a magnetic gap, and with a protection layer covering the plurality of inductive write head elements, a step of cutting the substrate to separate into a plurality of bar members, each of the bar members having aligned inductive write head elements, a step of processing the protection layer of each bar member so that a distance from an end edge of the pair of magnetic poles to an edge of a bottom surface of the bar member becomes in a range of 1 to 15 ?m, a step of lapping each bottom surface of the bar member, and cutting each bar member to separate into a plurality of individual magnetic head sliders.

Abstract: A hermetically sealed mobile hard disk drive that combines high storage capacity and performance with low power consumption and portable operation, including an integrated base substrate. One embodiment is a method for fabricating an integrated base substrate with a plurality of spiral conductors, MR stripes, and interconnect conductors fabricated by a semiconductor process, and upon which electronic integrated circuits are later assembled. Various embodiments of the invention can support a single or dual rotor spindle assembly, a multi-arm actuator assembly, and a housing to form a hermetically sealed chamber with the integrated base substrate. Various embodiments of the invention can be filled with low viscosity gas at ambient pressure or a lower than ambient pressure.

Abstract: A method for fabricating a multi-track thin-film magnetoresistive tape head with precisely-aligned read/write track-pairs fabricated on a monolithic substrate wafer is provided. The wafer is fabricated using modified standard thin-film processes for fabricating direct access storage device heads and modified substrate lapping procedures. Gap-to-gap separation within each read/write track-pair is reduced to nearly the thickness of the substrate wafer. Fabricating on both sides of the wafer, may enable hundreds or thousands of head elements to be aligned in one step of the fabrication process while reducing the number of pieces in the completed head assembly.

Abstract: A method for manufacturing a piezoelectric oscillator. The method having the step of preparing a master substrate partitioned into plural substrate regions. Mounting on each of the substrate regions a piezoelectric vibrator and an IC for controlling an oscillation output of the piezoelectric vibrator. The master substrate is then divided into individual substrate regions by cutting the master substrate on the outside circumferences of the individual substrate regions, thereby obtaining a plurality of piezoelectric oscillators.

Abstract: Improved process for manufacturing ring-type metal joints for high pressure ducts, characterized because it presents the following steps: a) oval bar manufacturing and b) ring-type metal joints manufacturing, wherein the oval bar manufacturing comprises the following steps: submitting a round metal bar to a sharpening treatment before it is drawn through a die and forming the oval bar; cutting, rolling, and bending the oval bar and welding the profile; submitting the joint to an electrolytic coating treatment.

Abstract: A method of making a micro-fluid ejection head structure for a micro-fluid ejection device. The method includes applying a removable mandrel material to a semiconductor substrate wafer containing fluid ejection actuators on a device surface thereof. The mandrel material is shaped to provide fluid chamber and fluid channel locations on the substrate wafer. A micro machinable material is applied to the shaped mandrel and the device surface of the wafer to provide a nozzle plate and flow feature layer on the shaped mandrel and wafer. A plurality of nozzle holes are formed in the nozzle plate and flow feature layer. The shaped mandrel material is then removed from the device surface of the substrate wafer to provide fluid chambers and fluid channels in the nozzle plate and flow feature layer.

Abstract: A method is used for fabricating sliders for use in a disc drive actuation system, the sliders having bonds pads formed on either a top surface or side faces of the slider. The method comprises providing a substrate having a top surface. Trenches are formed in the substrate and filled with a bond pad material to form slider bond pads. Excess bond pad material is removed from the trenches such that the slider bond pads are flush with the top surface of the substrate. A transducer is fabricated on the top surface of the substrate. Finally, the slider bond pads are exposed.

Abstract: A slider manufacturing method of the invention comprises: providing a row bar constructed by a plurality of slider bodies which has a surface for forming air bearing surface; forming a plurality of cutting lines on the surface for forming air bearing surface of the row bar; forming a stress absorption region adjacent to the cut line in a cutting region defined by two adjacent cutting lines; grinding the surface for forming air bearing surface of the row bar; and cutting the row bar along the cutting lines to form a plurality of individual sliders. When the row bar is cut by a cutter into a plurality of individual sliders along the cutting lines, stress generated in the cutting region adjacent to cutting lines during cutting process is partly or fully absorbed by the stress absorption region, thus no clear edge jumps will form at the edges of the ABS of the slider after cutting process, and the risks of disk surface scratching by slider also being eliminated.

Abstract: There is disclosed a member for sealing, baffling and/or reinforcing components of an automotive vehicle. The assembly generally includes a carrier, an expandable material and at least one fastener.

Abstract: A system and a method for in-line production of insulated glass units (IGU) for custom windows. The system and method schedule IGU production based on the order in which the cut glass is available, or broken out, from a glass cutting station. Once the IGUs are assembled, they are then sorted into the order in which they are to be further processed, i.e., into the order in which the corresponding windows are to be produced and shipped. Thus, the sorting, or carting, step occurs after the cut glass is contained in sealed IGUs, and the workers who perform the sorting step do not have to directly handle the pieces of cut glass.

Abstract: In a method for producing a protective cover for a device formed in a substrate, at first a sacrificial structure is produced on the substrate, wherein the sacrificial structure comprises a first portion covering a first area of the substrate including the device and a second portion extending from the first portion into a second area of the substrate including no device. Then a first cover layer is deposited that encloses the sacrificial structure such that the second portion of the sacrificial structure is at least partially exposed. Then the sacrificial structure is removed, and the structure formed by the removal of the sacrificial structure is closed.

Abstract: An anisotropic conductive film is prepared by winding an insulated wire around a core member to form one roll of a winding layer, placing an insulating resin film on the obtained winding layer, and repeating the step of winding the insulated wire and the step of placing the insulating resin film to give a laminate alternately having the winding layer comprising a single row of insulated wires and an insulating resin layer made from the insulating resin film. A coating layer and insulating resin layer are melted to integrate the winding layer and the insulating resin layer. The laminate then is sliced along a plane forming an angle with the insulated wire in a desired film thickness.

Abstract: In a method for marking a fuse in order to allow for the rapid visual identification of certain characteristics of that fuse, the fuse is provided with: a first color-coded visual indicia indicative of an amperage rating of the fuse; a second color-coded visual indicia indicative of an action value of the fuse; and/or a third color-coded visual indicia indicative of a voltage rating of the fuse.

Abstract: The fabrication of a semiconductor integrated circuit device involves testing using a pushing mechanism that is constructed by forming, over the upper surface of a thin film probe, a reinforcing material having a linear expansion coefficient (thermal expansion coefficient) almost equal to that of a wafer to be tested; forming a groove in the reinforcing material above a contact terminal; placing an elastomer in the groove so that a predetermined amount projects out of the groove; and disposing a pusher and another elastomer to sandwich the pusher between the elastomers. With the use of such a probe, it is possible to improve the throughput of wafer-level electrical testing of a semiconductor integrated circuit.

Abstract: Method for manufacturing an electromechanical sensor element for converting mechanical forces produced by the movements and vital functions or a person into electric signals, in which method a sensor film (11) is provided with metallic electrodes (15,16) placed on either side of it, at least one of said electrodes being a signal electrode, in which method is produced by cutting off a larger amount of sensor element material, in which method in the manufacture of sensor element material the electrodes are created in a continuous roll-to-roll process, and in which method the sensor element material is produced by laminating as a continuous roll-to-roll process. At least the sensor element material consists of repeated electrode patterns and a sensor element of a desired size and/or shape is formed by cutting the material between the patterns.

Abstract: A print head manufacturing method in which satisfactory precision can be obtained by simple processes are provided. Projecting objects having a predetermined shape are formed on a substrate, and a setting resin is applied on the substrate and is set. Then, the projecting objects are removed so that ink cells and nozzles are formed. The thickness of the setting resin is determined such that tip portions of the projecting objects project above the setting resin and ink cells can be formed.

Abstract: A method of fabricating electrical core sheet assemblies such as transformer limbs, transformer yokes, and transformer cores, includes the steps of first cutting electrical core sheets, whose main surfaces have been provided with an anti-corrosion layer, into a desired shape. The side surfaces of the cut core sheets are first provided with an anti-corrosion layer, before the cut core sheets are assembled into the desired core sheet assembly.

Abstract: A wiping device particularly for motor vehicles includes a wiper blade formed of a wiper rubber with two longitudinal grooves arranged opposite each other and a supporting element in the form of two elongated elastic rails arranged in the longitudinal grooves. An adapter element is provided on the supporting element to connect the wiper blades to a driveable wiper arm. A connecting element extending in a cross direction is used to connect the opposite-lying elastic rails and is arranged on at least one of the free ends of the wiper blade. The connecting element is welded to both of the front sides of the extremities of the elastic rails which are situated opposite each other.

Abstract: The present invention relates to a semiconductor electret condenser microphone capable of being reduced in size and including an acoustic sensor 100 and a case 200 for accommodating the acoustic sensor 100, the acoustic sensor 100 has a semiconductor chip 110 forming necessary electronic circuits 111A to 111C, and opening a through hole 112 away from the electronic circuits 111A to 111C, an electrode layer 120 formed on the surface of the semiconductor chip 110 away from the through hole 112, an electret member 130 laminated away from part of the electrode layer 120 and through hole 112, and a diaphragm 140 provided with a spacing 160 to the electret member 130, in which the electrode layer 120 exposed from the electret member 130 is connected to the electrode 111a of the electronic circuit 111A through the case 200 (FIG. 6).

Abstract: Embodiments include a slider having a silicon body and at least one carbide pad structure embedded therein. At least one head structure for reading and/or writing data is located on the silicon body. The silicon body includes an air bearing surface on which the head is located. The air bearing surface also includes at least a portion of the carbide pad structure thereon. In one aspect, the metal carbide structure may be made from a material such as titanium carbide, zirconium carbide, vanadium carbide, tungsten carbide, or molybdenum carbide. In another aspect, the head may be located on the air bearing surface between carbide pad structures.

Abstract: A slider comprises a slider section and a reproducing head section. The slider section has a first medium facing surface, an air inflow end, and a recording head. The reproducing head section has a second medium facing surface, an air outflow end, and a reproducing head. The slider section and the reproducing head section are fabricated separately, and bonded to each other so that the first medium facing surface and the second medium facing surface are continuous.

Abstract: A method for shaping an ABS of a magnetic head slider including a step of holding at least one row bar with a plurality of aligned thin-film magnetic head elements by adhering a first surface of the at least one row bar to an adhesive or UV tape capable of passing a laser beam there through, the first surface being opposite an ABS of the at least one row bar, a step of shaping the ABS of the at least one row bar in a convex shape by radiating a laser beam to the first surface of the at least one row bar through the adhesive or UV tape, a step of cutting the at least one row bar into individual magnetic head sliders, and a step of then, removing the magnetic head sliders from the adhesive or UV tape after weakening adhesion properties of the adhesive or UV tape.

Abstract: A method of manufacturing a thin quartz crystal wafer from a quartz crystal block which is cut from a crystal body of synthetic quartz crystal and has a flat principal surface, comprises the steps of (a) converging a laser beam at a region in said quartz crystal block at a predetermined depth from the principal surface thereof to cause multiphoton phenomenon state, thereby breaking Si—O—Si bonds of quartz crystal in said region to form voids in said region, and (b) peeling said thin quartz crystal wafer from a body of said quartz crystal block along said voids. The above process is repeatedly performed on one quartz crystal block to peel off a plurality of thin quartz crystal wafers successively from the principal surface of the quartz crystal block. Each of the thin quartz crystal wafers is divided into individual quartz crystal blanks for making quartz crystal units.

Abstract: The present invention makes it possible to fix connector pins at low cost. Connector pins penetrate both a holding substrate and a main substrate. The connecter pins can be restrained from an outward radial direction by both wall surfaces of pin holes of the holding substrate, and wall surfaces of through-holes of the main substrate, thus improving upright-standability of the connector pins. The holding substrate is formed of a same raw substrate as the main substrate is formed of, and permanent resists which are laminated on the holding substrate, and ink used for silk screen printing to which the holding substrate is subjected, are made of a same material of the main substrate, so that fire resistance of the holding substrate and fire resistance of the main substrate are same. Therefore, if the main substrate clears a predetermined fire-resistance standard, the holding substrate also inevitably clears the predetermined fire-resistance standard.

Abstract: A thin and flexible radio frequency (RF) antenna tag or label is disclosed which contains an RF circuit connected to an antenna which is created by demetallizing the area around the antenna pattern on a thin, metallized substrate such as a film or paper web. Antenna(s) may be formed on one or both sides of the substrate and can contain printed, holographic, optical variable device, diffractive, dot matrix, computer-generated holograms or computer-generated optical images. The demetallized RF antenna on the substrate can optionally further be transferred to a second substrate or web by means of a cold foil stamping process. The tag or label is thin and flexible, enabling a wide range of applications including RF tagging of anti-theft devices, product packaging of all types, credit cards, passports, admission tickets, stamps, vehicles, badges, fare cards, roadway tolls, customs and immigration checkpoints identification, and animal identification/tracking devices.

Abstract: Methods for manufacturing a piezoelectric actuator and a liquid ejecting head. In particular, a substrate, which is to be a vibration plate actuated by a piezoelectric element is prepared. A plurality of chip regions are defined on the substrate. A first common electrode of the piezoelectric element is formed on the substrate. A first piezoelectric layer of the piezoelectric element is formed on the first common electrode. A drive electrode of the piezoelectric element is formed on the first piezoelectric layer. A second piezoelectric layer of the piezoelectric element is formed on the drive electrode. A second common electrode of the piezoelectric element is formed on the second piezoelectric layer. Then, the substrate is cut so as to divide the chip regions from one another. In the aforementioned aspects of the invention, the first and second common electrodes as well as the drive electrode are formed so as not to extend beyond the outline of each of the chip regions.

Abstract: A magnet assembly connectable to a metal assembly in an engaging fashion, a metal assembly connectable with the magnet assembly in an engaging fashion and a snapping mechanism comprising the magnet assembly and the metal assembly are disclosed, to be used with a strap and a watch case. A leaf spring element and a base element to be used with a watch case are also disclosed, together with manufacturing processes and a system and method to teach the concept of time.

Abstract: Magnetic heads capable of recording and reading with high sensitivity and resolution are provided by minimizing the outflow of magnetic fluxes from a flux guide to magnetic shields while using a flux guide structure for an MR element. In the magnetic head, magnetic shields exposed on a surface opposite a magnetic recording medium (air bearing surface) and a flux guide exposed between the magnetic heads via a non-magnetic layer are provided, and magnetic fluxes are guided by the flux guide to a magnetoresistive (MR) element formed in a position not exposed on the air bearing surface. The height of the magnetic shields in direction perpendicular to the air bearing surface is less than the distance from the air bearing surface to the MR element.

Abstract: A process is described for fabricating magnetic transducers with metallic thin films with a corrosion resistant surface produced by exposing the thin films to a nitrogen in a plasma chamber. The exposure to the nitrogen is believed to increase the corrosion resistance of the metallic thin films by causing nitrides to form in a thin surface region. In the preferred embodiment the thin film metals of a magnetic transducer are treated with the nitrogen after being cut from the wafer and lapped. Typical metals used in magnetic transducers are NiMn, FeMn, NiFe, cobalt, CoFe, copper, IrMn and PtMn. The films may be further protected by the addition of prior art protective layers such as carbon.

Abstract: A method for fabricating a composite plate for a magnetic resonance imaging magnet. The method including cutting a starting plate having oppositely-directed major surfaces into a plurality of strips. Each of the strips having a width of approximately greater than 9 inches and faces which originally constituted parts of the major surfaces of the starting plate. The strips may be positioned to form the composite plate such that the width of each of the strips is equal to a thickness of the composite plate and the faces of the strips confront one another.

Abstract: On a surface of a glass cloth adhered a mica layer sheet, a mixture of inorganic particles having a thermal conductivity of at least 5 W/mK, a resin, and a solvent is applied to form a layer of the mixture of the inorganic particles, the resin, and the solvent; the layer of the mixture is reduced in thickness using a doctor blade, followed by pressurizing to form a high thermally conducting layer; the mica layer sheet on which the high thermally conducting layer is disposed is cut to obtain a mica insulating tape; and the mica insulation tape is wound around a coil conductor. As a result, an insulated coil that is excellent in the voltage endurance characteristics and has a high thermal conductivity is manufactured.

Abstract: In manufacturing a link plate for a roller chain, a band of sheet steel is intermittently forwarded along a path past series of dies, including rough punching dies and shaving dies. The punching dies and corresponding shaving dies are located symmetrically on opposite sides of an intermediate location along the path. The intermediate location coincides with a location at which the lateral deviation of the band reverses. Consequently, the outer peripheral surfaces of the plate and the inner peripheral surfaces of the connecting pin holes, both being formed by rough punching, are brought into very close alignment with the shaving dies.

Abstract: The invention relates to a method for producing bent spring rails from an endless spring band. The method is characterized by the following steps: continuous bending of a section of spring band; cutting the bent section of spring band into a spring rail; discontinuous reverse bending to reduce the internal stresses of the bent, cut-to-length spring rail by subjecting the spring rail to at least one reverse bending force and/or heat-treating the cut-to-length spring rails, the heat treatment being a low-temperature treatment in this case, preferably at a temperature of less than 200 *C.

Abstract: A method of manufacturing a magnetic head device includes forming a thin film magnetic head element over a substrate, the thin film magnetic head element including a magnetoresistance (MR) element. The substrate is cut such that the MR element is exposed on a side surface of the substrate. The side surface is then polished. Afterward, a magnetically degenerated layer is removed from the thin film magnetic head element along the side surface. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

Abstract: A microphone assembly comprises a microphone, a connector secured to the underside of the microphone. A gasket has a sound collecting hole and is secured on the upper surface of the microphone.

Abstract: An apparatus for controlling propagation of incident electromagnetic radiation is described, comprising a composite material having electromagnetically reactive cells of small dimension relative to a wavelength of the incident electromagnetic radiation. Each electromagnetically reactive cell comprises a metallic element and a substrate. An electron population within the substrate near the metallic element of at least one of the electromagnetically reactive cells is temporally controllable to allow temporal control of an associated effective refractive index encountered by the incident electromagnetic radiation while propagating through said composite material.

Abstract: A duct structure (50), includes lengths of square/rectangular duct (52) manufactured by pre-forming the duct in round cross-section (51) and then transforming the round cross-section into square and rectangular cross-sections utilizing expandable die structures (58). The duct (52) may be connected together end to end by flanged connectors (54) formed from strip stock (71), that is notched at locations that correspond to the corners of the formed flange connector. The cross-sectional profile of the flanged connector is then formed by roll forming and/or bending and/or other techniques. Thereafter, the strip stock is bent at its notched locations to define the corners (80) of the flange connector (54) and then the free ends of the strip stock are fixed together.