Abstract: In manufacturing a pressure sensor a recess that will form part of the sensor cavity is formed in a lower silicon substrate. An SOI-wafer having a monocrystalline silicon layer on top of a substrate is bonded to the lower silicon substrate closing the recess and forming the cavity. The supporting substrate of the SOI-wafer is then etched away, the portion of the monocrystalline layer located above the recess forming the sensor diaphragm. The oxide layer of the SOI-wafer here acts as an “ideal” etch stop in the case where the substrate wafer is removed by dry (plasma) or wet etching using e.g. KOH. This is due to high etch selectivity between silicon and oxide for some etch processes and it results in a diaphragm having a very accurately defined and uniform thickness. The cavity is evacuated by forming a opening to the cavity and then sealing the cavity by closing the opening using LPCVD.

Abstract: An electrical structure that includes a complex power-signal (CPS) substructure. The CPS substructure is formed and tested to determine whether the CPS substructure satisfies electrical performance acceptance requirements. The testing includes testing for electrical shorts, electrical opens, erroneous impedances, and electrical signal delay. If the CPS substructure passes the tests, then a dielectric-metallic (DM) laminate is formed on an external surface of the CPS substructure. The DM laminate includes an alternating sequence of an equal number N of dielectric layers and metallic layers such that a first dielectric layer of the N dielectric layers is formed on an external surface of the CPS substructure. N is at least 2. A multilevel conductive via is formed through the DM laminate and is electrically coupled to a metal layer of the CPS substructure.

Abstract: A method to produce a transponder comprises the steps of positioning a coil comprising at least one coil end in a predetermined coil position and holding all of said coil ends in a respective holding position, and holding a chip comprising at least one contact pad in a chip fixture so that all of said coil ends of the coil that should be bonded to said chip are located on one side of corresponding contact pads of the chip, and bonding of the coil ends to the contact pads.

Abstract: A method of manufacturing filled containers includes providing at least a first and a second part of the container, providing a product within at least one of the first and second parts, and assembling the first and second parts by bonding a portion of the first part to a portion of the second part, thereby generating a bond area. Scanning along the bond area is performed with a transmitted beam of a pulse train of ultrasonic energy. A reflected pulse train of ultrasonic energy from the bond area is sensed and a time derivative of at least one of time lag and of amplitude of the sensed pulse train is determined. A signal indicative of the quality of the bond along the bond area is generated by comparing at least one of the time derivatives with a predetermined threshold valve. If the indicative signal indicates a bond along the bond area is inaccurate, the container is separated. An apparatus for testing filled containers is also disclosed.

Abstract: The invention provides a method of manufacturing a cylindrical encoder, molded from rubber material, containing ferromagnetic powders mixed therein, using a pair of metal molds comprising an upper metal mold and a lower metal mold. The lower metal mold has a cylindrical cavity which is provided with a pot portion at an inlet side thereof, a rectification receiving portion at an outlet side thereof opposing to the inlet side, and a rectification portion between the pot portion and the rectification receiving portion at the inside of the pot portion. An annular shaped rubber material using the rubber material is formed, and mounted on the pot portion of the lower metal mold. The annular shaped rubber material is compressed on to the lower metal mold by using the upper metal mold with the applied heating, thereby charged into the cylindrical cavity.

Abstract: A method for manufacturing a planar sensor, comprises disposing a film of a material on a substrate, wherein the material is selected from the group consisting of platinum, rhodium, palladium and mixtures and alloys comprising at least one of the foregoing materials; annealing the material; measuring a resistance value of the material; laser trimming the annealed material; heat treating the laser trimmed material; and laser trimming the heat treated material to form the sensor.

Abstract: A method of mounting electrical components on a printed circuit board includes moving the printed circuit board to a first mounting location, picking up a plurality of electrical components with a corresponding plurality of mounter heads, and then placing the electrical components onto the printed circuit board with the mounter heads. The mounter heads are arranged so that they can move with respect to each other in both the X and Y directions, which allows the mounting device to mount a plurality of electrical components onto the printed circuit board substantially simultaneously, thereby reducing the amount of time required to produce a finished PCB. In some embodiments of the invention, the printed circuit board may be moved from a first position at which a first mounting head mounts electrical components onto the printed circuit board to a second mounting position at which a second mounting head mounts electrical components on the printed circuit board.

Abstract: A position sensor for an electronic control pedal is carried by the pedal mounting bracket and includes a linear potentiometer having a slider operable along a substrate in only a linear direction for providing an output voltage representative of slider displacement. A drive arm is connected to the pedal shaft for rotation during pedal movement. A coupler connected to the slider is slidable within a slot in the drive arm for providing the linear displacement through a rotational movement of the shaft. The drive arm has an inner arm in a telescoping connection with an outer arm for setting the drive arm at a desired length after potentiometer calibration. The longitudinal axis of the slot is at an non-zero angle to the longitudinal axis of the drive arm for desensitizing the sensor calibration and adjustment process.

Abstract: A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.

Abstract: An information handling system that includes a circuit board for mounting and coupling components of the information handling system. The circuit board includes a trace, a via coupled to the trace, and a cutout region surrounding the via and having a first diameter selected to minimize a loading effect of a via on a signal conveyed on the trace.

Abstract: An apparatus and method providing improved interconnection elements and tip structures for effecting pressure connections between terminals of electronic components is described. The tip structure of the present invention has a sharpened blade oriented on the upper surface of the tip structure such that the length of the blade is substantially parallel to the direction of horizontal movement of the tip structure as the tip structure deflects across the terminal of an electronic component. In this manner, the sharpened substantially parallel oriented blade slices cleanly through any non-conductive layer(s) on the surface of the terminal and provides a reliable electrical connection between the interconnection element and the terminal of the electrical component.

Abstract: A bolster plate is attached to a printed circuit board and acts as a stiffener that reduces bending in the overall assembly during the attachment of an integrated circuit chip to the printed circuit board under a heavy applied load. The bolster plate is provided with a shim that compensates for bending of the bolster plate under load, thereby preventing damage to the integrated circuit chip. The dimensions of the shim may be selected according to computer model results representing bow deformation in the bolster plate without the shim.

Abstract: Methods for mounting electrical components on a substrate and securely retaining the components are described. The methods include altering solder paste compositions, interposed between component retentive pins and retentive through holes, during a reflow process. Electronic assemblies including circuit boards and electrical components mounted thereto are also described. In one of the electronic assembly embodiments, materials originally associated with a mounted electrical component migrate into solder paste coupling the electrical component to the circuit board.

Abstract: The invention is directed to an electrical component having a base body (1) that comprises a layer stack of mutually overlapping, electrically conductive electrode layers (3) that are separated from one another by electrically conductive ceramic layers (10), whereby the electrically conductive ceramic layers (10) are composed of a ceramic whose specific electrical resistance exhibits a negative temperature coefficient, whereby the electrically conductive ceramic layers (10) are produced of ceramic green films that are sintered in common with the electrode layers (3), and whereby outside electrodes (2) that are electrically conductively connected to the electrode layers (3) are arranged at two opposite outside surfaces of the base body (1). The invention is also directed to a method for the manufacture of the component and to the employment of the component.

Abstract: To provide a method and apparatus for mounting components capable of mounting even such components as having narrow inter-component distances without producing any interference between already mounted components and suction nozzles or components being suction-held by the suction nozzles. The component mounting apparatus for picking up electronic components supplied from a component supply section by suction nozzles attached to a mounting head and mounting the electronic components on a printed circuit board, includes a control section containing information on the components to be mounted and controlling, based on this information, the positions of the suction nozzle, the mounting head and the printed circuit board so that the components to be mounted are mounted in ascending order of height.

Abstract: A method of making an interactive information package, including an interactive information closure including a radio frequency identification device, contemplates that a microelectronics assembly be provided, and positioned on an associated substrate for positioning adjacent an inside surface of the top wall portion of the closure of the package. In one embodiment, the mounting substrate is provided in the form of a disc-shaped sealing liner for the closure. In an alternate embodiment, the mounting substrate is laminated to an associated sealing liner, with the substrate, and microelectronics assembly positioned thereon, inserted together with the sealing liner into the associated molded closure.

Abstract: A method of assembling a multi-chip device may include coupling solder balls only to selected ones of the conductive pads on an interposer with cache memory devices. The cache memory devices are then tested, and the interposer is coupled to a substrate with the solder balls for further assembly only if the test is passed.

Abstract: An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.

Abstract: In a method of manufacturing a piezoelectric actuator there are provided a piece of piezoelectric material having piezoelectric bodies, a first piece of material having vibrational bodies, a second piece of material having movable bodies, and a third piece of material having pressurizing members. The first, second and third pieces of materials are superimposed over the piece of piezoelectric material to form a multilayered structure having piezoelectric actuators. The multilayered structure is cut to separate each of the piezoelectric actuators from one another.

Abstract: A multi-chip package (MCP) in which heat generated in first and second chips of the MCP is spread effectively and a method for manufacturing the same. The MCP includes first and second chips. The MCP further comprises a tape including a conductive material layer therein situated between the first chip and the second chip. Thus, the heat generated in the second chip can effectively spread to the outside through the tape.

Abstract: A test printing portion with a pattern dimension smaller than a minimum printing pattern dimension is formed on a substrate, and a printing state of this test printing portion is inspected after printing. Based on inspection results of the test printing portion, acceptability of the printing state of the entire substrate is judged. The test printing portion is created on a periphery of the substrate outside the printing pattern area or an unprinted space inside the printing pattern area. A detection device detects the test printing portion, and inspects its printing state. Based on the inspection results, the acceptability of the printing state of the entire substrate is judged. This enables the printing state to be easily inspected at low cost while securing a necessary decree of accuracy.

Abstract: A chip transfer apparatus includes a first carrier for feeding chips and a second carrier for carrying works on it. The transfer apparatus also includes a transfer engine including two or more coaxial revolvers, which can revolve coaxially with each other. Each of the coaxial revolvers includes an end-effector for receiving a chip from the first carrier and transferring the received chip onto a work on the second carrier. The end-effectors of the coaxial revolvers are arranged in a circle coaxial with the revolvers. The end-effectors sequentially receive chips from the first carrier at substantially zero speed relative to the first carrier and transfer the received chips onto works on the second carrier at substantially zero speed relative to the second carrier. While the end-effectors are revolving, they undergo periodic speed change control for timing adjustment and speed adjustment for the chip reception and transfer.

Abstract: A method of assembling the annular antenna and transponder tag includes formation of the antenna wire with an insulating cover therearound; cutting the covered antenna to length; stripping antenna wire ends; threading one antenna wire end through the transponder; splicing the antenna wire ends together; and injecting an insulating composition around the transponder tag and spliced antenna ends.

Abstract: A manufacturing method for a ceramic oscillator capable of controlling the oscillation frequency with a high accuracy is disclosed. In this method, a mother substrate is polarized, electrodes in discrete ceramic oscillator units are formed, the mother substrate is cut into discrete ceramic oscillator units, an outer package is applied to each of the ceramic oscillators, and thus a ceramic oscillator as a finished product is achieved. Herein, the polarization processing for the mother substrate is executed by finishing the application of a high DC voltage, when the antiresonant frequency fa of the mother substrate in a thickness vibration mode is measured while the voltage is applied to the mother substrate, and the antiresonant frequency fa which is being measured has reached a target value of the antiresonant frequency of the mother substrate during polarization corresponding to a target oscillation frequency of the ceramic oscillator as a finished product.

Abstract: The invention relates to a device for characterising component carriers (100, 200, 310) provided with a plurality of electrical components (110, 210) to be fitted, and to a method for using one such device. Said device comprises at least one data carrier (150, 250, 350) which is coupled to the components (110, 210) to be fitted, and in which at least technical data of the components (110, 210) is stored. Said data carrier (150, 250, 350) can be detected and read by means of a processing unit, and is designed in such a way that it can store other technical component data, logistical component data and/or operating data of the fitting installation. It is thus possible to take into account all operating states of a fitting installation, defective components, defective fitting processes etc. during a fitting process in a fitting program, and/or to evaluate the corresponding data, and use it for optimising and improving the fitting process.

Abstract: A method of manufacturing a ferromagnetic tunnel junction element, having an insulating film, a first ferromagnetic film and a second ferromagnetic film, including a step of turning the ferromagnetic tunnel junction element on electricity for a given period before a practical operation of the ferromagnetic tunnel junction element, so that a resistance of the insulating film is stabilized.

Abstract: A method of making an electrical current sensor having an electrical conducting portion (6; 6a, 6b) of rectangular cross-section being surrounded, on three of its lateral faces, by a magnetic circuit portion (7) which has end portions (7′, 7″) having planar surfaces situated substantially in a plane of a fourth lateral face of the conductor portion (6), a magnetic field detector (3; 24; 26) being arranged opposite the fourth lateral face. The conductor portion (6) is made by photo-lithography and etching in a layer of electrically conducting material applied on a first surface of a flat support member (1; 1′; 1″) or on intermediate layers (8, 9, 10, 11) deposited on the support member. The magnetic circuit portion (7) is made by photo-lithography and etching in a layer of magnetically permeable material applied on the conductor portion (6) on the first surface of the support member (1; 1′, 1″) or of an intermediate layer (8).

Abstract: A method of adjusting a resistance value of a film resistor. The method includes defining, as a single resistive element, a portion of a resistive film formed over a first linear conductive film formed at a position at which a first resistance value is detected when an electric contact is slid thereto, and a second linear conductive film formed at a position at which a second resistance value is detected when the electric contact is slid thereto. The method also includes trimming a portion of the resistive element at opposite sides of the first linear conductive film in a longitudinal direction substantially perpendicular to the width direction to form first and second trimmed portions; and trimming a portion of the resistive element from an end of the second trimmed portion in the width direction toward the second linear conductive film to form a third trimmed portion.

Abstract: A method is disclosed for adjusting a spacing within a magnetic circuit, in particular the spacing between a magnet armature and a magnet core, in which the magnet armature has an armature plate and an armature bolt which are joined together in a relative position, characterized in that after the mounting of the magnet armature comprising the armature plate and armature bolt, the relative position between the armature plate and the armature bolt is adjusted, in the context of a pressing operation, to a first defined size or a second defined size.

Abstract: A method for attaching an additional object to a resonator body. The method includes the steps of (1) placing the additional object in a recess of a pushing part of an extrusion machine; (2) pressing the pushing part against a bloom of a resonator body; and (3) pulling the pushing part back from the resulting resonator body. The attaching of the additional object occurs in conjunction with the extrusion process.

Abstract: A method of mounting a mechatronics control module (14) includes an electronic control unit (16) having a flex foil circuit (34) with a multiple of mounted electronic components including sensors (24) which sense the hydraulic state of the transmission clutch or other frictional engagement elements within the transmission system. The sensor is mounted to a base plate (82) which is mounted to a fixture (88) which folds the flap (84.) When the base plate (82) and mounted sensor are removed from the fixture (88), the flap (84) unfolds so that the circuit traces of the flex foil (34) are adjacent the contacts (94.) In a final step, the circuit traces (81) are electrically connected to the contacts (94.

Abstract: A wire tensioning apparatus and method tensions one or more wires by moving the tensioning function from a wire module to an apparatus external to the wire module. Within the wire module, the wire is placed between a movable member and a stationary member. Tension is placed on the wire and adjusted until the desired tension and/or vibrational frequency is met. Once the desired tension and/or vibrational frequency is met, the wire is clamped between the movable and stationary members within the wire module in order to maintain the achieved tension and/or vibrational frequency.

Abstract: A method and apparatus are described for a flexible tape constructed of a material suitable to convey electronic devices through an entire manufacturing process without removing the electronic packages from the tape. According to one embodiment, part receiving areas are located within the tape. Each part receiving area is suitable to hold an electronic device. A retention channel encompasses each part receiving area. The retention channel extends substantially an entire length along each edge of each part receiving area. The retention channel comprises an upper tab and a lower tab wherein the upper tab is flush with an upper surface of the flexible tape and extends into the part receiving area and the lower tab extends below a lower surface of the flexible tape and into the part receiving area.

Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.

Abstract: A method for shortening a cable, which is mounted in a device housing of a measurement device, of a cable probe, comprising the step of: removing the measurement device electronics; interrupting the electrical connections between the measurement device electronics and the cable probe; releasing a built-in sleeve which surrounds the cable, as a result of which at least one seal which surrounds the cable and acts with respect to a medium to be measured, is relieved of load; drawing out of the device housing the built-in sleeve, together with the cable and the seal; shortening the cable by a desired length; once again drawing over the remaining cable of the cable probe, a seal, a built-in sleeve and clamping cone and mounting the cable in the built-in sleeve, by pulling it into said built-in sleeve; once again making the electrical connections between the cable probe and the measurement device electronics; and once again closing the device housing once the measurement device electronics have been fitted.

Abstract: A manufacturing method of manufacturing a liquid jet head which has a plurality of piezoelectric vibrators, each having, at least in part, a laminate structure of electrodes and at least one layer of piezoelectric material. An ejection characteristic measurement step applies a similar drive signal to all of the piezoelectric vibrators to eject liquid from the nozzle openings. The liquid ejection characteristics are measured in a one-by-one basis of the nozzle openings. An ejection characteristic adjustment step sets a treatment condition for at least one of the piezoelectric vibrators based on a result of measurement by the ejection characteristic measurement step. At least one piezoelectric vibrator is subjected to a displacement amount adjustment based on the set treatment condition by trimming away a portion of an external electrode, thereby making the liquid ejection characteristic associated with the nozzle openings uniform.

Abstract: The present invention is generally directed towards a catalytic converter installed in the motor vehicles. More specifically to a method of measuring the pressure on the substrate as the catalytic converter is subject to the spin forming process. A pressure-measuring device such as a sensor is contact with the substrate. In order to transfer data from the rotating catalytic converter to a stationary object, a slip ring device is connected to the pressure-measuring sensor.

Abstract: A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.

Abstract: A method for manufacturing wireless communication devices for use in tracking or identifying other items comprises a number of cutting techniques that allow the size of the antenna for the wireless communication device. Further, the chip for the wireless communication device is nested so as to be flush with the surface of the substrate of the wireless communication device. Rollers cut the tabs that form the antenna elements. In a first embodiment, a plurality of rollers are used, each on effecting a different cut whose position may be phased so as to shorten or lengthen the antenna element. In a second embodiment, the rollers are independently positionable to shorten or lengthen the antenna element.

Abstract: A method of making a permanent magnet body is provided. The method includes providing a first precursor body comprising a plurality of blocks and magnetizing the first precursor body to form a first permanent magnet body. A recoil magnetization pulse may be applied to the permanent magnet body after the magnetization. The precursor body may be heated during magnetization. A power supply containing a battery may be used to energize a pulsed magnet used to magnetize the precursor body.

Abstract: A process for fabricating a ceramic electroactive transducer of a predetermined shape is disclosed. The process comprises the steps of providing a suitably shaped core having an outer surface, attaching a first conductor to the outer surface of the core, coating an inner conductive electrode on the the outer surface of the core such that the inner conductive electrode is in electrical communication with the first conductor, coating a ceramic layer onto the inner electrode, thereafter sintering the ceramic layer, coating an outer electrode onto the sintered ceramic layer to produce an outer electrode that is not in electrical communication with the first conductor, and then poling the sintered ceramic layer across the inner electrode and the outer electrode to produce the ceramic electrode.

Abstract: Probes for electronic devices are described. The probe is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface. The wires are cut off leaving stubs. A patterned polymer sheet having electrical conductor patterns therein is disposed over the stubs which extend through holes in the sheet. The ends of the wires are flattened to remit the polymer sheet in place. The wire is connected to an electrical conductor on the polymer sheet which is converted to a contact pad on the polymer sheet. A second wire is ball bonded to the pad on the polymer sheet and cut to leave a second stub. The polymer sheet is laser cut so that each second stub is free to move independently of the other second studs. The ends of the second stubs are disposed against contact locations of an electronic device, such as an FC chip, to test the electronic device.

Abstract: An AC power line protection device which includes miswiring protection has an indicator lamp which lights when the device is in the tripped condition and turns off when the device is reset. The protection device also includes a protective circuit which protects the AC power line from downstream faults. The indicator lamp and/or the protective circuit are powered via the hot line bus bar by connecting a breaker spring to the hot line bus bar. A contact post is then connected between the breaker spring and an underside of a printed circuit board where power is provided to the indicator lamp and/or the protective circuit.

Abstract: A method for adjusting an electrical length of a coaxial cable and a plug connector with an adjustable length that facilitates the adjustment of the electrical length of the cable are disclosed. With the method, both ends of the coaxial cable are terminated with a respective coaxial plug connector wherein at least one of the plug connectors has an adjustable length. One of the coaxial plug connectors is connected with a phase measurement device, and the other coaxial plug connector having the adjustable length is electrically shorted with a short-circuit plug. A pressing force is applied in an axial direction between the short-circuit plug and an outer conductor of the coaxial plug connector, until the phase measurement device indicates that the electrical length has reached a predetermined value.

Abstract: Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150° C., and can be completed in less than 60 minutes.

Abstract: A method and apparatus for mounting a component onto a substrate of an electrical assembly that utilizes a transponder unit. The transponder unit is attached to the substrate for storing mounting process data, such as, the component manufacturer identification code, the number of missing components, and the number of faulty substrate position, before, during or after the mounting process. The stored process data can then be transmitted to a control unit that controls the component mounting apparatus wherein the data is processed and utilized during the mounting operation to enhance process quality control.

Abstract: A measuring standard to measure the rotational speed of a machine is described. A ring (4) is integrally secured to the periphery (1.1) of a drum-shaped base member (1), by using soldering in accordance with the present invention. Through soldering, a stable measuring standard for an angular-position measuring system is created for high rotational speed applications.

Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.

Abstract: An apparatus 1 for fabricating a component-embedded board according to the present invention comprises: a detecting unit 11 for detecting, before the board 21 is covered with an insulating layer 23, the actual position of an electronic component 22 formed on the surface of the board 21; a holding unit 12 for calculating a displacement between the design position of the electronic component 22 and the actual position of the electronic component 22 on the surface of the board 21, and for holding the displacement as displacement data; and a correcting unit 13 for correcting, based on the displacement data, design data to be used for processing the board 21 after the board 21 is covered with the insulating layer 23.

Abstract: Methods automatic process control of biasing and testing a heated-electrode refrigerant sensor for use in a refrigerant detector. An unbiased sensor may be mounted in a manufacturing station, and while mounted may be biased by applying current to electrically heat the sensor and by applying a voltage potential between the sensor's anode and cathode, thereby generating a bias current at the cathode, and after the sensor is at least partially biased, the bias current is used to electrically test the sensor's construction. If the temperature of the sensor is held constant at a bias temperature, the acceptability of the sensor may be determined based on the time that elapses before the bias current decreases from an initial value to a threshold value, or determined based on the noise present on a signal which is representative of an operating condition other than the bias current magnitude.