Abstract: A test sensor is made that is adapted to assist in determining the concentration of an analyte in a fluid sample. The method includes providing a lid and providing a base. The lid is attached to the base to form an attached lid-base structure. The lid-base structure has a first end adapted to receive the fluid sample and a second opposing end adapted to be placed into a meter. Auto-calibration information is assigned to the lid-base structure. The second opposing end is formed such that the shape of the second opposing end corresponds to the auto-calibration information.

Abstract: A compliant contact structure and contactor card for operably coupling with a semiconductor device to be tested includes a substantially planar substrate with a compliant contact formed therein. The compliant contact structure includes a portion fixed within the substrate and at least another portion integral with the fixed portion, laterally unsupported within a thickness of the substrate and extending beyond a side thereof. Dual-sided compliant contact structures, methods of forming compliant contact structures, a method of testing a semiconductor device and a testing system are also disclosed.

Abstract: Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor wafer. Several embodiments of probe card assemblies, which provide tight signal pad pitch compliance and/or enable high levels of parallel testing in commercial wafer probing equipment, are disclosed. In some preferred embodiments, the probe card assembly structures include separable standard components, which reduce assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form. The probes also have built in mechanical protection for both the integrated circuits and the MEMS or thin film fabricated spring tips and probe layout structures on substrates.

Abstract: A circuit module includes a multilayer wiring board having a cavity portion and an interposer on which a chip part is mounted. The interposer is bonded to the multilayer wiring board so that the chip part is disposed in the cavity portion and the cavity portion is hermetically sealed. In the manufacturing process for the circuit module, a continuity test of the chip part is conducted by applying a testing voltage to the interposer before the interposer is bonded to the multilayer wiring board.

Abstract: An electronic module capable of easily determining connection reliability of an ACF connection portion is provided. Electrode wirings of a board serving as an electronic parts of a display panel are connected with ACF bonding wirings of an FPC through an ACF to make electrical connection between the FPC and the board. Two branch portions branched from each of the ACF bonding wirings extend to an edge of the FPC. Low resistance measurement of the connection portion can be performed using the electrode wiring of the board and the branch portions, so whether or not the ACF connection portion is faulty can be determined.

Abstract: Provided is a method for testing a head element that enables proper evaluation of the head element based on a characteristic of the head element under high-temperature and high-stress conditions. The testing method can be performed on a thin-film magnetic head including a head element and a heating element capable of applying a heat and stress to the head element, or performed on a row bar or a substrate wafer on which a plurality of the head elements and a plurality of the heating elements are disposed. The testing method comprises the steps of: causing the heating element to generate heat to apply a heat and stress to the head element; and measuring a characteristic of the head element under the heat and stress to evaluate the head element.

Abstract: A peel plate assembly for selectively removing RFID tags from a web for applying the RFID tags to a succession of articles includes an extendible or retractable peel blade and an RFID sensor recess mounted within a plate body. A cover for the plate body functions both as a web guide for advancing a succession of RFID tags past the sensor to the peel blade and as part of a shielding system to isolate communications between the sensor and the closest RFID tag to the peel blade.

Abstract: A battery powered sensing device for diagnosing a processing system and method for using the same are provided. The support platform generally has physical characteristics, such as size, profile height, mass, flexibility and/or strength, substantially similar to those of the substrates that are to be processed in the processing system, so the sensor device can be transferred through the processing system in a manner similar to the manner in which production substrates are transferred through the processing system.

Abstract: A circuit board with embedded components includes a plurality of embedded components and at least one transmission line electrically connected to at least one of the embedded components and having a terminal circuit. Therefore, a measuring device is used to be electrically connected to the transmission line and send out a signal, so as to receive a corresponding reflected signal, and then, compare the received reflected signal with a signal pattern in the database to obtain an electrical parameter of the embedded component.

Abstract: A method for reusing a conductive (carbon) core/glass or sapphire cylinder test electrode comprising expelling spent core material from the tip of the electrode and refinishing the electrode tip for use in further tests and refinished test electrodes produced in accordance with the method.

Abstract: According to the method of manufacturing a surface acoustic wave device of the invention, since a conductor layer is formed on electrode sections in a state where the entire regions of inter digital transducer and reflectors are covered with an insulating film, the inter digital transducer and the reflectors are protected by the insulating film during formation of the conductor layer. As a result, it is possible to obtain a highly efficient surface acoustic wave device with no sticking of foreign matters to the inter digital transducer and the reflectors.

Abstract: A method for producing a pH measuring probe includes: providing an electrode wire protruding out of both sides of a recording device, the electrode wire being fixed to the recording device with the first end thereof, placing a glass tube over a second end of the electrode wire until reaching a cavity of the recording device, the glass tube and the recording device being fixed together; providing another electrode wire protruding from both sides of a base plate including a recess for the recording device, the other electrode wire being fixed to the base plate with its end protruding; providing a casing comprising first and second openings, the casing and base plate being sealed together, forming the housing; and guiding the glass tube through the recess in the base plate until it protrudes out of an opening in the casing and the recording device is inserted into the base plate.

Abstract: A mounting apparatus includes an X-Y table for holding a board onto which components are to be mounted, and drive units for moving a mounting section by which the components are to be mounted, and also moving individual sections. When an effective torque calculated by an effective torque detecting section is decided by an effective torque deciding section as having exceeded a specified upper-limit value, rotational speed of a corresponding one of the drive units is decreased.

Abstract: Method and system for managing cabling rooms that include a plurality of communication panels, which are arranged closely to one another. Each cabling room has a plurality of patch panels, structurally connected to form vertical structures. An operator is automatically guided to a communication panel or a plurality of communication panels, in which changes are to be made to modify the connectivity status or to deal with connectivity problems that may arise for any reason. The system automatically indicates to an operator optimal ports that are available and optimal patch cords for connecting them, based on distances between ports and on the electrical characteristics of the electrical signals that it is intended to pass between the ports.

Abstract: Power supply switching regulator electrical circuit trimming methods. A trimming method includes assembling one or more components of a power supply switching regulator electrical circuit onto a printed circuit board having one or more electrical connections coupled to the said one or more components. An electrical parameter of the power supply switching regulator electrical circuit is then trimmed after the assembling of the one or more components of the power supply switching regulator electrical circuit onto the printed circuit board. The trimming of the electrical parameter of the power supply switching regulator electrical circuit includes removing a portion of the printed circuit board to break the electrical connection on the printed circuit board.

Abstract: A method of making and using an extended test switch starting with a previously existing un-extended test switch that is ready for connection to electrical devices to be tested. A housing selected from one or more available housings each having a predetermined length is connected to a modified un-extended test switch. Each housing has a rear wall that has several inwardly and outwardly facing terminals. At least one of the rear facing terminals of the un-extended test switch is connected to an associated one of the inwardly facing terminals of the housing. After manufacture the extended test switch can be mounted in a suitable receptacle for connection to at least one electrical device. One or more of the switches on the front of the un-extended test switch to be left in an operational condition with a clear cover attached to the front of the test switch.

Abstract: A method for detecting the presence or absence of internal discontinuities or inhomogeneities in a fired or green ceramic honeycomb structure is provided. In the method, an ultrasonic wave is propagated into the honeycomb structure at a first location, and a response of the propagated ultrasonic wave, as modulated and reflected (a pulse echo) by the honeycomb structure, is received at the first location. The received ultrasonic wave is filtered and then analyzed to determine the presence or absence of internal discontinuities. The transmitter generates ultrasonic waves having a frequency of five megahertz or less to maintain a high signal to noise ratio in the propagated wave received by the ultrasonic receiver.

Abstract: A built-in component type multilayer wiring board includes at least one resin layer and at least one frame resin layer. The resin layer includes electronic components buried therein. The frame resin layer includes at least one of glass cloth, filler and nonwoven fabric. The frame resin layer includes no electronic component.

Abstract: A method for attaching a capacitor to the feedthrough assembly of a medical device having a terminal pin comprises threading a first washer over the terminal pin, and placing a body of epoxy in contact with the first washer. The capacitor is positioned over the terminal pin such that the first washer and the body of epoxy are between the lower surface of the capacitor and a support surface. The body of epoxy is cured to couple the capacitor to the insulating structure. During curing, the body of epoxy is substantially confined between the upper surface and the lower surface by the ferrule, the insulating structure, the capacitor, and the first washer.

Abstract: A chip has formed thereon integrated circuit elements, which include a main circuit and an associated non volatile memory structure. A test result associated with prior testing of a function of the main circuit is stored in the non volatile memory structure. Additional apparatus and methods are disclosed.

Abstract: A method of making a microelectronic package includes providing a first microelectronic element having electrically conductive parts and including first and second surfaces and providing a compliant element including a releasable adhesive over the first surface of the first microelectronic element. A second microelectronic element having electrically conductive parts is abutted against the releasable adhesive so that the second microelectronic element is releasably assembled to the first microelectronic element and the electrically conductive parts of the first and second microelectronic elements are connected to one another. The releasably assembled package is tested to determine whether the package has been properly assembled. A curable liquid is then introduced between the first and second microelectronic elements of a properly assembled package and the curable liquid is cured to permanently assemble the first and second microelectronic elements together.

Abstract: A method of manufacturing a magnetic head carries out a testing step, in which the magnetic head is heated, quickly and with a low operation cost and therefore can reduce delays in the manufacturing process and the need to repeat the manufacturing process. The method includes a row bar holding step of holding at least one surface in a lengthwise direction of a row bar using a holding jig with a lower thermal expansion coefficient than the row bar, a wire bonding step of connecting, using wires, connection terminals of respective magnetic heads on the row bar and test terminals for electrically connecting the connection terminals for test purposes, a heating step of heating the row bar, and a functional characteristic testing step of testing functional characteristics of the respective magnetic heads via the test terminals and the wires.

Abstract: A method for establishing electrical contact includes nonrigidly applying force to a semiconductor substrate in directions substantially normal to a plane of the semiconductor substrate includes a first member with an electrically conductive element and a first attractive element and a second member that includes a support element and a second attractive element. The first and second attractive elements may be attracted to one another to secure the first and second members of the electrical connector to the semiconductor substrate in a manner that facilitates communication between the electrically conductive element of the first member and one or more semiconductor devices carried upon the semiconductor substrate. The electrical connector may be used in stress testing of semiconductor devices or to otherwise establish an electrical connection between one or more semiconductor devices, a ground, and a power source.

Abstract: A method of making and testing an electronic device that includes providing first and second external pins, first and second pads on the substrate connected to the first external pin by respective bonding wires, and third and fourth pads on the substrate connected to the second external pin respective bonding wires, and to a first common line by respective resistors. With a circuit configuration of this type, the intactness of the bonding wires can easily be checked by carrying out a simple resistance measurement between the first and the second external pin.

Abstract: A fabrication process produces markers for a magnetomechanical electronic article surveillance system. The marker includes a magnetomechanical element comprising one or more resonator strips of magnetostrictive amorphous metal alloy; a housing having a cavity sized and shaped to accommodate the resonator strips for free mechanical vibration therewithin; and a bias magnet to magnetically bias the magnetomechanical element. The process employs adaptive control of the cut length of the resonator strips, correction of the length being based on the deviation of the actual marker resonant frequency from a preselected, target marker frequency. Use of adaptive, feedback control advantageously results in a much tighter distribution of actual resonant frequencies. Also provided is a web-fed press for continuously producing such markers with adaptive control of the resonator strip length.

Abstract: A semiconductor component includes adjustment circuitry configured to adjust selected physical and electrical characteristics of the component or elements thereof, and an input/output configuration of the component. The component includes a semiconductor die, a substrate attached to the die, and terminal contacts on the substrate. The adjustment circuitry includes conductors and programmable links, such as fuses or anti-fuses, in electrical communication with the die and the terminal contacts. The adjustment circuit can also include capacitors and inductance conductors. The programmable links can be placed in a selected state (e.g., short or open) using a laser or programming signals. A method for fabricating the component includes the steps of forming the adjustment circuitry, and then placing the programmable links in the selected state to achieve the selected adjustment.

Abstract: Disclosed is a method of manufacturing a catheter or lead having electrically conductive traces and external electrical contacts. Each trace may be in electrical connection with one or more external electrical contacts. More specifically, each trace is typically electrically connected to a single contact. The traces and contacts may assist in diagnosis and/or detection of bio-electric signals emitted by organs, and may transmit such signals to a connector or diagnostic device affixed to the catheter. The external contacts may detect bioelectric energy or may deliver electrical energy to a target site.

Abstract: An inner terminal installation jig used to install an inner electrode terminal mount formed on an inner peripheral surface of a hollow cylindrical sensor element of a gas sensor.

Abstract: In the manufacture of RFID tags, electronic components are connected with soldered connections to antennas stamped from a thin strip of electrically conductive metal, utilizing methods and intermediate products which enable accurate registration of the leads of the electronic components with contacts on the antennas. Thus, a strip of metal is provided with contact members unitary with the strip and coupled to the strip through compliant coupling arrangements which allow compliant movement of the contact members relative to the strip for accurate alignment with electronic components juxtaposed with the contact members for soldered connections between the leads of the electronic components and the corresponding contact members. The antennas, with the electronic components soldered in place, are carried by a substrate, and the sequence of the stamping and soldering operations avoids exposing the substrate to the heat of soldering.

Abstract: Methods for manufacturing electrochemical sensors are described. The sensors have a working electrode and a counter electrode, which are planar, and optionally an indicator electrode. The sensor includes a sample chamber to hold a sample of no more than 1 ?L in electrolytic contact with the working electrode. The methods provide sensors that can be used to determine the concentration of a biomolecule, such as glucose or lactate, in a biological fluid, such as blood or serum, using techniques such as coulometry, amperometry, and potentiometry.

Abstract: An electronics module is assembled by demountably attaching integrated circuits to a module substrate. The module is then tested at a particular operating speed. If the module fails to operate correctly at the tested speed, the integrated circuit or circuits that caused the failure are removed and replaced with new integrated circuits, and the module is retested. Once it is determined that the module operates correctly at the tested speed, the module may be rated to operate at the tested speed and sold, or the module may be tested at a higher speed.

Abstract: A device and method for testing a slider of a head-gimbal assembly during disc drive manufacturing. The device includes a test disc, an actuator arm and a control module. The test disc has a first circumferential area for detecting contact between the slider and the test disc and a second circumferential area for burnishing sliders that contact the first circumferential area as the test disc rotates at or above the predetermined velocity. The head-gimbal assembly is affixed to a support, or flexure, on the actuator arm such that the slider is operable to move between an inner diameter and an outer diameter of the test disc. The control module controls rotation of the test disc and movement of the actuator arm, and thus the slider, relative to the test disc. The control module monitors the slider-disc interface for contact therebetween. If contact is detected, the slider is either burnished or the head-gimbal assembly is discarded altogether.

Abstract: A method for manufacturing wireless communication devices for use in tracking or identifying other items comprises a number of cutting techniques that allow the size of the antenna for the wireless communication device. Further, the chip for the wireless communication device is nested so as to be flush with the surface of the substrate of the wireless communication device. Rollers cut the tabs that form the antenna elements. In a first embodiment, a plurality of rollers are used, each on effecting a different cut whose position may be phased so as to shorten or lengthen the antenna element. In a second embodiment, the rollers are independently positionable to shorten or lengthen the antenna element.

Abstract: Electrically conductive movable elements 15 which are moved from a waiting position to a conduction position by an insertion operation of corresponding male terminals 7 are disposed in all female terminals 9 into which the male terminals are to be respectively inserted in a correct connection condition. Only when the male terminals 7 are correctly inserted into the female terminals 9, the movable elements 15 are moved to the conduction positions to be in contact with conductive portions 17 of a conduction test device 16, respectively, thereby establishing a conductive condition.

Abstract: An improved manufacturing method for a gas sensor is provided which is capable of establishing a required hermetic seal in a body of the gas sensor. The method includes preparing a sensor assembly including a housing, an air cover, an insulation porcelain, and a sensor element, pressing the air cover against the housing to fit an end of the air cover on an end of the housing to form an overlap thereof, and welding the air cover to the housing over the overlap. The welding is accomplished while pressing the air cover against the housing, thereby compressing an elastic member in the air cover to establish a hermetic seal between the sensor element and the housing.

Abstract: In a method of evaluating surface tension of a solid body surface, selection is made of at least three liquid samples having different surface tensions, and contact angles between the respective liquid samples and the solid body surface are measured. Thereby, a correlation between cosines (Y) of the contact angles and surface tensions (X) of the liquid samples is derived as a logarithmic function. Surface tension of the solid body surface is evaluated by the use of a value of X that is calculated by substituting 1 for Y in the correlation. When evaluated by the foregoing evaluation method, a magnetic disk has a surface where the value of X, when 1 is substituted for Y, is greater than 0 and no greater than 17 mN/m.

Abstract: A method and a device for detecting the incorrect chucking of a machine tool capable of easily and surely detecting a chucking error; the method, comprising the steps of measuring, by a sensor (12), the change of a distance (d) between the sensor (12) and the outer peripheral surface of the flange part (2B) of a tool holder (2) installed in a spindle (3) through all around the periphery of the tool holder while rotating the tool holder (2), performing a FFT analysis of the measured data by a CPU (18), extracting a fundamental frequency component, and calculating the amplitude thereof, whereby the eccentric amount of the tool holder (2) can be calculated by using the amplitude of the fundamental frequency component and, when the eccentric amount exceeds a preset allowable value, the tool holder (2) is judged to cause an incorrect chucking.

Abstract: A method of making a resonant frequency tag which resonates at a predetermined frequency. The method involves providing a first conductive pattern having an inductive element and a first land and a second conductive pattern having a second land and a third land which are joined together by a link. The second conductive pattern is overlaid the first conductive pattern such that the second land is positioned over the first land. The third land is in electrical communication with the inductive element of the first conductive pattern. The formed resonant frequency tag is energized to determine if the tag resonates at the predetermined frequency. If the tag resonates properly, the third land is electrically coupled to the inductive element. If it does not, the second conductive pattern is adjusted so that overlapping portions of the first and second lands are changed, altering the capacitance to adjust the resonant tag frequency.

Abstract: An apparatus includes at least one tag holder capable of receiving and holding a plurality of tags. The apparatus also includes at least one antenna capable of receiving wireless signals from the plurality of tags during a test of the tags. The apparatus may further include at least one of a temperature controller capable of controlling a temperature experienced by the tags during the test and a humidity controller capable of controlling a humidity experienced by the tags during the test. The at least one tag holder may include a plurality of guides capable of receiving and holding the tags, a plurality of rods capable of supporting the guides, and a plurality of spacers capable of maintaining a distance between adjacent guides.

Abstract: A bond pad structure comprising two bond pads, methods of forming the bond pad structure, an integrated circuit die incorporating the bond pad structure, and methods of using the bond pad structure are provided. Each of the bond pads comprise stacked metal layers, at least one lower metal layer and an upper metal layer. When the two pads are connected by a conductive material, they function as a single pad. The lower metal layer of one of the bond pads forms an extension that extends beneath the upper metal layer of the other of the bond pad. The lower metal extension functions to block the etching of a dielectric layer that is put down over the upper metal layers and the underlying substrate, for example, during a passivation etch to form the bond pad opening, to protect the substrate from damage.

Abstract: Probe cards are configured with protective circuitry suitable for use in electrical testing of semiconductor dice without damage to the probe cards. Protective fuses are provided in electrical communication with conductive traces and probe elements (e.g., probe needles) of a probe card. The fuses may be active or passive fuses, and are preferably self-resetting, repairable, and/or replaceable. Typically, the fuses will be interposed in, or located adjacent to, conductive traces residing over a surface of the probe card. Methods of fabricating a probe card are provided, as well as various probe card configurations. A semiconductor die testing system using the probe card is also provided.

Abstract: A cutting head has upper part with at least one separating cutter, at least one stripping cutter, a first cutting edge, a force-measuring device operating on the piezo principle, and a first holding plate. A lower part of the cutting head includes at least one separating cutter, at least one stripping cutter, a second cutting edge and a second holding plate. The first cutting edge, the second cutting edge, and the force-measuring device serve to measure the height of the crimp. The first holding plate and the second holding plate serve to measure the pull-out force.

Abstract: A method for processing a surface of an item and providing an association using a surface processing system includes receiving an item having a first identification marking on a surface of the item to provide a received item for providing a first identification signal in response to a first interrogation signal and applying a second identification marking to the surface of the item for providing a second identification signal in response to a second interrogation signal. At least one of the first and second interrogation signals is applied to the item to provide at least one of the first and second identification signals. At least one of the first and second identification signals is received in response to the at least one of the first and second interrogation signals. An association is made is determined in response to the first receiving.

Abstract: A board 20 is provided with a Cu film 30 as a conformal mask, in which are formed a register mark 30b and an opening 3a through which a via hole is formed. A camera senses this register mark 30b so that the position of the board 30 is determined. A laser beam is directed to the approximate position of the opening 30a, so that the opening 26a through which the via hole is drilled is formed. The accuracy of the position of the opening of the via hole depends on the accuracy of the position of the opening 30a in the Cu film 30 as the conformal mask. Therefore, the via hole can be formed at an adequate position despite the low accuracy of the position for laser irradiation.

Abstract: A method of manufacturing a waveguide includes forming two waveguide units, each waveguide unit having a channel defined by a bottom wall and two side walls generally transverse to the bottom wall, flanges extending from the side walls, outside the groove, transverse to the side walls and generally parallel to the bottom wall, the flanges including though holes; joining the two waveguide units to each other so that the flanges of a first of the waveguide units abut the flanges of a second of the waveguide units, with the grooves forming a channel for guiding waves; and, by insert molding, forming a thermoplastic resin cover that fills the through holes in the flanges and covers both of the first and second waveguide units, at least partially.

Abstract: A method of manufacturing a piezoelectric actuator, formed of multiple concave parts which are provided on one surface. First, a first sheet is formed of pliant piezoelectric materials and a second sheet is formed of pliant predetermined materials, forming an upper electrode layer formed of conduction materials on one surface of said first sheet, and forming a lower electrode layer formed of conduction materials on the other surface of said first sheet or one surface of said second sheet, wherein piezoelectric material is used as said material of the second sheet and electrode layer for polarization formed of conduction material is formed on the other surface side of said second sheet. Next, the first and second sheets are piled and densified. The first sheet is polarized in a direction of a thickness of the first sheet.

Abstract: A device and method for evaluating reliability of a semiconductor chip structure built by a manufacturing process includes a test structure built in accordance with a manufacturing process. The test structure is thermal cycled and the yield of the test structure is measured. The reliability of the semiconductor chip structure built by the manufacturing process is evaluated based on the yield performance before the thermal cycling.

Abstract: A method for testing a printed circuit board includes manufacturing a dedicated testing board having protrusive metal points corresponding to the points to be tested on the printed circuit board. A pressure sensitive conductive rubber layer is inserted between the protrusive metal points and the test points. The method connects the protrusive metal points with the points to be tested on the printed circuit board by using the pressure from the press and the flexibility of the conductive rubber. The testing board having protrusive metal points is connected to the dedicated tester through flat cables so that each protrusive metal point is connected to a test node in the tester.

Abstract: A method of making a resonant frequency tag having a predetermined frequency comprises forming a first conductive pattern comprising an inductive element and a first land having a first end connected to an inductive element end, and a second end spaced a predetermined distance from the first end; separately forming a second conductive pattern comprising a second land having a predetermined width and a link element; placing the second conductive pattern proximate the first conductive pattern at a first location wherein the second land overlies a portion of the first land with a dielectric therebetween establishing capacitive element plates having a first capacitance along with the inductive element forming a resonant circuit; measuring the resonant circuit frequency and comparing the measured and predetermined frequencies moving the second land along of the first land length to match the resonant frequency; and securing the second conductive pattern to the first conductive pattern.

Abstract: A technique for reducing the number of layers in a multilayer signal routing device is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for reducing the number of layers in a multilayer signal routing device having a plurality of electrically conductive signal path layers for routing electrical signals to and from at least one electronic component mounted on a surface of the multilayer signal routing device. In such a case, the method comprises routing electrical signals on the plurality of electrically conductive signal path layers in the multilayer signal routing device for connection to and from a high density electrically conductive contact array package based at least in part upon at least one of an electrically conductive contact signal type characteristic and an electrically conductive contact signal direction characteristic.