Abstract: A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled to a backing substrate. The contactor units may include leads extending laterally for connection to an external instrument such as a burn-in board. The contactor units include conductive areas such as pads that are placed into contact with conductive terminals on devices under test.

Abstract: The method of manufacturing an electric part including a matrix-shaped nonconductive base member, and a carbon nanotube group that is sealed within the nonconductive base member and includes at least one of a carbon nanotube and a plurality carbon nanotubes that are electrically connected to each other. According to the method, substantially only an end portion of the carbon nanotube or at least carbon nanotube contained in the plurality of carbon nanotubes may be exposed from one surface of the nonconductive base member, and an electrode may be connected to a side surface of at least one carbon nanotube included in the carbon nanotube group.

Abstract: In accordance with a component mounting method, a component stored in a component feeder is held by a component holding member and is then mounted in a mounting position on an object. The method includes, when a mounting posture of the component in which the component is mounted onto the object is inclined with respect to a basic posture of the component by a mounting angle, the operation of holding the component from the component feeder by the component holding member that has preliminarily been rotated to the mounting angle in such a direction as to depart from a reference posture of the component holding member prior to the mounting of the component on the object. And afterwards, the component holding member is rotated in a specified direction to finally return the component holding member to the reference posture, and then the component is mounted on the object.

Abstract: A method for post-fabrication modification of the snap actuation properties of a thermally responsive bimetallic actuator by exposing a pre-formed bimetallic actuator to laser energy, thereby permanently altering the thermal response properties of the bimetallic actuator, and a thermally responsive bimetallic actuator having snap actuation properties developed according to the method.

Abstract: Firstly, a supporting frame is produced, whose opening is spanned by an auxiliary layer flush on one side. Following the production of microstructures, flat parts or membranes on the common plane defined by the auxiliary layer and the supporting frame, the auxiliary layer is removed, preferably by etching. In a preferred application, the self-supporting microstructures produced in accordance with the method of the invention are used as electrically heatable resistance grids in a device for measuring weak gas flows.

Abstract: A method for manufacturing a tag encompassing an antenna or coil that is capable of at least one of wirelessly transmitting information to remote receivers and receiving information from remote transmitters. The method includes die-cutting a coil or antenna shape from an electrically conductive flat double foil having an upper electrically conductive flat foil layer of a soft, inelastic metal and a lower synthetic film substrate layer, the die-cutting including cutting with a die-cutting tool having a single die-cutting blade which matches the desired antenna or coil shape, the blade completely perforating the upper electrically conductive flat foil and at least partially separating the lower synthetic film substrate so that a gap the distance created in the flat foil by die-cutting remains after the die-cutting tool is removed. Subsequently the cut shape is bonded with additional layers including an electronic chip module.

Abstract: Longitudinal edges of an actuator arm are provided with stiffening elements in order to raise natural resonant frequencies of the arm so as to prevent resonance from occurring. The stiffening element is shaped and positioned so as to be able to individually “tune” the natural resonant frequency of a given bending mode without significantly affecting the natural frequencies in other bending modes.

Abstract: A poison resistant combustible gas sensing element, a method for its production and a method for determining poisoning of the element. The element includes an electric heating element, an inner layer coated on the electric heating element and containing a precious metal catalyst supported on a porous oxide, the precious metal catalyst catalyzing combustion of a combustible gas to be detected by the element, and an outer layer overlaying the first layer, and containing a catalytic compound capable of trapping gases which poison the precious metal catalyst, the catalytic compound being supported on a porous oxide.

Abstract: A method and a device for detecting the incorrect chucking of a machine tool capable of easily and surely detecting a chucking error; the method, comprising the steps of measuring, by a sensor (12), the change of a distance (d) between the sensor (12) and the outer peripheral surface of the flange part (2B) of a tool holder (2) installed in a spindle (3) through all around the periphery of the tool holder while rotating the tool holder (2), performing a FFT analysis of the measured data by a CPU (18), extracting a fundamental frequency component, and calculating the amplitude thereof, whereby the eccentric amount of the tool holder (2) can be calculated by using the amplitude of the fundamental frequency component and, when the eccentric amount exceeds a preset allowable value, the tool holder (2) is judged to cause an incorrect chucking.

Abstract: A method for producing a wafer interposer (210) for use in a wafer interposer assembly is disclosed. The wafer interposer (210) is produced by attaching solder bumps (140) to a lower surface of a support (120). First electrical terminals (130) are attached to an upper surface of the support (120) and substantially correspond to the solder bumps (140). First electrical pathways are provided that passes through the support (120) and connect the solder bumps (140) to the first electrical terminals (130). Second electrical terminals (310) are attached to the upper surface of the support (120). Second electrical pathways (320) connect the first electrical terminals (130) to the second electrical terminals (310).

Abstract: An electrical connector configured to nonrigidly apply force to a semiconductor substrate in directions substantially normal to a plane of the semiconductor substrate includes a first member with an electrically conductive element and a first attractive element and a second member that includes a support element and a second attractive element. Attractive forces, such as magnetic attraction, between the first and second attractive elements secure the first and second members of the electrical connector to the semiconductor substrate in a manner that facilitates communication between the electrically conductive element of the first member and one or more semiconductor devices carried upon the semiconductor substrate. The electrical connector may be used in stress testing of semiconductor devices or to otherwise establish an electrical connection between one or more semiconductor devices, a ground, and a power source.

Abstract: A crimping press has a tool receptacle arranged at a lower end of a pressing slider provided with a force-sensing device. The forces arising during the crimping operation are transmitted from the supporting surfaces of an upper tool to several points on the force-sensing device. Provided on each side of an upper fork and held by screws are two collars to which are transmitted, the crimping forces on either side of the supporting surface. With their heads, the screws hold the collars, while with their other ends the screws are engaged with the pressing slider. The collars transmit the crimping forces to the sensor elements of the force-sensing device.

Abstract: An inductor comprising a core, wherein the inductor is produced by the steps of: defining physical parameters of the core of the inductor, the physical parameters including dimensions of the air gap; defining a plurality of branches of the core; approximating the relative permeability of the core material by interpolating between first and second known values of magnetic flux density that exist in the core material when the core material is exposed to first and second values of magnetic field strength, respectively; calculating boundary currents that must flow through the inductor for each of the first and second known values of magnetic flux density to exist in each branch of the core; establishing the inductance of the inductor at each of the calculated boundary currents; and constructing the inductor.

Abstract: To manufacture a compact and high-performance thin-film piezoelectric bimorph element at low cost, first and second piezoelectric thin films (2, 3) are formed by sputtering on the both surfaces of a metal thin plate (1) which are opposing relation to each other along the thickness thereof, while the respective states of polarizations of the first and second piezoelectric thin films (2, 3) are controlled. A pair of electrode films (5) are formed on the respective surfaces of the first and second piezoelectric thin films (2, 3) opposite to the metal thin plate (1).

Abstract: The stacked core assembly apparatus, which can perform assembly at a high speed while keeping strength of an angle indexing apparatus, comprises a press machine 1, a non-synchronous transmitting apparatus 10 and an angle indexing apparatus 7. The non-synchronous transmitting apparatus 10 transforms a constant revolution of the press machine 1 into a variable revolution. The angle indexing apparatus 7 is connected to the non-synchronous transmitting apparatus 10 via a coupling device 20, and is connected to a rotatably stacking cavity device 51 of a press die 5.

Abstract: An optical module for use in an optical device is provided. The module includes an optical component and relative reference mount. The optical component is fixed spacially relative to a registration feature. The registration feature is configured to couple to a fixed reference mount.

Abstract: A method of manufacturing a speed ring in a continuous process using a magnetizing fixture and a trimming fixture. An unmagnetized magnetic strip is fed into the trolley of a magnetizing fixture, clamped stretched, and magnetized by a coil. The newly magnetized strip is then cut and fed into a trimming fixture. As the magnetized strip goes through the trimming fixture, it runs over a hall effect sensor which determines where a center of a pair of poles is located. Based on where a pair of poles is located the cutting blade of the trimming fixture is activated and a magnetic strip that can be turned into a speed ring is created.

Abstract: A poison resistant combustible gas sensing element, a method for its production and a method for determining poisoning of the element. The element includes an electric heating element, an inner layer coated on the electric heating element and containing a precious metal catalyst supported on a porous oxide, the precious metal catalyst catalyzing combustion of a combustible gas to be detected by the element, and an outer layer overlaying the first layer, and containing a catalytic compound capable of trapping gases which poison the precious metal catalyst, the catalytic compound being supported on a porous oxide.

Abstract: A semiconductor component includes adjustment circuitry configured to adjust selected physical and electrical characteristics of the component or elements thereof, and an input/output configuration of the component. The component includes a semiconductor die, a substrate attached to the die, and terminal contacts on the substrate. The adjustment circuitry includes conductors and programmable links, such as fuses or anti-fuses, in electrical communication with the die and the terminal contacts. The adjustment circuit can also include capacitors and inductance conductors. The programmable links can be placed in a selected state (e.g., short or open) using a laser or programming signals. A method for fabricating the component includes the steps of forming the adjustment circuitry, and then placing the programmable links in the selected state to achieve the selected adjustment.

Abstract: An apparatus in one example includes a compliant component for supporting an electrical interface component that serves to electrically and mechanically couple a die with a separate layer. In one example, the compliant component, upon relative movement between the die and the separate layer, serves to promote a decrease in stress in one or more of the die and the separate layer. The apparatus in another example includes a compliant component for supporting an electrical interface component that serves to create an electrical connection between a die and a separate layer. The compliant component, upon relative movement between the die and the separate layer, serves to promote maintenance of the electrical connection.

Abstract: In a method for manufacturing a piezo-electric vibrator, a vibrator is provided having a vibrator piece and a frame surrounding a periphery of the vibrator piece. A first exciting electrode is formed on the vibrator piece. A weight is disposed on the vibrator piece in spaced-apart relation to the first exciting electrode. A characteristic of the vibrator is then adjusted. The first exciting electrode is removed and a metal film is formed on a surface of the vibrator. The metal film is patterned and a second exciting electrode is formed on the vibrator piece.

Abstract: A piezoelectric/electrostrictive film-type actuator has a ceramic base and a piezoelectric/electrostrictive element, which has piezoelectric/electrostrictive films and electrode films and which is disposed on the ceramic base, and is driven in accordance with a dislocation of the piezoelectric/electrostrictive element. The piezoelectric/electrostrictive element is formed such that the piezoelectric/electrostrictive films and the electrode films are alternately laminated so as to construct the uppermost layer and the lowermost layer with the electrode films. Also, the piezoelectric/electrostrictive films have two layers and no pores, containing a different phase formed by a decomposed material thereof, in the boundary sandwiched therebetween. In addition, the upper layer of the two-layered piezoelectric/electrostrictive films is thicker than the lower layer.

Abstract: A method of manufacturing a measuring tube for an electromagnetic flow sensor includes the steps of filling a material to be sintered into a lumen of a support tube, sintering the material within the lumen to obtain an open-pored reinforcing body of the measuring tube, and impregnating the open-pored reinforcing body obtained by the step of sintering the material within the lumen at least partially with a liquid insulating material and solidifying the insulating material to obtain a liner of the measuring tube.

Abstract: A method of mounting a component on an electrode on a board. Mounting coordinates for mounting the component are calculated. A determination is made of printing positions where solder for the component is situation on the electrode. The printing positions of the solder are stored. Mounting position data for where the component is to be mounted on the solder is prepared based on the previous steps. The component is mounted using the information gathered in the previous steps.

Abstract: In one embodiment, a sight tube flowmeter is formed of a plurality of fluoropolymer components welded together to form a unitary flowmeter body. The components can comprise a PFA upright sight tube having two end portions, a flow conduit extending therethrough and two fitting portions that are uniquely welded onto each end of the sight tube, and a fluoropolymer float device movable to various positions within the flow conduit depending on the flow level of the fluid flowing therethrough. The float device can be of conventional design or for those flowmeter embodiments where low fluid flow rates are to be measured, an elongate float can be utilized. The floats and, in particular, a designated portion thereof, are visible through the sight tube to provide visual indication of the position, and thus the flow rate of fluid flowing through the flowmeter. In addition, alternative embodiments include the implementation of the unique sight tube and elongate float design in conventional flowmeters.

Abstract: In a method for manufacturing a quartz crystal oscillator, at least one of a chemical etching method, a physical etching method, and a mechanical method is utilized to form a quartz crystal tuning fork resonator having a quartz crystal tuning fork base, quartz crystal tuning fork tines connected to the quartz crystal tuning fork base, a fundamental mode of vibration, and a second overtone mode of vibration each comprised of a flexural mode of an inverse phase. An amplification circuit is provided having at least an amplifier. A feedback circuit is provided having the quartz crystal tuning fork resonator and capacitors. The amplifier of the amplification circuit and the quartz crystal tuning fork resonator and capacitors of the feedback circuit are electrically connected together.

Abstract: A method is provided to generate electrical current. The method includes creating a plurality of unitary masses each connected to one of a plurality of piezoceramic mass supports. The mass supports are electrically joined to a sheath. The method also includes removing material from the unitary masses to operably limit a mass vibration deflection. The sheath is attached to a vibrating body. The unitary masses are pre-tuned to match at least one natural frequency mode of the vibrating body. The unitary masses and the piezoceramic mass supports are induced to vibrate to generate the electrical current.

Abstract: A method of producing a quantity of integrated circuits, that includes testing a set of semiconductor wafers that is made up of a first subset and a second subset. This first subset is configured in such a manner that a first tester is more readily adapted to perform the testing but the second subset is configured in such a manner that a second tester is more readily adapted to perform the testing. A first tooling plate and a second tooling plate are provided. The first tooling plate is attached to a probe station. Then the probe station is mated to the first tester to test the first subset of wafers. In turn, the second tooling plate is attached to the probe station. The probe station is then mated to the second tester to test the second subset of wafers. Finally, the first wafer and said second wafer are diced into the quantity of individual integrated circuits.

Abstract: A method of making a resonant frequency tag which resonates at a predetermined frequency. The method involves providing a first conductive pattern having an inductive element and a first land and a second conductive pattern having a second land and a third land which are joined together by a link. The second conductive pattern is overlaid the first conductive pattern such that the second land is positioned over the first land. The third land is in electrical communication with the inductive element of the first conductive pattern. The formed resonant frequency tag is energized to determine if the tag resonates at the predetermined frequency. If the tag resonates properly, the third land is electrically coupled to the inductive element. If it does not, the second conductive pattern is adjusted so that overlapping portions of the first and second lands are changed, altering the capacitance to adjust the resonant tag frequency.

Abstract: The present disclosure provides probe cards which may be used for testing microelectronic components, including methods of making and using such probe cards. One exemplary implementation provides a probe card that employs a substrate with a plurality of openings. A first probe, which may be used to contact a microelectronic component, includes a first conductor slidably received in one of the openings and a first electrical trace. The electrical trace may be patterned from a metal layer on the back of the substrate and include a resilient free length adapted to urge the first conductor to extend outwardly beyond the front of the substrate. A second probe includes a second conductor slidably received in another one of the openings and a second electrical trace. The second electrical trace may be patterned from a metal layer on the front of the substrate and include a resilient free length adapted to urge the second conductor to extend outwardly beyond the back of the substrate.

Abstract: An acceleration sensor includes a piezoelectric element and support frames for supporting the ends of the piezoelectric element in the longitudinal direction. The piezoelectric element is formed by stacking an even number of piezoelectric layers greater than or equal to four layers. Electrodes are provided in between the layers and on the front and back faces of the piezoelectric element. The interlayer electrodes including a segmented electrode and lead electrodes are alternately stacked with the piezoelectric layers therebetween. The interlayer electrode in the middle in the thickness direction is a segmented electrode. The piezoelectric layers are polarized in the thickness direction so that charge having the same polarity is extracted from the electrodes when the acceleration is applied. Also, the center portion and both end portions of each piezoelectric layer are polarized in opposite directions.

Abstract: A method of forming a vacuum microelectronic device including steps of forming at least one electron emitter on a substrate, applying a first electric field to move a portion of the at least one electron emitter in a direction toward the first electric field, and maintaining the at least one electron emitter in the direction after removing the first electric field.

Abstract: To fabricate a magnetic field sensor, a copper barrier film is formed. A magnetic metal film is formed on the barrier film. A plurality of trenches is formed with a desired thickness in the magnetic metal film. A copper film is formed in the plurality of trenches, so that multiple layers of magnetic metal film and copper film are formed. The RF semiconductor device equipped with the magnetic field sensor includes a magnetic field sensor made by the above method. The magnetic field sensor is attached on a semiconductor substrate. Metal wirings are formed at near the both sides of the magnetic field sensor. An insulating film is formed on top. An inductor is formed on the insulating film at predetermined locations.

Abstract: An injection molding process for fabricating a Coriolis flowmeter. The process includes the steps forming a material flow path core using a core mold, placing the formed material flow path core into a wrapper mold having a cavity whose surfaces define the exterior surface of the plastic Coriolis flowmeter structure to be formed, injecting low temperature metal or soluble material into the cavity of the wrapper mold, removing the plastic Coriolis flowmeter structure from the wrapper mold, and removing the material flow path core from the plastic Coriolis flowmeter by melting the low temperature metal core or by dissolving the soluble material using hot water.

Abstract: The present invention provides for an apparatus and method for handling integrated circuit (IC) chips such as thin small outline package (TSOP) IC chips. Embodiments of the invention are directed toward removal of TSOPs from device under test (DUT) boards. By use of magnetic forces generated by the invention, in combination with physical manipulation of the DUT boards and transfer structures, IC chips are quickly and efficiently transferred.

Abstract: In a method for manufacturing a quartz crystal unit, a quartz crystal tuning fork resonator is formed by etching a quartz crystal wafer to form a quartz crystal tuning fork base, quartz crystal tuning fork tines connected to the quartz crystal tuning fork base, and a groove having stepped portions in at least one of opposite main surfaces of each of the quartz crystal tuning fork tines. A first electrode is disposed on at least one of the stepped portions of each of the grooves and a second electrode is disposed on each of side surfaces of each of the quartz crystal tuning fork tines. A frequency of oscillation of the quartz crystal tuning fork resonator is adjusted at least twice and in different steps. The quartz crystal tuning fork resonator is then mounted in a case and an open end of the case is covered with a lid.

Abstract: In a method of producing a quadrifilar antenna for circularly polarised radiation at frequencies above 200 MHz, the antenna is tuned by coupling it to a test source, measuring the relative phases and amplitudes of currents at predetermined positions in the individual elements of the antenna by means of probes capacitively coupled to the elements, and laser etching apertures in the elements to increase their inductance, the sizes of the apertures being computed according to the deviation of the measured relative phases from predetermined values.

Abstract: A method for quickly screening piezoelectric transformer apparatuses having low mechanical strength and latent defects is performed by connecting a load impedance to a generator of a piezoelectric transformer apparatus and applying a stress signal to an actuator to vibrate the piezoelectric transformer apparatus. Latent-defect transformer apparatuses having low mechanical strength are damaged during this process and therefore can be easily identified.

Abstract: Probes for electronic devices are described. The probe is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface. The wires are cut off leaving stubs. A patterned polymer sheet having electrical conductor patterns therein is disposed over the stubs which extend through holes in the sheet. The ends of the wires are flattened to remit the polymer sheet in place. The wire is connected to an electrical conductor on the polymer sheet which is converted to a contact pad on the polymer sheet. A second wire is ball bonded to the pad on the polymer sheet and cut to leave a second stub. The polymer sheet is laser cut so that each second stub is free to move independently of the other second studs. The ends of the second stubs are disposed against contact locations of an electronic device, such as an FC chip, to test the electronic device.

Abstract: The circuit characteristics of an intermediate layer between an uppermost layer and a lowermost layer of a ceramic multilayer substrate with substrates laminated can be evaluated. A method for evaluating the characteristics of the intermediate layer circuit is provided. The intermediate layer circuit is installed on the intermediate layer of the multilayer substrate and has a wiring and a grounding pad, holding grounding potential, formed in the vicinity of the wiring. The method includes steps of: irradiating a region of the upper layer substrate located above the grounding pad of the intermediate layer with a laser to ablate material to a predetermined thickness; polishing the upper layer substrate ablated to the predetermined thickness with a hard polishing tool to expose the wiring and/or grounding pad; and bringing a probe needle in contact with the exposed wiring and/or grounding pad to evaluate characteristics of the intermediate layer circuit.

Abstract: A method is provided for producing a matrix array ultrasonic transducer having an integrated interconnection assembly. A piezoelectric member, formed by a plurality of individual elemental transducers arranged in M×N matrix configuration, is provided and an interconnect interface device is joined to the rear face of the piezoelectric member. A plurality of printed circuits are then attached to the interconnect device so as to enable the resultant transducer array to be electrically connected to an external cable. The interconnect device is formed by an insulator member having dimensions in accordance with those of the piezoelectric member. A drilling operation is performed on the insulator member to form a corresponding array of through holes. The insulator member is then metallized and a resin used to provide filling of the through holes. Grooves are formed in at least one face of the insulator for receiving the printed circuits.

Abstract: A manufacturing method for a gas senor having sensor element on and in which an outer electrode terminal and an inner electrode terminal are press-fitted. The manufacturing method features stability of installation of the outer and inner electrode terminals without causing physical damage to the sensor element. Outer and inner terminal installation jigs are used in the method.

Abstract: An apparatus of two stories for manufacturing a non-resonance knock sensor has an assembly body stage positioned at a first floor for forming an assembly body in which a lower insulator, a lower terminal plate, a piezoelectric element, an upper terminal plate and an upper insulator are mounted on a cylindrical base, and process stages positioned at a second floor for fastening the assembly body with a nut to form a sensor main body, bending partly the lower and upper terminal plates of the sensor main body and connecting by welding a resistor between the lower and upper terminal plates which are partly bent in the sensor main body. Accordingly, its manufacturing line is compact and can be installed in smaller horizontal ground area.

Abstract: Method for taking out electronic parts from a parts supply section by a transfer head and transporting and mounting the electronic parts to and on a board positioned on a transfer passage. In an image pickup step, a board recognition camera moves independently of the transfer head and advances to and retreats from the board for picking up an image of the board to detect the position thereof in a position detecting step. The image pickup step of the board by the board recognition camera and the parts taking out step in the parts supply section by the transfer head are performed concurrently. Thus, the tact time can be shortened and the electronic parts can be mounted on the board efficiently.

Abstract: A method for adjusting a frequency characteristic of an edge reflection type surface acoustic wave device includes the step of obtaining a frequency characteristic of an edge reflection type surface acoustic wave device having a piezoelectric substrate. The edge reflection type surface acoustic wave device has a pair of edges of the piezoelectric substrate which define a predetermined distance therebetween. Then, the piezoelectric substrate is cut at at least one of a pair of positions which define a distance that is shorter than the predetermined distance when a final frequency characteristic of the edge reflection type surface acoustic wave device is to be higher than the obtained frequency characteristic. The piezoelectric substrate is cut at at least one of a pair of positions which define a distance that is longer than the predetermined distance when a final frequency characteristic of the edge reflection type surface acoustic wave device is to be lower than the obtained frequency characteristic.

Abstract: There is provided methods for producing an ultrasonic transducer assembly. The methods generally comprise the steps of creating a multi-layered rigid or flexible printed circuit board, having a top surface and bottom surface; creating a patterned conducting layer upon each of the top and bottom surface; creating at least one patterned backplate electrode on the board or as part of a discreet component which is then attached to the board; creating at least one conductive through-hole via integral with the board; roughening at least a portion of each of the at least one backplate to introduce gas pockets in that portion of a surface of the backplate; and attaching thin insulating or dielectric single or multi-layer film on a portion of the board in which the film has an integral conducting surface and in which the conducting surface is configured so as to form a capacitive structure with the at least one backplate.

Abstract: A novel multi chip module having increased accuracy of the soldering the integrated circuits (ICs) is provided by utilizing two additional lead frames and turning over the first lead frame soldered IC and stacking secondary IC thereon. Arrays of the first lead frames are mounted on a top tray guided by tooling pins. Solder pastes are printed on the first lead frames. Arrays of the second lead frames are placed on the first lead frames guided with tooling pins. Another layer of solder pastes are printed on the second lead frames. Thermal conductive glue is dispensed on the central portions of the first lead frames. ICs, which become the “bottom ICs” later, are placed on the central portions of the first lead frames upside down by a pick/place machine. After heat treatment, inspection and repair, the bottom ICs are mounted in a pocket on a bottom tray facing the first lead frames upside. Another layer of solder pastes are printed on the first lead frames.

Abstract: A solid state angular rate sensor is fabricated by preparation of a disc-shaped base structure (10) having first and second outer layers of a piezo-electric ceramic material, built up from a number of layers of a ceramic sheet or film that is capable of being tape-cast. The layers are then sintered and an inner layer of metallic material is provided between the outer layers, to complete a piezo-electric base structure having an inner electrode (15) between the sintered outer layers. Arrays of electrode structures are provided on the outer layers of the base structure (10), the electrodes radiating from the central region 14 of the base structure (10) and being equi-spaced around the outer edge of the disc (19).

Abstract: A method for packaging an image sensor includes the steps of: providing a substrate having an upper surface and a lower surface; mounting a frame layer to the upper surface of the substrate to form a chamber together with the substrate; mounting a photosensitive chip to the upper surface of the substrate and within the chamber, and electrically connecting the photosensitive chip to the substrate; mounting a transparent layer to the frame layer with a B-stage adhesive applied therebetween; pre-baking the B-stage adhesive to slightly adhere the transparent layer to the frame layer; testing the image sensor to determine whether the image sensor is passed or failed; and post-baking the passed image sensor to completely cure the B-stage adhesive so that the transparent layer is firmly adhered to the frame layer.

Abstract: A method of manufacturing multiple dimension transducer arrays of multiple layer elements from modules is provided. A plurality of multiple layer strips are formed. The strips are separate, such as an elongated strip corresponding in size to one row of elements. Connections between the electrodes of various layers or separate connections from the various electrodes to a bottom of the strip are formed on the separate multiple layer strips. The separate strips are then aligned within a frame and bonded together. The resulting sheet of multiple layer transducer material is then diced to form elements. Due to the previous interconnection of electrodes, each element includes electrical connections for each of the layer electrodes, avoiding the need for vias or high aspect ratio sputtering.