Abstract: An information handing system having apparatus for setting adequate drive strength based upon direct current (DC) trace resistance uses a resistance detection traces for each signal layer of a printed circuit board. These resistance detection traces are coupled to pull-up resistors and routed with a length and cross-sectional geometry that is substantially equal to the worst case routing of a net on a bus that is to be free of receiver mask violations (inadequate received signal strengths). Reference voltage levels may be determined for each bus so as to be representative of the minimum voltage acceptable to guarantee that the worst-case DC trace resistance will not cause the bus waveforms to fail signal integrity. A voltage comparator circuit may be used to compare the determined reference voltage levels with the voltage levels of the resistance detection traces of each of the printed circuit board layers.

Abstract: An automated system for setting the linear distance from a mounting surface of a pivot cartridge to critical features on actuator arms is disclosed. This distance is set to eliminate the tolerance incurred via normal manufacturing of these components. The system adjusts for every component to customize each actuator and/or pivot assembly to meet the functionality requirements for disk drives.

Abstract: A method of processing a ceramic capacitor includes a first step of applying a DC voltage to a ceramic capacitor by a first DC voltage source, and a second step of applying a DC voltage by a second DC voltage source to generate in the ceramic capacitor a polarization in a direction opposite to a direction of a polarization generated by the application of the DC voltage in the first step, thereby reducing electric charge remaining in the ceramic capacitor.

Abstract: In a method for manufacturing quartz crystal unit, a quartz crystal oscillator and an electronic apparatus, the method comprises the steps of forming at least triple and in different steps a quartz crystal tuning fork resonator having a frequency of oscillation of a fundamental mode of vibration, the quartz crystal tuning fork resonator having a quartz crystal tuning fork base and first and second quartz crystal tuning fork tines each connected to the quartz crystal tuning fork base, each of the first and second quartz crystal tuning fork tines having a first main surface and a second main surface opposite the first main surface, and a first side surface and a second side surface opposite the first side surface; providing a case having a mounting portion and an open end; providing a lid for covering the open end of the case; mounting the quartz crystal tuning fork resonator on the mounting portion of the case; and connecting the lid to the case to cover the open end thereof.

Abstract: An apparatus for mounting components provided with a multi-nozzle type component mounting head for moving vertically includes a plurality of movable parts linearly arranged; a plurality of nozzles respectively connected to tip parts of the movable parts; a height detector for detecting positions of the plurality of movable parts; a light projector provided on an extension of an arrangement of the plurality of nozzles; a light receiver provided at a position opposed to the light projector, wherein all of the plurality of nozzles are made to stand-by on an upper side of an optical axis L from the light projector, an arbitrary one of the nozzles is made to descend, and at a timing when the light receiver detects that light shielding of the light from the light projector is switched by the tip part of the nozzle, a vertical position of the movable part is measured by the height detector.

Abstract: A calibration apparatus includes an RC integrator circuit. The calibration apparatus further includes a bandwidth setting controller to provide a bandwidth setting code indicating a reference bandwidth value for calibration of the RC integrator circuit and a capacitance code generator, coupled to the RC integrator circuit, to generate a capacitance code to adjust a capacitance of the RC integrator circuit using the bandwidth setting code and a current capacitance value of the RC integrator circuit.

Abstract: A gas measuring device for measuring a presence of a target gas in a fluid medium includes a sensor having a sensing element and a heating element being configured to heat the sensing element to a predetermined operating temperature. The sensing element is responsive to the target gas such that at least one electrical property of the sensing element varies based on a presence of the target gas, and the electrical property of the sensing element is measured by the gas measuring device. The gas measuring device also includes a control circuit having a heating element controller connected to, and measuring an electrical property of, the heating element. The control circuit also includes a heater power supply supplying power to the heating element, wherein the heating element controller is connected to, and controls the operation of, the heater power supply based on the measurement of the electrical property of the heating element.

Abstract: Columns comprising a plurality of vertically aligned carbon nanotubes can be configured as electromechanical contact structures or probes. The columns can be grown on a sacrificial substrate and transferred to a product substrate, or the columns can be grown on the product substrate. The columns can be treated to enhance mechanical properties such as stiffness, electrical properties such as electrical conductivity, and/or physical contact characteristics. The columns can be mechanically tuned to have predetermined spring properties. The columns can be used as electromechanical probes, for example, to contact and test electronic devices such as semiconductor dies, and the columns can make unique marks on terminals of the electronic devices.

Abstract: A method of forming an electrical structure that includes a complex power-signal (CPS) substructure. The CPS substructure is formed and tested to determine whether the CPS substructure satisfies electrical performance acceptance requirements. The testing includes testing for electrical shorts, electrical opens, erroneous impedances, and electrical signal delay. If the CPS substructure passes the testes, then a dielectric-metallic (DM) laminate is formed on an external surface of the CPS substructure. The DM laminate includes an alternating sequence of an equal number N of dielectric layers and metallic layers such that a first dielectric layer of the N dielectric layers is formed on an external surface of the CPS substructure. N is at least 2. A multilevel conductive via is formed through the DM laminate and is electrically coupled to a metal layer of the CPS substructure.

Abstract: A bimorphic structure responsive to changes in an environmental condition, sensor structures incorporating one or more of such bimorphic structures, and a method of forming such bimorphic structures. The sensor structure has an electrically-conductive first contact on a substrate, and a bimorph beam anchored to the substrate so that a portion thereof is suspended above the first contact. The bimorph beam has a multilayer structure that includes first and second layers, with the second layer between the first layer and the substrate. A portion of the first layer projects through an opening in the second layer toward the first contact so as to define an electrically-conductive second contact located on the beam so as to be spaced apart and aligned with the first contact for contact with the first contact when the beam sufficiently deflects toward the substrate.

Abstract: A method for fabricating a semiconductor device includes (a) depositing an insulating film on a semiconductor substrate; (b) forming a recess in the insulating film; (c) depositing a conductive film on the insulating film while filling the recess with the conductive film; and (d) polishing the conductive film. Step (d) includes a first polishing substep of using a first polisher pad conditioned with a first dresser and a second polishing substep of using a second polisher pad conditioned with a second dresser different from the first dresser.

Abstract: The method for assembly of an LED lighting device comprising an LED module and a reflective and/or refractive optical unit and provided particularly as a reading or seat light for use in a vehicle such as, e.g.

Abstract: A method for manufacturing a pressure detector includes the steps of: preparing a first member including a sensing portion, a second member including a pressure receiving diaphragm, and a pressure transmission member; inserting the pressure transmission member between the sensing portion and the pressure receiving diaphragm; applying a preliminary load to the sensing portion; connecting the first member and the second member under the preliminary load; monitoring a signal from the sensing portion, corresponding to the preliminary load; and determining the preliminary load on the basis of the electric signal monitored in the step of monitoring.

Abstract: The present invention relates to a method of fabricating a vertical probe head, whereas the vertical probe head is formed by the combination of at least a probe, a bottom guide plate and a top guide plate having at least a hole matching the probe. The probe is fabricated by a LIGA-like process combining with the processes of photolithography, etching and electroforming, and so on, so that the probe is equipped with comparatively better precision, strength and reliability and yet can be custom-made for satisfying various demands. In addition, both the top and bottom guide plates are made by a means of non-mechanical machining, which respectively is fabricated by processing a substrate using means of photolithography, etching and mask so as to fabricate holes for matching with the aforesaid probe.

Abstract: Methods and apparatus for testing the actual glass parts that are to be used in electronic devices are disclosed. According to one aspect of the present invention, method for qualifying a glass part includes obtaining the glass part, and applying at least one thermal shock to the glass part. Once the thermal shock is applied, it is determined if the glass part qualifies for use in a device, e.g., a portable electronic device. If it is determined that the glass part qualifies for use in the device, the glass part is identified as qualifying for use in the device.

Abstract: For structuring solar modules, a track is inserted in a solar module by a structuring tool, and the inserted track is at the same time detected by a sensor following the structuring tool. This makes it possible to achieve quality control.

Abstract: A method of testing for misregistration in a multiple layer printed circuit board includes providing an electrical test pattern on one or more layers of the board, testing for an electrical signal between the test pattern and a test reference, and determining layer-to-layer misregistration based on the results of the testing. A method of manufacturing a multiple layer board that is configured to facilitate non-destructive testing of layer-to-layer misregistration includes forming an electrical test pattern on a first layer and forming a corresponding electrical test reference on a second layer. Then, a connecting pathway is formed between the test reference and the test pattern, including the first and second layers, with testing for an electrical signal between the test reference and the test pattern determining layer-to-layer misregistration of the first layer with respect to the second layer.

Abstract: In one aspect of the present invention, a manufacturing method of a semiconductor device may include performing an electrical test on a plurality of electronic components on a wafer, generating a mapping data set including category information representing categories of the respective electronic components based on the electrical test result and position information representing positions of the respective electronic components in the wafer, forming bumps on the plurality of electronic components at wafer level in various bump layouts employed in accordance with the categories assigned to the respective electronic components, with reference to the mapping data set, and dicing the wafer to separate the plurality of electronic components into individual chips, after forming the bumps.

Abstract: An electronic control pedal assembly includes a fixed support structure and a pedal arm. The pedal arm has a lower end carrying a pedal and is pivotable relative to the support structure. A potentiometer is at least partly carried by the fixed support and operable to generate an electric control signal that varies in magnitude in proportion to the extent of movement of the pedal arm relative to the fixed support structure. The potentiometer has at least one resistive track trimmed after assembly of the potentiometer to the fixed support so that the potentiometer provides a first fixed electric control signal at a idle position of the pedal arm and the potentiometer has at least one resistive track trimmed after assembly of the potentiometer to the fixed support so that the potentiometer provides a second fixed electric control signal at a full throttle position of the pedal arm.

Abstract: Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.

Abstract: A device for measuring the resistivity ?c of an interface between a semiconductor and a metal, comprising at least: one dielectric layer, at least one semiconductor-based element of a substantially rectangular shape, which is arranged on the dielectric layer, having a lengthwise L and widthwise W face in contact with the dielectric layer and having a thickness t, at least two interface portions containing the metal or an alloy of said semiconductor and said metal, each of the two opposing faces of the semiconductor element, having a surface equal to t×W and being perpendicular to the face in contact with the dielectric layer, being completely covered by one of the interface portions.

Abstract: A piezoelectric vibration element is provided which includes a piezoelectric substrate formed of a thickness slip based piezoelectric material and a metal layer formed on a surface of the piezoelectric substrate. In the piezoelectric vibration element, a surface of the metal layer is covered by a layer formed by chemical absorption with a material having a nonbonding electron pair.

Abstract: A method of making a microelectronic package includes providing a first microelectronic element having electrically conductive parts and including first and second surfaces and providing a compliant element including a releasable adhesive over the first surface of the first microelectronic element. A second microelectronic element having electrically conductive parts is abutted against the releasable adhesive so that the second microelectronic element is releasably assembled to the first microelectronic element and the electrically conductive parts of the first and second microelectronic elements are connected to one another. The releasably assembled package is tested to determine whether the package has been properly assembled. A curable liquid is then introduced between the first and second microelectronic elements of a properly assembled package and the curable liquid is cured to permanently assemble the first and second microelectronic elements together.

Abstract: An optical module includes a first silicon substrate having a first groove at its surface, a second silicon substrate having a second groove at its surface, a Laser device formed on the first silicon substrate, an optical modulator formed on the second silicon substrate, a substrate on which the first and the second silicon substrates are mounted wherein an optical axis of the Laser device is matched up with an optical axis of the optical modulator, a first lens transforming an divergent light emitted from the first optical device into a parallel light, disposed in the first groove, and a second lens converging the parallel light to the second optical device, disposed in the first groove.

Abstract: Method for fabricating a microscale anemometer on a substrate. A sacrificial layer is formed on the substrate, and a metal thin film is patterned to form a sensing element. At least one support for the sensing element is patterned. The sacrificial layer is removed, and the sensing element is lifted away from the substrate by raising the supports, thus creating a clearance between the sensing element and the substrate to allow fluid flow between the sensing element and the substrate. The supports are raised preferably by use of a magnetic field applied to magnetic material patterned on the supports.

Abstract: The invention realizes setting of measurement positions suitable for a warping state of a printed board and an easy work of setting the measurement positions. A printed board as a measurement sample is positioned three-dimensionally in X, Y and vertical directions on a positioning portion, and then a backup base is lifted up to apply backup pins to the back surface of the board and support the board horizontally. Then, the warping state of the board is measured by a height level detection device, and based on the measurement result the CPU displays the board on a monitor three-dimensionally or by contour lines. Once an operator sets measurement positions on the screen, the CPU converts each of the set positions into coordinates on the board, writes the coordinates of the set positions in the top of mounting data, and stores the data in the RAM.

Abstract: The present invention is a method and system for manufacturing an electronic device, such as a data storage device. The method includes generating a register including a desired device configuration. The register may include an identifier and radio signal information associated with the component so that the component may be tracked via a radio frequency identification device (RFID) physically associated with the component. Radio signals are monitored for signals associated with the component such as prior to inclusion into the electronic device to prevent improper assembly. An alert may be provided if a radio signal associated with a component included in the desired configuration is not present. The radio signals determined during monitoring are verified with the radio signals associated with the components included in the register. The components are assembled into the electronic device (or partially assembled device).

Abstract: A method for manufacturing an electronic apparatus comprises forming a quartz crystal tuning fork resonator having a fundamental mode of vibration and a second overtone mode of vibration each comprised of a flexural mode of an inverse phase, a series resistance R1 of the fundamental mode of vibration and a series resistance R2 of the second overtone mode of vibration. An amplification circuit is provided having a CMOS inverter, a feedback resistor, a negative resistance ?RL1 for the fundamental mode of vibration of the quartz crystal tuning fork resonator, and a negative resistance ?RL2 for the second overtone mode of vibration thereof. A feedback circuit is provided having the quartz crystal tuning fork resonator, a plurality of capacitors and a drain resistor. The quartz crystal tuning fork resonator is electrically connected to the CMOS inverter and the feedback resistor of the amplification circuit and to the capacitors and the drain resistor of the feedback circuit.

Abstract: An ultrasonic transducer device comprising: an ultrasonic transducer array micromachined on a substrate; flexible electrical connections connected to the transducer array; and a body of acoustically attenuative material that supports the substrate and the flexible electrical connections. The acoustic backing material may contain additional features, such as tabs or notches, for use in positioning the transducer on fixtures during manufacturing or positioning the transducer within a housing during final assembly. Tabs or other features that are used only during manufacturing may be subsequently removed from the device. The MUT device itself may also be thinned so as to provide flexibility as desired. The backing material is preferably matched in acoustic impedance to the silicon wafer so as to prevent reflection at the interface of any acoustic energy propagating rearward, i.e., in the direction away from the device front surface.

Abstract: A magnetic detection apparatus can be improved in its product yield. The magnetic detection apparatus includes a resin compact having a the magnet arranged in opposition to an object to be detected for generating a magnetic field, an IC chip with a magnetic detection part built therein for detecting a change in the magnetic field in accordance with movement of the object to be detected, and an IC package in which a lead frame having the IC chip installed thereon is sealed with a resin. A method for manufacturing such a magnetic detection apparatus includes a signal adjustment step for adjusting a signal generated from the magnetic detection part in a state in which the magnetic field is applied to the magnetic detection part to correct a deviation of the signal of the magnetic detection part generated in accordance with a relative displacement between the magnetic detection part and the magnet.

Abstract: An analysis device is provided comprising a housing having at least two housing parts, a measuring unit and a processor provided therein for purposes of the functionality of the analysis device and generation of analysis data, wherein the device comprises a lock element for producing a generally fixed mechanical connection between the at least two housing parts. Providing such a lock element allows the analysis device to be checked for quality control and/or functionality purposes before the lock element is fitted to the housing, and if the device requires service or repair as a result of such checks then the housing can be reopened without damage to the housing or other aspects of the device. Once the lock element is fitted into a locked position for locking the housing together, subsequent reopening of the housing causes structural effects, including damage or destruction, to either or both of the lock element and the housing or housing parts, ensuring that such reopening becomes apparent to the user.

Abstract: A detector for detecting a gaseous component in a gas is comprised of a sensor having a gas detecting region configured to output an electric signal in response to detection of the gaseous component and a contact portion configured to conduct the electric signal; an enclosure housing the sensor and having a through hole configured to introduce the gas to the gas detecting region; a wiring partly facing to the contact portion and being led out of the enclosure; an electric conductor interposed between the contact portion and the wiring; a packing member surrounding the through hole and so as to make a gap between the sensor and the enclosure impervious to the gas.

Abstract: A solar cell or solar module is measured during a short pulse of light in such a way that the resulting data for current and voltage at each light intensity is the same as would be measured under steady-state illumination conditions and therefore predictive of the actual performance of the solar cell or solar module in sunlight. A varying voltage is applied to the terminals of the solar cell during a light pulse so that the instantaneous current at a given voltage and light intensity during the light pulse is the same as would be measured under constant illumination at that same given intensity. A constant voltage is modified by a small signal correction that is proportional to the terminal current. Or, the small signal correction is proportional to the light intensity. An analog feedback circuit is constructed using the terminal current or light intensity for feedback in order to provide the requisite varying voltage. The varying voltage may also be supplied by digital synthesis.

Abstract: A wire member adapted to be used in a detection coil of an NMR spectrometer's probe. The wire member has a sleeve made of a copper tube having a high electrical conductivity, strands made of platinum, and a thin film of gold or rhodium formed on the surface of the sleeve by plating. The strands are mounted inside the sleeve and have a cross section to cancel the magnetic susceptibility due to the sleeve. The thin film cancels the total magnetic susceptibility of the sleeve and strands.

Abstract: The present invention is to provide a method of trimming during short time without any difficulty of controlling a device for trimming and a trimming device having a simple structure. The method of manufacturing a resister device comprises: trimming a resister element 5 including a resister film 4 in order to adjust a resister value of the resister element 5, the resister film 4 contacting a pair of electrodes 3 for a resister formed on a substrate 2. A region of the substrate located in a position of a side portion 6 and along with the resister film 4 is heated in the trimming, the position being on a surface where the electrodes 3 for a resister and the resister film 4 are formed. The heating is performed by laser beam irradiation. The side portion 6 is irradiated by a laser beam to form a concave portion 7.

Abstract: The invention comprises devices and methods for determining residual stress in MEMS devices such as interferometric modulators. In one example, a device measuring residual stress of a deposited conduct material includes a material used to form a MEMS device, and a plurality of disconnectable electrical paths, wherein said plurality of paths are configured to disconnect as a function of residual stress of the material. In another example, a method of measuring residual stress of a conductive deposited material includes monitoring a plurality of signals, each of said plurality of signals being associated with one of a plurality of test structures, said plurality of test structures each being configured to change the associated signal upon being subject to a predetermined amount of residual stress, sensing a change in said plurality of signals, and determining a residual stress level in said material based on the sensed change in the plurality of signals.

Abstract: A gas sensor apparatus and method of forming the same generally includes a gas sensor element comprising a heater and a plurality of electrodes. A ceramic substrate can be provided for supporting the electrodes on one side of the ceramic substrate and the heater on the opposite side of the ceramic substrate. The gas sensor element is preferably embedded in the ceramic substrate. The ceramic substrate also possesses a substantially circular shape in order to prevent a breakage of the gas sensor element, avoid thermal loss, and permit the gas sensor apparatus to withstand mechanical shock and high vibrations while occupying a minimal package space.

Abstract: A single cell oxygen sensor apparatus and method are disclosed. An yttrium-based stabilized layer having electrical terminals connected to the yttrium-based stabilized layer can be provided on a substrate, wherein the yttrium-based stabilized layer is excitable by a constant current applied to the electrical terminals. A plurality of electrodes are located on a side of the yttrium-based stabilized layer and a plurality of heater elements located on said substrate opposite said yttrium-based stabilized layer. The heater elements can maintain the yttrium-based stabilized layer at a particular temperature. A cavity is formed and located between the yttrium-based stabilized layer and the heater elements. The partial pressure of oxygen can be measured by comparing the partial pressure of oxygen within the cavity with respect to the partial pressure of oxygen in the atmosphere external to the single cell oxygen sensor apparatus.

Abstract: The present invention uses a frame with one or more axial ribs extending from a spine onto which two or more discrete two-terminal electronic components, such as capacitors, resistors, or inductors, can be attached. The function of the frame is to align and space the electronic components in a single device or array that allows the two-terminals of each component to be separately contacted or soldered to a PC board during final assembly into a circuit. The frame may use friction or a bonding agent to hold the components to the frame. Additionally, the base of the frame forms a single surface for the pick and place equipment used in circuit board assembly. The frame and any bonding agent must be capable of sustaining high temperature soldering operations to form electrical contacts in the circuit assembly operation.

Abstract: Embodiments of the present invention provide a process that monitors a magnetic playback signal while gradually increasing an electricity supply amount for a heater to thereby determine contact between a magnetic head slider and a magnetic disk medium. According to one embodiment, after components for configuring a magnetic recording/playback portion are assembled into a housing, magnetic information is played back on a specific track of a magnetic disk medium by using a playback element while gradually increasing an electricity supply amount for a heater of a magnetic head slider. An amplitude of a playback signal is measured at a plurality of portions along a circumferential direction of the track. Contact between the magnetic head slider and the magnetic disk medium is detected in accordance with an increase in variation in the measured amplitude.

Abstract: There is provided a device identifying method for identifying an electronic device including therein an actual operation circuit and a test circuit having a plurality of test elements provided therein, where the actual operation circuit operates during an actual operation of the electronic device and the test circuit operates during a test of the electronic device.

Abstract: Methods for fabricating light-emitting diode (LED) array structures comprising multiple vertical LED stacks coupled to a single metal substrate is provided. The LED array structure may comprise two, three, four, or more LED stacks arranged in any configuration. Each of the LED stacks may have an individual external connection to make a common anode array since the p-doped regions of the LED stacks are all coupled to the metal substrate, or some to all of the n-doped regions of the LED stacks may be electrically connected to create a parallel LED array. Such LED arrays may offer better heat conduction and improved matching of LED characteristics (e.g., forward voltage and emission wavelength) between the individual LED stacks compared to conventional LED arrays.

Abstract: In order to be able to provide magnetic angle sensors thin and slender, while still minimizing magnetic interference fields, the angle sensor, comprised of a longitudinally extending main circuit board and a sensor element, transversally disposed in front of the end of the main circuit board, is housed in a pin shaped sleeve type housing, in which at least the side walls are magnetically shielded in the portion of the sensor, and additionally also the backside and circumferential surface of the encoder magnet.

Abstract: A method for testing or measuring electric elements, includes applying a beam of particles to a location of an electric element. Charges are liberated under the effect of the application of the beam of particles. The liberated charges are collected by a collector. The collected quantity of charges is measured, and an electric feature is deduced from the measure of the collected quantity of charges.

Abstract: A modular sensor assembly and methods of fabricating a modular sensor assembly are provided. The modular sensor assembly includes a sensor array coupled to an electronics array in a stacked configuration. The sensor array comprises a plurality of sensor modules, each comprising a plurality of sensor sub-arrays. The electronics array comprises a plurality of integrated circuit modules, each comprising a plurality of integrated circuit chips. The sensor modules may be coupled to the electronics modules via flip chip technology.

Abstract: A method is presented for grinding a surface of an elongate bar having a plurality of thin film magnetic elements aligned in a line, each of the thin film magnetic elements having a magnetoresistive sensor for reading a magnetic record from a recording medium and an inductive electromagnetic transducer for writing a magnetic record into the recording medium in a stacked structure, the surface of the bar being a grind surface so that it can be formed into an air-bearing surface by means of the grinding. The method has steps of providing first resistive films on the grind surface in advance along a first longitudinal line parallel to a longitudinal direction of the bar, and providing second resistive films on the grind surface in advance along a second longitudinal line parallel to the longitudinal direction of the bar.

Abstract: A first cavity in a holder is provided with a plurality of spiral contactors and a thermosetting adhesive member. In a state where a first bare chip is mounted in the first cavity and spherical contactors on the first bare chip are pressed against the plurality of spiral contactors, various tests are performed. If the result of the test is pass, the holder is heated so that the adhesive member becomes hard and rigid by being heated. This can perform securing while a good connection between the first bare chip and the holder is maintained. If the result of the test is fail, only the first bare chip is removed and replaced with a new bare chip.

Abstract: A sensor element including: a first solid electrolyte layer as defined herein; and a second solid electrolyte layer as defined herein, wherein the first solid electrolyte layer includes a first inner insulating layer, a first outer insulating layer, a first inner conductive layer and a first outer conductive layer as defined herein, the second solid electrolyte layer includes a second inner insulating layer, a second outer insulating layer, a second inner conductive layer and a second outer conductive layer as defined herein, and the first outer conductive layer and the second outer conductive layer are in contact with one another.

Abstract: Various method embodiments comprise testing a plurality of RFID tags forming at least a portion of a first web to identify defective RFID tags and verified RFID tags, cutting the first web between a rotary die and an anvil to remove at least the verified RFID tags from the first web, rotating the anvil to transfer the verified RFID tags cut from the first web away from the first web, placing the verified RFID tags from the anvil onto a second web to form a third web having a first major surface, preventing the defective RFID tags from being placed from the anvil on the second web, and re-testing the RFID tags forming at least a portion of the third web. Other aspects and embodiments are provided herein.

Abstract: A substrate assembly is stuffed into a converter outer shell to form a catalytic converter having a desired gap bolt density (GBD) value. The substrate assembly is formed by wrapping and taping a mat around a catalytic substrate. A predetermined pressure is applied to the substrate assembly and an outer diameter of the substrate assembly is measured at this predetermined pressure. A GBD value is predicted based on this measurement and if the GBD value is acceptable the substrate assembly is stuffed into the converter outer shell.