Abstract: A fabrication process produces markers for a magnetomechanical electronic article surveillance system. The marker includes a magnetomechanical element comprising one or more resonator strips of magnetostrictive amorphous metal alloy; a housing having a cavity sized and shaped to accommodate the resonator strips for free mechanical vibration therewithin; and a non-deactivatable bias magnet adapted to magnetically bias the magnetomechanical element. The process employs adaptive control of the cut length of the resonator strips, correction of the length being based on deviation of the actual marker resonant frequency from a preselected, target marker frequency. Use of adaptive, feedback control advantageously results in a much tighter distribution of actual resonant frequencies. Also provided is a web-fed press for continuously producing such markers with adaptive control of the resonator strip length.

Abstract: A method and system for improving power distribution and/or current measurement on a printed circuit board is disclosed. According to the invention, a first power plane adapted for current measurement includes a first segment to which a current source is connected and a second segment to which other devices may be connected, forming the current load. A third segment is used to measure the current between the first segment and the second segment through two vias that link two points of the third segment to, preferably, two pads of the external layer. In a preferred embodiment, vias are connected to the first segment so that current flow in the third segment is linear, to improve and simplify current determination. The resistivity between the pair of vias may be computed or estimated using calibrated currents.

Abstract: A method for assembling an image capturing device is provided. The image capturing device includes a light-pervious module, an image sensor and a binding material. The image sensor has a light sensing region for converting an imaging light into an electronic signal. The binding material is used for binding articles together and curable by a curing process. Firstly, the light-pervious module and the image sensor together are releasably bound together via the binding material, thereby defining a close space for accommodating the image sensor. Then, a testing process is performed to detect a clean condition of the close space. If particles present in the close space are detected, the light-pervious module is detached from the image sensor, a cleaning process is done to remove the particle, and the light-pervious module and the image sensor are releasably bound together to define the close space again. Afterwards, the binding material is cured.

Abstract: When a formed position of a via formed on a board is the same as a position of a footprint of a chip component located on the back surface of the board corresponding to an area on which a BGA is mounted, a board designing apparatus determines that the chip component and the BGA can be connected using chip on hole. When it is determined that the chip component and the BGA can be connected, the board designing apparatus carries out chip on hole by forming a via in an area of the board on which the BGA is mounted, the via leading to the footprint of the chip component located on the back surface of the board.

Abstract: A filtered feedthrough assembly having at least one terminal pin therethrough is provided. The feedthrough assembly comprises a ferrule having a cavity therethrough for receiving the terminal pin, and insulating structure having an upper surface. The insulating structure is disposed within the cavity and around the terminal pin for electrically isolating the pin from the ferrule. A capacitor is disposed around the pin and electrically coupled thereto. The capacitor has a lower surface that is disposed proximate the upper surface, and at least one washer is disposed between the upper surface and the lower surface. To attach the capacitor to the insulating structure, a body of epoxy is substantially confined between the upper surface and the lower surface by the ferrule, the insulating structure, the capacitor, and the at least one washer.

Abstract: A stator bar facility including: a stator bar workstation; an in-ground pit below the workstation; a stator bar elevator extending from the workstation pit, and a coupling mechanism attached to the elevator, wherein the coupling mechanism further comprises a rotational mount to receive at least one stator bar, wherein the rotational mount enables the received stator bar to be turned from a substantially horizontal position to a substantially vertical position.

Abstract: A method for manufacturing an equalizer used to compensate a digital signal passed by a transmission line, in which the digital signal can be presented as a frequency-domain function. The method includes measuring a the transmission line scattering-parameter; performing an integration and a differentiation about the transmission line scattering-parameter, the frequency-domain function, the ideal gain, and an equalizer scattering-parameter to get the component impedances of the equalizer; and manufacturing the equalizer circuit with the derived component impedances.

Abstract: A method for manufacturing a calibration device for an active circuit on a chip, comprises: providing an active circuit that is capable of exhibiting a desired electrical characteristic; and providing a calibration mechanism on-chip with the active circuit. The calibration mechanism generates a control output and comprises a device under test (DUT) configured as a replica of at least one segment of the active circuit, and which generates a test output that causes finite adjustments to the control output, based on a comparison of the electrical characteristics exhibited by the DUT with a known electrical characteristic. The method further comprises: attaching to each control input terminal of the active circuit a corresponding control output from the calibration mechanism. The control output of the calibration mechanism dynamically adjusts control input applied to devices of the active circuit to force the active circuit to exhibit the desired electrical characteristic.

Abstract: A method for linearizing potentiometric sensors is provided, the method can include the steps of: insertion in a measurement and/or processing station of a potentiometric sensor provided with a resistive track; application of a defined voltage and/or of a defined current across the resistive track; placement of a number of sensing elements composed of metallic contacts distributed at uniform intervals over the length of the resistive track; acquisition of the individual measured values of the sensing elements and determination of the curve of the resistance of the resistive track, and linearization of the resistance of the resistive track by means of sequential adjustment of the resistance of the resistive track.

Abstract: An apparatus for detecting a location of conductive pins with respect to a circuit board during an assembly process using a press tool to mate the circuit board and the conductive pins includes a detector housing holding a plurality of switches aligned with corresponding conductive pins, wherein the detector housing is configured to be mounted to the press tool used during the assembly process. The switches change state based on the location of the conductive pins with respect to the circuit board. The apparatus further includes a sensor electrically coupled with the plurality of switches, wherein the sensor monitors the change of state of each switch to indicate that the respective conductive pins are properly mated with the circuit board.

Abstract: A mirror for a piezoelectric resonator consisting of alternately arranged layers of high and low acoustic impedance is manufactured by at first producing a first layer on which a second layer is produced, so that the second layer partially covers the first layer. Then, a planarization layer is applied on the first layer and on the second layer. Subsequently, a portion of the second layer is exposed by structuring the planarization layer, wherein the portion is associated with an active region of the piezoelectric resonator. Finally, the resulting structure is planarized by removing the portions of the planarization layer remaining outside the portion.

Abstract: A manufacturing method and manufacturing system for creating a modular electronic assembly are disclosed. The manufacturing system 300 may position a contact terminal 202 of a printed electronic component module 102 relative to a contact pad 204 of a printed electronic substrate 112. The manufacturing system 300 may connect the contact terminal 202 to the contact pad 204 using a conductive adhesive connection 116.

Abstract: To provide an electronic component mounting system and an electronic component mounting method which can prevent a mounting failure due to positional error in a height direction of a substrate and ensure mounting quality. The electronic component mounting system includes a plurality of electronic component mounting devices connected to one another and mounts an electronic component on a substrate to manufacture a mounting substrate. A print test device for testing the substrate after solder printing measures a height position of a height measurement point set on the upper surface of the substrate 4 by a height measuring machine 22 and outputs a measurement result as substrate height data. In a component placing step using an electronic component placing device, a control parameter for controlling a component placing operation of the placing head 32 is updated.

Abstract: An improved method of making sealant containing twist-on wire connectors from a batch of components, wherein some of the components may be preassembled through automated equipment and at least one or more of the steps performed in the making of a sealant containing twist-on wire connector is performed manually at a station where an operator can simultaneously perform one or more steps to enhance the formation of a twist-on wire connector containing a sealant while at the same time eliminating upfront investments costs for a work station as well as costs for maintenance of a work station.

Abstract: Disclosed is a cantilever-type probe and methods of fabricating the same. The probe is comprised of a cantilever being longer lengthwise relative to the directions of width and height, and a tip extending from the bottom of the cantilever and formed at an end of the cantilever. A section of the tip parallel to the bottom of the cantilever is rectangular, having four sides slant to the lengthwise direction of the cantilever.

Abstract: In a method of manufacturing an ink-jet recording head including plural recording element substrates having at least one nozzle array comprising nozzles to eject ink, an electric wiring member supplying signals to the recording element substrates, a member supporting the recording element substrates and the electric wiring member, electric connecting portions electrically interconnecting the recording element substrates and the electric wiring member, and a sealant sealing the electric connecting portions, the method comprises the steps of applying sealants to the supporting member including the recording element substrates, the electric wiring member, and the electric connecting portions, and curing the sealants, measuring a distance between reference positions set on each recording element substrate before and after the curing of the sealants, and mounting the recording element substrates to the supporting member depending on a difference in the distance between the reference positions measured before and a

Abstract: Disclosed herein is a method of manufacturing a medical device, catheter or lead having electrically conductive traces and external electrical contacts. Each trace may be in electrical connection with one or more external electrical contacts. More specifically, each trace is typically electrically connected to a single contact. The traces and contacts may assist in diagnosis and/or detection of bio-electrical signals emitted by organs, and may transmit such signals to a connector or diagnostic device affixed to the catheter. The external electrical contacts may detect bioelectric energy or may deliver electrical energy to a target site. Also disclosed herein is a medical device made in accordance with the method described above.

Abstract: Provided is a test apparatus that tests a device under test, comprising a test signal generating section that generates a test signal to be applied to the device under test; a first driver that is electrically connected to a terminal of the device under test and that supplies the test signal to the terminal of the device under test; a correction signal generating section that generates a correction signal for correcting attenuation of the test signal occurring until the test signal reaches the terminal of the device under test; and a second driver that is electrically connected to the terminal of the device under test and that supplies the correction signal to the terminal of the device under test.

Abstract: A method of producing a laminated variant-shaped core 10, comprising: Step A of punching out a required number of core sheets 12-14 for each of plural types, from a strip 11 to be processed, to form the outlines of the core sheets 12-14, and push back the punched out core sheets 12-14 into the strip 11; Step B of forming cutouts 28, 30 and 32 reaching outer peripheries of outer plates 27, 29 and 31, the outer plates 27, 29 and 31 being the same in outer shape and respectively containing thereinside the core sheets 12-14, the cutouts 28, 30 and 32 having inner edges respectively in contact with the core sheets 12-14; Step C of forming caulking portions 21 in each of the core sheets 12-14 and caulking portions 33 in each of the outer plates 27, 29 and 31; Step D of punching out the outer plates 27, 29 and 31 from the strip 11 to form the outlines of the outer plates 27, 29 and 31, and laminating and interlocking the core sheets 12-14 to form the variant-shaped laminated core 10 and laminating and interlocking t

Abstract: A high-speed machine and method for placing an RFID circuit onto an electrical component includes separating an RFID circuit from a web of RFID circuits, and placing the RFID circuit onto an electrical component with a placing device. The separating includes directing the RFID circuit onto a transfer drum of the placement device and separably coupling the RFID circuit to the transfer drum. According to one method, a separator device separates and directs chips or interposers onto a placement device. According to another method, chips or interposers are tested before being separated from a web, and if good, are separated from the web, directed onto a placement device, and placed on an electrical component. If defective, the chips or interposers are not directed onto a placement device and are removed by a scrap web removal device.

Abstract: An optical connector for contactless communication is provided. The optical connector includes an optical output part through which an optical signal is output; a first housing which is attached to a board of an electronic appliance and supports the optical output part so that the optical output part protrudes from the first housing to perform contactless communication; and a second housing which is removably attached to the first housing to surround the optical output part.

Abstract: There is provided a system, apparatus and methods for developing laser systems that can create a precise predetermined capsulotomy. The systems, apparatus and methods further provide laser systems that reduce the patient-to-patient variability and doctor-to-doctor variability associated with hand held apparatus for performing capsulorhexis and capsulotomies. There is further provided a precise predetermined shot pattern and shaped capsulotomy that is based at least in part on the shape of an IOL and in particular an accommodating IOL.

Abstract: A method for manufacturing wireless communication devices for use in tracking or identifying other items comprises a number of cutting techniques that allow the size of the antenna for the wireless communication device. Further, the chip for the wireless communication device is nested so as to be flush with the surface of the substrate of the wireless communication device. Rollers cut the tabs that form the antenna elements. In a first embodiment, a plurality of rollers are used, each on effecting a different cut whose position may be phased so as to shorten or lengthen the antenna element. In a second embodiment, the rollers are independently positionable to shorten or lengthen the antenna element.

Abstract: Provided is a wiring substrate which enables wiring density to be increased and enables transmission speed of signals to be adjusted without making a design change of wirings. A wiring substrate 100 is provided with a first terminal 110, a second terminal 120, a first wiring 112 and a second wiring 114. The first wiring 112 is such that one end thereof is connected to the first terminal 110, and is formed on the wiring substrate 100. The second wiring 114 is such that one end thereof is connected to the second terminal 120, and is formed on the wiring substrate 100. One end of each of a plurality of third wirings formed on the wiring substrate 100 is connected to the other end of the first wiring 112, and one end of each of a plurality of fourth wirings formed on the wiring substrate 100 is connected to the other end of the second wiring 114. The other end of at least one third wiring and the other end of at least fourth wiring are connected together.

Abstract: A method for characterizing deposited film on a substrate within a processing chamber during processing is provided. The method includes determining voltage-current characteristic for a probe head when measuring capacitor is set at a first capacitance value. The method also includes applying RF train to the probe head when measuring capacitor is set at a capacitance value greater than first capacitance value. The method further includes providing an initial resistance value and an initial capacitance value for the deposited film. The method yet also includes employing initial resistance value, initial capacitance value, and voltage-current characteristic to generate simulated voltage-time curve. The method yet further includes determining measured voltage-time curve, which represents potential drop across the deposited film for one RF train. The method more over includes comparing the two curves.

Abstract: The method of manufacturing a liquid ejection head includes the steps of: forming piezoelectric elements on a diaphragm; stacking an intermediate plate which includes recess sections for covering the piezoelectric elements and drive wires connected to the piezoelectric elements, on the diaphragm; connecting an integrated circuit to the drive wires; forming an actuator function unit by electrically and mechanically bonding the diaphragm, the piezoelectric elements, the drive wires, the intermediate plate and the integrated circuit, in such a manner that the piezoelectric elements are electrically driven via the integrated circuit; measuring displacement of the diaphragm by operating the integrated circuit; and bonding a flow path forming member to the actuator function unit after the step of measuring the displacement of the diaphragm, the flow path forming member being provided for forming pressure chambers connected to nozzles and forming a common liquid chamber for storing liquid supplied to the pressure ch

Abstract: An electronics module is assembled by demountably attaching integrated circuits to a module substrate. The module is then tested at a particular operating speed. If the module fails to operate correctly at the tested speed, the integrated circuit or circuits that caused the failure are removed and replaced with new integrated circuits, and the module is retested. Once it is determined that the module operates correctly at the tested speed, the module may be rated to operate at the tested speed and sold, or the module may be tested at a higher speed.

Abstract: The present invention is a method for adjusting the resonant frequency of a mechanical resonator whose frequency is dependent on the overall resonator thickness. Alternating selective etching is used to remove distinct adjustment layers from a top electrode. One of the electrodes is structured with a plurality of stacked adjustment layers, each of which has distinct etching properties from any adjacent adjustment layers. Also as part of the same invention is a resonator structure in which at least one electrode has a plurality of stacked layers of a material having different etching properties from any adjacent adjustment layers, and each layer has a thickness corresponding to a calculated frequency increment in the resonant frequency of the resonator.

Abstract: A method for manufacturing an acoustical stack for use within an ultrasound transducer comprises using a user defined center operating frequency of an ultrasound transducer that is at least about 2.9 MHz. A piezoelectric material and a dematching material are joined with an assembly material to form an acoustical connection therebetween. The piezoelectric material has a first acoustical impedance and *at least one of* an associated piezoelectric rugosity (Ra) and piezoelectric waviness (Wa). The dematching material has a second acoustical impedance that is different than the first acoustical impedance and at least one of an associated dematching Ra and dematching Wa. The piezoelectric and dematching materials have an impedance ratio of at least 2. The assembly material has a thickness that is based on the center operating frequency and at least one of the piezoelectric Ra, piezoelectric Wa, dematching Ra and dematching Wa.

Abstract: A method of assembling a scintillation detector including placing a scintillator crystal in a casing, and forming a sealed casing having a controlled atmosphere different than ambient atmosphere, wherein the controlled atmosphere includes an inert gas and a trace gas in an amount of at least about 1 vol % and not greater than about 30 vol %, wherein the trace gas is selected from the group of materials consisting of hydrogen, helium, neon, krypton, xenon, and carbon monoxide. The assembling method further includes testing the sealed casing for leaks by detecting the presence of the trace gas.

Abstract: Ultrasonic measurements of porosity in manufactured parts or materials are calibrated using reference standards in which parallel holes are drilled in the backside of a body of material. The holes simulate voids in a part which attenuate incident ultrasonic energy. The number, size and location of the holes determine the simulated level of porosity that may be used to calibrate an ultrasonic tester. Multiple reference standards representing different levels of porosity can be produced in the form of individual coupons, or in a single body having multiple groups of holes.

Abstract: An optical module 10 according to the invention is comprised of: a substrate 11; a laser diode array 14 implemented on said substrate in an array; a driver IC 15 implemented on said substrate and electrically connected to each of surface emitting semiconductor laser elements of the laser diode array 14; an optical connector unit 12 for holding a plurality of optical fiber 16 in an array, wherein the optical connector unit 12 is fixed to the substrate 11 in a location where center of each single end of said plurality of optical fiber and center of each light injecting region are aligned with each other; and a cover 13. The optical connector unit 12 includes two guide-pin holes 12b on two opposite sides of a plurality of fiber holding hole 12a. Two alignment marks 50 are provided on a surface 11a of the substrate 11, which are visually recognizable through each of the guide-pin holes 12b, and function as alignment reference of said optical connector unit 12.

Abstract: A method of making a device for measuring deformation includes a step of depositing a silicon adhesion underlayer on a silicon carbide surface by chemical vapor spraying, and a step of depositing a coating on the silicon adhesion underlayer by atmospheric thermal spraying.

Abstract: In general, in a first aspect, the invention features a system including an interferometer configured to direct test light to an overlay target and subsequently combine it with reference light to form an interference pattern, the test and reference light being derived from a common source, a multi-element detector, one or more optics to image the overlay target on the multi-element detector; and an electronic processor in communication with the multi-element detector. The overlay target includes a first pattern and a second pattern and the electronic processor is configured to determine information about the relative alignment between the first and second patterns.

Abstract: The present invention aims to increase the number of test elements of a TEG without increasing the area of each of slice areas. Test electrode pads are disposed in alignment in one row in each of areas separated from semiconductor chips provided over a semiconductor wafer. Test elements are formed corresponding to these test electrode pads and in areas lying directly therebelow. Electrode terminals of the test elements are electrically coupled to the test electrode pads adjacent to the corresponding electrode pads and the test electrode pads further adjacent thereto with being spaced one test electrode pad apart. Upon testing, probe pins are brought into contact with the odd-numbered test electrode pads to conduct testing. Next, the probe pins are brought into contact with the even-numbered test electrode pads while being shifted by one electrode pad pitch thereby to conduct testing.

Abstract: A method for manufacturing a piezoelectric actuator includes the steps of measuring a thickness of a vibration plate and determining a thickness of a piezoelectric layer based on an amount of deviation in the measured thickness of the vibration plate from a preset reference thickness of the vibration plate. Then, a piezoelectric layer of the determined thickness is formed on a side of the vibration plate which is opposite to a pressure chamber. This makes it easy to correct the thickness of the vibration plate with the thickness of the piezoelectric layer. It is easy to mass-produce piezoelectric actuators having constant and desired characteristics.

Abstract: A remote inspection device is provided for inspecting visually obscured locations. The device is generally comprised of a imager housing and a display housing disposed on opposite ends of a modular, flexible cable. An imaging device is embedded in the end of the cylindrical imager housing, such that the imaging device is able to capture an image of a viewing area proximate to the distal end of the flexible cable. One or more light sources also protrude from the outwardly facing end of the cylindrical imager housing along a perimeter of the imaging device such that the imaging device is recessed between the light sources. A display housing is coupled to the other end of the flexible cable and configured to be grasped by a user of the device. A display device supported by the display housing receives a video signal from the imaging device and converts the video signal to a video image.

Abstract: A gas sensor for determining a physical characteristic of a measurement gas, in particular its temperature or the concentration of a gas component in a gas mixture, having a sensor element that has end segments at the side of the measurement gas and at the side of the connection, a sheath that surrounds the sensor element with a radial distance and that has a protective tube, a housing, and a holding cap, and a sealing element that seals the sensor element against the sheath and that is situated on the sensor element between the measurement gas-side end segment and the connection-side end segment of the sensor element.

Abstract: The present invention, which aims at providing a component mounting method and a mounter capable of correcting, with high accuracy, a mounting position of a component, includes: a mounting head (105); a recognition unit (108) including a shutter camera (111b) and instructing it to start taking an image of a component (103a) when the mounting head (105) arrives at a predetermined position; and a main control unit (160) (i) correcting a position of the component shown in the image taken by the shutter camera (111b), based on a first distance over which the mounting head (105) moves during a time period from when the instruction to start taking the image is given to when camera exposure by the shutter camera (111b) is performed, (ii) correcting the mounting position at which the mounting head (105) is to mount the component (103a), based on the corrected component position, and (iii) controlling the mounting head (105) so that it mounts the component (103a) at the corrected mounting position.

Abstract: A method of manufacturing an optical component comprising a substrate and a mounting frame with plural contact portions disposed at predetermined distances from each other is provided. The method comprises providing a measuring frame separate from the mounting frame for mounting the substrate, which measuring frame comprises a number of contact portions equal to a number of the contact portions of the mounting frame, wherein respective distances between the contact portions of the measuring frame are substantially equal to the corresponding distances between those of the mounting frame, measuring a shape of the optical surface of the substrate, while the substrate is mounted on the measuring frame, and mounting the substrate on the mounting frame such that the contact portions of the mounting frame are attached to the substrate at regions which are substantially the same as contact regions at which the substrate was attached to the measuring frame.

Abstract: The invention relates to the collective fabrication of n 3D module. It comprises a step of fabricating a batch of n dies i at one and the same thin plane wafer (10) of thickness es comprising silicon, covered on one face with electrical connection pads (20), called test pads, and then with a thin electrically insulating layer (4) of thickness ei, forming the insulating substrate provided with at least one silicon electronic component (11) having connection pads (2) connected to the test pads (20) through the insulating layer.

Abstract: A system for fabricating, testing, and modifying a prototype of an electrical circuit comprises a materials printer including a holder for positioning a substrate. The materials printer is adapted to receive information describing the prototype and is further adapted to fabricate the prototype on the substrate based on the information. An electrical measuring instrument associated with the holder is adapted to be placed in electrical communication with the prototype when the prototype is received by the holder. A display device receives a plurality of measurements of the prototype from the electrical measuring instrument.

Abstract: A method for manufacturing a magnetostrictive torque sensor having low nonuniformity of sensitivity characteristics. The residual austenite content in the rotating shaft of the torque sensor is measured first. A magnetic film is subsequently subjected to a heat treatment under heat treatment conditions that are different for each of the measured residual austenite contents, and magnetic anisotropy is imparted.

Abstract: An electronic apparatus comprises at least one quartz crystal oscillator comprised of a quartz crystal oscillating circuit having a quartz crystal resonator, an amplifier, at least one resistor, and capacitors. The quartz crystal resonator comprises a quartz crystal tuning fork resonator having a quartz crystal tuning fork base, quartz crystal tuning fork tines connected to the quartz crystal tuning fork base, and at least one groove formed in at least one of opposite main surfaces of the quartz crystal tuning fork tines. A length of the at least one groove formed in at least one of the opposite main surfaces of the quartz crystal tuning fork tines is within a range of 40% to 80% of a length of the quartz crystal tuning fork tines.

Abstract: A method for testing an integrated circuit memory device includes applying a sequence of test pulses to a memory cell on the device, where the test pulses result in current through the memory cell having an amplitude dependent on the test pulse. Resistance in the memory cell is measured in response to the sequence of test pulses. A parameter set is extracted from the resistance measurements which includes at least one numerical coefficient that models dependency of the measured resistance on the amplitude of the current through the memory cell. The extracted numerical coefficient or coefficients are associated with the memory device, and used for controlling manufacturing operations.

Abstract: A RFID transponder includes a resonant circuit for providing a clock signal at a predetermined clock frequency, a self-calibration stage for calibrating the resonant circuit's current clock frequency towards the predetermined clock frequency. The self-calibration stage is adapted to compare a first clock frequency of the resonant circuit determined during an interrogation period, during which the resonant circuit is excited by an external RF signal, with a second clock frequency determined during a frequency maintenance period, during which the resonant circuit is excited internally through an oscillation maintenance circuit of the RFID transponder and to calibrate the resonant circuit towards the predetermined clock frequency based on the comparison result.

Abstract: Embodiments of the present disclosure relate generally to a sensor assembly. In various embodiments the sensor assembly includes a body having a first segment, a second segment, and a living hinge. The living hinge has a pivot axis and mechanically couples the first segment and the second segment. Further, the living hinge facilitates the first segment and the second segment to pivoting relative to one another about the pivot axis. Embodiments may also relate to a method of manufacturing a sensor frame. The method may include forming an integral sensor body having a first frame segment, a second frame segment, and a living hinge. The first frame segment and the second frame segment are configured to pivot relative to one another about a pivot axis of the living hinge. The method may also include coupling one or more biasing mechanisms to the first frame segment and the second frame segment. The biasing mechanism is configured to generate a moment about the pivot axis of the living hinge.

Abstract: A method of controlling contact load in an apparatus for mounting electronic components on a substrate includes a head holding an electronic component being lowered at a first speed to a first position where the electronic component does not contact the substrate. The head is lowered at a second speed slower than the first speed from the first position until a predetermined target contact load is detected. The head is moved down by a small step for a predetermined distance at the second speed and a contact load is measured after moving the head down. The method includes determining whether a measured contact load has reached the predetermined target contact load. The moving and the measuring is sequentially repeated until the measured contact load reaches the predetermined target contact load. The predetermined distance is set to a first predetermined distance when moving the head down until the electronic component contacts the substrate.

Abstract: Reducing chemical contaminants is increasingly important for maintaining competitive production costs during fabrication of electronic devices. There is currently no production floor capability for mapping chemical contaminants across an electronic device substrate on a routine basis. A scanning surface chemical analyzer for mapping the distributions of a variety of chemicals on substrates is disclosed. The analyzer includes an array of sensors, each of which detects a single chemical or narrow range of chemicals, a scanning mechanism to provide a mapping capability, an electrical signal analyzer to collect and analyze signals from the array of sensors and generate reports of chemical distributions, and an optical desorption mechanism to amplify detection. A preferred embodiment includes an array of miniature quadrupole mass spectrometers in the sensor array. Scanning modes include whole substrate mapping, region sampling, and spot sampling of known defect sites.

Abstract: A method for manufacturing wireless communication devices for use in tracking or identifying other items comprises a number of cutting techniques that allow the size of the antenna for the wireless communication device. Further, the chip for the wireless communication device is nested so as to be flush with the surface of the substrate of the wireless communication device. Rollers cut the tabs that form the antenna elements. In a first embodiment, a plurality of rollers are used, each of effecting a different cut whose position may be phased so as to shorten or lengthen the antenna element. In a second embodiment, the rollers are independently positionable to shorten or lengthen the antenna element.